TWI590947B - 複合絕緣膜 - Google Patents
複合絕緣膜 Download PDFInfo
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- TWI590947B TWI590947B TW101116886A TW101116886A TWI590947B TW I590947 B TWI590947 B TW I590947B TW 101116886 A TW101116886 A TW 101116886A TW 101116886 A TW101116886 A TW 101116886A TW I590947 B TWI590947 B TW I590947B
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Description
此申請案基於35 U.S.C.§119(e)、主張2011年5月12日提申之美國臨時申請案專利第61/485,180號之利益,其藉此以其之整體內容併入以作為參考資料。
揭示的是一種供使用於電氣絕緣應用之複合絕緣膜。該等複合絕緣膜包括已經塗覆至一基底聚合物層之部份固化的聚(醯胺)醯亞胺層。
以聚(醯胺)醯亞胺為主之樹脂的塗覆組成物會形成可撓且持久性的膜以及作為包線漆、清漆、積層板的黏著劑、塗料和類似物為特別有用的。此等聚(醯胺)醯亞胺基底塗覆組成物在其等之220℃等級的長期高溫能力為特別有名的,除了其等之其他的品質外,其使得其等於電氣絕緣應用,例如在電磁線漆方面,為特別有用的。此係與不具有此高持續性耐熱性之慣常的聚酯和聚酯醯亞胺基底塗覆組成物比較。
聚(醯胺)醯亞胺一般而言係使用相當昂貴的有機溶劑來製備,已經抑制了醯胺醯亞胺塗料之經濟上的用途。因而,已經習慣使用此等聚(醯胺)醯亞胺組成物作為較不昂貴的聚酯或聚酯醯亞胺基底塗層上之保護膜。
考慮到其等之機械性質和電的性質,以及相當低的生產成本,廣泛地使用聚對酞酸乙二酯(PET)膜作為電氣絕緣膜。然而,PET膜擁有低的熱阻以及因而被分等級為B等級絕緣或更低的絕緣。聚醯胺膜,例如屬於商標NOMEX商業上可得自於Du Pont的該等,展現出與PET膜比較之下優越的熱阻,但是已經報導有介電質破壞的問題。
聚(醯胺)醯亞胺膜展示出機械性質、熱性質、耐磨性,以及抗化學性,此等性質使聚(醯胺)醯亞胺膜合適作為電氣絕緣的材料。雖然聚(醯胺)醯亞胺膜與聚醯胺膜和聚酯膜比較下展示出一些優越的物理性質,但是成本和自由立膜(free standing film)性質考量已經妨礙聚(醯胺)醯亞胺膜在電氣絕緣應用上之商業化。
本技藝中因而需要一種有成本效益的電氣絕緣的材料,其展示出機械性質、熱性質、耐磨性,以及抗化學性之合適的組合。
本概要節打算要提供本揭示的概要俾以提供讀者對複合絕緣膜以及製備方法和用途基本的了解。此概要節不打算廣泛的綜述本揭示的複合膜以及製備方法和用途以及其不會確認該複合膜或方法之關鍵的/緊要的元件也不會描述本揭示的範疇。本概要節唯一的目的是要以簡化的形式呈現本文所揭示的一些概念作為以下呈現的更詳細說明之介紹。
提供一種可撓且自撐式複合膜,其包含基底聚合物膜層;以及部份固化的聚(醯胺)醯亞胺膜層。
亦提供一種製備一可撓且自撐式複合膜的方法,其包含提供基底聚合物膜層,鑄造聚(醯胺)醯亞胺膜層於該基底聚合物膜層之上,以及部份固化該聚(醯胺)醯亞胺膜層。
此外提供一種提供電動馬達或變壓器絕緣的方法,其包含提供一種可撓且自撐式之複合膜,該複合膜包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層,以及將該複合膜插入至電動馬達溝槽或變壓器之內。
進一步提供一種電動馬達或變壓器,其包含待絕緣的組件和鄰接該組件之可撓且自撐式複合膜,該複合膜包含基底聚合物膜層和該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層。
