TWI536445B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

Info

Publication number
TWI536445B
TWI536445B TW103109914A TW103109914A TWI536445B TW I536445 B TWI536445 B TW I536445B TW 103109914 A TW103109914 A TW 103109914A TW 103109914 A TW103109914 A TW 103109914A TW I536445 B TWI536445 B TW I536445B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
solvent
volatile solvent
heating
Prior art date
Application number
TW103109914A
Other languages
English (en)
Chinese (zh)
Other versions
TW201442106A (zh
Inventor
林航之介
古矢正明
大田垣崇
長嶋裕次
木名瀬淳
安部正泰
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201442106A publication Critical patent/TW201442106A/zh
Application granted granted Critical
Publication of TWI536445B publication Critical patent/TWI536445B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
TW103109914A 2013-03-18 2014-03-17 基板處理裝置及基板處理方法 TWI536445B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013054559 2013-03-18
JP2014028998A JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201442106A TW201442106A (zh) 2014-11-01
TWI536445B true TWI536445B (zh) 2016-06-01

Family

ID=50732754

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109914A TWI536445B (zh) 2013-03-18 2014-03-17 基板處理裝置及基板處理方法

Country Status (6)

Country Link
US (1) US10276406B2 (enExample)
EP (1) EP2782127B1 (enExample)
JP (1) JP6351993B2 (enExample)
KR (1) KR101602554B1 (enExample)
CN (1) CN104064496B (enExample)
TW (1) TWI536445B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6226297B2 (ja) * 2014-03-26 2017-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI661502B (zh) 2014-02-27 2019-06-01 日商斯克林集團公司 基板處理裝置
JP6300314B2 (ja) * 2014-03-26 2018-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6304592B2 (ja) * 2014-03-25 2018-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI667686B (zh) * 2015-01-23 2019-08-01 日本思可林集團股份有限公司 基板處理方法及基板處理裝置暨流體噴嘴
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6829639B2 (ja) * 2017-03-28 2021-02-10 Ｅｎｅｏｓ株式会社 Ｗ／ｏエマルジョン洗浄液を使用する洗浄方法
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法
JP7726653B2 (ja) * 2021-03-31 2025-08-20 芝浦メカトロニクス株式会社 基板乾燥装置及び基板処理装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292325A (ja) 1985-10-17 1987-04-27 Nec Corp ウエハ−乾燥装置
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
JPH09148297A (ja) * 1995-11-24 1997-06-06 Hitachi Ltd 基板の乾燥方法およびこれを用いる乾燥装置およびこれを用いる半導体装置の製造方法
US5980637A (en) 1996-12-20 1999-11-09 Steag Rtp Systems, Inc. System for depositing a material on a substrate using light energy
JP3171807B2 (ja) 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
JP3330300B2 (ja) 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
KR100271764B1 (ko) 1997-12-24 2000-12-01 윤종용 반도체장치 제조용 현상 장치 및 그의 제어방법
JPH11340187A (ja) 1998-05-28 1999-12-10 Matsushita Electric Ind Co Ltd 洗浄乾燥装置および洗浄乾燥方法
JPH11354487A (ja) 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP3250154B2 (ja) 1999-03-31 2002-01-28 株式会社スーパーシリコン研究所 半導体ウエハ製造装置
DE60044762D1 (de) 1999-05-20 2010-09-16 Kaneka Corp Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements
AT407680B (de) * 1999-06-04 2001-05-25 Sez Semiconduct Equip Zubehoer Verfahren und vorrichtung zum trocknen von scheibenförmigen gegenständen
DE10030431A1 (de) * 2000-06-21 2002-01-10 Karl Suess Kg Praez Sgeraete F Verfahren und Vorrichtung zum Reinigen und/oder Bonden von Substraten
CN101414547B (zh) * 2001-11-02 2012-02-08 应用材料公司 清洗微电子器件的方法
JP4056858B2 (ja) 2001-11-12 2008-03-05 東京エレクトロン株式会社 基板処理装置
US6843855B2 (en) 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer
JP2004259734A (ja) 2003-02-24 2004-09-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TW200633033A (en) 2004-08-23 2006-09-16 Koninkl Philips Electronics Nv Hot source cleaning system
US7642205B2 (en) 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
KR100696378B1 (ko) 2005-04-13 2007-03-19 삼성전자주식회사 반도체 기판을 세정하는 장치 및 방법
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100816740B1 (ko) * 2006-08-30 2008-03-27 세메스 주식회사 기판 처리 장치 및 방법
JP5043406B2 (ja) * 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP2009076856A (ja) 2007-08-28 2009-04-09 Dainippon Screen Mfg Co Ltd 基板処理装置
WO2009026720A1 (en) 2007-08-29 2009-03-05 Methylgene Inc. Processes and intermediates for preparing fused heterocyclic kinase inhibitors
DE102007058002B4 (de) 2007-12-03 2016-03-17 Mattson Thermal Products Gmbh Vorrichtung zum thermischen Behandeln von scheibenförmigen Halbleitersubstraten
JP4601079B2 (ja) * 2007-12-17 2010-12-22 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP5413016B2 (ja) 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
JP5140641B2 (ja) * 2009-06-29 2013-02-06 株式会社荏原製作所 基板処理方法及び基板処理装置
CN101718487B (zh) * 2009-12-04 2013-07-31 有研半导体材料股份有限公司 一种硅片清洗后的快速干燥方法和装置
JP5146522B2 (ja) 2010-11-26 2013-02-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US20120260517A1 (en) 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations
WO2012165377A1 (ja) 2011-05-30 2012-12-06 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2012250230A (ja) 2011-06-02 2012-12-20 Tokyo Ohka Kogyo Co Ltd 加熱装置、塗布装置及び加熱方法
JP5686261B2 (ja) 2011-07-29 2015-03-18 セメス株式会社ＳＥＭＥＳ ＣＯ．， Ｌｔｄ 基板処理装置及び基板処理方法
KR101329304B1 (ko) 2011-07-29 2013-11-14 세메스 주식회사 기판처리장치 및 기판처리방법
JP6000822B2 (ja) 2012-11-26 2016-10-05 東京エレクトロン株式会社 基板洗浄方法および基板洗浄システム

Also Published As

Publication number Publication date
EP2782127B1 (en) 2017-01-25
JP2014207437A (ja) 2014-10-30
EP2782127A3 (en) 2014-10-29
CN104064496B (zh) 2017-10-13
CN104064496A (zh) 2014-09-24
TW201442106A (zh) 2014-11-01
KR20140114298A (ko) 2014-09-26
EP2782127A2 (en) 2014-09-24
US10276406B2 (en) 2019-04-30
KR101602554B1 (ko) 2016-03-10
US20140261566A1 (en) 2014-09-18
JP6351993B2 (ja) 2018-07-04

Similar Documents

Publication Publication Date Title
TWI536445B (zh) 基板處理裝置及基板處理方法
TWI587381B (zh) 基板處理裝置及基板處理方法
CN104517809B (zh) 基板处理装置和基板处理方法
KR101624038B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2015092539A (ja) 基板処理装置及び基板処理方法
JP6276924B2 (ja) 基板処理装置
TWI597769B (zh) 基板處理裝置及基板處理方法
JP2015070208A (ja) 基板処理装置及び基板処理方法
JP6585243B2 (ja) 基板処理装置及び基板処理方法