TWI595815B - Substrate working device and viscous fluid residue in substrate working device - Google Patents
Substrate working device and viscous fluid residue in substrate working device Download PDFInfo
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- TWI595815B TWI595815B TW104125455A TW104125455A TWI595815B TW I595815 B TWI595815 B TW I595815B TW 104125455 A TW104125455 A TW 104125455A TW 104125455 A TW104125455 A TW 104125455A TW I595815 B TWI595815 B TW I595815B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
- G01N2021/177—Detector of the video camera type
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Operations Research (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
本發明係關於一種基板作業裝置及於基板作業裝置之黏性流體殘量測定方法,尤其係關於一種具備刮刀部之基板作業裝置及於該基板作業裝置之黏性流體殘量測定方法。 The present invention relates to a substrate working device and a method for measuring a residual amount of a viscous fluid in a substrate working device, and more particularly to a substrate working device including a doctor blade portion and a method for measuring a residual amount of viscous fluid in the substrate working device.
先前,已知有一種具備刮刀部之基板作業裝置。此種基板作業裝置例如於韓國公開專利第10-2013-0023603號公報中揭示。 Previously, a substrate working device having a doctor blade portion has been known. Such a substrate working device is disclosed, for example, in Korean Laid-Open Patent Publication No. 10-2013-0023603.
於上述韓國公開專利第10-2013-0023603號公報中,揭示有一種貼片機(基板作業裝置),其具備助焊劑狀態檢測裝置,該助焊劑狀態檢測裝置包含:助焊板,於其上表面設有識別標記;助焊劑槽(刮刀部),其設於助焊板上,貯留助焊劑;及攝像部,其自上方隔著助焊劑槽內之助焊劑而拍攝識別標記。於該貼片機中,構成為基於藉由攝像部而獲得之攝像結果,階段性地識別助焊劑之殘量。 In the above-mentioned Korean Patent Publication No. 10-2013-0023603, there is disclosed a chip mounter (substrate working device) including a flux state detecting device including: a soldering plate thereon The surface is provided with an identification mark; a flux bath (blade portion) provided on the soldering plate to store the flux; and an image pickup portion that captures an identification mark from above via a flux in the flux bath. In the above-described placement machine, the residual amount of the flux is periodically recognized based on the imaging result obtained by the imaging unit.
[專利文獻1]韓國公開專利第10-2013-0023603號公報 [Patent Document 1] Korean Laid-Open Patent Publication No. 10-2013-0023603
然而,於上述韓國公開專利第10-2013-0023603號公報之貼片機中,存在因僅階段性地識別助焊劑之殘量,故無法正確地(定量地)測定助焊劑等黏性流體之殘量之問題。又,於上述韓國公開專利第10- 2013-0023603號公報之貼片機中,亦存在因隔著助焊劑拍攝識別標記,故於有色之助焊劑(黏性流體)中,難以測定殘量之問題。 However, in the placement machine of the above-mentioned Korean Patent Publication No. 10-2013-0023603, since the residual amount of the flux is recognized only stepwise, it is impossible to accurately (quantitatively) measure the viscous fluid such as flux. The problem of the residual amount. Also, in the above-mentioned Korean Patent No. 10- In the placement machine of the publication No. 2013-0023603, since the identification mark is photographed by the flux, it is difficult to measure the residual amount in the colored flux (viscous fluid).
本發明係為了解決如上所述之問題而完成者,本發明之1個目的在於:提供一種可正確地測定黏性流體之殘量,且即便為有色之黏性流體亦可測定殘量之基板作業裝置及於基板作業裝置之黏性流體殘量測定方法。 The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a substrate capable of accurately measuring the residual amount of a viscous fluid and measuring the residual amount even for a colored viscous fluid. The working device and the method for measuring the residual amount of viscous fluid in the substrate working device.
本發明之第1態樣之基板作業裝置具備:刮刀部,其一面刮取轉印至轉印對象物之黏性流體一面將其抹平;攝像部,其對包含存在被刮刀部刮取且已成為塊狀之黏性流體之部分與不存在黏性流體之部分之特定區域進行拍攝;及控制部,其基於藉由攝像部而拍攝之特定區域之攝像圖像中存在黏性流體之部分之大小、或不存在黏性流體之部分之大小中之至少一者,取得黏性流體之殘量。 A substrate working device according to a first aspect of the present invention includes: a doctor blade that wipes a viscous fluid transferred to a transfer object while being smeared; and an image pickup unit that scrapes and includes a blade portion a portion of the viscous fluid that has become a block and a specific region where the viscous fluid is not present; and a control portion that is based on a portion of the viscous fluid in the captured image of the specific region photographed by the imaging portion At least one of the size or the size of the portion of the viscous fluid is not present, and the residual amount of the viscous fluid is obtained.
於本發明之第1態樣之基板作業裝置中,設有控制部,該控制部如上所述,基於藉由攝像部而拍攝之特定區域之攝像圖像中存在黏性流體之部分之大小、或不存在黏性流體之部分之大小中之至少一者,取得黏性流體之殘量。藉此,利用存在已成為塊狀之黏性流體之部分之大小與不存在黏性流體之部分之大小與黏性流體之殘量相關之事實,可正確地(定量地)測定黏性流體之殘量。又,對包含存在已成為塊狀之黏性流體之部分與不存在黏性流體之部分之特定區域進行拍攝,基於特定區域之攝像圖像取得殘量,故而與隔著黏性流體而拍攝識別標記之構成不同,即便為有色之黏性流體,亦可容易地測定殘量。 In the substrate working device according to the first aspect of the present invention, a control unit that has a size of a portion of a viscous fluid in a captured image of a specific region imaged by the imaging unit, as described above, is provided. Or at least one of the size of the portion of the viscous fluid, the residual amount of the viscous fluid is obtained. Thereby, the viscous fluid can be accurately (quantitatively) determined by the fact that the size of the portion of the viscous fluid that has become a block and the size of the portion where the viscous fluid is not present is related to the residual amount of the viscous fluid. Residual amount. Further, a specific region including a portion where the viscous fluid has been formed in a block shape and a portion where the viscous fluid is not present is imaged, and a residual amount is obtained based on the captured image of the specific region, so that the image is recognized by the viscous fluid. The composition of the mark is different, and even if it is a colored viscous fluid, the residual amount can be easily measured.
於上述第1態樣之基板作業裝置中,較佳為控制部以如下方式構成:基於特定區域之攝像圖像,取得特定區域中存在黏性流體之部分之面積或不存在黏性流體之部分之面積中之至少一者,並且基於所取 得之存在黏性流體之部分之面積或不存在黏性流體之部分之面積中之至少一者,取得黏性流體之殘量。若以此方式構成,則與例如基於藉由光感測器而獲得之點之測定結果取得黏性流體之殘量之情形不同,由於係基於面積取得黏性流體之殘量,故而即便於刮刀部所實施之每個刮取動作中,已成為塊狀之黏性流體之形狀稍微存在不均,亦可穩定且正確地(定量地)測定黏性流體之殘量。 In the substrate working device according to the first aspect, preferably, the control unit is configured to obtain an area of a portion where a viscous fluid exists in a specific region or a portion where no viscous fluid exists based on a captured image of a specific region. At least one of the areas, and based on The residual amount of the viscous fluid is obtained by at least one of the area of the portion of the viscous fluid or the portion of the portion where the viscous fluid is absent. According to this configuration, unlike the case where the residual amount of the viscous fluid is obtained based on the measurement result of the point obtained by the photosensor, since the residual amount of the viscous fluid is obtained based on the area, even if the squeegee is used In each of the scraping operations performed by the portion, the shape of the viscous fluid that has become a block is slightly uneven, and the residual amount of the viscous fluid can be measured stably and accurately (quantitatively).
於該情形時,較佳為控制部以如下方式構成:藉由對特定區域之攝像圖像進行二值化(binary)處理,而取得特定區域之二值化圖像,並且基於所取得之二值化圖像,取得特定區域中存在黏性流體之部分之面積或不存在黏性流體之部分之面積中之至少一者。若以此方式構成,則可容易地取得存在黏性流體之部分之面積或不存在黏性流體之部分之面積中之至少一者。 In this case, it is preferable that the control unit is configured to obtain a binarized image of a specific region by binarizing the captured image of the specific region, and based on the obtained two The image is obtained to obtain at least one of an area of a portion where a viscous fluid exists in a specific region or an area where a portion of the viscous fluid does not exist. According to this configuration, at least one of the area where the viscous fluid is present or the area where the viscous fluid is not present can be easily obtained.
於上述第1態樣之基板作業裝置中,較佳為進而具備供給黏性流體之黏性流體供給部,且控制部係以如下方式構成:於判斷出所取得之黏性流體之殘量為特定之閾值以下之情形時,進行自黏性流體供給部供給黏性流體之控制。若以此方式構成,則可基於正確地測定出之黏性流體之殘量供給黏性流體,故而可適量地供給黏性流體。其結果,與超過必要量地多餘供給黏性流體以避免黏性流體不足之情形不同,可抑制黏性流體之使用量增加。又,由於自動地供給黏性流體,所以可抑制黏性流體不足,從而黏性流體未充分地轉印至轉印對象物之不良狀況之發生。 Preferably, in the substrate working device according to the first aspect, the viscous fluid supply unit that supplies the viscous fluid is further provided, and the control unit is configured to determine that the residual amount of the viscous fluid obtained is specific. When the threshold value is equal to or lower than the threshold value, the control of the viscous fluid supplied from the self-adhesive fluid supply unit is performed. According to this configuration, the viscous fluid can be supplied based on the residual amount of the viscous fluid that is accurately measured, so that the viscous fluid can be supplied in an appropriate amount. As a result, unlike the case where the viscous fluid is excessively supplied in excess of the necessary amount to prevent the viscous fluid from being insufficient, the amount of use of the viscous fluid can be suppressed from increasing. Moreover, since the viscous fluid is automatically supplied, it is possible to suppress the occurrence of a problem that the viscous fluid is insufficiently transferred and the viscous fluid is not sufficiently transferred to the transfer target.
於上述第1態樣之基板作業裝置中,較佳為進而具備安裝頭,其對基板安裝零件,並且可相對於刮刀部而相對地移動,且攝像部係以與安裝頭一起相對於刮刀部相對地移動之方式構成。若以此方式構成,則可使安裝頭與攝像部藉由共同之移動機構而移動,因此可抑制用以測定黏性流體之殘量之裝置構成複雜化。 In the substrate working device according to the first aspect, it is preferable to further include a mounting head that mounts a component to the substrate and that is relatively movable with respect to the blade portion, and the image pickup portion is opposed to the blade portion together with the mounting head. It is constructed in a relatively moving manner. According to this configuration, since the mounting head and the imaging unit can be moved by the common moving mechanism, the configuration of the device for measuring the residual amount of the viscous fluid can be suppressed.
於該情形時,較佳為攝像部包含對用以識別基板之基板識別標記進行拍攝之基板識別用攝像部。若以此方式構成,則亦可將基板識別用攝像部作為黏性流體之殘量測定用之攝像部使用,故而可進一步抑制用以測定黏性流體之殘量之裝置構成複雜化。 In this case, it is preferable that the imaging unit includes an imaging unit for substrate recognition that images the substrate identification mark for identifying the substrate. According to this configuration, the imaging unit for substrate recognition can be used as the imaging unit for measuring the residual amount of the viscous fluid, so that the configuration of the device for measuring the residual amount of the viscous fluid can be further suppressed.
於上述第1態樣之基板作業裝置中,較佳為刮刀部具有可貯留黏性流體之框形狀,且攝像部以如下方式構成:對包含存在處於具有貯留黏性流體之框形狀之刮刀部之內部且已成為塊狀之黏性流體之部分與不存在黏性流體之部分之刮刀部之內部之特定區域進行拍攝。若以此方式構成,則藉由具有框形狀之刮刀部,可容易地使黏性流體形成為塊狀。其結果,可容易地形成存在已成為塊狀之黏性流體之部分及不存在黏性流體之部分,且可藉由攝像部對其進行拍攝。 In the substrate working device according to the first aspect, preferably, the doctor blade portion has a frame shape capable of storing a viscous fluid, and the image pickup portion is configured to include a blade portion having a frame shape having a storage viscous fluid. The inside is a part of the viscous fluid that has become a block and a specific area inside the blade portion where the viscous fluid is not present. According to this configuration, the viscous fluid can be easily formed into a block shape by the blade portion having a frame shape. As a result, it is possible to easily form a portion where the viscous fluid has become a block and a portion where the viscous fluid does not exist, and the image pickup portion can image the same.
於上述第1態樣之基板作業裝置中,較佳為轉印對象物包含安裝於基板上之零件,且該基板作業裝置進而具備形成轉印至零件之黏性流體之塗膜之塗膜形成板;刮刀部以如下方式構成:相對於塗膜形成板相對地移動而一面刮取黏性流體一面將其抹平,於塗膜形成板上,形成轉印至零件之黏性流體之塗膜;攝像部以如下方式構成:自塗膜形成板之上方,對包含存在處於塗膜形成板上且已成為塊狀之黏性流體之部分與不存在黏性流體之部分之特定區域進行拍攝。若以此方式構成,則於形成於塗膜形成板之黏性流體之塗膜向零件轉印之構成中,可正確(定量地)且確實地測定黏性流體之殘量。 In the substrate working device according to the first aspect, preferably, the transfer target includes a component mounted on the substrate, and the substrate working device further includes a coating film forming a coating film for transferring the viscous fluid to the component. The squeegee portion is configured to be smeared while scraping the viscous fluid while moving relative to the coating film forming plate, and forming a coating film for transferring the viscous fluid to the component on the coating film forming plate. The imaging unit is configured to photograph a specific region including a portion of the viscous fluid which is on the coating film forming plate and which has become a block and a portion where the viscous fluid is not present, above the self-coating film forming plate. According to this configuration, in the configuration in which the coating film of the viscous fluid formed on the coating film forming sheet is transferred to the component, the residual amount of the viscous fluid can be accurately (quantitatively and reliably) measured.
於上述第1態樣之基板作業裝置中,較佳為轉印對象物包含供零件安裝之基板,且該基板作業裝置進而具備具有用以藉由印刷向基板轉印黏性流體之印刷圖案之遮罩;刮刀部以如下方式構成:於遮罩上移動而一面刮取黏性流體一面將其抹平,經由印刷圖案將遮罩上之黏性流體轉印至基板;攝像部以如下方式構成:自遮罩之上方,對包含存在處於遮罩上且已成為塊狀之黏性流體之部分與不存在黏性流體之 部分之特定區域進行拍攝。若以此方式構成,則於經由印刷圖案將焊料等遮罩上之黏性流體向基板轉印之構成中,可正確(定量地)且確實地測定焊料等黏性流體之殘量。 In the substrate working device according to the first aspect, preferably, the transfer target includes a substrate on which the component is mounted, and the substrate working device further includes a print pattern having a transfer fluid for transferring the adhesive fluid to the substrate. The mask portion is configured to be smeared while moving on the mask while scraping the viscous fluid, and transferring the viscous fluid on the mask to the substrate via the printing pattern; the imaging portion is configured as follows : Above the mask, the part containing the viscous fluid that is present on the mask and has become a block and the absence of viscous fluid Part of the specific area to shoot. According to this configuration, in the configuration in which the viscous fluid on the mask such as solder is transferred to the substrate via the printing pattern, the residual amount of the viscous fluid such as solder can be accurately (quantitatively and reliably) measured.
於上述第1態樣之基板作業裝置中,較佳為進而具備可向特定區域照射光之照明部,且照明部構成為可根據黏性流體之種類,變更照射至特定區域之光之強度、照射至特定區域之光之角度、及照射至特定區域之光之波長中之至少任一者。若以此方式構成,則可藉由與黏性流體之種類相應之適當之照明拍攝特定區域,因此可以能容易地將存在已成為塊狀之黏性流體之部分與不存在黏性流體之部分區別開來而識別之方式進行拍攝。其結果,可更正確地測定黏性流體之殘量。 In the substrate working device according to the first aspect of the invention, it is preferable that the illuminating unit further includes an illuminating unit that can illuminate the specific area, and the illuminating unit is configured to change the intensity of the light that is irradiated to the specific area according to the type of the viscous fluid. At least one of an angle of light that is irradiated to a specific area and a wavelength of light that is irradiated to a specific area. According to this configuration, a specific region can be photographed by appropriate illumination corresponding to the kind of the viscous fluid, so that it is possible to easily have a portion where the viscous fluid which has become a block is present and a portion where the viscous fluid does not exist. Differentiate and identify the way to shoot. As a result, the residual amount of the viscous fluid can be more accurately measured.
於本發明之第2態樣之基板作業裝置之黏性流體殘量測定方法具備如下步驟:藉由刮刀部一面刮取轉印至轉印對象物之黏性流體一面將其抹平;藉由攝像部對包含存在被刮刀部刮取且已成為塊狀之黏性流體之部分與不存在黏性流體之部分之特定區域進行拍攝;及基於藉由攝像部而拍攝之特定區域之攝像圖像中存在黏性流體之部分之大小、或不存在黏性流體之部分之大小中之至少一者,藉由控制部取得黏性流體之殘量。 The viscous fluid residual amount measuring method of the substrate working device according to the second aspect of the present invention includes the step of smoothing the viscous fluid transferred to the transfer object by the blade portion while smoothing it; The imaging unit captures a specific region including a portion where the viscous fluid scraped by the blade portion is formed and a portion where the viscous fluid is not present, and a captured image based on a specific region photographed by the imaging portion At least one of the size of the portion of the viscous fluid or the portion of the viscous fluid that is not present, the residual portion of the viscous fluid is obtained by the control unit.
於本發明之第2態樣之基板作業裝置之黏性流體殘量測定方法中,設有如下步驟:如上所述,基於藉由攝像部而拍攝之特定區域之攝像圖像中存在黏性流體之部分之大小、或不存在黏性流體之部分之大小中之至少一者,藉由控制部取得黏性流體之殘量。藉此,與上述第1態樣之基板作業裝置之情形同樣地,可正確地測定黏性流體之殘量,並且即便為有色之黏性流體亦可測定殘量。 In the method for measuring the residual viscous fluid of the substrate working device according to the second aspect of the present invention, there is provided a step of: presenting a viscous fluid in a captured image based on a specific region photographed by the imaging unit as described above At least one of the size of the portion or the size of the portion where the viscous fluid does not exist, the residual portion of the viscous fluid is obtained by the control unit. Thereby, similarly to the case of the substrate working device of the first aspect described above, the residual amount of the viscous fluid can be accurately measured, and the residual amount can be measured even if it is a colored viscous fluid.
根據本發明,可提供一種如上所述,可正確地測定黏性流體之殘量,且即便為有色之黏性流體亦可測定殘量之基板作業裝置及於基 板作業裝置之黏性流體殘量測定方法。 According to the present invention, it is possible to provide a substrate working device capable of accurately measuring the residual amount of a viscous fluid as described above and measuring the residual amount even for a colored viscous fluid. Method for measuring the residual amount of viscous fluid in a plate working device.
1‧‧‧基台 1‧‧‧Abutment
2‧‧‧輸送器 2‧‧‧ conveyor
3‧‧‧零件供給部 3‧‧‧ Parts Supply Department
3a‧‧‧帶送給器 3a‧‧‧With a feeder
4‧‧‧頭單元 4‧‧‧ head unit
5‧‧‧支持部 5‧‧‧Support Department
6‧‧‧一對軌道部 6‧‧‧A pair of track sections
7‧‧‧零件識別相機 7‧‧‧Part identification camera
8‧‧‧轉印單元 8‧‧‧Transfer unit
9‧‧‧控制部 9‧‧‧Control Department
31‧‧‧零件(轉印對象物) 31‧‧‧ Parts (transfer object)
41‧‧‧噴嘴 41‧‧‧Nozzles
42‧‧‧安裝頭 42‧‧‧Installation head
43‧‧‧基板識別相機(攝像部) 43‧‧‧Substrate recognition camera (camera)
43a‧‧‧照明部 43a‧‧‧Lighting Department
51‧‧‧馬達 51‧‧‧Motor
61‧‧‧馬達 61‧‧‧Motor
81‧‧‧黏性流體供給部 81‧‧‧ Viscous fluid supply department
81a‧‧‧本體部 81a‧‧‧ Body Department
81b‧‧‧活塞部 81b‧‧‧Piston Department
81c‧‧‧蓋部 81c‧‧‧盖部
81d‧‧‧供給路徑 81d‧‧‧Supply path
82‧‧‧黏性流體槽(刮刀部) 82‧‧‧Adhesive fluid groove (scraper part)
83‧‧‧塗膜形成板 83‧‧‧ Coating film forming board
83a‧‧‧塗膜形成板之上表面 83a‧‧· Coating film forming the upper surface of the board
83b‧‧‧塗膜形成部 83b‧‧·film formation department
84‧‧‧板驅動機構 84‧‧‧ board drive mechanism
91‧‧‧閥門 91‧‧‧ Valve
100‧‧‧基板作業裝置 100‧‧‧Substrate operating device
101‧‧‧基台 101‧‧‧Abutment
102‧‧‧刮刀單元 102‧‧‧ scraper unit
103‧‧‧基板台 103‧‧‧ substrate table
103b‧‧‧托架構件 103b‧‧‧ bracket components
104‧‧‧黏性流體識別相機(攝像部) 104‧‧‧Adhesive Fluid Recognition Camera (Camera)
105‧‧‧控制部 105‧‧‧Control Department
106‧‧‧框架 106‧‧‧Frame
121‧‧‧刮刀部 121‧‧‧Scraper
122‧‧‧刮刀Y軸驅動機構 122‧‧‧Scraper Y-axis drive mechanism
122a‧‧‧Y軸馬達 122a‧‧‧Y-axis motor
123‧‧‧刮刀Z軸驅動機構 123‧‧‧ scraper Z-axis drive mechanism
124‧‧‧刮刀R軸驅動機構 124‧‧‧ scraper R-axis drive mechanism
125‧‧‧黏性流體供給部 125‧‧‧ Viscous fluid supply department
131‧‧‧輸送器 131‧‧‧ conveyor
132‧‧‧夾具構件(夾板) 132‧‧‧Clamping components (plywood)
133‧‧‧Y軸移動機構 133‧‧‧Y-axis moving mechanism
133a‧‧‧Y軸馬達 133a‧‧‧Y-axis motor
134‧‧‧Z軸移動機構 134‧‧‧Z-axis moving mechanism
134a‧‧‧Z軸台 134a‧‧‧Z-axis table
135‧‧‧基板升降部 135‧‧‧Base Lifting Department
135a‧‧‧支持板 135a‧‧‧Support board
200‧‧‧基板作業裝置 200‧‧‧Substrate operating device
A‧‧‧特定區域 A‧‧‧Specific area
B1‧‧‧特定區域之攝像圖像 B1‧‧‧Video images of specific areas
E2‧‧‧二值化圖像 E2‧‧‧ binarized image
C1‧‧‧存在黏性流體之部分 C1‧‧‧There is a part of viscous fluid
C2‧‧‧不存在黏性流體之部分 C2‧‧‧There is no part of viscous fluid
F‧‧‧基準標記(基板識別標記) F‧‧‧ benchmark mark (substrate identification mark)
H‧‧‧空氣軟管 H‧‧‧Air hose
L‧‧‧黏性流體 L‧‧‧viscous fluid
La‧‧‧塗膜 La‧‧·film
Lb‧‧‧黏性流體 Lb‧‧‧viscous fluid
M‧‧‧遮罩 M‧‧‧ mask
P‧‧‧基板(轉印對象物) P‧‧‧Substrate (transfer object)
S1‧‧‧步驟 S1‧‧‧ steps
S2‧‧‧步驟 S2‧‧‧ steps
S3‧‧‧步驟 S3‧‧‧ steps
S4‧‧‧步驟 S4‧‧‧ steps
S5‧‧‧步驟 S5‧‧ steps
S6‧‧‧步驟 S6‧‧ steps
Th‧‧‧特定之閾值 Th‧‧‧ specific threshold
X‧‧‧方向 X‧‧‧ direction
X1‧‧‧方向 X1‧‧‧ direction
X2‧‧‧方向 X2‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Y1‧‧‧方向 Y1‧‧‧ direction
Y2‧‧‧方向 Y2‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
Z1‧‧‧方向 Z1‧‧‧ direction
Z2‧‧‧方向 Z2‧‧‧ direction
圖1係表示本發明之第1實施形態之基板作業裝置之整體構成之圖。 Fig. 1 is a view showing the overall configuration of a substrate working device according to a first embodiment of the present invention.
圖2係表示本發明之第1實施形態之基板作業裝置之轉印單元之整體構成之側視圖。 2 is a side view showing the overall configuration of a transfer unit of the substrate working device according to the first embodiment of the present invention.
圖3係本發明之第1實施形態之基板作業裝置之轉印單元之俯視圖。 Fig. 3 is a plan view showing a transfer unit of the substrate working device according to the first embodiment of the present invention.
圖4係用以對本發明之第1實施形態之基板作業裝置中之特定區域之攝像圖像及二值化處理後之特定區域之攝像圖像進行說明之圖。 FIG. 4 is a view for explaining a captured image of a specific region and a captured image of a specific region after the binarization processing in the substrate working device according to the first embodiment of the present invention.
圖5係表示於本發明之第1實施形態之基板作業裝置之黏性流體殘量與特定區域內之存在黏性流體之部分之面積比例之關係之曲線圖。 Fig. 5 is a graph showing the relationship between the residual amount of the viscous fluid in the substrate working device according to the first embodiment of the present invention and the area ratio of the portion in the specific region where the viscous fluid is present.
圖6係表示本發明之第1實施形態之基板作業裝置中之有照明之情形時之特定區域之攝像圖像之一例之圖。 FIG. 6 is a view showing an example of a captured image of a specific region when the substrate working device according to the first embodiment of the present invention is illuminated.
圖7係表示本發明之第1實施形態之基板作業裝置中之照明變更之情形時之特定區域之攝像圖像之一例之圖。 FIG. 7 is a view showing an example of a captured image in a specific region when the illumination in the substrate working device according to the first embodiment of the present invention is changed.