進一步提供一種提供電動馬達絕緣的方法,其包含提供一電動馬達溝槽的組件,其內具有溝槽,以及將一種可撓且自撐式複合膜插入至該溝槽之內,該複合膜包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層。
第1圖為描繪一種未固化的澆鑄高分子量聚(醯胺)醯亞胺膜之熱機械分析(TMA)的圖;第2圖為描繪一種完全固化的澆鑄高分子量聚(醯胺)醯亞胺膜之熱機械分析(TMA)的圖;
第3圖為描繪有關未固化的高分子量聚(醯胺)醯亞胺膜之調變的微差掃描熱量法分析(mDSC)的圖;第4圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯示出有關高分子量之聚(醯胺)醯亞胺膜的第1次加熱循環之可逆和不可逆熱流組份;第5圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯示出表示固化的高分子量之聚(醯胺)醯亞胺膜的第2次加熱循環之可逆熱流組份;第6圖為描繪下述的圖為描繪下述的圖(is a graph depicting a is a graph depicting):一種未固化的澆鑄低分子量之聚(醯胺)醯亞胺膜之熱機械分析(TMA);第7圖為描繪一種完全固化的澆鑄低分子量之聚(醯胺)醯亞胺膜的熱機械分析(TMA)之圖;第8圖為描繪調變的微差掃描熱量法分析(mDSC)的圖,其顯示出有關一種低分子量之聚(醯胺)醯亞胺膜的第1次加熱循環之可逆和不可逆熱流組份;第9圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯示出表示固化的低分子量之聚(醯胺)醯亞胺膜的第2次加熱循環之可逆熱流組份。
揭示的是一種可撓且自撐式之複合絕緣膜。該複合絕緣膜包括基底聚合物膜層和鄰接接觸該基底聚合物膜層的表面之部份固化的聚(醯胺)醯亞胺膜層。依據某些複合絕緣
膜之作例證的具體例,該部份固化的聚(醯胺)醯亞胺膜層係鑄造於該基底聚合物膜層的表面上。
非限制性地,以及僅僅作為闡示,該複合絕緣膜的該基底聚合物膜層可以選自於聚醯胺膜,聚醯亞胺膜,聚酯膜,例如聚對酞酸酯(PET)或聚環烷酸酯(polyesternaphthenate)(PEN),聚醚碸膜,聚碸膜,或是聚醚醯亞胺膜。依據某些作例證的具體例,該複合絕緣膜的該基底聚合物膜層包含聚酯膜。依據此具體例,該複合絕緣膜包含聚酯的基底聚合物膜層,其具有聚(醯胺)醯亞胺膜層,其係予以塗覆至該基底聚酯膜層的至少一部分之上或者不然為沉積至該基底聚酯膜層的至少一部分之上。
包含聚酯的基底聚合物膜層且有聚(醯胺)醯亞胺膜層塗覆於其上之複合絕緣膜可以具有由大約2 mils至大約20 mils的厚度。依據某些作例證的具體例,該複合絕緣膜可以具有由大約2.5 mils至大約16 mils的總厚度。該複合絕緣膜之部份固化的聚(醯胺)醯亞胺層可以具有由大約0.1至大約5 mils的厚度。依據某些作例證的具體例,該複合絕緣膜之聚(醯胺)醯亞胺層可以具有由大約0.5至大約2 mils的厚度。該聚(醯胺)醯亞胺層可以予以塗覆至該聚酯層之相反的接觸表面(opposite facing surfaces)的一者或二者。該複合膜之薄的本質展示出可撓性,要插入至電動馬達溝槽之內之充分的結構完整性,以及展示出高至大約220℃之熱指數。
該可撓且自撐式之複合絕緣膜可以藉由一種方法予以製備,該方法包括提供一種基底聚合物膜層以及塗覆一聚
(醯胺)醯亞胺層至該基底聚合物膜層的表面上。該複合膜可以藉由先提供該基底聚合物膜層以及鑄造聚(醯胺)醯亞胺膜層至該基底聚合物膜層的表面上來製備。依據某些作例證的具體例,該聚(醯胺)醯亞胺膜層係鑄造至該基底聚合物膜層的一主要表面上。然而,依據其他作例證的具體例,該聚(醯胺)醯亞胺層可以鑄造至該基底聚合物層之相反的接觸主表面的二者之上。該聚(醯胺)醯亞胺層(layer)或層(layers)接而予以部份固化。此提供了一種可撓且自撐式之複合膜,其具有一種結構完整性使該膜合適插入至電動馬達之內的溝槽內。
