JP6351993B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP6351993B2
JP6351993B2 JP2014028998A JP2014028998A JP6351993B2 JP 6351993 B2 JP6351993 B2 JP 6351993B2 JP 2014028998 A JP2014028998 A JP 2014028998A JP 2014028998 A JP2014028998 A JP 2014028998A JP 6351993 B2 JP6351993 B2 JP 6351993B2
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Japan
Prior art keywords
substrate
liquid
volatile solvent
drying
heating
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Active
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JP2014028998A
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English (en)
Japanese (ja)
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JP2014207437A (ja
JP2014207437A5 (enExample
Inventor
林　航之介
航之介 林
古矢　正明
正明 古矢
崇 大田垣
崇 大田垣
裕次 長嶋
裕次 長嶋
淳 木名瀬
淳 木名瀬
正泰 安部
正泰 安部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2014028998A priority Critical patent/JP6351993B2/ja
Priority to KR1020140030244A priority patent/KR101602554B1/ko
Priority to US14/212,899 priority patent/US10276406B2/en
Priority to EP14160174.0A priority patent/EP2782127B1/en
Priority to TW103109914A priority patent/TWI536445B/zh
Priority to CN201410100796.8A priority patent/CN104064496B/zh
Publication of JP2014207437A publication Critical patent/JP2014207437A/ja
Publication of JP2014207437A5 publication Critical patent/JP2014207437A5/ja
Application granted granted Critical
Publication of JP6351993B2 publication Critical patent/JP6351993B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
JP2014028998A 2013-03-18 2014-02-18 基板処理装置及び基板処理方法 Active JP6351993B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014028998A JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法
US14/212,899 US10276406B2 (en) 2013-03-18 2014-03-14 Substrate processing device and substrate processing method
KR1020140030244A KR101602554B1 (ko) 2013-03-18 2014-03-14 기판 처리 장치 및 기판 처리 방법
TW103109914A TWI536445B (zh) 2013-03-18 2014-03-17 基板處理裝置及基板處理方法
EP14160174.0A EP2782127B1 (en) 2013-03-18 2014-03-17 Substrate processing device and substrate processing method
CN201410100796.8A CN104064496B (zh) 2013-03-18 2014-03-18 基板处理装置和基板处理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013054559 2013-03-18
JP2013054559 2013-03-18
JP2014028998A JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2014207437A JP2014207437A (ja) 2014-10-30
JP2014207437A5 JP2014207437A5 (enExample) 2017-09-28
JP6351993B2 true JP6351993B2 (ja) 2018-07-04

Family

ID=50732754

Family Applications (1)

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JP2014028998A Active JP6351993B2 (ja) 2013-03-18 2014-02-18 基板処理装置及び基板処理方法

Country Status (6)

Country Link
US (1) US10276406B2 (enExample)
EP (1) EP2782127B1 (enExample)
JP (1) JP6351993B2 (enExample)
KR (1) KR101602554B1 (enExample)
CN (1) CN104064496B (enExample)
TW (1) TWI536445B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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JP6226297B2 (ja) * 2014-03-26 2017-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI661502B (zh) 2014-02-27 2019-06-01 日商斯克林集團公司 基板處理裝置
JP6300314B2 (ja) * 2014-03-26 2018-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6304592B2 (ja) * 2014-03-25 2018-04-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI667686B (zh) * 2015-01-23 2019-08-01 日本思可林集團股份有限公司 基板處理方法及基板處理裝置暨流體噴嘴
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6829639B2 (ja) * 2017-03-28 2021-02-10 Ｅｎｅｏｓ株式会社 Ｗ／ｏエマルジョン洗浄液を使用する洗浄方法
JP7285692B2 (ja) * 2019-05-17 2023-06-02 東京エレクトロン株式会社 乾燥装置、基板処理システム、および乾燥方法
JP7726653B2 (ja) * 2021-03-31 2025-08-20 芝浦メカトロニクス株式会社 基板乾燥装置及び基板処理装置

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Also Published As

Publication number Publication date
EP2782127B1 (en) 2017-01-25
JP2014207437A (ja) 2014-10-30
EP2782127A3 (en) 2014-10-29
CN104064496B (zh) 2017-10-13
CN104064496A (zh) 2014-09-24
TW201442106A (zh) 2014-11-01
KR20140114298A (ko) 2014-09-26
EP2782127A2 (en) 2014-09-24
US10276406B2 (en) 2019-04-30
KR101602554B1 (ko) 2016-03-10
TWI536445B (zh) 2016-06-01
US20140261566A1 (en) 2014-09-18

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