GB0709021D0 - Solder alloy - Google Patents

Solder alloy

Info

Publication number
GB0709021D0
GB0709021D0 GBGB0709021.0A GB0709021A GB0709021D0 GB 0709021 D0 GB0709021 D0 GB 0709021D0 GB 0709021 A GB0709021 A GB 0709021A GB 0709021 D0 GB0709021 D0 GB 0709021D0
Authority
GB
United Kingdom
Prior art keywords
solder alloy
solder
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0709021.0A
Other versions
GB2433944B (en
GB2433944A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fernox Ltd
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of GB0709021D0 publication Critical patent/GB0709021D0/en
Publication of GB2433944A publication Critical patent/GB2433944A/en
Application granted granted Critical
Publication of GB2433944B publication Critical patent/GB2433944B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
GB0709021A 2004-10-15 2005-10-14 Solder alloy Expired - Fee Related GB2433944B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0422997A GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy
PCT/GB2005/003979 WO2006040582A1 (en) 2004-10-15 2005-10-14 Solder alloy

Publications (3)

Publication Number Publication Date
GB0709021D0 true GB0709021D0 (en) 2007-06-20
GB2433944A GB2433944A (en) 2007-07-11
GB2433944B GB2433944B (en) 2008-12-24

Family

ID=33462832

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0422997A Withdrawn GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy
GB0709021A Expired - Fee Related GB2433944B (en) 2004-10-15 2005-10-14 Solder alloy

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0422997A Withdrawn GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy

Country Status (3)

Country Link
CN (1) CN100591459C (en)
GB (2) GB2419137A (en)
WO (1) WO2006040582A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy
CN101197230B (en) * 2006-12-05 2011-11-16 比亚迪股份有限公司 Low-melting point alloy wire and temperature fuse adopting the same
CN100439028C (en) * 2007-01-24 2008-12-03 太仓市南仓金属材料有限公司 Leadless soft tin solder
US8598464B2 (en) * 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
CN101831574A (en) * 2010-05-26 2010-09-15 南京达迈科技实业有限公司 Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof
JP4787384B1 (en) * 2010-10-29 2011-10-05 ハリマ化成株式会社 Low silver solder alloy and solder paste composition
EP2670560B1 (en) * 2011-02-04 2016-01-13 Antaya Technologies Corp. Lead-free solder composition
WO2012127642A1 (en) * 2011-03-23 2012-09-27 千住金属工業株式会社 Lead-free solder alloy
WO2012131861A1 (en) * 2011-03-28 2012-10-04 千住金属工業株式会社 Lead-free solder ball
JP5238088B1 (en) * 2012-06-29 2013-07-17 ハリマ化成株式会社 Solder alloy, solder paste and electronic circuit board
CN104070299A (en) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 Tin solder of anti-ageing photovoltaic solder strip
CN104070302A (en) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 Leadless solder for photovoltaic solder strips
JP5723056B1 (en) * 2014-12-15 2015-05-27 ハリマ化成株式会社 Solder alloy, solder paste and electronic circuit board
CN105220014A (en) * 2015-11-13 2016-01-06 无锡清杨机械制造有限公司 A kind of preparation method of tin alloy silk
WO2017164194A1 (en) * 2016-03-22 2017-09-28 株式会社タムラ製作所 Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
CN105665956A (en) * 2016-03-23 2016-06-15 徐宏达 Soft solder alloy used for brazing aluminum and brazing aluminum alloy
CN107177752A (en) * 2017-06-05 2017-09-19 雅拓莱焊接科技（惠州）有限公司 A kind of inexpensive dystectic leadless welding alloy and preparation method thereof
JP6292342B1 (en) * 2017-09-20 2018-03-14 千住金属工業株式会社 Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
CN108004429A (en) * 2017-11-29 2018-05-08 广西厚思品牌策划顾问有限公司 A kind of low melting point lead-free solder alloy and preparation method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5094813A (en) * 1990-01-08 1992-03-10 Kale Sadashiv S Non toxic self fluxing soldering materials
JPH08215880A (en) * 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk Leadless solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JPH11291083A (en) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd Solder alloy
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000119046A (en) * 1998-10-09 2000-04-25 Nippon Sheet Glass Co Ltd Peripheral portion-sealed structure of glass panel
MY116246A (en) * 1999-01-28 2003-12-31 Murata Manufacturing Co Lead-free solder and soldered article
JP4186331B2 (en) * 1999-08-30 2008-11-26 ソニー株式会社 Solder alloy composition
JP2001200323A (en) * 2000-01-18 2001-07-24 Furukawa Electric Co Ltd:The Lead material for electronic parts and electronic parts using same lead material
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP4429476B2 (en) * 2000-05-16 2010-03-10 内橋エステック株式会社 Fuse element for built-in electrical parts
KR100407448B1 (en) * 2000-06-12 2003-11-28 가부시키가이샤 히타치세이사쿠쇼 Electronic apparatus and semiconductor device
EP2147740B1 (en) * 2001-03-01 2015-05-20 Senju Metal Industry Co., Ltd Lead-free solder paste
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy

Also Published As

Publication number Publication date
WO2006040582A1 (en) 2006-04-20
GB2419137A (en) 2006-04-19
CN101120109A (en) 2008-02-06
CN100591459C (en) 2010-02-24
GB2433944B (en) 2008-12-24
GB0422997D0 (en) 2004-11-17
GB2433944A (en) 2007-07-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20131014