TWI595815B - Substrate working device and viscous fluid residue in substrate working device - Google Patents

Substrate working device and viscous fluid residue in substrate working device Download PDF

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Publication number
TWI595815B
TWI595815B TW104125455A TW104125455A TWI595815B TW I595815 B TWI595815 B TW I595815B TW 104125455 A TW104125455 A TW 104125455A TW 104125455 A TW104125455 A TW 104125455A TW I595815 B TWI595815 B TW I595815B
Authority
TW
Taiwan
Prior art keywords
viscous fluid
substrate
working device
specific region
residual amount
Prior art date
Application number
TW104125455A
Other languages
English (en)
Chinese (zh)
Other versions
TW201642716A (zh
Inventor
Taro Kawai
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of TW201642716A publication Critical patent/TW201642716A/zh
Application granted granted Critical
Publication of TWI595815B publication Critical patent/TWI595815B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765—Method using an image detector and processing of image signal
    • G01N2021/177—Detector of the video camera type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Operations Research (AREA)
  • Coating Apparatus (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW104125455A 2015-05-18 2015-08-05 Substrate working device and viscous fluid residue in substrate working device TWI595815B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/064226 WO2016185545A1 (ja) 2015-05-18 2015-05-18 基板作業装置および基板作業装置における粘性流体残量測定方法

Publications (2)

Publication Number Publication Date
TW201642716A TW201642716A (zh) 2016-12-01
TWI595815B true TWI595815B (zh) 2017-08-11

Family

ID=57319705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125455A TWI595815B (zh) 2015-05-18 2015-08-05 Substrate working device and viscous fluid residue in substrate working device

Country Status (5)

Country Link
JP (1) JP6385571B2 (ko)
KR (1) KR101986096B1 (ko)
CN (1) CN107535055B (ko)
TW (1) TWI595815B (ko)
WO (1) WO2016185545A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785363B2 (ja) * 2017-03-31 2020-11-18 株式会社Ｆｕｊｉ 電子部品装着機及び装着方法
KR102051499B1 (ko) * 2018-05-10 2019-12-03 한화정밀기계 주식회사 솔더 용기의 자동 공급 장치 및 방법
JP7352321B2 (ja) * 2021-07-20 2023-09-28 株式会社新川 フラックス転写装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019084A (ja) * 2000-07-12 2002-01-22 Matsushita Electric Ind Co Ltd クリームはんだの印刷状態検査方法及び検査装置
JP2004111424A (ja) * 2002-09-13 2004-04-08 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2007294777A (ja) * 2006-04-27 2007-11-08 Hitachi High-Tech Instruments Co Ltd フラックス転写装置
JP2012000875A (ja) * 2010-06-17 2012-01-05 Sumitomo Metal Electronics Devices Inc スクリーン印刷装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4726005B2 (ja) * 2006-06-28 2011-07-20 富士機械製造株式会社 フラックス転写装置
JP2008036918A (ja) * 2006-08-04 2008-02-21 Hitachi Plant Technologies Ltd スクリーン印刷装置および画像認識位置合わせ方法
JP2008076215A (ja) * 2006-09-21 2008-04-03 I-Pulse Co Ltd 検査装置および検査方法
JP4643719B2 (ja) 2009-02-09 2011-03-02 ヤマハ発動機株式会社 はんだ供給装置、印刷装置および印刷方法
JP5635879B2 (ja) * 2010-11-17 2014-12-03 ヤマハ発動機株式会社 付着材料塗布装置
KR101703565B1 (ko) 2011-08-29 2017-02-07 한화테크윈 주식회사 플럭스 상태 감지 장치 및 그 방법
JP5786139B2 (ja) * 2011-09-27 2015-09-30 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装装置におけるペースト転写方法
JP5917941B2 (ja) * 2012-02-21 2016-05-18 ヤマハ発動機株式会社 スクリーン印刷装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019084A (ja) * 2000-07-12 2002-01-22 Matsushita Electric Ind Co Ltd クリームはんだの印刷状態検査方法及び検査装置
JP2004111424A (ja) * 2002-09-13 2004-04-08 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2007294777A (ja) * 2006-04-27 2007-11-08 Hitachi High-Tech Instruments Co Ltd フラックス転写装置
JP2012000875A (ja) * 2010-06-17 2012-01-05 Sumitomo Metal Electronics Devices Inc スクリーン印刷装置

Also Published As

Publication number Publication date
WO2016185545A1 (ja) 2016-11-24
JPWO2016185545A1 (ja) 2017-11-02
CN107535055A (zh) 2018-01-02
KR20170119327A (ko) 2017-10-26
JP6385571B2 (ja) 2018-09-12
TW201642716A (zh) 2016-12-01
CN107535055B (zh) 2020-02-21
KR101986096B1 (ko) 2019-06-05

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