TW200923003A - Curable composition for nanoimprint, cured product and production method thereof - Google Patents

Curable composition for nanoimprint, cured product and production method thereof Download PDF

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Publication number
TW200923003A
TW200923003A TW097134654A TW97134654A TW200923003A TW 200923003 A TW200923003 A TW 200923003A TW 097134654 A TW097134654 A TW 097134654A TW 97134654 A TW97134654 A TW 97134654A TW 200923003 A TW200923003 A TW 200923003A
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TW
Taiwan
Prior art keywords
composition
group
acrylate
meth
general formula
Prior art date
Application number
TW097134654A
Other languages
Chinese (zh)
Inventor
Akinori Fujita
Takashi Takayanagi
Original Assignee
Fujifilm Corp
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Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200923003A publication Critical patent/TW200923003A/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0834Compounds having one or more O-Si linkage
    • C07F7/0838Compounds with one or more Si-O-Si sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

This invention is to provide a curable nanoimprint composition offering cured materials of excellent transparency. The curable nanoimprint composition comprises (A) a monomer having at least 2 curable functional groups of different reactivity in a molecule, and (C) an antioxidant.

Description

200923003 九、發明說明: 【發明所屬之技術領域】 本發明係關於奈米壓印用硬化性組成物、硬化物及其製 法,以及使用該硬化物之液晶顯示裝置用構件及其製法。 【先前技術】 奈米壓印法係光碟製作上習知的壓紋技術經發展,將形 成有凹凸圖案之原模(一般稱爲模具、壓模、模板)按壓於 光阻使其力學變形,精密轉印微細圖案之技術。一旦製作 出模具,即可簡單重複成形出奈米構造等之微細構造,係 具經濟性,同時有害廢棄物少之加工技術;近年來,於各 種領域之應用受到期待。 奈米壓印法有二種提議,以熱塑性樹脂用作被加工材料 (S. Chou 等人:Appl. Phys. Lett.第 67,3114 卷( 1 9 9 5 )),與 使用光奈米壓印用硬化性組成物(M. Colbun等人:Pr〇c. SPIE,第3 67 6,379卷( 1 999))。熱式奈米壓印者係將模具按 壓於加熱至玻璃轉移溫度以上之高分子樹脂,冷卻後將模 具脫離以轉印微細構造於基板上之樹脂。因多種樹脂材 料、玻璃材料皆可採用,於各方面之應用受到期待。例如, 美國專利第5,77 2,905號公報、美國專利第5,95 6,2 1 6號公 報揭示:使用熱塑性樹脂的廉價形成奈米圖案之奈米壓印 法。 而通過透明模具照射光,使光奈米壓印用硬化性組成物 光硬化之光奈米壓印方式,則使室溫壓印成爲可能。最近 尙有,組合此二者之優點的奈米澆鑄法、製作三維積層構 200923003 造之反轉壓印法等新發展的報告。如此之奈米壓印法,可 想見會有以下應用。第一,成形品本身具有功能,可應用 作各種奈米科技之要素零件者,有各種微•奈米光學元件、 高密度記錄媒體、光學薄膜、平面顯示器之構造構件等。 第二,藉由微米構造與奈米構造之同時一體成形,或簡單 之層間位置配合構築出積層構造,以能應用於// -TAS、生 物晶片之製作者。第三,藉由高精度位置配合與高度積體 化,取代習知光微影術,而能採用於高密度半導體積體電 路之製作,或液晶顯示器電晶體的製造等者。近年來,關 於這些應用之奈米壓印法的實用化開發,正日漸活躍。 首先說明奈米壓印法的適用例,製作高密度半導體積體 電路之應用例。近年來,半導體積體電路之微細化、積體 化已有進步,用以實現其微細加工之圖案轉印技術,光微 影裝置之高精度化有所進展。可是,加工方法因逼近曝光 光源之波長,光微影術亦接近極限。因而,爲更促進微細 化、高精度化,取代光微影術,已有荷電粒子束裝置之一 種,電子束描繪裝置的採用。使用電子束之圖案形成,異 於使用1線、準分子雷射等光源之圖案形成中的一括曝光 法,係採取逐步描繪光罩圖案之方法,故所描繪之圖案愈 多則曝光(描繪)愈耗時,耗時的圖案形成於是成爲缺點。 因而,隨積體度由256M、1G至4G之飛躍提高’圖案形成 時間亦按比例飛躍加長,有產能顯著劣化之虞。故爲電子 束描繪裝置的高速化,有組合各種形狀之光罩’一括照射 電子束以形成複雜形狀的電子束之一括圖形照射法的開 發。然而,圖案微細化之另一方面,電子束描繪裝置需予 200923003 大型化,更高精度控制光罩位置之機構亦成必要,而有裝 置成本升高之缺點。 相對於此,有以奈米壓印作爲低成本形成微細圖案之技 術的提議。例如,美國專利第5,772,905號公報、美國專利 第5,2 5 9,926號公報揭示,以矽晶圓用作壓模,藉轉印形成 25奈米以下之微細構造的奈米壓印技術。 日本專利特表2005 -5 27 1 1 0號公報揭示,適用於半導體 微影領域的奈米壓印所用之複合組成物。而微細模具製作 技術、模具耐久性、模具製作成本、模具自樹脂的剝離性、 壓印均勻性、對準精度、檢查技術等,爲採用於半導體積 體電路製造之探討已開始活躍起來。 其次說明,於液晶顯示器(LCD)、電漿顯示器(PDP)等平 面顯示器的奈米壓印之應用例。 隨著LCD基板、PDP基板之趨於大型化、高精細化,作 爲取代製造薄膜電晶體(TFT)、電極板時所用之習知光微影 法的廉價微影法,光奈米壓印近年來多受囑目。因而必須 開發出取代用於習知光微影法之蝕刻光阻的光硬化性光 阻。 又,作爲LCD等之構造構件,特開2005-1 97699號公報、 特開2005 -30 1 289號公報所述之透明保護膜材料,或特開 2 0 0 5 - 3 0 1 2 8 9號公報所述的,光奈米壓印在間隔物等之應用 的探討亦已開始。如此之構造構件用的光阻異於上述蝕刻 光阻,因最終餘留在顯不器內,可§胃永久光阻或永久膜。 兹說明採用習知光微影之永久膜。永久膜係異於該触刻 光阻,直接餘留在平面顯示面板等之要素。茲具體說明用 200923003 於TFT基板上之永久膜。液晶面板者,於玻璃基板上形成 薄膜電晶體,於其上形成保護薄膜電晶體之透明保護膜層 (永久膜)。並以濺鍍設置電壓驅動液晶之透明電極 ITO(銦•錫氧化物)。該保護膜爲使薄膜電晶體與ITO能作 電接觸,於ITO濺鍍前經光微影形成接觸孔,並藉後烘烤 硬化以確保耐熱性。材料多使用正型光阻。 其次說明彩色濾光片用透明永久膜。一般液晶顯示器 中,於玻璃基板上形成使用含氧化鉻、碳黑之光阻的黑矩 陣,繼之於前面形成R、G、B彩色濾光片層。於此彩色濾 光片上塗布光硬化性樹脂等,以光微影去除電極拉出部 等,並經後烘烤之加熱處理,形成保護膜(永久膜)。彩色 濾光片用永久膜可減少彩色濾光片之層間落差,並提升透 明電極ITO於濺鍍製膜時之高溫處理耐抗性。 向來,彩色濾光片用永久膜者,係使用矽氧烷聚合物、 聚矽酮聚醯亞胺、環氧樹脂、丙烯醯樹脂等光硬化性樹脂、 熱硬化性樹脂形成彩色濾光片用永久膜(特開2000-397 1 3 號公報、特開平6-43 643號公報)。 於設在薄膜電晶體上,或彩色濾光片上之永久膜的形 成,有塗膜均勻性、基板密著性、至少超過2 0 0 °C的加熱處 理後之高透光性、平坦化特性、耐溶劑性、耐擦傷性等特 性之要求。 規定液晶顯示器的元件間隙之間隔物亦係永久膜的一 種,於習知光微影,一般廣泛採用由樹脂、光聚合性單體 及引發劑組成之光硬化性組成物(特開2004-24024 1號公 報)。間隔物一般係於彩色濾光片基板上形成彩色濾光片 200923003 後,或形成該彩色濾光片用保護膜後,塗布光硬化性 物,由光微影形成10〜20/zm左右之圖案,再經後烘烤 硬化所形成。 於間隔物有對於外部壓力具高機械特性、硬度、 性 '圖案精度、密著性等性能之要求。 然而’目前爲止使用於奈米壓印之透明保護膜,或 形成間隔物之光硬化性組成物的較佳組成物一槪未 不 ° 而關於塗膜均勻性,因基板之大型化,關於基板中 與周邊部之塗布膜厚均勻性,或隨高解析度化的尺寸 性、膜厚、形狀等種種部分已有嚴苛要求。向來,使 型玻璃基板之液晶顯示元件製造領域中,光阻塗布法 中央滴下後旋轉之方法(Electronic Journal 121-123 (2002))。中央滴下後旋轉的塗布法雖可得良好之塗布 性,而例如’ 1 m見方級之大型基板者,旋轉時甩出之 光阻量相當多,並產生高速旋轉所致之基板破裂、賦 間之確保問題。中央滴下後旋轉之方法中,塗布性能 於旋轉時的旋轉速度與光阻塗布量,欲採用於更大型 5代基板’則若無可得必要加速度之泛用馬達,須特 製該等馬達而有成本加大之問題。基板、裝置尺寸大g 例如塗布均勻度±3%,賦黏時間60〜70秒/片等,塗布 中之要求性能幾乎無法變動,故藉中央滴下後旋轉 法’塗布均勻性以外之要求向來難以對應。基於如此ij 適用於4代基板起’尤以5代基板起之大型基板的新 塗布法者’有吐出噴嘴式光阻塗布法之提議。吐出噴 組成 加熱 顯像 用以 見揭 央部 均勻 用小 係採 No.8 均勻 廢棄 黏時 取決 化之 地訂 ί化, 步驟 的方 Ϊ狀, 光阻 嘴式 200923003 光阻塗布法係使吐出噴嘴與基板相對移動,於基板塗布面 全面塗布光阻組成物之方法,有使用例如,具有複數噴孔 排成列之吐出口、狹縫狀吐出口的,可以帶狀吐出光阻組 成物之吐出噴嘴的方法等之提議。並有以吐出噴嘴式於基 板塗布面全面塗布光阻組成物後,使該基板旋轉調整膜厚 之方法的提議。因此,爲由奈米壓印組成物取代經習知光 微影術之光阻,以適用於這些液晶顯示元件製造領域,則 往基板之塗布均勻性變得重要。 用於製作半導體積體電路、液晶顯示器之正型光阻,製 作彩色濾光片用之顏料分散光阻等,已知係添加氟系及/或 矽酮系界面活性劑以解決塗布性問題,具體而言即基板上 塗布時所產生之輝紋、鱗狀模樣(光阻膜乾燥不勻)等塗布 缺失(特開平7-230165號公報、特開2000-181055號公報、 特開2004-9424 1號公報)。爲改良光碟、光磁碟等之保護膜 的磨耗性、塗布性,有添加氟系、矽酮系界面活性劑於無 溶劑系光硬化性組成物之揭示(特開2 0 0 4 - 9 4 2 4 1號公報、特 開平4-149280號公報、特開平7-62043號公報、特開 2001-93192號公報)。同樣已知於特開2005-8759號公報, 爲改良噴墨用組成物之墨料吐出安定性,添加非離子氟系 界面活性劑。特開2003 - 1 6593 0號公報揭示,以刷毛、筆、 棒塗機等作厚膜塗布之塗漆組成物以全相圖加工用模具作 壓紋加工之際’添加含有聚合性不飽和雙鍵之界面活性劑 1 %以上,較佳者3 %以上,改良硬化膜之水膨潤性的例子。 如此,於正型光阻、彩色濾光片製作用顏料分散光阻、光 磁碟等之保護膜添加界面活性劑,改良塗布性之技術,屬 -10- 200923003 習知技術。如由該噴墨、塗漆組成物之例可見,於無溶劑 系光硬化性樹脂添加界面活性劑,爲改良各用途中之特性 而添加界面活性劑之技術亦係已知。特開2007-84625號公 報揭示,製作半導體積體電路時,以含氟系界面活性劑之 光硬化性樹脂,用作光奈米壓印法之蝕刻光阻的例子。 然而,不以用於永久膜之顏料、染料、有機溶劑爲必要 成分之光硬化性奈米壓印光阻組成物的基板塗布性提升方 法,卻尙無所知。 光奈米壓印必須改良模具凹腔內之組成物流動性,並需 改良模具之剝離性、模具與光阻間之剝離性、光阻與基板 間之密著性。該流動性、剝離性、密著性不易兼顧。 茲更詳細說明關於光奈米壓印之習知技術。光奈米壓印 一般係於矽晶圓、石英、玻璃、薄膜或其它材料,例如陶 瓷材料、金屬或聚合物等基板上,以具有約數十奈米至數 十微米之圖案尺寸的微細凹凸之模具抵按加壓,加壓狀態 下照射光使組成物硬化後,自塗膜脫離模具,得轉印圖案 之方法。爲此,爲順利照射光光奈米壓印時,基板或模具 之至少其一須係透明。通常一般係由模具側照射光,模具 材料多採用石英、藍寶石等透UV之無機材料或透光性樹 脂等。 由模具側照射光,於本身具遮光性之基板(具體而言用 於LCD之彩色濾光片)上,以光奈米壓印法構築構造體時有 效。 光奈米壓法,相對於熱奈米壓印法有(1)不需加熱/冷卻 程序,可期待高產能,(2)因使用液態組成物,低度加壓即 -11 - 200923003 可壓印,(3)無熱膨脹所致之尺寸變化,(4)模具透明而易於 對準,(5)硬化後可得強韌之三維交聯體等主要優點。尤適 於有對準精度之要求的半導體微細加工用途、平面顯示器 領域之微細加工用途。 光奈米壓印法之其它特徵有,較諸通常之光微影,因解 析度獨立於光源波長,奈米級之微細加工時,不必步進機、 電子束描繪裝置等昂貴裝置。另一方面,光奈米壓印必須 要有等倍模具,因模具與樹脂接觸,模具之耐久性、成本 需加考慮。 如此,採用熱及/或光奈米壓印法,大面積壓印微米或 奈米大小之圖案時,不只按抵壓力之均勻性、原盤(模具) 之平坦性等要求,前敘組成物往模具凹腔內之流動性、壓 合流出的組成物特性亦需加以控制。 用於光奈米壓印之模具可由各種材料,例如金屬、半導 體、陶瓷、SOG(SpinOnGlass)或特定之塑膠製造。有例如, 國際公開 W099/22849號小冊之具有所欲微細構造的柔軟 聚二甲基矽氧烷模具之提議。此模具因於一表面形成三維 構造體,依構造體之大小及其解析度規格,可使用種種微 影法。電子束及X線微影通常用於未達3 00nm之構造體尺 寸。雷射直接曝光及UV微影則用於較大構造體。 關於光奈米壓印法,模具與光奈米壓印用硬化性組成物 之剝離性極爲重要,模具、模具表面處理,具體而言’使 用氫化倍半矽氧烷、氟化乙烯丙烯共聚物模具以爲解決附 著問題之嘗試等,尙屬未有。 於此,說明用於光奈米壓印的光硬化性樹脂。適用於奈 -12- 200923003 米壓印之光硬化性樹脂因反應機制不同,可大別爲自由基 聚合型與離子聚合型,或這些之混成型。任一組成物皆可 壓印,一般係用材料選擇範圍寬廣的自由基聚合型(F. Xu 等人:SPIE Microlithography Conference, 5374, 232(2004))。 自由基聚口型一般係用含具可自由基聚合之乙嫌基、(甲基) 丙烯醯基的單體(m ο η 〇 m e r)或低聚物與光聚合引發劑之組 成物。照射光則由光聚合引發劑產生之自由基攻擊乙烯基 而進行連鎖聚合,形成聚合物。以二官能以上之多官能基 … 單體或低聚物用作成分則得交聯構造體。D.;L Resnick等 人:J. Vac. Sci. Technol. B,Vol. 21. No. 6,2624(2003)揭 示,使用低黏度之UV可硬化單體,而能低壓、室溫壓印 之組成物。 1 茲詳細說明用於光奈米壓印之材料的特性。材料之要求 特性隨用途而異,程序特性則無關所欲用途而係共通。例 如’最新光阻材料手冊,第1、103至104頁(2005年,情 報機構出版)所示之主要要求項目係塗布性、基板密著性、 低黏度(<5mPa · s)、剝離性、低硬化收縮率、速硬化性等。 尤以於低壓壓印、殘膜率低減之必要用途,已知高度要求 低黏度材料。依用途而異之要求特性有例如關於光學構件 之折射率、透光性等,關於蝕刻光阻的耐蝕刻性、殘膜厚 度低減等。這些要求特性如何控制及取得諸特性之均衡乃 材料設計之關鍵。至少程序材料與永久膜因要求特性大爲 不同,材料必須依程序、用途開發。適於如此之光奈米壓 印用途的材料已知有,最新光阻材料手冊,第1、1 03至1 04 頁(2 0 0 5年,情報機構出版)所示之黏度約6 0 m P a · s (2 5 t ) -13- 200923003 的光硬化性材料。同樣,C M C出版:奈米壓印之開發與應 用第159至160頁(2006)揭示,以甲基丙烯酸單酯爲主要成 分之黏度14.4mPa · s,剝離性經提升的含氟感光性樹脂。 如此,雖有關於用在光奈米壓印之組成物,關於黏度之 期望的記載,而有關適合各用途之材料的設計指南則尙未 見報告。 茲說明目前爲止用於光奈米壓印之光硬化性樹脂的例 子。特開2004- 5 98 20號公報、特開2004 -5 9 8 22號公報揭示, 使用製作浮彫型全相圖、繞射格子用之含有具異氰酸酯基 的聚合物之光硬化性樹脂,作壓紋加工之例。特開 2006- 1 1 4 8 82號公報揭示,含聚合物、光聚合引發劑、黏度 調整劑之光奈米壓印用硬化性組成物。 特開2000- 1 4 3 924號公報揭示,爲改良與模具之剝離 性,使用含氟硬化性材料的圖案形成方法。 特開2007 - 1 865 70號公報揭示,爲賦予乾式蝕刻性,使 用含環狀構造之(甲基)丙烯酸酯單體的奈米壓印用光硬化 性組成物。 N. Sakai 等人:J. Photopolymer Sci· Technol.第 18 卷’ 第4號,53 1 (2005 )揭示,以(1)官能性丙烯醯單體,(2)官 能性丙烯醯單體,(3 )組合官能性丙烯醯單體與光聚合引 發劑之光硬化性自由基聚合性組成物,或含光硬化性環氧 化合物與光酸產生劑之光陽離子聚合性組成物等用於奈米 壓印,探討熱安定性、模具剝離性之例子。 M. Stewart 等人:MRS Buletin,第 30 卷,第 12 號 947 (2005) 專注於改良光硬化性樹脂與模具之剝離性、硬化後之膜收 -14- 200923003 縮性、氧存在下之光聚合妨礙所致之低感度化等問題,揭 示含(1)官能性丙烯醯單體,(2)官能性丙烯醯單體、含矽酮 之一官能丙烯醯單體及光聚合引發劑的光奈米壓印用硬化 性組成物。 T.Beiley 等人:J. Vac. Sci.Technol.B 1 8 (6), 3 5 7 2(2000) 揭示,將含一官能丙烯醯單體、含矽酮之一官能丙烯醯單 體與光聚合引發劑的光奈米壓印用硬化性組成物形成於矽 基板上,使用經表面處理之模具,減少光奈米壓印成形後 之缺陷。 B. Vratzov 等人:J· Vac. Sci. Technol. B21(6),2760(2003) 揭示,將含矽酮單體、三官能丙烯醯單體與光聚合引發劑 之光奈米壓印用硬化性組成物形成於矽基板上,利用Si〇2 模具的解析度高,塗布均勻性優良之組成物。 E. K. Kim 等人:J. Vac. Sci. Technol. B22(l),131(2004) 揭示,以特定之乙烯醚化合物與光酸產生劑組合成之陽離 子聚合性組成物形成50nm圖案尺寸之例。其記載,雖有黏 性低,硬化速度快之特徵,但模板剝離性仍係課題。 而如 N. Sakai 等人:J. Photopolymer Sci. Technol.第 18 卷,第 4 號 5 3 1 (2005 ),M. Stewart 等人:MRS Buletin,第 30 卷,第 12 號,947 (2005)、T. Beiley 等人:J. Vac. Ξοΐ-Τ e c h η ο 1. B 1 8 ( 6) , 3 5 7 2 ( 2 0 0 0) 、 B . V r a t z o v 等人:J · V a c . S c i. Technol. B2 1 (6), 2760(2003 )、E. K. Kim 等人:J. Vac. Sci. Technol.B22(l), 131(2004)所示,雖有採用官能基不同之丙 烯醯單體、丙烯醯系聚合物、乙烯醚化合物於光奈米壓印 的光硬化性樹脂之種種揭示,而作爲組成物之較佳種類, -15- 200923003 最適單體種類,單體之組合,單體或光阻之最適黏度,較 佳光阻溶液物性,光阻塗布性改良等關於材料設計之指南 則全然未見揭示。因而實況係,於光奈米壓印用途,能使 組成物廣爲採用之較佳組成物尙在未知,能切實令人滿意 之光奈米壓印光阻組成物至今仍未見提議。 記載有組成物之 B. Vratzov 等人:J. Vac. Sci. Technol. B2 1 (6), 2760(2003)、Ε· K. Kim 等人:J. Vac. Sci. Technol. B22(l), 131(2004)的組成物中,雖也有低黏度者,但光硬化 形成圖案,繼之經加熱處理時硬化膜的透過率低(著色), 硬度亦不足,無法實用作永久膜。組成物未爲所知。[Technical Field] The present invention relates to a curable composition for nanoimprint, a cured product, a method for producing the same, and a member for a liquid crystal display device using the cured product, and a method for producing the same. [Prior Art] The embossing technique of the conventional embossing method for optical disc production has been developed, and the original mold (generally called a mold, a stamper, a template) having a concave-convex pattern is pressed against the photoresist to cause mechanical deformation thereof. The technology of precision transfer of fine patterns. Once the mold is produced, it is possible to easily reproduce a fine structure such as a nanostructure, which is economical and has a processing technique that is less harmful to waste. In recent years, applications in various fields have been expected. There are two proposals for nanoimprinting, using thermoplastic resins as materials to be processed (S. Chou et al.: Appl. Phys. Lett., Vol. 67, 3114 (19.9)), and using photon pressure. A hardenable composition is printed (M. Colbun et al.: Pr.c. SPIE, Vol. 3, 67, 379 (1, 999)). The hot type nano embossing presses the mold to a polymer resin heated to a temperature higher than the glass transition temperature, and after cooling, the mold is detached to transfer the resin finely structured on the substrate. Since a variety of resin materials and glass materials can be used, applications in various fields are expected. For example, U.S. Patent No. 5,772,905, and U.S. Patent No. 5,95,2,166, the disclosure of which is incorporated herein by reference. Further, by irradiating light through a transparent mold and photo-hardening the light-hardening composition of the photo-nano imprinting composition, room temperature imprinting is possible. Recently, there have been reports on new developments such as the nano-casting method combining the advantages of the two, and the production of the three-dimensional laminated structure 200923003. With such a nanoimprint method, you can imagine the following applications. First, the molded article itself has functions and can be applied to various elemental components of nanotechnology, and various micro-nano optical components, high-density recording media, optical films, structural members of flat displays, and the like. Secondly, the micron structure and the nanostructure are integrally formed at the same time, or a simple interlayer structure is used to construct a laminate structure, which can be applied to a producer of //TAS or a biochip. Thirdly, it can be used for the fabrication of high-density semiconductor integrated circuits or the manufacture of liquid crystal display transistors by replacing the conventional photolithography with high-precision position matching and high integration. In recent years, the practical development of the nanoimprint method for these applications is becoming increasingly active. First, an application example of the nanoimprint method will be described, and an application example of a high-density semiconductor integrated circuit will be described. In recent years, the miniaturization and integration of semiconductor integrated circuits have progressed, and the pattern transfer technology for microfabrication has been realized, and the precision of the photolithographic apparatus has progressed. However, the photolithography approaching the limit due to the approaching approach to the wavelength of the exposure source. Therefore, in order to further promote miniaturization and high precision, instead of photolithography, one of the charged particle beam devices and the use of an electron beam drawing device have been used. The pattern formation using the electron beam is different from the one in the pattern formation using a light source such as a 1-line or excimer laser, and the method of gradually drawing the mask pattern is adopted, so that the more the pattern is drawn, the exposure (drawing) is performed. The more time consuming, time consuming pattern formation becomes a disadvantage. Therefore, as the degree of integration increases from 256M, 1G to 4G, the pattern formation time is also prolonged in proportion, and there is a significant deterioration in productivity. Therefore, in order to increase the speed of the electron beam drawing device, there is a combination of various types of photomasks including an electron beam which is irradiated with an electron beam to form a complicated shape, and the development of the pattern irradiation method. On the other hand, on the other hand, the electron beam drawing device needs to be enlarged in 200923003, and a mechanism for controlling the position of the mask with higher precision is also necessary, and there is a disadvantage that the cost of the device is increased. On the other hand, there is a proposal to use nanoimprint as a technique for forming a fine pattern at a low cost. For example, U.S. Patent No. 5,772,905 and U.S. Patent No. 5,259,926 disclose the use of a tantalum wafer as a stamper to form a nano-imprint technique of a fine structure of 25 nm or less. Japanese Patent Laid-Open Publication No. 2005-5-27119 discloses a composite composition for nanoimprinting in the field of semiconductor lithography. The micro-mold making technology, mold durability, mold manufacturing cost, mold peelability from resin, imprint uniformity, alignment accuracy, inspection technology, etc., have begun to be active in the use of semiconductor integrated circuit manufacturing. Next, an application example of nanoimprinting for a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP) will be described. As the LCD substrate and the PDP substrate tend to be larger and more refined, the photolithographic embossing method has been used in recent years as an inexpensive lithography method which replaces the conventional photolithography method for manufacturing a thin film transistor (TFT) or an electrode plate. Received attention. Therefore, it has been necessary to develop a photocurable photoresist which replaces the etching photoresist for the conventional photolithography method. Further, as a structural member such as an LCD, the transparent protective film material described in Japanese Laid-Open Patent Publication No. 2005-1 97699, No. 2005-30 No. 289, or the special opening No. 2 0 0 5 - 3 0 1 2 8 9 As discussed in the bulletin, the discussion of the application of photon imprinting to spacers and the like has also begun. The photoresist used for such a structural member is different from the above-described etching photoresist, and may eventually remain in the display, and may be a permanent photoresist or a permanent film. A permanent film using conventional photolithography is described. The permanent film is different from the touch resist and directly remains on the elements such as the flat display panel. The permanent film on the TFT substrate using 200923003 is specifically described. In the liquid crystal panel, a thin film transistor is formed on the glass substrate, and a transparent protective film layer (permanent film) for protecting the thin film transistor is formed thereon. The liquid crystal transparent electrode ITO (indium tin oxide) is driven by a sputtering voltage. The protective film is such that the thin film transistor can be electrically contacted with the ITO, and the contact hole is formed by photolithography before the ITO sputtering, and is post-baked and hardened to ensure heat resistance. Positive materials are used for materials. Next, a transparent permanent film for a color filter will be described. In a general liquid crystal display, a black matrix using a photoresist containing chromium oxide and carbon black is formed on a glass substrate, followed by formation of R, G, and B color filter layers on the front side. The color filter is coated with a photocurable resin or the like, and the electrode drawing portion or the like is removed by photolithography, and subjected to post-baking heat treatment to form a protective film (permanent film). The permanent film for the color filter can reduce the interlayer drop of the color filter and improve the high-temperature processing resistance of the transparent electrode ITO when it is sputtered. In the case of a permanent color filter for color filters, a color filter is used to form a color filter using a photocurable resin such as a decyl alkoxylate polymer, a polyfluorene ketone polyimide, an epoxy resin or an acryl resin, or a thermosetting resin. A permanent film (Japanese Unexamined Patent Publication No. Hei. No. 2000-3971-3, No. Hei 6-43 643). The formation of a permanent film on a thin film transistor or a color filter has uniformity of coating film, adhesion of the substrate, high light transmittance after heat treatment at least over 200 ° C, and flattening Characteristics of characteristics, solvent resistance, and scratch resistance. The spacer which defines the gap of the element of the liquid crystal display is also a kind of permanent film. In the conventional photolithography, a photocurable composition composed of a resin, a photopolymerizable monomer and an initiator is generally widely used (Specially Opened No. 2004-24024 No. 1) Bulletin). The spacer is generally formed on a color filter substrate to form a color filter 200923003, or after forming a protective film for the color filter, a photocurable material is applied, and a pattern of about 10 to 20/zm is formed by photolithography. And formed by post-baking hardening. The spacer has requirements for high mechanical properties, hardness, and 'pattern accuracy, adhesion, and the like for external pressure. However, the present invention has been used for the transparent protective film of nanoimprint or the preferred composition of the photocurable composition for forming a spacer, and the uniformity of the coating film, due to the enlargement of the substrate, regarding the substrate There are strict requirements for uniformity of coating film thickness in the middle and peripheral portions, or various dimensions such as dimensionality, film thickness, and shape with high resolution. In the field of manufacturing a liquid crystal display element of a glass substrate, a method in which the photoresist coating method is dropped after the center is applied (Electronic Journal 121-123 (2002)). Although the coating method of rotating after the center dripping can obtain good coatability, for example, a large substrate of '1 m square, the amount of light resisted during rotation is quite large, and the substrate is broken and caused by high-speed rotation. To ensure the problem. In the method of rotating after the center is dripped, the coating speed is rotated at the time of rotation and the amount of photoresist applied. If it is to be used in a larger 5th generation substrate, then if there is no general-purpose motor with the necessary acceleration, the motor must be specially made. The problem of increasing costs. The size of the substrate and the device is large, for example, the coating uniformity is ±3%, the bonding time is 60 to 70 seconds/piece, etc., and the required performance in coating is almost impossible to change. Therefore, it is difficult to apply the requirements other than the coating uniformity after the central dripping. correspond. Based on the fact that the ij is applied to the 4th generation substrate, the new coating method of the large substrate from the 5th generation substrate has a proposal of the discharge nozzle type photoresist coating method. The spit-out spray consists of a heating image for the purpose of seeing the central part of the faucet and evenly using the small series of No.8 to evenly dispose of the sticking. The step of the strip is shaped, and the photoresist nozzle type 200923003 is used to make the sputter. A method in which a nozzle and a substrate are relatively moved to apply a photoresist composition to a substrate coated surface, and for example, a discharge port having a plurality of orifices arranged in a row and a slit-shaped discharge port are used, and the photoresist composition can be discharged in a strip shape. A proposal for a method of spouting a nozzle or the like. There is also a proposal for a method of uniformly coating a photoresist composition on a substrate coated surface by a discharge nozzle type, and rotating the substrate to adjust the film thickness. Therefore, in order to replace the photoresist of the conventional photolithography by the nanoimprint composition, it is suitable for the field of manufacture of these liquid crystal display elements, and the uniformity of coating to the substrate becomes important. For the production of a semiconductor integrated circuit, a positive photoresist of a liquid crystal display, a pigment dispersion resist for a color filter, etc., it is known to add a fluorine-based and/or an anthrone-based surfactant to solve the problem of coating properties. Specifically, there is a coating defect such as a ridge pattern or a scaly pattern (the photoresist film is unevenly dried) which is generated when the substrate is coated (Japanese Unexamined Patent Publication No. Hei No. Hei 7-230165, No. 2000-181055, No. 2004-9424) Bulletin No. 1). In order to improve the abrasion resistance and coating property of a protective film such as a disc or a magneto-optical disk, there is a disclosure of a fluorine-free or an fluorenone-based surfactant in a solvent-free photocurable composition (Special opening 2 0 0 4 - 9 4 Japanese Unexamined Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. In order to improve the ink discharge stability of the inkjet composition, a nonionic fluorine-based surfactant is added in the Japanese Patent Publication No. 2005-8759. Japanese Laid-Open Patent Publication No. 2003-160350-A discloses that a paint composition for thick film coating, such as a bristles, a pen, a bar coater, and the like, is processed by a full-phase drawing mold for embossing processing. An example in which the surfactant of the bond is 1% or more, preferably 3% or more, and the water swelling property of the cured film is improved. Thus, a technique of adding a surfactant to a protective film such as a positive-type resist, a pigment dispersion resist for color filter production, or a magneto-optical disk, and improving the applicability is a conventional technique of -10-200923003. As an example of the ink-jet or paint composition, it is known that a surfactant is added to a solvent-free photocurable resin, and a technique of adding a surfactant to improve the properties in each application is also known. JP-A-2007-84625 discloses an example in which a photocurable resin containing a fluorine-containing surfactant is used as an etching resist of a photon imprinting method when a semiconductor integrated circuit is produced. However, there is no known method for improving the substrate coating property of a photocurable nanoimprint resist composition which is not used as a pigment, a dye or an organic solvent for a permanent film. The photon imprinting must improve the fluidity of the composition in the cavity of the mold, and it is necessary to improve the releasability of the mold, the peeling property between the mold and the photoresist, and the adhesion between the photoresist and the substrate. This fluidity, peelability, and adhesion are difficult to achieve. The prior art for photon imprinting is described in more detail. Photon imprinting is generally applied to tantalum wafers, quartz, glass, thin films or other materials, such as ceramic materials, metals or polymers, to have fine irregularities having a pattern size of about several tens of nanometers to several tens of micrometers. The mold is pressed against the pressurization, and after the composition is cured by irradiating light in a pressurized state, the film is released from the mold to obtain a pattern for transferring the pattern. For this reason, at least one of the substrate or the mold is required to be transparent in order to smoothly irradiate the light nano-imprint. Usually, the light is irradiated from the side of the mold, and the mold material is usually made of an inorganic material such as quartz or sapphire which is transparent to UV or a translucent resin. The light is irradiated from the mold side, and it is effective in constructing a structure by a photon imprinting method on a substrate having a light-shielding property (specifically, a color filter for an LCD). The light nano-pressure method has (1) no need for heating/cooling procedures, and can expect high productivity, (2) due to the use of liquid composition, low pressure is -11 - 200923003 Printing, (3) dimensional changes caused by thermal expansion, (4) mold is transparent and easy to align, (5) strong advantages such as three-dimensional crosslinked body can be obtained after hardening. It is especially suitable for semiconductor micromachining applications where alignment accuracy is required, and for microfabrication applications in the field of flat panel displays. Other features of the photon imprinting method are that, compared to the conventional photolithography, the resolution is independent of the wavelength of the light source, and the nanometer-level microfabrication does not require an expensive device such as a stepper or an electron beam drawing device. On the other hand, the photon imprint must have an equal magnification of the mold. Since the mold is in contact with the resin, the durability and cost of the mold need to be considered. In this way, when the pattern of micron or nanometer size is imprinted by a large area by heat and/or photon imprinting, not only the uniformity of the pressing force but also the flatness of the original disc (mold) is required, and the composition is described above. The fluidity in the cavity of the mold and the composition characteristics of the press-out flow also need to be controlled. The mold for photon imprinting can be made of various materials such as metal, semiconductor, ceramic, SOG (SpinOn Glass) or a specific plastic. There is, for example, a proposal for a soft polydimethyl siloxane mold having a desired fine structure in International Publication No. WO99/22849. Since the mold forms a three-dimensional structure on one surface, various lithography methods can be used depending on the size of the structure and the resolution specifications thereof. Electron beam and X-ray lithography are commonly used for structural dimensions up to 300 nm. Laser direct exposure and UV lithography are used for larger structures. Regarding the photon imprint method, the releasability of the mold and the hardenable composition for photon imprinting is extremely important, and the surface treatment of the mold and the mold, specifically, 'hydrogenated sesquioxane, fluorinated ethylene propylene copolymer The mold is thought to solve the problem of adhesion, etc., and it is not. Here, a photocurable resin for photon embossing will be described. The photocurable resin suitable for use in Nai-12-200923003 embossing differs depending on the reaction mechanism, and can be mostly a radical polymerization type and an ionic polymerization type, or a mixture of these. Any of the compositions can be embossed, and generally a wide range of radical polymerization types are used (F. Xu et al.: SPIE Microlithography Conference, 5374, 232 (2004)). The radical polyunsal type is generally a composition comprising a monomer having a radically polymerizable ethyl group, a (meth) acrylonitrile group (m ο η 〇 m e r) or an oligomer and a photopolymerization initiator. The irradiated light is subjected to a chain polymerization by attacking a vinyl group by a radical generated by a photopolymerization initiator to form a polymer. A crosslinked structure is obtained by using a difunctional or higher polyfunctional monomer or oligomer as a component. D.; L Resnick et al.: J. Vac. Sci. Technol. B, Vol. 21. No. 6, 2624 (2003) discloses the use of low viscosity UV hardenable monomers, capable of low pressure, room temperature imprinting Composition. 1 Describe in detail the characteristics of materials used for photon imprinting. Material Requirements The characteristics vary with the application and the procedural characteristics are unrelated to the intended use. For example, 'The latest photoresist material manual, pages 1, 103 to 104 (2005, published by the intelligence agencies), the main requirements are coating properties, substrate adhesion, low viscosity (<5 mPa · s), and peelability. , low hardening shrinkage rate, quick hardenability, etc. Especially for low-pressure stamping and the necessary use of low residual film rate, it is known that high-viscosity materials are required. The required characteristics depending on the application include, for example, the refractive index and optical transparency of the optical member, the etching resistance of the etching resist, and the thickness of the residual film being reduced. How these characteristics are controlled and the balance of characteristics is the key to material design. At least the program material and the permanent film are greatly different depending on the required characteristics, and the material must be developed according to the program and use. Materials suitable for such light nanoimprinting applications are known, and the latest photoresist materials manual, pages 1, 1 03 to 1 04 (in 2005, published by the intelligence agencies) have a viscosity of about 60 m. Photohardenable material of P a · s (2 5 t ) -13- 200923003. Similarly, C M C publication: Development and Application of Nanoimprinting, pp. 159-160 (2006) discloses a fluorine-containing photosensitive resin having a viscosity of 14.4 mPa·s as a main component of methacrylic acid monoester. Thus, there are reports on the expectation of viscosity for the composition used for photon imprinting, and the design guidelines for materials suitable for each application have not been reported. An example of a photocurable resin used for photon imprinting has been described. Japanese Laid-Open Patent Publication No. 2004-59 No. 20-A No. 2004-5-9 8 discloses a photocurable resin containing a polymer having an isocyanate group for use in a relief-type full-phase diagram or a diffraction grating. Example of grain processing. JP-A-2006- 1 1 4 8 82 discloses a curable composition for photon imprinting containing a polymer, a photopolymerization initiator, and a viscosity adjusting agent. Japanese Laid-Open Patent Publication No. 2000-144-924 discloses a pattern forming method using a fluorine-containing curable material in order to improve the releasability with a mold. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. N. Sakai et al.: J. Photopolymer Sci. Technol. Vol. 18 'No. 4, 53 1 (2005) discloses (1) functional propylene fluorene monomer, (2) functional propylene fluorene monomer, ( 3) a photocurable radical polymerizable composition combining a functional acryl monomer and a photopolymerization initiator, or a photocationic polymerizable composition containing a photocurable epoxy compound and a photoacid generator, etc., for use in a nano Embossing, an example of thermal stability and mold peelability. M. Stewart et al.: MRS Buletin, Vol. 30, No. 12, 947 (2005) Focus on improving the peelability of photocurable resins and molds, and the film after hardening. -200923003 Shrinkage, light in the presence of oxygen The problem of low sensitivity such as polymerization hindrance reveals light containing (1) a functional acryl oxime monomer, (2) a functional acryl oxime monomer, a fluorenone-containing functional acryl oxime monomer, and a photopolymerization initiator. A hardening composition for nanoimprinting. T. Beiley et al.: J. Vac. Sci. Technol. B 1 8 (6), 3 5 7 2 (2000) discloses that a monofunctional acryl oxime monomer, a fluorenone-containing functional acryl monomer, and The photopolymerization initiator is formed on a ruthenium substrate by a curable composition for photon imprinting, and a surface-treated mold is used to reduce defects after photon imprinting. B. Vratzov et al.: J. Vac. Sci. Technol. B21(6), 2760 (2003) discloses photon imprinting of an anthracene-containing monomer, a trifunctional acryl monomer and a photopolymerization initiator. The curable composition is formed on a ruthenium substrate, and the Si 〇 2 mold has a high resolution and is coated with a composition having excellent uniformity. E. K. Kim et al.: J. Vac. Sci. Technol. B22(l), 131 (2004) discloses an example in which a cationic polymerizable composition formed by combining a specific vinyl ether compound and a photoacid generator forms a 50 nm pattern size. It is described that although the viscosity is low and the curing speed is fast, the template peeling property is still a problem. For example, N. Sakai et al.: J. Photopolymer Sci. Technol. Vol. 18, No. 4 5 3 1 (2005), M. Stewart et al.: MRS Buletin, Vol. 30, No. 12, 947 (2005) T. Beiley et al.: J. Vac. Ξοΐ-Τ ech η ο 1. B 1 8 ( 6) , 3 5 7 2 ( 2 0 0 0) , B. V ratzov et al.: J · V ac . S C i. Technol. B2 1 (6), 2760 (2003), EK Kim et al.: J. Vac. Sci. Technol. B22(l), 131 (2004), although propylene oxime with different functional groups is used. Monomers, acrylonitrile-based polymers, and vinyl ether compounds are disclosed in various types of photo-curable resins which are embossed with photo-nano, and as a preferred type of composition, -15-200923003 optimum monomer type, combination of monomers, The guidelines for material design, such as the optimum viscosity of the monomer or photoresist, the physical properties of the photoresist solution, and the improvement of the photoresist coating properties, are not disclosed at all. Therefore, in fact, in the case of photon imprinting, it is possible to make the composition of the composition widely used, and the photon nano-imprint resist composition which is practically satisfactory is still not proposed. B. Vratzov et al.: J. Vac. Sci. Technol. B2 1 (6), 2760 (2003), Ε·K. Kim et al.: J. Vac. Sci. Technol. B22(l) In the composition of 131 (2004), although there is a low viscosity, the pattern is photohardened, and the transmittance of the cured film is low (coloring) after heat treatment, and the hardness is insufficient, so that it cannot be used as a permanent film. The composition is not known.

Proc. SPIE Int. S oc. Opt. Eng., H 6151 卷,第 Pt2 號, 61512F(2006)、科學及工業,第 80 卷,第 7 號,322(20 06) 提議,經以光機能交聯材物質作處理之矽石溶膠、(甲基) 丙烯醯單體、光聚合引發劑之混合物組成之無機·有機混 成材料,有應用於光奈米壓印的報告。Proc. SPIE Int. Soc. Opt. Eng•,第 6151 卷,第 Pt2 號,61512F(2006)、科學及工 業,第80卷,第7號,3 22 (2006)報告壓印材料之200nm線 條圖案形成例,而作爲模具材可圖案化至600nm之線寬。 但有與模具之剝離性、硬化膜之硬度不足等問題,未必能 令人滿意。Proc. SPIE Int. S oc. Opt. Eng., H 6151, Pt2, 61512F (2006), Science and Industry, Vol. 80, No. 7, 322 (20 06) Proposal, by optical function An inorganic/organic hybrid material composed of a mixture of a vermiculite sol, a (meth) acrylonitrile monomer, and a photopolymerization initiator, which has been treated with a combination material, has been reported for use in photon imprinting. Opc. SPIE Int. Soc. Opt. Eng•, Volume 6151, Pt2, 61512F (2006), Science and Industry, Vol. 80, No. 7, 3 22 (2006) Reporting 200nm line patterns of imprinted materials An example is formed, and as a mold material, it can be patterned to a line width of 600 nm. However, problems such as peeling property from the mold and insufficient hardness of the cured film may not be satisfactory.

Proc. SPIE Int. Soc. Opt. Eng.,第 6151 號,第 Pt2 號’ 615 12F (2006)、科學及工業,第 80 卷,第 7 號,322(2006) 之組成物中’雖有低黏度者,但皆係光硬化形成圖案,繼 之經加熱處理時硬化膜透過率低,亦即已著色,且硬度不 足。尤不見有足堪實用作永久膜之組成物。 -16- 200923003 特開2000- 1 43 924號公報揭示含有經表面處理之膠體矽 石、特定(甲基)丙烯醯單體、平流劑、光聚合引發劑之硬 被覆用組成物,報告兼顧膜硬度與低硬化收縮性之於光碟 的應用,但這些組成物與模具之剝離性、基板塗布性不佳, 難以應用於光奈米壓印。並且,光硬化後,經加熱處理時 透過率低,亦即,已著色,不堪用作永久膜。 特開2007 - 1 865 70號公報有,使用具有環狀構造之(甲基) 丙烯酸酯的蝕刻光阻用組成物之報告,而這些組成物於光 ,, 硬化後經加熱處理時透過率低,亦即已著色,有不堪用作 永久膜之問題,且硬化膜之硬度、耐溶劑性不足,不堪實 用。 爲提升硬化膜之硬度及力學強度,可藉使用賦予高交聯 密度之多官能單體達成,但該等多官能單體係高黏度化合 物,低黏度制約下難得滿意之硬化膜物性。並且,多官能 單體於照射光時一氣聚合,使用樹脂模具之際,有殘渣殘 留亦係問題。 f 國際公開W02004/099272號小冊雖有,使用同一分子中 有光聚合部位與熱反應部位之單體的噴墨用硬化性組成物 之報告,此發明因組成物黏度高,不能直接用於光奈米壓 印。又,硬化膜之著色亦大’用於液晶彩色濾光片用之間 隔物保護膜時透過性有問題,其改良方法卻未見揭示。 特開2005-25 5 854號公報有’同一分子內有乙烯醚基之 丙烯酸酯單體的硬化性組成物之報告。此發明黏度低,可 應用於光奈米壓印,但硬化膜之硬度不足,其改良方法未 見揭示。 -17- 200923003 如此,實況係尙未有,堪用作永久膜,適用於光奈米壓 印之光阻組成物的提議。 作爲永久膜之主要課題有,圖案精度、密著性、超過 2 00 °C之加熱處理後之透過性、高機械特性(對於外部壓力 之強度)、耐擦傷性、平坦化特性、耐溶劑性、加熱處理時 之釋氣減少等諸多課題。以光奈米壓印用硬化性組成物用 作永久膜時,如同習知的使用丙烯醯樹脂等之光阻, (1)塗膜均勻性 . (2)加熱處理後之透過性 (3) 耐擦傷性 之賦予極爲重要。 同時’作爲光奈米壓印用硬化性組成物,上述(1)〜(3)以 外必須考慮下述(4)、(5)之觀點,組成物設計技術之難度更 高。 (4) 確保光阻往模具凹部之流動性,無溶劑或使用少量溶 劑下之低黏度化變得重要。 (5) 光硬化後,易於自模具剝離,不附著於模具。 關於奈米壓印用之光奈米壓印用硬化性組成物,雖有各 種材料之揭示’而至目前爲止噴墨用組成物、光磁碟用保 護膜用途之已知組成物,或用作蝕刻光阻之光奈米壓印用 硬化性組成物’與用於永久膜之光奈米壓印用硬化性組成 物’雖於材料有共通部分,於高溫加熱處理、機械強度之 觀點等則大有不同’噴墨、光磁碟用保護膜,蝕刻光阻用 途適用之光硬化性樹脂,若直接用作永久膜用之光阻,則 因透過性、機械強度、耐溶劑性等,終究不堪實用。高透 -18- 200923003 過性者尤有需求。 【發明內容】 發明所欲解決之課題 本發明係鑑於上述實情而作,其目的在提供光硬化性優 良,且透過性優良之奈米壓印用硬化性組成物。並以提供, 適於平面顯示器等之永久膜的奈米壓印用硬化性組成物爲 目的。尤以提供,加熱硬化後之透過性、剝離性、圖案精 度皆優良之組成物爲目的。 用以解決課題之手段 就國際公開W02004/099272號小冊作精心探討得知,使 用同一分子中有反應性不同之2種以上的硬化性官能基, 例如光聚合部位與熱反應部位之單體時,可得具有適於奈 米壓印之黏度,能賦予滿意之硬化膜物性,並於光聚合時 呈半硬化狀態,使用廉價樹脂模具亦幾乎無殘渣殘留之效 果。基於該見解發現,藉下述手段可解決上述課題。 (1) 含有(A)同一分子內有至少2種反應性不同之硬化性官 能基的單體,與(C)抗氧化劑之奈米壓印用硬化性組成物。 (2) 如(1 )之奈米壓印用硬化性組成物,其中該硬化性官能 基之內,至少其一係α,/3-不飽和酯基。 (3 )如(1)或(2)之奈米壓印用硬化性組成物,其中更含有(Β) 界面活性劑。 (4)如(1)~(3)中任一之奈米壓印用硬化性組成物,其中該 組成物之黏度係在3〜18 mPa· s之範圍。 (5 )至少含(A)同一分子內有反應性不同之2種以上硬化性 官能基,且該硬化性官能基之至少其一係α,/3 -不飽和酯 -19- 200923003 基的單體,(B)界面活性劑,及(C)抗氧化劑之奈米壓印用硬 化性組成物,其中該組成物之黏度係在3 ~ 1 8 m P a · s之範 圍。 (6)如(1)~(5)中任一之奈米壓印用硬化性組成物,其中該 單體係如下述一般式(1)所表。 •^γ-5-〇·\-χ-(-Υ )η 一般式(1)Proc. SPIE Int. Soc. Opt. Eng., No. 6151, Pt2 '615 12F (2006), Science and Industry, Vol. 80, No. 7, 322 (2006) Viscosity, but all are light hardened to form a pattern, followed by heat treatment, the cured film has a low transmittance, that is, it has been colored, and the hardness is insufficient. In particular, it is useful to use as a permanent film. Japanese Laid-Open Patent Publication No. 2000-143-92 discloses a hard coating composition containing a surface-treated colloidal vermiculite, a specific (meth)acrylonitrile monomer, a leveling agent, and a photopolymerization initiator, and reports a film. Hardness and low hardening shrinkage are applied to optical discs, but the peelability of these compositions from the mold and the poor coatability of the substrate are difficult to apply to photon imprinting. Further, after the light is cured, the transmittance at the time of heat treatment is low, that is, it is colored, and it is unbearable as a permanent film. JP-A-2007- 1 865-70 discloses a report on a composition for etching photoresist having a ring structure of (meth) acrylate, and these compositions are light-transmitted, and have a low transmittance after heat treatment. That is, it has been colored, and it has a problem that it is unbearable for use as a permanent film, and the hardness and solvent resistance of the cured film are insufficient, which is unsuitable for practical use. In order to improve the hardness and mechanical strength of the cured film, it can be achieved by using a polyfunctional monomer which imparts a high crosslinking density, but these polyfunctional single-system high-viscosity compounds have a poorly cured film property under low viscosity. Further, when the polyfunctional monomer is polymerized at the time of irradiation with light, when a resin mold is used, there is a problem that residue remains. f International Publication No. WO2004/099272 has a report on the use of a curable composition for inkjet which has a photopolymerization site and a thermal reaction site in the same molecule. This invention is not directly applicable to the composition because of its high viscosity. Light nano embossing. Further, the color of the cured film is also large. There is a problem in the transparency of the protective film for the liquid crystal color filter, and the improvement method has not been disclosed. JP-A-2005-25 5 854 discloses a report of a hardenable composition of an acrylate monomer having a vinyl ether group in the same molecule. The invention has low viscosity and can be applied to photon embossing, but the hardness of the cured film is insufficient, and the improvement method is not disclosed. -17- 200923003 As such, the live system is not available and can be used as a permanent film for the proposal of photo-resist composition of photo-nano-imprinted. The main problems of the permanent film include pattern accuracy, adhesion, permeability after heat treatment at over 200 °C, high mechanical properties (strength to external pressure), scratch resistance, flattening properties, and solvent resistance. And many problems such as reduced gas release during heat treatment. When the curable composition for anodic imprinting is used as a permanent film, as in the conventional use of photoresist such as acryl resin, (1) uniformity of the coating film. (2) permeability after heat treatment (3) The imparting of scratch resistance is extremely important. At the same time, as the curable composition for photon imprinting, it is necessary to consider the following (4) and (5) in addition to the above (1) to (3), and the composition design technique is more difficult. (4) It is important to ensure the fluidity of the photoresist to the concave portion of the mold without solvent or low viscosity with a small amount of solvent. (5) After photohardening, it is easy to peel off from the mold and does not adhere to the mold. In the case of the curable composition for photon imprinting for nanoimprinting, there are various materials disclosed, and the composition for inkjet or the known composition for the protective film for magneto-optical discs has hitherto been used. The curable composition for etching photoresist, the hardenable composition for light nanoimprinting, and the curable composition for photo-nanoimprint for permanent film, have a common portion in materials, high-temperature heat treatment, mechanical strength, etc. There is a difference between the 'photo-curing resin for inkjet and optical disk, and the photo-curable resin for etching photoresist. If it is directly used as a photoresist for permanent film, it is transparent, mechanical strength, solvent resistance, etc. After all, it is not practical. High penetration -18- 200923003 People who have sex are particularly in need. DISCLOSURE OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a curable composition for nanoimprint which is excellent in photocurability and excellent in transparency. Further, it is intended to provide a hardenable composition for nanoimprinting which is suitable for a permanent film such as a flat panel display. In particular, it is intended to provide a composition excellent in permeability, releasability, and pattern accuracy after heat curing. In order to solve the problem, the international publication W02004/099272 is carefully explored, and it is known that two or more kinds of hardening functional groups having different reactivity in the same molecule, such as a monomer of a photopolymerization site and a thermal reaction site, are used. In the case of having a viscosity suitable for nanoimprinting, it is possible to impart satisfactory physical properties of the cured film, and it is semi-hardened in photopolymerization, and an inexpensive resin mold has almost no residue remaining. Based on this finding, it is found that the above problems can be solved by the following means. (1) A curable composition containing (A) a monomer having at least two kinds of sclerosing functional groups having different reactivity in the same molecule, and (C) an antioxidant for nanoimprinting. (2) A curable composition for nanoimprinting according to (1), wherein at least one of the curable functional groups is an α,/3-unsaturated ester group. (3) The curable composition for nanoimprinting according to (1) or (2), further comprising (Β) a surfactant. (4) The curable composition for nanoimprinting according to any one of (1) to (3), wherein the viscosity of the composition is in the range of 3 to 18 mPa·s. (5) containing at least (A) two or more kinds of curable functional groups having different reactivity in the same molecule, and at least one of the curable functional groups is a single α,/3-unsaturated ester-19-200923003 (B) a surfactant, and (C) a hardening composition for nanoimprinting of an antioxidant, wherein the viscosity of the composition is in the range of 3 to 18 m P a · s. (6) The curable composition for nanoimprinting according to any one of (1) to (5), wherein the single system is represented by the following general formula (1). •^γ-5-〇·\-χ-(-Υ)η General formula (1)

R1 L (一般式(1)中’R1表氫原子或羥甲基,Χ表有機基;111表1~3 之整數,η表1〜4之整數;Υ表具有碳-碳不飽和鍵之硬化 性官能基、具有碳-氮不飽和鍵之硬化性官能基、具有含氧 原子之環狀基的硬化性官能基或下述一般式(2)所表之基) —(-Si(OR2〉3) _ 般式⑵ ’ (R2各表烷基或芳基) (7 )如(6)之奈米壓印用硬化性組成物,其中一般式(1)中之 Y的至少其一係選自乙烯醚基、烯丙醚基、烯丙酯基、環 己烯基、環戊烯基、雙環戊烯基 '苯乙烯基、甲基丙烯醯 氧基、甲基丙烯醯胺基、丙烯醯胺基、乙烯矽烷基、N -乙 烯雜環基及順丁烯二醯亞胺基之群組。 (8 )如(6)之奈米壓印用硬化性組成物,其中一般式(1)中之 Y的至少其一係選自烯丙醚基、環己烯基、環戊烯基及雙 環戊稀基。 (9) 如(6)之奈米壓印用硬化性組成物,其中一般式(1)中之 Y的至少其一係烯丙醚基,η與m之和係。 (10) 如(6)之奈米壓印用硬化性組成物,其中一般式(1)中 之Y的至少其一係異氰酸酯基或腈基。 -20- 200923003 (11) 如(6)之奈米壓印用硬化性組成物’其中一般式(1)中 之Y的至少其一係選自環氧丙環、環氧乙環及碳酸伸乙酯 基之群。 (12) 如(6)〜(1 1)中任一之奈米壓印用硬化性組成物’其中 一般式(1)中X表總碳原子數3~9之有機基。 (13) 如(6)之奈米壓印用硬化性組成物’其中一般式(1)所 表之化合物係下述一般式(3)~ (5)中任何一種以上。R1 L (in general formula (1), 'R1 represents a hydrogen atom or a hydroxymethyl group, Χ is an organic group; 111 is an integer of Tables 1-3, η is an integer of Tables 1-4; Υ has a carbon-carbon unsaturated bond a curable functional group, a hardenable functional group having a carbon-nitrogen unsaturated bond, a hardening functional group having a cyclic group containing an oxygen atom, or a group represented by the following general formula (2)—(-Si(OR2) 〉3) _ General formula (2) ' (R2 each alkyl group or aryl group) (7) The hardening composition for nanoimprint of (6), wherein at least one of Y in general formula (1) Selected from vinyl ether, allyl ether, allyl ester, cyclohexenyl, cyclopentenyl, dicyclopentenyl 'styryl, methacryloxy, methacrylamido, propylene a group of amidino group, a vinyl fluorenyl group, an N-ethylene heterocyclic group, and a maleimide group. (8) A hardening composition for nanoimprinting as in (6), wherein the general formula (1) At least one of Y in the group is selected from the group consisting of an allyl ether group, a cyclohexenyl group, a cyclopentenyl group, and a dicyclopentanyl group. (9) A hardening composition for nanoimprinting as in (6), wherein At least one of the olefins of Y in the general formula (1) The base, the sum of η and m. (10) The hardenable composition for nanoimprint of (6), wherein at least one of the isocyanate groups or the nitrile group of Y in the general formula (1). 200923003 (11) The hardenable composition for nanoimprint of (6) wherein at least one of Y in the general formula (1) is selected from the group consisting of a epoxidized ring, an epoxy group, and an ethylene carbonate group. (12) The curable composition for nanoimprinting according to any one of (6) to (1), wherein the general formula (1) has an organic group having a total carbon number of 3 to 9 in the X form. 13) The curable composition for nanoimprinting of (6) wherein the compound represented by the general formula (1) is any one or more of the following general formulas (3) to (5).

一般式(5)General formula (5)

(一般式(3)~(5)中,R3各表氫原子或甲基’ r4各表甲基或乙 U 4)如(1)〜(1 3 )中任一之奈米壓印用硬化性組成物’其中 含該單體(A)以外之聚合性單體’及光聚合引發劑。 (15) 如(1)〜(14)中任一之奈米壓印用硬化性組成物,其中 該抗氧化劑係至少選自受阻酹系抗氧化劑或受阻胺系抗氧 化劑。 (16) 如(ι)〜(1 5)中任一之奈米壓印用硬化性組成物,其中 該抗氧化劑之含量係1 〇質量%以下。 (17) 如(1)〜(16)中任一之奈米壓印用硬化性組成物,其中 -21 - 200923003 不含分子量超過1 000之化合物。 (18) 如(1)〜(17)中任一之奈米壓印用硬化性組成物,其中 該組成物之表面張力係在18~30mN/m之範圍。 (19) 如(1)〜(1 8 )中任一之奈米壓印用硬化性組成物,其中 藉由進行照射光及加熱硬化。 (20) 使如(1)〜(19)中任一之奈米壓印用硬化性組成物硬化 得之硬化物。 (21) 包括使如(1)〜(19)中任一之奈米壓印用硬化性組成物 r 藉由複數次進行照射光及加熱而硬化的硬化物之製法。 (22) 使用如(20)之硬化物的液晶顯示裝置用構件。 (23) 包括使如(1)〜(19)中任一之奈米壓印用硬化性組成物 藉由進行複數次照射光及加熱而硬化的液晶顯示裝置用構 件之製法。 發明效果 藉本發明,可提供能得透過率優良之硬化物的奈米壓印 用硬化性組成物。 ? 【實施方式】 以下詳細說明本發明之內容。本說明書中「~」係用以 指含記載於其前後之數値作爲下限値及上限値。 以下詳細說明本發明。本說明書中(甲基)丙烯酸酯表丙 烯酸酯及甲基丙烯酸酯,(甲基)丙烯醯表丙烯醯及甲基丙 烯醯,(甲基)丙烯醯基表丙烯醯基及甲基丙烯醯基。本發 明中,單體與低聚物、聚合物有別,指分子量1,〇〇〇以下 之化合物。本說明書中,官能基指參與聚合之基。 本發明中所謂奈米壓印指,約數微米至數十奈米大小之 -22- 200923003 圖案轉印,當然不僅限於奈米級者。 本發明之光奈米壓印用硬化性組成物(以下或簡稱「本 發明之組成物」)係於硬化前透過性高,微細凹凸圖案之形 成能力優良,且可爲塗布適性及其它加工適性優良之物。 並於硬化後硬度優良,且可得其它各方面綜合上優良之塗 膜物性。因而,本發明之組成物可廣用於光奈米壓印。 亦即,本發明之組成物在用於光奈米壓印時,可具如下 特徵。 (1) 因室溫溶液流動性優良,該組成物易於流入模具凹腔 內,因不易吸入大氣不會使閥故障,模具凸部、凹部任一 於光硬化後皆不易殘留殘渣。 (2) 硬化後之硬化膜機械性質優良,塗膜與基板之密著性 優良,塗膜與模具之剝離性優良,故無剝離模具之際的圖 案崩壞、塗膜表面拉絲引起表面粗糙,可形成良好之圖案。 (3) 因塗布均勻性優良,適合塗布於大型基板•微細加工 領域等。 (4) 透光性、殘膜性、耐擦傷性等機械特性,耐溶劑性高, 故適用作各種永久膜。 例如,本發明之組成物適用於,目前爲止難以展開的半 導體積體電路、液晶顯示裝置用構件(尤以液晶顯示器之薄 膜電晶體、液晶彩色濾光片之保護膜、間隔物、其它液晶 顯示裝置用構件之微細加工用途等),其它用途,例如,電 漿顯示面板用間壁材、平面螢幕、微機電系統(MEMS)、感 測器元件、光碟、高密度記憶碟等磁記錄媒體、繞射格子、 浮彫型全相圖等光學零件,並應可廣用於微裝置、光學元 -23- 200923003 件、光學薄膜、偏光元件、有機電晶體、彩色濾光片、頂 塗層、柱材、液晶配向用肋材、微透鏡陣列、免疫分析晶 片、DNA分離晶片、微反應器、奈米生技裝置、光波導、 濾光器、光子液晶等之製作。 茲說明本發明之組成物的黏度。本發明中,黏度若非特 加說明,係指於25 °C之黏度。本發明之組成物於25 °C之黏 度係以 3~18mPa· s 爲佳,5~15mPa. s 更佳,7~12mPa· s 尤 佳。本發明之組成物的黏度爲3mPa · s以上即有不易發生 基板塗布適性之問題 '膜的機械強度下降之傾向。具體而 言,使黏度爲3mPa · s以上即有塗布組成物之際面上不勻 之產生,塗布時組成物自基板的流出可予抑制之傾向而較 佳。另一方面,使本發明之組成物的黏度爲1 8 m P a . s以下, 使組成物密著於有微細凹凸圖案之模具時,組成物亦能流 入模具凹腔內’不易有空氣混入,而不易引起氣泡缺陷, 光硬化後不易於模具凸部殘留有殘渣,故較佳。 本發明之組成物含(A)同一分子內有反應性不同之2種 以上的硬化性官能基之單體,與(C)抗氧化劑。本發明並亦 可含(B)界面活性劑。(A)單體可僅}種,亦可係2種以上。 本發明之組成物係以含(A)單體10〜99質量%爲佳,20~80 質量%更佳。本發明之組成物亦可含其它聚合性單體、光聚 合引發劑等。以下詳細說明這些內容。 首先說明含於本發明之組成物的同一分子內有反應性 不同之2種以上的硬化性官能基之化合物(以下或稱「本發 明中之單體」)。於此,2種反應性不同之硬化性官能基可 例如作如下區別。第一例有照射光時進行聚合(反應),而 -24- 200923003 其官能基之反應性不同者。如此的硬化性官能基有丙烯酸 酯基、N-乙烯基、(甲基)丙烯醯胺基等。第二例有與照射 光時進行聚合(反應)之基藉加熱進行聚合(反應)之基。具體 而言,光照射時不反應之基有乙烯醚基、烯丙醚基、烯丙 酯基、環己烯基、環戊烯基、雙環戊烯基、苯乙烯基、甲 基丙烯醯氧基、乙烯矽烷基及順丁烯二醯亞胺基。甲基丙 烯醯氧基、苯乙烯基' 乙烯醚基通常作自由基聚合,照光 時於室溫附近進行聚合故這些聚合性基不反應,而藉加熱 聚合。 本發明中之單體係硬化性官能基之內至少其一乃α, 不飽和酯基之單體爲佳,係一般式(1)之單體則更佳。(In general formula (3) to (5), each of R3's hydrogen atom or methyl group 'r4' is methyl or B'4) is hardened by nanoimprinting of any of (1) to (1 3) The composition 'containing a polymerizable monomer other than the monomer (A)' and a photopolymerization initiator. (15) The curable composition for nanoimprinting according to any one of (1) to (14) wherein the antioxidant is at least selected from the group consisting of a hindered lanthanide antioxidant or a hindered amine-based antioxidant. (16) The curable composition for nanoimprinting according to any one of (1) to (1), wherein the content of the antioxidant is 1% by mass or less. (17) A hardenable composition for nanoimprinting according to any one of (1) to (16), wherein -21 - 200923003 does not contain a compound having a molecular weight of more than 1,000. (18) The curable composition for nanoimprinting according to any one of (1) to (17), wherein the surface tension of the composition is in the range of 18 to 30 mN/m. (19) A curable composition for nanoimprinting according to any one of (1) to (18) which is cured by irradiation light and heat. (20) A cured product obtained by curing the curable composition for nanoimprinting according to any one of (1) to (19). (21) A method for producing a cured product obtained by curing light and heating by a plurality of hardening compositions r for nanoimprinting according to any one of (1) to (19). (22) A member for a liquid crystal display device using the cured product of (20). (23) A method for producing a member for a liquid crystal display device in which a curable composition for nanoimprinting according to any one of (1) to (19) is cured by performing a plurality of irradiation lights and heating. According to the present invention, it is possible to provide a curable composition for nanoimprint which can obtain a cured product excellent in transmittance. [Embodiment] The content of the present invention will be described in detail below. In the present specification, "~" is used to mean the number of 値 before and after it is used as the lower limit and upper limit 値. The invention is described in detail below. In the present specification, (meth) acrylate acrylate and methacrylate, (meth) propylene propylene and methacryl fluorene, (meth) propylene fluorenyl propylene and methacryl . In the present invention, the monomer is different from the oligomer and the polymer, and refers to a compound having a molecular weight of 1, 〇〇〇 or less. In the present specification, a functional group means a group which participates in polymerization. The so-called nanoimprinting in the present invention refers to a pattern transfer of about -22 to 200923003, which is about several micrometers to several tens of nanometers, and is of course not limited to the nanometer. The curable composition for photonic embossing of the present invention (hereinafter, simply referred to as "the composition of the present invention") has high permeability before curing, and is excellent in the ability to form fine concavo-convex patterns, and can be coated and other processing suitability. Excellent things. And it has excellent hardness after hardening, and it can obtain comprehensive and excellent film properties in other aspects. Thus, the composition of the present invention can be widely used for photon imprinting. That is, the composition of the present invention can have the following characteristics when used for photon imprinting. (1) Since the fluidity of the room temperature solution is excellent, the composition easily flows into the cavity of the mold, and the valve is not broken due to the difficulty of inhaling the atmosphere, and the residue of the convex portion and the concave portion of the mold is hard to be left after the light is hardened. (2) The cured film after hardening is excellent in mechanical properties, and the adhesion between the coating film and the substrate is excellent, and the peeling property between the coating film and the mold is excellent, so that the pattern is not broken at the time of peeling the mold, and the surface of the coating film is roughened due to drawing. A good pattern can be formed. (3) It is suitable for coating on large substrates and microfabrication fields because of excellent coating uniformity. (4) It is suitable for various permanent films because it has mechanical properties such as light transmittance, residual film properties, and scratch resistance, and has high solvent resistance. For example, the composition of the present invention is suitable for a semiconductor integrated circuit and a member for a liquid crystal display device which are difficult to expand up to now (especially a thin film transistor of a liquid crystal display, a protective film of a liquid crystal color filter, a spacer, and other liquid crystal display). Other applications, such as magnetic wall materials for plasma display panels, flat screens, microelectromechanical systems (MEMS), sensor components, optical discs, high-density memory discs, etc. Optical components such as diffraction gratings and relief-type full-phase diagrams, and should be widely used in micro devices, optical elements -23-200923003, optical films, polarizing elements, organic transistors, color filters, top coats, columns Fabrics, liquid crystal alignment ribs, microlens arrays, immunoassay wafers, DNA separation wafers, microreactors, nanotechnology devices, optical waveguides, filters, photonic liquid crystals, and the like. The viscosity of the composition of the present invention is illustrated. In the present invention, the viscosity means a viscosity at 25 ° C unless otherwise specified. The composition of the present invention preferably has a viscosity of 3 to 18 mPa·s at 25 ° C, more preferably 5 to 15 mPa·s, and particularly preferably 7 to 12 mPa·s. When the viscosity of the composition of the present invention is 3 mPa·s or more, there is a problem that the substrate coating property is less likely to occur. 'The mechanical strength of the film tends to decrease. Specifically, when the viscosity is 3 mPa·s or more, unevenness occurs on the surface of the coating composition, and the tendency of the composition to flow out from the substrate during coating can be suppressed. On the other hand, when the viscosity of the composition of the present invention is 18 mPa·s or less, when the composition is adhered to the mold having the fine concavo-convex pattern, the composition can also flow into the cavity of the mold. It is not easy to cause bubble defects, and it is not easy to leave a residue in the convex portion of the mold after photohardening, which is preferable. The composition of the present invention contains (A) a monomer having two or more kinds of curable functional groups having different reactivity in the same molecule, and (C) an antioxidant. The present invention may also contain (B) a surfactant. (A) The monomer may be used alone or in combination of two or more. The composition of the present invention is preferably 10 to 99% by mass of the (A) monomer, more preferably 20 to 80% by mass. The composition of the present invention may contain other polymerizable monomers, photopolymerization initiators and the like. These are described in detail below. First, a compound (hereinafter referred to as "monomer in the present invention") having two or more kinds of curable functional groups having different reactivity in the same molecule of the composition of the present invention will be described. Here, the two types of curable functional groups having different reactivity can be distinguished as follows, for example. The first example is polymerized (reacted) when irradiated with light, and -24-200923003 is different in reactivity of its functional groups. Such a curable functional group is an acrylate group, an N-vinyl group, a (meth) acrylamide group or the like. The second example has a group in which polymerization (reaction) is carried out by heating while reacting with light. Specifically, the group which does not react upon light irradiation is a vinyl ether group, an allyl ether group, an allyl ester group, a cyclohexenyl group, a cyclopentenyl group, a dicyclopentenyl group, a styryl group, a methacryloyloxy group. Base, vinyl decyl and maleimide. The methacryloxy group and the styryl-vinyl ether group are usually subjected to radical polymerization, and polymerization is carried out at room temperature in the case of light irradiation, so that these polymerizable groups do not react and are polymerized by heating. In the present invention, at least one of the single-system hardening functional groups is preferably a monomer having an unsaturated ester group, and more preferably a monomer of the general formula (1).

一般式(1) (―般式(1)中,R1表氫原子或羥甲基,X表有機基;111表1~3 之整數,η表1〜4之整數;Υ表具有碳·碳不飽和鍵之硬化 性官能基、具有碳·氮不飽和鍵之硬化性官能基、具有含氧 原子之環狀基的硬化性官能基或下述一般式(2)之基) -般式⑵ (R2各表烷基或芳基) X所表之有機基係2〜7價之有機基,3〜6價之有機基更 佳。可係脂肪族或芳香族,其總碳原子數以2〜20爲佳,3〜9 更佳。總碳原子數爲3~9則官能基密度高,可提升硬化膜 之交聯密度,並設計成低分子量,故可使本發明之組成物 的黏度在較佳範圍。該有機基亦可由氧原子、硫原子、酯 基、氨酯基隔開。具體而言,有碳原子數3~9之烷鏈、丙 -25- 200923003 三醇骨架、新戊四醇骨架,環己烷環、環戊環等爲代表之 脂環骨架,苯骨架等。 γ所表之具有碳-碳不飽和鍵之硬化性官能基可係雙鍵 或三鍵,亦可於不飽和結合具有取代基,可係鏈狀或環狀。 其總碳原子數以2〜18爲佳。 Y可係乙烯醚基、烯丙酸基、稀丙醋基、環己稀基、環 戊燒基、雙環戊稀基、苯乙稀基、甲基丙稀醯氧基、甲基 丙烯醯胺基、丙烯醯胺基、乙烯矽烷基、N -乙烯雜環基及 順丁烯二醯亞胺基;烯丙醚基、環己烯基及雙環戊烯基爲 較佳;烯丙醚基、烯丙酯基更佳。 Y所表之具有碳-氮不飽和鍵的硬化性官能基,有異氰酸 酯基、腈基。 1 Y所表之含有含氧原子之環狀基的硬化性官能基有氧矽 烷環、環氧丙環、碳酸乙二酯基。較佳者有氧矽烷環、環 氧丙環。 較佳之m係1~3,1或2更佳,較佳之11係1~4,1~3更 佳。m係2以上時,複數之R1可係相同或各異。n係2以 上時,複數之Υ可係相同或各異。 R2所表之烷基係以碳原子數1〜8者爲佳。如此之烷基有 甲基、乙基、丙基、丁基、己基、苯甲基。芳基係以碳原 子數6〜12者爲佳。如此之芳基有苯基、對甲苯基、對氯苯 基。 本發明中,尤以Υ之至少其一係烯丙醚基或烯丙酯基, η與m之和係3~6爲佳;Υ之至少其一係烯丙醚基或烯丙 酯基,η與m之和係3~6’ X係總碳原子數3〜9之有機基爲 -26- 200923003 更佳。採用如此之單體即可提升硬化膜之交聯密度,可提 升硬化膜之機械特性及耐溶劑性,並可設定組成物之黏度 於較佳範圍,可得圖案精度提升之效果。 一般式(1)之化合物以係下述一般式(3)〜(5)中任1種以 上所表之化合物爲佳。General formula (1) (In the general formula (1), R1 represents a hydrogen atom or a hydroxymethyl group, X represents an organic group; 111 an integer of Tables 1-3, η is an integer of Tables 1-4; Υ has carbon·carbon a curable functional group having an unsaturated bond, a curable functional group having a carbon/nitrogen unsaturated bond, a curable functional group having a cyclic group containing an oxygen atom, or a group of the following general formula (2): (2) (R2 each represents an alkyl group or an aryl group) The organic group represented by X is an organic group having a valence of 2 to 7 and an organic group having a valence of 3 to 6 is more preferable. It may be aliphatic or aromatic, and the total number of carbon atoms is preferably 2 to 20, more preferably 3 to 9. When the total number of carbon atoms is from 3 to 9, the density of the functional group is high, the crosslinking density of the cured film can be increased, and the molecular weight is designed to be low, so that the viscosity of the composition of the present invention can be in a preferable range. The organic group may also be separated by an oxygen atom, a sulfur atom, an ester group or a urethane group. Specifically, there are an alkyl chain having 3 to 9 carbon atoms, a C-25-200923003 triol skeleton, a pentaerythritol skeleton, a cyclohexane ring, a cyclopentane ring, and the like, and a benzene skeleton. The hardening functional group having a carbon-carbon unsaturated bond represented by γ may be a double bond or a triple bond, or may have a substituent in the unsaturated bond, and may be a chain or a ring. The total number of carbon atoms is preferably from 2 to 18. Y may be a vinyl ether group, an allyl group, a dipropyl acrylate group, a cyclohexyl group, a cyclopentyl group, a biscyclopentyl group, a styrene group, a methyl propyl decyloxy group, a methacrylamide a base, an acrylamide group, a vinyl fluorenyl group, an N-ethylene heterocyclic group and a maleimide group; an allyl ether group, a cyclohexenyl group and a dicyclopentenyl group are preferred; an allyl ether group; The allyl ester group is more preferred. The curable functional group having a carbon-nitrogen unsaturated bond represented by Y is an isocyanate group or a nitrile group. The curable functional group containing a cyclic group containing an oxygen atom represented by Y is an oxane ring, a propylene oxide ring or an ethylene carbonate group. Preferred are aeroxane ring and epoxidized ring. Preferably, m is 1 to 3, 1 or 2 is better, and preferably 11 is 1 to 4, and 1 to 3 is more preferable. When the m system is 2 or more, the plural R1 may be the same or different. When the n system is 2 or more, the plural numbers may be the same or different. The alkyl group represented by R2 is preferably one having a carbon number of from 1 to 8. Such alkyl groups are methyl, ethyl, propyl, butyl, hexyl or benzyl. The aryl group is preferably a carbon atom number of 6 to 12. Such aryl groups are phenyl, p-tolyl, p-chlorophenyl. In the present invention, in particular, at least one of the allyl ether or allyl ester groups, and the combination of η and m is preferably 3 to 6; at least one of the allyl ether or allyl ester groups is The sum of η and m is 3~6' X. The organic group having 3 to 9 total carbon atoms is -26-200923003. By using such a monomer, the crosslinking density of the cured film can be increased, the mechanical properties and solvent resistance of the cured film can be improved, and the viscosity of the composition can be set in a preferred range, and the effect of pattern precision can be improved. The compound of the formula (1) is preferably a compound of any one of the following general formulas (3) to (5).

