MY157604A - Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board - Google Patents

Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board

Info

Publication number
MY157604A
MY157604A MYPI2013003917A MYPI2013003917A MY157604A MY 157604 A MY157604 A MY 157604A MY PI2013003917 A MYPI2013003917 A MY PI2013003917A MY PI2013003917 A MYPI2013003917 A MY PI2013003917A MY 157604 A MY157604 A MY 157604A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
wiring board
printed wiring
copper
Prior art date
Application number
MYPI2013003917A
Other languages
English (en)
Inventor
Terumasa Moriyama
Kazuhiko Sakaguchi
Tomota Nagaura
Michiya Kohiki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY157604A publication Critical patent/MY157604A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
MYPI2013003917A 2012-10-26 2013-10-28 Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board MY157604A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012236858 2012-10-26
JP2013016116A JP5358740B1 (ja) 2012-10-26 2013-01-30 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
MY157604A true MY157604A (en) 2016-06-30

Family

ID=49850277

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003917A MY157604A (en) 2012-10-26 2013-10-28 Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board

Country Status (5)

Country Link
JP (1) JP5358740B1 (ja)
KR (1) KR101569253B1 (ja)
CN (1) CN103786389B (ja)
MY (1) MY157604A (ja)
TW (1) TWI564144B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171902A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171899A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN112004964B (zh) * 2018-04-25 2022-03-18 古河电气工业株式会社 表面处理铜箔、覆铜板以及印刷电路板
WO2020066457A1 (ja) * 2018-09-25 2020-04-02 東レＫｐフィルム株式会社 積層体および積層体の製造方法
CN113646469A (zh) * 2019-03-27 2021-11-12 三井金属矿业株式会社 印刷电路板用金属箔、带载体的金属箔和覆金属层叠板、及使用其的印刷电路板的制造方法
US20230276579A1 (en) * 2020-07-16 2023-08-31 Mitsui Mining & Smelting Co., Ltd. Manufacturing methods for copper-clad laminate and printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
JP4329953B2 (ja) * 1999-05-19 2009-09-09 古河電気工業株式会社 高密度超微細配線板用銅箔
JP3770537B2 (ja) * 2001-07-30 2006-04-26 三井金属鉱業株式会社 キャパシター及びそれを形成するための両面銅張積層板の製造方法
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP4906332B2 (ja) * 2005-12-06 2012-03-28 三井金属鉱業株式会社 複合箔のカール矯正方法、複合箔及び複合箔張積層板

Also Published As

Publication number Publication date
KR101569253B1 (ko) 2015-11-13
TW201431678A (zh) 2014-08-16
JP2014100905A (ja) 2014-06-05
CN103786389B (zh) 2017-01-04
KR20140053797A (ko) 2014-05-08
TWI564144B (zh) 2017-01-01
JP5358740B1 (ja) 2013-12-04
CN103786389A (zh) 2014-05-14

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