TWI505518B - 具有高折射率透鏡之發光二極體模組 - Google Patents
具有高折射率透鏡之發光二極體模組 Download PDFInfo
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Description
本發明係關於發光二極體(LED)模組。
本發明之一個或更多實施例係在政府支援下按照由能源部授予的第DE-FC26-08NT01583號合約而實施。政府享有此發明之某些權利。
在一些發光二極體(LED)模組中,一透鏡被接合或覆模製於一LED之上。該等LED模組被焊接至一基板,諸如一印刷電路板。根據該透鏡與該LED之間的接觸區域,該透鏡在使用期間可能會自該LED晶粒脫離。
一LED可包含多個LED晶粒,諸如薄膜覆晶,其安裝於一基台上。對於一圓頂狀透鏡,為了自該等LED器件中萃取最多的光,該透鏡應大於該等LED晶粒。這需要一較大的基台,以提供承接該透鏡之區域,因此,由於基板可能相當昂貴,導致該模組之成本增加。
在本發明之一個或多個實施例中,模製一具有殼體本體及透鏡之殼體陣列,或模製一殼體本體陣列且將之與若干透鏡接合,以形成具有殼體本體及透鏡之殼體陣列。發光二極體(LED)被附接至該陣列中之該等殼體。可將金屬墊陣列接合至該陣列的背部或與該殼體陣列插入模製,以在該等殼體之背部上形成接合墊。將該陣列單體化,以形成若干個別LED模組。
在不同的圖式中,使用相同的元件符號指示相似或相同的元件。
圖1、2及3分別圖解在本發明的一個或多個實施例中一發光二極體(LED)模組100之一分解圖、透視裝配圖及一橫截面裝配圖。模組100包含一透鏡102;一波長轉換元件104;一殼體本體106,其具有一頂部開口108,該頂部開口108被耦合至一底部開口110;一金屬填隙片112,其具有若干模製凸片(tab)114;及一LED 116,其具有一個或多個LED晶粒117。
透鏡102可為一以習知方法模製之玻璃透鏡。常見的可模製玻璃材料包括B270、Pyrex、Tempax,、Borofloat 33及F2玻璃。或者,透鏡102可為另一折射率(RI)為1.5或更大(例如,1.7或更大)之材料,諸如高RI玻璃(例如S-LAH51)、藍寶石、立方氧化鋯或金剛石。若無波長轉換元件附接至該透鏡102,亦可以RI為1.4或更大之剛硬或柔軟聚矽氧製造透鏡102。透鏡102具有一圓頂狀形狀或其他有助於自波長轉換元件104及LED晶粒116萃取光之形狀。
波長轉換元件104被固定至透鏡102之底面。波長轉換元件104修改LED晶粒117之發射光譜,以提供一所期望之顏色。該波長轉換元件可為如美國專利第7,361,938中所描述的一個或多個陶瓷磷光體板,該專利係以引用之方式共同讓與且併入本文中。可藉由如美國專利申請案序號第XX/XXX,XXX號、代理人檔案號第PH012893US1號標題為「包括一窗口元件之模製透鏡(Molded Lens Incorporating a Window Element)」中所述之高折射率接合劑將波長轉換元件104固定至透鏡102之該底面,該案係與本案同時申請且共同讓與,並且以引用之方式併入本文中。
殼體本體106包含一凹部118及頂部開口108,以承接具有波長轉換元件104之透鏡102。透鏡102與殼體本體106對準,使得波長轉換元件104完全覆蓋頂部開口108。可將透鏡102接合至凹部118,以維持該對準。可在透鏡102的底部、凹部118或二者上施加膠合劑。膠合劑可為聚矽氧、環氧樹脂或其他黏著劑。圍繞凹部118定位若干夾具120。在一被稱為「熱固定」之製程中,夾具120可藉由加熱而發生塑性變形,以施壓於透鏡102之一輪緣或凸緣122上。由於透鏡102被接合且夾持至殼體本體106,該透鏡應無法自該殼體本體脫離。由於透鏡102被固定至殼體本體106,其大小不受限於該LED 116之該基台之大小。例如,透鏡102之的底面可大於LED 116之該頂面。殼體本體106可為一以習知方法模製之白色塑膠。例如,殼體本體106可為聚磷苯二甲醯胺(PPA),諸如DuPont公司生產之Zytel,Solvay Advanced Polymers生產之Amodel,或一液晶聚合物(LCP)。