圖8係表示轉印單元之掃刮動作(A)、塊狀流體攝像動作(B)、及黏性流體轉印動作(C)之模式圖。 Fig. 8 is a schematic view showing a wiping operation (A), a bulk fluid imaging operation (B), and a viscous fluid transfer operation (C) of the transfer unit.
圖9係用以對本發明之第1實施形態之基板作業裝置之黏性流體自動供給處理進行說明之流程圖。 FIG. 9 is a flowchart for explaining an automatic viscous fluid supply process of the substrate working device according to the first embodiment of the present invention.
圖10係表示本發明之第2實施形態之基板作業裝置之整體構成之圖。 Fig. 10 is a view showing the overall configuration of a substrate working device according to a second embodiment of the present invention.
以下,基於圖式對將本發明具體化之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described based on the drawings.
[第1實施形態] [First Embodiment]
(基板作業裝置之構成) (Structure of substrate working device)
首先,參照圖1~圖8,對本發明之第1實施形態之基板作業裝置100之構成進行說明。於第1實施形態中,對將本發明應用於將零件31安裝於基板P上之零件安裝裝置之例進行說明。 First, the configuration of the substrate working device 100 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 8 . In the first embodiment, an example in which the present invention is applied to a component mounting device in which the component 31 is mounted on the substrate P will be described.
如圖1所示,基板作業裝置100係藉由一對輸送器2將基板P自X1方向側搬送至X2方向側,於特定之安裝作業位置M將零件31安裝於基板P上之零件安裝裝置。再者,零件31係申請專利範圍之「轉印對象物」之一例。 As shown in FIG. 1 , the substrate working device 100 is a component mounting device that transports the substrate P from the X1 direction side to the X2 direction side by a pair of conveyors 2 and mounts the component 31 on the substrate P at a specific mounting working position M. . Further, the part 31 is an example of a "transfer object" in the patent application.
基板作業裝置100具備基台1、一對輸送器2、零件供給部3、頭單元4、支持部5、一對軌道部6、零件識別相機7、轉印單元8、及控制部9。 The substrate working device 100 includes a base 1 , a pair of conveyors 2 , a component supply unit 3 , a head unit 4 , a support unit 5 , a pair of rail units 6 , a component recognition camera 7 , a transfer unit 8 , and a control unit 9 .
一對輸送器2係以設置於基台1上,且於X方向上搬送基板P之方式構成。又,一對輸送器2係以於使搬送中之基板P於安裝作業位置M停止之狀態下保持該基板P之方式構成。又,一對輸送器2構成為於Y方向上隔開特定距離而相互平行地配置,且可根據基板P之尺寸調整Y方向之間隔。 The pair of conveyors 2 are configured to be disposed on the base 1 and transport the substrate P in the X direction. Further, the pair of conveyors 2 are configured to hold the substrate P while the substrate P being conveyed is stopped at the mounting work position M. Further, the pair of conveyors 2 are disposed so as to be parallel to each other with a predetermined distance in the Y direction, and the interval in the Y direction can be adjusted in accordance with the size of the substrate P.
零件供給部3配置於一對輸送器2之兩外側(Y1側及Y2側)之複數個部位。又,於零件供給部3,安裝有複數個帶送給器3a。 The component supply unit 3 is disposed at a plurality of locations on both outer sides (Y1 side and Y2 side) of the pair of conveyors 2. Further, a plurality of tape feeders 3a are attached to the component supply unit 3.
帶送給器3a保持有捲盤(未圖示),該捲盤捲繞有將複數個零件31隔開特定之間隔而保持之帶。帶送給器3a係以如下方式構成:藉由使捲盤旋轉送出保持零件31之帶,而自帶送給器3a之前端供給零件31。此處,零件31例如係表示IC(Integrated Circuit,積體電路)、電晶體、電容器及電阻等電子零件之概念。 The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of parts 31 at a predetermined interval is held. The tape feeder 3a is configured to supply the component 31 from the front end of the tape feeder 3a by rotating the reel to the tape holding the holding member 31. Here, the component 31 is a concept of an electronic component such as an IC (Integrated Circuit), a transistor, a capacitor, and a resistor.
頭單元4配置於一對輸送器2及零件供給部3之上方位置,且包含於下端含有噴嘴41之複數個安裝頭42、及基板識別相機43。再者,基板識別相機43係申請專利範圍之「攝像部」及「基板識別用攝像部」 之一例。 The head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3, and includes a plurality of mounting heads 42 including nozzles 41 at the lower end, and a substrate recognition camera 43. Further, the substrate recognition camera 43 is an "imaging unit" and a "substrate recognition imaging unit" in the patent application scope. One example.
噴嘴41以如下方式構成:藉由利用負壓產生機(未圖示)於噴嘴41之前端部產生之負壓,而吸附並保持自帶送給器3a供給之零件31,並搭載(安裝)於基板P上。 The nozzle 41 is configured to suck and hold the component 31 supplied from the feeder 3a by a negative pressure generated at the end of the nozzle 41 by a negative pressure generator (not shown), and mount (mount) On the substrate P.
基板識別相機43係以對用以識別基板P之位置之基準標記F進行拍攝之方式構成。藉由拍攝而識別出基準標記F之位置,可正確地取得基板P之零件31之安裝位置。又,於基板識別相機43,設有複數個照明部43a(參照圖2)。照明部43a構成為於由基板識別相機43所實施之基準標記F之攝像及下述特定區域A(參照圖3)之攝像時,可向基準標記F及特定區域A照射光。再者,基準標記F係申請專利範圍之「基板識別標記」之一例。 The substrate recognition camera 43 is configured to image the reference mark F for identifying the position of the substrate P. By identifying the position of the reference mark F by photographing, the mounting position of the part 31 of the substrate P can be accurately obtained. Further, the substrate recognition camera 43 is provided with a plurality of illumination units 43a (see FIG. 2). The illumination unit 43a is configured to emit light to the reference mark F and the specific area A when the imaging of the reference mark F by the substrate recognition camera 43 and the imaging of the specific area A (see FIG. 3) described below are performed. Further, the reference mark F is an example of the "substrate identification mark" of the patent application.
支持部5包含馬達51。支持部5係以藉由使馬達51驅動,而使頭單元4沿支持部5於X方向上移動之方式構成。又,支持部5之兩端部被一對軌道部6支持。 The support portion 5 includes a motor 51. The support unit 5 is configured to move the head unit 4 along the support unit 5 in the X direction by driving the motor 51. Further, both end portions of the support portion 5 are supported by the pair of rail portions 6.
一對軌道部6固定於基台1上。X1側之軌道部6包含馬達61。軌道部6係以藉由使馬達61驅動,而使支持部5沿一對軌道部6於與X方向正交之Y方向上移動之方式構成。頭單元4可沿支持部5於X方向上移動,並且支持部5可沿軌道部6於Y方向上移動,由此頭單元4可於XY方向上移動。 A pair of rail portions 6 are fixed to the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. The head unit 4 is movable in the X direction along the support portion 5, and the support portion 5 is movable in the Y direction along the rail portion 6, whereby the head unit 4 is movable in the XY direction.
零件識別相機7固定於基台1之上表面上。零件識別相機7以如下方式構成:為了於零件31之安裝之前識別出零件31之吸附狀態(吸附姿勢),而自下側(Z2側)拍攝吸附於安裝頭42之噴嘴41之零件31。藉此,可取得吸附於安裝頭42之噴嘴41之零件31之吸附狀態。 The part identification camera 7 is fixed to the upper surface of the base 1. The part identification camera 7 is configured to recognize the suction state (adsorption posture) of the component 31 before the attachment of the component 31, and to photograph the component 31 adsorbed to the nozzle 41 of the mounting head 42 from the lower side (Z2 side). Thereby, the adsorption state of the component 31 adsorbed to the nozzle 41 of the mounting head 42 can be obtained.
轉印單元8配置於一對輸送器2之Y2側,可裝卸地安裝於基板作業裝置100。又,轉印單元8係以形成用以轉印至零件31之下述黏性流體L之塗膜La之方式構成。 The transfer unit 8 is disposed on the Y2 side of the pair of conveyors 2 and is detachably attached to the substrate working device 100. Further, the transfer unit 8 is configured to form a coating film La for transferring to the following viscous fluid L of the component 31.
又,如圖2及圖3所示,轉印單元8包含黏性流體供給部81、黏性流體槽82、塗膜形成板83、及板驅動機構84。再者,黏性流體槽82係申請專利範圍之「刮刀部」之一例。又,於圖2及圖8中,為了易於理解,將安裝頭42與基板識別相機43兩者表示於一個圖中。因此,圖2及圖8中之兩者之位置關係未必與圖1中之兩者之位置關係對應。 Further, as shown in FIGS. 2 and 3, the transfer unit 8 includes a viscous fluid supply unit 81, a viscous fluid tank 82, a coating film forming plate 83, and a plate driving mechanism 84. Further, the viscous fluid groove 82 is an example of the "blade portion" of the patent application. Further, in FIGS. 2 and 8, for ease of understanding, both the mounting head 42 and the substrate recognition camera 43 are shown in one figure. Therefore, the positional relationship between the two in FIG. 2 and FIG. 8 does not necessarily correspond to the positional relationship of both in FIG.
黏性流體供給部81係以將黏性流體L供給至黏性流體槽82之方式構成。又,黏性流體供給部81具有本體部81a、活塞部81b、蓋部81c、及供給路徑81d。 The viscous fluid supply unit 81 is configured to supply the viscous fluid L to the viscous fluid tank 82. Further, the viscous fluid supply unit 81 includes a main body portion 81a, a piston portion 81b, a lid portion 81c, and a supply path 81d.
本體部81a構成為具有中空之大致圓筒形狀,且可於內部貯留助焊劑或焊料等黏性流體L(藉由影線而表示)。活塞部81b配置於本體部81a之內部,可於上下方向(Z方向)上滑動地嵌合於本體部81a之內側面。黏性流體L填充(貯留)於藉由本體部81a與活塞部81b而劃分形成之本體部81a之內部空間。蓋部81c係以配置於本體部81a之上端部,將本體部81a密閉之方式構成。又,於蓋部81c,連接有空氣軟管H之一端,以將特定壓力之氣體(空氣)供給至本體部81a內部。又,空氣軟管H之另一端連接於閥門91。閥門91構成為連接於未圖示之空壓源,可切換將特定壓力之氣體供給至本體81a內部之開啟狀態與不將氣體供給至本體81a內部之關閉狀態。供給路徑81d配置於本體部81a之下端,且連接於黏性流體槽82之側面。 The main body portion 81a is configured to have a hollow substantially cylindrical shape, and can store a viscous fluid L (shown by hatching) such as flux or solder inside. The piston portion 81b is disposed inside the main body portion 81a, and is slidably fitted to the inner side surface of the main body portion 81a in the vertical direction (Z direction). The viscous fluid L is filled (stored) in the internal space of the main body portion 81a which is defined by the main body portion 81a and the piston portion 81b. The lid portion 81c is configured to be disposed at an upper end portion of the main body portion 81a and to seal the main body portion 81a. Further, one end of the air hose H is connected to the lid portion 81c to supply a gas (air) of a specific pressure to the inside of the body portion 81a. Further, the other end of the air hose H is connected to the valve 91. The valve 91 is connected to a pneumatic source (not shown), and is capable of switching between an open state in which a gas of a specific pressure is supplied to the inside of the main body 81a and a closed state in which the gas is not supplied to the inside of the main body 81a. The supply path 81d is disposed at a lower end of the body portion 81a and is connected to a side surface of the viscous fluid groove 82.
黏性流體供給部81以如下方式構成:於閥門91為「開啟狀態」之情形時,自空氣軟管H經由蓋部81c向本體81a內部供給特定壓力之氣體,藉由將活塞81b向下方向(Z2方向)移動,而經由供給路徑81d向黏性流體槽82壓送(供給)填充於本體81a內部之黏性流體L。又,黏性流體供給部81以如下方式構成:於閥門91為「關閉狀態」之情形時,因為活塞81b不向下方向(Z2方向)移動,所以並不經由供給路徑81d向黏性流體槽82壓送(供給)填充於本體81a內部之黏性流體L。 The viscous fluid supply unit 81 is configured such that when the valve 91 is in the "open state", the gas is supplied from the air hose H to the inside of the body 81a via the lid portion 81c, and the piston 81b is directed downward. In the (Z2 direction), the viscous fluid L filled in the inside of the body 81a is pressure-fed (supplied) into the viscous fluid tank 82 via the supply path 81d. Further, the viscous fluid supply unit 81 is configured such that when the valve 91 is in the "closed state", since the piston 81b does not move in the downward direction (Z2 direction), it does not pass through the supply path 81d to the viscous fluid tank. 82 pressure feeds (supplies) the viscous fluid L filled in the inside of the body 81a.
黏性流體槽82構成為具有上下開口之中空之框形狀,且配置於塗膜形成板83上,藉此可將來自黏性流體供給部81之黏性流體L貯留於內部。又,黏性流體槽82係藉由未圖示之固定機構而固定,並不移動。又,黏性流體槽82係以藉由未圖示之賦能機構向塗膜形成板83賦予勢能之方式構成。由於框形狀之黏性流體槽82之上部開口,所以基板識別相機43可自上方拍攝黏性流體槽82之內部空間。 The viscous fluid groove 82 is formed in a hollow frame shape having an upper and lower opening, and is disposed on the coating film forming plate 83, whereby the viscous fluid L from the viscous fluid supply portion 81 can be stored therein. Further, the viscous fluid groove 82 is fixed by a fixing mechanism (not shown) and does not move. Further, the viscous fluid groove 82 is configured to impart potential energy to the coating film forming plate 83 by an energizing means (not shown). Since the upper portion of the frame-shaped viscous fluid groove 82 is opened, the substrate recognition camera 43 can photograph the internal space of the viscous fluid groove 82 from above.
塗膜形成板83構成為於俯視時(自Z方向觀察)具有大致矩形狀,可藉由板驅動機構84於長度方向(圖2及圖3之驅動方向)上移動。又,於塗膜形成板83之上表面83a,設有自上表面83a向下方凹陷相當於塗膜La之膜厚t之塗膜形成部83b,以用於形成黏性流體L之塗膜La。 The coating film forming plate 83 is configured to have a substantially rectangular shape in a plan view (viewed in the Z direction), and is movable in the longitudinal direction (the driving direction of FIGS. 2 and 3) by the plate driving mechanism 84. Further, the upper surface 83a of the coating film forming plate 83 is provided with a coating film forming portion 83b which is recessed downward from the upper surface 83a to correspond to the film thickness t of the coating film La for forming a coating film La of the viscous fluid L. .
而且,黏性流體槽82以如下方式構成:於內部貯留有黏性流體L之狀態下,藉由利用板驅動機構84使塗膜形成板83於驅動方向上移動,而相對於塗膜形成板83相對地移動,而一面刮取黏性流體L一面將其抹平(掃刮)。藉此,黏性流體槽82構成為將轉印至零件31之黏性流體L之塗膜La形成於塗膜形成板83之塗膜形成部83b。 Further, the viscous fluid groove 82 is configured such that the coating film forming plate 83 is moved in the driving direction by the plate driving mechanism 84 in a state where the viscous fluid L is stored therein, and the coating film is formed with respect to the coating film. 83 moves relatively while squeezing the viscous fluid L while smoothing it (sweeping). Thereby, the viscous fluid groove 82 is formed so that the coating film La of the viscous fluid L transferred to the component 31 is formed in the coating film forming portion 83b of the coating film forming plate 83.
板驅動機構84例如構成為可設定為包含滾珠螺桿、球形螺母及馬達等之驅動機構,可使塗膜形成板83於驅動方向上移動。 The plate driving mechanism 84 is configured to be, for example, a driving mechanism including a ball screw, a ball nut, a motor, and the like, and can move the coating film forming plate 83 in the driving direction.
控制部9以如下方式構成:包含CPU(Central Processing Unit,中央處理單元),控制頭單元4所實施之安裝動作、下述轉印單元8之掃刮動作、塊狀流體攝像動作、黏性流體轉印動作等基板作業裝置100之全部動作。 The control unit 9 is configured to include a CPU (Central Processing Unit), an attachment operation by the control head unit 4, a wiping operation of the transfer unit 8 described below, a block fluid imaging operation, and a viscous fluid. All operations of the substrate working device 100 such as a transfer operation.
(黏性流體之殘量之取得) (Acquisition of the residual amount of viscous fluid)
其次,參照圖3~圖5,對貯留於黏性流體槽82之黏性流體L之殘量之取得方法進行說明。 Next, a method of obtaining the residual amount of the viscous fluid L stored in the viscous fluid tank 82 will be described with reference to Figs. 3 to 5 .
若進行掃刮動作,則黏性流體槽82之內部之黏性流體L滾動著旋轉(捲動),而成為概略圓柱狀截面之塊(Lb)。如圖2及圖3所示,基板 識別相機43(參照圖1)以如下方式構成:為了測定貯留於黏性流體槽82之黏性流體L之殘量,對包含存在被轉印單元8之黏性流體槽82刮取且已成為塊狀之黏性流體L(Lb)之部分、及不存在黏性流體L(Lb)之部分之特定區域A進行拍攝。 When the wiping operation is performed, the viscous fluid L inside the viscous fluid groove 82 is rolled (rolled) to form a block (Lb) having a substantially cylindrical cross section. As shown in FIG. 2 and FIG. 3, the substrate The identification camera 43 (refer to FIG. 1) is configured to measure the residual amount of the viscous fluid L stored in the viscous fluid groove 82, scraping the viscous fluid groove 82 including the transfer unit 8 and having become A portion of the bulk viscous fluid L (Lb) and a specific region A where no part of the viscous fluid L (Lb) is present are photographed.
此時,基板識別相機43以如下方式構成:自塗膜形成板83及已成為塊狀之黏性流體L(Lb)之上方,對包含存在處於具有貯留黏性流體L之框形狀之黏性流體槽82之內部且已成為塊狀之黏性流體L(Lb)之部分、及不存在黏性流體L(Lb)之部分之特定區域A進行拍攝。 At this time, the substrate recognition camera 43 is configured such that the self-coating film forming plate 83 and the viscous fluid L (Lb) which has become a block shape are contained, and the viscous shape including the frame shape having the storage viscous fluid L is contained. The inside of the fluid groove 82 and a part of the viscous fluid L (Lb) which has become a block, and a specific area A where a part of the viscous fluid L (Lb) does not exist is imaged.
此處,於第1實施形態中,如圖4及圖5所示,控制部9以如下方式構成:基於藉由基板識別相機43而拍攝之特定區域A之攝像圖像B1中存在黏性流體L(Lb)之部分C1之大小、及不存在黏性流體L(Lb)之部分C2之大小,取得貯留於黏性流體槽82之黏性流體L之殘量。 Here, in the first embodiment, as shown in FIGS. 4 and 5, the control unit 9 is configured such that a viscous fluid exists in the captured image B1 based on the specific region A captured by the substrate recognition camera 43. The size of the portion C1 of L(Lb) and the size of the portion C2 of the viscous fluid L (Lb) are not present, and the residual amount of the viscous fluid L stored in the viscous fluid tank 82 is obtained.
具體而言,控制部9以如下方式構成:基於特定區域A之攝像圖像B1,取得特定區域A中存在黏性流體L之部分C1之面積、及不存在黏性流體L之部分C2之面積。而且,控制部9以如下方式構成:基於所取得之特定區域A中存在黏性流體L之部分C1之面積、及不存在黏性流體L之部分C2之面積,取得黏性流體L之殘量。 Specifically, the control unit 9 is configured to acquire the area of the portion C1 where the viscous fluid L exists in the specific region A and the portion of the portion C2 where the viscous fluid L does not exist, based on the captured image B1 of the specific region A. . Further, the control unit 9 is configured to obtain the residual amount of the viscous fluid L based on the area of the portion C1 where the viscous fluid L exists in the specific region A obtained and the area of the portion C2 where the viscous fluid L is not present. .
又,於第1實施形態中,控制部9以如下方式構成:藉由對特定區域A之攝像圖像B1進行二值化處理,取得特定區域A之二值化圖像B2,並且基於所取得之二值化圖像B2,取得特定區域A中存在黏性流體L之部分C1之面積、及不存在黏性流體L之部分C2之面積。以下,關於該等方面詳細地進行說明。 Further, in the first embodiment, the control unit 9 is configured to obtain the binarized image B2 of the specific region A by binarizing the captured image B1 of the specific region A, and based on the obtained image The binarized image B2 acquires the area of the portion C1 where the viscous fluid L exists in the specific region A and the area of the portion C2 where the viscous fluid L does not exist. Hereinafter, these aspects will be described in detail.
如圖4所示,首先,藉由控制部9而取得由基板識別相機43而拍攝之特定區域A之攝像圖像B1(於圖4之左側表示之二值化處理前之圖像)。此時,於特定區域A之攝像圖像B1中,於存在黏性流體L(Lb)之部分C1,光因黏性流體L(Lb)發生漫反射,故而可獲得相對較暗之圖 像。另一方面,於不存在黏性流體L(Lb)之部分C2,光因金屬製之塗膜形成板83之上表面83a發生鏡面反射,故而可獲得相對較亮之圖像。因此,於特定區域A之攝像圖像B1中,可將攝像圖像中存在黏性流體L(Lb)之部分C1、及攝像圖像中不存在黏性流體L(Lb)之部分C2區別開來而識別。 As shown in FIG. 4, first, the image pickup image B1 of the specific region A captured by the substrate recognition camera 43 is acquired by the control unit 9 (the image before the binarization processing shown on the left side of FIG. 4). At this time, in the image B1 of the specific area A, in the portion C1 where the viscous fluid L (Lb) is present, the light is diffusely reflected by the viscous fluid L (Lb), so that a relatively dark map can be obtained. image. On the other hand, in the portion C2 where the viscous fluid L (Lb) is not present, the light is specularly reflected by the upper surface 83a of the coating film forming plate 83 made of metal, so that a relatively bright image can be obtained. Therefore, in the captured image B1 of the specific area A, the portion C1 in which the viscous fluid L (Lb) exists in the captured image and the portion C2 in which the viscous fluid L (Lb) is not present in the captured image can be distinguished. Come and identify.
其次,對於所取得之特定區域A之攝像圖像B1,藉由控制部9而進行將其轉換為白色與黑色之兩個色調之圖像之二值化處理。藉此,特定區域A之攝像圖像B1被轉換為特定區域A之攝像圖像(於圖4之右側表示之二值化處理後之圖像、二值化圖像)B2,該攝像圖像B2係特定區域A中存在黏性流體L(Lb)之部分C1(相對較暗之圖像部分)用黑色表示,特定區域A中不存在黏性流體L(Lb)之部分C2(相對較亮之部分)用白色表示。 Next, the captured image B1 of the acquired specific area A is subjected to binarization processing by converting the image into two images of white and black by the control unit 9. Thereby, the captured image B1 of the specific area A is converted into a captured image of the specific area A (the image after the binarization process shown on the right side of FIG. 4, the binarized image) B2, the captured image The portion C1 (relatively darker image portion) in which the viscous fluid L (Lb) exists in the specific region A of the B2 system is indicated by black, and the portion C2 of the viscous fluid L (Lb) is not present in the specific region A (relatively brighter) Part of it) is shown in white.
繼而,基於所取得之二值化圖像B2,藉由控制部9取得特定區域A中存在黏性流體L(Lb)之部分C1之面積(即黑色部分之面積)與特定區域A中不存在黏性流體L(Lb)之部分C2之面積(即白色部分之面積)。詳細而言,基於二值化圖像B2中黑色部分之像素數,取得特定區域A中存在黏性流體L(Lb)之部分C1之面積,基於二值化圖像B2中白色部分之像素數,取得特定區域A中不存在黏性流體L(Lb)之部分C2之面積。 Then, based on the obtained binarized image B2, the area of the portion C1 in which the viscous fluid L (Lb) exists in the specific region A (that is, the area of the black portion) is not obtained by the control portion 9 and does not exist in the specific region A. The area of the portion C2 of the viscous fluid L (Lb) (i.e., the area of the white portion). Specifically, based on the number of pixels of the black portion in the binarized image B2, the area of the portion C1 in which the viscous fluid L (Lb) exists in the specific region A is obtained, based on the number of pixels of the white portion in the binarized image B2 The area of the portion C2 in which the viscous fluid L (Lb) is not present in the specific region A is obtained.
繼而,基於所取得之存在黏性流體L(Lb)之部分C1之面積及不存在黏性流體L(Lb)之部分C2之面積,藉由控制部9取得存在黏性流體L(Lb)之部分C1相對於特定區域A之面積比例(X%)、及不存在黏性流體L(Lb)之部分C2相對於特定區域A之面積比例(Y=100-X%)。 Then, based on the obtained area of the portion C1 where the viscous fluid L (Lb) exists and the area of the portion C2 where the viscous fluid L (Lb) is not present, the control unit 9 obtains the presence of the viscous fluid L (Lb). The ratio of the area of the portion C1 to the specific region A (X%), and the ratio of the portion of the portion C2 where the viscous fluid L (Lb) is absent to the specific region A (Y = 100 - X%).
此處,如圖5所示,於特定區域A中存在黏性流體L(Lb)之部分C1之面積比例與黏性流體槽82之內部之黏性流體L之殘量之間存在相互關係。因此,藉由以上述方式取得特定區域A中存在黏性流體L(Lb)之 部分C1之面積比例,可取得貯留於黏性流體槽82之黏性流體L之殘量。再者,於特定區域A中不存在黏性流體L(Lb)之部分C2之面積比例與黏性流體槽82之內部之黏性流體L之殘量之間亦同樣地存在相互關係,因此藉由取得特定區域A中不存在黏性流體L(Lb)之部分C2之面積比例,亦可取得貯留於黏性流體槽82之黏性流體L之殘量。 Here, as shown in FIG. 5, there is a correlation between the area ratio of the portion C1 in which the viscous fluid L (Lb) exists in the specific region A and the residual amount of the viscous fluid L inside the viscous fluid groove 82. Therefore, by obtaining the viscous fluid L (Lb) in the specific region A in the above manner The area ratio of the portion C1 can be obtained as the residual amount of the viscous fluid L stored in the viscous fluid tank 82. Further, there is a similar relationship between the area ratio of the portion C2 in which the viscous fluid L (Lb) is not present in the specific region A and the residual amount of the viscous fluid L inside the viscous fluid groove 82. The residual amount of the viscous fluid L stored in the viscous fluid tank 82 can also be obtained by obtaining the area ratio of the portion C2 in which the viscous fluid L (Lb) is not present in the specific region A.