一般式⑸ (一般式(3)~(5)中R3各表氫原子或甲基,R4各表甲基或乙 基) 於此提示本發明中之單體的較佳例,當然本發明不限於 這些。 -27- 200923003General formula (5) (in the general formulae (3) to (5), each of R3 represents a hydrogen atom or a methyl group, and R4 each represents a methyl group or an ethyl group. Here, a preferred example of the monomer in the present invention is shown, of course, the present invention does not Limited to these. -27- 200923003

-28 200923003-28 200923003

NCO M-22NCO M-22

M-23M-23

M-24M-24

M-25M-25

a 0 28 -I, M-31a,a 0 28 -I, M-31a,

M-26 M-27 ^5i(0Me)3 Μ·29 M-30 ^0- M-32 0 M-33M-26 M-27 ^5i(0Me)3 Μ·29 M-30 ^0- M-32 0 M-33

M-34M-34

0^0 M-360^0 M-36

M-40 M-41 M-42 \ M-44 M-43 其它聚合性單體 本發明之組成物爲改良組成物黏度、膜硬度、撓性等之 目的,可含其它聚合性單體,以倂用具有1個含乙烯性不 -29- 200923003 飽和鍵之基的聚合性不飽和單體(一官能之聚合性不飽和 單體)爲佳。具體而言,有例如酞酸2 -丙烯醯氧乙酯、酞酸 2 -丙烯醯氧-2-羥乙酯、六氫酞酸2 -丙烯醯氧乙酯、酞酸2-丙烯醯氧丙酯、2 -乙基-2 -丁基丙二醇丙烯酸酯、(甲基)丙 烯酸2-乙己酯、2-乙己卡必醇(甲基)丙烯酸酯、(甲基)丙烯 酸2 -羥丁酯、(甲基)丙烯酸2 -羥乙酯、(甲基)丙烯酸2 -羥 丙酯、(甲基)丙烯酸2-甲氧乙酯、(甲基)丙烯酸3-甲氧丁 酯、(甲基)丙烯酸4 -羥丁酯、丙烯酸二聚物、(甲基)丙烯酸 f. 苯甲酯、丁二醇—(甲基)丙烯酸酯 '(甲基)丙烯酸丁氧乙 V. 酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸鯨蠟酯、環氧乙烷(以 下稱EO)改質甲酚(甲基)丙烯酸酯、二丙二醇(甲基)丙烯酸 酯、乙氧化苯基(甲基)丙烯酸酯、(甲基)丙烯酸乙酯、(甲 基)丙烯酸異戊酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸異 辛酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異萡酯、(甲基) 丙烯酸雙環戊酯、(甲基)丙烯酸雙環戊氧乙酯、(甲基)丙烯 酸異十四酯、(甲基)丙烯酸月桂酯、甲氧二丙二醇(甲基) / 丙烯酸酯、甲氧三丙二醇(甲基)丙烯酸酯、甲氧聚乙二醇(甲 基)丙嫌酸酯、甲氧三甘醇(甲基)丙烯酸酯、(甲基)丙烯酸 甲醋、新戊二醇苯甲酸酯(甲基)丙烯酸酯、壬苯氧基聚乙 二醇(甲基)丙烯酸酯、壬苯氧基聚丙二醇(甲基)丙烯酸酯、 (甲基)丙嫌酸辛酯、對異丙苯基苯氧乙二醇(甲基)丙烯酸 醋、表氯醇(下作ECH)改質苯氧基丙烯酸酯、(甲基)丙烯酸 苯氧乙酯、苯氧二甘醇(甲基)丙烯酸酯、苯氧六甘醇(甲基) 丙稀酸醋、笨氧四甘醇(甲基)丙烯酸酯、聚乙二醇(甲基) 丙嫌酸醋、聚乙二醇-聚丙二醇(甲基)丙烯酸酯、聚丙二醇 -30- 200923003 (甲基)丙烯酸酯、(甲基)丙烯酸硬脂酯、EO改質琥珀酸(甲 基)丙烯酸酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸三溴 苯酯、E0改質(甲基)丙烯酸三溴苯酯、三(十二基)(甲基) 丙烯酸酯、對異丙烯酚、苯乙烯、α -甲苯乙烯、丙烯腈、 乙烯咔唑、氨酯(甲基)丙烯酸酯。 以具有2個以上之含乙烯性不飽和鍵的基之多官能聚合 性不飽和單體用作其它聚合性單體亦佳。 適用於本發明之有2個含乙烯性不飽和鍵的基之二官能 聚合性不飽和單體有例如二甘醇一乙醚(甲基)丙烯酸酯、 二羥甲基二氯戊烷(甲基)丙烯酸酯、二(甲基)丙烯醯化異三 聚氰酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4 -丁二醇二(甲 基)丙烯酸酯、Ε0改質1,6-己二醇二(甲基)丙烯酸酯、ECH 改質1,6 -己二醇二(甲基)丙烯酸酯、烯丙氧聚乙二醇丙烯酸 酯、1,9-壬二醇二(甲基)丙烯酸酯、Ε◦改質雙酚Α二(甲基) 丙烯酸酯、P0改質雙酚A二(甲基)丙烯酸酯、改質雙酚A 二(甲基)丙烯酸酯、E0改質雙酚F二(甲基)丙烯酸酯、ECH 改質六氫酞酸二丙烯酸酯、羥基三甲基乙酸新戊二醇二(甲 基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、E〇改質新戊二 醇二丙烯酸酯、環氧丙烷(下作p〇)改質新戊二醇二丙烯酸 酯、己內酯改質羥基三甲基乙酸酯新戊二醇、硬脂酸改質 新戊四醇二(甲基)丙烯酸酯、ECH改質酞酸二(甲基)丙烯酸 酯、聚(乙二醇-四亞甲二醇)二(甲基)丙烯酸酯、聚(丙二醇 -四亞甲二醇)二(甲基)丙烯酸酯、聚酯(二)丙烯酸酯、聚乙 二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、;gCH 改質丙二醇二(甲基)丙烯酸酯、矽酮二(甲基)丙烯酸酯、三 -31 - 200923003 甘醇二(甲基)丙烯酸酯、四甘醇二(甲基)丙烯酸酯、二羥甲 基三環癸烷二(甲基)丙烯酸酯、新戊二醇改質三羥甲丙烷 二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、EO改質 三丙二醇二(甲基)丙烯酸酯、三甘油二(甲基)丙烯酸酯、二 丙二醇二(甲基)丙烯酸酯、二乙烯伸乙脲、二乙烯伸丙脲、 氨酯(甲基)丙烯酸酯。 這些之中’新戊二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲 基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、四甘醇二(甲基) 丙烯酸酯、羥基三甲基乙酸新戊二醇二(甲基)丙烯酸酯、 聚乙二醇二(甲基)丙烯酸酯等尤適用於本發明。 有3個以上含乙烯式不飽和鍵的基之多官能聚合性不飽 和單體有例如,ECH改質甘油三(甲基)丙烯酸酯、EO改質 甘油三(甲基)丙烯酸酯、P〇改質甘油三(甲基)丙烯酸酯、 新戊四醇三丙烯酸酯、EO改質磷酸三丙烯酸酯、三羥甲基 丙烷三(甲基)丙烯酸酯、己內酯改質三羥甲丙烷三(甲基) 丙烯酸酯、E 0改質三羥甲丙烷三(甲基)丙烯酸酯、p 〇改質 三羥甲丙烷三(甲基)丙烯酸酯、參(丙烯醯氧乙基)異三聚氰 酸酯、二新戊四醇六(甲基)丙烯酸酯、己內酯改質二新戊 四醇六(甲基)丙烯酸酯 '二新戊四醇羥基五(甲基)丙烯酸 醋、院基改質二新戊四醇五(甲基)丙烯酸酯、二新戊四醇 聚(甲基)两烧酸酯、烷基改質二新戊四醇三(甲基)丙烯酸 醋、二(二經甲基)丙烷四(甲基)丙烯酸酯、新戊四醇乙氧基 四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、氨酯(甲 基)丙烯酸酯等。 追t之中’ EO改負甘油二(甲基)丙燦酸醋、p〇改質甘 -32- 200923003 油三(甲基)丙烯酸酯、三羥甲丙烷三(甲基)丙烯酸酯、E〇 改質三羥甲丙烷三(甲基)丙烯酸酯' PO改質三羥甲丙烷三 (甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、新戊四醇 乙氧基四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、氨 酯(甲基)丙烯酸酯等尤適用於本發明。 該氨酯(甲基)丙烯酸酯者可用,一(甲基)丙烯酸酯、多 官能丙烯酸酯。具體化合物有新中村化學公司製U-2PPA、 UA-4100、UA-5 20 1、U-4H、U-4HA、U-6HA、U-15HA 等。 本發明之組成物,爲更提高交聯密度,可將分子量比上 述多官能聚合性單體更大之多官能低聚物、聚合物,以可 達本發明目的之範圍配合。具有光自由基聚合性之多官能 低聚物有,聚酯丙烯酸酯、聚氨酯丙烯酸酯、聚醚丙烯酸 酯、聚環氧丙烯酸酯等各種丙烯酸酯低聚物。 用於本發明之其它聚合性單體,可係具有環氧乙烷環之 化合物。具有環氧乙烷環之化合物有例如多元酸之聚環氧 丙酯類、多元醇之聚環氧丙醚類、聚氧伸烷二醇之聚環氧 丙醚類、芳族多元醇之聚環氧丙醚類的加氫化合物類、氨 酯聚環氧化合物及環氧化聚丁二烯類等。這些化合物可以 一種單獨使用,或混合二種以上使用。 含有環氧丙基之化合物,適用之市售品有UVR-6216(聯 合碳化公司製)、去水甘油、AOEX24、CYCLOMER A200(以 上 DAICEL 化學工業(股)製),EPIKOTE 828、EPIKOTE 812、 EPIKOTE 1031、EPIKOTE 872 ' EPIKOTE CT5 08(以上油化 SHELL(股)製),KRM-2400、KRM-2410、KRM-2408 ' KRM-2490、KRM-2720、KRM- 275 0C以上旭電化工業(股)製) -33- 200923003 等。這些可單獨1種或組合2種以上使用。 這些具有環氧乙烷環之化合物的製法無特殊限制,可參 考例如’九善KK出版,第四版實驗化學講座20有機合成 11 ’ 21 3 ~ 成 4 年 ’ Ed. by Alfred Hasiner,The chemistry of heterocyclic compounds-Small Ring Heterocycles part 3 Oxiranes, John Wiley & Sons, An Interscience Publication,M-40 M-41 M-42 \ M-44 M-43 Other polymerizable monomer The composition of the present invention may contain other polymerizable monomers for the purpose of improving composition viscosity, film hardness, flexibility, and the like. Preferably, a polymerizable unsaturated monomer (monofunctional polymerizable unsaturated monomer) having one group having an ethylenic group other than a -29-200923003 saturated bond is used. Specifically, there are, for example, 2-propenyloxyethyl phthalate, 2-propenyl-2-hydroxyethyl phthalate, 2-propylene oxirane hexahydrophthalate, 2-propene oxime citrate Ester, 2-ethyl-2-butylpropanediol acrylate, 2-ethylhexyl (meth)acrylate, 2-ethylhexacarbitol (meth)acrylate, 2-hydroxybutyl (meth)acrylate, ( 2-hydroxyethyl methacrylate, 2-hydroxypropyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, (meth) acrylate 4-hydroxybutyl ester, acrylic acid dimer, (meth)acrylic acid f. phenylmethyl ester, butanediol-(meth)acrylate '(meth)acrylic acid butoxyethyl V. ester, (meth)acrylic acid Butyl ester, cetyl (meth)acrylate, ethylene oxide (hereinafter referred to as EO) modified cresol (meth) acrylate, dipropylene glycol (meth) acrylate, ethoxylated phenyl (meth) acrylate Ester, ethyl (meth)acrylate, isoamyl (meth)acrylate, isobutyl (meth)acrylate, isooctyl (meth)acrylate, (meth)acrylic acid Cyclohexyl ester, isodecyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentaoxyethyl (meth)acrylate, isotetradecyl (meth)acrylate, lauryl (meth)acrylate , methoxydipropylene glycol (meth) / acrylate, methoxytripropylene glycol (meth) acrylate, methoxy polyethylene glycol (methyl) propyl acrylate, methoxy triethylene glycol (meth) acrylate , (meth)acrylic acid methyl vinegar, neopentyl glycol benzoate (meth) acrylate, nonyl phenoxy polyethylene glycol (meth) acrylate, nonyl phenoxy polypropylene glycol (meth) acrylate Ester, (meth) propyl octanoate, p-cumyl phenoxy glycol (meth) acrylate, epichlorohydrin (below ECH) modified phenoxy acrylate, benzene (meth) acrylate Oxyethyl ester, phenoxy diglycol (meth) acrylate, phenoxy hexaethylene glycol (meth) acrylate vinegar, oxytetraethylene glycol (meth) acrylate, polyethylene glycol (methyl) Acrylic acid vinegar, polyethylene glycol-polypropylene glycol (meth) acrylate, polypropylene glycol-30- 200923003 (meth) propylene Ester, stearyl (meth) acrylate, EO modified succinic acid (meth) acrylate, tertiary (meth) acrylate, tribromophenyl (meth) acrylate, E0 modified (methyl) Tribromophenyl acrylate, tris(dodecyl)(meth) acrylate, p-isopropenol, styrene, α-methylstyrene, acrylonitrile, vinyl carbazole, urethane (meth) acrylate. A polyfunctional polymerizable unsaturated monomer having two or more groups containing an ethylenically unsaturated bond is also preferably used as the other polymerizable monomer. Difunctional polymerizable unsaturated monomers having two groups containing an ethylenically unsaturated bond suitable for use in the present invention are, for example, diethylene glycol monoethyl ether (meth) acrylate, dimethylol dichloropentane (methyl) Acrylate, di(meth)acrylonitrile deuterated isocyanurate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, Ε0 Modified 1,6-hexanediol di(meth)acrylate, ECH modified 1,6-hexanediol di(meth)acrylate, allyloxy polyethylene glycol acrylate, 1,9-anthracene Diol (meth) acrylate, bismuth bisphenol quinone di(meth) acrylate, P0 modified bisphenol A di(meth) acrylate, modified bisphenol A di(meth) acrylate Ester, E0 modified bisphenol F di(meth) acrylate, ECH modified hexahydrophthalic acid diacrylate, hydroxytrimethyl acetic acid neopentyl glycol di(meth) acrylate, neopentyl glycol di Methyl) acrylate, E 〇 modified neopentyl glycol diacrylate, propylene oxide (lower p〇) modified neopentyl glycol diacrylate, caprolactone modified hydroxy trimethyl acetic acid Ester neopentyl glycol, stearic acid modified neopentyl alcohol di(meth) acrylate, ECH modified bis (meth) acrylate, poly (ethylene glycol-tetramethylene glycol) II Methyl) acrylate, poly(propylene glycol-tetramethylene glycol) di(meth) acrylate, polyester (di) acrylate, polyethylene glycol di(meth) acrylate, polypropylene glycol di(methyl) ) acrylate, gCH modified propylene glycol di(meth) acrylate, fluorenone di(meth) acrylate, tri-31 - 200923003 glycol di(meth) acrylate, tetraethylene glycol di(methyl) Acrylate, dimethylol tricyclodecane di(meth) acrylate, neopentyl glycol modified trimethylolpropane di(meth) acrylate, tripropylene glycol di(meth) acrylate, EO modification Tripropylene glycol di(meth)acrylate, triglycerin di(meth)acrylate, dipropylene glycol di(meth)acrylate, diethylene acetal, divinyl acetal, urethane (meth) acrylate . Among these, 'new pentanediol di(meth) acrylate, 1,9-nonanediol di(meth) acrylate, tripropylene glycol di(meth) acrylate, tetraethylene glycol di(meth) acrylate Esters, hydroxytrimethylacetic acid neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and the like are particularly suitable for use in the present invention. The polyfunctional polymerizable unsaturated monomer having three or more ethylenically unsaturated bond-containing groups is, for example, ECH-modified glycerol tri(meth)acrylate, EO-modified glycerol tri(meth)acrylate, P〇. Modified triglyceride (meth) acrylate, neopentyl alcohol triacrylate, EO modified phosphoric acid triacrylate, trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane three (Meth) acrylate, E 0 modified trimethylolpropane tri(meth) acrylate, p 〇 modified trimethylolpropane tri (meth) acrylate, ginseng (propylene oxyethyl) heterotrimer Cyanate ester, dipentaerythritol hexa(meth) acrylate, caprolactone modified dipentaerythritol hexa(meth) acrylate diamyl pentoxide hydroxy penta (meth) acrylate vinegar, hospital Base modified dipentaerythritol penta (meth) acrylate, dipentaerythritol poly(methyl) bis-succinic acid ester, alkyl modified dine pentaerythritol tris (meth) acrylate vinegar, two ( Di-methyl)propane tetra(meth)acrylate, neopentyl alcohol ethoxytetra(meth)acrylate, neopentyl alcohol Tetra (meth) acrylate, urethane (meth) acrylate, and the like. Tracing t' EO to change glycerol di(methyl) propylene vinegar, p 〇 modified gan-32- 200923003 oil tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, E Rhodium-modified trimethylolpropane tri(meth)acrylate' PO modified trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, neopentyl alcohol ethoxylate Tetrakis (meth) acrylate, neopentyl alcohol tetra (meth) acrylate, urethane (meth) acrylate, etc. are particularly suitable for use in the present invention. The urethane (meth) acrylate is available as a (meth) acrylate or a polyfunctional acrylate. Specific compounds include U-2PPA, UA-4100, UA-5 20 1, U-4H, U-4HA, U-6HA, U-15HA, etc., manufactured by Shin-Nakamura Chemical Co., Ltd. In the composition of the present invention, in order to further increase the crosslinking density, a polyfunctional oligomer or a polymer having a molecular weight larger than that of the above polyfunctional polymerizable monomer can be blended in an amount which can achieve the object of the present invention. The polyfunctional oligomer having photo-radical polymerizability includes various acrylate oligomers such as polyester acrylate, urethane acrylate, polyether acrylate, and polyepoxy acrylate. The other polymerizable monomer used in the present invention may be a compound having an oxirane ring. The compound having an oxirane ring is, for example, a polyglycidyl ester of a polybasic acid, a polyglycidyl ether of a polyhydric alcohol, a polyglycidyl ether of a polyoxyalkylene glycol, or a polycondensation of an aromatic polyhydric alcohol. Hydrogenated compounds of epoxidized ethers, urethane polyepoxides, and epoxidized polybutadienes. These compounds may be used alone or in combination of two or more. For the compound containing epoxy propyl group, commercially available products include UVR-6216 (manufactured by Union Carbide Co., Ltd.), dehydrated glycerin, AOEX24, CYCLOMER A200 (manufactured by DAICEL Chemical Industry Co., Ltd.), EPIKOTE 828, EPIKOTE 812, EPIKOTE 1031, EPIKOTE 872 ' EPIKOTE CT5 08 (above the oily SHELL (share) system), KRM-2400, KRM-2410, KRM-2408 'KRM-2490, KRM-2720, KRM-275 0C or above Asahi Chemical Industry Co., Ltd. System) -33- 200923003 and so on. These may be used alone or in combination of two or more. The preparation method of these compounds having an oxirane ring is not particularly limited, and can be referred to, for example, 'Jishan KK Publishing, Fourth Edition Experimental Chemistry Lecture 20 Organic Synthesis 11 ' 21 3 ~ 4 Years' Ed. by Alfred Hasiner, The chemistry Of heterocyclic compounds-Small Ring Heterocycles part 3 Oxiranes, John Wiley & Sons, An Interscience Publication,

New York, 1985,吉村,接著,29 卷 12 號,32,1985,吉村, 接著,30卷5號,42,1986’吉村,接著,30卷7號,42, 1 986 ’特開平1 1 - 1 00378號公報,日本專利第2906245號公 報,日本專利第2926262號公報等文獻合成。 亦可倂用乙烯醚化合物作爲用於本發明之其它聚合性 單體。1 乙烯醚化合物適當選擇即可,例如2 -乙基己基乙烯醚、 丁二醇-1,4 -二乙烯醚、二甘醇一乙烯醚、乙二醇二乙烯醚、 三甘醇二乙儲醚、1,2-丙二醇二乙烯醚、ι,3 -丙二醇二乙烯 醚、1,3 -丁二醇二乙烯醚、1,4 -丁二醇二乙烯醚、四亞甲二 醇二乙烯醚、新戊二醇二乙烯醚、三羥甲丙烷三乙烯醚、 三羥甲乙烷三乙烯醚、己二醇二乙烯醚、四甘醇二乙烯醚、 新戊四醇一乙稀醚、新戊四醇二乙嫌酸、新戊四醇四乙嫌 醚、山梨醇四乙烯醚、山梨醇五乙烯醚、乙二醇二伸乙基 乙烯醚、三甘醇二伸乙基乙烯醚、乙二醇二伸丙基乙烯醚、 三甘醇二伸乙基乙烯醚、三羥甲丙烷三伸乙基乙烯醚、三 羥甲丙烷二伸乙基乙烯醚、新戊四醇二伸乙基乙烯醚、新 戊四醇三伸乙基乙烯醚、新戊四醇四伸乙基乙烯醚、1,1,1-參[4-(2 -乙稀氧乙氧基)苯基]乙院、雙酣a二乙嫌氧乙基醚 -34- 200923003 等。 這些乙烯酿化合物可依例如Stephen C. Lapin, Polymers Paint Colour Journal,1 79(4237),3 2 1 ( 1 98 8)所述之方法,亦 即由多元醇或多元酚與乙炔之反應,或多元醇或多元酚與 鹵化烷基乙烯醚之反應合成;這些可以1種單獨或組合2 種以上使用。 亦可採用苯乙烯衍生物作爲用於本發明之其它聚合性 單體。苯乙烯衍生物有例如對甲氧苯乙烯、對甲氧-0 -甲 苯乙烯、對蹲苯乙烯等。New York, 1985, Yoshimura, then, 29 volumes No. 12, 32, 1985, Yoshimura, then, 30 volumes No. 5, 42, 1986 'Yoshimura, then, 30 volumes, No. 7, 42, 1 986 'Special Kaiping 1 1 - Japanese Patent No. 2906245, Japanese Patent No. 2926262, and the like are synthesized. A vinyl ether compound can also be used as the other polymerizable monomer used in the present invention. 1 The vinyl ether compound may be appropriately selected, for example, 2-ethylhexyl vinyl ether, butanediol-1,4-divinyl ether, diethylene glycol monovinyl ether, ethylene glycol divinyl ether, triethylene glycol diethyl storage Ether, 1,2-propanediol divinyl ether, iota, 3-propylene glycol divinyl ether, 1,3-butanediol divinyl ether, 1,4-butanediol divinyl ether, tetramethylene glycol divinyl ether , neopentyl glycol divinyl ether, trimethylolpropane trivinyl ether, trimethylolethane trivinyl ether, hexanediol divinyl ether, tetraethylene glycol divinyl ether, neopentyl alcohol-ethylene ether, new Pentaerythritol diethylene acid, neopentyl alcohol tetraethylene ether, sorbitol tetravinyl ether, sorbitol pentavinyl ether, ethylene glycol diethylene ethyl ether, triethylene glycol diethylene vinyl ether, B Diol propyl vinyl ether, triethylene glycol diethyl ether, trimethylolpropane triethyl ether, trimethylolpropane diethyl vinyl ether, neopentyl alcohol diethylene ethyl Ether, neopentyl alcohol tri-ethyl vinyl ether, neopentyl alcohol tetraethyl ether, 1,1,1-gin[4-(2-ethoxyethoxyethoxy)phenyl] Double 酣 a diethylene oxyethyl ether - 34- 200923003 and so on. These vinyl styrene compounds can be reacted, for example, by a method described by Stephen C. Lapin, Polymers Paint Colour Journal, 1 79 (4237), 3 2 1 (1 98 8), that is, by reacting a polyhydric alcohol or a polyhydric phenol with acetylene, or The reaction of the polyol or the polyhydric phenol with the halogenated alkyl vinyl ether is carried out; these may be used alone or in combination of two or more. A styrene derivative can also be used as the other polymerizable monomer used in the present invention. The styrene derivative is, for example, p-methoxystyrene, p-methoxy-0-methylstyrene, p-nonylstyrene or the like.

Jtt外’可與本發明之一官能聚合物倂用的苯乙烯衍生物 有例如苯乙烯、對甲苯乙烯、對甲氧苯乙烯、/3 -甲苯乙烯、 對甲-甲衆乙烯、α·甲苯乙烯、對甲氧-甲苯乙烯、 對經苯乙嫌等;乙烯萘衍生物有例如1-乙烯萘、α -甲基-1- 乙燒蔡' θ'申基-1-乙烯萘、4-甲基-1-乙烯萘、4-甲氧基-1- 乙烯萘等。 胃胃升與模具之剝離性、塗布性,亦可倂用(甲基)丙烯 _ = 、(甲基)丙烯酸五氟乙酯、(甲基)丙烯酸(全氟 T S )乙醋、全氟丁基-羥丙基(甲基)丙烯酸酯、(甲基)丙烯 酸(全氣5基)乙酯、(甲基)丙烯酸八氟戊酯、(甲基)丙烯酸 全氣辛乙ϋ、(甲基)丙烯酸四氟丙酯等具有氟原子之化合 物。 亦可·配合丙烯醚及丁烯醚作爲用於本發明之其它聚合 性單體。適用者有例如丨-十二基-丨_丙烯醚、丨_十二基 丁嫌酸、丨· 丁烯氧甲基-2降萡烯、1,4 -二(1-丁烯氧基)丁烷、 (丁稀氧基)癸院、1,4 - 一(1-丁稀氧甲基)環己院、 200923003 一甘醇二(1_ 丁烯基)醚、1,2,3-三(1-丁烯氧基)丙烷、丙烯醚 伸丙基碳酸酯等。 其它聚合性單體係以丨〇~9〇質量%含於組成物中爲較 佳’ 2 0 ~ 8 0質量%更佳。 其次說明本發明中單體及其它聚合性單體(以下這些或 倂稱「聚合性不飽和單體」)之較佳摻合形態。本發明之組 成物係以’同一分子內有反應性不同之2種以上硬化性官 能基’且,該硬化性官能基之至少其一係α0 —不飽和酯 / 基之單體爲必要成分,含有其它聚合性單體則較佳。 一官能之聚合性不飽和單體通常係用作反應性稀釋 劑’於降低本發明之組成物的黏度有效,通常係以全部聚 合性不飽和單體之1 5質量%以上添加。2 0〜8 0質量%較佳, 25〜70質量%更佳,30〜60質量%尤佳。 該一官能聚合性不飽和單體因適用作反應性稀釋劑,以 全部聚合性不飽和單體之1 5質量%以上添加爲佳。 有2個含不飽和鍵之基的單體(二官能聚合性不飽和單 體)係以全部聚合性不飽和單體之90質量%以下添加,80 i. 質量%以下較佳,70質量%以下尤佳。一官能及二官能聚合 性不飽和單體之添加比率係全部聚合性不飽和單體之1 ~95 質量%,3 ~ 9 5質量%較佳,5〜9 0質量%更佳。有3個以上 含不飽和鍵之基的多官能聚合性不飽和單體之較佳添加比 率係全部聚合性不飽和單體的80質量%以下,70質量%以 下更佳,60質量%以下尤佳。使有3個以上含聚合性不飽 和鍵之基的聚合性不飽和單體之比率爲80質量%以下,則 可降低組成物之黏度故較佳。 -36- 200923003 本發明之組成物,表面張力係以18〜30mN/m爲佳, 20~28mN/m更佳。在如此範圍即可得提升表面平滑性之效 果。 本發明之組成物,調製時之水分量係以2.0質量%以下 爲佳,1 .5質量%以下更佳,1.0質量%以下尤佳。調製時之 水分量爲2.0質量%以下,即可更安定保存本發明之組成 物。 本發明之組成物,有機溶劑含量係以全體組成物中之3 質量%以下爲佳。亦即,本發明之組成物,較佳者因含如上 之一官能及或二官能的其它單體作爲反應性稀釋劑,未必 需含有機溶劑以溶解本發明之組成物成分。若不含有機溶 劑則爲揮發溶劑之烘烤步驟即可不必,能有效簡化程序等 優點重大。因此,本發明之組成物,有機溶劑含量係以3 質量%以下爲佳,2質量%以下更佳,不含者尤佳。如此, 本發明之組成物未必須含有機溶劑,而反應性稀釋劑在使 不溶化合物等溶解作爲本發明之組成物時,或微調黏度之 際’可任意添加。可用於本發明之組成物的較佳有機溶劑 種類,係一般用於光奈米壓印用硬化性組成物、光阻之溶 劑’係能將本發明所用之化合物溶解及均勻分散者即佳, 且若係不與這些成分反應者即無特殊限制。 該有機溶劑有例如甲醇、乙醇等醇類;四氧呋喃等醚 類;乙二醇一甲醚、乙二醇二甲醚、乙二醇甲基乙基醚、 乙二醇一乙醚等二醇醚類;乙酸甲賽璐蘇、乙酸乙賽璐蘇 等乙酸乙二醇烷基醚類;二甘醇一甲醚、二甘醇二乙醚、 二甘醇二甲醚、二甘醇乙基甲基醚、二甘醇一乙醚、二甘 -37- 200923003 醇一丁醚等二甘醇類;乙酸丙二醇甲基醚、乙酸丙二醇乙 基醚等乙酸丙二醇烷基醚類;甲苯、二甲苯等芳香族輕類; 丙酮、丁酮、甲基異丁基酮、環己酮、4-羥-4-甲-2-戊酿j ' 2-戊酮等酮類;2-羥丙酸乙酯、2-羥-2-甲丙酸甲酯、2-裡·2_ 甲丙酸乙酯、乙氧乙酸乙酯、羥乙酸乙酯、2_羥甲丁酸 甲酯、3-甲氧丙酸甲酯、3-甲氧丙酸乙酯、3-乙氧丙酸甲醋、 3 -乙氧丙酸乙酯 '乙酸乙酯、乙酸丁酯,乳酸甲酯、乳酸 乙酯等乳酸酯類等酯類。 並亦可添加Ν-甲基甲醯胺、Ν,Ν-二甲基甲醯胺、Ν_甲基 甲醯胺苯、Ν-甲基乙醯胺、Ν,Ν-二甲基乙醯胺、Ν_甲基口比 咯烷酮、二甲亞颯、苯甲基乙醚、二己醚、乙醯丙酮、異 佛酮、己酸、辛酸、卜辛醇、1-壬醇、苯甲醇、乙酸苯甲 酯、苯甲酸乙酯、草酸二乙酯、順丁烯二酸乙酯、r_丁內 酯、碳酸伸乙酯、碳酸伸丙酯、乙酸苯賽璐蘇等高沸點溶 劑。這些可以1種單獨使用或倂用2種以上。 這些之中’乙酸甲氧丙二醇、2-羥丙酸乙酯、3·羥两酸 甲酯、3 -甲氧丙酸甲酯、3 -乙氧丙酸乙酯、乳酸乙酯、環 己酮、甲基異丁基酮、2-庚酮等尤佳。 本發明之組成物中,以不含分子量超過1000之化合物 爲佳。爲如此之組成’即可抑制組成物之黏度上升。此所 謂分子量,構造確定之化合物係由分子式計算,如高分子 化合物之具複數構造的化合物之複合物者,指以GPC法(聚 苯乙烯換算)測定之分子量。 光聚合引發劑 本發明之組成物以含光聚合引發劑爲佳。用於本發明之 200923003 光聚合引發劑係以全體組成物中之例如0 . 1〜1 5質量%含 有’ 0.2〜12質量%更佳,0.3~10質量%尤佳。使用2種以上 之光聚合引發劑時,其合計量在該範圍。 光聚合引發劑之比率爲0.1質量%以上,則感度(速硬化 性)、解析度、線緣粗糙性、塗膜強度有改善之傾向而較佳。 另一方面,光聚合引發劑之比率爲1 5質量%以下,則透光 性、著色性、取用性等有提升之傾向而較佳。目前爲止, 含染料及/或顏料之噴墨用組成物、液晶顯示器彩色濾光片 用組成物中,較佳光聚合引發劑及/或光酸產生劑之添加量 已有種種探討,而至於奈米壓印用等之光奈米壓印用硬化 性組成物的較佳光聚合引發劑及/或光酸產生劑之添加量 則未見報告。亦即,於含染料及/或顏料之系統,這些係用 作自由基捕捉劑,不影響光聚合性、感度。考慮及此,於 這些用途,光聚合引發劑之添加量係經最適化。而本發明 之組成物並不以染料及/或顏料爲必要成分,光聚合引發劑 之最適範圍有時異於噴墨用組成物、液晶顯示器彩色濾光 片用組成物等領域者。 用於本發明之光聚合引發劑係使用,配合對於所用光源 的波長具有活性之物,以促使產生恰當之活性物種者。 用於本發明之光聚合引發劑可係例如市售引發劑。這些 有例如可自 Ciba公司取得之 Irgacure(註冊商 標)2959(1-[4-(2-羥乙氧基)苯基]-2-羥-2-甲基-卜丙基-卜 酮)、Irgacure(註冊商標)184(1-羥環己基苯基酮)、 Irgacure(註冊商標)500( 1 -羥環己基苯基酮、二苯基酮)、 Irgacure(註冊商標)651(2,2-二甲氧-1,2-二苯乙基-1-酮)、 -39- 200923003A styrene derivative which can be used with a functional polymer of the present invention is, for example, styrene, p-methylstyrene, p-methoxystyrene, /3-methylstyrene, p-methylenevinylene, ?-toluene. Ethylene, p-methoxy-methylstyrene, p-benzoic acid, etc.; vinylnaphthalene derivatives are, for example, 1-vinylnaphthalene, α-methyl-1-ethene-cai- θ'-Shenyl-1-vinylnaphthalene, 4- Methyl-1-vinylnaphthalene, 4-methoxy-1-vinylnaphthalene, and the like. Gastrointestinal peeling and mold peelability, coating properties, can also be used (meth) propylene _ =, (meth) acrylate pentafluoroethyl ester, (meth) acrylic acid (perfluoro TS) ethyl vinegar, perfluorobutyl Base-hydroxypropyl (meth) acrylate, (meth)acrylic acid (all-gas 5-yl) ethyl ester, (meth)acrylic acid octafluoropentyl ester, (meth)acrylic acid all-gas octyl hydrazine, (methyl A compound having a fluorine atom such as tetrafluoropropyl acrylate. Further, propylene ether and butenyl ether may be blended as the other polymerizable monomer used in the present invention. Suitable for use are, for example, anthracene-dodecyl-fluorene-propene ether, anthracene-dodecylbutyric acid, anthracene·butenoxymethyl-2nordecene, 1,4-bis(1-butenyloxy) Butane, (butoxy) brothel, 1,4 -1 (1-butoxymethyl) cyclohexyl, 200923003 monoglycol bis(1-butenyl) ether, 1,2,3-three (1-butoxy)propane, propylene ether propyl carbonate, and the like. The other polymerizable single system is preferably contained in the composition of 2~9〇% by mass in terms of preferably '20 to 80% by mass. Next, a preferred blending form of the monomer and other polymerizable monomers (hereinafter referred to as "polymerizable unsaturated monomers") in the present invention will be described. The composition of the present invention contains two or more kinds of curable functional groups having different reactivity in the same molecule, and at least one of the monofunctional α0-unsaturated ester groups of the curable functional group is an essential component. It is preferred to contain other polymerizable monomers. The monofunctional polymerizable unsaturated monomer is usually used as a reactive diluent. It is effective for lowering the viscosity of the composition of the present invention, and is usually added at 15% by mass or more of all the polymerizable unsaturated monomers. 2 0 to 8 0% by mass is preferable, 25 to 70% by mass is more preferable, and 30 to 60% by mass is particularly preferable. The monofunctional polymerizable unsaturated monomer is preferably used as a reactive diluent, and is preferably added in an amount of 15% by mass or more based on the total of the polymerizable unsaturated monomers. The monomer having two groups containing an unsaturated bond (difunctional polymerizable unsaturated monomer) is added in an amount of 90% by mass or less based on all of the polymerizable unsaturated monomers, and 80% by mass or less is preferably 70% by mass or less. The following is especially good. The addition ratio of the monofunctional and difunctional polymerizable unsaturated monomers is from 1 to 95% by mass based on the total of the polymerizable unsaturated monomers, preferably from 3 to 9.5 mass%, more preferably from 5 to 90% by mass. A preferred addition ratio of the polyfunctional polymerizable unsaturated monomer having three or more groups containing an unsaturated bond is 80% by mass or less, more preferably 70% by mass or less, and particularly preferably 60% by mass or less. good. When the ratio of the polymerizable unsaturated monomer having three or more groups containing a polymerizable unsaturated bond is 80% by mass or less, the viscosity of the composition can be lowered, which is preferable. -36- 200923003 The composition of the present invention preferably has a surface tension of 18 to 30 mN/m and more preferably 20 to 28 mN/m. In such a range, the effect of improving surface smoothness can be obtained. In the composition of the present invention, the water content at the time of preparation is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, and still more preferably 1.0% by mass or less. When the water content at the time of preparation is 2.0% by mass or less, the composition of the present invention can be more stably stored. In the composition of the present invention, the organic solvent content is preferably 3% by mass or less based on the total composition. That is, the composition of the present invention preferably contains, as a reactive diluent, another monomer having one or more of the above functions, and it is not necessary to contain an organic solvent to dissolve the component of the present invention. If the organic solvent is not contained, the baking step of the volatile solvent is not necessary, and the procedure can be simplified, which is advantageous. Therefore, in the composition of the present invention, the organic solvent content is preferably 3% by mass or less, more preferably 2% by mass or less, and particularly preferably not included. As described above, the composition of the present invention does not necessarily contain an organic solvent, and the reactive diluent can be arbitrarily added when the insoluble compound or the like is dissolved as a component of the present invention or when the viscosity is finely adjusted. A preferred organic solvent type which can be used in the composition of the present invention is a solvent which is generally used for a photocurable composition for photonic imprinting, and a photoresist which is capable of dissolving and uniformly dispersing the compound used in the present invention. And if it does not react with these components, there is no particular limitation. The organic solvent is, for example, an alcohol such as methanol or ethanol; an ether such as tetraoxane; a glycol such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether or ethylene glycol monoethyl ether. Ethers; ethylene glycol acetate such as acesulfame acetate, ethyl acesulfame acetate; diethylene glycol monomethyl ether, diethylene glycol diethyl ether, diglyme, diethylene glycol ethyl Diethylene glycol such as dimethyl ether, diethylene glycol monoethyl ether, digan-37-200923003 alcohol monobutyl ether; propylene glycol alkyl ether acetate such as propylene glycol methyl ether acetate or propylene glycol ethyl ether; aromatics such as toluene and xylene Alkaloids; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanyl ketones such as j '2-pentanone; ethyl 2-hydroxypropionate, Methyl 2-hydroxy-2-methylpropanoate, 2-ri·2_ethyl propionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxymethylbutyrate, 3-methoxypropionic acid Esters such as ester, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, etc. class. Also, Ν-methylformamide, hydrazine, hydrazine-dimethylformamide, hydrazine-methylmethalamine benzene, hydrazine-methylacetamide, hydrazine, hydrazine-dimethylacetamide may be added. , Ν_methyl-port pyrrolidone, dimethyl hydrazine, benzyl ether, dihexyl ether, acetamidine, isophorone, caproic acid, octanoic acid, octyl alcohol, 1-nonanol, benzyl alcohol, High boiling point solvents such as benzyl acetate, ethyl benzoate, diethyl oxalate, ethyl maleate, r-butyrolactone, ethyl carbonate, propyl carbonate, and benzoquinone acetate. These may be used alone or in combination of two or more. Among these, 'methoxypropanediol acetate, ethyl 2-hydroxypropionate, methyl 3-hydroxydicarboxylate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethyl lactate, cyclohexanone Methyl isobutyl ketone, 2-heptanone, etc. are particularly preferred. The composition of the present invention preferably contains a compound having a molecular weight of more than 1,000. For such a composition, the viscosity of the composition can be suppressed from increasing. The molecular weight, the structure-determined compound is calculated from a molecular formula, such as a compound of a compound having a complex structure of a polymer compound, and means a molecular weight measured by a GPC method (polystyrene conversion). Photopolymerization Initiator The composition of the present invention is preferably a photopolymerization initiator. The 200923003 photopolymerization initiator used in the present invention is preferably contained in the total composition of, for example, 0.1 to 15 mass%, more preferably 0.2 to 12% by mass, more preferably 0.3 to 10% by mass. When two or more kinds of photopolymerization initiators are used, the total amount thereof is in this range. When the ratio of the photopolymerization initiator is 0.1% by mass or more, the sensitivity (speed hardenability), the resolution, the edge roughness, and the coating film strength tend to be improved. On the other hand, when the ratio of the photopolymerization initiator is 15% by mass or less, the light transmittance, the coloring property, the removability, and the like tend to be improved. In the inkjet composition containing a dye and/or a pigment, and the composition for a color filter of a liquid crystal display, the amount of a photopolymerization initiator and/or a photoacid generator to be added has been variously discussed. The addition amount of a preferred photopolymerization initiator and/or photoacid generator for the curable composition for photon nanoimprint for nanoimprinting has not been reported. That is, in a system containing a dye and/or a pigment, these are used as a radical scavenger, and do not affect photopolymerization and sensitivity. In view of this, in these applications, the amount of the photopolymerization initiator added is optimized. On the other hand, the composition of the present invention does not contain a dye and/or a pigment as an essential component, and the optimum range of the photopolymerization initiator may be different from those of an inkjet composition, a liquid crystal display color filter composition, and the like. The photopolymerization initiator used in the present invention is used in combination with an active material for the wavelength of the light source used to promote the production of an appropriate active species. The photopolymerization initiator used in the present invention may be, for example, a commercially available initiator. These include, for example, Irgacure (registered trademark) 2959 (1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-propyl-propyl) available from Ciba Corporation, Irgacure ( Registered trademark) 184 (1-hydroxycyclohexyl phenyl ketone), Irgacure (registered trademark) 500 (1-hydroxycyclohexyl phenyl ketone, diphenyl ketone), Irgacure (registered trademark) 651 (2, 2-dimethyl Oxy-1,2-diphenylethyl-1-one), -39- 200923003

Irgacure(註冊商標)369(2-苯甲基-2-二甲胺-1-(4-味啉苯基) 丁酮-1)、Irgacure(註冊商標)907(2 -甲- l- [4-甲硫苯基]-2 -味 啉丙基-1 -酮)、Irgacure(註冊商標)819(氧化雙(2,4,6-三甲苯 甲醯基)苯膦)、Irgacure(註冊商標)1800(氧化雙(2,6-二甲氧 苯甲基)-2,4,4 -三甲基戊膦、1-羥環己基苯基酮)、 Irgacure(註冊商標)1 800(氧化雙(2,6-二甲氧苯甲醯 基)-2,4,4 -三甲基戊膦、2 -羥基-2 -甲基-1-苯基-1-丙基-1-酮)、Irgacure(註冊商標)OXE01(1,2 -辛二酮)、1-[4-(苯硫基) 苯基]-2-(0-苯醯肟)、Darocur(註冊商標)1173(2-羥基-2 -甲 基-1-苯基-1-丙基-1-酮)、Darocur(註冊商標)1116、1398、 1174 及 1 020、CGI242(乙酮、1-[9-乙基-6-(2-甲苯甲醯 基)-9H-咔唑-3-基]-1-(0-乙醯肟),可自 BASF公司取得之 Lucirin TPO(氧化 2,4,6 -三甲苯甲醯二苯膦)、L u c i r ι η TPO-L(氧化2,4,6-三甲苯甲醯基乙氧基苯膦),可自ESACUR 日本SiberHegner公司取得之ESACURE 1001Μ(1-[4 -苯甲醯 苯基锍基]苯基]-2-甲基- 2-(4-甲苯楓基)丙基-1-酮),N-1414 可自旭電化公司取得之 ADEKA 〇PT0MER(註冊商 標)N-1414(咔唑.苯酮系)、ADEKA OPTOMER(註冊商 標)N-17 17(吖啶系)、ADEKA 0PT0MER(註冊商標)N- 1 606(三 阱系)、三和化學製TFE-三畊(2-[2-(呋喃-2-基)苯基]-4,6-雙(三氯甲基)-1,3,5-三阱)、三和化學製丁河£-三阱(2-[2-(5-甲呋喃-2-基)苯基]-4,6-雙(三氯甲基)-1,3,5-三哄)、三和化 學製 MP-三阱(2-(4 -甲氧苯基)-4,6-雙(三氯甲基)-1,3,5-三 阱)、綠化學製TAZ-113(2-[2-(3,4-二甲氧苯基)乙烯基]-4,6-雙(三氯甲基)-1,3,5-三阱)、綠化學製TAZ-108(2-(3,4 -二甲 -40- 200923003 氧苯基)-4,6-雙(三氯甲基)-^5-三阱),二苯基_、μ,— 雙二乙胺二苯基酮、甲基_2-二苯基酮、4_苯甲醯—甲基 -氯-9 -氧硫口山 苯硫醚 苯二苯基酮、乙基米其勒酮 口生、2 -甲基-9 -氧硫卩山喂、2 -異丙-9 -氧硫卩山[I星、 4 -異丙-9 -氧 硫Dilj卩星、2,4-二乙基-9-氧硫卩山哩、丨-氯-扣丙氣 與基-9 -氧硫口山 唱、2-甲基-9-氧硫卩山唱、9-氧硫妯哽銨鹽、苯偶姻、* 4, 二甲氧苯偶姻、苯偶姻甲醚、苯偶姻乙醚、苯偶姻異丙醚、 苯偶姻異丁醚、苯甲基二甲縮酮、1,丨,卜三氯苯乙酮二^氧 苯乙酮及環庚酮、鄰苯甲醯苯甲酸甲酯、2來 本甲醯萘、4-苯 甲醯聯苯、4-苯甲醯二苯醚' i,4-苯甲醯苯、〜〜 〜本甲酿、1 〇- 丁基-2-氯吖啶酮' [4-(甲苯硫基)苯基]苯甲院 — ζ -乙基恩醒、 2,2-雙(2-氯苯基)-4,5,4,,5’ _肆(3,4,5_三甲氧苯基η,〗,—聯 咪唑、2,2-雙(鄰氯苯基)-4,5,4’ ,5’ -四苯-1ι2 (4 -聯咪唑、參 -甲胺苯基)甲烷、4-(二甲胺基)苯甲酸乙酯、苯甲酸2·(二 甲胺基)乙酯、4-(二甲胺基)苯甲酸丁氧乙酯等。 本發明之組成物除光聚合引發劑以外,亦可添加光增感 劑,調整UV範圍之波長。可用於本發明之典型增感劑有 揭示於 Crivello〔J.V.Crivell〇,Adv.in P〇lymer Sci,62,丄 ( 1 9 84)〕者;具體而言有芘 '茈、吖啶橙' 9_氧硫_嗤、2_ 氯-9-氧硫卩山哩、苯黃素、N -乙烯咔D坐、9,10-二丁氧蒽、蒽 醒、薰草素、酮基薰草素、菲、樟腦醌、啡噻阱衍生物等。 界面活性劑 本發明之組成物含界面活性劑。用於本發明之界面活性 劑係以全體組成物中之例如含有〇 . 0 0 1 ~ 5質量% ’ 〇 _ 0 0 2 ~ 4 質量%更佳,0.005〜3質量%尤佳。使用2種以上之界面活 -41 - 200923003 性劑時’其合計量在該範圍。界面活性劑於組成物中未達 0.001質量%則塗布均勻效果不足,而超過5質量%則致使 模具轉印特性惡化而不佳。 界面活性劑係以含氟系界面活性劑、矽酮系界面活性劑 及氟•矽酮系界面活性劑之至少1種爲佳,含氟系界面活 性劑與矽酮系界面活性劑二者,或氟.矽酮系界面活性劑 更佳’含氟·矽酮系界面活性劑最佳。 於此’氟•矽酮系界面活性劑指,兼具氟系界面活性劑 及矽酮系界面活性劑二者之要件者。 使用如此之界面活性劑,將本發明之組成物塗布於半導 體元件製造用之矽晶圓,液晶元件製造用之玻璃方形基 板,形成有鉻膜、鉬膜、鉬合金膜、鉅膜、組合金膜、氮 化矽膜、非晶矽膜、摻雜有氧化錫之氧化銦(ITO)膜、氧化 錫膜等各種膜之基板上時所產生之輝紋、鱗狀模樣(光阻膜 之乾燥斑)等塗布缺失問題可獲解決,並可改良組成物往模 具凹腔內之流動性,改良模具與光阻間之剝離性,改善光 阻與基板間之密著性,降低組成物之黏度等。尤以於本發 明之組成物,因添加該界面活性劑,塗布均勻性可大幅改 善,於使用旋塗機、狹縫掃描塗布機之塗布,可得無關基 板尺寸之良好塗布適性。 用於本發明之非離子氟系界面活性劑有例如商品名 FLUORAD FC-430、FC-431(住友 3M 公司製),商品名 SURFLON S-3 82(旭硝子公司製)、EFTOP EF-122A、122B、 122C、EF-121、EF-126、EF-127、MF-100(TOCHEM PRODUCTS 公司製),商品名 PF-636、PF-6320、PF-656 ' PF-6520(皆係 -42- 200923003 OMNOVA 公司),商品名 FUTAGENT FT250、FT25 卜 DFX18(皆 係' NE〇S(股)製),商品名 UNIDAIN DS-401、DS-403、 DS-451(皆係 DAIKIN 工業(股)製),商品名 MEGAFAC 171' 172、173、178K、178A(皆係大日本油墨化學工業公司製); 非離子氟系界面活性劑有例如,商品名SI-10系列(竹本油 脂公司製),MEG AFAC PAINT ADD 31 (大日本油墨化學工業 公司製),KP-341(信越化學工業公司製)。 用於本發明之氟•矽酮系界面活性劑有例如商品名 f Χ-70-090、Χ-70-091、Χ-70-092、Χ-70-093(皆係信越化學工 業公司製),商品名MEGAFAC R-08、XRB-4(皆係大日本油 墨化學工業公司製)。 抗氧化劑 本發明之組成物含習知抗氧化劑。用於本發明之抗氧化 劑的含量於全體組成物中係以10質量%以下爲佳,0.01〜10 質量%更佳’ 0.2 ~ 5質量%尤佳。使用2種以上之抗氧化劑 時,其合計量在該範圍。 抗氧化劑係抑制熱、照光所致之褪色,及臭氧、活性氧、 ξ V N 〇 x、S Ο x (X係整數)等各種氧化性氣體所致之裡色者。本 發明尤可藉添加抗氧化劑以防硬化膜著色。並具有能降低 分解所致之膜厚減少的優點。如此之抗氧化劑有醯肼類、 受阻胺系抗氧化劑、含氮雜環锍系化合物、硫醚系抗氧化 劑、受阻酚系抗氧化劑、抗壞血酸類、硫酸鋅、硫氰酸鹽 類、硫脲衍生物、糖類、亞硝酸鹽、亞硫酸鹽、硫代硫酸 鹽、羥胺衍生物等。 從改善硬化膜之透過性及膜厚減少的觀點,於本發明係 -43- 200923003 以受阻酚系抗氧化劑、受阻胺系抗氧化劑、硫醚系抗氧化 劑爲佳,受阻酚系抗氧化劑及受阻胺系抗氧化劑更佳。 抗氧化劑之市售品有Irganoxl〇i〇、1〇35、1 076、1 222(以 上汽巴嘉基(股)製),Antigene P、3C、FR、SUMILIZER S、 SUMILIZER GA80(住友化學工業製),ADEKASTAB AO70、 AO80、AO503 (ADEKA(股)製)等,這些可以單獨使用,或混 合使用。 其它成分 本發明之組成物除上述成分以外必要時亦可添加脫模 劑、矽烷耦合劑、聚合抑制劑 '紫外線吸收劑 '光安定劑、 老化防止劑、塑化劑、密著促進劑、熱聚合引發劑、著色 劑、彈性體粒子、光酸增殖劑、光鹼產生劑、鹼性化合物、 流動調整劑、消泡劑、分散劑等。 爲提高具有微細凹凸圖案之表面構造的耐熱性、強度, 或與金屬蒸镀層之密著性,亦可將有機金屬耦合劑配合於 本發明之組成物。有機金屬耦合劑並具有促進熱硬化反應 之效果。有機金屬耦合劑者可用例如矽烷耦合劑、鈦耦合 劑、锆耦合劑、鋁耦合劑、錫耦合劑等各種耦合劑。 該有機金屬耦合劑可以光奈米壓印用硬化性組成物之 固體成分總量中〇.〇〇丨~1〇質量%之比率任意配合。使有機 金屬親合劑之比率爲〇 · 〇 01質量%以上,於提升耐熱性、強 度、與蒸鍍層之密著性賦予即更有效。而使有機金屬耦合 劑之比率爲1 〇質量%以下,即傾向可抑制組成物在安定 性、成膜性上之缺失而較佳。 紫外線吸收劑之市售品有Tinuvin P' 234、320、326、 -44- 200923003 3 27、3 2 8、213(以上汽巴嘉基(股)製),SumisorbllO、130、 140 ' 220、250、300、320、340、350、400(以上住友化學 工業製)等。紫外線吸收劑係以占光奈米壓印用硬化性組成 物總量的0.0 1〜1 0質量%之比率任意配合爲佳。 光安定劑之市售品有Tinuvin 292、144、622LD(以上汽 巴嘉基(股)製),SANOL LS-770、765、292、2626、1114、 7 44(以上三共化成工業(股)製)等。光安定劑係以占組成物 總量的0.0 1〜1 0質量%之比率配合爲佳。 老化防止劑之市售品有Antigene W、S' P、3C、6C、RD-G、 FR、AW(以上住友化學工業製)等。老化防止劑係以占組成 物總量的0.0 1〜1 0質量%之比率配合爲佳。 爲調整與基板之黏著性、膜之柔軟性、硬度等,亦可於 本發明之組成物加塑化劑。較佳塑化劑之具體例有酞酸二 辛酯、酞酸二(十二)酯、三甘醇二辛酸酯、二甲基二醇酞 酸酯、磷酸三甲酚酯、己二酸二辛酯、癸二酸二丁酯、三 乙醯甘油、己二酸二甲酯、己二酸二正丁酯、栓酸二甲酯、 栓酸二乙酯、栓酸二正丁酯等。塑化劑可以組成物中的3 0 質量%以下任意添加;20質量%以下更佳,10質量%以下尤 佳。爲得塑化劑之添加效果,以0. 1質量%以上爲佳。 爲使本發明之組成物硬化,必要時亦可添加熱聚合引發 劑。較佳熱聚合引發劑有例如過氧化物、偶氮化合物。具 體而言,有過氧化苯甲醯基、過氧苯甲酸三級丁酯、偶氮 異丁腈等。 爲調整圖案形狀、感度等,必要時可於本發明之組成物 添加光鹼產生劑。較佳者有例如2 -硝苯甲環己胺甲酸酯、 -45 - 200923003 三苯甲醇、0-胺甲醯基羥基醯胺、〇-胺甲醯肟、[[(2,6-二 硝苯甲基)氧基]羰基]環己胺、雙[[(2-硝苯甲基)氧基]羰基] 己·1,6-二胺、4-(甲硫苯甲醯基)-1-甲-1-味啉乙烷、(4-味啉 苯甲醯基)-1-苯甲基-1-二甲胺丙烷、N-(2 -硝苯甲氧羰基) 吡咯啶、參(三苯甲基硼酸)六氨鈷(111 )、2 -苯甲-2 -二甲胺 _1-(4-味啉苯基)丁酮、2,6-二甲-3,5-二乙醯-4-(2’ -硝苯 基)-1,4-二氫吡啶、2,6-二甲-3,5-二乙醯- 4.(2’ ,4’ -二硝苯 基)-1,4 -二氫吡啶等。 f 爲塗膜視認性之提升等目的,亦可於本發明之組成物任 意添加著色劑。著色劑者可在無損於本發明目的之範圍使 用UV噴墨組成物、彩色濾光片用組成物及CCD影像感測 器用組成物等所用之顏料、染料。可用於本發明之顏料有 習知種種無機顏料或有機顔料。無機顏料係金屬氧化物、 金屬錯鹽等金屬化合物’具體有鐵、姑、銘、錫、錯、銅、 鈦、鎂、鉻、鋅、銻等金屬之氧化物、金屬複合氧化物。 有機顏料有例如 C.I. Pigment Yellow 11、24、31、53、83、 ,. 99、108、109、110、138、139、15卜 154、167,C.I. Pigment 'k,Irgacure (registered trademark) 369 (2-benzyl-2- dimethylamine-1-(4-morpholine phenyl) butanone-1), Irgacure (registered trademark) 907 (2-A-l- [4 -Methylthiophenyl]-2-carbolinepropyl-1-one), Irgacure (registered trademark) 819 (bis(2,4,6-trimethylphenylmethyl)phenylphosphine oxide), Irgacure (registered trademark) 1800 (bis(2,6-dimethoxybenzyl)-2,4,4-trimethylpentanephosphine, 1-hydroxycyclohexyl phenyl ketone), Irgacure (registered trademark) 1 800 (oxidized double ( 2,6-Dimethoxybenzhydryl)-2,4,4-trimethylpentanephosphine, 2-hydroxy-2-methyl-1-phenyl-1-propyl-1-one), Irgacure (registered trademark) OXE01 (1,2-octanedione), 1-[4-(phenylthio)phenyl]-2-(0-benzoquinone), Darocur (registered trademark) 1173 (2-hydroxy- 2-methyl-1-phenyl-1-propyl-1-one), Darocur (registered trademark) 1116, 1398, 1174 and 1 020, CGI242 (ethanone, 1-[9-ethyl-6-( 2-toluamyl)-9H-indazol-3-yl]-1-(0-acetamidine), Lucirin TPO available from BASF (oxidized 2,4,6-trimethylbenzenediphenyl) Phosphine), L ucir ι η TPO-L (oxidized 2,4,6-trimethylmethylmercaptoethoxyphenylphosphine), ESACURE 1001Μ(1-[4-benzoylphenyl)phenyl]-2-methyl-2-(4-methylbenzyl)propyl-1-one) available from ESACUR Japan SiberHegner, N-1414 ADEKA 〇PT0MER (registered trademark) N-1414 (carbazole benzophenone), ADEKA OPTOMER (registered trademark) N-17 17 (acridine), ADEKA 0PT0MER (registered trademark) N- 1 606 (triple well), tri-chemical TFE-three tillage (2-[2-(furan-2-yl)phenyl]-4,6-bis(trichloromethyl)-1, 3,5-Triple), Sanhe Chemical Dinghe £-Triple (2-[2-(5-methylfuran-2-yl)phenyl]-4,6-bis(trichloromethyl)- 1,3,5-triazine), tri-chemical MP-tripod (2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triad ), green chemical system TAZ-113 (2-[2-(3,4-dimethoxyphenyl)vinyl]-4,6-bis(trichloromethyl)-1,3,5-triad) , TAZ-108 (2-(3,4-dimethyl-40-200923003 oxyphenyl)-4,6-bis(trichloromethyl)-^5-triad), diphenyl _, ,, — bis-diethylamine diphenyl ketone, methyl 2 - diphenyl ketone, 4 — benzamidine — methyl — chloro-9 — oxo sulphur phenyl sulfide benzene Ketone, ethyl mitoxanone, 2-methyl-9-oxosulfonate, 2-isopropyl-9-oxosulfonate [I star, 4-isopropyl-9-oxo-sulfur Dilj Comet, 2,4-diethyl-9-oxosulfonium, sputum-chlorine-deducted propane gas, and -9-oxo-sulphur-sucking, 2-methyl-9-oxo-sulphur 9-oxosulfonium ammonium salt, benzoin, * 4, dimethyl benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzo Dimethyl ketal, 1, hydrazine, trichloroacetophenone dioxo acetophenone and cycloheptanone, methyl phthalic acid benzoate, 2 methyl carbaryl, 4-benzyl quinone biphenyl , 4-benzylidene diphenyl ether 'i,4-benzoyl benzene, ~~~ this brew, 1 〇-butyl-2-chloroacridone' [4-(tolylthio)phenyl] Benzene Institute - ζ - ethyl waking, 2,2-bis(2-chlorophenyl)-4,5,4,,5' _肆(3,4,5-trimethoxyphenyl η,〗, -biimidazole, 2,2-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1ι2 (4-diimidazole, cis-methylamine phenyl)methane, 4-(dimethyl Ethyl benzoate ethyl ester, benzoic acid 2·(dimethylamino)ethyl ester, 4-(dimethylamino)benzoic acid butyl Oxyethyl ester and the like. In addition to the photopolymerization initiator, the composition of the present invention may be added with a photosensitizer to adjust the wavelength of the UV range. Typical sensitizers useful in the present invention are disclosed in Crivello [JVCrivell®, Adv. in P〇lymer Sci, 62, 丄 (1 9 84)]; specifically, 芘'茈, acridine orange' 9 _Oxygen sulphur 嗤, 2_ chloro-9-oxosulfonate, benzoxanthin, N-vinyl hydrazine D sitting, 9,10-dibutoxyxanthine, awakening, oxacillin, keto-encain Phenanthrene, camphor sputum, and morphine trap derivatives. Surfactant The composition of the present invention contains a surfactant. The surfactant used in the present invention contains, for example, 〇. 0 0 1 to 5 mass% ' 〇 _ 0 0 2 4 4% by mass, more preferably 0.005 to 3% by mass. When two or more kinds of interfaces are used - 41 - 200923003 When the agent is used, the total amount is in this range. When the surfactant is less than 0.001% by mass in the composition, the coating uniformity effect is insufficient, and if it exceeds 5% by mass, the transfer characteristics of the mold are deteriorated. The surfactant is preferably at least one of a fluorine-containing surfactant, an anthrone-based surfactant, and a fluoroneketone-based surfactant, and both a fluorine-containing surfactant and an anthrone-based surfactant. Or a fluorine-fluorenone-based surfactant is more preferable, and a fluorine-containing anthrone-based surfactant is preferred. Here, the 'fluoroneketone-based surfactant is a requirement of both a fluorine-based surfactant and an anthrone-based surfactant. By using such a surfactant, the composition of the present invention is applied to a tantalum wafer for manufacturing a semiconductor element, and a glass square substrate for manufacturing a liquid crystal element is formed with a chromium film, a molybdenum film, a molybdenum alloy film, a giant film, and a combination gold. A striated or scaly pattern produced on a substrate of various films such as a film, a tantalum nitride film, an amorphous germanium film, an indium oxide (ITO) film doped with tin oxide, or a tin oxide film (drying of the photoresist film) The problem of coating loss such as spotting can be solved, and the fluidity of the composition into the cavity of the mold can be improved, the peeling property between the mold and the photoresist can be improved, the adhesion between the photoresist and the substrate can be improved, and the viscosity of the composition can be lowered. Wait. In particular, the composition of the present invention can be greatly improved in coating uniformity by the addition of the surfactant, and good coating suitability irrespective of the substrate size can be obtained by coating with a spin coater or a slit coater. The non-ionic fluorine-based surfactant used in the present invention is, for example, trade name FLUORAD FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.), trade name SURFLON S-3 82 (made by Asahi Glass Co., Ltd.), EFTOP EF-122A, 122B. , 122C, EF-121, EF-126, EF-127, MF-100 (manufactured by TOCHEM PRODUCTS), trade name PF-636, PF-6320, PF-656 'PF-6520 (both are -42- 200923003 OMNOVA Company), the product name FUTAGENT FT250, FT25 Bu DFX18 (both are 'NE〇S (share) system), the trade name UNIDAIN DS-401, DS-403, DS-451 (all are DAIKIN industrial (share) system), goods MEGAFAC 171' 172, 173, 178K, and 178A (all manufactured by Dainippon Ink and Chemicals Co., Ltd.); Non-ionic fluorine-based surfactants, for example, trade name SI-10 series (made by Takemoto Oil Co., Ltd.), MEG AFAC PAINT ADD 31 (manufactured by Dainippon Ink Chemical Industry Co., Ltd.), KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.). The fluoroneketone-based surfactants to be used in the present invention are, for example, trade names f Χ-70-090, Χ-70-091, Χ-70-092, Χ-70-093 (all manufactured by Shin-Etsu Chemical Co., Ltd.) , trade names MEGAFAC R-08, XRB-4 (all manufactured by Dainippon Ink Chemical Industry Co., Ltd.). Antioxidant The composition of the present invention contains a conventional antioxidant. The content of the antioxidant used in the present invention is preferably 10% by mass or less based on the total composition, more preferably 0.01 to 10% by mass, and particularly preferably 0.2 to 5% by mass. When two or more kinds of antioxidants are used, the total amount thereof is in this range. Antioxidants are those which are caused by various oxidizing gases such as ozone, active oxygen, ξV N 〇 x, and S Ο x (X-type integer), which are suppressed by heat and fading. In the present invention, an antioxidant may be added to prevent coloration of the cured film. It also has the advantage of reducing the film thickness reduction caused by decomposition. Such antioxidants are hydrazines, hindered amine antioxidants, nitrogen-containing heterocyclic guanidine compounds, thioether antioxidants, hindered phenolic antioxidants, ascorbic acid, zinc sulfate, thiocyanates, thiourea derivatives. A substance, a saccharide, a nitrite, a sulfite, a thiosulfate, a hydroxylamine derivative or the like. From the viewpoint of improving the permeability of the cured film and the reduction of the film thickness, the present invention is preferably a hindered phenol-based antioxidant, a hindered amine-based antioxidant, or a thioether-based antioxidant, and a hindered phenol-based antioxidant and hindered from the viewpoint of the present invention-43-200923003. Amine antioxidants are preferred. Commercial products of antioxidants include Irganoxl〇i〇, 1〇35, 1 076, 1 222 (above Ciba Jaki), Antigene P, 3C, FR, SUMILIZER S, SUMILIZER GA80 (Sumitomo Chemical Industry) ), ADEKASTAB AO70, AO80, AO503 (made by ADEKA), etc. These can be used alone or in combination. Other components In addition to the above components, the composition of the present invention may be added with a release agent, a decane coupling agent, a polymerization inhibitor 'UV absorber', a light stabilizer, an aging inhibitor, a plasticizer, a adhesion promoter, and a heat. A polymerization initiator, a colorant, an elastomer particle, a photoacid proliferation agent, a photobase generator, a basic compound, a flow regulator, an antifoaming agent, a dispersing agent, and the like. In order to improve the heat resistance and strength of the surface structure having the fine uneven pattern or the adhesion to the metal deposition layer, an organic metal coupling agent may be blended in the composition of the present invention. The organometallic coupling agent has an effect of promoting a thermosetting reaction. As the organometallic coupling agent, various coupling agents such as a decane coupling agent, a titanium coupling agent, a zirconium coupling agent, an aluminum coupling agent, and a tin coupling agent can be used. The organometallic coupling agent can be arbitrarily blended in a ratio of 〇.〇〇丨1% by mass of the total solid content of the curable composition for photon imprinting. When the ratio of the organometallic affinity agent is 〇·〇 01% by mass or more, it is more effective in improving heat resistance, strength, and adhesion to the vapor deposition layer. On the other hand, when the ratio of the organometallic coupling agent is 1% by mass or less, it tends to suppress the loss of the composition in terms of stability and film formability. Commercial products of UV absorbers are Tinuvin P' 234, 320, 326, -44-200923003 3 27, 3 2 8, 213 (above Ciba Jaki), SumisorbllO, 130, 140 '220, 250 , 300, 320, 340, 350, 400 (above Sumitomo Chemical Industries). The ultraviolet absorber is preferably blended at a ratio of from 0.01 to 10% by mass based on the total amount of the curable composition for the photon imprint. Commercial products of light stabilizers are Tinuvin 292, 144, 622LD (above Ciba Jaki (share)), SANOL LS-770, 765, 292, 2626, 1114, 7 44 (above the three common chemical industry) )Wait. The photosensitizer is preferably blended at a ratio of from 0.01 to 10% by mass based on the total amount of the composition. Commercial products of the anti-aging agent include Antigene W, S'P, 3C, 6C, RD-G, FR, AW (manufactured by Sumitomo Chemical Industries, Ltd.). The aging preventive agent is preferably blended at a ratio of from 0.01 to 10% by mass based on the total amount of the composition. In order to adjust the adhesion to the substrate, the flexibility of the film, the hardness, and the like, a plasticizer may be added to the composition of the present invention. Specific examples of preferred plasticizers are dioctyl phthalate, di(didecanoate), triethylene glycol dicaprylate, dimethyl glycol phthalate, tricresyl phosphate, adipic acid Octyl ester, dibutyl sebacate, triethylene glycol glycerin, dimethyl adipate, di-n-butyl adipate, dimethyl succinate, diethyl succinate, di-n-butyl succinate, and the like. The plasticizer may be arbitrarily added in an amount of 30% by mass or less, more preferably 20% by mass or less, and particularly preferably 10% by mass or less. 01质量质量以上以上。 Preferably, in order to obtain a plasticizer, preferably 0.1% by mass or more. In order to harden the composition of the present invention, a thermal polymerization initiator may be added as necessary. Preferred thermal polymerization initiators are, for example, peroxides and azo compounds. Specifically, there are benzammonium peroxide, butyl peroxybenzoate, azoisobutyronitrile, and the like. In order to adjust the shape, sensitivity, and the like of the pattern, a photobase generator may be added to the composition of the present invention as necessary. Preferred are, for example, 2-nifedicyclohexylamine formate, -45 - 200923003 triphenylmethanol, 0-amine formazan hydroxyguanamine, hydrazine-amine formazan, [[(2,6-di) Nifedimethyl)oxy]carbonyl]cyclohexylamine, bis[[(2-nitrobenzyl)oxy]carbonyl]hexa-1,6-diamine, 4-(methylthiobenzyl)- 1-methyl-1-tyrosine ethane, (4-glycine benzhydryl)-1-benzyl-1-dimethylamine propane, N-(2-nitrobenzyloxycarbonyl) pyrrolidine, ginseng (tritylboronic acid) hexaammonium cobalt (111), 2-benzoyl-2-dimethylamine-1-(4-morpholinylphenyl)butanone, 2,6-dimethyl-3,5-di Ethylene-4-(2'-nitrophenyl)-1,4-dihydropyridine, 2,6-dimethyl-3,5-diethylhydrazine- 4.(2',4'-dinitrophenyl )-1,4-dihydropyridine and the like. f may be any coloring agent added to the composition of the present invention for the purpose of enhancing the visibility of the coating film. The coloring agent can use a pigment or a dye used for a composition such as a UV inkjet composition, a color filter composition, a CCD image sensor, or the like, without departing from the object of the present invention. The pigments which can be used in the present invention are various inorganic pigments or organic pigments. The inorganic pigment is a metal compound such as a metal oxide or a metal salt, and specifically includes an oxide of a metal such as iron, gu, m, tin, copper, zinc, titanium, magnesium, chromium, zinc or lanthanum, and a metal composite oxide. Organic pigments are, for example, C.I. Pigment Yellow 11, 24, 31, 53, 83, , 99, 108, 109, 110, 138, 139, 15 154, 167, C.I. Pigment 'k,

