TWI532760B - Resin composition, prepreg and laminate - Google Patents
Resin composition, prepreg and laminate Download PDFInfo
- Publication number
- TWI532760B TWI532760B TW101102504A TW101102504A TWI532760B TW I532760 B TWI532760 B TW I532760B TW 101102504 A TW101102504 A TW 101102504A TW 101102504 A TW101102504 A TW 101102504A TW I532760 B TWI532760 B TW I532760B
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- TW
- Taiwan
- Prior art keywords
- group
- resin
- parts
- mass
- resin composition
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 45
- 239000003822 epoxy resin Substances 0.000 claims description 46
- 229920000647 polyepoxide Polymers 0.000 claims description 46
- 239000011256 inorganic filler Substances 0.000 claims description 36
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 36
- -1 cyanate compound Chemical class 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 25
- 239000005011 phenolic resin Substances 0.000 claims description 24
- 239000005078 molybdenum compound Substances 0.000 claims description 19
- 150000002752 molybdenum compounds Chemical class 0.000 claims description 19
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 125000001624 naphthyl group Chemical group 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004848 polyfunctional curative Substances 0.000 claims description 7
- 125000005427 anthranyl group Chemical group 0.000 claims description 6
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 claims description 3
- 239000011609 ammonium molybdate Substances 0.000 claims description 3
- 235000018660 ammonium molybdate Nutrition 0.000 claims description 3
- 229940010552 ammonium molybdate Drugs 0.000 claims description 3
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 2
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- 125000002950 monocyclic group Chemical group 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 19
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 18
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 229910001593 boehmite Inorganic materials 0.000 description 13
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 238000005553 drilling Methods 0.000 description 11
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 10
