CN107535055B - 基板作业装置及基板作业装置中的粘性流体剩余量测定方法 - Google Patents

基板作业装置及基板作业装置中的粘性流体剩余量测定方法 Download PDF

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Publication number
CN107535055B
CN107535055B CN201580080023.0A CN201580080023A CN107535055B CN 107535055 B CN107535055 B CN 107535055B CN 201580080023 A CN201580080023 A CN 201580080023A CN 107535055 B CN107535055 B CN 107535055B
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Chinese (zh)
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CN107535055A (zh
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川井太朗
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765—Method using an image detector and processing of image signal
    • G01N2021/177—Detector of the video camera type

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Operations Research (AREA)
  • Coating Apparatus (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201580080023.0A 2015-05-18 2015-05-18 基板作业装置及基板作业装置中的粘性流体剩余量测定方法 Active CN107535055B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/064226 WO2016185545A1 (ja) 2015-05-18 2015-05-18 基板作業装置および基板作業装置における粘性流体残量測定方法

Publications (2)

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CN107535055A CN107535055A (zh) 2018-01-02
CN107535055B true CN107535055B (zh) 2020-02-21

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CN201580080023.0A Active CN107535055B (zh) 2015-05-18 2015-05-18 基板作业装置及基板作业装置中的粘性流体剩余量测定方法

Country Status (5)

Country Link
JP (1) JP6385571B2 (ko)
KR (1) KR101986096B1 (ko)
CN (1) CN107535055B (ko)
TW (1) TWI595815B (ko)
WO (1) WO2016185545A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785363B2 (ja) * 2017-03-31 2020-11-18 株式会社Ｆｕｊｉ 電子部品装着機及び装着方法
KR102051499B1 (ko) * 2018-05-10 2019-12-03 한화정밀기계 주식회사 솔더 용기의 자동 공급 장치 및 방법
JP7352321B2 (ja) * 2021-07-20 2023-09-28 株式会社新川 フラックス転写装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019084A (ja) * 2000-07-12 2002-01-22 Matsushita Electric Ind Co Ltd クリームはんだの印刷状態検査方法及び検査装置
JP2007294777A (ja) * 2006-04-27 2007-11-08 Hitachi High-Tech Instruments Co Ltd フラックス転写装置
CN101117043A (zh) * 2006-08-04 2008-02-06 株式会社日立工业设备技术 丝网印刷装置及图像识别对位方法
JP2012000875A (ja) * 2010-06-17 2012-01-05 Sumitomo Metal Electronics Devices Inc スクリーン印刷装置
CN102529319A (zh) * 2010-11-17 2012-07-04 雅马哈发动机株式会社 附着材料涂敷装置
CN104136221A (zh) * 2012-02-21 2014-11-05 雅马哈发动机株式会社 网版印刷装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4014476B2 (ja) * 2002-09-13 2007-11-28 松下電器産業株式会社 部品実装装置及び部品実装方法
JP4726005B2 (ja) * 2006-06-28 2011-07-20 富士機械製造株式会社 フラックス転写装置
JP2008076215A (ja) * 2006-09-21 2008-04-03 I-Pulse Co Ltd 検査装置および検査方法
JP4643719B2 (ja) 2009-02-09 2011-03-02 ヤマハ発動機株式会社 はんだ供給装置、印刷装置および印刷方法
KR101703565B1 (ko) 2011-08-29 2017-02-07 한화테크윈 주식회사 플럭스 상태 감지 장치 및 그 방법
JP5786139B2 (ja) * 2011-09-27 2015-09-30 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装装置におけるペースト転写方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002019084A (ja) * 2000-07-12 2002-01-22 Matsushita Electric Ind Co Ltd クリームはんだの印刷状態検査方法及び検査装置
JP2007294777A (ja) * 2006-04-27 2007-11-08 Hitachi High-Tech Instruments Co Ltd フラックス転写装置
CN101117043A (zh) * 2006-08-04 2008-02-06 株式会社日立工业设备技术 丝网印刷装置及图像识别对位方法
JP2012000875A (ja) * 2010-06-17 2012-01-05 Sumitomo Metal Electronics Devices Inc スクリーン印刷装置
CN102529319A (zh) * 2010-11-17 2012-07-04 雅马哈发动机株式会社 附着材料涂敷装置
CN104136221A (zh) * 2012-02-21 2014-11-05 雅马哈发动机株式会社 网版印刷装置

Also Published As

Publication number Publication date
WO2016185545A1 (ja) 2016-11-24
JPWO2016185545A1 (ja) 2017-11-02
CN107535055A (zh) 2018-01-02
KR20170119327A (ko) 2017-10-26
JP6385571B2 (ja) 2018-09-12
TW201642716A (zh) 2016-12-01
TWI595815B (zh) 2017-08-11
KR101986096B1 (ko) 2019-06-05

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