WO2006040582A1 - Solder alloy - Google Patents
Solder alloy Download PDFInfo
- Publication number
- WO2006040582A1 WO2006040582A1 PCT/GB2005/003979 GB2005003979W WO2006040582A1 WO 2006040582 A1 WO2006040582 A1 WO 2006040582A1 GB 2005003979 W GB2005003979 W GB 2005003979W WO 2006040582 A1 WO2006040582 A1 WO 2006040582A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- alloy
- solder
- copper
- bismuth
- end cap
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 128
- 239000000956 alloy Substances 0.000 title claims abstract description 128
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 41
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052709 silver Inorganic materials 0.000 claims abstract description 35
- 229910052718 tin Inorganic materials 0.000 claims abstract description 35
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000004332 silver Substances 0.000 claims abstract description 32
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 29
- 239000011701 zinc Substances 0.000 claims abstract description 29
- 239000012535 impurity Substances 0.000 claims abstract description 28
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 28
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 25
- 239000010941 cobalt Substances 0.000 claims abstract description 25
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052738 indium Inorganic materials 0.000 claims abstract description 25
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 25
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 23
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 23
- 239000011574 phosphorus Substances 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 230000004907 flux Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 235000011837 pasties Nutrition 0.000 description 9
- 238000009736 wetting Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Definitions
- the present invention relates to an alloy and, in particular, a lead-free solder alloy.
- the alloy is particularly, though not exclusively, suitable for use in the manufacture of electrical fuses.
- Electrical fuses are supplied in many forms including the type where a current is passed along a fine wire. If the threshold current is exceeded, then the wire melts and the fuse fails.
- the fuse wire which may be, for example, copper, tinned copper, silvered copper, or other alloy as appropriate, typically runs though a glass or ceramic tube. End caps (for example nickel coated brass caps) are fitted over the ends of the tube to form terminations.
- each cap there may be provided a melted slug of cored solder wire, which performs the dual function of sealing the tube and providing a solder joint to the fuse wire.
- a conventional solder composition is a tin-lead alloy comprising 35 - 50 wt% tin. Such an alloy starts to melt at a temperature of about 183 0 C, but melting is not complete until a higher temperature (about 230 0 C) has been reached. At an intermediate temperature falling between these two limits, the solder is "pasty" and, as a consequence, relatively immobile. This property is important for processes such as fuse manufacture where the joint may have to be made with the cap inverted so that a fluid solder can run under gravity. Alternatively, if the cap and tube are pressed together so that there is a sudden movement, then a fluid solder may splash up the wire or tube.
- lead-free replacements for lead-containing conventional alloys For environmental reasons, there is an increasing demand for lead-free replacements for lead-containing conventional alloys. Many lead-free alloys are tin rich, with small additions of elements such as copper, silver, bismuth, indium , antimony and zinc, for example. Lead-free alloys have been developed for use in the electronics industry, although these alloys generally do not exhibit a significant "pasty" range, which, as mentioned above, is an important characteristic for alloys used in the manufacture of electrical fuses. It has proved very difficult to develop an alloy composition which will work well in more demanding fuse manufacturing procedures.
- the present invention aims to address at least some of the problems associated with the prior art.
- the present invention provides a solder alloy for use in the manufacture of electrical fuses, the alloy comprising: Copper - from 0.5 to 4 wt.% Silver - from 0.1 to 1 wt.% Antimony - from 0.2 to 3 wt.% Bismuth - from 0 to 1.5 wt.% Zinc - from 0 to 2 wt.%
- the copper content is from 1.5 to 4 wt.%, more preferably from 1.5 to 3 wt.%, still more preferably from 1.7 to 2.3 wt.%, still more preferably from 1.8 to 2.2 wt.%.
- the alloy comprises: Copper - from 1.5 to 3 wt.%
- Cobalt - from 0 to 0.3 wt.% Phosphorus - from 0 to 0.01 wt.% Indium - from 0 to 0.2 wt.% Germanium - from 0 to 0.03 wt.% and the balance tin, together with unavoidable impurities.
- the zinc content is preferably up to 1 wt. %, more preferably up to 0.5 wt. %.
- the alloy comprises: Copper - 1.8 to 2.2 wt. % Silver - 0.3 to 0.5 wt. % Antimony - 0.7 to 1.5 wt. % Bismuth - 0.2 to 1 wt.% Zinc - from 0 to 0.5 wt.% Nickel - from 0 to 0.3 wt.%
- the alloy comprises: Copper - approximately 2 wt.%
- the alloy comprises:
- the alloy comprises:
- the bismuth content will typically be from 0.1 to 1 wt.%.
- the bismuth content preferably does not exceed approximately 0.3 wt.%, more preferably the bismuth content does not exceed approximately 0.2 wt.%.