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000002270 dispersing agent Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 5
- 150000002466 imines Chemical class 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N alpha-naphthol Natural products C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 4
- 239000000347 magnesium hydroxide Substances 0.000 description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- GGMMWVHTLAENAS-UHFFFAOYSA-M (1,1-diethylpyrrolidin-1-ium-3-yl) 2-hydroxy-2,2-diphenylacetate;bromide Chemical compound [Br-].C1[N+](CC)(CC)CCC1OC(=O)C(O)(C=1C=CC=CC=1)C1=CC=CC=C1 GGMMWVHTLAENAS-UHFFFAOYSA-M 0.000 description 1
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 1
- NHWYMYDMYCNUKI-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-diethylphenyl]methyl]-2,6-diethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(CC)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(CC)=C1N1C(=O)C=CC1=O NHWYMYDMYCNUKI-UHFFFAOYSA-N 0.000 description 1
- RUORVEVRVBXRIO-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-dimethylphenyl]methyl]-2,6-dimethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(C)=CC=1CC(C=C1C)=CC(C)=C1N1C(=O)C=CC1=O RUORVEVRVBXRIO-UHFFFAOYSA-N 0.000 description 1
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- LARNQUAWIRVQPK-UHFFFAOYSA-N 2-methyloxiran-2-amine Chemical compound NC1(CO1)C LARNQUAWIRVQPK-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- GNPSQUCXOBDIDY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane Chemical compound C(CCCCCCC)C(C(OC)(OC)OC)CCC GNPSQUCXOBDIDY-UHFFFAOYSA-N 0.000 description 1
- PBEHQFUSQJKBAS-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;phenol Chemical compound OC1=CC=CC=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 PBEHQFUSQJKBAS-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910021532 Calcite Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PNUGSDQQNPJAPF-UHFFFAOYSA-N Cl.C(CC)C(C(OC)(OC)OC)CCCCCCCC Chemical compound Cl.C(CC)C(C(OC)(OC)OC)CCCCCCCC PNUGSDQQNPJAPF-UHFFFAOYSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- BHXFKXOIODIUJO-UHFFFAOYSA-N benzene-1,4-dicarbonitrile Chemical compound N#CC1=CC=C(C#N)C=C1 BHXFKXOIODIUJO-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- QPJDMGCKMHUXFD-UHFFFAOYSA-N cyanogen chloride Chemical compound ClC#N QPJDMGCKMHUXFD-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- ZZJTZUHEKFAEAZ-UHFFFAOYSA-N decane ethene Chemical compound C=C.CCCCCCCCCC ZZJTZUHEKFAEAZ-UHFFFAOYSA-N 0.000 description 1
- UZILCZKGXMQEQR-UHFFFAOYSA-N decyl-Benzene Chemical compound CCCCCCCCCCC1=CC=CC=C1 UZILCZKGXMQEQR-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
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Description
本發明係關於樹脂組成物,更詳而言之,係關於印刷電路板用預浸體使用的樹脂組成物。再者,本發明係關於使用樹脂組成物而製作之印刷電路板用預浸體、以及使用該預浸體之疊層板及覆金屬箔疊層板。
近年來,電子設備或通信器材、個人電腦等廣為使用的半導體的高密集化、高機能化、高密度安裝化愈來愈加速,比起以前對於半導體塑膠封裝體用疊層板的熱膨脹率、鑽孔加工性、耐熱性及難燃性的要求更為提高。
尤其,近年來對於疊層板的面方向的熱膨脹率減低強力要求。其原因為:該等當半導體元件與半導體塑膠封裝體用印刷電路板間的熱膨脹率差異大、施加熱衝撃時,由於熱膨脹率差會造成半導體塑膠封裝體翹曲,且半導體元件與半導體塑膠封裝體用印刷電路板間、或半導體塑膠封裝體與安裝的印刷電路板之間會發生連接不良。
為了滿足耐熱性及難燃性且同時降低熱膨脹率,有增加樹脂組成物中之無機填充材之填充量的方法(參照例如專利文獻1及2)。但該方法容易發生硬化物變得硬且脆、鑽頭快速磨損、由於鑽頭折損或孔位置精度降低而需要增加鑽頭更換的頻度的問題。
其他方法有填充高摩氏硬度之無機填充材之方法。例如:已知有摻合軟水鋁石(Boehmite)或二氧化矽當做無機填充材之方法。但該等方法雖對於降低熱膨脹率有效,但是由於係堅硬的無機填充材,故會有鑽孔劇烈磨損、鑽孔加工性惡化的缺點。
另一方面,若摻合氫氧化鎂或氫氧化鋁當做比起軟水鋁石或二氧化矽的摩氏硬度低的無機填充材(例如參照專利文獻3及4),雖然比起單獨使用軟水鋁石或二氧化矽時,鑽孔加工性雖然較優異,但是,由此而得之面方向之熱膨脹率不足,會由於加熱時所釋放的結晶水造成耐熱性降低。
專利文獻1:日本特開2004-059643公報
專利文獻2:日本特開2009-120702公報
專利文獻3:日本特開2009-074036公報
專利文獻4:日本特開2009-279770公報
本發明之課題在於提供:使用在面方向之熱膨脹率低、鑽孔加工性優異、且耐熱性、難燃性優異之印刷電路板用預浸體的樹脂組成物、使用該樹脂組成物製作之印刷電路板用預浸體、以及使用該預浸體之疊層板及覆金屬箔疊層板。
本案發明人等發現藉由使用包含鉬化合物(A)、環氧樹脂(B)、硬化劑(C)、與無機填充材(D)而成之樹脂組成物,且其中無機填充材之摩氏硬度為3.5以上,且無機填充材之含量相對於樹脂固體成分之合計100質量份為40~600質量份之樹脂組成物,可以獲得完全滿足上述課題之疊層板。
亦即,依照本發明之一態樣,提供一種樹脂組成物,係包含以下成分而成:鉬化合物(A)、環氧樹脂(B)、硬化劑(C)、與無機填充材(D);該無機填充材(D)之摩氏硬度為3.5以上,且該無機填充材(D)之含量,相對於樹脂固體成分之合計100質量份,為40~600質量份。
又,依照本發明之另一態樣,提供上述樹脂組成物含浸或塗佈於基材而成之預浸體。
又,依照本發明之另一態樣,提供將上述預浸體予以疊層成形而成的疊層板。
又,依照本發明之另一態樣,提供將上述預浸體與金屬箔予以疊層成形而成之覆金屬箔疊層板。
由使用依照本發明之樹脂組成物製作之預浸體獲得之疊層板,於面方向之熱膨脹率低、鑽孔加工性優異、具有高耐熱性及難燃性,故能提供要求各種特性之半導體封裝體用之材料。
樹脂組成物
依照本發明之樹脂組成物,係包含鉬化合物(A)、環氧樹脂(B)、硬化劑(C)、與無機填充材(D)而成,且無機填充材(D)之摩氏硬度為3.5以上,且無機填充材(D)之含量相對於樹脂固體成分之合計100質量份為40~600質量份。在此,樹脂固體成分,係指環氧樹脂(B)、硬化劑(C),樹脂組成物含有馬來醯亞胺化合物及/或BT樹脂時,係指也包含此等者。依照本發明之樹脂組成物,適用於製作印刷電路板用預浸體。以下針對構成樹脂組成物之各成分加以說明。
鉬化合物(A)
本發明使用之鉬化合物(A),例如:鉬酸、鉬酸鋅、鉬酸銨、鉬酸鈉、鉬酸鈣、鉬酸鉀、三氧化鉬等鉬化合物。藉由摻合鉬化合物(A),由使用依照本發明之樹脂組成物製作之預浸體獲得之疊層板之難燃性會變得良好。
