TWI634371B - 微小元件的轉移方法 - Google Patents

微小元件的轉移方法 Download PDF

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TWI634371B
TWI634371B TW106133598A TW106133598A TWI634371B TW I634371 B TWI634371 B TW I634371B TW 106133598 A TW106133598 A TW 106133598A TW 106133598 A TW106133598 A TW 106133598A TW I634371 B TWI634371 B TW I634371B
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micro
laser
light
elements
transferring
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TW201915566A (zh
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張修明
林博文
洪宗泰
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台虹科技股份有限公司
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Priority to CN201711095632.0A priority patent/CN109585380A/zh
Priority to US15/826,728 priority patent/US20190103274A1/en
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Abstract

本發明提供一種微小元件的轉移方法，包括以下步驟。提供具有彼此相對的第一表面與第二表面的載體基板，在第一表面上配置多個微小元件，每一微小元件與第一表面之間以雷射解黏膠進行黏著。接著，令接收基板與第一表面相對靠近，並於第二表面上提供光罩。之後，對提供有光罩的第二表面照射雷射光，以使未照射到雷射光的微小元件保持黏著於第一表面上，照射到雷射光的微小元件失去黏著力而轉移至接收基板上。

Description

微小元件的轉移方法
本發明是有關於一種轉移方法，且特別是有關於一種微小元件的轉移方法。
微型發光二極體顯示裝置(Micro LED Display)具有高亮度、高對比、廣視角、長壽命及低耗電等優勢，已成為未來顯示技術發展的重點。將微型發光二極體(micro LED)晶體直接搬運到驅動背板上的技術稱為巨量轉移(mass transfer process)，而巨量轉移技術具有以下困難點。首先，微型發光二極體的尺寸極小(約5μm至10μm)，需要更精細化的操作技術。此外，由幾十萬或幾百萬顆微型發光二極體才能構成一片面板，而一次轉移需要移動幾萬乃至幾十萬顆微型發光二極體，數量龐大。
在習知技術中，通常利用機械靜電吸取法或黏著膠黏取法進行巨量轉移。機械靜電吸取法的吸附頭及機械手臂較大，無法吸附10μm以下的微型發光二極體，且無法大量轉移。黏著膠黏取法具有黏著力不均勻的缺點，在黏著力移除時，黏力下降不穩定，造成良率問題，且由於膠帶面積太大，故無法選取特定位 置的微型發光二極體。
基於上述，發展出一種能夠一次大量轉移微型發光二極體的方法，且可適用於微小尺寸(10μm以下)的微型發光二極體，並可選取特定位置的微型發光二極體，為目前所需研究的重要課題。
本發明提供一種微小元件的轉移方法，主要利用光罩搭配雷射解黏膠，能夠一次大量轉移微型發光二極體，且可適用於微小尺寸(10μm以下)的微型發光二極體，更可在轉移過程中選取特定位置的微型發光二極體。
本發明的微小元件的轉移方法包括以下步驟。提供具有彼此相對的第一表面與第二表面的載體基板，在第一表面上配置多個微小元件，每一微小元件與第一表面之間以雷射解黏膠進行黏著。接著，令接收基板與第一表面相對靠近，並於第二表面上提供光罩。之後，對提供有光罩的第二表面照射雷射光，以使未照射到雷射光的微小元件保持黏著於第一表面上，照射到雷射光的微小元件失去黏著力而轉移至接收基板上。
在本發明的一實施例中，微小元件的轉移方法更包括在第一表面上塗布雷射解黏膠，以使每一微小元件與第一表面之間以雷射解黏膠進行黏著。
在本發明的一實施例中，微小元件的轉移方法更包括在 每一微小元件上塗布雷射解黏膠，以使每一微小元件與第一表面之間以雷射解黏膠進行黏著。
在本發明的一實施例中，在第一表面上配置的多個微小元件為發出相同色光的微型發光二極體。
在本發明的一實施例中，在第一表面上配置的多個微小元件為發出不同色光的微型發光二極體。
在本發明的一實施例中，載體基板為玻璃基板，接收基板為驅動IC玻璃基板。
在本發明的一實施例中，雷射解黏膠的材料包括聚醯亞胺。
在本發明的一實施例中，雷射解黏膠在波長為200nm至1064nm的雷射光照射下失去黏著力。
基於上述，本發明提供一種微小元件的轉移方法，將微型發光二極體以雷射解黏膠黏著於玻璃上，搭配光罩作用，使得未照射到雷射光的微型發光二極體保持黏著，照射到雷射光的微型發光二極體失去黏著力而轉移至驅動背板上，因此，能夠一次大量轉移微型發光二極體，且可適用於微小尺寸(10μm以下)的微型發光二極體，更可在轉移過程中選取特定位置的微型發光二極體。
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。
100‧‧‧接收基板
110‧‧‧載體基板
120‧‧‧雷射解黏膠
130、130a、130b、132、132a、132b、134、134a、134b、230、232、234‧‧‧微小元件
140、142、144、240、242、244‧‧‧光罩
150‧‧‧雷射裝置
160‧‧‧雷射光
S1‧‧‧第一表面