Orange 36、38、43’ C.I. Pigment Red 105、122、149、150、 155、171、175 ' 176 ' 177、209,C.I. Pigment V1〇let 19、 23、32、39,C.I.PigmentBluel、2、15、16、22、60、66, C.I. Pigment Green 7 ' 36、37 ’ C.I. Pigment Brown 25 ' 28, C . I · P i g m e n t B 1 a c k 1、7,及碳黑。著色劑係以占組成物總 量之0.001〜2質量%的比率配合爲佳。 爲提升機械強度、柔軟性等目的,亦可於本發明之組成 物添加彈性體粒子作爲任意成分。 -46- 200923003 可添加於本發明之組成物作爲任意成分之彈性體粒 子,平均粒子尺寸係以10〜700nm爲佳,30~300nm更佳。 例如聚丁二烯、聚異平、丁二烯/丙烯腈共聚物、苯乙烯/ 丁二烯共聚物、苯乙烯/異平共聚物、乙烯/丙烯共聚物 '乙 烯/ α -烯烴系共聚物、乙烯/ α -烯烴/聚烯共聚物' 丙烯醯 橡膠、丁二烯/(甲基)丙烯酸酯共聚物、苯乙烯/丁二烯嵌段 共聚物、苯乙烯/異平嵌段共聚物等彈性體之粒子。亦可使 用這些彈性體粒子經甲基丙烯酸甲酯聚合物、甲基丙烯酸 甲酯/甲基丙烯酸環氧丙酯共聚物等被覆之芯/殼型粒子。彈 性體粒子亦可具交聯構造。 這些彈性體粒子可以單獨或組合2種以上使用。本發明 之組成物中彈性體粒子成分含有比率係以1 ~ 3 5質量%爲 佳,2 ~ 3 0質量%更佳,3 ~ 2 0質量%尤佳。 爲抑制硬化收縮、提升熱安定性等目的’亦可於本發明 之組成物任意添加鹼性化合物。鹼性化合物有胺以及,喹 啉及嗤阱等含氮雜環化合物、鹼性鹼金屬化合物、鹼性鹼 土金屬化合物等。這些之中,基於與光聚合性單體之相溶 性係以胺爲佳,有例如辛胺、萘胺、二甲苯二胺、二苯甲 胺、二苯胺、二丁胺、二辛胺、二甲苯胺、喂啶、三丁胺、 三辛胺、四甲基乙二胺、四甲-1,6 -六亞甲二胺、六亞甲四 胺及三乙醇胺等。 爲提升光硬化性,、亦可於本發明之組成物添加鏈轉移 劑。具體而言有4-雙(3-锍丁氧基)丁烷、1,3,5-參(3-锍丁氧 基)-1,3,5-三阱- 2,4,6(1Η,3Η,5Η)三酮、新戊四醇肆(3-锍丁 酸酯)。 -47- 200923003 其次說明使用本發明之組成物的圖案(尤以微細凹凸圖 案)之形成方法。本發明中,以本發明之組成物塗布並硬 化,可形成圖案。於此,本發明之組成物通常係藉照光或 熱,較佳者照光及熱硬化。具體而言,於基板或支持體上 至少塗布由本發明之組成物構成的圖案形成層,必要時加 以乾燥形成本發明之組成物構成的層(圖案形成層)製作圖 案受體,按壓模具於該圖案受體之圖案形成層表面,進行 模具圖案之轉印加工,藉照光及加熱使微細凹凸形成層硬 化。通常須進行複數次之照光及加熱。以本發明之圖案形 成方法,光壓印微影術可作積層化、多重圖案化,亦可與 通常之熱壓印組合使用。 本發明之組成物的應用亦可係,於基板或支持體上塗布 本發明之組成物,將該組成物構成之層曝光、硬化,必要 時加以乾燥(烘烤),製作頂塗層、絕緣膜等永久膜。 用於液晶顯示器(LCD)等之永久膜(構造構件用光阻),爲 無礙於顯示器之作動,宜極力避免金屬或有機物離子性雜 質混入光阻中,其濃度須係lOOOppm以下,lOOppm以下更 佳。 以下說明使用本發明之組成物的圖案形成方法、圖案轉 印方法。 本發明之組成物可藉一般習知塗布方法,例如沾塗法、 氣刀塗布法、幕塗法、絲棒塗布法、凹輥塗布法、擠壓塗 布法、旋塗法等’經塗布成形。本發明之組成物構成的層 之膜厚隨用途而異,係0.05~30ym。本發明之組成物亦可 予多重塗布。 -48- 200923003 用以塗布本發明之組成物的基板或支持體有石英、玻 璃、光學膜、陶瓷材料、蒸鍍膜、磁性膜、反射膜,Νι、 Cu、Cr、Fe等金屬基板,紙、s〇G、聚酯膜聚碳酸酯膜、 聚醯亞胺膜等聚合物基板,TFT陣列基板、pDp電極板、 玻璃、透明塑膠基板、ΙΤ〇、金屬等導電性基材’絕緣性基 材矽、氮化矽、多晶矽 '氧化矽、非晶矽等半導體製作 基板等,無特殊限制。基板可係板狀或捲狀。 使本發明之組成物硬化的光無特殊限制,有高能量電離 f 放射線、近紫外線、遠紫外線’可見、紅外等範圍波長之 光或放射線。高能量電離放射線者有例如經科克勞夫型加 速器、凡德格拉夫型加速器、線性加速器、貝他加速器、 迴旋加速器等加速器加速之電子束,工業使用上最便利經 濟’此外’放射自放射性同位素、原子爐等之T -線、X線、 α線、中子束、質子束等放射線亦可使用。紫外線源有例 如紫外線螢光燈、低壓水銀燈、高壓水銀燈、超高壓水銀 燈、氙燈、碳弧燈、太陽燈等。放射線包含例如微波、ΕυV。 : LED、半導體雷射光、或248nm之KrF準分子雷射光、I93nm 之ArF準分子雷射等用於半導體微細加工之雷射光亦適用 於本發明。這些光可用單色光,亦可係複數之波長不同的 光(混合光)。 曝光之際,曝光照度宜爲1 mW/cm2~50 mW/cm2。爲 lmW/cm2以上即可縮短曝光時間故生產力提升,爲 5 0mW/cm2以下即可抑制副反應所致之永久膜特性劣化而 較佳。曝光量宜爲5mJ/cm2~1000m;T/cm2。未達5mJ/cm2則曝 光邊限狹窄,光硬化不足,易有未反應物附著於模具等問 -49- 200923003 題發生。而超過100〇ml/cm2則因組成物分解’永久膜有劣 化之虞。 曝光之際爲防氧對於自由基聚合之妨礙’亦可以氮'急 等非活性氣體流過,控制氧濃度於未達l〇〇mg/L ° 本發明之組成物的硬化溫度係以150~2 80 °C爲佳’ 200〜250 °C更佳。加熱時間係以5~60分鐘爲佳,15~45分鐘 更佳。 其次說明可用於本發明之模具材。使用本發明之組成物 的光奈米壓印必須係,模具材及/或基板之至少其一選用透 光性材料。適用於本發明之光壓印微影術係,於基板上塗 布光奈米壓印用硬化性組成物,以透光性模具按壓,自模 具背面照光,使光奈米壓印用硬化性組成物硬化。並亦可 於透光性基板上塗布光奈米壓印用硬化性組成物,以模具 按壓,自模具背面照光,使光奈米壓印用硬化性組成物硬 化。 照光可於使模具附著之狀態下進行,亦可於剝離模具後 進行,本發明係以於使模具密著之狀態下進行爲佳。 可用於本發明之模具係具有欲予轉印之圖案的模具。模 具可例如藉光微影、電子束描繪法等,依所欲加工精度形 成圖案’而於本發明’模具圖案形成方法無特殊限制。 用於本發明之透光性模具材無特殊限制,旦特定強产、 耐久性者即佳。具體而言’有例如玻璃、石英、pmma、聚 碳酸酯樹脂等透明樹脂、透明金屬蒸鍍膜、聚二甲基砂氧 烷等之柔軟膜、光硬化膜、金屬膜等。 使用本發明之透明基材時所用之非透光型模具材無特 -50- 200923003 殊限制,若具特定強度即佳。具體而言有例如陶瓷材料、 蒸鍍膜、磁性膜、反射膜,Ni、Cu 、Cr、 Fe等金屬基板, SiC、矽、氮化砂、多晶砂、氧化砂、非晶砂基板等,無特 殊限制。形狀可係板狀、捲狀任一。捲狀者尤適用於必須 連續生產時。 上述用於本發明之模具,爲提升光奈米壓印用硬化性組 成物與模具之剝離性,可係經脫模處理者。經以矽酮系、 氟系等之矽烷耦合劑處理者,例如,DAIKIN工業製OPTOOL , DSX、住友3M製Novec EGC- 1 720等市售脫模劑亦適用。 以本發明進行光壓印微影時,通常模具壓力係以1 0大 氣壓以下爲佳。模具壓力爲1 0大氣壓以下,模具、基板即 不易變形,圖案精度可提升,又因低度加壓,裝置可予縮 小而較佳。模具壓力係以在模具凸部光奈米壓印用硬化性 組成物殘膜少之範圍,選擇於可確保模具轉印均勻性之領 域爲佳。 本發明中,光壓印微影之照光若係十分大於硬化所需照 射量即佳。硬化所需照射量,係檢視光奈米壓印用硬化性 ' 組成物之不飽和鍵的消耗量、硬化膜之黏性而決定。 適用於本發明之光壓印微影,其照光之際的基板溫度通 常係常溫,爲提高反應性亦可一邊加熱一邊照光。照光前 段於真空狀態爲之,則因能有效防止氣泡混入,抑制氧的 混入所致之反應性降低,提升模具與光奈米壓印用硬化性 組成物之密著性,故亦可於真空狀態下照光。本發明中較 佳真空度係lO^Pa至常壓。 本發明之組成物可於混合上述各成分後,以例如孔徑 -51 - 200923003 0.05//m~5.0//m之濾器過濾調製溶液。光奈米壓印用硬化 性組成物之混合.溶解通常係於〇 °C ~ 1 0 0 t:之範圍進行。過 濾可多段進行,亦可重複多數次。過濾後之液可再予過濾。 用於過濾之材質可係聚乙烯樹脂、聚丙烯樹脂、氟樹脂、 耐綸樹脂等,無特殊限制。 用於液晶顯示器(LCD)等之永久膜(構造構件用光阻)係 於製造後裝瓶於加侖瓶、夸脫瓶等容器輸送、保存,此時 爲防劣化’容器內可經非活性之氮或氬等取代。輸送、保 存之際可係常溫’爲更防止永久膜變質,可控制溫度於_2〇 °c ~ 0 °c。當然,必須遮光至不起反應之程度。 本發明之組成物亦適用作半導體積體電路、記錄材料、 或平面顯示器等之蝕刻光阻。 實施例 以下舉實施例更具體說明本發明。以下實施例中所示之 材料 '用量、比率、處理內容、處理順序等,只要不脫離 本發明之旨趣,可適當變更。因此,本發明之範圍不限於 以下所示之具體例。 <光奈米壓印之評估> 實施例及比較例得之各組成物,係依下述評估方法測 定·評估。 <黏度測定> 黏度測定係用東機產業(股)製RE-80L型旋轉黏度計,於 25±0.2°C 測定。 測定時之轉數係’〇.5mPa.s以上未達5mPa.s者l〇〇r -52- 200923003 5mPa· s以上未達10mPa· s者50rpm,lOmPa· s以上未達 30mPa· s 者 20rpm,30mPa. s 以上未達 60mPa· s 者 lOrpm, 60mPa. s 以上未達 120mPa. s 者 5rpm,120mPa. s 者 lrpm 或 0 · 5 r p m。 <圖案精度之觀察> 調製下述表1〜7之單體、光聚合引發劑、界面活性劑、 抗氧化劑構成之各組成物,旋塗於玻璃基板上使膜厚可爲 3.0# m。安置經旋塗之塗布基膜於以ORC公司製之高壓水 銀燈(燈功率2000mW/cm2)爲光源之奈米壓印裝置,以模具 壓力0.8kN,曝光中之真空度係i〇Torr,自具有10//m之 線條/間隔圖案,溝深4.0 // m之聚二甲基矽氧烷(東麗•道 康寧公司製,SILPOT184於80°C硬化60分鐘者)材質的模 具表面以240 ml/cm2之條件曝光,曝光後脫離模具,得光 阻圖案。得到之光阻圖案於烘箱以2 3 0 °C加熱3 0分鐘使完 全硬化。 轉印後之圖案形狀以掃瞄電子顯微鏡或光學顯微鏡觀 察,如下評估圖案形狀。 A:模具之圖案形狀與其原版圖案幾乎相同 B:模具之圖案形狀與其原版圖案形狀有一部分不同(與原 版相差未達1 0 %) C:模具之圖案形狀與其原版圖案形狀有一部分不同(與原 版相差1 0 %以上未達2 0 %) D:模具之圖案形狀與其原版圖案明顯不同,或圖案膜厚與 原版圖案相差2 0 %以上 <剝離性之評估> -53- 200923003 使用如同用於圖案精度觀察之樣本’以掃瞄電子顯微鏡 或光學顯微鏡觀察是否有組成物成分附著於用在形成圖案 之模具,如下評估剝離性。 A :於模具全不見時有硬化性組成物附著 B :於模具稍見有時硬化性組成物附著 C :於模具明顯可見時有硬化性組成物附著 <硬度之評估> 旋塗各組成物於玻璃基板上使膜厚可爲3〜1 0 # m,不以 模具壓著,氮氛圍下以曝光量240m〗/cm2曝光,然後於烘箱 以230°C加熱30分鐘得硬化膜,以島津公司製微小硬度計 試驗機測定動態硬度。測定條件爲三角錐壓頭,負荷1 mN, 保持時間1秒。 動態硬度 A : 32以上 B : 2 8以上未達3 2 , C: 25以上未達28 D :未達25 <透過率之評估> 旋塗各組成物於玻璃基板上使膜厚爲3.0 // m,不以模具 壓著,氮氛圍下以曝光量240m〗/cm2曝光,然後於烘箱以 2 3 0 °C加熱2 7 0分鐘得硬化膜,以島津公司製U V - 2 4 0 0 P C測 定400nm之透過率。 透過率 A : 97%以上 B : 9 5 %以上未達9 7 % -54 - 200923003 C : 9 0 %以上未達9 5 % D :未達9 0 % <耐溶劑性試驗> 旋塗各組成物於玻璃基板上使膜厚爲3.0// m,不以模具 壓著,氮氛圍下以曝光量240m】/cm2曝光,然後於烘箱以 2 3 0 °C加熱3 0分鐘得硬化膜,浸泡於2 5 °C之N -甲基吡咯;c完 酮溶劑3 0分鐘,如下評估浸泡前後硬化膜之變化。 A :膜厚變化未達1 % f B :膜厚變化1 %以上,未達2% C :膜厚變化2%以上,未達10% D :表面粗糙 <同一分子內有反應性不同之2種以上硬化性官能基的單 體> Q-1:化合物(M-12)丙烯酸雙環戊烯酯(FA-511AS:日立化 成公司製) Q-2 :化合物(Μ-1 3)丙烯酸雙環戊烯氧乙酯(FA-5 1 2AS :日 , 立化成公司製) ‘ Q-3 :化合物(M-32)丙烯酸3-環己烯甲酯 Q-4 :化合物(M-22)異氰酸丙烯醯氧乙酯(Karenz AOI :昭 和電工公司製)Orange 36, 38, 43' CI Pigment Red 105, 122, 149, 150, 155, 171, 175 '176 '177, 209, CI Pigment V1〇let 19, 23, 32, 39, CIPigmentBluel, 2, 15, 16, 22, 60, 66, CI Pigment Green 7 '36, 37 ' CI Pigment Brown 25 ' 28, C. I · P igment B 1 ack 1, 7, and carbon black. The colorant is preferably blended at a ratio of 0.001 to 2% by mass based on the total amount of the composition. For the purpose of improving mechanical strength, flexibility, and the like, elastomer particles may be added as an optional component to the composition of the present invention. -46- 200923003 The composition of the present invention may be added as an elastomer particle of an optional component, and the average particle size is preferably 10 to 700 nm, more preferably 30 to 300 nm. For example, polybutadiene, polyisoprene, butadiene/acrylonitrile copolymer, styrene/butadiene copolymer, styrene/isobutyl copolymer, ethylene/propylene copolymer 'ethylene/α-olefin copolymer , ethylene/α-olefin/polyene copolymer' propylene rubber, butadiene/(meth) acrylate copolymer, styrene/butadiene block copolymer, styrene/isoblock copolymer, etc. Particles of elastomer. These core particles may be coated with a core/shell type particle coated with a methyl methacrylate polymer, a methyl methacrylate/glycidyl methacrylate copolymer or the like. The elastic particles may also have a crosslinked structure. These elastomer particles may be used alone or in combination of two or more. The composition ratio of the elastomer particles in the composition of the present invention is preferably from 1 to 35 % by mass, more preferably from 2 to 30% by mass, particularly preferably from 3 to 20% by mass. The basic compound may be optionally added to the composition of the present invention for the purpose of suppressing the hardening shrinkage and improving the thermal stability. The basic compound may be an amine or a nitrogen-containing heterocyclic compound such as a quinoline or a hydrazine trap, a basic alkali metal compound or a basic alkaline earth metal compound. Among these, an amine is preferred because it is compatible with a photopolymerizable monomer, and examples thereof include octylamine, naphthylamine, xylene diamine, diphenylmethylamine, diphenylamine, dibutylamine, dioctylamine, and Toluidine, azide, tributylamine, trioctylamine, tetramethylethylenediamine, tetramethyl-1,6-hexamethylenediamine, hexamethylenetetramine and triethanolamine. In order to enhance photocurability, a chain transfer agent may also be added to the composition of the present invention. Specifically, there are 4-bis(3-indolyloxy)butane, 1,3,5-gin(3-indolyloxy)-1,3,5-trisole-2,4,6 (1Η) , 3Η, 5Η) triketone, pentaerythritol bismuth (3-indolyl butyrate). -47- 200923003 Next, a method of forming a pattern (especially a fine uneven pattern) using the composition of the present invention will be described. In the present invention, the composition of the present invention is coated and hardened to form a pattern. Here, the composition of the present invention is usually irradiated with light or heat, preferably by light and heat. Specifically, at least a pattern forming layer composed of the composition of the present invention is applied onto a substrate or a support, and if necessary, dried to form a layer (pattern forming layer) composed of the composition of the present invention, and a pattern acceptor is pressed. The pattern of the pattern receptor forms the surface of the layer, performs transfer processing of the mold pattern, and hardens the fine uneven layer formation layer by light and heat. It is usually necessary to perform multiple times of illumination and heating. In the pattern forming method of the present invention, photoimprint lithography can be used for lamination, multiple patterning, or in combination with conventional hot stamping. The composition of the present invention may be applied by coating the composition of the present invention on a substrate or a support, exposing and hardening the layer formed of the composition, and drying (baking) if necessary to prepare a top coat and insulation. Permanent film such as film. For permanent film (such as photoresist for structural components) for liquid crystal display (LCD), in order to prevent the display from acting, it is best to avoid metal or organic ionic impurities from being mixed into the photoresist. The concentration must be less than 100 ppm, less than 100 ppm. Better. A pattern forming method and a pattern transfer method using the composition of the present invention will be described below. The composition of the present invention can be formed by a conventional coating method such as a dip coating method, an air knife coating method, a curtain coating method, a wire bar coating method, a concave roll coating method, an extrusion coating method, a spin coating method, or the like. . The film thickness of the layer composed of the composition of the present invention varies depending on the use, and is 0.05 to 30 μm. The composition of the present invention can also be multi-coated. -48- 200923003 The substrate or support for coating the composition of the present invention includes quartz, glass, optical film, ceramic material, vapor deposited film, magnetic film, reflective film, metal substrate such as Νι, Cu, Cr, Fe, paper,聚合物G, polyester film polycarbonate film, polymer substrate such as polyimide film, TFT array substrate, pDp electrode plate, glass, transparent plastic substrate, conductive substrate such as germanium, metal, insulating substrate There are no particular restrictions on semiconductor substrates such as tantalum, tantalum nitride, polycrystalline germanium, germanium oxide, and amorphous germanium. The substrate may be in the form of a plate or a roll. The light for hardening the composition of the present invention is not particularly limited, and has high-energy ionization f radiation, near-ultraviolet rays, far ultraviolet rays, visible light, infrared light, and the like. High-energy ionizing radiation has electron beams accelerated by accelerators such as Krakow accelerators, Vandergrave accelerators, linear accelerators, beta accelerators, cyclotrons, etc., which is the most convenient and economical for industrial use. Radiations such as T-lines, X-rays, α-lines, neutron beams, and proton beams of isotopes and atomic furnaces can also be used. Examples of ultraviolet sources include ultraviolet fluorescent lamps, low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, xenon lamps, carbon arc lamps, and solar lamps. The radiation contains, for example, microwaves, ΕυV. : Laser light for semiconductor microfabrication, such as LED, semiconductor laser light, or 248 nm KrF excimer laser light, I93 nm ArF excimer laser, is also suitable for use in the present invention. These lights may be monochromatic or may be light of a plurality of different wavelengths (mixed light). Exposure should be 1 mW/cm2 to 50 mW/cm2. When the exposure time is lmW/cm2 or more, the productivity is improved, and if it is 50 mW/cm2 or less, it is preferable to suppress deterioration of permanent film characteristics due to side reactions. The exposure amount is preferably 5 mJ/cm 2 to 1000 m; T/cm 2 . If it is less than 5mJ/cm2, the exposure margin is narrow, the photohardening is insufficient, and it is easy to have unreacted substances attached to the mold. -49-200923003 occurs. On the other hand, if it exceeds 100 〇ml/cm2, the composition is decomposed and the permanent film is degraded. At the time of exposure, the anti-oxidation is resistant to the radical polymerization, and the inert gas such as nitrogen can be flowed, and the oxygen concentration is controlled to be less than 10 mg/L. The curing temperature of the composition of the present invention is 150~ 2 80 °C is better '200~250 °C better. The heating time is preferably 5 to 60 minutes, and more preferably 15 to 45 minutes. Next, a mold material which can be used in the present invention will be described. The photon imprinting using the composition of the present invention must be such that at least one of the mold material and/or the substrate is selected from a light transmissive material. The photoimprint lithography system of the present invention is applied to a substrate for coating a curable composition for photon imprinting on a substrate, and is pressed by a translucent mold to illuminate the back surface of the mold to form a hardening composition for photon imprinting. Hardening of matter. Further, a curable composition for photon imprinting can be applied to a light-transmitting substrate, and pressed by a mold to illuminate the back surface of the mold to harden the curable composition for photon imprinting. The illuminating may be carried out in a state where the mold is attached, or may be carried out after the mold is peeled off, and the present invention is preferably carried out in a state where the mold is adhered. The mold which can be used in the present invention is a mold having a pattern to be transferred. The mold can be formed into a pattern by the lithography, the electron beam drawing method or the like, for example, in accordance with the desired processing precision. The mold pattern forming method of the present invention is not particularly limited. The light-transmitting mold material used in the present invention is not particularly limited, and is preferably excellent in strength and durability. Specifically, there are, for example, a transparent resin such as glass, quartz, pmma or polycarbonate resin, a transparent metal deposited film, a soft film such as polydimethyl siloxane, a photocured film, a metal film or the like. The non-transmissive mold material used in the use of the transparent substrate of the present invention is not limited to a specific strength, and is preferably a specific strength. Specifically, for example, a ceramic material, a vapor deposited film, a magnetic film, a reflective film, a metal substrate such as Ni, Cu, Cr, or Fe, SiC, tantalum, nitrided sand, polycrystalline sand, oxidized sand, amorphous sand substrate, or the like, Special restrictions. The shape can be either a plate shape or a roll shape. Rollers are especially useful when continuous production is required. The mold used in the present invention described above can be used for mold release treatment in order to improve the peelability of the curable composition for photon imprinting from the mold. For the treatment of decane coupling agents such as anthrone or fluorine, for example, commercially available release agents such as OTOCO Industrial Co., Ltd., OPXOL, DSX, and Sumitomo 3M Novec EGC-1720 are also suitable. In the case of photoimprint lithography according to the present invention, the mold pressure is usually preferably 10 or less. When the mold pressure is below 10 atm, the mold and the substrate are not easily deformed, the pattern accuracy can be improved, and the device can be shrunk and reduced because of low pressure. The mold pressure is preferably selected in the range of ensuring uniformity of transfer of the mold in a range in which the residual film of the curable composition for the light embossing of the mold convex portion is small. In the present invention, the illumination of the photoimprint lithography is preferably greater than the amount of illumination required for hardening. The amount of irradiation required for hardening is determined by the amount of the unsaturated bond of the hardenable composition of the photon nanoimprint and the viscosity of the cured film. The photoimprint lithography which is suitable for use in the present invention is usually at a normal temperature when the light is irradiated, and can be heated while being heated to improve the reactivity. When the front part of the illuminating light is in a vacuum state, the reactivity of the air bubbles can be effectively prevented from being mixed, the reactivity caused by the mixing of oxygen is suppressed, and the adhesion between the mold and the hardenable composition for the photon imprinting is improved. Light in the state. In the present invention, the preferred degree of vacuum is from 10 MPa to atmospheric pressure. The composition of the present invention may be prepared by mixing the above components, and filtering the solution by, for example, a filter having a pore diameter of -51 - 200923003 0.05 / / m - 5.0 / / m. The mixing of the hardenable composition for photon imprinting. Dissolution is usually carried out in the range of 〇 °C ~ 1 0 0 t:. Filtration can be carried out in multiple stages or repeated many times. The filtered liquid can be filtered again. The material used for the filtration may be a polyethylene resin, a polypropylene resin, a fluororesin, a nylon resin, or the like, and is not particularly limited. A permanent film (resistance for a structural member) used for a liquid crystal display (LCD) is bottled in a gallon bottle or a quart bottle after being manufactured, and is stored and preserved. In this case, it is inactivated in the container. Substituted by nitrogen or argon. When transporting and storing, it can be kept at room temperature to prevent deterioration of the permanent film, and the temperature can be controlled at _2〇 °c ~ 0 °c. Of course, it must be shaded to the extent that it does not respond. The composition of the present invention is also suitable for use as an etching resistor for a semiconductor integrated circuit, a recording material, or a flat panel display. EXAMPLES Hereinafter, the present invention will be more specifically described by way of examples. The materials, the amount, the ratio, the processing contents, the processing order, and the like shown in the following examples can be appropriately changed without departing from the scope of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. <Evaluation of Photon Imprint> Each of the compositions obtained in the examples and the comparative examples was measured and evaluated according to the following evaluation method. <Viscosity measurement> The viscosity measurement was carried out at 25 ± 0.2 °C using a RE-80L rotary viscometer manufactured by Toki Sangyo Co., Ltd. The number of revolutions at the time of measurement is '〇.5mPa.s or less and less than 5mPa.s. l〇〇r -52- 200923003 5mPa·s or less is less than 10mPa·s for 50rpm, lOmPa·s or less is less than 30mPa·s for 20rpm. , 30mPa. s or less is less than 60mPa·s, lOrpm, 60mPa. s or less is less than 120mPa. s is 5rpm, 120mPa. s is lrpm or 0 · 5 rpm. <Observation of Pattern Accuracy> Each of the components of the following Tables 1 to 7, a photopolymerization initiator, a surfactant, and an antioxidant was prepared and spin-coated on a glass substrate to have a film thickness of 3.0 # m . Place the spin-coated base film on a nano-imprinting device with a high-pressure mercury lamp (lamp power 2000mW/cm2) made by ORC, with a mold pressure of 0.8kN, and the vacuum degree in the exposure is i〇Torr. Line/space pattern of 10//m, polydimethyl methoxy oxane with a depth of 4.0 // m (made by Toray Dow Corning, SILPOT184 hardened at 80 °C for 60 minutes) with a mold surface of 240 ml/ The condition of cm2 is exposed, and after exposure, it is separated from the mold to obtain a photoresist pattern. The resulting photoresist pattern was completely cured by heating in an oven at 203 °C for 30 minutes. The shape of the pattern after transfer was observed with a scanning electron microscope or an optical microscope, and the shape of the pattern was evaluated as follows. A: The pattern shape of the mold is almost the same as that of the original pattern. B: The pattern shape of the mold is partially different from the original pattern shape (less than 10% difference from the original) C: The pattern shape of the mold is partially different from the original pattern shape (with the original) D: 10% or more is less than 20%) D: The pattern shape of the mold is significantly different from the original pattern, or the pattern thickness is different from the original pattern by more than 20% <Evaluation of peelability> -53- 200923003 The sample for observation of pattern accuracy was observed by a scanning electron microscope or an optical microscope to see whether or not a composition component adhered to a mold used for patterning, and the peelability was evaluated as follows. A: There is a hardening composition adhesion when the mold is completely absent B: Sometimes the hardening composition adheres to the mold C: When the mold is clearly visible, there is adhesion of the hardening composition <Evaluation of hardness> Spin coating composition The film thickness on the glass substrate can be 3~10 0 m, not pressed by the mold, exposed to an exposure amount of 240 m/cm 2 under a nitrogen atmosphere, and then heated at 230 ° C for 30 minutes in an oven to obtain a cured film. The dynamic hardness was measured by a micro hardness tester manufactured by Shimadzu Corporation. The measurement conditions were a triangular pyramid indenter with a load of 1 mN and a holding time of 1 second. Dynamic hardness A: 32 or more B: 2 8 or more is less than 3 2 , C: 25 or less is less than 28 D: less than 25 < evaluation of transmittance > Spin coating each composition on a glass substrate to a film thickness of 3.0 // m, not pressed by the mold, exposed to 240m/cm2 under nitrogen atmosphere, and then cured in an oven at 270 °C for 270 minutes to obtain a cured film, manufactured by Shimadzu Corporation UV - 2 4 0 0 The PC measured the transmittance at 400 nm. Transmittance A: 97% or more B: 9 5 % or more is less than 9 7 % -54 - 200923003 C : 9 0 % or more is less than 9 5 % D : less than 90% <solvent resistance test> Spin coating Each composition was made to have a film thickness of 3.0/m on a glass substrate, not pressed by a mold, exposed to an exposure amount of 240 m/cm 2 in a nitrogen atmosphere, and then heated at 230 ° C for 30 minutes in an oven to obtain a cured film. Soaked in N-methylpyrrole at 25 ° C; c ketone solvent for 30 minutes, the change of the cured film before and after soaking was evaluated as follows. A: film thickness change is less than 1% f B : film thickness change is 1% or more, less than 2% C: film thickness change is 2% or more, less than 10% D: surface roughness < different reactivity in the same molecule Monomer of two or more kinds of curable functional groups> Q-1: Compound (M-12) biscyclopentenyl acrylate (FA-511AS: manufactured by Hitachi Chemical Co., Ltd.) Q-2: Compound (Μ-1 3) acrylic double ring Ethyl oxyethyl ester (FA-5 1 2AS: manufactured by Lihua Chemical Co., Ltd.) 'Q-3 : Compound (M-32) 3-cyclohexene methyl acrylate Q-4 : Compound (M-22) isocyanide Acetyl propylene oxide (Karenz AOI: manufactured by Showa Denko)

