KR101569253B1 - 캐리어가 부착된 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 프린트 회로판, 및 프린트 배선판의 제조 방법 - Google Patents

캐리어가 부착된 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 프린트 회로판, 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR101569253B1
KR101569253B1 KR1020130128013A KR20130128013A KR101569253B1 KR 101569253 B1 KR101569253 B1 KR 101569253B1 KR 1020130128013 A KR1020130128013 A KR 1020130128013A KR 20130128013 A KR20130128013 A KR 20130128013A KR 101569253 B1 KR101569253 B1 KR 101569253B1
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KR
South Korea
Prior art keywords
layer
carrier
copper foil
copper
resin
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KR1020130128013A
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English (en)
Korean (ko)
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KR20140053797A (ko
Inventor
데루마사 모리야마
가즈히코 사카구치
도모타 나가우라
미치야 고히키
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20140053797A publication Critical patent/KR20140053797A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020130128013A 2012-10-26 2013-10-25 캐리어가 부착된 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 프린트 회로판, 및 프린트 배선판의 제조 방법 KR101569253B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-236858 2012-10-26
JP2012236858 2012-10-26
JPJP-P-2013-016116 2013-01-30
JP2013016116A JP5358740B1 (ja) 2012-10-26 2013-01-30 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20140053797A KR20140053797A (ko) 2014-05-08
KR101569253B1 true KR101569253B1 (ko) 2015-11-13

Family

ID=49850277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130128013A KR101569253B1 (ko) 2012-10-26 2013-10-25 캐리어가 부착된 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 프린트 회로판, 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP5358740B1 (ja)
KR (1) KR101569253B1 (ja)
CN (1) CN103786389B (ja)
MY (1) MY157604A (ja)
TW (1) TWI564144B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171902A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018171899A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN112004964B (zh) * 2018-04-25 2022-03-18 古河电气工业株式会社 表面处理铜箔、覆铜板以及印刷电路板
WO2020066457A1 (ja) * 2018-09-25 2020-04-02 東レＫｐフィルム株式会社 積層体および積層体の製造方法
CN113646469A (zh) * 2019-03-27 2021-11-12 三井金属矿业株式会社 印刷电路板用金属箔、带载体的金属箔和覆金属层叠板、及使用其的印刷电路板的制造方法
US20230276579A1 (en) * 2020-07-16 2023-08-31 Mitsui Mining & Smelting Co., Ltd. Manufacturing methods for copper-clad laminate and printed wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331537A (ja) * 1999-05-19 2000-11-30 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP2005262506A (ja) * 2004-03-16 2005-09-29 Mitsui Mining & Smelting Co Ltd 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP2007152796A (ja) * 2005-12-06 2007-06-21 Mitsui Mining & Smelting Co Ltd 複合箔のカール矯正方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
JP3770537B2 (ja) * 2001-07-30 2006-04-26 三井金属鉱業株式会社 キャパシター及びそれを形成するための両面銅張積層板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331537A (ja) * 1999-05-19 2000-11-30 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP2005262506A (ja) * 2004-03-16 2005-09-29 Mitsui Mining & Smelting Co Ltd 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP2007152796A (ja) * 2005-12-06 2007-06-21 Mitsui Mining & Smelting Co Ltd 複合箔のカール矯正方法

Also Published As

Publication number Publication date
TW201431678A (zh) 2014-08-16
JP2014100905A (ja) 2014-06-05
CN103786389B (zh) 2017-01-04
KR20140053797A (ko) 2014-05-08
TWI564144B (zh) 2017-01-01
JP5358740B1 (ja) 2013-12-04
MY157604A (en) 2016-06-30
CN103786389A (zh) 2014-05-14

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