用於製備該複合絕緣膜之方法包括提供一種基底聚合物膜層,其係選自於聚醯胺膜、聚醯亞胺膜、聚酯膜、聚醚碸膜,聚碸膜,或聚醚醯亞胺膜。該方法包括選擇或者製備一聚酯膜的基底聚合物膜層,其具有由大約2 mils至大約14 mils的厚度。一聚(醯胺)醯亞胺膜層係予以塗覆至該基底聚酯膜層的一表面。舉例來說,該聚(醯胺)醯亞胺膜層係鑄造至該基底聚酯膜層的表面之上。該聚(醯胺)醯亞胺也許鑄造於該基底聚酯層之上以達到由大約0.5 mil至大約2 mil的厚度。該聚(醯胺)醯亞胺層可以鑄造至該聚酯基底層之相反的接觸表面之一者或二者之上。
一旦該聚(醯胺)醯亞胺膜層係鑄造至該基底聚酯層的表面上,該聚(醯胺)醯亞胺層接而予以部份固化以獲得一種可撓且自撐式之複合絕緣膜。該聚(醯胺)醯亞胺膜層可以藉由於大約100℃至大約260℃的溫度下加熱該層歷時大約20
秒至大約60分鐘而予以部份固化。任擇地,該聚(醯胺)醯亞胺膜層可以藉由於大約150℃至大約180℃的溫度下加熱該層歷時大約1分鐘至大約10分鐘而予以部份固化。
對於作為可以使用來製備複合絕緣膜之基本樹脂的聚(醯胺)醯亞胺沒有限制。可以使用一種,舉例而言,藉由三甲酸酐和二異氰酸酯於極性溶劑內之直接反應所獲得的或者藉由三甲酸酐和二胺類於極性溶劑內反應所獲得的聚醯胺醯亞胺,來引進醯亞胺鍵以及接而以通常的方式以二異氰酸酯進行醯胺化作用。一種進一步作例證的方法為氯化三甲酸酐和二胺類於極性溶劑內之反應。
關於可以使用於製備膜形成層之此基本的樹脂之三甲酸酐,一般而言使用苯偏三酸酐(trimellitic acid anhydride)。各種的甲酸酐係使用於製造聚(醯胺)醯亞胺。此等包括,但不限於:苯偏三酸酐(trimellitic anhydride)(TMA);2,6,7-萘三甲酸酐;3,3',4-二苯基三甲酸酐;3,3',4-二苯甲酮三甲酸酐;1,3,4-環戊烷四甲酸酐;2,2',3-二苯基三甲酸酐;二苯碸3,3',4-三甲酸酐;二苯基亞異丙基3,3',4-三甲酸酐;3,4,10-苝三甲酸酐;3,4-二甲酸苯基3-羧苯醚酐;乙三甲酸酐(ethylene tricarboxylic an hydride);1,2,5-萘三甲酸酐。
一部分量的三甲酸酐可以以四甲酸酐代替,當其反應時。關於此情況中的四甲酸酐,可以使用,舉例而言,焦蜜石酸二酐(pyromellitic acid dianhydride)、3,3',4,4'-二苯甲酮四甲酸二酐,或類似物。再者,一部分量的三甲酸酐可
以以另一種酸或者酸酐代替,舉例而言,苯偏三酸、異酞酸、已二酸、順丁烯二酸,或者對酞酸。
可以與三甲酸酐反應之二異氰酸酯的非限制性實例,包括芳香族二異氰酸酯,例如4,4-二苯基甲烷二異氰酸酯與和甲苯二異氰酸酯(tolylene diisocyanate),以及二胺的實例包括芳香族二胺,例如間苯二胺、4,4'-二胺基二苯基醚、1,2-乙二胺、4,4'-二胺基二苯基甲烷、4,4'-二胺基二苯碸(diphenylsulfon)和4,4'-二胺基二苯甲酮。
依據某些具體例,該聚(醯胺)醯亞胺樹脂可以組合以一種或更多種其他相容的樹脂使用來製備該複合絕緣膜。舉例而言,且不限於,該聚(醯胺)醯亞胺樹脂可以組合以一種或更多種以下相容的樹脂使用來製備該複合絕緣膜:聚醯亞胺、聚醚醯亞胺、聚碸、聚醚碸、聚乙烯醇、聚乙烯丁醛、聚醚酮、苯氧樹脂,以及其等之組合。
額外的相容樹脂可以組合以聚(醯胺)醯亞胺樹脂使用來改善複合絕緣膜之各種不同的性能性質。舉例而言,一種或更多種額外的樹脂可以組合以聚(醯胺)醯亞胺樹脂使用來改善產生的複合絕緣膜之附著力、耐熱性,及/或可撓性。依據某些作例證的具體例,聚(醯胺)醯亞胺膜可以組合以聚醚碸使用來改善產生的複合絕緣膜對鋁的附著力。舉例而言,且不限於,聚醚碸也許以大約1重量百分比至大約99重量百分比的量與聚(醯胺)醯亞胺摻合。
