JP2016001756A - 高屈折率レンズを有するledモジュール - Google Patents
高屈折率レンズを有するledモジュール Download PDFInfo
- Publication number
- JP2016001756A JP2016001756A JP2015172146A JP2015172146A JP2016001756A JP 2016001756 A JP2016001756 A JP 2016001756A JP 2015172146 A JP2015172146 A JP 2015172146A JP 2015172146 A JP2015172146 A JP 2015172146A JP 2016001756 A JP2016001756 A JP 2016001756A
- Authority
- JP
- Japan
- Prior art keywords
- led
- array
- lens
- housing body
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000003491 array Methods 0.000 description 13
- 239000002131 composite material Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000013464 silicone adhesive Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000004954 Polyphthalamide Substances 0.000 description 4
- 229920006375 polyphtalamide Polymers 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- 239000005352 borofloat Substances 0.000 description 3
- 239000010987 cubic zirconia Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229920006104 Amodel® Polymers 0.000 description 2
- 229920006102 Zytel® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004956 Amodel Substances 0.000 description 1
- 239000004957 Zytel Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】 ハウジング本体とレンズとを有するハウジングのアレイを形成するために、ハウジング本体106とレンズ102とを有するハウジングのアレイがモールド成形されるか、又はハウジング本体のアレイがレンズとモールド成形されて結合される。発光ダイオード(LED)116がアレイのハウジングに取り付けられる。ハウジングの背面に接続パッドを形成するために、金属パッド112のアレイがアレイの背面に結合されるか、又はハウジングのアレイとインサート・モールド成形される。個々のLEDモジュールを形成するために、アレイが切り離される。
【選択図】 図1
Description
Claims (5)
- ハウジング本体であり、
凹部、
前記凹部内の頂部開口部、
前記凹部の周囲に配置されたクランプ、及び
前記頂部開口部へつながっている底部開口部であり、接着剤オーバーフローチャネルを画成する天井部を有する底部開口部、
を有するハウジング本体と、
前記ハウジング本体の底部にボンドパッドを形成する金属シムであって、前記ハウジング本体とインサート成形された金属シムと、
レンズと、
前記レンズの底部に固定されたセラミック蛍光体プレートと、
サブマウントと、該サブマウント上にマウントされた1つ以上のLEDダイとを有するLEDであり、各LEDダイが、n型層、発光層及びp型層を有し、前記サブマウントが底部パッドを有する、LEDと、
を有し、
前記クランプが、塑性変形して、前記凹部に受け入れられた前記レンズを固定しており、
前記セラミック蛍光体プレートが前記頂部開口部を完全に覆うよう、前記レンズが前記ハウジング本体に位置合わせされており、
前記サブマウントが前記底部開口部内に完全に着座している、
ことを特徴とする発光ダイオード(LED)モジュール。 - 一つ以上の前記頂部開口部及び前記底部開口部が反射性の側壁又は拡散性の側壁を有する、ことを特徴とする請求項1に記載のLEDモジュール。
- 前記レンズが前記LEDの上面よりも大きな底面をもつ、ことを特徴とする請求項1に記載のLEDモジュール。
- 前記金属シムが、前記LEDを受け入れて位置決めするためのガイドを画成する垂直なタブを有する、ことを特徴とする請求項1に記載のLEDモジュール。
- 前記ハウジング本体が、前記底部開口部内に4つのコーナーストッパを有する、ことを特徴とする請求項1に記載のLEDモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/561,617 US9385285B2 (en) | 2009-09-17 | 2009-09-17 | LED module with high index lens |
US12/561,617 | 2009-09-17 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012529369A Division JP2013505572A (ja) | 2009-09-17 | 2010-08-20 | 高屈折率レンズを有するledモジュール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016217826A Division JP6310994B2 (ja) | 2009-09-17 | 2016-11-08 | Ledモジュールを製造する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016001756A true JP2016001756A (ja) | 2016-01-07 |
JP6041948B2 JP6041948B2 (ja) | 2016-12-14 |
Family
ID=43242886
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012529369A Pending JP2013505572A (ja) | 2009-09-17 | 2010-08-20 | 高屈折率レンズを有するledモジュール |
JP2015172146A Active JP6041948B2 (ja) | 2009-09-17 | 2015-09-01 | 高屈折率レンズを有するledモジュール |