因此,控制部9以如下方式構成:基於預先設定之特定區域A中存在黏性流體L(Lb)之部分之面積比例與貯留於黏性流體槽82之黏性流體L之殘量之間之相關資訊,根據所取得之存在黏性流體L(Lb)之部分之面積比例,而取得貯留於黏性流體槽82之黏性流體L之殘量。 Therefore, the control unit 9 is configured to be based on an area ratio of a portion where the viscous fluid L (Lb) exists in the specific region A set in advance and a residual amount of the viscous fluid L stored in the viscous fluid groove 82. Related information, the residual amount of the viscous fluid L stored in the viscous fluid tank 82 is obtained based on the obtained area ratio of the portion of the viscous fluid L (Lb).
又,於第1實施形態中,控制部9係以對所取得之黏性流體L之殘量是否為用以判定是否供給黏性流體L之特定之閾值Th(參照圖5)以下進行判斷之方式構成。再者,特定之閾值Th係基於圖5所示之曲線圖,由使用者預先設定。 Further, in the first embodiment, the control unit 9 determines whether or not the residual amount of the obtained viscous fluid L is equal to or lower than a specific threshold value Th (see FIG. 5) for determining whether or not to supply the viscous fluid L. Way composition. Furthermore, the specific threshold Th is based on the graph shown in FIG. 5 and is preset by the user.
而且,控制部9以如下方式構成:於判斷出黏性流體L之殘量為特定之閾值Th以下之情形時,進行自黏性流體供給部81向黏性流體槽82供給特定量之黏性流體L之控制。 Further, when the control unit 9 determines that the residual amount of the viscous fluid L is equal to or smaller than the specific threshold Th, the self-adhesive fluid supply unit 81 supplies a specific amount of viscosity to the viscous fluid tank 82. Control of fluid L.
又,控制部9以如下方式構成:於判斷出黏性流體L之殘量大於特定之閾值Th之情形時,進行不自黏性流體供給部81向黏性流體槽82供給黏性流體L之控制。 Moreover, the control unit 9 is configured to supply the viscous fluid L to the viscous fluid tank 82 without the self-adhesive fluid supply unit 81 when it is determined that the residual amount of the viscous fluid L is greater than the specific threshold value Th. control.
(照明部之構成) (constitution of the lighting department)
又,於第1實施形態中,照明部43a(參照圖2)構成為可根據黏性流體L之種類,變更照射至特定區域A之光之強度、照射至特定區域A之光之角度、及照射至特定區域A之光之波長。 Further, in the first embodiment, the illumination unit 43a (see FIG. 2) is configured to change the intensity of light that is irradiated to the specific area A, the angle of light that is irradiated to the specific area A, and the angle of the light that is irradiated to the specific area A, depending on the type of the viscous fluid L. The wavelength of light that is irradiated to a specific area A.
具體而言,照明部43a包含:內圈照明部,其呈圈狀配置於基板識別相機43之透鏡周邊,可照射可見光;外圈照明部,其呈圈狀配置於內圈照明部之外側,可照射可見光;及紅外照明部,其可照射紅外 光。又,照明部43a構成為可使內圈照明部、外圈照明部、及紅外照明部各者獨立地發光。又,內圈照明部、外圈照明部及紅外照明部構成為可以互不相同之角度,向特定區域A照射光。 Specifically, the illumination unit 43a includes an inner ring illumination unit that is disposed in a circle shape around the lens of the substrate recognition camera 43 and that emits visible light, and an outer ring illumination unit that is disposed in a circle shape on the outer side of the inner ring illumination unit. Irradiating visible light; and infrared illumination unit, which can illuminate infrared Light. Further, the illumination unit 43a is configured to allow the inner ring illumination unit, the outer ring illumination unit, and the infrared illumination unit to independently emit light. Further, the inner ring illumination unit, the outer ring illumination unit, and the infrared illumination unit are configured to emit light to the specific area A at mutually different angles.
因此,照明部43a構成為藉由變更內圈照明部、外圈照明部、及紅外照明部中發光之照明部之數量,可變更照射至特定區域A之光之強度及光之角度。又,照明部43a構成為藉由僅使內圈照明部及/或外圈照明部發光,而照射可見光,藉由僅使紅外照明部發光,而照射紅外光,藉此可變更照射至特定區域A之光之波長。 Therefore, the illumination unit 43a is configured to change the intensity of the light irradiated to the specific area A and the angle of the light by changing the number of the illumination units that are illuminated in the inner ring illumination unit, the outer ring illumination unit, and the infrared illumination unit. Further, the illumination unit 43a is configured to emit visible light by emitting only the inner ring illumination unit and/or the outer ring illumination unit, and to illuminate the specific area by irradiating only the infrared illumination unit to emit infrared light. The wavelength of the light of A.
於圖6中,關於助焊劑及焊料之兩種黏性流體,表示有存在藉由照明部43a之照明之情形時(自內圈照明部、外圈照明部、及紅外照明部之3個部件照射光之情形時)之特定區域A之攝像圖像(二值化處理後之攝像圖像)。如圖6所示,於使用焊料作為黏性流體之情形時,無論黏性流體L之殘量之多少,均可將兩者區別開來而識別,其原因在於存在黏性流體L(Lb)之部分係用黑色表示,不存在黏性流體L(Lb)之部分係用白色表示。 In FIG. 6, the two types of viscous fluids of the flux and the solder indicate that there are three parts of the inner illuminating unit, the outer ring illuminating unit, and the infrared illuminating unit when there is illumination by the illuminating unit 43a. A captured image of a specific area A when the light is irradiated (a captured image after binarization processing). As shown in Fig. 6, when solder is used as the viscous fluid, the difference between the two can be recognized regardless of the residual amount of the viscous fluid L, because the viscous fluid L (Lb) is present. The part is indicated by black, and the part where the viscous fluid L (Lb) is absent is indicated by white.
另一方面,於使用助焊劑作為黏性流體之情形時,存在以下情形:儘管當黏性流體L之殘量較少時,可將兩者區別開來而識別,但是當黏性流體L之殘量較多時,由於存在黏性流體L(Lb)之部分係用白色表示,所以難以將兩者區別開來而識別。 On the other hand, in the case of using a flux as a viscous fluid, there are cases in which, when the residual amount of the viscous fluid L is small, the two can be distinguished and recognized, but when the viscous fluid L is When the residual amount is large, since the portion where the viscous fluid L (Lb) is present is indicated by white, it is difficult to distinguish the two and recognize them.
又,於圖7中,關於助焊劑,表示有變更藉由照明部43a之照明之情形時(自內圈照明部及紅外照明部之2個部件照射光之情形時)之特定區域A之攝像圖像(二值化處理後之攝像圖像)。如圖7所示,於變更藉由照明部43a之照明之情形時,即便是使用助焊劑作為黏性流體時,無論黏性流體L之殘量之多少,亦均可將兩者區別開來而識別,其原因在於存在黏性流體L(Lb)之部分係用黑色表示,不存在黏性流體L(Lb)之部分係用白色表示。如此,照明部43a以如下方式構成:根 據黏性流體L之種類,變更照射至特定區域A之光之強度、照射至特定區域A之光之角度、及照射至特定區域A之光之波長。 In addition, in the case of the flux, when the illumination by the illumination unit 43a is changed (the case where the light is irradiated from two members of the inner-circle illumination unit and the infrared illumination unit), the imaging of the specific area A is shown in FIG. Image (camera image after binarization). As shown in FIG. 7, when the illumination by the illumination unit 43a is changed, even if a flux is used as the viscous fluid, the difference between the two can be distinguished regardless of the amount of the viscous fluid L remaining. The reason for the identification is that the portion in which the viscous fluid L (Lb) is present is indicated by black, and the portion in which the viscous fluid L (Lb) is absent is indicated by white. In this manner, the illumination unit 43a is configured as follows: The intensity of the light irradiated to the specific area A, the angle of the light irradiated to the specific area A, and the wavelength of the light irradiated to the specific area A are changed according to the type of the viscous fluid L.
(與轉印單元相關之動作) (action related to the transfer unit)
其次,參照圖8,作為與轉印單元相關之動作,對掃刮動作、塊狀流體攝像動作、及黏性流體轉印動作進行說明。 Next, the wiping operation, the block fluid imaging operation, and the viscous fluid transfer operation will be described as operations related to the transfer unit with reference to Fig. 8 .
如圖8(A)所示,於向零件31轉印黏性流體L之前,藉由板驅動機構84使塗膜形成板83於驅動方向上往返移動,藉此向塗膜形成板83之塗膜形成部83b,填充貯留於黏性流體槽82之黏性流體L。同時,藉由黏性流體槽82刮取並抹平黏性流體L。其結果,如圖8(B)所示,於塗膜形成板83之塗膜形成部83b,形成有適於黏性流體L向零件31之轉印之厚度t之黏性流體L之塗膜La。該掃刮動作於每次向零件31轉印黏性流體L時均進行。 As shown in FIG. 8(A), before the viscous fluid L is transferred to the component 31, the coating film forming plate 83 is reciprocated in the driving direction by the plate driving mechanism 84, thereby applying the coating film forming plate 83. The film forming portion 83b fills the viscous fluid L stored in the viscous fluid tank 82. At the same time, the viscous fluid L is scraped and smoothed by the viscous fluid groove 82. As a result, as shown in Fig. 8(B), a coating film of a viscous fluid L suitable for the thickness t of the transfer of the viscous fluid L to the component 31 is formed in the coating film forming portion 83b of the coating film forming plate 83. La. This wiping action is performed every time the viscous fluid L is transferred to the part 31.
又,如圖8(B)所示,於實施掃刮動作時,於黏性流體槽82之內部,發生被稱為捲動之黏性流體L之夾帶現象,因此於掃刮後之黏性流體槽82之內部,形成有已成為塊狀之黏性流體L(Lb)。而且,於形成有已成為塊狀之黏性流體L(Lb)之期間,藉由頭單元4之基板識別相機43而拍攝包含存在已成為塊狀之黏性流體L(Lb)之部分、及不存在黏性流體L(Lb)之部分之特定區域A(參照圖3)。此時,自正確地測定黏性流體槽82之內部之黏性流體L之殘量之觀點而言,較佳為於已成為塊狀之黏性流體L(Lb)之形狀崩壞之前進行藉由基板識別相機43之攝像。因此,較佳為於掃刮動作結束之前,使基板識別相機43預先於用以拍攝特定區域A之特定位置待機。 Further, as shown in FIG. 8(B), when the wiping operation is performed, an entrainment phenomenon called a viscous fluid L called a wrap is generated inside the viscous fluid groove 82, so that the viscosity after the squeegee is removed. Inside the fluid groove 82, a viscous fluid L (Lb) which has been formed into a block shape is formed. Further, during the formation of the bulky viscous fluid L (Lb), the substrate recognition camera 43 of the head unit 4 captures a portion including the viscous fluid L (Lb) which is in the form of a block, and There is no specific area A of a portion of the viscous fluid L (Lb) (refer to Fig. 3). At this time, from the viewpoint of accurately measuring the residual amount of the viscous fluid L inside the viscous fluid groove 82, it is preferable to borrow before the shape of the viscous fluid L (Lb) which has become a block collapses. The imaging of the camera 43 is recognized by the substrate. Therefore, it is preferable to cause the substrate recognition camera 43 to stand by in advance at a specific position for capturing the specific area A before the end of the wiping operation.
其後,如圖8(C)所示,藉由頭單元4之安裝頭42之升降,對吸附於安裝頭42之零件31,轉印形成於塗膜形成板83之塗膜狀之黏性流體L(La)。再者,於圖8中,表示有配合黏性流體轉印動作,進行用以形成轉印至零件31之黏性流體L之塗膜La之掃刮動作之例,但並不限於 此,亦可配合塊狀流體攝像動作,進行用以拍攝已成為塊狀之黏性流體L之掃刮動作。 Then, as shown in FIG. 8(C), the adhesive film formed on the coating film forming plate 83 is transferred to the component 31 adsorbed to the mounting head 42 by the lifting and lowering of the mounting head 42 of the head unit 4. Fluid L (La). In addition, FIG. 8 shows an example of a wiping operation for forming a coating film La of the viscous fluid L transferred to the component 31 in conjunction with a viscous fluid transfer operation, but is not limited thereto. In this case, it is also possible to perform a wiping operation for capturing the viscous fluid L that has become a block in accordance with the block fluid imaging operation.
(黏性流體自動供給處理) (Adhesive fluid automatic supply processing)
其次,參照圖9,基於流程圖對於基板作業裝置100之轉印單元8之黏性流體自動供給處理進行說明。再者,基板作業裝置100之動作係藉由控制部9而進行。 Next, an viscous fluid automatic supply process of the transfer unit 8 of the substrate working device 100 will be described based on a flowchart with reference to FIG. Furthermore, the operation of the substrate working device 100 is performed by the control unit 9.