S2‧‧‧第二表面
圖1A至圖1F為依照本發明的第一實施例所繪示的微小元件的轉移方法的剖面示意圖。
圖2A至圖2F為依照本發明的第二實施例所繪示的微小元件的轉移方法的剖面示意圖。
在本說明書中，為求清楚說明，可能誇大圖中分層及區域的大小及比例。此外，所繪示元件(例如微小元件)的數目僅為例示說明用，本發明並不以此為限，元件的數目可依實際操作情形而加以調整。
圖1A至圖1F為依照本發明的第一實施例所繪示的微小元件的轉移方法的剖面示意圖。
首先，請參照圖1A，提供具有彼此相對的第一表面S1與第二表面S2的載體基板110，在第一表面S1上配置多個微小元件130，且每一微小元件130與第一表面S1之間以雷射解黏膠120進行黏著。必須說明的是，雖然在圖1A中是在第一表面S1上塗布雷射解黏膠120，以使每一微小元件130與第一表面S1之間以雷射解黏膠120進行黏著，但本發明並不以此為限，亦可僅在每一微小元件130上塗布雷射解黏膠，以使每一微小元件130與第一表面S1之間以雷射解黏膠進行黏著。並且，此處有關微小元件 與第一表面S1之間以雷射解黏膠120進行黏著的相關敘述不僅適用於微小元件130，更適用於下文中所提到的微小元件132、134。
更具體而言，載體基板110例如是玻璃基板。雷射解黏膠120的材料可包括聚醯亞胺，在波長例如是200nm至1064nm的雷射光照射下可失去黏著力，但本發明並不以此為限，亦可使用其他在雷射光照射下可失去黏著力的雷射解黏膠。在本實施例中，在第一表面S1上配置的多個微小元件130為發出相同色光的微型發光二極體，例如是紅色發光二極體，但本發明並不以此為限，亦可依操作需求選擇綠色發光二極體或藍色發光二極體。
接著，請繼續參照圖1A，令接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩140。更具體而言，接收基板100例如是驅動IC玻璃基板，光罩140的材料例如是石英玻璃或是塑膠。在圖1A中，光罩140直接配置於載體基板110的第二表面S2上，而與第二表面S2接觸，但本發明並不以此為限，光罩140亦可與載體基板110的第二表面S2保持距離，而不與第二表面S2接觸。並且，此處有關提供光罩的相關敘述不僅適用於光罩140，更適用於下文中所提到的光罩142、144、240、242、244。
之後，請參照圖1B，利用雷射裝置150對提供有光罩140的第二表面S2照射雷射光160，以使未照射到雷射光160的微小元件130a保持黏著於第一表面S1上，照射到雷射光160的微小元件130b失去黏著力而轉移至接收基板100上。更詳細而言，所 照射雷射光160的波長例如是355nm，雷射解黏膠120在波長例如是355nm的雷射光照射下可失去黏著力。當雷射光160照射提供有光罩140的第二表面S2時，光罩140的開口所對應到的微小元件130b處未受到遮蔽而照射到雷射光160，使得微小元件130b與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件130b掉落而轉移至接收基板100上。相對地，微小元件130a處受到光罩140遮蔽而未照射到雷射光160，使得微小元件130a與第一表面S1之間的雷射解黏膠120黏著力不受影響，微小元件130a仍保持黏著於第一表面S1上。
如此一來，本發明的微小元件的轉移方法不但可適用於微小尺寸(10μm以下)的微型發光二極體，更可透過光罩設計與欲解黏以轉移的微小元件相互對應，在轉移過程中選取特定位置的微型發光二極體，進而克服排解故障發光二極體位置問題。
之後，請參照圖1C，在第一表面S1上配置多個微小元件132，且每一微小元件132與第一表面S1之間以雷射解黏膠120進行黏著。在本實施例中，在第一表面S1上配置的多個微小元件132為發出相同色光的微型發光二極體，例如是綠色發光二極體，但本發明並不以此為限，亦可依操作需求選擇不同於微小元件130所發出色光的其他微型發光二極體。
請繼續參照圖1C，令已轉移有微小元件130b的接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩142，其中光罩142的材料可與光罩140的材料相同。
之後，請參照圖1D，利用雷射裝置150對提供有光罩142的第二表面S2照射雷射光160，以使未照射到雷射光160的微小元件132a保持黏著於第一表面S1上，照射到雷射光160的微小元件132b失去黏著力而轉移至接收基板100上。相似於上文圖1B所述的技術機制，在圖1D中也是利用光罩142的開口位置設計，使開口所對應到的微小元件132b處未受到遮蔽而照射到雷射光160，使得微小元件132b與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件132b掉落而轉移至接收基板100上。相對地，微小元件132a處受到光罩142遮蔽而未照射到雷射光160，使得微小元件132a與第一表面S1之間的雷射解黏膠120黏著力不受影響，微小元件132a仍保持黏著於第一表面S1上。
接下來，請參照圖1E，在第一表面S1上配置多個微小元件134，且每一微小元件134與第一表面S1之間以雷射解黏膠120進行黏著。在本實施例中，在第一表面S1上配置的多個微小元件134為發出相同色光的微型發光二極體，例如是藍色發光二極體，但本發明並不以此為限，亦可依操作需求選擇不同於微小元件130、132所發出色光的其他微型發光二極體。
請繼續參照圖1E，令已轉移有微小元件130b、132b的接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩144，其中光罩144的材料可與光罩140、142的材料相同。
