KR101602554B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR101602554B1
KR101602554B1 KR1020140030244A KR20140030244A KR101602554B1 KR 101602554 B1 KR101602554 B1 KR 101602554B1 KR 1020140030244 A KR1020140030244 A KR 1020140030244A KR 20140030244 A KR20140030244 A KR 20140030244A KR 101602554 B1 KR101602554 B1 KR 101602554B1
Authority
KR
South Korea
Prior art keywords
substrate
volatile solvent
heating
liquid
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140030244A
Other languages
English (en)
Korean (ko)
Other versions
KR20140114298A (ko
Inventor
고노스케 하야시
마사아키 후루야
다카시 오오타가키
유지 나가시마
아츠시 기나세
마사히로 아베
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20140114298A publication Critical patent/KR20140114298A/ko
Application granted granted Critical
Publication of KR101602554B1 publication Critical patent/KR101602554B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140030244A 2013-03-18 2014-03-14 기판 처리 장치 및 기판 처리 방법 Active KR101602554B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013054559 2013-03-18
JPJP-P-2013-054559 2013-03-18
JPJP-P-2014-028998 2014-02-18
JP2014028998A JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
KR20140114298A KR20140114298A (ko) 2014-09-26
KR101602554B1 true KR101602554B1 (ko) 2016-03-10

Family

ID=50732754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140030244A Active KR101602554B1 (ko) 2013-03-18 2014-03-14 기판 처리 장치 및 기판 처리 방법

Country Status (6)