Q-5 :化合物(M-24)丙烯酸3-乙基-3-環氧丙甲酯(VISCOAT OXE 10 :大阪有機化學工業公司製) Q-6 :化合物(M-29)丙烯酸3-三甲氧矽丙酯(KBM-5103 :信 越化學工業公司製) Q-7 :化合物(M-30)丙烯酸烯丙酯(Aldrich公司製試藥) -55- 200923003 Q-8:化合物(M-33)丙烯酸2-丙烯醯氧-3-烯丙氧丙酯 Q - 9 :化合物(Μ - 4)丙烯酸2,3 -二烯丙氧丙酯 Q -1 0 :化合物(Μ - 3 4)丙烯酸3,5 -二烯丙氧環己酯 〇-11:化合物^-38)丙烯酸3,5-雙(烯丙氧羰基)苯酯 Q-12:化合物(Μ-39)丙烯酸4-烯丙氧羰苯酯 Q-13:化合物(Μ-40)烯丙氧羰-3,5-雙(丙烯醯氧基)苯 Q-14:化合物(Μ-41)雙丙烯醯氧基甲基丙酸烯丙酯 Q-15:化合物(Μ-42)雙烯丙氧基羰基乙基丙烯酸酯 , Q-16 :化合物(Μ-43)烯丙氧基羰基甲基丙烯酸酯 f ^ Q-17:化合物(M-44)烯丙氧基羰基乙基丙烯酸酯 <其它一官能單體> R-1:丙烯酸苯甲酯(VISCOAT#160:大阪有機化學公司製) R - 2 :丙烯酸2 -萘酯 R-3 :丙烯酸1-萘甲酯 <其它二官能單體> S-01 :新戊二醇二丙烯酸酯 <其它三官能以上之單體> S-10 :三羥甲丙烷三丙烯酸酯(ARON IX M-3 09 :東亞合成公 司製) s-ll: 1,3,5-參丙烯醯氧苯 <其它三官能以上之單體> s -1 2 :四官能氨酯丙烯酸酯(U - 4 Η A :新中村化學公司製) <其它聚合性單體> S-23: HOA-MS (琥珀酸2-丙烯醯氧乙酯’共榮社化學(股 製) -56- 200923003 <光聚合引發劑> P-1:氧化 2,4,6-三甲苯甲醯基乙氧苯膦(LucirinTPO-L: BASF公司製) <界面活性劑> W-1 :非氟系界面活性劑(竹本油脂(股)製:PIONIN D6315) W-2 :氟系界面活性劑(DIC(股)製:MEGAFAC F7 80F) <抗氧化劑> A-l: SumilizerGA80,受阻酚系(住友化學(股)製)Q-5: Compound (M-24) 3-ethyl-3-glycidyl acrylate (VISCOAT OXE 10: manufactured by Osaka Organic Chemical Industry Co., Ltd.) Q-6: Compound (M-29) 3-trimethoxy acrylate Propyl propyl ester (KBM-5103: manufactured by Shin-Etsu Chemical Co., Ltd.) Q-7: Compound (M-30) allyl acrylate (a reagent manufactured by Aldrich Co., Ltd.) -55- 200923003 Q-8: Compound (M-33) acrylic acid 2-propenyloxy-3-allyloxypropyl propyl ester Q - 9 : compound (Μ - 4) 2,3-diallyloxypropyl acrylate Q -1 0 : compound (Μ - 3 4) acrylic acid 3,5 -diallyloxycyclohexyl ester oxime-11: compound ^-38) 3,5-bis(allyloxycarbonyl)phenyl acrylate Q-12: compound (Μ-39) 4-allyloxycarbonyl phenyl acrylate Q-13: Compound (Μ-40) allyloxycarbonyl-3,5-bis(acryloxy)benzene Q-14: Compound (Μ-41) bis propylene methoxy methoxypropionate Q -15: compound (Μ-42) bisallyloxycarbonylethyl acrylate, Q-16 : compound (Μ-43) allyloxycarbonyl methacrylate f ^ Q-17: compound (M-44 Allyloxycarbonylethyl acrylate <other monofunctional monomer> R-1: benzyl acrylate (VISCOAT #160: Osaka has Machine Chemical Co., Ltd.) R - 2 : 2-naphthyl acrylate R-3 : 1-naphthyl methacrylate <other difunctional monomer > S-01 : neopentyl glycol diacrylate <Other trifunctional or higher Monomer> S-10: Trimethylolpropane triacrylate (ARON IX M-3 09: manufactured by Toagosei Co., Ltd.) s-ll: 1,3,5-paraben oxime oxime <Other trifunctional or higher Monomer > s -1 2 : Tetrafunctional urethane acrylate (U - 4 Η A: manufactured by Shin-Nakamura Chemical Co., Ltd.) <Other polymerizable monomers> S-23: HOA-MS (succinic acid 2- Propylene oxime ethyl ester 'Kyoeisha Chemical Co., Ltd. -56- 200923003 <Photopolymerization initiator> P-1: Oxidation of 2,4,6-trimethylglyoximeyl phenylphosphine (LucirinTPO-L) : BASF Corporation) <Interacting Agent> W-1: Non-fluorine-based surfactant (made by Takeshiba Oil & Fats Co., Ltd.: PIONIN D6315) W-2: Fluorine-based surfactant (DIC: MEGAFAC) F7 80F) <Antioxidant> Al: Sumilizer GA80, hindered phenolic system (Sumitomo Chemical Co., Ltd.)

