KR101529365B1 - 배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리 - Google Patents

배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리 Download PDF

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Publication number
KR101529365B1
KR101529365B1 KR1020107028771A KR20107028771A KR101529365B1 KR 101529365 B1 KR101529365 B1 KR 101529365B1 KR 1020107028771 A KR1020107028771 A KR 1020107028771A KR 20107028771 A KR20107028771 A KR 20107028771A KR 101529365 B1 KR101529365 B1 KR 101529365B1
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KR
South Korea
Prior art keywords
varistor
carrier
heat sink
electrical
varistor body
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KR1020107028771A
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English (en)
Korean (ko)
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KR20110016448A (ko
Inventor
토마스 페이츠틴거
건터 엥겔
악셀 페시나
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에프코스 아게
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Led Device Packages (AREA)
KR1020107028771A 2008-05-21 2009-05-22 배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리 Active KR101529365B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008024480.5 2008-05-21
DE102008024480A DE102008024480A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
PCT/EP2009/056251 WO2009141439A1 (de) 2008-05-21 2009-05-22 Elektrische bauelementanordnung mit varistor und halbleiterbauelement

Publications (2)

Publication Number Publication Date
KR20110016448A KR20110016448A (ko) 2011-02-17
KR101529365B1 true KR101529365B1 (ko) 2015-06-16

Family

ID=41082594

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028771A Active KR101529365B1 (ko) 2008-05-21 2009-05-22 배리스터 및 반도체 소자를 포함하는 전기 소자 어셈블리

Country Status (7)

Country Link
US (1) US9196402B2 (https=)
EP (1) EP2289075B1 (https=)
JP (1) JP5607028B2 (https=)
KR (1) KR101529365B1 (https=)
DE (1) DE102008024480A1 (https=)
TW (1) TWI512915B (https=)
WO (1) WO2009141439A1 (https=)

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KR20190129929A (ko) * 2017-03-15 2019-11-20 샐텍 에스.알.오 과전압 보호 기능을 갖는 전압 제한기

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US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
JP5596410B2 (ja) * 2010-05-18 2014-09-24 スタンレー電気株式会社 半導体発光装置
JP2014026993A (ja) * 2010-11-08 2014-02-06 Panasonic Corp セラミック基板と発光ダイオードモジュール
TW201221501A (en) * 2010-11-26 2012-06-01 Sfi Electronics Technology Inc Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature
US20130247777A1 (en) * 2010-12-02 2013-09-26 Nestec S.A. Low-inertia thermal sensor in a beverage machine
CN104302317B (zh) 2012-05-16 2016-07-06 Kj生物科学有限公司 新型和改进的流感疫苗
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TWI479164B (zh) * 2012-06-05 2015-04-01 Advantest Corp Test vehicle
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
CN106463221B (zh) * 2014-05-23 2018-01-05 三菱电机株式会社 浪涌吸收元件
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
FR3026600A1 (fr) * 2014-09-29 2016-04-01 Valeo Vision Carte de circuit imprime a led
JP6468057B2 (ja) * 2015-04-28 2019-02-13 日亜化学工業株式会社 発光素子
JP6668617B2 (ja) * 2015-06-04 2020-03-18 富士電機株式会社 サーミスタ搭載装置およびサーミスタ部品
US9979187B2 (en) * 2015-11-12 2018-05-22 Infineon Technologies Austria Ag Power device with overvoltage arrester
DE102016100352A1 (de) 2016-01-11 2017-07-13 Epcos Ag Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung
DE102016107493B4 (de) * 2016-04-22 2021-10-14 Tdk Electronics Ag Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben
DE102016107495B4 (de) * 2016-04-22 2022-04-14 Tdk Electronics Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
DE102016109853B4 (de) * 2016-05-30 2021-08-12 Infineon Technologies Ag Chipträger und Halbleitervorrichtung mit Umverteilungsstrukturen sowie Verfahren zur Herstellung einer Umverteilungsstruktur
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
KR102123813B1 (ko) * 2017-08-23 2020-06-18 스템코 주식회사 연성 회로 기판 및 그 제조 방법
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht

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KR20060031648A (ko) * 2003-06-30 2006-04-12 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 발광 다이오드 열 관리 시스템
JP4867511B2 (ja) * 2006-07-19 2012-02-01 Ｔｄｋ株式会社 バリスタ及び発光装置

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JP2005244220A (ja) * 2004-02-25 2005-09-08 Lumileds Lighting Us Llc 基体にｅｓｄ保護を組み入れた発光ダイオード用基体
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190129929A (ko) * 2017-03-15 2019-11-20 샐텍 에스.알.오 과전압 보호 기능을 갖는 전압 제한기
KR102235916B1 (ko) 2017-03-15 2021-04-05 샐텍 에스.알.오 과전압 보호 기능을 갖는 전압 제한기

Also Published As

Publication number Publication date
EP2289075A1 (de) 2011-03-02
WO2009141439A1 (de) 2009-11-26
US9196402B2 (en) 2015-11-24
KR20110016448A (ko) 2011-02-17
TW200950027A (en) 2009-12-01
JP5607028B2 (ja) 2014-10-15
EP2289075B1 (de) 2017-09-06
TWI512915B (zh) 2015-12-11
DE102008024480A1 (de) 2009-12-03
JP2011524082A (ja) 2011-08-25
US20110261536A1 (en) 2011-10-27

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