TWI546934B - Led陣列擴張方法及led陣列單元 - Google Patents
Led陣列擴張方法及led陣列單元 Download PDFInfo
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Description
本發明是有關於一種LED擴張方法及LED陣列單元,特別是指一種利用承載膜擴張的LED陣列的擴張方法及用於該擴張方法的LED陣列單元。
一般要將在磊晶基板上製得的發光元件陣列轉移到所要應用的不同尺寸的顯示面板時,由於該等發光元件陣列排列的間距與所要應用的顯示面板尺寸的排列間距並不相同,因此,須要改變該等發光元件的間距並將其轉移到所要應用的顯示面板後,方可實際應用。
常用的發光元件可利用多次轉移方式,將形成在磊晶基板上的發光元件逐一轉移到所要應用的基板上,因此,在轉移的過程即可控制發光元件的位置,而改變發光元件的排列間距。
前述利用多次轉移方式雖然可精確的控制每一個發光元件的排列間距,然而製程繁複,且每一次轉移的對位均須精準,否則,反而會造成轉移後的該等發光元件之間產生對位誤差。尤其近年來以奈米製程微縮發光元件尺寸,發展出尺寸小於一般發光元件的微型發光二極體(micro LED),由於尺寸微縮,因此,其對於轉移及對位的
精度的要求也更甚於一般的發光元件,所以,如何有效且精準的控制發光元件重新排列後的間距,則是本技術領域者努力改善的方向。
因此,本發明之目的,即在提供一種可控制發光元件間距差異變異性的LED陣列擴張方法。
於是,本發明LED陣列擴張方法包含:一步驟(a)及一步驟(b)。
該步驟(a)是提供一個LED陣列單元,該LED陣列單元具有一承載膜,及多個與該承載膜表面連接,且呈陣列排列的發光元件,其中,該承載膜為具有可延伸性。
該步驟(b)是沿該承載膜的一第一方向及一第二方向進行面拉伸,以改變該等發光元件的間距,其中,該第一方向及該第二方向與該等發光元件的橫向及縱向排列方向同向。
此外,本發明的另一目的,是提供一種可用於前述該LED陣列擴張方法的LED陣列單元。
於是,本發明該LED陣列單元包括一承載膜、多個與該承載膜表面連接並呈陣列排列的發光元件,其中,該承載膜具有多個穿孔,且該等穿孔相對該等發光元件分佈。
本發明之功效在於:利用沿該承載膜的該第一、二方向進行面拉伸,可讓該等發光元件於擴張後的間距
可具有極佳的均一性;此外,該承載膜也可具有穿孔,藉由該等穿孔令該承載膜產生應力阻斷點,讓施於該承載膜的拉伸應力可均勻的分佈,而讓該等發光元件於擴張後的間距可具有更佳的均一性。
2‧‧‧LED陣列單元
21‧‧‧承載膜
22‧‧‧發光元件
3‧‧‧封裝基板
31‧‧‧連接層
4‧‧‧LED陣列單元
41‧‧‧承載膜
42‧‧‧穿孔
43‧‧‧發光元件
X‧‧‧第一方向
Y‧‧‧第二方向
S1、S1’‧‧‧第一間距
S2‧‧‧第二間距
L1‧‧‧第一直線
L2‧‧‧第二直線
P1‧‧‧第一應力
P2‧‧‧第二應力
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一示意圖,說明用於本發明LED陣列擴張方法的一第一實施例的LED陣列單元;圖2是一流程示意圖,輔助說明該第一實施例;及圖3是一示意圖,說明應用於本發明LED陣列擴張方法的一第二實施例的LED陣列單元。
參閱圖1,及圖2,本發明LED陣列擴張方法的一實施例,包含:一步驟(a)、一步驟(b),及一步驟(c)。
該步驟(a)是提供一個LED陣列單元2,其中,該LED陣列單元2具有一承載膜21、多個與該承載膜21表面連接,且呈陣列排列的發光元件22。
詳細的說,該承載膜21具延伸性,可選自具有彈性且可拉伸的高分子材料構成並具有初黏性,而可與該等發光元件22黏接,且較佳地,為了易於後續該等發光元件22的轉移,該承載膜21可選自易撕除,業界通稱的藍膜、或照設預定波長的光即會降低與該等發光元件22黏性
的光解膠帶(UV tape),或是加熱至預定溫度後可降低與該等發光元件22黏性的熱解黏膠帶。於本實施例中,該承載膜21較佳是選自藍膜,可節省製程的時間和成本。
該等發光元件22呈陣列排列並與該承載膜21表面連接,具有可發出預定光色的半導體磊晶層(圖未示),該等半導體磊晶層可發出一種或多種不同光色,且該等半導體磊晶層的高度可為相同或不同。由於該承載膜21與該等發光元件22的相關材料選擇為本技術領域者所周知,且非為本技術之重點,因此,不再多加贅述。
具體的說,以該等發光元件22為沿一第一方向X及一第二方向Y成陣列排列,且每一個發光元件22為成方形晶片為例,該等發光元件22沿該承載膜21的一第一方向X以第一間距S1間隔分佈,沿該第二方向Y則以第二間距S2間隔分佈,且該第一間距S1與該第二間距S2可為相同或不同,於本實施例中。是以該第一、二間距S1、S2相同做說明。
該步驟(b)是對該LED陣列單元2,沿該承載膜21的該第一方向X與該第二方向Y進行面拉伸,以改變該等發光元件22的間距。
詳細的說,該步驟(b)可以是利用拉伸設備例如一擴膜機,以預設的拉伸應力將該承載膜21沿與該等發光元件22的縱向及橫向排列方向相同的方向,拉伸擴張到令該等發光元件22的第一、二間距S1、S2與預定要應用的基板所需的排列間距相同為止。
要說明的是,該承載膜21的拉伸可以是將該承載膜21的一側固定,並自相對遠離的另一側進行單向拉伸,或是同時自該承載膜21相對遠離的兩側同時進行對向拉伸,並無特別限制,於本實施例中是以將該承載膜21的一側固定,並自相對遠離的一側進行單向拉伸為例做說明。
具體的說,該步驟(b)是將該承載膜21的一側固定,並自相對遠離的另一側沿與該等發光晶片22的橫向排列方向相同的該第一方向X進行面拉伸,由於是在同一方向進行同一應力的面拉伸,因此與該承載膜21連接的該等發光元件22將會各自受到來自該第一方向X的第一應力P1,而令該等發光元件22的第一間距S1可均勻地改變。同理,當該承載膜21是沿與該等發光晶片22的縱向排列方向相同的該第二方向Y進行面拉伸時,與該承載膜21連接的該等發光元件22將會各自受到該第二方向Y的第二應力P2,而令該等發光元件22的第二間距S2可均勻地改變。要說明的是,該步驟(b)可以是將該承載膜21是先沿該第一方向X拉伸後,再沿該第二方向Y進行面拉伸。或是同時沿該承載膜21的該第一方向X及第二方向Y同時進行面拉伸。
當完成該等發光元件22的拉伸擴張,而將該等發光元件22原始的第一、二間距S1、S2改變成新的排列間距後,即可進行該步驟(c)。
該步驟(b)是令原本以該第一、二間距S1、S2分佈的該等發光元件22經過面拉伸後,形成新的第一、二
間距S1’、S2’(圖2為沿該第一方向X進行面拉伸的示意圖,故未顯示該第二間距S2’);該步驟(c)則是將以新的該第一、二間距S1’、S2’排列的該等發光元件22以遠離該承載膜21的表面,透過一連接層31而接合於一封裝基板3,最後,再將該承載膜21自該LED陣列單元2移除,即可將經過改變排列間距的該等發光元件22轉移至該封裝基板3,而完成該等發光元件22的轉移擴張。