- the alloy comprises:
- the alloy comprises: Copper - from 1.5 to 3 wt.%
- Antimony - from 0.3 to 1 wt. %
- the alloy comprises:
- the alloy comprises:
- the alloy comprises:
- the alloy comprises:
- Cobalt - from 0 to 0.3 wt.%
- the alloy comprises: Copper - approximately 1 wt.%
- the alloys according to the present invention are lead- free or essentially lead-free. These alloys offer environmental advantages over conventional alloys used in the manufacture of electrical fuses.
- the alloys according to the present invention are suitable for use in the manufacture of electrical fuses.
- the alloys are advantageously used for (i) sealing/joining an end cap to a tube for an electrical fuse, and/or (ii) providing a solder joint between an end cap and a fuse wire.
- the alloys according to the present invention have the property of being "pasty” or “sluggish” within a sufficiently broad temperature range intermediate between the temperature at which the alloy is fully molten and the temperature at which the alloy is fully solidified.
- the precise physical characteristics by which this is achieved are not fully understood, but the success in an operating system is believed to depend on the alloy having a sufficient working range at which some liquid and solid exist in equilibrium, together with viscosity and surface tension characteristics that limit the flow of the alloy at the operating temperature.
- the tin-based alloys according to present invention typically start to melt at temperatures above approximately 200 0 C, more typically above approximately 21O 0 C.
- the liquidus temperature depends primarily on the copper content, and is typically above approximately 260 0 C, and may even extend to approximately 300 0 C. This enables the joint between the cap and the fuse wire, and the co-process of sealing the cap to the fuse body, to be accomplished without excess metal running away for the cap, along the inside or outside of the tube.
- intermetallics may act to form intermetallics.
- the presence of intermetallics is believed to have a positive effect on the flow properties of the alloys, particularly in relation to the "pasty" range.
- alloying elements Ag, Bi (optional) and Zn (optional) act to widen the temperature difference between liquidus and solidus, and increase the residual liquid phase just above the solidus. This is believed to have a positive effect on the mechanical properties of the alloys, in relation to the "pasty" range.
- Ag and Bi are preferred over Zn because Zn has the disadvantage that it reduces the spread of the solder during the first melting of the wire onto the cap, so that the complete coverage of the cap may not be achieved. It also makes the wire slightly more difficult to draw.
- the bismuth content is preferably from 0.1 to 1 wt.%, more preferably from 0.1 to 0.5 wt.%.
- the zinc content is preferably from 0.1 to 2 wt.%, more preferably from 0.1 to 1 wt.%.
- the nickel content is preferably from 0.1 to 0.3 wt.%, more preferably from 0.1 to 0.2 wt.%.
- the cobalt content is preferably from 0.1 to 0.3 wt.%, more preferably from 0.1 to 0.2 wt.%.
- the phosphorus content is preferably from 0.002 to 0.01 wt.%.
- the indium content is preferably from 0.02 to 0.2 wt.%, more preferably from 0.02 to 0.1 wt.% .
- the germanium content is preferably from 0.005 to 0.1 wt.%
- the alloys according to the present invention will typically be provided in the form of a wire, preferably a cored wire, which incorporates a flux.
- the wire is preferably made by the conventional techniques of extrusion and drawing. Accordingly, the alloys according to the present invention possess mechanical properties that are compatible with extrusion and wire drawing processes.
- Bismuth may be present in the alloy according to the present invention in an amount of up to 1.5 wt.%, for example from 0.5 to 1.5 wt.%. However, if the bismuth level is too high, the alloy can become difficult to draw.
- the bismuth level therefore preferably does not exceed 0.5 wt.%, more preferably the bismuth level does not exceed 0.3 wt.%, still more preferably the bismuth level does not exceed 0.2 wt.%.
- the copper level is preferably from 1.5 to 3 wt.%, more preferably from 1.7 to 2.3 wt.%, still more preferably from 1.8 to 2.2 wt.%.
- Indium may be present in an amount of up to 0.2 wt.%, but preferably does not exceed 0.1% wt.%.
- the presence of indium can benefit the wetting properties of the alloys.
- Silver also improves the wetting properties.
- Nickel and/or cobalt may be present in an amount of up to 0.3 wt. %.
- the presence of nickel and/or cobalt has been found to have a beneficial effect on the "pasty" characteristics of the alloys according to the present invention.
- nickel and/or cobalt reduces the rate of attack of the solder alloy on copper and copper-alloy wires, which are typically used in electrical fuses.
- Antimony is believed to form intermetallics with tin and some other constituents of the alloy, and has been found to have a beneficial effect on the flow properties of the alloy, reducing the mobility in the process temperature operating region.
- Phosphorus and/or germanium act to reduce the production of dross on the surface of the molten solder. This is a benefit during the manufacturing process.