, A-2 : ADEKASTAB AO 5 0 3,受阻酚系 + 硫醚系(ADEKA JAPAN(股)製) A-3: Irganox 1035FF,受阻酚系+硫醚系(汽巴特化公司製) A-4 : ADEKASTAB LA-57 > 受阻胺’系(A D E K A (股)製) A-5: TINUVIN144,受阻胺系+受阻酚系(汽巴特化公司製) <矽酮油> X- 1 : X-22-3 7 1 0(信越化學(股)製) -57- 200923003 表1 實施例1 實施例2 實施例3 實施例4 實施例5 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% 0-1 48.2 0-2 48.2 0-3 38.6 Q-4 38.6 0-5 16.4 S-01 48.2 S-01 48.2 S-01 57.8 S-01 28.9 S-01 28.9 聚合性不飽和 S-10 28.9 S-10 28.9 單體 R-1 22.2 光聚合引發劑 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 界面活性劑 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0,1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 1 A-1 1 A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A-2 2 A-2 2 A-2 2 表2 實施例6 實施例7 實施例8 實施例9 實施例10 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% Q-6 38.6 0-7 38.6 0-1 19.3 0-2 19.3 0-1 19.3 S-01 28.9 S-01 28.9 S-01 28.9 S-01 28.9 S-01 19.3 聚合性不飽和 S-10 28.9 S-10 28.9 R-1 12.5 R-1 12.5 S-10 19.3 單體 0-5 35.7 0-5 35.7 R-1 16.4 0-5 22.1 光聚合引發劑 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 界面活性劑 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 1 A-1 1 A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A-2 2 A-2 2 A-2 2 -58- 200923003 表3 實施/ 例11 實施1 阿12 實施1 网13 化合物 質量% 化合物 質量% 化合物 質量% 聚合性不飽和單體 0-5 16.1 0-5 16.1 0-5 16.1 0-8 28.9 0-9 28,9 Q-10 28.9 S-10 28.9 S-10 28.9 S-10 28.9 R-1 22.5 R-1 22.5 R-1 22.5 光聚合引發劑 P-1 0.5 P-1 0.5 P-1 0.5 界面活性劑 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A-2 2 表4 實施例14 實施例15 實施 列16 實施例π 實施例18 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% 化合物 質量% Q-6 10 Q-6 10 Q-6 10 Q-6 10 Q-6 10 Q-5 18.8 Q-12 29.2 Q-13 17.2 R-3 17.2 S-ll 17.2 聚合性不飽和 R-1 23.2 R-1 23.3 R-1 23.3 R-1 23.3 R-1 23.3 單體 S-10 26.6 S-10 22.4 Q-5 23.2 0-5 23.2 0-5 23.2 S-01 17.1 R-2 11.4 S-10 22.6 S-10 22.6 0-11 22.6 S-23 0.5 光聚合引發劑 Ρ·1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 界面活性劑 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 1 A-1 1 A-1 1 A-1 A-1 1 A-2 2 A-2 2 A-2 2 A-2 2 A-2 2 矽酮油 X-l 0.1 X-l 0.1 X-l 0.1 X-l 0.1 X-l 0.1 -59- 200923003 表5 實施1 网19 實施1 列20 實施1 网21 化合物 質量0/〇 化合物 質量% 化合物 質量1 聚合性不飽和單體 R-1 22.1 R-1 23.3 R-1 23 0-5 18.1 Q-5 19.1 Q-5 18.6 S-01 16.5 S-01 17.2 S-01 26.2 S-10 25.4 S-10 26.7 Q-12 16.8 S-12 4.73 S-12 3 Q-6 6.8 Q-6 9.5 Q-6 7 S-12 4.9 光聚合引發劑 P-1 0.48 P-1 0.5 P-1 0.44 界面活性劑 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 1.91 A-1 1.96 A-1 2 A-3 0.95 A-3 1 A-3 1 矽酮油 X-1 0.19 X-1 0.1 X-1 0.12 表6 實施例22 實施例23 實施例24 實施例25 實施例26 實施例27 化合 物 質量% 化合物 質量% 化合物 質量〇/〇 化合物 質量% 化合物 質量% 化合物 質量% 聚合性不 飽和單體 Q-6 10 Q-6 10 Q-6 20 Q-6 20 Q-6 10 Q-6 10 0-5 19.8 Q-12 29.2 Q-14 47.3 Q-15 47.3 Q-16 52.3 Q-17 52.3 R-1 23.2 R-1 23.3 S-10 30 S-10 30 S-10 35 S-10 35 S-10 26.6 S-10 22.4 S-01 17.1 R-2 11.4 S-23 0.5 光聚合引 發劑 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-I 0.5 界面活性 劑 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-4 2 A-5 3 A-4 2 A-4 2 A-4 2 A-4 2 矽酮油 X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 -60- 200923003 表7 實施1 列28 實施1 网29 實施1 列30 化合物 質量% 化合物 質量% 化合物 質量% 聚合性不飽和單體 0-6 10 Q-6 10 Q-6 10 〇-12 5 〇-12 5 Q-12 5 0-5 17 0-5 17 Q-5 17 R-1 21.8 R-1 21.8 R-1 21.8 S-01 10.2 Q-14 10.2 Q-15 10.2 S-10 26.7 S-10 26.7 S-10 26.7 S-23 0.5 S-23 0.5 S-23 0.5 S-12 5 S-12 5 S-12 5 光聚合引發齊J P-1 0.5 P-1 0.5 P-1 0.5 界面活性剤 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 抗氧化劑 A-1 2 A-1 2 A-1 2 A-3 1 A-3 1 A-3 1 矽酮油 X-1 0.2 X-1 0.2 X-1 0.2 依上表之組成配合上述單體,製作實施例之組成物,測 定黏度、圖案精度、剝離性、硬度、透過率、耐溶劑性。 結果如表9。 比較例1 以國際公開W02004/099272號公報所揭示之噴墨用組成 物的實施例6所述之組成物,如同本實施例施行,測定圖 案精度、剝離性、硬度、透過率、耐溶劑性。組成物之配 方如表8,試驗結果如表9。 -61 - 200923003 比較例2 以特開2007- 84625號公報所揭示之奈米壓印用組成物 的實施例1所述之組成物,如同本實施例施行,測定圖案 精度、剝離性、硬度、透過率、耐溶劑性。組成物之配方 如表8,試驗結果如表9。 比較例3 以特開2005-255 85 4號公報所揭示之光硬化性組成物的 實施例3所述之組成物,如同本實施例施行,測定圖案精 , 度、硬度、透過率、耐溶劑性。組成物之配方如表8,試 驗結果如表9。 比較例4 以特開2007- 1 865 70號公報所揭示之光硬化性組成物的 實施例2所述之組成物,如同本實施例施行,測定圖案精 度、硬度、透過率。組成物之配方如表8,試驗結果如表9。 比較例5 以特開2007- 1 865 70號公報所揭示之光硬化性組成物的 實施例6所述之組成物,如同本實施例施行,測定圖案精 ' 度、硬度、透過率。組成物之配方如表8,試驗結果如表9。 該比較例1 ~ 5無一含抗氧化劑。比較例2及比較例4不 含反應性不同之2種以上硬化性官能基。 -62- 200923003 比較例5 質量% cK 28.5 Ο) t-< Os 28.5 化合物 BPE-500 LITE ESTER 1G 1 FA-511 A 卜 £ g cd 茗 MEGA FAC R08 BPE-500 LITE ESTER 1G FA-511 A 比較例4 質量% 28.5 Os 寸· o 28.5 化合物 BPE-500 LITE ESTER 1G LITE ESTER BZ 卜 s cd 旦 MEGA FAC R08 BPE-500 LITE ESTER 1G LITE ESTER BZ 比較例3 質量% 3 ro 化合物 丙烯酸2-乙烯乙氧乙酯 丙烯酸異丁酯 Irgacure 184 _i ADEKASTABAO30 比較例2 質量% 00 CN — 5 化合物 u-> s α (U N-乙烯基吡咯烷酮 t 爾 辱 瑁 ^ &- E V g: ;s Λ ^ fr w (N MEGA FAC R08 比較例1 質量% 〇 V-) (N 化合物 丙烯酸環氧丙酯 三羥甲丙烷三丙烯酸酯 丙烯酸異萡酯 N-乙烯基-2-吡咯烷酮 環氧丙醇 3-乙基-3-苯氧甲環氧丙烷 (N a 1 1 11 Φ # El· (N ADEKAOPTOMER SP-152 200923003 表9, A-2 : ADEKASTAB AO 5 0 3, hindered phenolic system + thioether system (made by ADEKA JAPAN Co., Ltd.) A-3: Irganox 1035FF, hindered phenolic system + thioether system (manufactured by Steam Bart Chemical Co., Ltd.) A-4 : ADEKASTAB LA-57 > Hindered amine 'system (made by ADEKA Co., Ltd.) A-5: TINUVIN 144, hindered amine system + hindered phenol system (manufactured by Vapart Chemical Co., Ltd.) <nonanone oil> X-1 : X -22-3 7 1 0 (Shin-Etsu Chemical Co., Ltd.) -57- 200923003 Table 1 Example 1 Example 2 Example 3 Example 4 Example 5 Compound mass % Compound mass % Compound mass % Compound mass % Compound mass % 0-1 48.2 0-2 48.2 0-3 38.6 Q-4 38.6 0-5 16.4 S-01 48.2 S-01 48.2 S-01 57.8 S-01 28.9 S-01 28.9 Polymeric Unsaturated S-10 28.9 S -10 28.9 Monomer R-1 22.2 Photopolymerization initiator P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 Surfactant W-1 0.1 W-1 0.1 W-1 0.1 W- 1 0.1 W-1 0,1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 1 A-1 1 A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A-2 2 A-2 2 A-2 2 Table 2 Example 6 Example 7 Example 8 Example 9 Example 10 Compound mass % Compound mass % Compound mass % Compound mass % Compound mass % Q-6 38.6 0-7 38.6 0-1 19.3 0-2 19.3 0-1 19.3 S-01 28.9 S-01 28.9 S- 01 28.9 S-01 28.9 S-01 19.3 Polymeric Unsaturated S-10 28.9 S-10 28.9 R-1 12.5 R-1 12.5 S-10 19.3 Monomer 0-5 35.7 0-5 35.7 R-1 16.4 0- 5 22.1 Photopolymerization initiator P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 Surfactant W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W -2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 1 A-1 1 A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A -2 2 A-2 2 A-2 2 -58- 200923003 Table 3 Implementation / Example 11 Implementation 1 A 12 Implementation 1 Net 13 Compound mass % Compound mass % Compound mass % Polymerizable unsaturated monomer 0-5 16.1 0- 5 16.1 0-5 16.1 0-8 28.9 0-9 28,9 Q-10 28.9 S-10 28.9 S-10 28.9 S-10 28.9 R-1 22.5 R-1 22.5 R-1 22.5 Photopolymerization initiator P- 1 0.5 P-1 0.5 P-1 0.5 Surfactant W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 1 A-1 1 A-1 1 A-2 2 A-2 2 A-2 2 Table 4 Example 14 Example 15 Example 16 Example π Example 18 Compound mass % Compound mass % Compound mass % Compound mass % Compound mass % Q-6 10 Q -6 10 Q-6 10 Q-6 10 Q-6 10 Q-5 18.8 Q-12 29.2 Q-13 17.2 R-3 17.2 S-ll 17.2 Polymerizable Unsaturated R-1 23.2 R-1 23.3 R-1 23.3 R-1 23.3 R-1 23.3 Monomer S-10 26.6 S-10 22.4 Q-5 23.2 0-5 23.2 0-5 23.2 S-01 17.1 R-2 11.4 S-10 22.6 S-10 22.6 0-11 22.6 S-23 0.5 Photopolymerization initiator Ρ·1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 Surfactant W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W- 1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 1 A-1 1 A-1 1 A-1 A-1 1 A-2 2 A-2 2 A-2 2 A-2 2 A-2 2 fluorenone oil Xl 0.1 Xl 0.1 Xl 0.1 Xl 0.1 Xl 0.1 -59- 200923003 Table 5 Implementation 1 Net 19 Implementation 1 Column 20 Implementation 1 Net 21 Compound mass 0 / 〇 compound Mass % Compound mass 1 Polymerizable unsaturated monomer R-1 22.1 R-1 23.3 R-1 23 0-5 18.1 Q-5 19.1 Q-5 18.6 S-01 16.5 S-01 17.2 S-01 26.2 S-10 2 5.4 S-10 26.7 Q-12 16.8 S-12 4.73 S-12 3 Q-6 6.8 Q-6 9.5 Q-6 7 S-12 4.9 Photopolymerization Initiator P-1 0.48 P-1 0.5 P-1 0.44 Interface Active agent W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 1.91 A-1 1.96 A-1 2 A-3 0.95 A-3 1 A- 3 1 fluorenone oil X-1 0.19 X-1 0.1 X-1 0.12 Table 6 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Compound mass % Compound mass % Compound mass 〇 / 〇 compound mass % Compound mass % Compound mass % Polymerizable unsaturated monomer Q-6 10 Q-6 10 Q-6 20 Q-6 20 Q-6 10 Q-6 10 0-5 19.8 Q-12 29.2 Q-14 47.3 Q -15 47.3 Q-16 52.3 Q-17 52.3 R-1 23.2 R-1 23.3 S-10 30 S-10 30 S-10 35 S-10 35 S-10 26.6 S-10 22.4 S-01 17.1 R-2 11.4 S-23 0.5 Photopolymerization initiator P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 P-1 0.5 PI 0.5 Surfactant W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-4 2 A-5 3 A-4 2 A-4 2 A-4 2 A-4 2 Anthrone oil X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 X-1 0.1 -60- 200923003 Table 7 Implementation 1 Column 28 Implementation 1 Net 29 Implementation 1 Column 30 Compound Mass % Compound Quality % Compound mass % Polymerizable unsaturated monomer 0-6 10 Q-6 10 Q-6 10 〇-12 5 〇-12 5 Q-12 5 0-5 17 0-5 17 Q-5 17 R-1 21.8 R-1 21.8 R-1 21.8 S-01 10.2 Q-14 10.2 Q-15 10.2 S-10 26.7 S-10 26.7 S-10 26.7 S-23 0.5 S-23 0.5 S-23 0.5 S-12 5 S- 12 5 S-12 5 Photopolymerization initiation Qi P P 0.5 0.5 P-1 0.5 P-1 0.5 Interfacial activity 剤W-1 0.1 W-1 0.1 W-1 0.1 W-2 0.04 W-2 0.04 W-2 0.04 Antioxidant A-1 2 A-1 2 A-1 2 A-3 1 A-3 1 A-3 1 Anthrone oil X-1 0.2 X-1 0.2 X-1 0.2 According to the composition of the above table, the above monomers are compounded. The composition of the examples was prepared, and the viscosity, pattern accuracy, peelability, hardness, transmittance, and solvent resistance were measured. The results are shown in Table 9. Comparative Example 1 The composition described in Example 6 of the ink-jet composition disclosed in International Publication No. WO2004/099272 was subjected to the measurement of the pattern precision, peelability, hardness, transmittance, and solvent resistance as in the present example. . The composition of the composition is shown in Table 8, and the test results are shown in Table 9. -61 - 200923003 Comparative Example 2 The composition described in Example 1 of the composition for nanoimprint disclosed in JP-A-2007-84625, as shown in the present example, was used to measure pattern accuracy, peelability, hardness, and Transmittance, solvent resistance. The composition of the composition is shown in Table 8, and the test results are shown in Table 9. Comparative Example 3 The composition described in Example 3 of the photocurable composition disclosed in JP-A-2005-255 85-4 was subjected to the measurement of the pattern, degree, hardness, transmittance, and solvent resistance as in the present example. Sex. The composition of the composition is shown in Table 8, and the test results are shown in Table 9. Comparative Example 4 The composition described in Example 2 of the photocurable composition disclosed in JP-A-2007- 1 865 70 was measured in the same manner as in the present example, and the pattern precision, hardness, and transmittance were measured. The composition of the composition is shown in Table 8, and the test results are shown in Table 9. Comparative Example 5 The composition described in Example 6 of the photocurable composition disclosed in JP-A-2007- 1 865 70 was measured in the same manner as in the present example, and the pattern precision, hardness, and transmittance were measured. The composition of the composition is shown in Table 8, and the test results are shown in Table 9. None of the comparative examples 1 to 5 contained an antioxidant. Comparative Example 2 and Comparative Example 4 did not contain two or more kinds of curable functional groups having different reactivity. -62- 200923003 Comparative Example 5 Mass % cK 28.5 Ο) t-< Os 28.5 Compound BPE-500 LITE ESTER 1G 1 FA-511 A 卜 £ cd 茗MEGA FAC R08 BPE-500 LITE ESTER 1G FA-511 A Compare Example 4 Mass % 28.5 Os inch · o 28.5 Compound BPE-500 LITE ESTER 1G LITE ESTER BZ s cd dan MEGA FAC R08 BPE-500 LITE ESTER 1G LITE ESTER BZ Comparative Example 3 Mass % 3 ro Compound Acrylic 2-Ethylene ethoxylate Ethyl acetate isobutyl ester Irgacure 184 _i ADEKASTABAO30 Comparative Example 2 Mass % 00 CN — 5 Compound u-> s α (U N-vinylpyrrolidone t 瑁 & ^ &- EV g: ;s Λ ^ fr w (N MEGA FAC R08 Comparative Example 1 Mass % 〇V-) (N compound propylene glycol acrylate propyl hydroxypropyl triacrylate isopropyl isophthalate N-vinyl-2-pyrrolidone oxime 3-ethyl- 3-Phenyloxypropylene oxide (N a 1 1 11 Φ # El· (N ADEKAOPTOMER SP-152 200923003 Table 9

黏度 圖案精度 剝離性 硬度 透過率 耐溶劑性 實施例1 Ί.9 A A A A B 實施例2 9.9 A A B A B 實施例3 10.0 A A A A B 實施例4 5.8 A A A A B 實施例5 8.7 A A A A B 實施例6 6.6 A A A A B 實施例7 5.5 A A A A B 實施例8 8.5 A A A A B 實施例9 9.4 A A A A B 實施例10 8.7 A A A A B 實施例11 8.0 A A A A A 實施例12 7.8 A A A A A 實施例13 9.8 A A A A A 實施例14 6.8 A A B A A 實施例15 9.1 > A A B A A 實施例16 8.5 A A B A A 實施例17 7.5 A A B A A 實施例18 15.2 A A B A A 實施例19 8.3 A A B A B 實施例20 8 A A B A A 實施例21 10 A A B A A 實施例22 7.2 A A B A A 實施例23 9.5 A A B A A 實施例24 16 A A A A A 實施例25 14 A A A A A 實施例26 10 A A B A A 實施例27 11 A A B A A 實施例28 9.1 A A B A A 實施例29 11 A A A A A 實施例30 11 A A A A A 比較例1 19.5 C C C D B 比較例2 11.4 A B D D C 比較例3 7.0 A C D A D 比較例4 5.6 A B D D D 比較例5 16.4 A B B D C -64 - 200923003 本發明之組成物於圖案精度、剝離性、硬度、透過率皆 優。而比較例之組成物則硬度皆差。比較例1則圖案精度 及透過率皆差。 產業上之利用可能性 依本發明即可提供,用作永久膜時加熱硬化後之透過 性、機械強度、剝離性、圖案形狀、塗布性、耐溶劑性綜 合上優異之組成物。並可提供,用作透明保護膜、間隔物 等之永久膜時,具有優良殘膜性、透光性、耐擦傷性等機 f 械特性、耐溶劑性之組成物。 【圖式簡單說明】 Μ 。 【主要元件符號說明】 te 〇 /\w -65-Viscosity pattern precision peelability Hardness transmittance Solvent resistance Example 1 9.9 AAAAB Example 2 9.9 AABAB Example 3 10.0 AAAAB Example 4 5.8 AAAAB Example 5 8.7 AAAAB Example 6 6.6 AAAAB Example 7 5.5 AAAAB Example 8 8.5 AAAAB Example 9 9.4 AAAAB Example 10 8.7 AAAAB Example 11 8.0 AAAAA Example 12 7.8 AAAAA Example 13 9.8 AAAAA Example 14 6.8 AABAA Example 15 9.1 > AABAA Example 16 8.5 AABAA Example 17 7.5 AABAA Example 18 15.2 AABAA Example 19 8.3 AABAB Example 20 8 AABAA Example 21 10 AABAA Example 22 7.2 AABAA Example 23 9.5 AABAA Example 24 16 AAAAA Example 25 14 AAAAA Example 26 10 AABAA Example 27 11 AABAA Example 28 9.1 AABAA Example 29 11 AAAAA Example 30 11 AAAAA Comparative Example 1 19.5 CCCDB Comparative Example 2 11.4 ABDDC Comparative Example 3 7.0 ACDAD Comparative Example 4 5.6 ABDDD Comparative Example 5 16.4 ABBDC -64 - 2 00923003 The composition of the present invention is excellent in pattern accuracy, peelability, hardness, and transmittance. The composition of the comparative example was poor in hardness. In Comparative Example 1, the pattern accuracy and the transmittance were poor. Industrial Applicability According to the present invention, it is possible to provide a composition excellent in permeability, mechanical strength, releasability, pattern shape, applicability, and solvent resistance after heat curing as a permanent film. When it is used as a permanent film such as a transparent protective film or a spacer, it is a composition having excellent mechanical properties such as residual film properties, light transmittance, and scratch resistance. [Simple description of the diagram] Μ . [Main component symbol description] te 〇 /\w -65-

Claims (1)

200923003 十、申請專利範圍: 1. —種奈米壓印用硬化性組成物,其特徵爲含有(A)同一分 子內有至少2種反應性不同之硬化性官能基的單體’與(C) 抗氧化劑。 2. 如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中上述硬化性官能基之至少其一係不飽和酯基。 3. 如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中更含有(Β)界面活性劑。 4 .如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中該組成物之黏度係在3〜18mPa · s之範圍。 5·—種奈米壓印用,硬化性組成物,係至少含(A)同一分子內 有反應性不同之2種以上硬化性官能基,且該硬化性官 能基之至少其一係不飽和酯基的單體,(B)界面活 性劑,及(C)抗氧化劑之奈米壓印用硬化性組成物,其特 徵爲該組成物之黏度係在3〜18mPa· s之範圍。 6 .如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中該單體係如下述一般式(1)所表;200923003 X. Patent application scope: 1. A hardening composition for nanoimprinting, characterized by containing (A) a monomer having at least two reactive functional groups having different reactivity in the same molecule and (C) ) Antioxidants. 2. The curable composition for nanoimprinting according to the first aspect of the invention, wherein at least one of the curable functional groups is an unsaturated ester group. 3. The curable composition for nanoimprinting according to item 1 of the patent application, further comprising (Β) a surfactant. 4. The hardenable composition for nanoimprinting according to claim 1, wherein the viscosity of the composition is in the range of 3 to 18 mPa·s. 5·—for a nanoimprint, a curable composition containing at least two or more kinds of curable functional groups having different reactivity in the same molecule, and at least one of the curable functional groups is unsaturated. A monomer for ester group, (B) a surfactant, and (C) a curable composition for nanoimprint of an antioxidant, characterized in that the viscosity of the composition is in the range of 3 to 18 mPa·s. 6. The hardenable composition for nanoimprinting according to item 1 of the patent application, wherein the single system is as shown in the following general formula (1); (―般式(1)中,R1表氫原子或羥甲基,X表有機基;m 表1~3之整數,!!表之整數;Y表具有碳-碳不飽和鍵 之硬化性目能基、具有碳-氮不飽和鍵之硬化性官能基、 具有含氧原子之環狀基的硬化性官能基或下述一般式(2) 所表之基)(In the general formula (1), R1 represents a hydrogen atom or a hydroxymethyl group, X represents an organic group; m is an integer of Tables 1-3, an integer of the !! table; and the Y table has a hardening property of a carbon-carbon unsaturated bond. An energy group, a hardening functional group having a carbon-nitrogen unsaturated bond, a hardening functional group having a cyclic group containing an oxygen atom, or a group represented by the following general formula (2) -般式⑵ -66- 200923003 (R2各表烷基或芳基)。 7 .如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)中之Y的至少其—係選自乙烯醚基、烯丙醚 基、烯丙酯基、環己烯基、環戊烯基、雙環戊烯基、苯 乙烯基、甲基丙烯醯氧基、甲基丙烯醯胺基、丙烯醯胺 基、乙烯矽烷基、N -乙烯基雜環基及順丁烯二醯亞胺基 之群組。 8. 如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)中之Y的至少其一係選自烯丙醚基、環己烯 基、環戊烯基及雙環戊烯基。 9. 如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中—般式(1)中之Y的至少其一係烯丙醚基,η與m之和 係3〜6。 10·如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)中之Y的至少其一係異氰酸酯基或腈基。 1 1 ·如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)中之Y的至少其一係選自環氧丙環、環氧乙 環及碳酸伸乙酯基之群。 1 2 · $D申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)中X表總碳原子數3~9之有機基。 1 3 ·如申請專利範圍第6項之奈米壓印用硬化性組成物,其 中一般式(1)所表之化合物係下述一般式(3)〜(5)中任何 ―種以上; -67- 200923003- General formula (2) -66- 200923003 (R2 each alkyl or aryl group). 7. The hardenable composition for nanoimprinting according to item 6 of the patent application, wherein at least the Y of the general formula (1) is selected from the group consisting of a vinyl ether group, an allyl ether group, an allyl ester group, Cyclohexenyl, cyclopentenyl, dicyclopentenyl, styryl, methacryloxy, methacrylamido, acrylamido, vinyl fluorenyl, N-vinyl heterocyclic and Group of maleimide groups. 8. The hardenable composition for nanoimprinting according to item 6 of the patent application, wherein at least one of Y in the general formula (1) is selected from the group consisting of allyl ether groups, cyclohexenyl groups, and cyclopentenyl groups. And dicyclopentenyl. 9. The hardenable composition for nanoimprinting according to item 6 of the patent application, wherein at least one of the allyl ether groups of Y in the general formula (1), and the sum of η and m are 3 to 6. 10. The hardenable composition for nanoimprinting according to item 6 of the patent application, wherein at least one of the isocyanate groups or nitrile groups of Y in the general formula (1). 1 1 . The hardenable composition for nanoimprinting according to item 6 of the patent application, wherein at least one of Y in the general formula (1) is selected from the group consisting of a epoxidized ring, an epoxy ring, and a carbonic acid a group of ester groups. 1 2 · $D is a hardening composition for nanoimprinting according to item 6 of the patent application, wherein an organic group having a total carbon number of 3 to 9 in the formula X (1). 1 3 - The curable composition for nanoimprinting according to item 6 of the patent application, wherein the compound represented by the general formula (1) is any one of the following general formulas (3) to (5); 67- 200923003 °γ° *^R3°γ° *^R3 一般式(3) 一般式(4)General formula (3) general formula (4) 0"^\-^Si(0R4)3 —般式(5) (一般式(3)〜(5)中,r3各表氫原子或甲基,R4各表甲基 或乙基)。 1 4.如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中含該單體(A)以外之聚合性單體,及光聚合引發劑。 Π.如申請專利範圍第丨項之奈米壓印用硬化性組成物,其 中該抗氧化劑係至少選自受阻酚系抗氧化劑或受阻胺系 抗氧化劑。 1 6 ·如申請專利範圍第1項之奈米壓印用硬化性組成物,其 、 中該抗氧化劑之含量係1 0質量%以下。 17. 如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中不含分子量超過1000之化合物。 18. 如申請專利範圍第丨項之奈米壓印用硬化性組成物,其 中該組成物的表面張力係在18~30mN/m之範圍。 1 9.如申請專利範圍第1項之奈米壓印用硬化性組成物,其 中藉由進行照光及加熱以硬化。 20.—種硬化物,其特徵爲係使如申請專利範圍第1至19 項中任一項之奈米壓印用硬化性組成物硬化而成。 -68- 200923003 2 1 . —種硬化物之製法,其特徵爲包括使如申請專利範圍第 1至1 9項中任一項之奈米壓印用硬化性組成物藉由複數 次進行照光及加熱而硬化。 22. —種液晶顯示裝置用構件,其特徵爲使用如申請專利範 圍第2 0項之硬化物。 2 3 . —種液晶顯示裝置用構件之製法,其特徵爲包括使如申 請專利範圍第1至1 9項中任一項之奈米壓印用硬化性組 成物藉由進行複數次照射光及加熱而硬化。 -69- 200923003 七、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: Μ。 ^ 1 f \ 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式:0"^\-^Si(0R4)3 General formula (5) (in the general formulas (3) to (5), each of the hydrogen atoms or methyl groups of r3, and each methyl or ethyl group of R4). (1) The curable composition for nanoimprinting according to the first aspect of the invention, which comprises a polymerizable monomer other than the monomer (A) and a photopolymerization initiator. The hardenable composition for nanoimprinting according to the ninth aspect of the invention, wherein the antioxidant is at least selected from the group consisting of a hindered phenol-based antioxidant or a hindered amine-based antioxidant. In the case of the curable composition for nanoimprinting according to the first aspect of the patent application, the content of the antioxidant is 10% by mass or less. 17. The hardenable composition for nanoimprinting according to item 1 of the patent application, which does not contain a compound having a molecular weight of more than 1,000. 18. The hardenable composition for nanoimprinting according to the ninth aspect of the invention, wherein the surface tension of the composition is in the range of 18 to 30 mN/m. 1 9. The hardenable composition for nanoimprinting according to the first aspect of the patent application, wherein the hardening composition is cured by irradiation and heating. A cured product obtained by hardening a hardenable composition for nanoimprinting according to any one of claims 1 to 19. -68-200923003 2 1 - A method for producing a cured product, which comprises irradiating a hardening composition for nanoimprinting according to any one of claims 1 to 19 by a plurality of times Hardened by heating. A member for a liquid crystal display device characterized by using a cured product as in item 20 of the patent application. And a method for producing a member for a liquid crystal display device, comprising: performing a plurality of irradiation lights by using a hardening composition for nanoimprinting according to any one of claims 1 to 19; Hardened by heating. -69- 200923003 VII. Designation of representative representatives: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: Μ. ^ 1 f \ VIII. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention:
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US8574822B2 (en) 2009-06-09 2013-11-05 Tsinghua University Nanoimprint resist
TWI473726B (en) * 2009-07-15 2015-02-21 Nat Univ Tsing Hua Method for forming modified metal layer
TWI503365B (en) * 2012-04-27 2015-10-11 Nissan Chemical Ind Ltd Imprinting material
CN106715495A (en) * 2014-09-12 2017-05-24 3M创新有限公司 Allyl acrylate crosslinkers for PSAs
TWI666685B (en) * 2016-03-31 2019-07-21 佳能股份有限公司 Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

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JP5899145B2 (en) 2012-06-18 2016-04-06 富士フイルム株式会社 Composition for forming underlayer film for imprint and pattern forming method
JP6327948B2 (en) * 2013-06-26 2018-05-23 キヤノン株式会社 Photocurable composition, cured product, film manufacturing method, optical component manufacturing method, circuit board manufacturing method, and electronic component manufacturing method using the same
JP6327947B2 (en) 2013-06-26 2018-05-23 キヤノン株式会社 Photocurable composition, film manufacturing method, optical component manufacturing method, circuit board manufacturing method, electronic component manufacturing method, cured product using the same
JP6494185B2 (en) 2013-06-26 2019-04-03 キヤノン株式会社 Imprint method and apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8574822B2 (en) 2009-06-09 2013-11-05 Tsinghua University Nanoimprint resist
TWI473726B (en) * 2009-07-15 2015-02-21 Nat Univ Tsing Hua Method for forming modified metal layer
TWI503365B (en) * 2012-04-27 2015-10-11 Nissan Chemical Ind Ltd Imprinting material
CN106715495A (en) * 2014-09-12 2017-05-24 3M创新有限公司 Allyl acrylate crosslinkers for PSAs
TWI666685B (en) * 2016-03-31 2019-07-21 佳能股份有限公司 Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10578965B2 (en) 2016-03-31 2020-03-03 Canon Kabushiki Kaisha Pattern forming method

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