TWI570962B - A light emitting unit and a semiconductor light emitting device - Google Patents

A light emitting unit and a semiconductor light emitting device Download PDF

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Publication number
TWI570962B
TWI570962B TW104106904A TW104106904A TWI570962B TW I570962 B TWI570962 B TW I570962B TW 104106904 A TW104106904 A TW 104106904A TW 104106904 A TW104106904 A TW 104106904A TW I570962 B TWI570962 B TW I570962B
Authority
TW
Taiwan
Prior art keywords
light
external terminal
pad
layer
emitting
Prior art date
Application number
TW104106904A
Other languages
English (en)
Chinese (zh)
Other versions
TW201613142A (en
Inventor
小幡進
小島章弘
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TW201613142A publication Critical patent/TW201613142A/zh
Application granted granted Critical
Publication of TWI570962B publication Critical patent/TWI570962B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW104106904A 2014-09-16 2015-03-04 A light emitting unit and a semiconductor light emitting device TWI570962B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014187250A JP6295171B2 (ja) 2014-09-16 2014-09-16 発光ユニット及び半導体発光装置

Publications (2)

Publication Number Publication Date
TW201613142A TW201613142A (en) 2016-04-01
TWI570962B true TWI570962B (zh) 2017-02-11

Family

ID=55455627

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106904A TWI570962B (zh) 2014-09-16 2015-03-04 A light emitting unit and a semiconductor light emitting device

Country Status (4)

Country Link
US (1) US9293663B1 (ja)
JP (1) JP6295171B2 (ja)
CN (2) CN110085723B (ja)
TW (1) TWI570962B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955135B2 (ja) 2016-10-19 2021-10-27 日亜化学工業株式会社 発光装置およびその製造方法
KR102430500B1 (ko) * 2017-05-30 2022-08-08 삼성전자주식회사 반도체 발광소자 및 이를 이용한 led 모듈
TWI635605B (zh) * 2017-11-02 2018-09-11 錼創顯示科技股份有限公司 微型發光二極體顯示面板
CN110071134B (zh) 2018-01-23 2023-09-12 晶元光电股份有限公司 发光元件、其制造方法及显示模块
JP6717324B2 (ja) * 2018-02-27 2020-07-01 日亜化学工業株式会社 発光素子
JP7014973B2 (ja) 2019-08-28 2022-02-02 日亜化学工業株式会社 発光装置
CN110707198A (zh) * 2019-09-20 2020-01-17 深圳市华星光电半导体显示技术有限公司 阵列基板及其制备方法
JP7389331B2 (ja) * 2019-10-31 2023-11-30 日亜化学工業株式会社 発光デバイスの製造方法
EP4160679B1 (en) 2020-04-28 2024-01-31 Nichia Corporation Light-emitting device
JP7114854B2 (ja) * 2020-04-28 2022-08-09 日亜化学工業株式会社 発光装置
CN114302773B (zh) 2020-08-04 2023-10-20 株式会社东芝 涂敷装置以及涂敷方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044737A1 (en) * 2007-03-30 2010-02-25 Rohm Co., Ltd. Semiconductor light emitting device
US20110127569A1 (en) * 2008-07-23 2011-06-02 Rohm Co., Ltd. Led module

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JP4139634B2 (ja) 2002-06-28 2008-08-27 松下電器産業株式会社 Ｌｅｄ照明装置およびその製造方法
JP2004039938A (ja) * 2002-07-05 2004-02-05 Sony Corp チップ状電子部品、その実装構造、その中間基板、及びこれらの製造方法、並びにチップ状電子部品の検査方法
US7221044B2 (en) * 2005-01-21 2007-05-22 Ac Led Lighting, L.L.C. Heterogeneous integrated high voltage DC/AC light emitter
CN101452979A (zh) * 2007-12-04 2009-06-10 亿光电子工业股份有限公司 发光器件的封装结构及其制造方法
JP4724222B2 (ja) * 2008-12-12 2011-07-13 株式会社東芝 発光装置の製造方法
CN101621105B (zh) * 2009-07-30 2011-08-17 宁波晶科光电有限公司 Led倒装芯片集成封装方法及采用该方法封装的led
JP2011071272A (ja) 2009-09-25 2011-04-07 Toshiba Corp 半導体発光装置及びその製造方法
US9153561B2 (en) * 2010-04-16 2015-10-06 Nichia Corporation Light-emitting device comprising a metal film on a substrate and manufacturing method for the same
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
JP5337105B2 (ja) * 2010-06-03 2013-11-06 株式会社東芝 半導体発光装置
JP5266290B2 (ja) 2010-10-06 2013-08-21 ラピスセミコンダクタ株式会社 半導体装置の製造方法
JP5568451B2 (ja) 2010-11-26 2014-08-06 株式会社フジクラ 半導体パッケージ
JP2012195435A (ja) * 2011-03-16 2012-10-11 Stanley Electric Co Ltd 半導体発光素子の製造方法
JP5770006B2 (ja) * 2011-04-15 2015-08-26 シチズン電子株式会社 半導体発光装置
CN102881799A (zh) * 2011-07-11 2013-01-16 郭文平 一种高压led芯片及制作方法
JP5662277B2 (ja) * 2011-08-08 2015-01-28 株式会社東芝 半導体発光装置及び発光モジュール
JP6176817B2 (ja) * 2011-10-17 2017-08-09 ローム株式会社 チップダイオードおよびダイオードパッケージ
CN202930422U (zh) * 2012-11-05 2013-05-08 金木子 倒装结构的led高压芯片
JP6306308B2 (ja) 2013-09-19 2018-04-04 株式会社東芝 半導体発光装置
CN204257706U (zh) * 2014-10-29 2015-04-08 王文娟 一种led光源封装结构

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044737A1 (en) * 2007-03-30 2010-02-25 Rohm Co., Ltd. Semiconductor light emitting device
US20110127569A1 (en) * 2008-07-23 2011-06-02 Rohm Co., Ltd. Led module

Also Published As

Publication number Publication date
JP2016062940A (ja) 2016-04-25
CN105990495A (zh) 2016-10-05
TW201613142A (en) 2016-04-01
CN110085723A (zh) 2019-08-02
CN110085723B (zh) 2022-10-21
JP6295171B2 (ja) 2018-03-14
US9293663B1 (en) 2016-03-22
US20160079483A1 (en) 2016-03-17
CN105990495B (zh) 2019-04-05

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