Country Link
US (1) US10276406B2 (enExample)
EP (1) EP2782127B1 (enExample)
JP (1) JP6351993B2 (enExample)
KR (1) KR101602554B1 (enExample)
CN (1) CN104064496B (enExample)
TW (1) TWI536445B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6300314B2 (ja) * 2014-03-26 2018-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6226297B2 (ja) * 2014-03-26 2017-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108155133B (zh) 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
JP6304592B2 (ja) * 2014-03-25 2018-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN105826219B (zh) * 2015-01-23 2019-01-04 株式会社思可林集团 基板处理方法、基板处理装置和流体喷嘴
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6829639B2 (ja) * 2017-03-28 2021-02-10 Ｅｎｅｏｓ株式会社 Ｗ／ｏエマルジョン洗浄液を使用する洗浄方法
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法
JP7726653B2 (ja) * 2021-03-31 2025-08-20 芝浦メカトロニクス株式会社 基板乾燥装置及び基板処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120260517A1 (en) 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292325A (ja) * 1985-10-17 1987-04-27 Nec Corp ウエハ−乾燥装置
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
JPH09148297A (ja) * 1995-11-24 1997-06-06 Hitachi Ltd 基板の乾燥方法およびこれを用いる乾燥装置およびこれを用いる半導体装置の製造方法
US5980637A (en) 1996-12-20 1999-11-09 Steag Rtp Systems, Inc. System for depositing a material on a substrate using light energy
JP3171807B2 (ja) 1997-01-24 2001-06-04 東京エレクトロン株式会社 洗浄装置及び洗浄方法
JP3330300B2 (ja) 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
KR100271764B1 (ko) 1997-12-24 2000-12-01 윤종용 반도체장치 제조용 현상 장치 및 그의 제어방법
JPH11340187A (ja) 1998-05-28 1999-12-10 Matsushita Electric Ind Co Ltd 洗浄乾燥装置および洗浄乾燥方法
JPH11354487A (ja) 1998-06-03 1999-12-24 Dainippon Screen Mfg Co Ltd 基板乾燥装置および基板乾燥方法
JP3250154B2 (ja) 1999-03-31 2002-01-28 株式会社スーパーシリコン研究所 半導体ウエハ製造装置
DE60044762D1 (de) 1999-05-20 2010-09-16 Kaneka Corp Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements
AT407680B (de) * 1999-06-04 2001-05-25 Sez Semiconduct Equip Zubehoer Verfahren und vorrichtung zum trocknen von scheibenförmigen gegenständen
DE10030431A1 (de) * 2000-06-21 2002-01-10 Karl Suess Kg Praez Sgeraete F Verfahren und Vorrichtung zum Reinigen und/oder Bonden von Substraten
CN101499413B (zh) * 2001-11-02 2011-05-04 应用材料股份有限公司 单个晶片的干燥装置和干燥方法
JP4056858B2 (ja) 2001-11-12 2008-03-05 東京エレクトロン株式会社 基板処理装置
US6843855B2 (en) 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer
JP2004259734A (ja) 2003-02-24 2004-09-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TW200633033A (en) 2004-08-23 2006-09-16 Koninkl Philips Electronics Nv Hot source cleaning system
US7642205B2 (en) 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
KR100696378B1 (ko) 2005-04-13 2007-03-19 삼성전자주식회사 반도체 기판을 세정하는 장치 및 방법
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100816740B1 (ko) * 2006-08-30 2008-03-27 세메스 주식회사 기판 처리 장치 및 방법
JP5043406B2 (ja) * 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP2009076856A (ja) 2007-08-28 2009-04-09 Dainippon Screen Mfg Co Ltd 基板処理装置
ES2593279T3 (es) 2007-08-29 2016-12-07 Methylgene Inc. Procesos e intermedios para preparar inhibidores de cinasa heterocíclicos condensados
DE102007058002B4 (de) 2007-12-03 2016-03-17 Mattson Thermal Products Gmbh Vorrichtung zum thermischen Behandeln von scheibenförmigen Halbleitersubstraten
JP4601079B2 (ja) * 2007-12-17 2010-12-22 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP5413016B2 (ja) 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
JP5140641B2 (ja) * 2009-06-29 2013-02-06 株式会社荏原製作所 基板処理方法及び基板処理装置
CN101718487B (zh) * 2009-12-04 2013-07-31 有研半导体材料股份有限公司 一种硅片清洗后的快速干燥方法和装置
JP5146522B2 (ja) 2010-11-26 2013-02-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5254308B2 (ja) * 2010-12-27 2013-08-07 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
WO2012165377A1 (ja) 2011-05-30 2012-12-06 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP2012250230A (ja) 2011-06-02 2012-12-20 Tokyo Ohka Kogyo Co Ltd 加熱装置、塗布装置及び加熱方法
JP5686261B2 (ja) 2011-07-29 2015-03-18 セメス株式会社ＳＥＭＥＳ ＣＯ．， Ｌｔｄ 基板処理装置及び基板処理方法
KR101329304B1 (ko) 2011-07-29 2013-11-14 세메스 주식회사 기판처리장치 및 기판처리방법
JP6000822B2 (ja) 2012-11-26 2016-10-05 東京エレクトロン株式会社 基板洗浄方法および基板洗浄システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120260517A1 (en) 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations

Also Published As

Publication number Publication date
TWI536445B (zh) 2016-06-01
TW201442106A (zh) 2014-11-01
US10276406B2 (en) 2019-04-30
CN104064496B (zh) 2017-10-13
EP2782127A2 (en) 2014-09-24
KR20140114298A (ko) 2014-09-26
US20140261566A1 (en) 2014-09-18
EP2782127B1 (en) 2017-01-25
EP2782127A3 (en) 2014-10-29
CN104064496A (zh) 2014-09-24
JP6351993B2 (ja) 2018-07-04
JP2014207437A (ja) 2014-10-30

Similar Documents

Publication Publication Date Title
KR101602554B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR101688689B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP6426927B2 (ja) 基板処理装置及び基板処理方法
KR101624038B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2015092539A (ja) 基板処理装置及び基板処理方法
JP6276924B2 (ja) 基板処理装置
KR101634428B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP6585243B2 (ja) 基板処理装置及び基板処理方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20181220

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20191226

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 11