本揭示亦包括一種提供電動馬達或變壓器絕緣的方法。提供電動馬達或變壓器絕緣的方法包括提供一種可撓
且自撐式之複合膜,其包含基底聚合物膜層和部份固化的聚(醯胺)醯亞胺膜層至該基底膜層上以及將該複合膜插入至電動馬達溝槽或變壓器之內。
下面的非限制性胺不論為單獨的或者以混合物均可以為有用的:對二甲苯二胺、雙(4-胺基-環己基)甲烷、六亞甲基二胺、七亞甲基二胺、伸辛基二胺、伸壬基二胺、亞甲基二胺、癸二胺(decamethylene diamine)、3-甲基-七亞甲基二胺、4,4'-二甲基七亞甲基二胺、2,11-二胺基-十二烷、1,2-雙-(3-胺基-丙氧基)乙烷、2,2-二甲基丙二胺、3-甲氧基-六亞甲基二胺、2,5-二甲基六亞甲基二胺、2,5-二甲基七亞甲基二胺、5-甲基伸壬基二胺、1,4-二胺基-環-己烷、1,12-二胺基-十八烷、2,5-二胺基-1,3,4-二唑、H2N(CH2)3O(CH2)2O(CH2)3NH2、H2N(CH2)S(CH2)3NH2、H2N(CH2)3N(CH3)(CH2)3NH2間苯二胺、對苯二胺、4,4'-二胺基-二苯基丙烷、4,4'-二胺基-二苯基甲烷聯苯胺、4,4'-二胺基-二苯基硫化物、4,4'-二胺基-二苯碸、3,3'-二胺基-二苯碸、4,4'-二胺基-二苯基醚、2,6-二胺基-吡啶、雙(4-胺基-苯基)二乙基矽烷、雙(4-胺基-苯基)二苯基矽烷、氧化[雙(4-胺基-苯基)膦、4,4'-二胺基二苯甲酮、雙(4-胺基-苯基)-N-甲基胺、雙(4-胺基丁基)四甲基二矽氧、1,5-二胺基萘、3,3'-二甲基-4,4'-二胺基-聯苯、3,3'-二甲氧基聯苯胺、2,4-雙(β-胺基-第三丁基)甲苯甲苯二胺、雙(對-β-胺基-第三丁基-苯基)醚、對-雙(2-甲基-4-胺基-戊基)苯、對-雙(11,1-二甲基-5-胺基-戊基)苯、間二甲苯二胺,以及聚甲烯聚苯胺
(polymethylene polyaniline)。
任何的聚異氰酸酯,那就是任何具有兩個或更多個不管是阻隔的或者未阻隔的異氰酸酯基團之異氰酸酯,可以使用於製造聚醯胺醯亞胺。單獨或者以摻和物均為有用之聚異氰酸酯包括:四亞甲基二異氰酸酯、六亞甲基二異氰酸酯、1,4-苯二異氰酸酯、1,3-苯二異氰酸酯、1,4-伸環己基二異氰酸酯、2,4-甲苯二異氰酸酯、2,5-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、3,5-甲苯二異氰酸酯4-氯-1,3-苯二異氰酸酯、1-甲氧基-2,4-苯二異氰酸酯、1-甲基-3,5-二乙基-2,6-苯二異氰酸酯、1,3,5-三乙基-2,4-苯二異氰酸酯、1-甲基-3,5-二乙基-2,4-苯二異氰酸酯、1-甲基-3,5-二乙基-6-氯-2,4-苯二異氰酸酯、6-甲基-2,4-二乙基-5-硝基-1,3-苯二異氰酸酯、對二甲苯二異氰酸酯、間二甲苯二異氰酸酯、4,6-二甲基-1,3-二甲苯二異氰酸酯、1,3-二甲基-4,6-雙-(b-異氰酸乙基)-苯、3-(a-異氰酸乙基)-苯基異氰酸酯、1-甲基-2,4-伸環己基二異氰酸酯、4,4'-聯苯二異氰酸酯、3,3'-二甲基-4,4'-聯苯二異氰酸酯、3,3'-二甲氧基-4,4'-聯苯二異氰酸酯、3,3'-二乙氧基-4,4-聯苯二異氰酸酯、1,1-雙-(4-異氰酸苯基)環己烷,4,4'-二異氰酸-二苯基醚、4,4'-二異氰酸-二環己基甲烷、4,4-二異氰酸-二苯基甲烷、4,4'-二異氰酸-3,3'-二甲基二苯基甲烷、4,4'-二異氰酸-3,3'-二氯二苯基甲烷、4,4'-二異氰酸-二苯基二甲基甲烷、1,5-伸萘基二異氰酸酯、1,4-伸萘基二異氰酸酯、4,4',4"-三異氰酸-三苯甲烷、2,4,4'-三異氰酸-二苯基醚、2,4,6-三異氰酸-1-甲基-3,5-二乙
基苯、聯鄰甲苯胺-4,4'-二異氰酸酯、聯間甲苯胺-4,4'-二異氰酸酯、二苯甲酮-4,4'-二異氰酸酯、雙脲三異氰酸酯,以及聚苯聚亞甲基聚異氰酸酯(polymethylenepolyphenylene isocyanate)。
進一步揭示的為一種電動馬達或變壓器,其包含一種待絕緣的組件;以及一種位於鄰接待絕緣的該組件之可撓且自撐式之複合膜,該複合膜包含基底聚合物膜層和該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層。該複合絕緣膜可以使用於帶有溝槽襯裡之典型的三相定子之內。該定子係位於外罩內以及於中央具有轉子。該定子上之金屬材料包含核心。適當成形的溝槽襯裡(例如,舉例而言,形狀像C)係插入於該溝槽之內。銅線圈接而用複合絕緣膜襯裡作為核心和銅繞組之間的絕緣障壁而插入於溝槽之內。第二片的材料係以溝槽襯裡的反向(也是C形)予以插入,其於本技藝中稱為“楔形”,來維持銅於溝槽之內以便其不會四處移動。
已經測試複合電氣絕緣膜之製造性質。材料於成狹縫的、小巧的模(die cute)、成片狀的以及其他加工的能力方面展示出優越的性能。小部件的刮刀(Drag knife)切割亦能夠伴隨爭議(issue)來進行。材料之雷射切割亦在沒有典型與NOMEX為主的材料有關聯之爭議或者炭化(char)的狀況下執行。亦檢查以自動化的方法形成楔形,且該複合膜於自動化線路內在圍管(cuffing)和插入方面係非常良好地執行而沒有擦刻或者剝層。於馬達溝槽內之線料插入(Wire
inserion)與其他已知的材料比較下展示出最小的阻力。
進一步揭示的為一種提供電動馬達絕緣的方法,其包含提供一電動馬達溝槽組件,其內具有溝槽。一種可撓且自撐式之複合膜,其包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層,係插入至該溝槽之內。
提出下面的實施例來進一步詳細地說明以及來闡明複合絕緣膜和方法。下面的實施例在任何方式下不應該理解為限制複合絕緣膜或製備方法。
於攪拌下(氮流量0.5 L/min)添加916.7 g的N-甲基-2-吡咯啶酮(NMP)於配備有熱電偶、水冷凝器、氮入口及氣動翼式攪拌器的3L燒瓶中。於攪拌下添加苯偏三酸酐(107.2g,0.558莫耳)和二苯基甲烷-4,4二異氰酸酯(153.5 g,0.614莫耳)。反應混合物加熱至93℃且維持於該溫度歷時大約1小時,以及接而加熱至120℃且維持歷時大約1小時。反應混合物接而加熱至138-150℃以及黏度係藉由G-H管予以監控(由燒瓶吸取15 g的樣本以及以NMP稀釋至20 g用於黏度測量)。當黏度達到Z時,停止加熱以及添加300 g的NMP。在冷卻於100℃的時候,添加4.4 g的正丁醇和90.7 g NMP。反應產品的分析顯示15.9%的固體(於200℃ 2小時後)以及於25℃為2751 cps的黏度。
於攪拌下(氮流量0.5 L/min)添加916.7 g的N-甲基-2-吡咯啶酮(NMP)於配備有熱電偶、水冷凝器、氮入口及氣動翼式攪拌器的3L燒瓶中。於攪拌下添加苯偏三酸酐(107.2g,0.558莫耳)和二苯基甲烷-4,4二異氰酸酯(153.5 g,0.614莫耳)。反應混合物加熱至93℃且維持歷時1小時,以及接而加熱至120℃且維持歷時1小時。反應混合物接而加熱至138-150℃以及黏度係藉由G-H管予以監控(由燒瓶吸取15 g的樣本以及以NMP稀釋至20 g用於黏度測量)。當黏度達到S時,停止加熱以及添加300 g的NMP。在冷卻於100℃的時候,添加4.4 g的正丁醇和90.7 g NMP。反應產品的分析顯示15.4%的固體(於200℃ 2小時後)以及於25℃為506 cps的黏度。
