TWI584928B - 平刃狀切割刃以及綠板切割刃 - Google Patents

平刃狀切割刃以及綠板切割刃 Download PDF

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Publication number
TWI584928B
TWI584928B TW102134946A TW102134946A TWI584928B TW I584928 B TWI584928 B TW I584928B TW 102134946 A TW102134946 A TW 102134946A TW 102134946 A TW102134946 A TW 102134946A TW I584928 B TWI584928 B TW I584928B
Authority
TW
Taiwan
Prior art keywords
blade
cutting edge
tip
flat
cutting
Prior art date
Application number
TW102134946A
Other languages
English (en)
Chinese (zh)
Other versions
TW201434601A (zh
Inventor
堀端浩則
金山貴哉
林武彥
Original Assignee
聯合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 聯合材料股份有限公司 filed Critical 聯合材料股份有限公司
Publication of TW201434601A publication Critical patent/TW201434601A/zh
Application granted granted Critical
Publication of TWI584928B publication Critical patent/TWI584928B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Knives (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW102134946A 2012-09-28 2013-09-27 平刃狀切割刃以及綠板切割刃 TWI584928B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012216720 2012-09-28

Publications (2)

Publication Number Publication Date
TW201434601A TW201434601A (zh) 2014-09-16
TWI584928B true TWI584928B (zh) 2017-06-01

Family

ID=50388278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102134946A TWI584928B (zh) 2012-09-28 2013-09-27 平刃狀切割刃以及綠板切割刃

Country Status (7)

Country Link
JP (2) JP6087363B2 (ko)
KR (1) KR101773267B1 (ko)
CN (1) CN104684699B (ko)
MY (1) MY166204A (ko)
PH (1) PH12015500706A1 (ko)
TW (1) TWI584928B (ko)
WO (1) WO2014050883A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6187827B2 (ja) * 2014-12-08 2017-08-30 ツジカワ株式会社 押切切断用刃型及び押切切断用刃型の製造方法並びに押切切断用刃型を用いた被加工物の押切切断方法
JP6568443B2 (ja) * 2015-09-30 2019-08-28 日本特殊陶業株式会社 セラミック積層体の製造方法及び切断装置
CN109015780B (zh) * 2018-08-10 2024-02-02 安徽格林开思茂光电科技股份有限公司 一种触摸屏切割刀具
JP2020064923A (ja) * 2018-10-16 2020-04-23 太陽誘電株式会社 積層セラミック電子部品の製造方法及び積層セラミック電子部品の製造装置
JP6517418B1 (ja) * 2018-10-26 2019-05-22 株式会社レーベン 切断器具及びその製造方法
JP2021002592A (ja) * 2019-06-21 2021-01-07 太陽誘電株式会社 積層セラミック電子部品の製造方法及び積層セラミック電子部品の製造装置
JP7292487B2 (ja) 2020-06-19 2023-06-16 株式会社アライドマテリアル 超硬合金製切断刃
CN115697657A (zh) * 2020-06-19 2023-02-03 联合材料公司 超硬合金制切割刃
CN115697656A (zh) 2020-06-19 2023-02-03 联合材料公司 超硬合金制切割刃
CN112643862B (zh) * 2020-12-30 2022-03-04 瓷金科技(河南)有限公司 陶瓷生坯片修整方法、加工方法、及修整辅助装置
JP2024112328A (ja) * 2021-06-17 2024-08-21 株式会社ファインテック 刃物および刃物の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19741089A1 (de) * 1996-09-24 1998-04-02 Essmann & Schaefer Schneid- und Ritzwerkzeug
JP2009196285A (ja) * 2008-02-25 2009-09-03 Sumitomo Metal Electronics Devices Inc 押圧溝形成用スリット刃
JP2012071374A (ja) * 2010-09-28 2012-04-12 Tdk Corp 切断刃及び積層セラミック電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977287A (en) * 1975-12-22 1976-08-31 General Motors Corporation Fabric cutting blade
JPS59156797U (ja) * 1983-04-06 1984-10-20 日本特殊陶業株式会社 分割用溝の形成刃
JPH01148719A (ja) * 1987-12-03 1989-06-12 Hitachi Metals Ltd ガラス切断用刃物
JP2594234B2 (ja) * 1994-06-30 1997-03-26 ニッコー株式会社 セラミック製電子回路基板の形成方法及びその形成装置
DE29609877U1 (de) * 1996-06-04 1997-10-02 Hofer, Helmut, Prof. Dr.-Ing., 81929 München Druckschneidemesser
DE19902818C2 (de) * 1999-01-25 2003-03-27 Wolfgang Bauer Metallmesser mit speziell angepaßter Materialhärtenverteilung für Zerkleinerungs- und Schneidmaschinen
JP2001158013A (ja) * 1999-12-02 2001-06-12 Sumitomo Metal Electronics Devices Inc セラミック基板の製造方法および製造装置
CN1201342C (zh) * 2000-05-23 2005-05-11 京瓷株式会社 芯片电阻形成用的陶瓷基板及芯片电阻的制造方法
JP4084690B2 (ja) * 2003-03-26 2008-04-30 京セラ株式会社 切断刃
JP4753650B2 (ja) * 2005-07-28 2011-08-24 Ｕｈｔ株式会社 切断装置および切断装置用カッターホルダ
JP2007083332A (ja) * 2005-09-21 2007-04-05 Ｎｅｘｔ Ｉ＆Ｄ株式会社 切断装置および切断装置用カッターホルダ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19741089A1 (de) * 1996-09-24 1998-04-02 Essmann & Schaefer Schneid- und Ritzwerkzeug
JP2009196285A (ja) * 2008-02-25 2009-09-03 Sumitomo Metal Electronics Devices Inc 押圧溝形成用スリット刃
JP2012071374A (ja) * 2010-09-28 2012-04-12 Tdk Corp 切断刃及び積層セラミック電子部品の製造方法

Also Published As

Publication number Publication date
PH12015500706B1 (en) 2015-05-18
PH12015500706A1 (en) 2015-05-18
JP2017042911A (ja) 2017-03-02
KR20150052301A (ko) 2015-05-13
CN104684699A (zh) 2015-06-03
KR101773267B1 (ko) 2017-08-31
CN104684699B (zh) 2017-05-17
JPWO2014050883A1 (ja) 2016-08-22
WO2014050883A1 (ja) 2014-04-03
MY166204A (en) 2018-06-14
TW201434601A (zh) 2014-09-16
JP6087363B2 (ja) 2017-03-01

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