JP2016217826A Active JP6310994B2 (ja) | 2009-09-17 | 2016-11-08 | Ledモジュールを製造する方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012529369A Pending JP2013505572A (ja) | 2009-09-17 | 2010-08-20 | 高屈折率レンズを有するledモジュール |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016217826A Active JP6310994B2 (ja) | 2009-09-17 | 2016-11-08 | Ledモジュールを製造する方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9385285B2 (ja) |
EP (1) | EP2478575B1 (ja) |
JP (3) | JP2013505572A (ja) |
KR (1) | KR101880767B1 (ja) |
CN (2) | CN104953018B (ja) |
TW (2) | TWI505518B (ja) |
WO (1) | WO2011033407A2 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
KR101865272B1 (ko) * | 2011-07-26 | 2018-06-07 | 삼성전자주식회사 | 발광소자 모듈 및 이의 제조방법 |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
JP6021485B2 (ja) * | 2012-07-17 | 2016-11-09 | 株式会社朝日ラバー | 光学部材付半導体発光装置 |
DE102012106982A1 (de) | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
US8876330B2 (en) * | 2012-11-15 | 2014-11-04 | Illinois Tool Works Inc. | Illumination device |
CN105393374B (zh) * | 2013-07-19 | 2019-05-28 | 亮锐控股有限公司 | 具有光学元件并且没有衬底载体的pc led |
KR101504309B1 (ko) * | 2013-08-27 | 2015-03-20 | 주식회사 루멘스 | 발광 소자 패키지 및 이를 갖는 백라이트 유닛 |
US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
DE102013222703A1 (de) * | 2013-11-08 | 2015-05-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
KR102217791B1 (ko) | 2014-01-23 | 2021-02-22 | 루미리즈 홀딩 비.브이. | 자기-정렬되는 미리 형성된 렌즈를 갖는 발광 디바이스 |
EP2953176A1 (de) * | 2014-06-02 | 2015-12-09 | Swarovski Energy GmbH | Beleuchtungsvorrichtung |
DE102014110719A1 (de) * | 2014-07-29 | 2016-02-04 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement, Beleuchtungsvorrichtung und Verfahren zur Herstellung eines Halbleiterbauelements |
DE102014111278A1 (de) * | 2014-08-07 | 2016-02-11 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Halter sowie LED-Lampe oder Leuchte zur Beleuchtung |
KR101636516B1 (ko) * | 2015-03-10 | 2016-07-06 | 한국광기술원 | 렌즈 일체형 발광다이오드 모듈의 제조방법 |
US9634206B1 (en) * | 2015-04-30 | 2017-04-25 | Cse, Inc. | LED luminaire |
WO2017121676A1 (en) * | 2016-01-12 | 2017-07-20 | Lumileds Holding B.V. | Lighting arrangement with exact positioning of an optical element |
US10069051B2 (en) * | 2016-04-08 | 2018-09-04 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
JP6955135B2 (ja) * | 2016-10-19 | 2021-10-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
RU172080U1 (ru) * | 2017-01-09 | 2017-06-28 | федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" | Корпус светодиода для поверхностного монтажа |
KR102528528B1 (ko) * | 2018-02-05 | 2023-05-04 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 발광장치 |
CN109817797A (zh) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | Led器件和灯组阵列 |
DE102019104436A1 (de) * | 2019-02-21 | 2020-08-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
US11587881B2 (en) | 2020-03-09 | 2023-02-21 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device |
US11335646B2 (en) | 2020-03-10 | 2022-05-17 | Advanced Semiconductor Engineering, Inc. | Substrate structure including embedded semiconductor device and method of manufacturing the same |
USD933872S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture |
USD933881S1 (en) | 2020-03-16 | 2021-10-19 | Hgci, Inc. | Light fixture having heat sink |
US11032976B1 (en) | 2020-03-16 | 2021-06-15 | Hgci, Inc. | Light fixture for indoor grow application and components thereof |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001350074A (ja) * | 2000-06-07 | 2001-12-21 | Azuma Koki:Kk | 光ピックアップのレンズ取付構造 |
JP2002094122A (ja) * | 2000-07-13 | 2002-03-29 | Matsushita Electric Works Ltd | 光源装置及びその製造方法 |
US6590773B1 (en) * | 2002-08-28 | 2003-07-08 | Para Light Electronics Co., Ltd. | Heat dissipation device for enhanced power light emitting diodes |
US20030189830A1 (en) * | 2001-04-12 | 2003-10-09 | Masaru Sugimoto | Light source device using led, and method of producing same |
JP2004147032A (ja) * | 2002-10-23 | 2004-05-20 | Citizen Electronics Co Ltd | 小型撮像モジュール |
JP2004214436A (ja) * | 2003-01-06 | 2004-07-29 | Sharp Corp | 半導体発光装置およびその製造方法 |
JP2004335740A (ja) * | 2003-05-07 | 2004-11-25 | Citizen Electronics Co Ltd | 発光ダイオード及びそのパッケージ構造 |
US20050269582A1 (en) * | 2004-06-03 | 2005-12-08 | Lumileds Lighting, U.S., Llc | Luminescent ceramic for a light emitting device |
JP2006066519A (ja) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
JP2006162947A (ja) * | 2004-12-07 | 2006-06-22 | Canon Inc | 光学装置および光学部材固定方法 |
JP2006237141A (ja) * | 2005-02-23 | 2006-09-07 | Stanley Electric Co Ltd | サブマウント型led |
WO2006095949A1 (en) * | 2005-03-11 | 2006-09-14 | Seoul Semiconductor Co., Ltd. | Led package having an array of light emitting cells coupled in series |
JP2007203625A (ja) * | 2006-02-02 | 2007-08-16 | Fujinon Corp | 熱カシメ装置 |
JP2007335798A (ja) * | 2006-06-19 | 2007-12-27 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008116803A (ja) * | 2006-11-07 | 2008-05-22 | Olympus Corp | 熱かしめ方法、レンズ鏡枠の製造方法、及び、熱かしめ装置 |
JP2008231218A (ja) * | 2007-03-20 | 2008-10-02 | Nippon Electric Glass Co Ltd | 蛍光体材料及び白色led |
JP2009176579A (ja) * | 2008-01-24 | 2009-08-06 | Stanley Electric Co Ltd | 照明装置 |
JP2009177106A (ja) * | 2007-12-28 | 2009-08-06 | Panasonic Corp | 半導体発光装置用セラミックス部材、半導体発光装置用セラミックス部材の製造方法、半導体発光装置および表示装置 |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69124822T2 (de) | 1990-04-27 | 1997-10-09 | Omron Tateisi Electronics Co | Lichtemittierende Halbleitervorrichtung mit Fresnel-Linse |
JPH0555636A (ja) * | 1991-08-22 | 1993-03-05 | Sanken Electric Co Ltd | 半導体発光装置の製造方法 |
US5444520A (en) * | 1993-05-17 | 1995-08-22 | Kyocera Corporation | Image devices |
JP3992770B2 (ja) * | 1996-11-22 | 2007-10-17 | 日亜化学工業株式会社 | 発光装置及びその形成方法 |
JP2000216413A (ja) * | 1999-01-26 | 2000-08-04 | Apic Yamada Corp | Bga型透明プラスチック半導体パッケ―ジ |
US6521916B2 (en) * | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
JP2001077430A (ja) * | 1999-09-02 | 2001-03-23 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2002118270A (ja) * | 2000-10-06 | 2002-04-19 | Tokai Rika Co Ltd | 光デバイス及びその製造方法 |
KR20030095391A (ko) * | 2001-01-31 | 2003-12-18 | 젠텍스 코포레이션 | 방사 에미터 장치 및 이를 제조하는 방법 |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
TW552726B (en) | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
JP2003110146A (ja) | 2001-07-26 | 2003-04-11 | Matsushita Electric Works Ltd | 発光装置 |
JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
JP2003304000A (ja) * | 2002-04-08 | 2003-10-24 | Citizen Electronics Co Ltd | 発光ダイオード用パッケージの製造方法 |
EP1383175A1 (de) | 2002-07-16 | 2004-01-21 | Abb Research Ltd. | Optisches chipmodul |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
KR20110137403A (ko) * | 2003-02-26 | 2011-12-22 | 크리, 인코포레이티드 | 복합 백색 광원 및 그 제조 방법 |
JP4123057B2 (ja) | 2003-05-26 | 2008-07-23 | 松下電工株式会社 | 発光装置及びその製造方法 |
JP2005093712A (ja) * | 2003-09-17 | 2005-04-07 | Stanley Electric Co Ltd | 半導体発光装置 |
TWI244226B (en) | 2004-11-05 | 2005-11-21 | Chen Jen Shian | Manufacturing method of flip-chip light-emitting device |
CN100444415C (zh) | 2004-07-06 | 2008-12-17 | 旭山光电股份有限公司 | 气密式高导热芯片封装组件 |
TWM271254U (en) * | 2004-09-10 | 2005-07-21 | Sen Tech Co Ltd | Heat dissipation base and package structure for light-emitting diode |
JP2006114854A (ja) | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
KR101170407B1 (ko) * | 2004-11-19 | 2012-08-02 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 무기 하우징을 갖는 발광 소자 |
JP2007102139A (ja) * | 2004-12-03 | 2007-04-19 | Sony Corp | 光取出しレンズ、発光素子組立体、面状光源装置、及び、カラー液晶表示装置組立体 |
JP2006173326A (ja) | 2004-12-15 | 2006-06-29 | Nippon Leiz Co Ltd | 光源装置 |
EP1524705B1 (en) | 2005-01-12 | 2008-03-12 | NeoBulb Technologies, Inc. | Flip chip type LED lighting device and its manufacturing method |
US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
KR100665117B1 (ko) | 2005-02-17 | 2007-01-09 | 삼성전기주식회사 | Led 하우징 및 그 제조 방법 |
KR101161384B1 (ko) * | 2005-03-29 | 2012-07-02 | 서울반도체 주식회사 | 직렬접속된 발광셀 어레이를 갖는 발광다이오드 칩을탑재한 발광다이오드 패키지 |
WO2006117710A1 (en) | 2005-04-29 | 2006-11-09 | Koninklijke Philips Electronics N.V. | Light source with glass housing |
JP4329735B2 (ja) * | 2005-06-28 | 2009-09-09 | 豊田合成株式会社 | Ledランプユニット |
KR100667504B1 (ko) * | 2005-06-29 | 2007-01-10 | 엘지전자 주식회사 | 발광 소자의 패키지 및 그의 제조 방법 |
US8163580B2 (en) * | 2005-08-10 | 2012-04-24 | Philips Lumileds Lighting Company Llc | Multiple die LED and lens optical system |
JP4696780B2 (ja) * | 2005-08-24 | 2011-06-08 | パナソニック電工株式会社 | Led照明器具 |
JP2007116138A (ja) | 2005-09-22 | 2007-05-10 | Lexedis Lighting Gmbh | 発光装置 |
DE102006032416A1 (de) | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
JP2007123777A (ja) | 2005-10-31 | 2007-05-17 | Sharp Corp | 半導体発光装置 |
WO2007069399A1 (ja) * | 2005-12-12 | 2007-06-21 | Nichia Corporation | 発光装置及び半導体装置とその製造方法 |
JP2007214522A (ja) | 2006-02-10 | 2007-08-23 | Intekkusu Kk | 光源装置及びこれを用いた照明装置 |
KR100738933B1 (ko) * | 2006-03-17 | 2007-07-12 | (주)대신엘이디 | 조명용 led 모듈 |
US7906794B2 (en) * | 2006-07-05 | 2011-03-15 | Koninklijke Philips Electronics N.V. | Light emitting device package with frame and optically transmissive element |
US7503676B2 (en) * | 2006-07-26 | 2009-03-17 | Kyocera Corporation | Light-emitting device and illuminating apparatus |
US8092735B2 (en) | 2006-08-17 | 2012-01-10 | 3M Innovative Properties Company | Method of making a light emitting device having a molded encapsulant |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
JP4934546B2 (ja) * | 2007-01-10 | 2012-05-16 | 古河電気工業株式会社 | 接続構造及び接続方法 |
JP2008205138A (ja) * | 2007-02-20 | 2008-09-04 | Misuzu Kogyo:Kk | 電子光学素子の実装体および電子光学素子の実装体を組み込んだ電子光学機器 |
CN101276860A (zh) * | 2007-03-30 | 2008-10-01 | 神钛光学科技股份有限公司 | 光透过率优越散热性良好的发光二极管组装体及组装方法 |
JP2009071186A (ja) * | 2007-09-14 | 2009-04-02 | Stanley Electric Co Ltd | Ledユニット |
JP5082710B2 (ja) * | 2007-09-19 | 2012-11-28 | 日亜化学工業株式会社 | 発光装置 |
US20090078950A1 (en) * | 2007-09-21 | 2009-03-26 | Tsung-Ting Sun | Package structure with replaceable element for light emitting diode |
US8416514B2 (en) * | 2008-01-08 | 2013-04-09 | Lg Innotek Co., Ltd. | Lens unit, lens assembly, camera module, method of fabricating camera module and lens assembly, method of fabricating optic member, and apparatus of fabricating optic member |
US7928458B2 (en) * | 2008-07-15 | 2011-04-19 | Visera Technologies Company Limited | Light-emitting diode device and method for fabricating the same |
JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ledランプの製造方法 |
US20110062469A1 (en) | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Molded lens incorporating a window element |
US9735198B2 (en) * | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
-
2009
- 2009-09-17 US US12/561,617 patent/US9385285B2/en active Active
-
2010
- 2010-08-20 WO PCT/IB2010/053772 patent/WO2011033407A2/en active Application Filing
- 2010-08-20 KR KR1020127009716A patent/KR101880767B1/ko active IP Right Grant
- 2010-08-20 JP JP2012529369A patent/JP2013505572A/ja active Pending
- 2010-08-20 CN CN201510392659.0A patent/CN104953018B/zh active Active
- 2010-08-20 EP EP10757835.3A patent/EP2478575B1/en active Active
- 2010-08-20 CN CN201080041382.2A patent/CN102484191B/zh active Active
- 2010-08-23 TW TW099128119A patent/TWI505518B/zh active
- 2010-08-23 TW TW104129079A patent/TWI600186B/zh active
-
2015
- 2015-09-01 JP JP2015172146A patent/JP6041948B2/ja active Active
-
2016
- 2016-03-22 US US15/077,255 patent/US9755124B2/en active Active
- 2016-11-08 JP JP2016217826A patent/JP6310994B2/ja active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001350074A (ja) * | 2000-06-07 | 2001-12-21 | Azuma Koki:Kk | 光ピックアップのレンズ取付構造 |
JP2002094122A (ja) * | 2000-07-13 | 2002-03-29 | Matsushita Electric Works Ltd | 光源装置及びその製造方法 |
US20030189830A1 (en) * | 2001-04-12 | 2003-10-09 | Masaru Sugimoto | Light source device using led, and method of producing same |
US6590773B1 (en) * | 2002-08-28 | 2003-07-08 | Para Light Electronics Co., Ltd. | Heat dissipation device for enhanced power light emitting diodes |
JP2004147032A (ja) * | 2002-10-23 | 2004-05-20 | Citizen Electronics Co Ltd | 小型撮像モジュール |
JP2004214436A (ja) * | 2003-01-06 | 2004-07-29 | Sharp Corp | 半導体発光装置およびその製造方法 |
JP2004335740A (ja) * | 2003-05-07 | 2004-11-25 | Citizen Electronics Co Ltd | 発光ダイオード及びそのパッケージ構造 |
US20050269582A1 (en) * | 2004-06-03 | 2005-12-08 | Lumileds Lighting, U.S., Llc | Luminescent ceramic for a light emitting device |
JP2006005367A (ja) * | 2004-06-03 | 2006-01-05 | Lumileds Lighting Us Llc | 発光デバイスのための発光セラミック |
JP2006066519A (ja) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
JP2006162947A (ja) * | 2004-12-07 | 2006-06-22 | Canon Inc | 光学装置および光学部材固定方法 |
