TWI592761B - 導電圖案的形成方法及導電圖案基板 - Google Patents
導電圖案的形成方法及導電圖案基板 Download PDFInfo
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- TWI592761B TWI592761B TW102111902A TW102111902A TWI592761B TW I592761 B TWI592761 B TW I592761B TW 102111902 A TW102111902 A TW 102111902A TW 102111902 A TW102111902 A TW 102111902A TW I592761 B TWI592761 B TW I592761B
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- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/0009—Details relating to the conductive cores
- H01B7/0027—Liquid conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Insulated Conductors (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012085523 | 2012-04-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201351051A TW201351051A (zh) | 2013-12-16 |
| TWI592761B true TWI592761B (zh) | 2017-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102111902A TWI592761B (zh) | 2012-04-04 | 2013-04-02 | 導電圖案的形成方法及導電圖案基板 |
| TW106118013A TWI630536B (zh) | 2012-04-04 | 2013-04-02 | 靜電電容式觸控面板 |
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| TW106118013A TWI630536B (zh) | 2012-04-04 | 2013-04-02 | 靜電電容式觸控面板 |
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| JP (3) | JP5940648B2 (ja) |
| KR (2) | KR101751588B1 (ja) |
| CN (1) | CN104170029B (ja) |
| TW (2) | TWI592761B (ja) |
| WO (1) | WO2013151052A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPWO2016013587A1 (ja) * | 2014-07-24 | 2017-05-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性フィルム、パターン基板、感光性導電フィルム及び導電パターン基板 |
| JP2016133937A (ja) * | 2015-01-16 | 2016-07-25 | アルプス電気株式会社 | 静電容量式センサの製造方法、静電容量式センサ、感光型導電性シート、タッチパネル及び電子機器 |
| JP6042486B1 (ja) * | 2015-05-29 | 2016-12-14 | 日本写真印刷株式会社 | タッチセンサの製造方法及びタッチセンサ |
| JP2017059171A (ja) * | 2015-09-18 | 2017-03-23 | 日立化成株式会社 | 静電容量方式タッチパネル |
| JP2017207906A (ja) * | 2016-05-18 | 2017-11-24 | 日立化成株式会社 | 静電容量方式タッチパネル及びその製造方法 |
| CN107093494B (zh) * | 2017-03-22 | 2021-07-13 | 中山大学 | 一种可转移图案化的导电薄膜及其制备与图案化的方法 |
| JP6871385B2 (ja) * | 2017-07-28 | 2021-05-12 | 富士フイルム株式会社 | パターン形成方法、積層体、及び、タッチパネル製造方法 |
| US11343918B2 (en) * | 2017-12-20 | 2022-05-24 | Sumitomo Electric Industries, Ltd. | Method of making printed circuit board and laminated structure |
| WO2020194948A1 (ja) * | 2019-03-28 | 2020-10-01 | 富士フイルム株式会社 | 導電性転写材料、導電パターンの製造方法、積層体、タッチパネル、及び液晶表示装置 |
| WO2022071422A1 (ja) * | 2020-09-30 | 2022-04-07 | 大日本印刷株式会社 | センサー、物品、センサーの製造方法、および導電体 |
| CN113921622B (zh) * | 2021-09-30 | 2024-04-05 | 中国科学院苏州纳米技术与纳米仿生研究所 | 电池片基板、光伏电池、光伏电池组件及其组装方法 |
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| JPH0439816A (ja) * | 1990-06-05 | 1992-02-10 | Bridgestone Corp | 導電部材 |
| JPH06162820A (ja) * | 1992-11-25 | 1994-06-10 | Kao Corp | 導電性ペーストおよび導電性塗膜 |