由於殼體本體106中之頂部開口108小於底部開口110,該底部開口之頂板(ceiling)圍繞該頂部開口之周圍形成一擋止部(stop)302(圖3及圖5)。擋止部302界定LED 116座落於底部開口110中多深及該LED自該底部開口突出多遠。
LED 116被放置於底部開口110及經接合之波長轉換元件104及擋止部302中。可於放置該LED之前,在波長轉換元件104之該底部、LED 116之頂部或二者上施加膠合劑。膠合劑可為聚矽氧、環氧樹脂或另一黏著劑。擋止部302中界定有一個或多個膠合劑溢出通道502(圖5),以允許膠合劑602(圖6)膨脹或收縮而不損壞LED晶粒117。
LED 116上之LED晶粒117可稍微突進頂部開口108中或波長轉換元件104可稍微突進底部開口110中。在任何情形下,一填充有該膠合劑之小空隙可存在於波長轉換元件104之底部與LED晶粒117之頂部之間。頂部開口108及底部開口110之側壁具反射性或散射性,以將光自LED晶粒117萃取至波長轉換元件104,且防止該LED晶粒及該波長轉換元件發生任何邊緣發射。
LED晶粒117被安裝於一基台或插入件(由元件符號116指示)上。各個LED晶粒包含一n型層、該n型層之上方之一發光層(通常被稱為「主動區域」)及該發光層的上方之一p型層。該基台包含一基板,具有通孔或LED晶粒117之金屬圖案之基台上再分佈。該基台可將該等LED晶粒117串聯或並行地耦合,再分佈該金屬接合墊圖案,或執行該等兩個動作。該基台包含LED 116的背部上之兩個或更多接合墊304(圖3及圖5)。
將金屬填隙片112與殼體本體106插入模製。金屬填隙片112具有與殼體本體106的底部相抵的一基座板及從基座板延伸進入殼體本體106的模製凸片114,模製凸片114界定若干孔,該等孔由形成殼體本體106之部分的殼體材料填
充,俾使金屬填隙片112及殼體本體106形成一整體結構。基座板在殼體本體106之底部上形成若干金屬接合墊。殼體本體106之該等金屬接合墊有助於LED 116之接合墊304(圖3及圖5)將模組100固定至一基板,諸如一印刷電路板上。
可如下製造模組100。可個別地模製透鏡102或使之成陣列,且接著將之分割成若干個別透鏡。可如圖4所示,具有殼體本體106之陣列400(僅一個有標識)與填隙片112(僅一個被標示)之一陣列插入模製。陣列400可具任何大小,且可將一大陣列分割(例如,割鋸)成若干較小陣列,以便於操縱及處理。個別透鏡102可接合於且熱熔接至陣列400中之殼體本體106。可將陣列400倒置且可將個別LED 116放置於底部開口110中且與殼體106接合,如圖5中所示。
圖7圖解殼體702(僅一個被標示)之一實例陣列700,在本發明之一個或多個實施例中,各殼體702具有一殼體本體及一透鏡。陣列700可為以習知方法模製之玻璃。普通的可模製玻璃材料包括B270、Pyrex、Tempax、Borofloat 33及F2玻璃。或者,陣列700可為另一折射率(RI)為1.5或更大(例如,1.7或更大)之材料,諸如藍寶石、金剛石、氧化鋁或立方氧化鋯。亦可以RI為1.4或更大之剛硬或柔軟聚矽氧製造陣列700。陣列700可具任何大小,且可將一大陣列分割(例如,割鋸)成若干較小之陣列,以易於操縱及處理。
圖8A及圖8B分別圖解在本發明之一個或多個實施例中陣列700中之一實例殼體702之仰視透視圖及平面圖。殼體
702包含一殼體本體802,其界定一底部開口804,以承接一LED;及該殼體本體之上方之一透鏡806。殼體本體802在底部開口804中包含四個著陸墊/角落擋止部808(圖8B)。角落擋止部808在該LED之該頂面與透鏡806之該底面之間提供一氣隙1304(圖13)。角落擋止部808亦界定該LED座落於底部開口204中多深及該LED自該底部開口突出多遠。透鏡806具有一圓頂狀形狀或其他有助於自該LED萃取光之形狀。由於透鏡806為殼體本體802之一部分,其大小不受限於該LED之基台之大小。例如,透鏡806之一底面可大於該LED之該頂面。
圖9A及圖9B分別圖解在本發明之一個或多個實施例中殼體702(下文殼體902)之另一實施例之仰視透視圖及仰視平面圖。殼體902包含一殼體本體802,其界定一底部開口904,以承接一LED;及該殼體本體之上方之一透鏡806。不同於殼體702,殼體902在底部開口904中不具有任何角落擋止部且該LED抵靠該開口之頂板而座落,因此該LED之該頂面與透鏡806之該底面之間不存在氣隙。
圖10顯示若干LED 1000(僅一個被標示)被放置於底部開口804(圖8A及圖8B)中且接合至殼體702之角落擋止部808(圖8B)。在放置該LED之前,可在角落擋止部808或該LED 1000之角落或二者上施加膠合劑。該膠合劑可為聚矽氧、環氧樹脂或其他黏著劑。LED 100亦可放置於底部開口904中且接合至該開口之頂板。
LED 1000包含一個或多個LED晶粒,其等被安裝於一基台或插入件上。各個LED器件包含一n型層、該n型層之上方之一發光層(通常被稱為「主動區域」)及該發光層的上方之一p型層。各個LED器件可在該n型層的上方包含一波長轉換元件。該波長轉換元件修改該LED器件之發射光譜,以提供一期望之顏色。該波長轉換元件可為一個或多個磷光體層或一個或多個陶瓷磷光體板。美國專利第7,361,938號中描述了陶瓷磷光體板,該案係共同讓與且以引用之方式併入本文中。可以一側塗層覆蓋該等LED器件之邊緣,以減少邊緣發射。
該基台包含具有通孔之一基板或該等LED晶粒之金屬圖案之基台上再分佈。該基台可將該等LED晶粒串聯或並行地耦合。該基台在LED 1000之背部包括兩個或更多個接合墊1002。
圖11顯示陣列700,且殼體702由LED 1000完全填充。圖12顯示金屬條陣列1200,其被接合至陣列700的背部。該等金屬條可形成一網格圖案。可在陣列700、1200或二者上施加膠合劑,以接合該等兩個陣列。該膠合劑可為聚矽氧、環氧樹脂或另一黏著劑。該組合陣列接著被單體化以形成個別LED模組。
圖13及圖14分別圖解在本發明的一個或多個實施例中自該組合陣列而得之實例單體化模組1300之一橫截面側視圖及一仰視平面圖。一旦被單體化,陣列1200之該等金屬條沿各個殼體702之周圍形成一個或多個接合墊1302。殼體702之接合墊1302有助於LED 1000之接合墊1002將模組1300固定至一基板,諸如印刷電路板。
在本發明的一個或多個實施例中,將該殼體本體及該透鏡製造成獨立的陣列且接著將之接合在一起,而非製成一具有整合殼體本體及透鏡之殼體。圖15圖解在本發明的一個或多個實施例中若干透鏡1502(僅一個被標示)之一實例陣列1500。陣列1500可為以習知方法模製之玻璃。常見的可模製材料包括B270、Pyrex、Tempax、Borofloat 33及F2玻璃。或者,陣列1500可為另一高折射率(RI)為1.5或更大(例如,1.7或更大)材料,諸如藍寶石、金剛石、氧化鋁或立方氧化鋯。亦可以RI為1.4或更大之剛硬或柔軟聚矽氧製造陣列1500。陣列1500可具任何大小,且可將一大陣列分割(例如,割鋸)成若干較小之陣列,以易於操縱及處理。
圖16圖解在本發明的一個或多個實施例中,陣列1500之一實例透鏡1502之一橫截面側視圖。透鏡1502包含一透鏡部分1602及具有一平坦底部1606之安裝部分1604。透鏡部分1602具有一圓頂狀形狀或其他有助於自該LED晶粒萃取光之形狀。
圖17圖解在本發明的一個或多個實施例中殼體本體1702(僅一個被標示)陣列1700之一俯視圖。殼體本體1702具有一平坦頂面1704,以承接若干透鏡1502。圖18圖解殼體本體1702(僅一個被標示)陣列1700之一仰視圖。殼體本體1702各者界定一底部開口1802,其具有四個降落墊/角落擋止部1804。角落擋止部1804在該LED的該頂面與透鏡1502(圖15及圖16)之頂底面1606(圖16)之間提供一氣隙。角落擋止部1804亦界定該LED座落在底部開口1802(圖18)中多深及該LED自該底部開口突出多遠。陣列1700可為一以習知方法模製之白色塑膠。例如,陣列1700可為一PPA,諸如可自DuPont採購之Zytel及可自Solvay Advanced Polymers採購之Amodel或一LCP。陣列1700可具任何大小,且可將一大陣列分割(例如,割鋸)成若干較小的陣列,以易於操縱及處理。
圖19顯示陣列1500及1700被接合以形成若干殼體1902(僅一個被標示)之一組合陣列1900,且LED 1000被放置於底部開口1802中(圖18)且被接合至殼體本體1702(圖17及圖18)之角落擋止部1804(圖18)。在放置該等LED之前,可在角落擋止部1804、LED 1000之角落或二者上施加膠合劑。該膠合劑可為聚矽氧、環氧樹脂或另一黏著劑。接著將組合陣列1900單體化,以形成若干個別LED模組。
圖20及圖21分別圖解在本發明的一個或多個實施例中自組合陣列1900而得之一實例單體化LED模組2000之一橫截面側視圖及仰視平面圖。由於透鏡1502被接合至殼體本體1702,該透鏡不應自該殼體本體脫離。由於透鏡1502被固定至殼體本體1702,其大小不受限於LED 1000之基台的大小。例如,一圓頂狀透鏡102之一底面大於LED 116之該頂面。圖22顯示一金屬接合墊2202,其被接合至LED模組2000之該底部。可對模組2000、接合墊2202或二者上施加膠合劑,以將之接合在一起。該膠合劑可為聚矽氧、環氧樹脂或另一黏著劑。或者,在將該組合陣列1900單體化以形成個別模組之前,將金屬墊2202之陣列2200接合至組合陣列1900的背部。
在本發明的一個或多個實施例中,位於上述模組的背部之金屬接合墊可包含固持該等LED之凸片。圖23顯示在本發明的一個或多個實施例中金屬接合墊2302(僅一個被標示)之陣列2300。陣列2300可具任何大小,且可將一大陣列分割(例如,割鋸)成若干較小陣列,以易於操縱及處理。圖24圖解一實例接合墊2302之一放大圖,其被接合至殼體902或與殼體902插入模製。接合墊2302包含一直形垂直凸片2402及兩個L形垂直凸片2404,其等界定一用於承接且定位一LED之導件。藉由提供具接合墊2302之導件凸片2402及2404,自一個LED模組至另一LED模組,可一致地定位該LED,只要陣列2300與該殼體陣列一致地對準即可。接合墊2302亦可與殼體702及1902連用。
所揭示之實施例的特徵之各種其他調適及組合屬於本發明之範圍內。下文之申請專利範圍涵蓋各種實施例。
100...LED糢組
102...透鏡
104...波長轉換元件
106...殼體本體
108...頂部開口
110...底部開口
112...金屬填隙片
114...凸片
116...LED
117...LED晶粒
118...凹部
120...夾具
122...輪緣或凸緣
302...擋止部
304...接合墊
400...陣列
502...膠合劑溢出通道
602...膠合劑
700...陣列
702...殼體
802...殼體本體
804...底部開口
806...透鏡
808...降落墊/角落擋止部
902...殼體
904...底部開口
1000...LED
1002...接合墊
1200...金屬條陣列
1300...實例經單體化模組
1302...接合墊
1304...氣隙
1500...陣列
1502...透鏡
1602...透鏡部分
1604...安裝部分
1606...平坦底部
1700...陣列
1702...殼體本體
1802...底部開口
1804...落墊/角落擋止部
1900...組合陣列
1902...殼體
2000...模組
2200...陣列
2202...接合墊
2302...接合墊
2402...導件凸片
2404...導件凸片
圖1、2及3圖解在本發明的一個或多個實施例中之一LED模組之分解圖、裝配圖及橫截面圖;
圖4圖解在本發明之一個或多個實施例中圖1之該殼體陣列之一透視圖;
圖5圖解在本發明之一個或多個實施例中將一LED放置於圖1之該殼體中之一透視圖;
圖6圖解在本發明之一個或多個實施例中具有該LED之該殼體之一透視圖;
圖7圖解在本發明之一個或多個實施例中殼體陣列的一實例之一透視圖,該殼體各具有一殼體本體及一透鏡;
圖8A及圖8B分別圖解在本發明之一個或多個實施例中圖7的該陣列中之一實例殼體之仰視透視圖及平面圖;
圖9A及圖9B分別圖解在本發明之一個或多個實施例中圖7的陣列中之另一實例殼體之一仰視透視圖及平面圖;
圖10及圖11圖解在本發明之一個或多個實施例中將發光二極體(LED)放置於圖7之該陣列之殼體中之透視圖;
圖12係圖解在本發明之一個或多個實施例中將金屬條陣列接合於圖11的集結陣列之背部上之透視圖;
圖13及圖14分別圖解在本發明之一個或多個實施例中自圖12之該陣列單體化而得之一實例LED模組之橫截面圖及仰視平面圖;
圖15圖解在本發明之一個或多個實施例中透鏡之一實例陣列之透視圖;
圖16圖解在本發明之一個或多個實施例中圖15之該陣列中之一實例透鏡之一橫截面圖;
圖17及圖18圖解在本發明之一個或多個實施例中殼體本體之陣列之俯視透視圖及仰視透視圖;
圖19圖解在本發明之一個或多個實施例中將圖15及圖17中之該透鏡及殼體陣列接合而得之組合陣列及將該LED放置於該組合陣列之該等殼體中之一仰視透視圖;
圖20及圖21分別圖解在本發明之一個或多個實施例中自圖19之該陣列單體化而得之一實例LED模組之一俯視透視圖及仰視透視圖;
圖22圖解金屬墊之陣列之透視圖,在本發明之一個或多個實施例中,其有待於接合至圖21之該LED模組之背部;圖23圖解在本發明之一個或多個實施例中金屬墊陣列之一俯視透視圖;及
圖24圖解在本發明之一個或多個實施例中來自圖23之被接合至一殼體之該陣列之一實例金屬墊之仰視透視圖。
100...LED糢組
102...透鏡
104...波長轉換元件
106...殼體本體
108...頂部開口
110...底部開口
112...金屬填隙片
114...凸片
116...LED
117...LED晶粒
118...凹部
120...夾具
122...輪緣或凸緣
Claims (6)
- 一種發光二極體(LED)模組,其包括:一殼體本體(housing body),其包括:一頂部開口;及一底部開口,其耦合至該頂部開口;一金屬填隙片(metal shim),其包括:一基座板(base plate),其與該殼體本體的一底部相抵,該基座板形成一接合墊(bond pad);及模製凸片(molding tabs),其自該基座板延伸進入該殼體本體,該等模製凸片界定孔(holes),該等孔由形成該殼體本體之部分的一殼體材料所填充,俾使該金屬填隙片及該殼體本體形成一整體結構(integral structure);一透鏡;一波長轉換元件(wavelength converting element),其被固定至該透鏡的底部,其中該透鏡被附接至該殼體本體之一頂部;及一LED,其包括一n型層、一發光層及一p型層,其中該LED被附接至該底部開口中之該殼體本體。
- 如請求項1之LED模組,其中該頂部開口及該底部開口中之一者或多者包括反射性或散射性側壁。
- 如請求項1之LED模組,其中該LED包括一基台(submount)及該基台上之一個或多個LED晶粒,且該透鏡之一底面大於該LED之一頂面。
- 如請求項3之LED模組,其中該基台具有底部接合墊。
- 如請求項1之LED模組,其中該波長轉換元件完全覆蓋該頂部開口。
- 如請求項1之LED模組,其中一或多個膠合劑溢流通道(glue overflow channel)界定於該底部開口的一頂板(ceiling)。
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JP2017028328A (ja) | 2017-02-02 |
CN102484191A (zh) | 2012-05-30 |
US20110062471A1 (en) | 2011-03-17 |
KR20120079105A (ko) | 2012-07-11 |
KR101880767B1 (ko) | 2018-07-20 |
JP2013505572A (ja) | 2013-02-14 |
CN104953018A (zh) | 2015-09-30 |
TW201119098A (en) | 2011-06-01 |
EP2478575B1 (en) | 2019-10-09 |
TW201603333A (zh) | 2016-01-16 |
TWI600186B (zh) | 2017-09-21 |
US9755124B2 (en) | 2017-09-05 |
JP2016001756A (ja) | 2016-01-07 |
EP2478575A2 (en) | 2012-07-25 |
JP6310994B2 (ja) | 2018-04-11 |
US9385285B2 (en) | 2016-07-05 |
CN102484191B (zh) | 2015-08-12 |
WO2011033407A3 (en) | 2011-06-16 |
US20160240754A1 (en) | 2016-08-18 |
JP6041948B2 (ja) | 2016-12-14 |
CN104953018B (zh) | 2018-09-18 |
WO2011033407A2 (en) | 2011-03-24 |
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