TWI505897B - 無鉛焊料組成物 - Google Patents
無鉛焊料組成物 Download PDFInfo
- Publication number
- TWI505897B TWI505897B TW101103491A TW101103491A TWI505897B TW I505897 B TWI505897 B TW I505897B TW 101103491 A TW101103491 A TW 101103491A TW 101103491 A TW101103491 A TW 101103491A TW I505897 B TWI505897 B TW I505897B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- silver
- indium
- tin
- nickel
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 200
- 229910000679 solder Inorganic materials 0.000 title claims description 137
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 340
- 229910052709 silver Inorganic materials 0.000 claims description 177
- 239000004332 silver Substances 0.000 claims description 177
- 229910052738 indium Inorganic materials 0.000 claims description 174
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 174
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 173
- 229910052718 tin Inorganic materials 0.000 claims description 173
- 239000010949 copper Substances 0.000 claims description 172
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 170
- 229910052802 copper Inorganic materials 0.000 claims description 170
- 229910052759 nickel Inorganic materials 0.000 claims description 169
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 112
- 229910052725 zinc Inorganic materials 0.000 claims description 112
- 239000011701 zinc Substances 0.000 claims description 112
- 229910052797 bismuth Inorganic materials 0.000 claims description 96
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 96
- 229910052684 Cerium Inorganic materials 0.000 claims description 25
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 165
- 239000011135 tin Substances 0.000 description 164
- 238000012360 testing method Methods 0.000 description 55
- 239000011521 glass Substances 0.000 description 42
- 238000002844 melting Methods 0.000 description 38
- 230000008018 melting Effects 0.000 description 38
- 238000000034 method Methods 0.000 description 16
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052703 rhodium Inorganic materials 0.000 description 10
- 239000010948 rhodium Substances 0.000 description 10
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 10
- -1 about 15 wt% tin Chemical compound 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052787 antimony Inorganic materials 0.000 description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000009864 tensile test Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000003570 air Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2410/00—Constructional features of vehicle sub-units
- B60Y2410/115—Electric wiring; Electric connectors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161439538P | 2011-02-04 | 2011-02-04 | |
| US201161540213P | 2011-09-28 | 2011-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201238696A TW201238696A (en) | 2012-10-01 |
| TWI505897B true TWI505897B (zh) | 2015-11-01 |
Family
ID=45755521
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101103491A TWI505897B (zh) | 2011-02-04 | 2012-02-03 | 無鉛焊料組成物 |
| TW106111553A TWI642510B (zh) | 2011-02-04 | 2012-02-03 | 焊料組成物，車輛玻璃組件及形成焊料合金之方法 |
| TW104123697A TWI583481B (zh) | 2011-02-04 | 2012-02-03 | 形成焊料組成物之方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106111553A TWI642510B (zh) | 2011-02-04 | 2012-02-03 | 焊料組成物，車輛玻璃組件及形成焊料合金之方法 |
| TW104123697A TWI583481B (zh) | 2011-02-04 | 2012-02-03 | 形成焊料組成物之方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US8771592B2 (OSRAM) |
| EP (2) | EP2670560B1 (OSRAM) |
| JP (4) | JP2014509944A (OSRAM) |
| CN (1) | CN103476539B (OSRAM) |
| CA (1) | CA2825629A1 (OSRAM) |
| MX (2) | MX344239B (OSRAM) |
| PL (2) | PL2670560T3 (OSRAM) |
| TW (3) | TWI505897B (OSRAM) |
| WO (1) | WO2012106434A1 (OSRAM) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112009002570B4 (de) * | 2008-10-24 | 2024-05-23 | Mitsubishi Electric Corporation | Lötmetalllegierung und Halbleiterbauteil |
| EP2670560B1 (en) * | 2011-02-04 | 2016-01-13 | Antaya Technologies Corp. | Lead-free solder composition |
| JP6008945B2 (ja) * | 2011-05-03 | 2016-10-19 | ピルキントン グループ リミテッド | はんだ付けされたコネクタを備えるグレイジング |
| KR101438897B1 (ko) | 2012-08-13 | 2014-09-17 | 현대자동차주식회사 | 유리용 무연솔더 조성물 |
| EP3027347A2 (en) * | 2013-07-31 | 2016-06-08 | Antaya Technologies Corporation | Electrical component having presoldered surface with flux reservoirs |
| JP6062905B2 (ja) * | 2013-10-16 | 2017-01-18 | スマート エレクトロニクス インク | 表面実装用ヒューズおよびそれを含む構造体 |
| KR102272298B1 (ko) * | 2015-05-15 | 2021-07-05 | 앱티브 테크놀러지스 리미티드 | 인듐-주석-은 베이스 무연 솔더 |
| JP6725971B2 (ja) * | 2015-07-14 | 2020-07-22 | 日本板硝子株式会社 | ガラス板モジュール |
| KR20170108766A (ko) * | 2016-03-18 | 2017-09-27 | 헤베이 리신 테크놀로지 컴퍼니 리미티드 | 높은 연성을 가지는 무연 솔더 조성물 |
| EP3492217B1 (en) * | 2017-03-17 | 2021-03-03 | Fuji Electric Co., Ltd. | Solder material |
| US11121487B2 (en) | 2017-11-07 | 2021-09-14 | Central Glass Company, Limited | Car window glass assembly |
| CN108326464A (zh) * | 2018-03-13 | 2018-07-27 | 苏州塞澳电气有限公司 | 一种汽车玻璃专用的无铅焊锡 |
| CN112638575A (zh) * | 2018-09-07 | 2021-04-09 | 中央硝子株式会社 | 车窗用玻璃组件 |
| CN111250893A (zh) * | 2020-03-12 | 2020-06-09 | 南通欢腾机电科技有限公司 | 一种无铅焊料、其制备方法、其应用及金属端子 |
| CN111872596A (zh) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | 一种铟、铅、银、锑低温钎焊料 |
| US11383330B2 (en) | 2020-09-21 | 2022-07-12 | Aptiv Technologies Limited | Lead-free solder composition |
| JP7695822B2 (ja) * | 2021-05-26 | 2025-06-19 | 内橋エステック株式会社 | 鉛フリーはんだ |
| US12269127B2 (en) * | 2022-04-22 | 2025-04-08 | Magna Exteriors, Inc. | Vehicular window assembly process with temperature control of the solder joint that attaches an electrical connector |
| CN117139917B (zh) * | 2023-10-31 | 2024-03-08 | 苏州塞一澳电气有限公司 | 一种汽车玻璃用无铅焊料及其制备方法和应用 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US785137A (en) * | 1903-04-01 | 1905-03-21 | James G Westbrook | Valve. |
| CN1398697A (zh) * | 2001-07-25 | 2003-02-26 | 邓和升 | 无铅焊料 |
| WO2006040582A1 (en) * | 2004-10-15 | 2006-04-20 | Alpha Fry Limited | Solder alloy |
| TW200621411A (en) * | 2004-09-03 | 2006-07-01 | Intel Corp | Tin/indium lead-free solders for low stress chip attachment |
| CN1842415A (zh) * | 2003-08-29 | 2006-10-04 | Ppg工业俄亥俄公司 | 焊接方法和焊料组分 |
| CN1982405A (zh) * | 2005-07-12 | 2007-06-20 | 霍尼韦尔国际公司 | 导热性材料、焊料预成型结构、组件以及半导体封装 |
| TW200810869A (en) * | 2006-08-17 | 2008-03-01 | Po-Shan Huang | Soldering paste and hot-pressing method for soldering using same |
| CN101257995A (zh) * | 2005-08-12 | 2008-09-03 | 安塔亚技术公司 | 焊接组合物 |
| WO2009111932A1 (zh) * | 2008-03-13 | 2009-09-17 | 浙江省冶金研究院有限公司 | 一种无铅高温电子钎料及制备方法 |
| WO2010047139A1 (ja) * | 2008-10-24 | 2010-04-29 | 三菱電機株式会社 | はんだ合金および半導体装置 |
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| US3721594A (en) | 1969-07-01 | 1973-03-20 | Ppg Industries Inc | Applying electroconductive heating circuits to glass |
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- 2012-02-01 PL PL12705540T patent/PL2670560T3/pl unknown
- 2012-02-01 CA CA2825629A patent/CA2825629A1/en not_active Abandoned
- 2012-02-01 WO PCT/US2012/023492 patent/WO2012106434A1/en not_active Ceased
- 2012-02-01 JP JP2013552598A patent/JP2014509944A/ja active Pending
- 2012-02-01 MX MX2013009014A patent/MX344239B/es active IP Right Grant
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- 2012-02-01 CN CN201280017440.7A patent/CN103476539B/zh active Active
- 2012-02-01 US US13/363,618 patent/US8771592B2/en active Active
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|---|---|
| US20180207753A1 (en) | 2018-07-26 |
| TWI583481B (zh) | 2017-05-21 |
| JP2018039053A (ja) | 2018-03-15 |
| TWI642510B (zh) | 2018-12-01 |
| CN103476539A (zh) | 2013-12-25 |
| JP2020040127A (ja) | 2020-03-19 |
| TW201538263A (zh) | 2015-10-16 |
| PL2990155T3 (pl) | 2018-01-31 |
| EP2670560B1 (en) | 2016-01-13 |
| US20120222893A1 (en) | 2012-09-06 |
| MX356849B (es) | 2018-06-15 |
| MX344239B (es) | 2016-12-07 |
| US20140271343A1 (en) | 2014-09-18 |
| PL2670560T3 (pl) | 2016-04-29 |
| JP6846328B2 (ja) | 2021-03-24 |
| CN103476539B (zh) | 2016-08-17 |
| US8771592B2 (en) | 2014-07-08 |
| WO2012106434A1 (en) | 2012-08-09 |
| JP6243893B2 (ja) | 2017-12-06 |
| MX2013009014A (es) | 2013-12-06 |
| TW201726291A (zh) | 2017-08-01 |
| US20170190004A1 (en) | 2017-07-06 |
| US10105794B2 (en) | 2018-10-23 |
| BR112013019849A2 (pt) | 2016-10-11 |
| JP2016052684A (ja) | 2016-04-14 |
| EP2670560A1 (en) | 2013-12-11 |
| EP2990155B1 (en) | 2017-09-27 |
| US9975207B2 (en) | 2018-05-22 |
| EP2990155A1 (en) | 2016-03-02 |
| TW201238696A (en) | 2012-10-01 |
| JP6928062B2 (ja) | 2021-09-01 |
| CA2825629A1 (en) | 2012-08-09 |
| JP2014509944A (ja) | 2014-04-24 |
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