首先,如圖9所示,於步驟S1中,藉由利用板驅動機構84移動塗膜形成板83,而由黏性流體槽82進行黏性流體L之掃刮動作。 First, as shown in FIG. 9, in step S1, the coating film forming plate 83 is moved by the plate driving mechanism 84, and the viscous fluid groove 82 is subjected to the wiping operation of the viscous fluid L.
繼而,於步驟S2中,對是否為利用基板識別相機43拍攝特定區域A之攝像時點進行判斷。作為攝像時點,例如可設定為自前次之塊狀流體攝像動作起已進行過特定次數之掃刮動作之情形時、自前次之塊狀流體攝像動作起已經過特定時間之情形時、已進行過下述步驟S6之黏性流體供給動作之情形時等。 Then, in step S2, it is determined whether or not the imaging time of the specific area A is captured by the substrate recognition camera 43. When the imaging time is set to, for example, a certain number of times of the scanning operation has been performed since the previous block fluid imaging operation, and the specific time has elapsed since the previous block fluid imaging operation, the time has elapsed. In the case of the viscous fluid supply operation in the following step S6, etc.
當於步驟S2中,判斷出並非攝像時點之情形時,進入步驟S5,進行黏性流體轉印動作。再者,於進行黏性流體轉印動作之後,吸附於安裝頭42之零件31被安裝於基板P上。 When it is determined in step S2 that it is not the time of imaging, the process proceeds to step S5 to perform a viscous fluid transfer operation. Further, after the viscous fluid transfer operation, the component 31 adsorbed to the mounting head 42 is mounted on the substrate P.
又,當於步驟S2中,判斷出是攝像時點之情形時,進入步驟S3。 Moreover, when it is judged that it is the imaging time point in step S2, it progresses to step S3.
繼而,於步驟S3中,藉由基板識別相機43而進行包含存在已成為塊狀之黏性流體L(Lb)之部分、及不存在黏性流體L(Lb)之部分之特定區域A之攝像。 Then, in step S3, the substrate recognition camera 43 performs imaging of a specific region A including a portion where the bulky viscous fluid L (Lb) exists and a portion where the viscous fluid L (Lb) does not exist. .
繼而,於步驟S4中,基於基板識別相機43拍攝所得之攝像圖像,判斷黏性流體L之殘量是否為特定之閾值Th以下。於判斷出黏性流體L之殘量並非特定之閾值Th以下之情形時,認為無須向黏性流體槽82供給(補給)黏性流體L,因此進入步驟S5,不向黏性流體槽82進行黏性流體L之供給,而進行黏性流體轉印動作。 Then, in step S4, based on the captured image captured by the substrate recognition camera 43, it is determined whether or not the residual amount of the viscous fluid L is equal to or less than a specific threshold Th. When it is determined that the residual amount of the viscous fluid L is not equal to or less than the specific threshold value Th, it is considered that it is not necessary to supply (supply) the viscous fluid L to the viscous fluid tank 82, so that the process proceeds to step S5 without proceeding to the viscous fluid tank 82. The viscous fluid transfer operation is performed by supplying the viscous fluid L.
又,當於步驟S4中,判斷出黏性流體L之殘量為特定之閾值Th以下之情形時,認為需要向黏性流體槽82供給(補給)黏性流體L,因此進入步驟S6。 When it is determined in step S4 that the residual amount of the viscous fluid L is equal to or less than the specific threshold value Th, it is considered that it is necessary to supply (replenish) the viscous fluid L to the viscous fluid tank 82. Therefore, the process proceeds to step S6.
繼而,於步驟S6中,進行自黏性流體供給部81向黏性流體槽82供給特定量之黏性流體L之黏性流體供給動作。藉此,於黏性流體L之殘量為特定之閾值Th以下之情形時,黏性流體L自動地供給(補給)至黏性流體槽82。 Then, in step S6, the viscous fluid supply operation in which the self-adhesive fluid supply unit 81 supplies a specific amount of the viscous fluid L to the viscous fluid tank 82 is performed. Thereby, when the residual amount of the viscous fluid L is equal to or less than the specific threshold value Th, the viscous fluid L is automatically supplied (replenished) to the viscous fluid tank 82.
又,於黏性流體L之殘量為特定之閾值Th以下之情形時,存在藉由前次之掃刮動作並未於塗膜形成板83上正常地形成黏性流體L之塗膜之可能性,因此返回至步驟S1,再次進行掃刮動作。以上動作針對吸附於安裝頭42之每個零件31依序執行。 Further, when the residual amount of the viscous fluid L is equal to or less than the specific threshold value Th, there is a possibility that the coating film of the viscous fluid L is not normally formed on the coating film forming plate 83 by the previous wiping operation. Therefore, the process returns to step S1, and the sweeping operation is performed again. The above actions are sequentially performed for each of the parts 31 adsorbed to the mounting head 42.
(第1實施形態之效果) (Effects of the first embodiment)
於第1實施形態中,可獲得如下效果。 In the first embodiment, the following effects can be obtained.
於第1實施形態中,設有控制部9,該控制部9如上所述,基於藉由基板識別相機43而拍攝之特定區域A之攝像圖像B1中存在黏性流體L之部分C1之大小、及不存在黏性流體L之部分C2之大小,取得黏性流體L之殘量。藉此,利用存在已成為塊狀之黏性流體L(Lb)之部分C1之大小及不存在黏性流體L之部分C2之大小與黏性流體L之殘量相關之事實,可正確地(定量地)測定黏性流體L之殘量。又,對包含存在已成為塊狀之黏性流體L(Lb)之部分C1與不存在黏性流體L之部分C2之特定區域A進行拍攝,基於特定區域A之攝像圖像B1取得殘量,故而與隔著黏性流體L而拍攝識別標記之構成不同,即便為有色之黏性流體L,亦可容易地測定殘量。 In the first embodiment, the control unit 9 is provided. The control unit 9 has the size of the portion C1 of the viscous fluid L in the captured image B1 of the specific region A captured by the substrate recognition camera 43 as described above. And the size of the portion C2 of the viscous fluid L is absent, and the residual amount of the viscous fluid L is obtained. Thereby, the fact that the size of the portion C1 in which the bulky viscous fluid L (Lb) exists and the portion C2 in which the viscous fluid L does not exist are related to the residual amount of the viscous fluid L can be correctly ( The residual amount of the viscous fluid L is measured quantitatively. Further, the specific region A including the portion C1 in which the bulky viscous fluid L (Lb) exists and the portion C2 in which the viscous fluid L is not present is imaged, and the residual image is obtained based on the captured image B1 of the specific region A. Therefore, unlike the configuration in which the identification mark is photographed via the viscous fluid L, even if it is a colored viscous fluid L, the residual amount can be easily measured.
又,於第1實施形態中,以如下方式構成控制部9:基於特定區域A之攝像圖像B1,取得特定區域A中存在黏性流體L之部分C1之面積及不存在黏性流體L之部分C2之面積,並且基於所取得之存在黏性 流體L之部分C1之面積及不存在黏性流體L之部分C2之面積,取得黏性流體L之殘量。藉此,與例如基於藉由光感測器而獲得之點之測定結果取得黏性流體之殘量之情形不同,係基於面積取得黏性流體L之殘量,故而即便於黏性流體槽82所實施之每個刮取動作中,已成為塊狀之黏性流體L之形狀稍微存在不均,亦可穩定且正確地(定量地)測定黏性流體L之殘量。 Further, in the first embodiment, the control unit 9 is configured to acquire the area of the portion C1 in which the viscous fluid L exists in the specific region A and the absence of the viscous fluid L based on the image B1 of the specific region A. Part of the area of C2, and based on the presence of viscosity The area of the portion C1 of the fluid L and the area of the portion C2 where the viscous fluid L is not present obtain the residual amount of the viscous fluid L. Thereby, unlike the case where the residual amount of the viscous fluid is obtained based on the measurement result of the point obtained by the photosensor, the residual amount of the viscous fluid L is obtained based on the area, so even the viscous fluid groove 82 is obtained. In each of the scraping operations performed, the shape of the bulky viscous fluid L is slightly uneven, and the residual amount of the viscous fluid L can be measured stably and accurately (quantitatively).
又,於第1實施形態中,以如下方式構成控制部9:藉由對特定區域A之攝像圖像B1進行二值化處理,取得特定區域A之二值化圖像B2,並且基於所取得之二值化圖像B2,取得特定區域A中存在黏性流體L之部分C1之面積及不存在黏性流體L之部分C2之面積。藉此,可容易地取得存在黏性流體L之部分C1之面積或不存在黏性流體L之部分C2之面積。 Further, in the first embodiment, the control unit 9 is configured to obtain the binarized image B2 of the specific region A by performing binarization processing on the captured image B1 of the specific region A, and based on the acquired image The binarized image B2 acquires the area of the portion C1 where the viscous fluid L exists in the specific region A and the area of the portion C2 where the viscous fluid L does not exist. Thereby, the area of the portion C1 where the viscous fluid L exists or the portion C2 where the viscous fluid L does not exist can be easily obtained.
又,於第1實施形態中,以如下方式構成控制部9:當判斷出所取得之黏性流體L之殘量為特定之閾值Th以下之情形時,進行自黏性流體供給部81供給黏性流體L之控制。藉此,可基於正確地測定出之黏性流體L之殘量供給黏性流體L,故而可適量地供給黏性流體L。其結果,與超過必要量地多餘供給黏性流體L以避免黏性流體L不足之情形不同,可抑制黏性流體L之使用量增加。又,由於自動地供給黏性流體L,所以可抑制黏性流體L不足,從而黏性流體L未充分地轉印至作為轉印對象物之零件31之不良狀況之發生。 Further, in the first embodiment, the control unit 9 is configured to supply the viscosity to the self-adhesive fluid supply unit 81 when it is determined that the residual amount of the obtained viscous fluid L is equal to or less than the specific threshold value Th. Control of fluid L. Thereby, the viscous fluid L can be supplied based on the residual amount of the viscous fluid L that is accurately measured, so that the viscous fluid L can be supplied in an appropriate amount. As a result, unlike the case where the viscous fluid L is excessively supplied in excess of the required amount to prevent the viscous fluid L from being insufficient, the amount of use of the viscous fluid L can be suppressed from increasing. In addition, since the viscous fluid L is supplied automatically, it is possible to suppress the occurrence of a problem that the viscous fluid L is insufficiently transferred to the component 31 as the transfer target.
又,於第1實施形態中,以基板識別相機43與安裝頭42一起相對於黏性流體槽82而相對地移動之方式構成基板識別相機43。藉此,可使安裝頭42與基板識別相機43藉由共同之移動機構而移動,因此可抑制用以測定黏性流體L之殘量之裝置構成複雜化。 Further, in the first embodiment, the substrate recognition camera 43 is configured such that the substrate recognition camera 43 moves relative to the viscous fluid groove 82 together with the mounting head 42. Thereby, the mounting head 42 and the substrate recognition camera 43 can be moved by the common moving mechanism, so that the configuration of the device for measuring the residual amount of the viscous fluid L can be suppressed.
又,於第1實施形態中,黏性流體L之殘量測定用攝像部係對用以識別基板P之基準標記F進行拍攝之基板識別相機43。藉此,亦可將 基板識別相機43作為黏性流體L之殘量測定用之攝像部使用,故而可進一步抑制用以測定黏性流體L之殘量之裝置構成複雜化。 In the first embodiment, the imaging unit for measuring the residual amount of the viscous fluid L is a substrate recognition camera 43 that images the reference mark F for identifying the substrate P. By this, you can also Since the substrate recognition camera 43 is used as an imaging unit for measuring the residual amount of the viscous fluid L, it is possible to further suppress the complication of the device configuration for measuring the residual amount of the viscous fluid L.
又,於第1實施形態中,以如下方式構成基板識別相機43:對包含存在處於具有貯留黏性流體L之框形狀之黏性流體槽82之內部且已成為塊狀之黏性流體L(Lb)之部分C1及不存在黏性流體L之部分C2之黏性流體槽82之內部之特定區域A進行拍攝。藉此,藉由具有框形狀之黏性流體槽82,可容易地使黏性流體L形成為塊狀。其結果,可容易地形成存在已成為塊狀之黏性流體L(Lb)之部分C1及不存在黏性流體L之部分C2,且可藉由基板識別相機43對其進行拍攝。 Further, in the first embodiment, the substrate recognition camera 43 is configured to include a viscous fluid L which is in the form of a block which is present inside the viscous fluid groove 82 having the frame shape of the storage viscous fluid L ( Part C1 of Lb) and a specific area A inside the viscous fluid groove 82 in which part C2 of the viscous fluid L is absent are photographed. Thereby, the viscous fluid L can be easily formed into a block shape by the viscous fluid groove 82 having a frame shape. As a result, the portion C1 in which the viscous fluid L (Lb) which has become bulky and the portion C2 in which the viscous fluid L does not exist can be easily formed, and can be imaged by the substrate recognition camera 43.
