GB0422997D0 - Solder alloy - Google Patents

Solder alloy

Info

Publication number
GB0422997D0
GB0422997D0 GBGB0422997.7A GB0422997A GB0422997D0 GB 0422997 D0 GB0422997 D0 GB 0422997D0 GB 0422997 A GB0422997 A GB 0422997A GB 0422997 D0 GB0422997 D0 GB 0422997D0
Authority
GB
United Kingdom
Prior art keywords
solder alloy
solder
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0422997.7A
Other versions
GB2419137A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fernox Ltd
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Priority to GB0422997A priority Critical patent/GB2419137A/en
Publication of GB0422997D0 publication Critical patent/GB0422997D0/en
Priority to PCT/GB2005/003979 priority patent/WO2006040582A1/en
Priority to GB0709021A priority patent/GB2433944B/en
Priority to CN200580039071A priority patent/CN100591459C/en
Publication of GB2419137A publication Critical patent/GB2419137A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fuses (AREA)
  • Conductive Materials (AREA)
GB0422997A 2004-10-15 2004-10-15 Solder alloy Withdrawn GB2419137A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB0422997A GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy
PCT/GB2005/003979 WO2006040582A1 (en) 2004-10-15 2005-10-14 Solder alloy
GB0709021A GB2433944B (en) 2004-10-15 2005-10-14 Solder alloy
CN200580039071A CN100591459C (en) 2004-10-15 2005-10-14 Solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0422997A GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy

Publications (2)

Publication Number Publication Date
GB0422997D0 true GB0422997D0 (en) 2004-11-17
GB2419137A GB2419137A (en) 2006-04-19

Family

ID=33462832

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0422997A Withdrawn GB2419137A (en) 2004-10-15 2004-10-15 Solder alloy
GB0709021A Expired - Fee Related GB2433944B (en) 2004-10-15 2005-10-14 Solder alloy

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0709021A Expired - Fee Related GB2433944B (en) 2004-10-15 2005-10-14 Solder alloy

Country Status (3)

Country Link
CN (1) CN100591459C (en)
GB (2) GB2419137A (en)
WO (1) WO2006040582A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy
CN101197230B (en) * 2006-12-05 2011-11-16 比亚迪股份有限公司 Low-melting point alloy wire and temperature fuse adopting the same
CN100439028C (en) * 2007-01-24 2008-12-03 太仓市南仓金属材料有限公司 Leadless soft tin solder
JP5280520B2 (en) * 2009-04-20 2013-09-04 パナソニック株式会社 Solder material and electronic component assembly
CN101831574A (en) * 2010-05-26 2010-09-15 南京达迈科技实业有限公司 Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof
JP4787384B1 (en) * 2010-10-29 2011-10-05 ハリマ化成株式会社 Low silver solder alloy and solder paste composition
EP2670560B1 (en) * 2011-02-04 2016-01-13 Antaya Technologies Corp. Lead-free solder composition
WO2012127642A1 (en) * 2011-03-23 2012-09-27 千住金属工業株式会社 Lead-free solder alloy
WO2012131861A1 (en) * 2011-03-28 2012-10-04 千住金属工業株式会社 Lead-free solder ball
JP5238088B1 (en) * 2012-06-29 2013-07-17 ハリマ化成株式会社 Solder alloy, solder paste and electronic circuit board
CN104070299A (en) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 Tin solder of anti-ageing photovoltaic solder strip
CN104070302A (en) * 2013-03-26 2014-10-01 昆山市天和焊锡制造有限公司 Leadless solder for photovoltaic solder strips
JP5723056B1 (en) * 2014-12-15 2015-05-27 ハリマ化成株式会社 Solder alloy, solder paste and electronic circuit board
CN105220014A (en) * 2015-11-13 2016-01-06 无锡清杨机械制造有限公司 A kind of preparation method of tin alloy silk
KR101925760B1 (en) * 2016-03-22 2018-12-05 가부시키가이샤 다무라 세이사쿠쇼 Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
CN105665956A (en) * 2016-03-23 2016-06-15 徐宏达 Soft solder alloy used for brazing aluminum and brazing aluminum alloy
CN107177752A (en) * 2017-06-05 2017-09-19 雅拓莱焊接科技（惠州）有限公司 A kind of inexpensive dystectic leadless welding alloy and preparation method thereof
JP6292342B1 (en) * 2017-09-20 2018-03-14 千住金属工業株式会社 Solder alloy for joining Cu pipe and / or Fe pipe, preform solder, cored solder and solder joint
US11577343B2 (en) * 2017-11-09 2023-02-14 Alpha Assembly Solutions Inc. Low-silver alternative to standard SAC alloys for high reliability applications
CN108004429A (en) * 2017-11-29 2018-05-08 广西厚思品牌策划顾问有限公司 A kind of low melting point lead-free solder alloy and preparation method thereof
WO2024120722A1 (en) * 2022-12-07 2024-06-13 Schurter Ag Method of handling solder material

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5094813A (en) * 1990-01-08 1992-03-10 Kale Sadashiv S Non toxic self fluxing soldering materials
JPH08215880A (en) * 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk Leadless solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JPH11291083A (en) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd Solder alloy
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000119046A (en) * 1998-10-09 2000-04-25 Nippon Sheet Glass Co Ltd Peripheral portion-sealed structure of glass panel
US6139979A (en) * 1999-01-28 2000-10-31 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
JP4186331B2 (en) * 1999-08-30 2008-11-26 ソニー株式会社 Solder alloy composition
JP2001200323A (en) * 2000-01-18 2001-07-24 Furukawa Electric Co Ltd:The Lead material for electronic parts and electronic parts using same lead material
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP4429476B2 (en) * 2000-05-16 2010-03-10 内橋エステック株式会社 Fuse element for built-in electrical parts
KR100407448B1 (en) * 2000-06-12 2003-11-28 가부시키가이샤 히타치세이사쿠쇼 Electronic apparatus and semiconductor device
EP2942410A1 (en) * 2001-03-01 2015-11-11 Senju Metal Industry Co., Ltd. Lead-free solder paste
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy

Also Published As

Publication number Publication date
GB2433944B (en) 2008-12-24
WO2006040582A1 (en) 2006-04-20
CN100591459C (en) 2010-02-24
GB2419137A (en) 2006-04-19
CN101120109A (en) 2008-02-06
GB2433944A (en) 2007-07-11
GB0709021D0 (en) 2007-06-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)