TWI586831B - A bridging liquid for preventing electroless metal plating, and a method of manufacturing the printed wiring board using the same - Google Patents

A bridging liquid for preventing electroless metal plating, and a method of manufacturing the printed wiring board using the same Download PDF

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Publication number
TWI586831B
TWI586831B TW103118810A TW103118810A TWI586831B TW I586831 B TWI586831 B TW I586831B TW 103118810 A TW103118810 A TW 103118810A TW 103118810 A TW103118810 A TW 103118810A TW I586831 B TWI586831 B TW I586831B
Authority
TW
Taiwan
Prior art keywords
liquid
electroless
plating
wiring board
catalyst
Prior art date
Application number
TW103118810A
Other languages
English (en)
Chinese (zh)
Other versions
TW201522705A (zh
Inventor
Juichi Tanimoto
Kumiko Ishikawa
Original Assignee
Jcu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jcu Corp filed Critical Jcu Corp
Publication of TW201522705A publication Critical patent/TW201522705A/zh
Application granted granted Critical
Publication of TWI586831B publication Critical patent/TWI586831B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW103118810A 2013-06-18 2014-05-29 A bridging liquid for preventing electroless metal plating, and a method of manufacturing the printed wiring board using the same TWI586831B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013127319 2013-06-18

Publications (2)

Publication Number Publication Date
TW201522705A TW201522705A (zh) 2015-06-16
TWI586831B true TWI586831B (zh) 2017-06-11

Family

ID=52104391

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118810A TWI586831B (zh) 2013-06-18 2014-05-29 A bridging liquid for preventing electroless metal plating, and a method of manufacturing the printed wiring board using the same

Country Status (5)

Country Link
JP (1) JP6290206B2 (ja)
KR (1) KR20160021107A (ja)
CN (1) CN105264114A (ja)
TW (1) TWI586831B (ja)
WO (1) WO2014203649A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6429079B2 (ja) * 2015-02-12 2018-11-28 メック株式会社 エッチング液及びエッチング方法
EP3059277B2 (en) * 2015-02-23 2022-03-30 MacDermid Enthone Inc. Inhibitor composition for racks when using chrome free etches in a plating on plastics process
JP2018076560A (ja) * 2016-11-10 2018-05-17 株式会社Ｊｃｕ 無電解銅めっきおよび無電解銅めっきの析出に用いられた触媒の除去液およびその用途
WO2019122055A1 (en) 2017-12-22 2019-06-27 Atotech Deutschland Gmbh A method and treatment composition for selective removal of palladium

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217001A (ja) * 2004-01-28 2005-08-11 Ebara Udylite Kk 無電解金属めっきのブリッジ防止液およびこれを用いたプリント配線板の製造方法
JP2006316305A (ja) * 2005-05-11 2006-11-24 Sumitomo Metal Mining Co Ltd 絶縁性配線基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613214B2 (ja) 1990-09-04 1994-02-23 東伸工業株式会社 自動スクリーン捺染機におけるスクリーンの自動位置決め設定方法及び装置
JP2893998B2 (ja) 1991-05-29 1999-05-24 日本電気株式会社 ディジタル信号切替器
JP5135572B2 (ja) * 2005-10-29 2013-02-06 国立大学法人岩手大学 有機薄膜トランジスタ装置及びその製造方法並びに金属薄膜の形成方法
JP4820989B2 (ja) * 2005-11-10 2011-11-24 国立大学法人岩手大学 電鋳金型の製造方法
TW200831710A (en) * 2006-09-25 2008-08-01 Mec Co Ltd Metal removing solution and metal removing method using the same
JP2008106354A (ja) * 2006-09-25 2008-05-08 Mec Kk 金属除去液及びこれを用いた金属除去方法
KR101502995B1 (ko) * 2007-10-23 2015-03-16 우베 에쿠시모 가부시키가이샤 금속 피막 형성 방법 및 도전성 입자
US8974869B2 (en) * 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217001A (ja) * 2004-01-28 2005-08-11 Ebara Udylite Kk 無電解金属めっきのブリッジ防止液およびこれを用いたプリント配線板の製造方法
JP2006316305A (ja) * 2005-05-11 2006-11-24 Sumitomo Metal Mining Co Ltd 絶縁性配線基板の製造方法

Also Published As

Publication number Publication date
JP6290206B2 (ja) 2018-03-07
KR20160021107A (ko) 2016-02-24
CN105264114A (zh) 2016-01-20
WO2014203649A1 (ja) 2014-12-24
JPWO2014203649A1 (ja) 2017-02-23
TW201522705A (zh) 2015-06-16

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