又,於第1實施形態中,以如下方式構成黏性流體槽82:使黏性流體槽82相對於塗膜形成板83相對地移動,而一面刮取黏性流體L一面將其抹平,從而於塗膜形成板83上,形成轉印至零件31之黏性流體L之塗膜La。而且,以如下方式構成基板識別相機43:自塗膜形成板83之上方,對包含存在處於塗膜形成板83上且已成為塊狀之黏性流體L(Lb)之部分C1及不存在黏性流體L之部分C2之特定區域A進行拍攝。藉此,於形成於塗膜形成板83之黏性流體L之塗膜La轉印至零件31之構成中,可正確(定量地)且確實地測定黏性流體L之殘量。 Further, in the first embodiment, the viscous fluid groove 82 is configured such that the viscous fluid groove 82 is relatively moved with respect to the coating film forming plate 83, and the viscous fluid L is scraped off while being scraped. Thus, a coating film La which is transferred to the viscous fluid L of the component 31 is formed on the coating film forming plate 83. Further, the substrate recognition camera 43 is configured as follows: above the self-coating film forming plate 83, the portion C1 containing the viscous fluid L (Lb) which is on the coating film forming plate 83 and which has become a block shape, and the absence of adhesion A specific area A of the portion C2 of the fluid L is photographed. Thereby, the coating film La formed on the viscous fluid L of the coating film forming plate 83 is transferred to the component 31, and the residual amount of the viscous fluid L can be accurately (quantitatively and reliably) measured.
又,於第1實施形態中,構成可根據黏性流體L之種類,變更照射至特定區域A之光之強度之照明部43a。藉此,可藉由與黏性流體L之種類相應之適當之照明拍攝特定區域A,因此可以容易地將存在已成為塊狀之黏性流體L(Lb)之部分C1與不存在黏性流體L之部分C2區別開來而識別之方式進行拍攝。其結果,可更正確地測定黏性流體L之殘量。 Further, in the first embodiment, the illumination unit 43a that changes the intensity of the light that is irradiated to the specific area A can be changed depending on the type of the viscous fluid L. Thereby, the specific region A can be photographed by appropriate illumination corresponding to the kind of the viscous fluid L, so that the portion C1 in which the viscous fluid L (Lb) which has become bulky can be easily formed and the viscous fluid is absent Part C of L is distinguished by the way it is identified and photographed. As a result, the residual amount of the viscous fluid L can be more accurately measured.
[第2實施形態] [Second Embodiment]
以下,參照圖10,對本發明之第2實施形態之基板作業裝置200之構成進行說明。 Hereinafter, the configuration of the substrate working device 200 according to the second embodiment of the present invention will be described with reference to Fig. 10 .
於該第2實施形態中,與將本發明應用於將零件31安裝於基板P上之零件安裝裝置之第1實施形態不同,而對將本發明應用於對基板P印刷焊料之印刷裝置之例進行說明。 In the second embodiment, unlike the first embodiment in which the present invention is applied to a component mounting device in which the component 31 is mounted on the substrate P, an example in which the present invention is applied to a printing device for printing solder on the substrate P is described. Be explained.
(基板作業裝置之構成) (Structure of substrate working device)
第2實施形態之基板作業裝置200係一種印刷裝置,其如圖10所示,將包含焊料之黏性流體L作為印刷(轉印)材料,使用以特定之印刷圖案形成有開口部(未圖示)之遮罩M,於基板P之表面網版印刷黏性流體L。再者,基板P係申請專利範圍之「轉印對象物」之一例。 The substrate working device 200 according to the second embodiment is a printing device. As shown in FIG. 10, the viscous fluid L containing solder is used as a printing (transfer) material, and an opening portion is formed by using a specific printing pattern (not shown). The mask M of the substrate is screen printed with a viscous fluid L on the surface of the substrate P. Further, the substrate P is an example of a "transfer object" in the patent application.
基板作業裝置200具備基台101、包含刮刀部121之刮刀單元102、及基板台103。刮刀單元102及基板台103配置於基台101上。刮刀單元102係以藉由使刮刀部121於Y方向上移動而進行印刷動作之方式構成。 The substrate working device 200 includes a base 101, a doctor unit 102 including a blade portion 121, and a substrate stage 103. The doctor unit 102 and the substrate stage 103 are disposed on the base 101. The doctor unit 102 is configured to perform a printing operation by moving the blade unit 121 in the Y direction.
又,如圖10所示,基板作業裝置200具備拍攝黏性流體L之黏性流體識別相機104、及控制基板作業裝置200之整體之控制部105。再者,黏性流體識別相機104係申請專利範圍之「攝像部」之一例。 Further, as shown in FIG. 10, the substrate working device 200 includes a viscous fluid recognizing camera 104 that images the viscous fluid L, and a control unit 105 that controls the entire substrate working device 200. Further, the viscous fluid recognition camera 104 is an example of the "camera portion" of the patent application.
遮罩M於俯視時具有矩形形狀,外周部安裝於框架106。基板作業裝置200藉由未圖示之遮罩保持部保持框架106。 The mask M has a rectangular shape in plan view, and the outer peripheral portion is attached to the frame 106. The substrate working device 200 holds the frame 106 by a mask holding portion (not shown).
刮刀單元102配置於遮罩M之上方。刮刀單元102包含刮刀部121、刮刀Y軸驅動機構122、刮刀Z軸驅動機構123、刮刀R軸驅動機構124、及黏性流體供給部125。 The doctor unit 102 is disposed above the mask M. The doctor unit 102 includes a blade portion 121, a blade Y-axis driving mechanism 122, a blade Z-axis driving mechanism 123, a blade R-axis driving mechanism 124, and a viscous fluid supply portion 125.
刮刀部121以如下方式構成:具有刮刀狀形狀,以於Y方向上移動而刮取黏性流體L之方式將黏性流體L抹平,藉此將遮罩M上之黏性流體L轉印(印刷)於基板P上。此時,刮刀部121以如下方式構成:一面自上側(Z1方向側)向遮罩M施加特定之印壓(負重)一面於印刷方向(Y方向)上移動,藉此一面使黏性流體L捲動(旋轉)一面進行轉印(印刷)。 The blade portion 121 is configured to have a blade-like shape to smooth the viscous fluid L in such a manner as to move in the Y direction to scrape the viscous fluid L, thereby transferring the viscous fluid L on the mask M. (Printed) on the substrate P. At this time, the doctor blade portion 121 is configured to move the viscous fluid L while moving in the printing direction (Y direction) by applying a specific printing pressure (load weight) to the mask M from the upper side (the Z1 direction side). The transfer (printing) is performed while scrolling (rotating).
刮刀Y軸驅動機構122包含Y軸馬達122a。刮刀Y軸驅動機構122係以藉由驅動Y軸馬達122a,使刮刀單元102(刮刀部121)沿Y軸軌道於Y方向上移動之方式構成。刮刀Z軸驅動機構123係以使刮刀R軸驅動機構124及刮刀部121於Z方向上升降之方式構成。刮刀R軸驅動機構124係以使刮刀部121繞旋動軸中心旋動之方式構成。黏性流體供給部125配置於遮罩M之上方,具有向遮罩M之上表面上供給黏性流體L之功能。 The scraper Y-axis drive mechanism 122 includes a Y-axis motor 122a. The blade Y-axis drive mechanism 122 is configured to move the blade unit 102 (the blade portion 121) in the Y direction along the Y-axis by driving the Y-axis motor 122a. The scraper Z-axis drive mechanism 123 is configured to elevate and lower the scraper R-axis drive mechanism 124 and the scraper portion 121 in the Z direction. The scraper R-axis drive mechanism 124 is configured to rotate the scraper portion 121 about the center of the swivel axis. The viscous fluid supply unit 125 is disposed above the mask M and has a function of supplying the viscous fluid L to the upper surface of the mask M.
基板台103構成為配置於遮罩M之下方位置(Z2側位置),且可於基台101上沿Y方向往返移動。基板台103進行將基板P搬送至特定之印刷位置並加以保持之動作、及搬出已印刷完畢之基板P之動作。 The substrate stage 103 is disposed so as to be disposed at a position (Z2 side) below the mask M, and is reciprocally movable in the Y direction on the base 101. The substrate stage 103 performs an operation of transporting the substrate P to a specific printing position and holding it, and an operation of carrying out the printed substrate P.
基板台103包含一對輸送器131、夾具構件(夾板)132、Y軸移動機構133、Z軸移動機構134、未圖示之X軸移動機構及R軸移動機構。 The substrate stage 103 includes a pair of conveyors 131, a jig member (plywood) 132, a Y-axis moving mechanism 133, a Z-axis moving mechanism 134, an X-axis moving mechanism (not shown), and an R-axis moving mechanism.
一對輸送器131具有如下功能:自上游側之裝置搬入未印刷之基板P,將基板P搬送至特定之印刷位置,並將印刷完畢之基板P搬出至下游側之裝置。一對輸送器131係於Y方向上隔開特定距離而相互平行地配置。一對輸送器131係以沿基板P之搬送方向(X方向)延伸之方式設置。一對輸送器131係以可與所搬送之基板P之寬度(Y方向尺寸)對應地調整Y方向之間隔之方式構成。 The pair of conveyors 131 have a function of transferring the unprinted substrate P from the upstream device, transporting the substrate P to a specific printing position, and carrying the printed substrate P to the downstream device. The pair of conveyors 131 are arranged in parallel with each other with a predetermined distance in the Y direction. The pair of conveyors 131 are provided to extend in the conveying direction (X direction) of the substrate P. The pair of conveyors 131 are configured to adjust the interval in the Y direction in accordance with the width (the Y dimension) of the substrate P to be conveyed.
夾具構件132以如下方式構成:以鄰接於一對輸送器131之上側之方式設有一對,藉由自兩側夾緊(夾持)基板P之側端面而固定(保持)該基板P。 The jig member 132 is configured such that a pair is provided adjacent to the upper side of the pair of conveyors 131, and the substrate P is fixed (held) by clamping (clamping) the side end faces of the substrate P from both sides.
Y軸移動機構133包含Y軸馬達133a。Y軸移動機構133係以藉由使Y軸馬達133a驅動,而使基板台103沿Y軸軌道於Y方向上移動之方式構成。 The Y-axis moving mechanism 133 includes a Y-axis motor 133a. The Y-axis moving mechanism 133 is configured to move the substrate stage 103 in the Y direction along the Y-axis track by driving the Y-axis motor 133a.
Z軸移動機構134包含Z軸台134a。Z軸移動機構134係以藉由使未圖示之Z軸馬達驅動,而使Z軸台134a於Z方向上移動(升降)之方式構 成。於Z軸台134a上,設有基板升降部135及一對托架構件103b,於托架構件103b之各上部設有輸送器131及夾具構件132。 The Z-axis moving mechanism 134 includes a Z-axis stage 134a. The Z-axis moving mechanism 134 is configured to move the Z-axis table 134a in the Z direction (lifting and lowering) by driving a Z-axis motor (not shown). to make. A substrate lifting portion 135 and a pair of bracket members 103b are provided on the Z-axis table 134a, and a conveyor 131 and a clamp member 132 are provided on each of the bracket members 103b.
基板升降部135以如下方式構成:配置於一對輸送器131之間之Y方向位置,使支持板135a於Z方向上移動(升降)。於支持板135a配置有未圖示之支承銷。基板升降部135係以藉由支承銷支持基板P之方式構成。 The substrate lifting and lowering portion 135 is configured to be disposed in the Y-direction between the pair of conveyors 131 to move (lift) the support plate 135a in the Z direction. A support pin (not shown) is disposed on the support plate 135a. The substrate lifting portion 135 is configured to support the substrate P by a support pin.
再者,未圖示之X軸移動機構具有使基板P於X方向上移動之功能,同樣地未圖示之R軸移動機構具有使基板P於水平面內(XY面內)旋動之功能。於藉由該等X軸移動機構、Y軸移動機構133及R軸移動機構將基板P相對於遮罩M之相對位置(水平面內之位置及斜率)正確地定位之狀態下,藉由Z軸移動機構134將基板P抵接於遮罩M之下表面。 Further, the X-axis moving mechanism (not shown) has a function of moving the substrate P in the X direction, and similarly, the R-axis moving mechanism (not shown) has a function of rotating the substrate P in the horizontal plane (in the XY plane). By the X-axis moving mechanism, the Y-axis moving mechanism 133, and the R-axis moving mechanism, the relative position of the substrate P relative to the mask M (the position and the slope in the horizontal plane) is correctly positioned, and the Z-axis is used. The moving mechanism 134 abuts the substrate P to the lower surface of the mask M.
黏性流體識別相機104構成為可相對於遮罩M相對地移動。再者,黏性流體識別相機104既可藉由與刮刀單元102之移動機構共同之移動機構,相對於遮罩M相對地移動,亦可藉由專用之移動機構,相對於遮罩M相對地移動。 The viscous fluid recognition camera 104 is configured to be relatively movable with respect to the mask M. Furthermore, the viscous fluid recognition camera 104 can be relatively moved relative to the mask M by a moving mechanism common to the moving mechanism of the doctor unit 102, or can be relatively opposed to the mask M by a dedicated moving mechanism. mobile.
