TWI564144B - 附載子銅箔、使用其之銅張積層板、印刷配線板、印刷電路板、以及印刷配線板之製造方法 - Google Patents

附載子銅箔、使用其之銅張積層板、印刷配線板、印刷電路板、以及印刷配線板之製造方法 Download PDF

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Publication number
TWI564144B
TWI564144B TW102138667A TW102138667A TWI564144B TW I564144 B TWI564144 B TW I564144B TW 102138667 A TW102138667 A TW 102138667A TW 102138667 A TW102138667 A TW 102138667A TW I564144 B TWI564144 B TW I564144B
Authority
TW
Taiwan
Prior art keywords
layer
copper foil
carrier
copper
ultra
Prior art date
Application number
TW102138667A
Other languages
English (en)
Chinese (zh)
Other versions
TW201431678A (zh
Inventor
森山晃正
坂口和彦
古曳倫也
永浦友太
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW201431678A publication Critical patent/TW201431678A/zh
Application granted granted Critical
Publication of TWI564144B publication Critical patent/TWI564144B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
TW102138667A 2012-10-26 2013-10-25 附載子銅箔、使用其之銅張積層板、印刷配線板、印刷電路板、以及印刷配線板之製造方法 TWI564144B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012236858 2012-10-26
JP2013016116A JP5358740B1 (ja) 2012-10-26 2013-01-30 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
TW201431678A TW201431678A (zh) 2014-08-16
TWI564144B true TWI564144B (zh) 2017-01-01

Family

ID=49850277

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102138667A TWI564144B (zh) 2012-10-26 2013-10-25 附載子銅箔、使用其之銅張積層板、印刷配線板、印刷電路板、以及印刷配線板之製造方法

Country Status (5)

Country Link
JP (1) JP5358740B1 (ja)
KR (1) KR101569253B1 (ja)
CN (1) CN103786389B (ja)
MY (1) MY157604A (ja)
TW (1) TWI564144B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171902A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171899A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN112004964B (zh) * 2018-04-25 2022-03-18 古河电气工业株式会社 表面处理铜箔、覆铜板以及印刷电路板
WO2020066457A1 (ja) * 2018-09-25 2020-04-02 東レＫｐフィルム株式会社 積層体および積層体の製造方法
CN113646469A (zh) * 2019-03-27 2021-11-12 三井金属矿业株式会社 印刷电路板用金属箔、带载体的金属箔和覆金属层叠板、及使用其的印刷电路板的制造方法
US20230276579A1 (en) * 2020-07-16 2023-08-31 Mitsui Mining & Smelting Co., Ltd. Manufacturing methods for copper-clad laminate and printed wiring board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4604160A (en) * 1984-01-11 1986-08-05 Hitachi, Ltd. Method for manufacture of printed wiring board
CN1237508A (zh) * 1998-05-29 1999-12-08 三井金属鉱业株式会社 涂覆树脂的复合箔及其制造,用其制造多层覆铜层压板和多层印刷线路板
JP2000331537A (ja) * 1999-05-19 2000-11-30 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
TW577096B (en) * 2001-07-30 2004-02-21 Mitsui Mining & Smelting Co Double-sided copper clad laminate for forming capacitor layer and method for manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP4906332B2 (ja) * 2005-12-06 2012-03-28 三井金属鉱業株式会社 複合箔のカール矯正方法、複合箔及び複合箔張積層板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4604160A (en) * 1984-01-11 1986-08-05 Hitachi, Ltd. Method for manufacture of printed wiring board
CN1237508A (zh) * 1998-05-29 1999-12-08 三井金属鉱业株式会社 涂覆树脂的复合箔及其制造,用其制造多层覆铜层压板和多层印刷线路板
JP2000331537A (ja) * 1999-05-19 2000-11-30 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
TW577096B (en) * 2001-07-30 2004-02-21 Mitsui Mining & Smelting Co Double-sided copper clad laminate for forming capacitor layer and method for manufacturing the same

Also Published As

Publication number Publication date
KR101569253B1 (ko) 2015-11-13
TW201431678A (zh) 2014-08-16
JP2014100905A (ja) 2014-06-05
CN103786389B (zh) 2017-01-04
KR20140053797A (ko) 2014-05-08
JP5358740B1 (ja) 2013-12-04
MY157604A (en) 2016-06-30
CN103786389A (zh) 2014-05-14

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