於攪拌下(氮流量0.5 L/min)添加500.1 g的N-甲基-2-吡咯啶酮(NMP)於配備有熱電偶、水冷凝器、氮入口及氣動翼式攪拌器的3L燒瓶中。於攪拌下添加苯偏三酸酐(124.2g,0.646莫耳)和二苯基甲烷-4,4二異氰酸酯(161.6g,0.646莫耳)。反應混合物加熱至93℃且維持歷時1小時,以及接而加熱至120℃且維持歷時1小時。黏度係藉由G-H管予以監控(由燒瓶吸取45 g的樣本以及以NMP稀釋至66 g用於黏度測量)。當黏度達到Z時,停止加熱以及添加125 g的NMP。在冷卻於100℃的時候,添加2.3 g的甲醇以及165 g NMP。反應產品的分析顯示25.4%的固體(於200℃ 2小時後)以及於25℃為2402 cps的黏度。
樹脂溶液係鑄造至一玻璃撐體之上以及在150℃予以部份固化歷時60分鐘接著在260℃完全固化歷時20分鐘。該經固化之低的、中間的,和高分子量之聚(醯胺)醯亞胺膜的性質係在以下的表1A和1B內提出。
表1A中報導之固化的膜之抗拉強度與抗拉模數性質係依據-ASTM D-882-91方法A所獲得的。
埃羅門多撕裂強度係依據ASTM D-1922-89所獲得的。
葛瑞夫茲撕裂強度係依據ASTM-D-1004-90所獲得的。
聚(醯胺)醯亞胺樹脂溶液係使用溝槽塗覆的方法來鑄造至一種基底PET聚酯膜的前側和後側之上(100微米)。複合膜接而於175℃的烘箱內乾燥歷時大約2分鐘以移除所有的溶劑留下12.5微米之部份固化的PAI層於PET的前側和後側二者之上。包含一層聚酯膜以及包括未固化的聚(醯胺)
醯亞胺層之複合絕緣膜的機械性質(伸長、抗拉模數、抗拉強度)以及撕裂強度係在以下的表2A和2B內提出。
聚(醯胺)醯亞胺層可以從PET基底移除以及藉由調變的微差掃描熱量法(第3圖)來檢查固化的狀態。於50-200℃之間見到寬闊的放熱,其為不可逆熱流事件(第4圖)。此暗示著固化的事件可能於此等狀況下發生。第2次加熱顯示出大約270℃之玻璃轉化,其顯示出完全固化膜的性質(第5圖)。
部份固化的膜亦藉由熱機械分析(TMA)予以確認。部份固化的聚(醯胺)醯亞胺膜之TMA顯示出在115-127℃之可能的玻璃轉化(第1圖)。一種完全固化膜(260℃歷時30分鐘)顯示出藉由此方法之在大約250-270℃之玻璃轉化(第2圖)。第6-9圖描繪鑄造於PET基底聚合物之上的低Mw PAI膜之相同的熱分析。
表2A中報導的撕裂強度性質係依據ASTM D624所獲得的。
抗拉強度和抗拉模數之抗拉性質係依據ASTM D638所獲得的。
包含一層PET膜以及包括部份固化的聚(醯胺)醯亞胺層之複合絕緣膜的體積電阻率係在以下的表3中提出。
體積電阻率值係依據ASTM D257所獲得的。
包含一層聚酯膜以及包括部份固化的聚(醯胺)醯亞胺層的複合絕緣膜之介電質破壞係在以下的表4中提出。
介電質破壞值係依據ASTM D-115所獲得的。
包含一層聚酯膜以及包括未固化的聚(醯胺)醯亞胺層的複合絕緣(insulting)膜接受抗化學性測試。抗化學性測試的結果係在以下的表5中提出。材料浸入溶劑/溶液的各者
內下方歷時一天。接而觀測材料之物理變化。
雖然複合絕緣膜以及製備方法和用途已經關於各種作例證的具體例來說明,但要了解到其他相似的具體例可以使用或是可以對所說明的具體例做出修飾和添加用於執行本文揭示之相同的功能而不背離本文。以上所說明的具體例於替代方案中不是必須的,因各種具體例可以組合以提供所欲的特徵。因而,複合絕緣膜和方法應該不限於任何單一的具體例,而是依據列舉之附隨的申請專利範圍之廣度和範疇來解釋。
第1圖為描繪一種未固化的澆鑄高分子量聚(醯胺)醯亞胺膜之熱機械分析(TMA)的圖;第2圖為描繪一種完全固化的澆鑄高分子量聚(醯胺)醯亞胺膜之熱機械分析(TMA)的圖;第3圖為描繪有關未固化的高分子量聚(醯胺)醯亞胺膜之調變的微差掃描熱量法分析(mDSC)的圖;第4圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯
示出有關高分子量之聚(醯胺)醯亞胺膜的第1次加熱循環之可逆和不可逆熱流組份;第5圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯示出表示固化的高分子量之聚(醯胺)醯亞胺膜的第2次加熱循環之可逆熱流組份;第6圖為描繪下述的圖為描繪下述的圖:一種未固化的澆鑄低分子量之聚(醯胺)醯亞胺膜之熱機械分析(TMA);第7圖為描繪一種完全固化的澆鑄低分子量之聚(醯胺)醯亞胺膜的熱機械分析(TMA)之圖;第8圖為描繪調變的微差掃描熱量法分析(mDSC)的圖,其顯示出有關一種低分子量之聚(醯胺)醯亞胺膜的第1次加熱循環之可逆和不可逆熱流組份;第9圖為描繪微差掃描熱量法分析(mDSC)的圖,其顯示出表示固化的低分子量之聚(醯胺)醯亞胺膜的第2次加熱循環之可逆熱流組份。
Claims (22)
- 一種可撓且自撐式之複合絕緣膜,其包含:基底聚合物膜層;以及部份固化的聚(醯胺)醯亞胺膜層。
- 如申請專利範圍第1項之複合絕緣膜,其中該部份固化的聚(醯胺)醯亞胺膜層係鑄造於該基底聚合物膜層的一主要表面上。
- 如申請專利範圍第1項之複合絕緣膜,其中該部份固化的聚(醯胺)醯亞胺膜層係鑄造至該基底聚合物膜層之相反的接觸主表面(opposite facing major surfaces)兩者之上。
- 如申請專利範圍第2項之複合絕緣膜,其中該基底聚合物膜層係選自於聚醯胺膜、聚醯亞胺膜、聚酯膜、聚醚碸膜、聚碸膜,或聚醚醯亞胺膜。
- 如申請專利範圍第4項之複合絕緣膜,其中該基底聚合物膜層包含一聚酯膜。
- 如申請專利範圍第5項之複合絕緣膜,其中該聚酯膜層係選自於由聚對酞酸乙二酯、聚萘二甲酸乙二酯(polyethylene naphthalate),以及聚對酞酸丁二酯所構成的群組。
- 如申請專利範圍第6項之複合絕緣膜,其中該聚酯膜層包含聚對酞酸乙二酯。
- 如申請專利範圍第7項之複合絕緣膜,其中該複合膜的厚度係由大約2.5 mils至大約16 mils。
- 如申請專利範圍第8項之複合絕緣膜,其中該部份固化的聚(醯胺)醯亞胺膜層之厚度係大約0.5-2 mil。
- 如申請專利範圍第9項之複合絕緣膜,其中該膜展現出高至大約220℃的熱指數。
- 一種製備可撓且自撐式之複合膜的方法,其包含:提供基底聚合物膜層;鑄造聚(醯胺)醯亞胺膜層至該基底聚合物膜層之至少一個主要相反的接觸表面(opposite facing surfaces)之上;以及部份固化該聚(醯胺)醯亞胺膜層。
- 如申請專利範圍第11項之方法,其中該部份固化的聚(醯胺)醯亞胺膜層係鑄造至該基底聚合物膜層之相反的接觸主表面兩者之上。
- 如申請專利範圍第11項之方法,其中該提供該基底聚合物膜層包含提供選自於聚醯胺膜、聚醯亞胺膜、聚酯膜、聚醚碸膜、聚碸膜,或聚醚醯亞胺膜之基底聚合物膜層。
- 如申請專利範圍第13項之方法,其中該提供該基底聚合物膜層包含提供該聚酯膜。
- 如申請專利範圍第14項之方法,其中該聚酯膜層係選自於由聚對酞酸乙二酯、聚萘二甲酸乙二酯,以及聚對酞酸丁二酯所構成的群組。
- 如申請專利範圍第15項之方法,其中該聚酯膜層包含聚對酞酸乙二酯。
- 如申請專利範圍第16項之方法,其中該提供該聚酯膜包含提供具有由大約2 mils至大約14 mils的厚度之聚酯膜。
- 如申請專利範圍第16項之方法,其中該鑄造該聚(醯胺)醯亞胺膜層於該基底聚合物膜層之上包含鑄造具有大約0.5 mil至大約2 mil的厚度之聚(醯胺)醯亞胺層。
- 如申請專利範圍第11項之方法,其中該聚(醯胺)醯亞胺膜層係藉由在大約100℃至大約260℃的溫度下加熱該層歷時大約20秒至大約60分鐘而予以部份固化。
- 一種提供電動馬達或變壓器絕緣的方法,其包含:提供一可撓且自撐式之複合膜,該複合膜包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層;以及將該複合膜插入至電動馬達溝槽之內或該變壓器之內。
- 一種電動馬達或變壓器,其包含:待絕緣的組件;以及鄰接該組件之可撓且自撐式之複合膜,該複合膜包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層。