要說明的是,該等發光元件22經擴張後的該第一、二間距S1’、S2’可為相同或不同,端示所需應用的設計而定,該封裝基板3則可例如是印刷電路板、TFT基板,或CMOS基板,該連接層31可以是選自共晶溫度低於300℃的合金材料,而該承載膜21因為是選自易撕除的藍膜、或照設預定波長的光即會降低與該等發光元件22黏性的光解膠帶(UV tape),或是加熱至預定溫度後可降低與該等發光元件22黏性的熱解黏膠帶,因此,當將該等發光元件22轉移至該封裝基板3後,即可藉由照光、加熱,或直接撕除的方式,將該承載膜21自該等發光元件22的表面移除。
本發明係利用一具有可延伸性的承載膜21,使多個與該承載膜21表面連接,且呈陣列排列的發光元件22,利用沿該承載膜21的第一方向X及第二方向Y進行面拉伸,讓該等發光元件22於擴張後的間距可具有極佳的均一性,因此,在轉移至該封裝基板3時,可具有更佳的對位精準度。
配合參閱圖3,本發明LED陣列擴張方法的一第二實施例,該第二實施例與該第一實施例大致相同,不同處在於,該第二實施例之LED陣列單元4的承載膜41具有多個穿孔42,且該等穿孔42相對應該發光元件43分佈,較佳地,該等穿孔42為對應每一個發光元件43,而形成於每一個發光元件43的頂點或是四個邊長的中點。
更詳細的說,於本實施中是定義多條位於任相鄰兩行的發光元件43之間的第一直線L1,及多條與該第一直線L1垂直且位於任相鄰兩列的發光元件43之間的第二直線L2,且該等第一、二直線L1、L2是分別通過該第一、二間距S1、S2的中點。
其中,該等穿孔42形成於該第一、二直線L1、L2上,並相對於該每一個發光元件43成對稱分佈。更詳細地說,該等穿孔42亦可以是被多個發光元件43共用,例如:該等穿孔42可以是形成於該等第一、二直線L1、L2的交點,如此,每一個穿孔42可被相鄰的4個發光元件43共用;或是可將該等穿孔42形成於第一、二直線L1、L2上,對應該每一個發光元件43四邊長的中點,如此,每一個穿孔42可被相鄰的2個發光元件43共用。
利用該具有穿孔42的承載膜41,藉由該等穿孔42令該承載膜41產生應力阻斷點,因此,當對該承載膜41施以外力拉伸時,施加於該承載膜41的應力會因為該等穿孔42的阻斷而轉向該等穿孔42四周均勻分佈,因此,可讓該承載膜41於拉伸的過程中各個位置所承受的應力及
變形更趨於一致,而令拉伸後的該等發光元件43之間的排列間距更為一致,因此,當將經過拉伸後重新擴張排列的發光元件43轉移至如圖2所需應用的該封裝基板3時,即可更精確的對位
此外,要說明的是,該等穿孔42是為了對該承載膜41於進行面拉伸時,可達成應力阻斷的目的,且不影響該承載膜41本身的機械性質。然而,穿孔42的數量愈多或是穿孔42的孔徑太大,對該承載膜41的物性影響就會愈大,因此,較佳地,該每一個穿孔42的位置是以至少被兩個相鄰的發光元件43共用而設置。於本實施例中,是以該等穿孔42為形成於該等第一、二直線L1、L2的交點,而得到如圖3所示的LED陣列單元4。
本發明利用一具可延伸性的承載膜21,使多個與該承載膜21表面連接,且呈陣列排列的發光元件22,利用將該承載膜21沿與該等發光元件22的橫向及縱向排列相同的該第一方向X及第二方向Y進行面拉伸,讓該等發光元件22於擴張過程維持僅受到來自該第一方向X及第二方向Y的應力,而不受到其它方向應力的干擾,因此,於擴張後,該等發光元件22僅會改變其沿第一方向X及第二方向Y的排列間距,而可令擴張後的間距具有極佳的均一性,而轉移至一封裝基板3。
此外,本發明亦可進一步利用讓該承載膜41形成穿孔42,藉由該等穿孔42令該承載膜41產生應力阻斷點,因此,當對該承載膜41施以外力拉伸時,施加於該承
載膜41的應力會因為該等穿孔42的阻斷而轉向該等穿孔42四周均勻分佈,讓該承載膜41於拉伸的過程中各個位置所承受的應力及變形更趨於一致,而令拉伸後的發光元件43之間的排列間距更為一致,因此,當將經過拉伸後重新擴張排列的發光元件42轉移至所需應用的封裝基板4時,即可更精確的對位,故確實能達成本發明之目的。
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。
2‧‧‧LED陣列單元
21‧‧‧承載膜
22‧‧‧發光元件
X‧‧‧第一方向
Y‧‧‧第二方向
S1‧‧‧第一間距
S2‧‧‧第二間距
P1‧‧‧第一應力
P2‧‧‧第二應力
Claims (14)
- 一種LED陣列擴張方法,其包含下列步驟:步驟(a),提供一LED陣列單元,該LED陣列單元具有一承載膜、多個與該承載膜表面連接,且呈陣列排列的發光元件,其中,該承載膜為具有可延伸性;及步驟(b),將該承載膜沿一第一方向及一第二方向進行面拉伸,以改變該等發光元件的間距,其中,該第一方向及該第二方向與該等發光元件的橫向及縱向排列方向同向。
- 如請求項1所述的LED陣列擴張方法,其中,該步驟(b)是先沿該承載膜的該第一方向拉伸後,再沿該第二方向進行拉伸。
- 如請求項1所述的LED陣列擴張方法,其中,該步驟(b)是沿該承載膜的該第一方向及該第二方向同時進行面拉伸。
- 如請求項1所述的LED陣列擴張方法,其中,該步驟(a)之該承載膜具有多個穿孔,該等穿孔相對應該等發光元件分佈。
- 如請求項4所述的LED陣列擴張方法,其中,該等穿孔為對應形成於該等發光元件的各個頂點,或是四個邊長的中點。
- 如請求項4所述的LED陣列擴張方法,定義多條位於任相鄰兩行的發光元件之間的第一直線,及多條與該第一直線垂直,且位於任相鄰兩列的發光元件之間的第 二直線,其中,該等第一、二直線是分別通過任相鄰兩行及兩列的該等發光元件的間距的中點,且該等穿孔為形成於該等第一、二直線上。
- 如請求項6所述的LED陣列擴張方法,其中,該等穿孔形成於該些第一、二直線的交點。
- 如請求項1所述的LED陣列擴張方法,還包含一實施於該步驟(b)之後的步驟(c),該步驟(c)是將該等發光元件遠離該承載膜的表面接合於一封裝基板,並將該承載膜自該LED陣列單元移除。
- 如請求項8所述的LED陣列擴張方法,其中,該步驟(c)是利用照射特定波長的光或加熱方式降低該承載膜與該LED陣列單元的連接性後,再將該承載膜自該LED陣列單元移除。
- 如請求項8所述的LED陣列擴張方法,其中,該封裝基板為印刷電路板、TFT基板,或CMOS基板。
- 一種LED陣列單元,包括一承載膜及多個與該承載膜表面連接並呈陣列排列發光元件,其中,該承載膜具延伸性,並具有多個穿孔,且該等穿孔相對應該等發光元件分佈。
- 如請求項11所述的LED陣列單元,其中,該等穿孔為對應形成於該等發光元件的各個頂點,或是四個邊長的中點。
- 如請求項11所述的LED陣列單元,定義多條位於任相鄰兩行的發光元件之間的第一直線,及多條與該第一 直線垂直,且位於任相鄰兩列的發光元件之間的第二直線,其中,該等第一、二直線是分別通過任相鄰兩行及兩列的該等發光元件的間距的中點,且該等穿孔為形成於該等第一、二直線上。
- 如請求項13所述的LED陣列單元,其中,該等穿孔形成於該等第一、二直線的交點。
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US20160111604A1 (en) | 2016-04-21 |
US20180240941A1 (en) | 2018-08-23 |
TW201616635A (zh) | 2016-05-01 |
US10290622B2 (en) | 2019-05-14 |
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