此處,於第2實施形態中,黏性流體識別相機104以如下方式構成:為了測定遮罩M上之黏性流體L之殘量,對包含存在被刮刀單元102之刮刀部121刮取且已成為塊狀之黏性流體L之部分、及不存在黏性流體L之部分之特定區域進行拍攝。此時,黏性流體識別相機104以如下方式構成:根據遮罩M之資訊,對包含存在處於遮罩上且已成為塊狀之黏性流體L之部分、及不存在黏性流體L之部分之特定區域進行拍攝。 Here, in the second embodiment, the viscous fluid recognizing camera 104 is configured to scrape the scraper portion 121 including the scraper unit 102 in order to measure the residual amount of the viscous fluid L on the mask M. A specific area of the block-shaped viscous fluid L and a portion where the viscous fluid L is not present is photographed. At this time, the viscous fluid recognizing camera 104 is configured to include, in accordance with the information of the mask M, a portion including the viscous fluid L which is present on the mask and which has become a block, and a portion where the viscous fluid L is not present. Shoot in a specific area.
於該情形時,亦與上述第1實施形態同樣地,於特定區域之攝像圖像中,於存在黏性流體L之部分,光因黏性流體L發生漫反射,因此獲得相對較暗之圖像。另一方面,於不存在黏性流體L之部分,光 因遮罩M之上表面發生鏡面反射,因此獲得相對較亮之圖像。藉此,可將攝像圖像中存在黏性流體L之部分與攝像圖像中不存在黏性流體L之部分區別開來而識別。 In this case as well, as in the first embodiment, in the captured image of the specific region, the light is diffusely reflected by the viscous fluid L in the portion where the viscous fluid L is present, so that a relatively dark map is obtained. image. On the other hand, in the absence of part of the viscous fluid L, light A relatively bright image is obtained due to specular reflection on the surface of the mask M. Thereby, the portion where the viscous fluid L exists in the captured image can be distinguished from the portion where the viscous fluid L is not present in the captured image.
而且,控制部105與上述第1實施形態同樣地以如下方式構成:取得藉由黏性流體識別相機4而拍攝之特定區域之攝像圖像,並且基於所取得之特定區域之攝像圖像,取得黏性流體L之殘量。即,以如下方式構成:對特定區域之攝像圖像進行二值化處理,自經過二值化處理之攝像圖像取得存在黏性流體L之部分之面積比例,自所取得之存在黏性流體L之部分之面積比例取得遮罩M上之黏性流體L之殘量。 Further, the control unit 105 is configured to acquire a captured image of a specific region captured by the viscous fluid recognition camera 4 and acquire the captured image based on the acquired specific region, similarly to the above-described first embodiment. The residual amount of viscous fluid L. In other words, it is configured to perform binarization processing on a captured image of a specific region, and obtain an area ratio of a portion where the viscous fluid L exists from the captured image subjected to the binarization processing, and the viscous fluid existing from the obtained The area ratio of the portion of L obtains the residual amount of the viscous fluid L on the mask M.
又,控制部105以如下方式構成:對所取得之黏性流體L之殘量是否為用以判定是否供給黏性流體L之特定之閾值以下進行判斷,並且於判斷出黏性流體L之殘量為特定之閾值以下之情形時,進行自黏性流體供給部125向遮罩M供給特定量之黏性流體L之控制。 Further, the control unit 105 is configured to determine whether or not the residual amount of the obtained viscous fluid L is equal to or lower than a specific threshold value for determining whether or not the viscous fluid L is supplied, and to determine the residual of the viscous fluid L. When the amount is equal to or less than a specific threshold value, the self-adhesive fluid supply unit 125 performs control for supplying a specific amount of the viscous fluid L to the mask M.
再者,第2實施形態之其他構成與上述第1實施形態相同。 The other configuration of the second embodiment is the same as that of the first embodiment.
於第2實施形態中,可獲得如下效果。 In the second embodiment, the following effects can be obtained.
(第2實施形態之效果) (Effect of the second embodiment)
於第2實施形態中,設有控制部105,該控制部105如上所述,基於藉由黏性流體識別相機104而拍攝之特定區域之攝像圖像中存在黏性流體L之部分之大小、及不存在黏性流體L之部分之大小,取得黏性流體L之殘量。藉此,與上述第1實施形態同樣地,可正確地(定量地)測定黏性流體L之殘量,並且即便為有色之黏性流體L,亦可容易地測定殘量。 In the second embodiment, the control unit 105 is provided. The control unit 105 has the size of the portion of the viscous fluid L in the captured image of the specific region captured by the viscous fluid recognition camera 104 as described above. And the size of the portion of the viscous fluid L is not present, and the residual amount of the viscous fluid L is obtained. Thereby, similarly to the above-described first embodiment, the residual amount of the viscous fluid L can be accurately (quantitatively) measured, and even if it is a colored viscous fluid L, the residual amount can be easily measured.
又,於第2實施形態中,以如下方式構成刮刀部121:於遮罩M上移動而一面刮取黏性流體L一面將其抹平,經由印刷圖案將遮罩M上之黏性流體L轉印至基板。而且,以如下方式構成黏性流體識別相機104:自遮罩M之上方,對包含存在處於遮罩M上且已成為塊狀之黏 性流體L之部分與不存在黏性流體L之部分之特定區域進行拍攝。藉此,於經由印刷圖案將焊料等遮罩M上之黏性流體L轉印至基板P之構成中,可正確(定量地)且確實地測定焊料等黏性流體L之殘量。 Further, in the second embodiment, the doctor blade portion 121 is configured such that the viscous fluid L is scraped while being moved over the mask M, and the viscous fluid L on the mask M is printed via the printing pattern. Transfer to the substrate. Further, the viscous fluid recognizing camera 104 is constructed in such a manner that the upper portion of the self-mask M includes the presence of the viscous layer which is present on the mask M and has become a block. The portion of the fluid L is photographed with a specific region where the portion of the viscous fluid L is not present. Thereby, in the configuration in which the viscous fluid L on the mask M such as solder is transferred to the substrate P via the printing pattern, the residual amount of the viscous fluid L such as solder can be accurately (quantitatively and reliably) measured.
再者,第2實施形態之其他效果與上述第1實施形態相同。 Further, other effects of the second embodiment are the same as those of the first embodiment.
[變化例] [variation]
再者,此次揭示之實施形態應認為於所有方面均為例示,而並非限制性內容。本發明之範圍並非藉由上述實施形態之說明而是藉由申請專利範圍所表示,進而包括與申請專利範圍均等之意思及範圍內之所有變更(變化例)。 Furthermore, the embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims and the scope of the invention, and all modifications (variations) within the meaning and scope of the claims.
例如,於上述第1及第2實施形態中,表示有使用各自之面積作為存在黏性流體之部分之大小及不存在黏性流體之部分之大小之例,但本發明並不限於此。於本發明中,亦可使用面積以外之大小作為存在黏性流體之部分之大小及不存在黏性流體之部分之大小。例如,亦可使用圖4所示之攝像圖像中與寬度方向(存在黏性流體L之部分延伸之方向)正交之方向之長度。 For example, in the above-described first and second embodiments, the respective areas are used as the size of the portion where the viscous fluid is present and the size of the portion where the viscous fluid is not present. However, the present invention is not limited thereto. In the present invention, the size other than the area may be used as the size of the portion where the viscous fluid is present and the portion where the viscous fluid is not present. For example, the length of the captured image shown in FIG. 4 in the direction orthogonal to the width direction (the direction in which the portion where the viscous fluid L exists) may be used.
又,於上述第1及第2實施形態中,表示有基於存在黏性流體之部分之大小及不存在黏性流體之部分之大小兩者,取得黏性流體之殘量之例,但本發明並不限於此。於本發明中,亦可基於存在黏性流體之部分之大小及不存在黏性流體之部分之大小中之至少一者,取得黏性流體之殘量。 Further, in the first and second embodiments, the residual amount of the viscous fluid is obtained based on the size of the portion where the viscous fluid is present and the size of the portion where the viscous fluid is not present, but the present invention is Not limited to this. In the present invention, the residual amount of the viscous fluid may be obtained based on at least one of the size of the portion where the viscous fluid is present and the size of the portion where the viscous fluid is not present.
又,於上述第1及第2實施形態中,表示有對特定區域之攝像圖像進行二值化處理,而取得存在黏性流體之部分之大小及不存在黏性流體之部分之大小之例,但本發明並不限於此。於本發明中,亦可不對特定區域之攝像圖像進行二值化處理,而取得存在黏性流體之部分之大小及不存在黏性流體之部分之大小。 Further, in the first and second embodiments, the image of the specific region is binarized, and the size of the portion where the viscous fluid exists and the size of the portion where the viscous fluid is not present are obtained. However, the invention is not limited thereto. In the present invention, the size of the portion where the viscous fluid exists and the portion where the viscous fluid does not exist may be obtained without performing binarization processing on the image of the specific region.
又,於上述第1實施形態中,表示有基於特定區域A中存在黏性 流體L(Lb)之部分之面積比例與貯留於黏性流體槽82之黏性流體L之殘量之間之相關資訊,取得貯留於黏性流體槽82之黏性流體L之殘量之例,但本發明並不限於此。於本發明中,亦可預先取得特定區域A中不存在黏性流體L(Lb)之部分之面積比例、特定區域A中存在黏性流體L(Lb)之部分之面積、及特定區域A中不存在黏性流體L(Lb)之部分之面積中之至少任一者與貯留於黏性流體槽82之黏性流體L之殘量之間之相關資訊,基於該相關資訊,取得貯留於黏性流體槽82之黏性流體L之殘量。 Further, in the first embodiment described above, it is indicated that there is viscosity in the specific region A. An example of the difference between the area ratio of the portion of the fluid L (Lb) and the residual amount of the viscous fluid L stored in the viscous fluid tank 82, and the residual amount of the viscous fluid L stored in the viscous fluid tank 82 is obtained. However, the invention is not limited thereto. In the present invention, the area ratio of the portion where the viscous fluid L (Lb) is not present in the specific region A, the area of the portion where the viscous fluid L (Lb) exists in the specific region A, and the specific region A may be obtained in advance. The correlation information between at least one of the areas of the portion of the viscous fluid L (Lb) and the residual amount of the viscous fluid L retained in the viscous fluid tank 82 is obtained based on the relevant information. The residual amount of the viscous fluid L of the fluid tank 82.
又,於上述第1實施形態中,表示有使用基板識別相機43作為本發明之攝像部之例,但本發明並不限於此。於本發明中,亦可將本發明之攝像部與基板識別相機43分開設置。 Further, in the above-described first embodiment, the substrate recognition camera 43 is used as an example of the imaging unit of the present invention, but the present invention is not limited thereto. In the present invention, the imaging unit of the present invention may be provided separately from the substrate recognition camera 43.
又,於上述第1實施形態中,表示有使用具有框形狀之黏性流體槽82作為本發明之刮刀部之例,但本發明並不限於此。於本發明中,亦可使用具有框形狀以外之形狀之刮刀部作為本發明之刮刀部。例如,亦可使用與上述第2實施形態之刮刀部121同樣地具有刮刀狀形狀之刮刀部。 Further, in the above-described first embodiment, the viscous fluid groove 82 having a frame shape is used as the blade portion of the present invention, but the present invention is not limited thereto. In the present invention, a doctor blade portion having a shape other than the frame shape may be used as the blade portion of the present invention. For example, a blade portion having a blade shape similar to the blade portion 121 of the second embodiment described above can be used.
又,於上述第1實施形態中,表示有藉由將黏性流體槽82固定並使塗膜形成板83移動,而黏性流體槽82相對於塗膜形成板83相對地移動而一面刮取黏性流體L一面將其抹平之例,但本發明並不限於此。於本發明中,亦可藉由將塗膜形成板83固定並使黏性流體槽82移動,而黏性流體槽82相對於塗膜形成板83相對地移動而一面刮取黏性流體L一面將其抹平。 Further, in the above-described first embodiment, the viscous fluid groove 82 is fixed and the coating film forming plate 83 is moved, and the viscous fluid groove 82 is relatively moved with respect to the coating film forming plate 83. The viscous fluid L is smeared on one side, but the present invention is not limited thereto. In the present invention, the viscous fluid groove 82 can be fixed by moving the viscous fluid groove 82 while the viscous fluid groove 82 is moved relative to the coating film forming plate 83. Smooth it.
又,於上述第1實施形態中,為了便於進行說明,使用按照處理流程依序進行處理之流程驅動型之流程對控制部之處理進行了說明,但亦可藉由例如以事件為單位執行處理之事件驅動型(事件從動型)之處理進行控制部之處理動作。於該情形時,既可以完全之事件驅動型 進行,亦可將事件驅動及流程驅動組合而進行。 Further, in the above-described first embodiment, the processing of the control unit has been described using a flow-driven flow that is sequentially processed in accordance with the processing flow for the sake of convenience of explanation. However, the processing may be performed by, for example, an event unit. The processing of the event-driven type (event-driven type) performs the processing operation of the control unit. In this case, it can be completely event-driven. This can also be done by combining event-driven and process-driven.
B1‧‧‧特定區域之攝像圖像 B1‧‧‧Video images of specific areas
B2‧‧‧二值化圖像 B2‧‧‧ binarized image
C1‧‧‧存在黏性流體之部分 C1‧‧‧There is a part of viscous fluid
C2‧‧‧不存在黏性流體之部分 C2‧‧‧There is no part of viscous fluid
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