- 一種提供電動馬達絕緣的方法,其包含:提供一電動馬達溝槽的組件,該組件內具有溝槽;以及將一可撓且自撐式之複合膜插入至該溝槽之內,該 複合膜包含基底聚合物膜層和於該基底膜層上之部份固化的聚(醯胺)醯亞胺膜層。
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-
2012
- 2012-05-04 US US13/464,395 patent/US10406791B2/en active Active
- 2012-05-11 WO PCT/US2012/037558 patent/WO2012155060A2/en active Application Filing
- 2012-05-11 ES ES12781654T patent/ES2881327T3/es active Active
- 2012-05-11 KR KR1020197011383A patent/KR102155773B1/ko active IP Right Grant
- 2012-05-11 CA CA2834787A patent/CA2834787C/en active Active
- 2012-05-11 EP EP12781654.4A patent/EP2707219B1/en active Active
- 2012-05-11 JP JP2014510499A patent/JP6282224B2/ja active Active
- 2012-05-11 PL PL12781654T patent/PL2707219T3/pl unknown
- 2012-05-11 CN CN201711050979.3A patent/CN107813570A/zh active Pending
- 2012-05-11 KR KR1020137032901A patent/KR102108020B1/ko active IP Right Grant
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HUE056386T2 (hu) | 2022-02-28 |
CA2834787C (en) | 2021-04-27 |
JP6282224B2 (ja) | 2018-02-21 |
KR20190045389A (ko) | 2019-05-02 |
EP2707219A2 (en) | 2014-03-19 |
US20120286620A1 (en) | 2012-11-15 |
KR102155773B1 (ko) | 2020-09-15 |
JP2014518789A (ja) | 2014-08-07 |
KR20140032431A (ko) | 2014-03-14 |
EP2707219A4 (en) | 2015-05-20 |
WO2012155060A2 (en) | 2012-11-15 |
EP2707219B1 (en) | 2021-06-23 |
ES2881327T3 (es) | 2021-11-29 |
PL2707219T3 (pl) | 2021-12-20 |
CN103534092A (zh) | 2014-01-22 |
WO2012155060A3 (en) | 2013-01-03 |
CA2834787A1 (en) | 2012-11-15 |
KR102108020B1 (ko) | 2020-05-07 |
TW201302471A (zh) | 2013-01-16 |
US10406791B2 (en) | 2019-09-10 |
CN107813570A (zh) | 2018-03-20 |
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