TWI541857B - 壓印方法和設備 - Google Patents
壓印方法和設備 Download PDFInfo
- Publication number
- TWI541857B TWI541857B TW103121712A TW103121712A TWI541857B TW I541857 B TWI541857 B TW I541857B TW 103121712 A TW103121712 A TW 103121712A TW 103121712 A TW103121712 A TW 103121712A TW I541857 B TWI541857 B TW I541857B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- photocurable composition
- condensable gas
- workpiece substrate
- gas
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 36
- 239000000203 mixture Substances 0.000 claims description 94
- 239000000758 substrate Substances 0.000 claims description 63
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 claims description 8
- 238000004049 embossing Methods 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 claims description 2
- 229940029284 trichlorofluoromethane Drugs 0.000 claims description 2
- GCDWNCOAODIANN-UHFFFAOYSA-N 1,1,1,2,2-pentafluoro-2-methoxyethane Chemical compound COC(F)(F)C(F)(F)F GCDWNCOAODIANN-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 description 81
- 239000000463 material Substances 0.000 description 9
- 238000009835 boiling Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NRNCYVBFPDDJNE-UHFFFAOYSA-N pemoline Chemical compound O1C(N)=NC(=O)C1C1=CC=CC=C1 NRNCYVBFPDDJNE-UHFFFAOYSA-N 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 methyl pentafluoroethyl ether ethanol Chemical compound 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
- B29K2033/04—Polymers of esters
- B29K2033/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013133541 | 2013-06-26 | ||
| JP2014121911A JP6494185B2 (ja) | 2013-06-26 | 2014-06-12 | インプリント方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201506996A TW201506996A (zh) | 2015-02-16 |
| TWI541857B true TWI541857B (zh) | 2016-07-11 |
Family
ID=52141903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103121712A TWI541857B (zh) | 2013-06-26 | 2014-06-24 | 壓印方法和設備 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10386717B2 (enExample) |
| EP (1) | EP3000120B1 (enExample) |
| JP (1) | JP6494185B2 (enExample) |
| KR (1) | KR101967966B1 (enExample) |
| CN (1) | CN105359254A (enExample) |
| TW (1) | TWI541857B (enExample) |
| WO (1) | WO2014208571A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015089158A1 (en) * | 2013-12-10 | 2015-06-18 | Canon Nanotechnologies, Inc. | Imprint lithography template and method for zero-gap imprinting |
| WO2016136240A1 (en) * | 2015-02-27 | 2016-09-01 | Canon Kabushiki Kaisha | Nanonimprint liquid material, method for manufacturing nanoimprint liquid material, method for manufacturing cured product pattern, method for manufacturing optical component, and method for manufacturing circuit board |
| JP6632200B2 (ja) | 2015-02-27 | 2020-01-22 | キヤノン株式会社 | パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法 |
| JP2016162863A (ja) * | 2015-02-27 | 2016-09-05 | キヤノン株式会社 | パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法 |
| JP2016164977A (ja) * | 2015-02-27 | 2016-09-08 | キヤノン株式会社 | ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法 |
| JP6562707B2 (ja) * | 2015-05-13 | 2019-08-21 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| US10562223B2 (en) * | 2015-10-29 | 2020-02-18 | National Institute Of Advanced Industrial Science And Technology | Imprint device |
| JP6643048B2 (ja) * | 2015-11-09 | 2020-02-12 | キヤノン株式会社 | 基板を処理する装置、物品の製造方法、および気体供給経路 |
| US11194247B2 (en) | 2018-01-31 | 2021-12-07 | Canon Kabushiki Kaisha | Extrusion control by capillary force reduction |
| JP7278828B2 (ja) * | 2019-03-26 | 2023-05-22 | キヤノン株式会社 | 成形方法、成形装置、インプリント方法、および物品の製造方法 |
| EP4084044A4 (en) | 2019-12-25 | 2024-06-05 | Scivax Corporation | PRINTING DEVICE AND PRINTING METHOD |
| JP7581033B2 (ja) * | 2020-12-11 | 2024-11-12 | キヤノン株式会社 | インプリント装置、インプリント方法、物品の製造方法、およびコンピュータプログラム |