之後，請參照圖1F，利用雷射裝置150對提供有光罩144的第二表面S2照射雷射光160，以使未照射到雷射光160的微小 元件134a保持黏著於第一表面S1上，照射到雷射光160的微小元件134b失去黏著力而轉移至接收基板100上。相似於上文中所述圖1B的技術機制，在圖1F中也是利用光罩144的開口位置設計，使開口所對應到的微小元件134b處未受到遮蔽而照射到雷射光160，使得微小元件134b與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件134b掉落而轉移至接收基板100上。相對地，微小元件134a處受到光罩144遮蔽而未照射到雷射光160，使得微小元件134a與第一表面S1之間的雷射解黏膠120黏著力不受影響，微小元件134a仍保持黏著於第一表面S1上。如此一來，即可完成發出不同色光的微型發光二極體(紅色發光二極體、綠色發光二極體以及藍色發光二極體)之轉移。
在以上圖1A至圖1F的第一實施例中，微小元件的轉移方法是在載體基板110上配置發出相同色光的多個微型發光二極體，但本發明並不以此為限，亦可依操作需求在載體基板110上配置發出不同色光的多個微型發光二極體，如下文圖2A至圖2F所描述的第二實施例。
圖2A至圖2F為依照本發明的第二實施例所繪示的微小元件的轉移方法的剖面示意圖。在此必須說明的是，圖2A至圖2F所示之實施例相似於圖1A至圖1F所示之實施例，因此，下述實施例將沿用前述實施例的元件標號與部分內容，其中採用相同的標號來表示相同或近似的元件，並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例，下述實施例不再重 複贅述。
首先，請參照圖2A，提供具有彼此相對的第一表面S1與第二表面S2的載體基板110，在第一表面S1上配置多個微小元件230、232、234，且每一微小元件230、232、234與第一表面S1之間以雷射解黏膠120進行黏著。必須說明的是，雖然在圖2A中是在第一表面S1上塗布雷射解黏膠120，以使每一微小元件230、232、234與第一表面S1之間以雷射解黏膠120進行黏著，但本發明並不以此為限，亦可僅在每一微小元件230、232、234上塗布雷射解黏膠，以使每一微小元件230、232、234與第一表面S1之間以雷射解黏膠進行黏著。
在本實施例中，在第一表面S1上配置的多個微小元件230、232、234為發出不同色光的微型發光二極體。舉例而言，微小元件230可以是紅色發光二極體，微小元件232可以是綠色發光二極體，微小元件234可以是藍色發光二極體。然而，但本發明並不以此為限，亦可依操作需求進行調整。
接著，請繼續參照圖2A，令接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩240，其中光罩240的材料可與上述實施例中光罩140的材料相同。
之後，請參照圖2B，利用雷射裝置150對提供有光罩240的第二表面S2照射雷射光160，以使未照射到雷射光160的微小元件232、234保持黏著於第一表面S1上，照射到雷射光160的微小元件230失去黏著力而轉移至接收基板100上。相似於上述 實施例中圖1B的技術機制，在圖2B中也是利用光罩240的開口位置設計，使開口所對應到的微小元件230處未受到遮蔽而照射到雷射光160，使得微小元件230與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件230掉落而轉移至接收基板100上。相對地，微小元件232、234處受到光罩240遮蔽而未照射到雷射光160，使得微小元件232、234與第一表面S1之間的雷射解黏膠120黏著力不受影響，微小元件232、234仍保持黏著於第一表面S1上。
接下來，請參照圖2C，令已轉移有微小元件230的接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩242，其中光罩242的材料可與光罩240的材料相同。
之後，請參照圖2D，利用雷射裝置150對提供有光罩242的第二表面S2照射雷射光160，以使未照射到雷射光160的微小元件234保持黏著於第一表面S1上，照射到雷射光160的微小元件232失去黏著力而轉移至接收基板100上。相似於上文中所述圖2B的技術機制，在圖2D中也是利用光罩242的開口位置設計，使開口所對應到的微小元件232處未受到遮蔽而照射到雷射光160，使得微小元件232與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件232掉落而轉移至接收基板100上。相對地，微小元件234處受到光罩242遮蔽而未照射到雷射光160，使得微小元件234與第一表面S1之間的雷射解黏膠120黏著力不受影響，微小元件234仍保持黏著於第一表面S1上。
然後，請參照圖2E，令已轉移有微小元件230、232的接收基板100與第一表面S1相對靠近，並於第二表面S2上提供光罩244，其中光罩244的材料可與光罩240、242的材料相同。
之後，請參照圖2F，利用雷射裝置150對提供有光罩244的第二表面S2照射雷射光160，以使照射到雷射光160的微小元件234失去黏著力而轉移至接收基板100上。相似於上文中所述圖2B的技術機制，在圖2F中也是利用光罩244的開口位置設計，使開口所對應到的微小元件234處未受到遮蔽而照射到雷射光160，使得微小元件234與第一表面S1之間的局部雷射解黏膠120失去黏著力，導致微小元件234掉落而轉移至接收基板100上。如此一來，即可完成發出不同色光的微型發光二極體(紅色發光二極體、綠色發光二極體以及藍色發光二極體)之轉移。
綜上所述，本發明的微小元件的轉移方法利用光罩搭配雷射解黏膠，透過光罩設計與欲解黏以轉移的微小元件相互對應，以有效地克服巨量轉移技術的困難點。更詳細而言，本發明的微小元件的轉移方法能夠一次大量轉移微型發光二極體，且可適用於微小尺寸(10μm以下)的微型發光二極體，更可在轉移過程中選取特定位置的微型發光二極體，以解決故障發光二極體位置問題，因此，克服了習知機械靜電吸取法或黏著膠黏取法進行巨量轉移的各種缺點。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的 精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。