| JP4035888B2 (ja) * | 1998-04-21 | 2008-01-23 | Ｊｓｒ株式会社 | 電極の製造方法および転写フィルム |
| JP2001203436A (ja) * | 2000-01-18 | 2001-07-27 | Nippon Synthetic Chem Ind Co Ltd:The | 電極形成用シートとその製造法および基板上への電極の形成方法 |
| JP2003086910A (ja) * | 2001-09-12 | 2003-03-20 | Mesh Kk | 導電感光性フィルム、及び導電感光性フィルムを利用する導体パターン形成方法 |
| SG183720A1 (en) * | 2005-08-12 | 2012-09-27 | Cambrios Technologies Corp | Nanowires-based transparent conductors |
| US20080152870A1 (en) * | 2006-12-22 | 2008-06-26 | Katsunori Takada | Transparent electrically-conductive hard-coated substrate and method for producing the same |
| TWI456468B (zh) * | 2007-04-27 | 2014-10-11 | Tpk Touch Solutions Inc | 電容式觸控板之觸控圖型製作方法及其結構 |
| KR101855056B1 (ko) * | 2008-08-22 | 2018-05-04 | 히타치가세이가부시끼가이샤 | 감광성 도전 필름, 도전막의 형성 방법, 도전 패턴의 형성 방법 및 도전막 기판 |
| WO2010027061A1 (ja) * | 2008-09-04 | 2010-03-11 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法並びに導体パターン、プリント配線板、リードフレーム、基材及び半導体パッケージの製造方法 |
| JP5387894B2 (ja) * | 2009-04-17 | 2014-01-15 | 日立化成株式会社 | 導電性転写フィルム及びそれを用いた導電性パターンの形成方法 |
| JP5515789B2 (ja) * | 2010-01-28 | 2014-06-11 | コニカミノルタ株式会社 | 透明パターン電極、該電極の製造方法、該電極を用いた有機電子デバイスおよびその製造方法 |
| TWI471790B (zh) * | 2010-02-03 | 2015-02-01 | Wintek Corp | 電容式觸控感應器及其製造方法及電容式觸控面板 |
| JP5569144B2 (ja) * | 2010-02-24 | 2014-08-13 | 日立化成株式会社 | 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法 |
| KR101140878B1 (ko) * | 2010-04-23 | 2012-05-03 | 삼성전기주식회사 | 단층 정전용량식 터치스크린의 제조방법 |
| JP2012033466A (ja) * | 2010-07-02 | 2012-02-16 | Fujifilm Corp | 導電層転写材料、及びタッチパネル |
| CN103080876A (zh) * | 2010-07-05 | 2013-05-01 | Dic株式会社 | 带透明导电层的基体及其制造方法、以及触控面板用透明导电膜层叠体、触控面板 |
| JP2012022844A (ja) * | 2010-07-13 | 2012-02-02 | Fujifilm Corp | 導電膜形成用積層体及びその製造方法、並びにパターン形成方法、タッチパネル及び集積型太陽電池 |
| JP2012169072A (ja) * | 2011-02-10 | 2012-09-06 | Fujifilm Corp | 導電膜形成用積層体、導電膜形成方法、導電膜、導電要素、タッチパネル及び集積型太陽電池 |
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2013
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- 2013-04-02 CN CN201380014556.XA patent/CN104170029B/zh not_active Expired - Fee Related
- 2013-04-02 TW TW102111902A patent/TWI592761B/zh not_active IP Right Cessation
- 2013-04-02 JP JP2014509171A patent/JP5940648B2/ja not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6176295B2 (ja) | 2017-08-09 |
| TW201351051A (zh) | 2013-12-16 |
| CN104170029B (zh) | 2018-02-16 |
| JPWO2013151052A1 (ja) | 2015-12-17 |
| CN104170029A (zh) | 2014-11-26 |
| KR20170072956A (ko) | 2017-06-27 |
| JP2016006901A (ja) | 2016-01-14 |
| KR20140111024A (ko) | 2014-09-17 |
| JP2017224309A (ja) | 2017-12-21 |
| KR101751588B1 (ko) | 2017-06-27 |
| WO2013151052A1 (ja) | 2013-10-10 |
| JP5940648B2 (ja) | 2016-06-29 |
| TW201734742A (zh) | 2017-10-01 |
| TWI630536B (zh) | 2018-07-21 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |