JP2013505572A - 高屈折率レンズを有するledモジュール - Google Patents
高屈折率レンズを有するledモジュール Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 19
- 238000003491 array Methods 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 28
- 230000001070 adhesive effect Effects 0.000 description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000004954 Polyphthalamide Substances 0.000 description 4
- 229920006375 polyphtalamide Polymers 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- 239000005352 borofloat Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000010987 cubic zirconia Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 229920006104 Amodel® Polymers 0.000 description 2
- 229920006102 Zytel® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004956 Amodel Substances 0.000 description 1
- 239000004957 Zytel Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
底部開口部の天井部分が、頂部開口部の外周の周りにストッパ302(図3及び図5参照)を形成する。当該ストッパ302は、LED 116が底部開口部110にどの程度深く着座するか、及び当該LEDが底部開口部からどの程度突出するかを規定する。LED 116が底部開口部110内に設置され、波長変換エレメント104とストッパ302とに結合される。LEDが設置される前に、接着剤が波長変換エレメント104の底部、LED 116の上部、又は両方に塗布される。接着剤はシリコン接着剤、エポキシ接着剤、又は別の接着剤でもよい。LEDチップ117に損傷を与えること無く接着剤602(図6参照)が膨張又は収縮できるよう、一つ以上の余剰接着剤の導管502(図5参照)がストッパ302に規定されている。
Claims (17)
- 頂部開口部、及び
当該頂部開口部へつながっている底部開口部、
を有するハウジング本体と、
レンズと、
当該レンズの底部に固定された波長変換エレメントと、
n-タイプの層、発光層及びp-タイプの層とを有するLEDと、
を有し、
前記波長変換エレメントが前記頂部開口部に位置するよう、前記レンズが前記ハウジング本体の上部に取り付けられ、
前記LEDが前記底部開口部で前記ハウジング本体に取り付けられることを特徴とする、発光ダイオード(LED)モジュール。 - 一つ以上の前記頂部開口部及び前記底部開口部が反射性の側壁又は拡散性の側壁を有することを特徴とする、請求項1に記載のLEDモジュール。
- 前記LEDモジュールが更に、ハウジングの底部にボンドパッドを有することを特徴とする、請求項1に記載のLEDモジュール。
- 前記ボンドパッドが前記ハウジング本体にインサート成形された金属シムの一部分であることを特徴とする、請求項3に記載のLEDモジュール。
- 前記LEDがサブマウントと、当該サブマウント上に一つ以上のLEDダイと、を有し、 前記レンズが前記LEDの上面よりも大きな底面をもつことを特徴とする、請求項1に記載のLEDモジュール。
- 発光ダイオード(LED)モジュールを製造する方法であって、当該方法は、
- 複数のレンズを有するレンズアレイを成形するステップと、
- 複数のハウジング本体を有するハウジングアレイを成形するステップと、
- 複合アレイを形成するために、前記レンズアレイ及び前記ハウジングアレイを結合するステップと、
- LEDを前記複合アレイの前記ハウジングに取り付けるステップと、
- 個々の前記LEDモジュールを形成するために前記複合アレイを切り離すステップと、
を含む、方法。 - 前記方法が更に、
- 前記ハウジングの背面に金属パッドを形成するために、金属パッドのアレイを前記ハウジングアレイへと結合するか、又は当該金属パッドのアレイを前記ハウジングアレイとインサート成形するステップ、
を含む、請求項6に記載の方法。 - 前記方法が更に、LEDダイを位置決めするためのタブを有する金属グリッドを形成するステップ、を含む、請求項7に記載の方法。
- 前記LEDの各々がサブマウントと、当該サブマウント上に一つ以上のLEDダイと、を有し、前記レンズの各々が、各々の前記LEDの上面よりも大きな底面をもつことを特徴とする、請求項6に記載の方法。
- 前記方法が更に、
- 波長変換エレメントを前記レンズアレイの前記レンズの底部に固定するステップ、
を含み、
前記ハウジング本体の各々が頂部開口部と、当該頂部開口部につながっている底部開口部と、を有し、前記頂部開口部及び底部開口部が反射性の側壁又は拡散性の側壁を有し、
前記レンズアレイ及び前記ハウジングアレイを結合するステップが、前記波長変換エレメントを前記ハウジングの前記頂部開口部に位置付けるるステップを含み、
前記LEDを前記複合アレイの前記ハウジングに取り付けるステップが、当該LEDを前記ハウジング本体の前記底部開口部に位置付けるステップを含むことを特徴とする、請求項6に記載の方法。 - 前記方法が更に、
- 一つ以上の前記レンズを有する前記レンズアレイ及び一つ以上の前記ハウジングアレイを、加工用のより小さなアレイへと切り離すステップ、
を含む、請求項6に記載の方法。 - 発光ダイオード(LED)モジュールを製造する方法であって、当該方法は、
- ハウジング本体及びレンズを備えた複数のハウジングを有するハウジングアレイを成形するステップと、
- LEDを前記ハウジングに取り付けるステップと、
- 個々の前記LEDモジュールを形成するために前記ハウジングアレイを切り離すステップと、
を含む、方法。 - 前記方法が更に、
- 前記ハウジングの背面に金属パッドを形成するために、金属パッドのアレイを前記ハウジングアレイに結合するか、又は当該金属パッドのアレイを前記ハウジングアレイとインサート成形するステップ、
を含む、請求項12に記載の方法。 - 前記方法が更に、前記LEDを位置決めするためのタブを備えた金属グリッドを形成するステップを含む、請求項13に記載の方法。
- 前記LEDを前記ハウジングに取り付けるステップが、各々の前記LEDを底部開口部の角部ストッパに結合するステップを含み、当該角部ストッパは、前記LEDの発光面と前記レンズの底面との間に空隙を設けることを特徴とする、請求項12に記載の方法。
- 前記LEDの各々がサブマウントと、当該サブマウント上に一つ以上のLEDダイと、を有し、前記レンズの各々が各々の前記LEDの上面よりも大きな底面をもつことを特徴とする、請求項12に記載の方法。
- 前記ハウジングアレイを、加工用のより小さなアレイへと切り離すステップを更に含む、請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/561,617 US9385285B2 (en) | 2009-09-17 | 2009-09-17 | LED module with high index lens |
US12/561,617 | 2009-09-17 | ||
PCT/IB2010/053772 WO2011033407A2 (en) | 2009-09-17 | 2010-08-20 | Led module with high index lens |
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JP2015172146A Division JP6041948B2 (ja) | 2009-09-17 | 2015-09-01 | 高屈折率レンズを有するledモジュール |
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JP2013505572A true JP2013505572A (ja) | 2013-02-14 |
JP2013505572A5 JP2013505572A5 (ja) | 2015-10-15 |
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JP2012529369A Pending JP2013505572A (ja) | 2009-09-17 | 2010-08-20 | 高屈折率レンズを有するledモジュール |
JP2015172146A Active JP6041948B2 (ja) | 2009-09-17 | 2015-09-01 | 高屈折率レンズを有するledモジュール |
JP2016217826A Active JP6310994B2 (ja) | 2009-09-17 | 2016-11-08 | Ledモジュールを製造する方法 |
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JP2015172146A Active JP6041948B2 (ja) | 2009-09-17 | 2015-09-01 | 高屈折率レンズを有するledモジュール |
JP2016217826A Active JP6310994B2 (ja) | 2009-09-17 | 2016-11-08 | Ledモジュールを製造する方法 |
Country Status (7)
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US (2) | US9385285B2 (ja) |
EP (1) | EP2478575B1 (ja) |
JP (3) | JP2013505572A (ja) |
KR (1) | KR101880767B1 (ja) |
CN (2) | CN104953018B (ja) |
TW (2) | TWI505518B (ja) |
WO (1) | WO2011033407A2 (ja) |
Cited By (6)
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KR101504309B1 (ko) * | 2013-08-27 | 2015-03-20 | 주식회사 루멘스 | 발광 소자 패키지 및 이를 갖는 백라이트 유닛 |
JP2017501564A (ja) * | 2013-11-08 | 2017-01-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス部品 |
US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
JP2018067630A (ja) * | 2016-10-19 | 2018-04-26 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
KR20190094719A (ko) * | 2018-02-05 | 2019-08-14 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 발광장치 |
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US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
JP6021485B2 (ja) * | 2012-07-17 | 2016-11-09 | 株式会社朝日ラバー | 光学部材付半導体発光装置 |
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US8876330B2 (en) * | 2012-11-15 | 2014-11-04 | Illinois Tool Works Inc. | Illumination device |
CN105393374B (zh) * | 2013-07-19 | 2019-05-28 | 亮锐控股有限公司 | 具有光学元件并且没有衬底载体的pc led |
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Also Published As
Publication number | Publication date |
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WO2011033407A3 (en) | 2011-06-16 |
TWI505518B (zh) | 2015-10-21 |
EP2478575A2 (en) | 2012-07-25 |
EP2478575B1 (en) | 2019-10-09 |
CN104953018A (zh) | 2015-09-30 |
US20160240754A1 (en) | 2016-08-18 |
TW201603333A (zh) | 2016-01-16 |
TWI600186B (zh) | 2017-09-21 |
KR101880767B1 (ko) | 2018-07-20 |
JP6041948B2 (ja) | 2016-12-14 |
TW201119098A (en) | 2011-06-01 |
CN102484191A (zh) | 2012-05-30 |
CN102484191B (zh) | 2015-08-12 |
KR20120079105A (ko) | 2012-07-11 |
JP6310994B2 (ja) | 2018-04-11 |
JP2016001756A (ja) | 2016-01-07 |
US9385285B2 (en) | 2016-07-05 |
CN104953018B (zh) | 2018-09-18 |
JP2017028328A (ja) | 2017-02-02 |
US20110062471A1 (en) | 2011-03-17 |
US9755124B2 (en) | 2017-09-05 |
WO2011033407A2 (en) | 2011-03-24 |
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