本發明中,鉬化合物(A)摻合時之形態不特別限定,較佳為不是使用為無機填充材構成之核材所被覆者,而是單獨(非載持型)使用。藉由不使用以往當做核材使用之摩氏硬度小於3.5之無機填充材,由使用依照本發明之樹脂組成物製作之預浸體所獲得之疊層板之耐熱性會更為良好。因此,依照本發明之樹脂組成物所含之摩氏硬度小於3.5之無機填充材之含量,相對於鉬化合物(A)100質量份為100質量份以下較佳。再者,依照本發明之樹脂組成物,更佳為實質上不含摩氏硬度小於3.5之無機填充材。又,摩氏硬度小於3.5之無機填充材,例如:滑石(摩氏硬度1)、石膏(摩氏硬度2)、氫氧化鎂(摩氏硬度2.5)、方解石(摩氏硬度3)、及氫氧化鋁(摩氏硬度3)等。
本發明中,鉬化合物(A)之摻合量,相對於樹脂固體成分之合計100質量份,為約0.2~30質量份時,從難燃性及耐熱性之觀點較佳,尤其於1~10質量份之範圍使用較佳。
環氧樹脂(B)
本發明使用之環氧樹脂(B),從近年來對於環境問題之關注提高的觀點,為非鹵素系環氧樹脂較佳。例如:雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚酚醛型環氧樹脂、甲酚酚醛型環氧樹脂、雙酚A酚醛型環氧樹脂、3官能酚型環氧樹脂、4官能酚型環氧樹脂、萘型環氧樹脂、聯苯型環氧樹脂、芳烷基酚醛型環氧樹脂、脂環環氧樹脂、多元醇型環氧樹脂、將環氧丙胺、環氧丙酯、及丁二烯等的雙鍵予以環氧化而得之化合物、及利用含羥基之矽酮樹脂類與表氯醇之反應獲得之化合物等。其中,從獲得之疊層板之難燃性或耐熱性提高之觀點,芳烷基酚醛型環氧樹脂及酚酚醛型環氧樹脂當中至少1種較佳,從使難燃性更提高的觀點,以下式(1)表示之芳烷基酚醛型環氧樹脂更佳。具體而言,宜使用酚聯苯芳烷基型環氧樹脂或聚氧化萘型環氧樹脂等。尤以下式(2)表示之酚苯基芳烷基型環氧樹脂為較佳。又,從熱膨脹率之觀點,使用以下式(3)表示之具萘骨架之環氧樹脂較佳,其中,尤以下式(3)之結構為以下式(6)或下式(7)表示時為較佳。以下式(3)表示之環氧樹脂之製品,例如DIC(股)公司製EXA-7311。該等環氧樹脂也可視目的適當使用1種或組合2種以上。
(式中,Ar1及Ar2各為相同或不同,並表示苯基、萘基、聯苯基等單環或多環之芳香族烴成為取代基之芳基,Rx及Ry各為相同或不同,表示氫原子或烷基、芳基。m表示1~5之整數,n表示1~50之整數。又,G表示環氧丙基。)
(式中,n表示1以上之整數。)
(式中,R1表示氫原子或甲基,Ar3及Ar4各為相同或不同,並表示伸萘基或伸苯基,兩基也可各具有碳數1~4之烷基或伸苯基當做取代基。R2各自獨立地表示氫原子、碳數1~4之烷基或下式(4)表示之芳烷基,m及n各為0~4之整數,且m或n中任一者為1以上,R3表示氫原子、以下列通式(4)表示之芳烷基或以下列通式(5)表示之含環氧基之芳香族烴基。上述通式(3)中,對於萘結構部位之鍵結位置,可為構成該萘結構部位之2個苯環當中任一者。)
(式中,R4及R5各自獨立地表示氫原子或甲基,Ar5表示伸苯基、有1~3個氫原子經碳數1~4之烷基進行核取代而得之伸苯基或伸萘基或有1~3個氫原子經碳數1~4之烷基進行核取代而得之伸萘基。o平均為0.1~4。)
(式中,R6表示氫原子或甲基,Ar6各自獨立地表示伸萘基、或具有以碳原子數1~4之烷基、芳烷基或伸苯基當做取代基之伸萘基,p為1或2之整數。)
(式中,R7表示氫原子或甲基,R8各自獨立地表示氫原子、碳原子數1~4之烷基或以上式(4)表示之芳烷基。)
(式中,R9表示氫原子或甲基,R10各自獨立地表示氫原子、碳原子數1~4之烷基、或以上式(4)表示之芳烷基。)
環氧樹脂(B)之摻合量,相對於樹脂固體成分之合計100質量份,為約5~60質量份較佳,尤佳為以10~40質量份之範圍使用。其原因為:為5質量份以上時,可獲得目的之硬化物,為60質量份以下時,可獲得良好的耐熱性。
硬化劑(C)
本發明使用之硬化劑(C),只要是一般能使環氧樹脂硬化之硬化劑即可,不特別限定,宜使用耐熱性優異,尤其介電率、介電正切等電特性優異之氰酸酯化合物、或低吸水性、高耐熱性優異之酚樹脂。
前述氰酸酯化合物,可使用一般公知之氰酸酯化合物。例如:以下式(8)表示之萘酚芳烷基型氰酸酯化合物、1,3-二氰酸苯、1,4-二氰酸苯、1,3,5-三氰酸苯、雙(3,5-二甲基4-氰酸苯基)甲烷、1,3-二氰酸萘、1,4-二氰酸萘、1,6-二氰酸萘、1,8-二氰酸萘、2,6-二氰酸萘、2,7-二氰酸萘、1,3,6-三氰酸萘、4,4’-二氰酸基聯苯、雙(4-氰酸苯基)甲烷、2,2’-雙(4-氰酸苯基)丙烷、雙(4-氰酸基苯基)醚、雙(4-氰酸苯基)硫醚、雙(4-氰酸苯基)碸、2,2’-雙(4-氰酸苯基)丙烷、雙(3,5-二甲基、4-氰酸苯基)甲烷、酚酚醛型氰酸酯化合物等,其中從提高難燃性之觀點,以下式(8)表示之萘酚芳烷基型氰酸酯化合物尤為理想。
(式中,R11表示氫原子或甲基,q表示1以上之整數。)
前述酚樹脂,只要是1分子中具有2個以上酚性羥基之樹脂即可,不特別限定。例如:以下式(9)表示之萘酚芳烷基型酚樹脂、酚酚醛樹脂、烷基酚酚醛樹脂、雙酚A酚醛樹脂、二環戊二烯型酚樹脂、Xylok型酚樹脂、萜烯改性酚樹脂、聚乙烯基酚類、萘酚芳烷基型酚樹脂、聯苯芳烷基型酚樹脂、萘型酚樹脂、胺基三酚醛型酚樹脂等。該等可以單獨使用或組合2種以上使用。其中,從吸水性或耐熱性之觀點,宜使用以下式(9)表示之萘酚芳烷基型酚樹脂。
(式中,R表示氫原子或甲基,n表示1以上之整數。)
摻合酚樹脂時,將酚樹脂之羥基數與環氧樹脂之環氧丙基數的數目比以0.7~2.5進行摻合較佳。酚樹脂之羥基數與環氧樹脂之環氧丙基數之數目比,從防止玻璃轉移溫度降低的觀點,為0.7以上較佳,從防止難燃性降低之觀點,為2.5以下較佳。
硬化劑(C)之摻合量不特別限定,從耐熱性之觀點,相對於樹脂固體成分之合計100質量份為5~90質量份較佳,10~60質量份更佳。
無機填充材(D)
本發明中,無機填充材(D)係降低獲得之疊層板之熱膨脹率的效果高的摩氏硬度為3.5以上者,只要是印刷電路板用樹脂組成物通常使用之無機填充材即可,不特別限定,例如:軟水鋁石(摩氏硬度3.5)、碳酸鈣(摩氏硬度3.5)、碳酸鎂(摩氏硬度6)、氮化鋁(摩氏硬度7)、二氧化矽(摩氏硬度7)、煅燒滑石(摩氏硬度7.5)、氧化鋁(摩氏硬度9)等。摩氏硬度係將當做礦物硬度比較之標準的10種礦物,依序刮磨試樣表面並測定,編號為各物質之硬度數值,值大愈則愈硬。
無機填充材(D)之平均粒徑(D50)不特別限定,若考慮分散性,平均粒徑(D50)為0.2~5μm較佳。在此,D50係指中位徑(median diameter),係當將測定之粉體之粒度分布區分為2種時,較大側之粒子之個數與較小側之粒子之個數成為等量之直徑。一般而言,係利用濕式雷射繞射散射法測定。
無機填充材(D)之摻合量,從熱膨脹率及成形性之觀點,相對於樹脂固體成分之總量100質量份為40~600質量份較佳,又,80~150質量份之範圍為更佳。該等無機填充材(D)可使用1種或適當混合2種以上後使用。又,無機填充材(D)不含鉬化合物(A)。
其他成分
關於無機填充材(D)也可併用矽烷偶聯劑或濕潤分散劑。藉由摻合矽烷偶聯劑或濕潤分散劑,能提高無機填充材之分散性。該等矽烷偶聯劑,只要是一般使用在無機物之表面處理的矽烷偶聯劑即可,不特別限定。具體例例如:γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷等胺基矽烷系、γ-環氧丙氧基丙基三甲氧基矽烷等環氧矽烷系、γ-甲基丙烯醯氧丙基三甲氧基矽烷等乙烯基矽烷系、N-β-(N-乙烯基苄胺基乙基)-γ-胺基丙基三甲氧基矽烷鹽酸鹽等陽離子矽烷系、苯基矽烷系等,可使用1種或適當組合2種以上使用。又,濕潤分散劑只要是塗料用途使用之分散安定劑即可,不特別限定。例如BYK Japan(股)製Disperbyk-110、Disperbyk-111、Disperbyk-180、Disperbyk161、BYK-W996、W9010、W903等濕潤分散劑。
依照本發明之樹脂組成物,也可更包含BT樹脂(雙馬來醯亞胺‧三樹脂)。BT樹脂,只要是以馬來醯亞胺化合物與氰酸酯化合物當做主成分並且預聚合物化者即可,不特別限定。例如:將2,2-雙(4-氰酸苯基)丙烷(CX、三菱瓦斯化學(股)公司製)與雙(3-乙基-5-甲基-4-馬來醯亞胺二苯基)甲烷(Bis-(3-ethyl-5-methyl-4-maleimidephenyl)methane)(BMI-70:KI化成(股)公司製)予以加熱熔融並使聚合反應者、將酚醛型氰酸酯樹脂(Primacet PT-30、Lonza Japan(股)製、氰酸酯當量:124g/eq.)與雙(3-乙基-5-甲基-4-馬來醯亞胺基二苯基)甲烷(BMI-70:KI化成(股)公司製)予以加熱熔融並使預聚合物化後,溶於甲乙酮者。
其中,含萘酚芳烷基型氰酸酯化合物之BT樹脂,由於樹脂骨架為剛硬的結構,故能夠維持耐熱性且減少反應抑制要因而提高硬化性,具有吸水性、耐熱性優異之特性,從此等觀點為較佳。為BT樹脂之原料的氰酸酯化合物,可使用1種或將2種以上適當混用。
依照本發明之樹脂組成物,也可更包含馬來醯亞胺化合物。馬來醯亞胺化合物具有提高耐熱性的效果。本發明使用之馬來醯亞胺化合物,只要是1分子中具有1個以上的馬來醯亞胺基之化合物即可,不特別限定。其具體例,例如:N-苯基馬來醯亞胺、N-羥基苯基馬來醯亞胺、雙(4-馬來醯亞胺苯基)甲烷、2,2-雙{4-(4-馬來醯亞胺苯氧基)-苯基}丙烷、雙(3,5-二甲基-4-馬來醯亞胺苯基)甲烷、雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷、雙(3,5-二乙基-4-馬來醯亞胺苯基)甲烷、聚苯基甲烷馬來醯亞胺、該等馬來醯亞胺化合物之預聚物或馬來醯亞胺化合物與胺化合物之預聚物等,可使用1種或適當混合2種以上使用。更佳者,例如雙(4-馬來醯亞胺苯基)甲烷、2,2-雙{4-(4-馬來醯亞胺苯氧基)-苯基}丙烷、雙(3-乙基-5-甲基-4-馬來醯亞胺苯基)甲烷。
馬來醯亞胺化合物之使用量,相對於樹脂固體成分之合計100質量份為約3~50質量份較佳。再者,若為5~30質量份之範圍,可獲得高耐熱性,且為低吸水性。
依照本發明之樹脂組成物,也可更包含矽酮粉末。矽酮粉末具有延遲燃燒時間,提高難燃效果之當做難燃助劑的作用。又,矽酮粉末也有提高鑽孔加工性的效果。矽酮粉末,例如:將矽氧烷鍵以三維網狀交聯獲得之聚甲基倍半矽氧烷微粉末化者、將含乙烯基之二甲基聚矽氧烷與甲基氫聚矽氧烷之加成聚合物予以微粉末化者、將含乙烯基之二甲基聚矽氧烷與甲基氫聚矽氧烷之加成聚合物而得之微粉末表面被覆矽氧烷鍵交聯成三維網狀而得之聚甲基倍半矽氧烷者、於無機載持體表面被覆矽氧烷鍵以三維網狀交聯成的聚甲基倍半矽氧烷者等。矽酮粉末之平均粒徑(D50)不特別限定,若考慮分散性,平均粒徑(D50)為1~15μm較佳。
矽酮粉末之摻合量不特別限定,相對於樹脂固體成分之合計摻合量100質量份為1質量份以上30質量份以下較佳,為2質量份以上20質量份以下尤佳。從提高鑽孔加工性之觀點,為1質量份以上較佳,從防止成形性或分散性降低之觀點,為30質量份以下較佳。
依照本發明之樹脂組成物中,視需要也可為了適當調整硬化速度而併用硬化促進劑。該等只要是一般當做環氧樹脂或氰酸酯化合物或酚樹脂之硬化促進劑使用者即可,不特別限定。該等之具體例,例如銅、鋅、鈷、鎳等有機金屬鹽類、咪唑類及其衍生物、三級胺等,可使用1種或適當組合2種以上使用。
依照本發明之樹脂組成物中,於不損及所期待之特性之範圍,也可併用其他熱硬化性樹脂、熱塑性樹脂及其寡聚物、彈性體類等各種高分子化合物、其他難燃性之化合物、添加劑等。該等只要是一般使用者即可,不特別限定。例如:難燃性化合物可列舉:三聚氰胺或苯基胍胺等含窒化合物、含環之化合物等。添加劑,例如:紫外線吸收劑、抗氧化劑、光聚合起始劑、螢光增白劑、光增感劑、染料、顏料、增黏劑、潤滑劑、消泡劑、分散劑、塗平劑、光澤劑、聚合抑制劑等,可視所望適當組合使用。
依照本發明之樹脂組成物之製造方法,只要是將鉬化合物(A)、環氧樹脂(B)、硬化劑(C)與無機填充材(D)予以組合而獲得樹脂組成物者即可,不特別限定。例如對於環氧樹脂(B)摻合鉬化合物(A)、無機填充材(D),並以均質混合器等分散,並於其中摻合硬化劑(C)之方法等。再者,為了降低黏度、提高操作性,且同時提高與玻璃布的含浸性,添加有機溶劑為理想。
預浸體
依照本發明之預浸體,係將上述樹脂組成物含浸或塗佈於基材而成者。製造依照本發明之預浸體時,使用之基材可使用在各種印刷電路板材料所用之公知者。例如:E玻璃、D玻璃、S玻璃、NE玻璃、T玻璃、Q玻璃、球狀玻璃等玻璃纖維、或玻璃以外之無機纖維、聚醯亞胺、聚醯胺、聚酯等有機纖維,可視目的之用途或性能適當選擇。形狀例如:織布、不織布、粗紗(roving)、短切氈(chopped strand mat)、表面氈(surfacing mat)等。關於厚度不特別限制,通常使用約0.01~0.3mm。該等基材中,從面方向之膨脹率與鑽孔加工性之均衡性的觀點,尤佳為使用E玻璃之玻璃纖維。
依照本發明之預浸體之製造方法,只要可獲得將含有鉬化合物(A)與環氧樹脂(B)與硬化劑(C)與無機填充劑(D)而成的樹脂組成物、基材予以組合之預浸體即可,不特別限定。例如:將由上述樹脂組成物與有機溶劑構成之樹脂清漆含浸或塗佈於基材後,於100~200℃的乾燥機中加熱1~60分鐘之方法等使半硬化,並製造預浸體之方法等。樹脂組成物對於基材之附著量,以預浸體之樹脂量(含無機填充材)計,為20~90重量%之範圍較佳。
有機溶劑係用於降低樹脂組成物之黏度、提高操作性,並且提高與玻璃布之含浸性而使用。有機溶劑只要環氧樹脂(B)、硬化劑(C)會溶解即可,不特別限定。具體例,例如:丙酮、甲乙酮、甲基異丁酮、環己酮等酮類、苯、甲苯、二甲苯等芳香族烴類、二甲基甲醯胺或二甲基乙醯胺等醯胺類等。
疊層板
本發明之疊層板,係使用上述預浸體進行疊層成形者。具體而言,係藉由將1片或多片以上的前述預浸體重疊,視所望在其單面或兩面配置銅或鋁等金屬箔之構成予以疊層成形以製造。使用之金屬箔,只要是印刷電路板材料可使用者即可,不特別限定。成形條件可以應用通常之印刷電路板用疊層板及多層板之方法。例如:使用多段壓製機、多段真空壓製機、連續成形、高壓釜成形機等,一般而言,溫度為100~300℃、壓力為2~100kgf/cm2、加熱時間為0.05~5小時之範圍。又,也可將本發明之預浸體與另外製作的內層用配線板組合並且疊層成形,以製成多層板。以下舉合成例、實施例、比較例詳細說明本發明。
實施例
合成例1
α-萘酚芳烷基型氰酸酯化合物之合成
將安裝有溫度計、攪拌器、滴加漏斗及回流冷卻器的反應器預先以滷水冷卻至0~5℃,並於其中添加氯化氰7.47g(0.122mol)、35%鹽酸9.75g(0.0935mol)、水76ml、及二氯甲烷44ml。將該反應器內之溫度保持在-5~+5℃、pH保持在1以下,於攪拌中,以滴加漏斗花費1小時滴加將α-萘酚芳烷基化合物(上式(6)(式中之R均為氫原子)、SN485、羥基當量:214g/eq.軟化點:86℃、新日鐵化學(股)製)20g(0.0935mol)、及三乙胺14.16g(0.14mol)溶於二氯甲烷92ml而得之溶液,滴加結束後,再花費15分鐘滴加三乙胺4.72g(0.047mol)。
滴加結束後,於同溫度攪拌15分鐘,之後將反應液分液,並取有機層。將獲得之有機層以水100ml洗滌2次後,以蒸發器於減壓下餾去二氯甲烷,最後於80℃濃縮1小時使乾固,獲得α-萘酚芳烷基型氰酸酯化合物23.5g。
將獲得之氰酸酯化合物以液體層析及IR光譜分析,結果未檢測到原料峰部。又,利用13C-NMR及1H-NMR鑑定結構。羥基轉化為氰酸酯基之轉化率為99%以上。
合成例2
BT樹脂(BT2610)之合成
將2,2-雙(4-氰酸苯基)丙烷(CX、三菱瓦斯化學(股)公司製)40質量份與雙(3-乙基-5-甲基-4-馬來醯亞胺基二苯基)甲烷(BMI-70、KI化成(股)公司製)60質量份於150℃熔融,於攪拌狀態使混合樹脂反應直到圓錐平板式黏度計測量為1.2Pa‧s為止,之後將其溶於甲乙酮,獲得BT樹脂。
實施例1
將萘酚芳烷基型酚樹脂(SN-495、新日鐵化學(股)製、羥基當量:236g/eq.)45質量份、酚聯苯芳烷基型環氧樹脂(NC-3000-FH、環氧當量:320g/eq.、日本化藥(股)製)55質量份、軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份、濕潤分散劑(BYK-W903、BYK JAPAN(股)製)5質量份、鉬酸鋅(日本無機化學工業(股)製)10質量份、咪唑(2E4MZ、四國化成工業(股)製)0.03質量份混合,獲得清漆。將該清漆以甲乙酮稀釋,含浸塗佈於厚度0.1mm的E玻璃不織布,於160℃進行4分鐘加熱乾燥,獲得樹脂含量50重量%的預浸體。
覆金屬疊層板之製成
將獲得之預浸體各重疊4片,配置於厚12μm之電解銅箔(3EC-III、三井金屬礦業(股)製)的上下,以壓力30kgf/cm2、溫度220℃實施120分鐘的疊層成形,獲得絕緣層厚度0.4mm之覆金屬箔疊層板。
實施例2
將鉬酸鋅(日本無機化學工業(股)製)減少為1質量份,除此以外與實施例1同樣進行。
實施例3
使用鉬酸(日本無機化學工業(股)製)10質量份代替鉬酸鋅(日本無機化學工業(股)製)10質量份,除此以外與實施例1同樣進行。
實施例4
使用三氧化鉬(日本無機化學工業(股)製)10質量份代替鉬酸鋅(日本無機化學工業(股)製)10質量份,除此以外與實施例1同樣進行。
實施例5
使用TF-2000(鉬酸銨、日本無機化學工業(股)製)10質量份代替鉬酸鋅(日本無機化學工業(股)製)10質量份,除此以外與實施例1同樣進行。
實施例6
使用合成例1製作之α-萘酚芳烷基型氰酸酯化合物(氰酸酯當量:261g/eq.)45質量份代替萘酚芳烷基型酚樹脂(SN-495、新日鐵化學(股)製、羥基當量:236g/eq.)45質量份,並使用辛酸鋅0.01質量份代替咪唑(2E4MZ、四國化成工業(股)製)0.03質量份,除此以外‧與實施例1同樣實施。
實施例7
使用聚氧化伸萘基型環氧樹脂(EXA-7311、環氧當量:277g/eq.)55質量份代替酚聯苯芳烷基型環氧樹脂(NC-3000-FH、環氧當量:320g/eq.、日本化藥(股)製)55質量份,除此以外與實施例1同樣進行。
實施例8
使用球狀二氧化矽(SFP-130MC)(摩氏硬度7)150質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,並使用濕潤分散劑(Disperbyk161、BYK JAPAN(股)製)5質量份代替濕潤分散劑(BYK-W903、BYK JAPAN(股)製)5質量份,除此以外與實施例1同樣進行。
實施例9
使用碳酸鎂(Ultracarb 1200、Minelco製)(摩氏硬度3.5)150質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,除此以外與實施例1同樣進行。
實施例10
使用氧化鋁(新日鐵材料(股)公司MICRON公司製)(摩氏硬度9)600質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,除此以外與實施例1同樣進行。
實施例11
將實施例1中的萘酚芳烷基型酚樹脂(SN-495、新日録化學(股)製、羥基當量:236g/eq.)減少為5質量份,並將酚聯苯芳烷基型環氧樹脂(NC-3000-FH、環氧當量:320g/eq、日本化藥(股)製)減少為10質量份,且改用雙(3-乙基-5-甲基-4-馬來醯亞胺基二苯基)甲烷(BMI-70、KI化成(股)公司製)15質量份,除此以外與實施例1同樣進行。
實施例12
於實施例1中添加矽酮粉末(KMP-605、信越矽酮製)10質量份,除此以外與實施例1同樣進行。
實施例13
將軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)減少為60質量份,除此以外與實施例1同樣進行。
比較例1
於實施例1不添加鉬酸鋅(日本無機化學工業(股)製),除此以外與實施例1同樣進行。
比較例2
於實施例1中不添加酚聯苯芳烷基型環氧樹脂(NC-3000-FH、環氧當量:320g/eq.,日本化藥(股)製),除此以外與實施例1同樣進行,但未硬化。
比較例3
於實施例1不添加萘酚芳烷基型酚樹脂(SN-495、新日鐵化學(股)製,羥基當量:236g/eq.),除此以外與實施例1同樣進行,但未硬化。
比較例4
於實施例1中不添加軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5),除此以外與實施例1同樣進行。
比較例5
使用氫氧化鎂(KISUMA 8SN、協和化學工業製)(摩氏硬度2.5)150質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,並且不添加鉬酸鋅(日本無機化學工業(股)製),除此以外與實施例1同樣進行。
比較例6
使用氫氧化鎂(KIMASU 8SN、協和化學工業製)(摩氏硬度2.5)150質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,除此以外與實施例1同樣進行。
比較例7
使用氫氧化鋁(CL-303、住友化學製)(摩氏硬度3)150質量份代替軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份,除此以外與實施例1同樣進行。
比較例8
於實施例10將氧化鋁(新日鐵材料(股)公司MICRON公司製)(摩氏硬度9)600質量份增加為800質量份,除此以外與實施例10同樣進行。
比較例9
將實施例1中的軟水鋁石(APYRAL AOH60、Nabaltec製)(摩氏硬度3.5)150質量份減少為30質量份,除此以外與實施例1同樣進行。
使用獲得之覆金屬箔疊層板,評價難燃性、耐熱性、熱膨脹率、鑽孔加工性。
難燃性、熱膨脹率係將覆金屬箔疊層板利用蝕刻去除銅箔之後,以下列方法進行。
難燃性:使用板厚0.8mm之經蝕刻的疊層板,依據UL94垂直燃燒試驗法進行評價。
熱膨脹率:以熱機械分析裝置(德州儀器製)以每分鐘10℃從40℃升溫至340℃,測定於60℃至120℃於面方向之線膨脹係數。測定方向,係測定疊層板之玻璃布之縱方向(Warp)
耐熱性評價,係將覆金屬箔疊層板以下列方法實施。
耐熱性:使50×50mm的樣本於300℃的焊料回流30分鐘,測定直到發生脫層合的時間。當即使經過了30分鐘也未發生脫層合時,於表中以>30min表示。
鑽孔加工性評價係以下列鑽孔加工條件評價孔位置精度。
加工機:Hitachi via mechanics(股)製 ND-1 V212
重疊數:覆金屬箔疊層板4片
蓋板(entry sheet):三菱瓦斯化學(股)製 LE450
墊板(back up board):利昌工業(股)製 PS-1160D
鑽頭:Union tool(股)製 MD MC 0.18×3.3L508A)
轉速:160krpm
進料速度:0.8m/min
撞擊數:3000
評價結果如表1、表2。
比較例1比起實施例1,孔位置精度較差。比較例2未硬化。比較例3未硬化。比較例4比起實施例1,熱膨脹率、難燃性較差。比較例5比起實施例1,孔位置精度、熱膨脹率、耐熱性較差。比較例6比起實施例1,熱膨脹率、耐熱性較差。比較例7比起實施例1,熱膨脹率、耐熱性較差。比較例8比起實施例10,孔位置精度較差。比較例9,比起實施例1,熱膨脹率、難燃性較差。
由以上可確認:由依照本發明獲得之預浸體形成的疊層板,耐熱性高、熱膨脹率小、且鑽孔加工性優異,可不使用鹵素系難燃劑與磷化合物當做難燃劑而能保持高度的難燃性。
Claims (14)
- 一種樹脂組成物,係包含以下成分而成:非載持型鉬化合物(A)、環氧樹脂(B)、硬化劑(C)、與無機填充材(D);該無機填充材(D)之摩氏硬度為3.5以上,且該無機填充材(D)之含量,相對於樹脂固體成分之合計100質量份,為40~600質量份;該非載持型鉬化合物(A)之含量,相對於樹脂固體成分之合計100質量份,為0.2~30質量份。
- 如申請專利範圍第1項之樹脂組成物,其中,該鉬化合物(A)係選自於鉬酸鋅、鉬酸、三氧化鉬、及鉬酸銨中至少1種,且該鉬化合物(A)之含量,相對於樹脂固體成分之合計100質量份,為0.2~30質量份。
- 如申請專利範圍第1或2項之樹脂組成物,係使用在印刷電路板用預浸體。
- 如申請專利範圍第1或2項之樹脂組成物,其中,該硬化劑(C)係氰酸酯化合物或酚樹脂。
- 如申請專利範圍第4項之樹脂組成物,其中,該氰酸酯化合物係以式(1)表示之氰酸酯化合物;
- 如申請專利範圍第4項之樹脂組成物,其中,該酚樹脂係以式(2)表示之酚樹脂;
- 如申請專利範圍第1或2項之樹脂組成物,其中,該環氧樹脂(B)係以式(3)表示之環氧樹脂;
- 如申請專利範圍第1或2項之樹脂組成物,其中,該環氧樹脂(B)係以式(4)表示之環氧樹脂;
- 如申請專利範圍第1或2項之樹脂組成物,更包含馬來醯亞胺化合物及/或BT(Bismaleimide Triazine)樹脂。
- 如申請專利範圍第1或2項之樹脂組成物,其中,該環氧樹脂(B)之摻合量,相對於該環氧樹脂(B)與該硬化劑(C)之合計100質量份,為5~60質量份。
- 如申請專利範圍第1或2項之樹脂組成物,其中,摩氏硬度未滿3.5之無機填充材之含量,相對於該鉬化合物(A)100質量份,為100質量份以下。
- 一種預浸體,係將如申請專利範圍第1至11項中任一項之樹脂組成物含浸或塗佈於基材而成。
- 一種疊層板,係將如申請專利範圍第12項之預浸體疊層成形而成。
- 一種覆金屬箔疊層板,係將如申請專利範圍第12項之預浸體、與金屬箔予以疊層成形而成。
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JPWO2012099162A1 (ja) | 2014-06-30 |
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TW201233702A (en) | 2012-08-16 |
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