DE102008024480A1 - Elektrische Bauelementanordnung - Google Patents

Elektrische Bauelementanordnung Download PDF

Info

Publication number
DE102008024480A1
DE102008024480A1 DE102008024480A DE102008024480A DE102008024480A1 DE 102008024480 A1 DE102008024480 A1 DE 102008024480A1 DE 102008024480 A DE102008024480 A DE 102008024480A DE 102008024480 A DE102008024480 A DE 102008024480A DE 102008024480 A1 DE102008024480 A1 DE 102008024480A1
Authority
DE
Germany
Prior art keywords
varistor
arrangement according
component arrangement
varistor body
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102008024480A
Other languages
German (de)
English (en)
Inventor
Thomas Feichtinger
Günter Dr. Engel
Axel Dr. Pecina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102008024480A priority Critical patent/DE102008024480A1/de
Priority to TW098116656A priority patent/TWI512915B/zh
Priority to PCT/EP2009/056251 priority patent/WO2009141439A1/de
Priority to JP2011509998A priority patent/JP5607028B2/ja
Priority to EP09749929.7A priority patent/EP2289075B1/de
Priority to KR1020107028771A priority patent/KR101529365B1/ko
Priority to US12/994,143 priority patent/US9196402B2/en
Publication of DE102008024480A1 publication Critical patent/DE102008024480A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Led Device Packages (AREA)
DE102008024480A 2008-05-21 2008-05-21 Elektrische Bauelementanordnung Ceased DE102008024480A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102008024480A DE102008024480A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
TW098116656A TWI512915B (zh) 2008-05-21 2009-05-20 電子元件組裝架構
PCT/EP2009/056251 WO2009141439A1 (de) 2008-05-21 2009-05-22 Elektrische bauelementanordnung mit varistor und halbleiterbauelement
JP2011509998A JP5607028B2 (ja) 2008-05-21 2009-05-22 バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ
EP09749929.7A EP2289075B1 (de) 2008-05-21 2009-05-22 Elektrische bauelementanordnung mit varisor und halbleiterbauelement
KR1020107028771A KR101529365B1 (ko) 2008-05-21 2009-05-22 배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리
US12/994,143 US9196402B2 (en) 2008-05-21 2009-05-22 Electronic component assembly comprising a varistor and a semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008024480A DE102008024480A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Publications (1)

Publication Number Publication Date
DE102008024480A1 true DE102008024480A1 (de) 2009-12-03

Family

ID=41082594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008024480A Ceased DE102008024480A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Country Status (7)

Country Link
US (1) US9196402B2 (https=)
EP (1) EP2289075B1 (https=)
JP (1) JP5607028B2 (https=)
KR (1) KR101529365B1 (https=)
DE (1) DE102008024480A1 (https=)
TW (1) TWI512915B (https=)
WO (1) WO2009141439A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
DE102012111458A1 (de) * 2012-11-27 2014-05-28 Epcos Ag Halbleitervorrichtung
US9337408B2 (en) 2012-08-31 2016-05-10 Epcos Ag Light-emitting diode device
DE102016100352A1 (de) * 2016-01-11 2017-07-13 Epcos Ag Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung
DE102016107493A1 (de) * 2016-04-22 2017-10-26 Epcos Ag Trägersystem
DE102016107495A1 (de) * 2016-04-22 2017-11-09 Epcos Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
DE102016109853A1 (de) * 2016-05-30 2017-11-30 Infineon Technologies Ag Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen mit verbesserter thermischer und elektrischer Leistung
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
JP5596410B2 (ja) * 2010-05-18 2014-09-24 スタンレー電気株式会社 半導体発光装置
JP2014026993A (ja) * 2010-11-08 2014-02-06 Panasonic Corp セラミック基板と発光ダイオードモジュール
TW201221501A (en) * 2010-11-26 2012-06-01 Sfi Electronics Technology Inc Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature
US20130247777A1 (en) * 2010-12-02 2013-09-26 Nestec S.A. Low-inertia thermal sensor in a beverage machine
CN104302317B (zh) 2012-05-16 2016-07-06 Kj生物科学有限公司 新型和改进的流感疫苗
TWI479164B (zh) * 2012-06-05 2015-04-01 Advantest Corp Test vehicle
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
CN106463221B (zh) * 2014-05-23 2018-01-05 三菱电机株式会社 浪涌吸收元件
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
FR3026600A1 (fr) * 2014-09-29 2016-04-01 Valeo Vision Carte de circuit imprime a led
JP6468057B2 (ja) * 2015-04-28 2019-02-13 日亜化学工業株式会社 発光素子
JP6668617B2 (ja) * 2015-06-04 2020-03-18 富士電機株式会社 サーミスタ搭載装置およびサーミスタ部品
US9979187B2 (en) * 2015-11-12 2018-05-22 Infineon Technologies Austria Ag Power device with overvoltage arrester
CZ2017143A3 (cs) * 2017-03-15 2018-08-08 Saltek S.R.O. Omezovač napětí s přepěťovou ochranou
KR102123813B1 (ko) * 2017-08-23 2020-06-18 스템코 주식회사 연성 회로 기판 및 그 제조 방법
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3928242A (en) * 1973-11-19 1975-12-23 Gen Electric Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof
JPH08191155A (ja) * 1995-01-12 1996-07-23 Hitachi Ltd 発光素子駆動回路
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
DE102007013016A1 (de) 2006-03-20 2007-10-11 Tdk Corp. Varistorelement
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same

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US3766098A (en) * 1970-06-22 1973-10-16 Matsushita Electric Industrial Co Ltd Voltage nonlinear resistors
JPH0572567A (ja) * 1991-09-13 1993-03-26 Toppan Printing Co Ltd 液晶表示装置の製造方法
DE4441279C1 (de) * 1994-11-19 1995-09-21 Abb Management Ag Vorrichtung zur Strombegrenzung
DE19824104B4 (de) * 1998-04-27 2009-12-24 Abb Research Ltd. Nichtlinearer Widerstand mit Varistorverhalten
JP2001110801A (ja) * 1999-10-05 2001-04-20 Takeshi Yao パターン形成方法、並びに電子素子、光学素子及び回路基板
JP2002151741A (ja) * 2000-11-08 2002-05-24 Murata Mfg Co Ltd 発光装置、実装基板およびこれを用いた電子機器
EP1642346A1 (en) * 2003-06-30 2006-04-05 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
TWI229948B (en) * 2003-08-29 2005-03-21 Opto Tech Corp Flip-chip type LED package array and package unit thereof
JP4041082B2 (ja) * 2004-03-23 2008-01-30 Ｔｄｋ株式会社 バリスタ及びバリスタの製造方法
US7671468B2 (en) * 2005-09-30 2010-03-02 Tdk Corporation Light emitting apparatus
JP4134135B2 (ja) * 2005-09-30 2008-08-13 Ｔｄｋ株式会社 発光装置
JP2007250899A (ja) 2006-03-16 2007-09-27 Matsushita Electric Ind Co Ltd 発光モジュールとこれを用いた表示装置及び照明装置
JP4867511B2 (ja) * 2006-07-19 2012-02-01 Ｔｄｋ株式会社 バリスタ及び発光装置
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3928242A (en) * 1973-11-19 1975-12-23 Gen Electric Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof
JPH08191155A (ja) * 1995-01-12 1996-07-23 Hitachi Ltd 発光素子駆動回路
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same
DE102007013016A1 (de) 2006-03-20 2007-10-11 Tdk Corp. Varistorelement

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9449958B2 (en) 2012-05-24 2016-09-20 Epcos Ag Light-emitting diode device
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
US9337408B2 (en) 2012-08-31 2016-05-10 Epcos Ag Light-emitting diode device
DE102012111458A1 (de) * 2012-11-27 2014-05-28 Epcos Ag Halbleitervorrichtung
US9693482B2 (en) 2012-11-27 2017-06-27 Epcos Ag Semiconductor device
DE102012111458B4 (de) 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
US10490322B2 (en) 2016-01-11 2019-11-26 Epcos Ag Component carrier having an ESD protective function and method for producing same
DE102016100352A1 (de) * 2016-01-11 2017-07-13 Epcos Ag Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung
WO2017121727A1 (de) * 2016-01-11 2017-07-20 Epcos Ag Bauelementtraeger mit esd schutzfunktion und verfahren zur herstellung
WO2017182157A1 (de) * 2016-04-22 2017-10-26 Epcos Ag Trägersystem
DE102016107495A1 (de) * 2016-04-22 2017-11-09 Epcos Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
DE102016107493B4 (de) 2016-04-22 2021-10-14 Tdk Electronics Ag Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben
DE102016107495B4 (de) 2016-04-22 2022-04-14 Tdk Electronics Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
DE102016107493A1 (de) * 2016-04-22 2017-10-26 Epcos Ag Trägersystem
DE102016109853A1 (de) * 2016-05-30 2017-11-30 Infineon Technologies Ag Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen mit verbesserter thermischer und elektrischer Leistung
DE102016109853B4 (de) 2016-05-30 2021-08-12 Infineon Technologies Ag Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen sowie Verfahren zur Herstellung einer Umverteilungsstruktur
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
WO2018091230A1 (de) * 2016-11-16 2018-05-24 Epcos Ag Leistungsmodul mit verringerter defektanfälligkeit und verwendung desselben

Also Published As

Publication number Publication date
EP2289075A1 (de) 2011-03-02
WO2009141439A1 (de) 2009-11-26
US9196402B2 (en) 2015-11-24
KR20110016448A (ko) 2011-02-17
KR101529365B1 (ko) 2015-06-16
TW200950027A (en) 2009-12-01
JP5607028B2 (ja) 2014-10-15
EP2289075B1 (de) 2017-09-06
TWI512915B (zh) 2015-12-11
JP2011524082A (ja) 2011-08-25
US20110261536A1 (en) 2011-10-27

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: TDK ELECTRONICS AG, DE

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final