- the alloys according to the present invention may also be provided in the form of sphere or a preform cut or stamped from a strip or solder. These may be alloy only or coated with a suitable flux as required by the soldering process. The alloys may also be supplied as a powder blended with a flux to produce a solder paste.
- the present invention further provides an alloy as herein described in the form of a bar, a stick, an ingot, optionally together with a flux, a solid or flux-cored wire, a foil or strip, or a powder or paste (powder plus flux blend), or solder spheres or other pre-formed solder pieces.
- the present invention further provides a solder bath or tank, wherein the solder bath contains an alloy as herein described in the molten state.
- the present invention further provides a soldered joint or coating comprising an alloy as herein described.
- the alloys will typically comprise at least 90 wt.% tin, preferably from 94 to 99.1 % tin, more preferably from 95 to 99 % tin, still more preferably 96 to 98 % tin.
- the present invention further provides an alloy for use in the manufacture of electrical fuses, the alloy comprising:
- the alloys according to the present invention may contain unavoidable impurities, although, in total, these are unlikely to exceed 1 wt.% of the composition.
- the alloys may contain unavoidable impurities in an amount of not more than 0.5 wt. % of the composition, more preferably not more than 0.3 wt. % of the composition.
- the alloys according to the present invention may consist essentially of the recited elements. It will therefore be appreciated that in addition to those elements that are mandatory (i.e. Sn, Cu, Ag and Sb) other non- specified elements may be present in the composition provided that the essential characteristics of the composition are not materially affected by their presence. Accordingly, the present invention still further provides an alloy for use in the manufacture of electrical fuses, the alloy consisting essentially of:
- the present invention also provides an electrical fuse comprising a fuse wire, a tube for the fuse wire, and at least one end cap for the tube, wherein the end cap is at least partially joined and/or sealed to the tube by virtue of a solder alloy as herein described (together with optional flux) .
- the present invention also provides an electrical fuse comprising a fuse wire, a tube for the fuse wire, and at least one end cap for the tube, wherein the fuse wire is joined to the end cap by a solder alloy (together with optional flux) as herein described.
- the present invention also provides a process for making an electrical fuse comprising:
- the process may further involve at least partially sealing the end cap by placing the end cap over one end of the tube, heating the solder alloy in the end cap, and applying pressure to the tube and end cap whereby the solder alloy (together with optional flux) contacts and fills an end portion of the tube and at least partially seals any space between an outer wall of the tube and an inner wall of the cap.
- the fuse wire may be formed from, for example, copper or an alloy thereof. Examples include tinned copper, silvered copper, or other alloy as appropriate.
- the tube is typically a cylindrical tube which may be formed from, for example, from a glass or a ceramic.
- the end caps may be formed from any suitable electrically conducting metal or alloy. Examples include brass caps and nickel-coated brass caps.
- the alloys according to the present invention preferably possess adequate wetting characteristics to enable them to be used for the desired purpose.
- the alloys according to the present invention should also possess adequate mechanical properties to enable theme to drawn into wires if desired.
- the alloys according to the present invention have the property of being "pasty" and relatively immobile within a sufficiently broad temperature range intermediate between the temperature at which the alloy is fully molten and the temperature at which the alloy is fully solidified. This characteristic means that the alloys are particularly useful in the manufacture of electrical fuses.
- the alloy according to Eg 2 above was cast into billets, extruded together with a solder flux (AlphaFry GCl), and drawn into a cored wire.
- the wire was cut into small pieces (approx. 100 mg) suitable for forming a joint in a solder cap.
- the solder piece was melted into the cap, by placing the latter onto a hot plate at 335°C.
- the molten solder covered all or most of the base of the cap. Furthermore, there remained flux residue with sufficient activity for the second stage of the process.
- the process of soldering the cap to the fuse body containing the fuse wire may be undertaken one joint at a time or both at once.
- the alloy possesses the required lack of fluidity (in other words the alloy is "pasty” or “sluggish") so that a good bond with the fuse wire can be achieved without the solder being pushed out of the cap during the compression phase, in which the cap and the tube are pushed together.
- the addition of nickel reduced the spread very slightly, so that the temperature of the first melting of the solder piece was increased to 345°C.
- the alloy according to Eg 5 above was cast into billets, extruded to make a solid wire, which was then drawn to 3.0 mm diameter.
- the wire was used, together with "Powerflow flux", to join two 28 mm copper tubes using an end feed copper fitting. Joints in large diameter pipes are more difficult to solder with an alloy which is very fluid at soldering temperatures.
- This alloy was shown to have beneficial properties such that soldering could be accomplished more easily without excessive run of molten solder away from the joint area. Accordingly, the alloys according to the present invention are not limited solely to applications involving the manufacture of electrical fuses.
- Each of these alloys is characterised as being too fluid in a fuse manufacturing process in that loss of solder away from the cap was excessive.
- CEg 4 Sn - Zn Tin-Zinc alloys were found to have poor wetting characteristics.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fuses (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0709021A GB2433944B (en) | 2004-10-15 | 2005-10-14 | Solder alloy |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0422997.7 | 2004-10-15 | ||
GB0422997A GB2419137A (en) | 2004-10-15 | 2004-10-15 | Solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006040582A1 true WO2006040582A1 (en) | 2006-04-20 |
Family
ID=33462832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2005/003979 WO2006040582A1 (en) | 2004-10-15 | 2005-10-14 | Solder alloy |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN100591459C (en) |
GB (2) | GB2419137A (en) |
WO (1) | WO2006040582A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100439028C (en) * | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
CN103962744A (en) * | 2009-04-20 | 2014-08-06 | 松下电器产业株式会社 | Soldering material and electronic component assembly |
JP5723056B1 (en) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
TWI505897B (en) * | 2011-02-04 | 2015-11-01 | Antaya Technologies Corp | Lead-free solder composition |
US9221132B2 (en) | 2012-06-29 | 2015-12-29 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
EP4299238A3 (en) * | 2017-11-09 | 2024-03-27 | Alpha Assembly Solutions Inc. | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2431412B (en) * | 2005-10-24 | 2009-10-07 | Alpha Fry Ltd | Lead-free solder alloy |
CN101197230B (en) * | 2006-12-05 | 2011-11-16 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
CN101831574A (en) * | 2010-05-26 | 2010-09-15 | 南京达迈科技实业有限公司 | Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof |
JP4787384B1 (en) * | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | Low silver solder alloy and solder paste composition |
WO2012127642A1 (en) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | Lead-free solder alloy |
WO2012131861A1 (en) | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | Lead-free solder ball |
CN104070302A (en) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | Leadless solder for photovoltaic solder strips |
CN104070299A (en) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | Tin solder of anti-ageing photovoltaic solder strip |
CN105220014A (en) * | 2015-11-13 | 2016-01-06 | 无锡清杨机械制造有限公司 | A kind of preparation method of tin alloy silk |
HUE052698T2 (en) * | 2016-03-22 | 2021-05-28 | Tamura Seisakusho Kk | Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device |
CN105665956A (en) * | 2016-03-23 | 2016-06-15 | 徐宏达 | Soft solder alloy used for brazing aluminum and brazing aluminum alloy |
CN107177752A (en) * | 2017-06-05 | 2017-09-19 | 雅拓莱焊接科技(惠州)有限公司 | A kind of inexpensive dystectic leadless welding alloy and preparation method thereof |
JP6292342B1 (en) * | 2017-09-20 | 2018-03-14 | 千住金属工業株式会社 | Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint |
CN108004429A (en) * | 2017-11-29 | 2018-05-08 | 广西厚思品牌策划顾问有限公司 | A kind of low melting point lead-free solder alloy and preparation method thereof |
WO2024120722A1 (en) * | 2022-12-07 | 2024-06-13 | Schurter Ag | Method of handling solder material |
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US5094813A (en) * | 1990-01-08 | 1992-03-10 | Kale Sadashiv S | Non toxic self fluxing soldering materials |
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2004
- 2004-10-15 GB GB0422997A patent/GB2419137A/en not_active Withdrawn
-
2005
- 2005-10-14 CN CN200580039071A patent/CN100591459C/en not_active Expired - Fee Related
- 2005-10-14 GB GB0709021A patent/GB2433944B/en not_active Expired - Fee Related
- 2005-10-14 WO PCT/GB2005/003979 patent/WO2006040582A1/en active Application Filing
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Cited By (8)
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CN100439028C (en) * | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | Leadless soft tin solder |
CN103962744A (en) * | 2009-04-20 | 2014-08-06 | 松下电器产业株式会社 | Soldering material and electronic component assembly |
TWI505897B (en) * | 2011-02-04 | 2015-11-01 | Antaya Technologies Corp | Lead-free solder composition |
TWI583481B (en) * | 2011-02-04 | 2017-05-21 | 安塔雅科技公司 | A method of forming a solder composition |
US9221132B2 (en) | 2012-06-29 | 2015-12-29 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
JP5723056B1 (en) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
WO2016098358A1 (en) * | 2014-12-15 | 2016-06-23 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
EP4299238A3 (en) * | 2017-11-09 | 2024-03-27 | Alpha Assembly Solutions Inc. | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Also Published As
Publication number | Publication date |
---|---|
GB2419137A (en) | 2006-04-19 |
CN100591459C (en) | 2010-02-24 |
GB0709021D0 (en) | 2007-06-20 |
CN101120109A (en) | 2008-02-06 |
GB2433944A (en) | 2007-07-11 |
GB0422997D0 (en) | 2004-11-17 |
GB2433944B (en) | 2008-12-24 |
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