Claims (8)

  1. 一種微小元件的轉移方法，包括： 提供具有彼此相對的第一表面與第二表面的載體基板，在所述第一表面上配置多個微小元件，每一所述微小元件與所述第一表面之間以雷射解黏膠進行黏著； 令接收基板與所述第一表面相對靠近，並於所述第二表面上提供光罩；以及 對提供有所述光罩的所述第二表面照射雷射光，以使未照射到雷射光的所述微小元件保持黏著於所述第一表面上，照射到雷射光的所述微小元件失去黏著力而轉移至所述接收基板上。
  2. 如申請專利範圍第1項所述的微小元件的轉移方法，更包括在所述第一表面上塗布所述雷射解黏膠，以使每一所述微小元件與所述第一表面之間以所述雷射解黏膠進行黏著。
  3. 如申請專利範圍第1項所述的微小元件的轉移方法，更包括在每一所述微小元件上塗布所述雷射解黏膠，以使每一所述微小元件與所述第一表面之間以所述雷射解黏膠進行黏著。
  4. 如申請專利範圍第1項所述的微小元件的轉移方法，其中在所述第一表面上配置的多個所述微小元件為發出相同色光的微型發光二極體。
  5. 如申請專利範圍第1項所述的微小元件的轉移方法，其中在所述第一表面上配置的多個所述微小元件為發出不同色光的微型發光二極體。
  6. 如申請專利範圍第1項所述的微小元件的轉移方法，其中所述載體基板為玻璃基板，所述接收基板為驅動IC玻璃基板。
  7. 如申請專利範圍第1項所述的微小元件的轉移方法，其中所述雷射解黏膠的材料包括聚醯亞胺。
  8. 如申請專利範圍第1項所述的微小元件的轉移方法，其中所述雷射解黏膠在波長為200 nm至1064 nm的雷射光照射下失去黏著力。
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