JP2006237141A (ja) * | 2005-02-23 | 2006-09-07 | Stanley Electric Co Ltd | サブマウント型led |
WO2006095949A1 (en) * | 2005-03-11 | 2006-09-14 | Seoul Semiconductor Co., Ltd. | Led package having an array of light emitting cells coupled in series |
JP2008533716A (ja) * | 2005-03-11 | 2008-08-21 | ソウル セミコンダクター カンパニー リミテッド | 直列接続された発光セルのアレイを有する発光ダイオードパッケージ |
JP2007203625A (ja) * | 2006-02-02 | 2007-08-16 | Fujinon Corp | 熱カシメ装置 |
JP2007335798A (ja) * | 2006-06-19 | 2007-12-27 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008116803A (ja) * | 2006-11-07 | 2008-05-22 | Olympus Corp | 熱かしめ方法、レンズ鏡枠の製造方法、及び、熱かしめ装置 |
JP2008231218A (ja) * | 2007-03-20 | 2008-10-02 | Nippon Electric Glass Co Ltd | 蛍光体材料及び白色led |
JP2009177106A (ja) * | 2007-12-28 | 2009-08-06 | Panasonic Corp | 半導体発光装置用セラミックス部材、半導体発光装置用セラミックス部材の製造方法、半導体発光装置および表示装置 |
JP2009176579A (ja) * | 2008-01-24 | 2009-08-06 | Stanley Electric Co Ltd | 照明装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011033407A3 (en) | 2011-06-16 |
TWI505518B (zh) | 2015-10-21 |
EP2478575A2 (en) | 2012-07-25 |
EP2478575B1 (en) | 2019-10-09 |
CN104953018A (zh) | 2015-09-30 |
US20160240754A1 (en) | 2016-08-18 |
TW201603333A (zh) | 2016-01-16 |
TWI600186B (zh) | 2017-09-21 |
KR101880767B1 (ko) | 2018-07-20 |
JP6041948B2 (ja) | 2016-12-14 |
TW201119098A (en) | 2011-06-01 |
JP2013505572A (ja) | 2013-02-14 |
CN102484191A (zh) | 2012-05-30 |
CN102484191B (zh) | 2015-08-12 |
KR20120079105A (ko) | 2012-07-11 |
JP6310994B2 (ja) | 2018-04-11 |
US9385285B2 (en) | 2016-07-05 |
CN104953018B (zh) | 2018-09-18 |
JP2017028328A (ja) | 2017-02-02 |
US20110062471A1 (en) | 2011-03-17 |
US9755124B2 (en) | 2017-09-05 |
WO2011033407A2 (en) | 2011-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6041948B2 (ja) | 高屈折率レンズを有するledモジュール | |
JP2013505572A5 (ja) | ||
US20200108528A1 (en) | Led packaging with integrated optics and methods of manufacturing the same | |
US8231251B2 (en) | Multiple piece reflective angle transformer | |
KR102135763B1 (ko) | 발광 장치 | |
EP3100309B1 (en) | Light emitting device with a phosphor-converted led in a shallow reflector cup filled with encapsulant | |
JP2016115729A (ja) | 発光装置の製造法 | |
EP2666193B1 (en) | Led package comprising encapsulation | |
US20100207140A1 (en) | Compact molded led module | |
US9240526B2 (en) | Solid state light emitting diode packages with leadframes and ceramic material | |
KR20160107238A (ko) | 카메라를 위한 얇은 led 플래시 | |
TW201436294A (zh) | 具有成側向形態或頂向形態裝置定向之疊層無引線載架封裝的光電子裝置(一) | |
JP2010508655A (ja) | Ledおよび関連アセンブリの一体化熱拡散器 | |
CN104396035A (zh) | 通过透明间隔物从led分离的磷光体 | |
TW201739071A (zh) | 製造光電組件之方法及光電組件 | |
JP2020188094A (ja) | 半導体発光装置 | |
US20070029559A1 (en) | Light emitting chip carrier structure | |
KR102098848B1 (ko) | 발광소자 패키지 | |
JP2020188182A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160428 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160531 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160817 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161011 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161108 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6041948 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |