TWI512915B - 電子元件組裝架構 - Google Patents

電子元件組裝架構 Download PDF

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Publication number
TWI512915B
TWI512915B TW098116656A TW98116656A TWI512915B TW I512915 B TWI512915 B TW I512915B TW 098116656 A TW098116656 A TW 098116656A TW 98116656 A TW98116656 A TW 98116656A TW I512915 B TWI512915 B TW I512915B
Authority
TW
Taiwan
Prior art keywords
varistor
carrier
electronic component
assembly structure
component assembly
Prior art date
Application number
TW098116656A
Other languages
English (en)
Chinese (zh)
Other versions
TW200950027A (en
Inventor
寬特 恩葛爾
湯馬士 費奇丁葛爾
艾克索爾 潘西娜
Original Assignee
Ｅｐｃｏｓ Ａｇ集團股份公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｅｐｃｏｓ Ａｇ集團股份公司 filed Critical Ｅｐｃｏｓ Ａｇ集團股份公司
Publication of TW200950027A publication Critical patent/TW200950027A/zh
Application granted granted Critical
Publication of TWI512915B publication Critical patent/TWI512915B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Led Device Packages (AREA)
TW098116656A 2008-05-21 2009-05-20 電子元件組裝架構 TWI512915B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008024480A DE102008024480A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Publications (2)

Publication Number Publication Date
TW200950027A TW200950027A (en) 2009-12-01
TWI512915B true TWI512915B (zh) 2015-12-11

Family

ID=41082594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098116656A TWI512915B (zh) 2008-05-21 2009-05-20 電子元件組裝架構

Country Status (7)

Country Link
US (1) US9196402B2 (https=)
EP (1) EP2289075B1 (https=)
JP (1) JP5607028B2 (https=)
KR (1) KR101529365B1 (https=)
DE (1) DE102008024480A1 (https=)
TW (1) TWI512915B (https=)
WO (1) WO2009141439A1 (https=)

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US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
JP5596410B2 (ja) * 2010-05-18 2014-09-24 スタンレー電気株式会社 半導体発光装置
JP2014026993A (ja) * 2010-11-08 2014-02-06 Panasonic Corp セラミック基板と発光ダイオードモジュール
TW201221501A (en) * 2010-11-26 2012-06-01 Sfi Electronics Technology Inc Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature
US20130247777A1 (en) * 2010-12-02 2013-09-26 Nestec S.A. Low-inertia thermal sensor in a beverage machine
CN104302317B (zh) 2012-05-16 2016-07-06 Kj生物科学有限公司 新型和改进的流感疫苗
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TWI479164B (zh) * 2012-06-05 2015-04-01 Advantest Corp Test vehicle
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
CN106463221B (zh) * 2014-05-23 2018-01-05 三菱电机株式会社 浪涌吸收元件
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
FR3026600A1 (fr) * 2014-09-29 2016-04-01 Valeo Vision Carte de circuit imprime a led
JP6468057B2 (ja) * 2015-04-28 2019-02-13 日亜化学工業株式会社 発光素子
JP6668617B2 (ja) * 2015-06-04 2020-03-18 富士電機株式会社 サーミスタ搭載装置およびサーミスタ部品
US9979187B2 (en) * 2015-11-12 2018-05-22 Infineon Technologies Austria Ag Power device with overvoltage arrester
DE102016100352A1 (de) 2016-01-11 2017-07-13 Epcos Ag Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung
DE102016107493B4 (de) * 2016-04-22 2021-10-14 Tdk Electronics Ag Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben
DE102016107495B4 (de) * 2016-04-22 2022-04-14 Tdk Electronics Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
DE102016109853B4 (de) * 2016-05-30 2021-08-12 Infineon Technologies Ag Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen sowie Verfahren zur Herstellung einer Umverteilungsstruktur
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
CZ2017143A3 (cs) * 2017-03-15 2018-08-08 Saltek S.R.O. Omezovač napětí s přepěťovou ochranou
KR102123813B1 (ko) * 2017-08-23 2020-06-18 스템코 주식회사 연성 회로 기판 및 그 제조 방법
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht

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US5796568A (en) * 1994-11-19 1998-08-18 Asea Brown Boveri Ag Current limiter device
TW200509412A (en) * 2003-08-29 2005-03-01 Opto Tech Corp Flip-chip light-emitting diode package array and its package unit
US20070297108A1 (en) * 2004-02-25 2007-12-27 Philips Lumileds Lighting Company, Llc Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection

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US3928242A (en) * 1973-11-19 1975-12-23 Gen Electric Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof
JPH0572567A (ja) * 1991-09-13 1993-03-26 Toppan Printing Co Ltd 液晶表示装置の製造方法
JPH08191155A (ja) * 1995-01-12 1996-07-23 Hitachi Ltd 発光素子駆動回路
DE19824104B4 (de) * 1998-04-27 2009-12-24 Abb Research Ltd. Nichtlinearer Widerstand mit Varistorverhalten
JP2001110801A (ja) * 1999-10-05 2001-04-20 Takeshi Yao パターン形成方法、並びに電子素子、光学素子及び回路基板
JP2002151741A (ja) * 2000-11-08 2002-05-24 Murata Mfg Co Ltd 発光装置、実装基板およびこれを用いた電子機器
EP1642346A1 (en) * 2003-06-30 2006-04-05 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
JP4041082B2 (ja) * 2004-03-23 2008-01-30 Ｔｄｋ株式会社 バリスタ及びバリスタの製造方法
US7940155B2 (en) * 2005-04-01 2011-05-10 Panasonic Corporation Varistor and electronic component module using same
US7671468B2 (en) * 2005-09-30 2010-03-02 Tdk Corporation Light emitting apparatus
JP4134135B2 (ja) * 2005-09-30 2008-08-13 Ｔｄｋ株式会社 発光装置
JP2007250899A (ja) 2006-03-16 2007-09-27 Matsushita Electric Ind Co Ltd 発光モジュールとこれを用いた表示装置及び照明装置
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
JP4867511B2 (ja) * 2006-07-19 2012-02-01 Ｔｄｋ株式会社 バリスタ及び発光装置
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

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US5796568A (en) * 1994-11-19 1998-08-18 Asea Brown Boveri Ag Current limiter device
TW200509412A (en) * 2003-08-29 2005-03-01 Opto Tech Corp Flip-chip light-emitting diode package array and its package unit
US20070297108A1 (en) * 2004-02-25 2007-12-27 Philips Lumileds Lighting Company, Llc Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection

Also Published As

Publication number Publication date
EP2289075A1 (de) 2011-03-02
WO2009141439A1 (de) 2009-11-26
US9196402B2 (en) 2015-11-24
KR20110016448A (ko) 2011-02-17
KR101529365B1 (ko) 2015-06-16
TW200950027A (en) 2009-12-01
JP5607028B2 (ja) 2014-10-15
EP2289075B1 (de) 2017-09-06
DE102008024480A1 (de) 2009-12-03
JP2011524082A (ja) 2011-08-25
US20110261536A1 (en) 2011-10-27

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees