KR101602554B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR101602554B1
KR101602554B1 KR1020140030244A KR20140030244A KR101602554B1 KR 101602554 B1 KR101602554 B1 KR 101602554B1 KR 1020140030244 A KR1020140030244 A KR 1020140030244A KR 20140030244 A KR20140030244 A KR 20140030244A KR 101602554 B1 KR101602554 B1 KR 101602554B1
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substrate
volatile solvent
heating
liquid
cleaning liquid
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Korean (ko)
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KR20140114298A (ko
Inventor
고노스케 하야시
마사아키 후루야
다카시 오오타가키
유지 나가시마
아츠시 기나세
마사히로 아베
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140030244A 2013-03-18 2014-03-14 기판 처리 장치 및 기판 처리 방법 Active KR101602554B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013054559 2013-03-18
JPJP-P-2013-054559 2013-03-18
JP2014028998A JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法
JPJP-P-2014-028998 2014-02-18

Publications (2)

Publication Number Publication Date
KR20140114298A KR20140114298A (ko) 2014-09-26
KR101602554B1 true KR101602554B1 (ko) 2016-03-10

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KR1020140030244A Active KR101602554B1 (ko) 2013-03-18 2014-03-14 기판 처리 장치 및 기판 처리 방법

Country Status (6)

Country Link
US (1) US10276406B2 (enExample)
EP (1) EP2782127B1 (enExample)
JP (1) JP6351993B2 (enExample)
KR (1) KR101602554B1 (enExample)
CN (1) CN104064496B (enExample)
TW (1) TWI536445B (enExample)

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JP6226297B2 (ja) * 2014-03-26 2017-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN108155133B (zh) 2014-02-27 2022-04-15 斯克林集团公司 基板处理装置
JP6300314B2 (ja) * 2014-03-26 2018-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6304592B2 (ja) * 2014-03-25 2018-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10249487B2 (en) * 2015-01-23 2019-04-02 SCREEN Holdings Co., Ltd. Substrate processing method
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6829639B2 (ja) * 2017-03-28 2021-02-10 Ｅｎｅｏｓ株式会社 Ｗ／ｏエマルジョン洗浄液を使用する洗浄方法
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法
JP7726653B2 (ja) * 2021-03-31 2025-08-20 芝浦メカトロニクス株式会社 基板乾燥装置及び基板処理装置

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US20120260517A1 (en) 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations

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Also Published As

Publication number Publication date
CN104064496A (zh) 2014-09-24
EP2782127A3 (en) 2014-10-29
JP6351993B2 (ja) 2018-07-04
EP2782127A2 (en) 2014-09-24
TW201442106A (zh) 2014-11-01
TWI536445B (zh) 2016-06-01
US20140261566A1 (en) 2014-09-18
CN104064496B (zh) 2017-10-13
US10276406B2 (en) 2019-04-30
EP2782127B1 (en) 2017-01-25
JP2014207437A (ja) 2014-10-30
KR20140114298A (ko) 2014-09-26

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