| TWI898644B (zh) * | 2024-06-07 | 2025-09-21 | 志聖工業股份有限公司 | 壓合裝置 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01229024A (ja) | 1988-03-08 | 1989-09-12 | Mitsubishi Rayon Co Ltd | 光硬化性被覆組成物 |
| TW430672B (en) | 1997-07-03 | 2001-04-21 | Sumitomo Chemical Co | A photo-curing resin composition for DVD |
| JP4011811B2 (ja) | 2000-01-14 | 2007-11-21 | Ｊｓｒ株式会社 | 光硬化性樹脂組成物及び光学部材 |
| JP3700001B2 (ja) * | 2002-09-10 | 2005-09-28 | 独立行政法人産業技術総合研究所 | インプリント方法及び装置 |
| JP2007144995A (ja) | 2005-10-25 | 2007-06-14 | Dainippon Printing Co Ltd | 光硬化ナノインプリント用モールド及びその製造方法 |
| KR100790899B1 (ko) * | 2006-12-01 | 2008-01-03 | 삼성전자주식회사 | 얼라인 마크가 형성된 템플릿 및 그 제조 방법 |
| JP5020844B2 (ja) * | 2007-02-06 | 2012-09-05 | キヤノン株式会社 | インプリント方法及びインプリント装置、インプリント方法を用いた部材の製造方法 |
| KR20090027169A (ko) | 2007-09-11 | 2009-03-16 | 후지필름 가부시키가이샤 | 나노임프린트용 경화성 조성물, 경화물 및 그 제조 방법 |
| US8119052B2 (en) | 2007-11-02 | 2012-02-21 | Molecular Imprints, Inc. | Drop pattern generation for imprint lithography |
| NL2003762A (en) * | 2008-11-18 | 2010-05-20 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| KR101560249B1 (ko) | 2009-06-19 | 2015-10-14 | 닛산 가가쿠 고교 가부시키 가이샤 | 저유전율 임프린트 재료 |
| JP5364533B2 (ja) * | 2009-10-28 | 2013-12-11 | 株式会社東芝 | インプリントシステムおよびインプリント方法 |
| JP5546893B2 (ja) | 2010-02-16 | 2014-07-09 | 東京エレクトロン株式会社 | インプリント方法 |
| JP2011222732A (ja) * | 2010-04-09 | 2011-11-04 | Fujifilm Corp | パターン形成方法及びパターン基板製造方法 |
| WO2012002413A1 (ja) | 2010-07-02 | 2012-01-05 | 株式会社トクヤマ | 光硬化性インプリント用組成物及び該組成物を用いたパターンの形成方法 |
| JP5762245B2 (ja) | 2010-10-20 | 2015-08-12 | 株式会社トクヤマ | 光硬化性ナノインプリント用組成物、該組成物を用いたパターンの形成方法、及び該組成物の硬化体を有するナノインプリント用レプリカ金型 |
| EP2490151A1 (en) * | 2011-02-17 | 2012-08-22 | Nagravision S.A. | Method and device to speed up face recognition |
| JP5679850B2 (ja) * | 2011-02-07 | 2015-03-04 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP5829177B2 (ja) | 2011-07-12 | 2015-12-09 | 富士フイルム株式会社 | インプリント用硬化性組成物、パターン形成方法およびパターン |
| JP5710553B2 (ja) | 2011-08-25 | 2015-04-30 | 富士フイルム株式会社 | インプリント用硬化性組成物、パターン形成方法およびパターン |
| JP2013070033A (ja) * | 2011-09-05 | 2013-04-18 | Canon Inc | インプリント装置、インプリント方法及び物品の製造方法 |
| TWI471693B (zh) | 2011-11-10 | 2015-02-01 | Canon Kk | 光可固化組成物，及使用彼之圖案化方法 |
| JP5882922B2 (ja) | 2012-01-19 | 2016-03-09 | キヤノン株式会社 | インプリント方法、およびインプリント装置 |
| JP6071312B2 (ja) | 2012-08-03 | 2017-02-01 | 株式会社東芝 | テンプレート作製方法、パターン形成方法、半導体素子の製造方法、テンプレート製造装置、及びテンプレート材料 |
| JP6278645B2 (ja) | 2012-09-24 | 2018-02-14 | キヤノン株式会社 | 光硬化性組成物及びこれを用いた膜の製造方法 |
| US20140239529A1 (en) * | 2012-09-28 | 2014-08-28 | Nanonex Corporation | System and Methods For Nano-Scale Manufacturing |
| JP6748399B2 (ja) | 2012-11-30 | 2020-09-02 | キヤノン株式会社 | インプリント方法およびインプリント用硬化性組成物 |
| JP6305058B2 (ja) | 2013-03-05 | 2018-04-04 | キヤノン株式会社 | 感光性ガス発生剤、光硬化性組成物 |
-
2014
- 2014-06-12 JP JP2014121911A patent/JP6494185B2/ja active Active
- 2014-06-18 KR KR1020167001312A patent/KR101967966B1/ko active Active
- 2014-06-18 CN CN201480036290.3A patent/CN105359254A/zh active Pending
- 2014-06-18 WO PCT/JP2014/066753 patent/WO2014208571A1/en not_active Ceased
- 2014-06-18 EP EP14818394.0A patent/EP3000120B1/en active Active
- 2014-06-18 US US14/900,126 patent/US10386717B2/en active Active
- 2014-06-24 TW TW103121712A patent/TWI541857B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014208571A1 (en) | 2014-12-31 |
| CN105359254A (zh) | 2016-02-24 |
| EP3000120B1 (en) | 2022-01-12 |
| US10386717B2 (en) | 2019-08-20 |
| JP6494185B2 (ja) | 2019-04-03 |
| US20160147143A1 (en) | 2016-05-26 |
| TW201506996A (zh) | 2015-02-16 |
| KR101967966B1 (ko) | 2019-04-10 |
| JP2015029073A (ja) | 2015-02-12 |
| KR20160021274A (ko) | 2016-02-24 |
| EP3000120A1 (en) | 2016-03-30 |
| EP3000120A4 (en) | 2017-03-15 |
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