TWI503549B - Parallel adjustment mechanism of probe card and probe inspection device - Google Patents

Parallel adjustment mechanism of probe card and probe inspection device Download PDF

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Publication number
TWI503549B
TWI503549B TW100122209A TW100122209A TWI503549B TW I503549 B TWI503549 B TW I503549B TW 100122209 A TW100122209 A TW 100122209A TW 100122209 A TW100122209 A TW 100122209A TW I503549 B TWI503549 B TW I503549B
Authority
TW
Taiwan
Prior art keywords
moving body
top plate
probe card
lifting
inclined surface
Prior art date
Application number
TW100122209A
Other languages
English (en)
Chinese (zh)
Other versions
TW201221965A (en
Inventor
Masayuki Noguchi
Shuji Akiyama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201221965A publication Critical patent/TW201221965A/zh
Application granted granted Critical
Publication of TWI503549B publication Critical patent/TWI503549B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW100122209A 2010-06-25 2011-06-24 Parallel adjustment mechanism of probe card and probe inspection device TWI503549B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010145424A JP5826466B2 (ja) 2010-06-25 2010-06-25 プローブカードの平行調整機構及び検査装置

Publications (2)

Publication Number Publication Date
TW201221965A TW201221965A (en) 2012-06-01
TWI503549B true TWI503549B (zh) 2015-10-11

Family

ID=45358635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100122209A TWI503549B (zh) 2010-06-25 2011-06-24 Parallel adjustment mechanism of probe card and probe inspection device

Country Status (4)

Country Link
JP (1) JP5826466B2 (enrdf_load_stackoverflow)
KR (1) KR101256306B1 (enrdf_load_stackoverflow)
CN (1) CN102298079A (enrdf_load_stackoverflow)
TW (1) TWI503549B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616664B (zh) * 2016-03-23 2018-03-01 創意電子股份有限公司 使用探針卡之方法、系統及其探針卡裝置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5277827B2 (ja) * 2008-09-22 2013-08-28 東京エレクトロン株式会社 プローブ装置
JP2013175572A (ja) * 2012-02-24 2013-09-05 Tokyo Electron Ltd プローブ装置及びプローブカードの平行調整機構
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
CN104183515A (zh) * 2013-05-24 2014-12-03 标准科技股份有限公司 晶圆测试机台
KR101607087B1 (ko) * 2014-09-24 2016-03-29 주식회사 디이엔티 프로브
JP6890921B2 (ja) 2015-10-21 2021-06-18 株式会社日本マイクロニクス プローブカード及び接触検査装置
KR102446953B1 (ko) * 2016-02-24 2022-09-23 세메스 주식회사 정렬 지그 및 이를 이용하여 테스트 헤드를 프로브 스테이션에 정렬하는 방법
CN107422241B (zh) * 2016-03-23 2019-10-15 创意电子股份有限公司 使用探针卡的方法及系统
TWI610080B (zh) * 2016-05-12 2018-01-01 中華精測科技股份有限公司 探針卡總成
CN106206355B (zh) * 2016-08-30 2018-11-27 重庆市妙格半导体研究院有限公司 基于石墨烯感测单元的半导体检测系统
KR102654604B1 (ko) * 2016-11-22 2024-04-03 세메스 주식회사 프로브 스테이션
CN108387759B (zh) * 2018-01-15 2020-10-16 北京时代民芯科技有限公司 一种通用1553b总线电路反熔丝调整夹具
KR102115179B1 (ko) * 2018-11-20 2020-06-08 주식회사 탑 엔지니어링 프로브장치 및 프로브 자세 보정 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231018A (ja) * 1993-08-25 1995-08-29 Tokyo Electron Ltd プローブ装置
JPH08320389A (ja) * 1995-05-26 1996-12-03 Dainippon Screen Mfg Co Ltd 測定ステージ
JP2004071909A (ja) * 2002-08-07 2004-03-04 Tokyo Electron Ltd 載置台の駆動装置及びプローブ装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185327A (ja) * 1989-12-15 1991-08-13 Sanwa Musen Sokki Kenkyusho:Kk 真空測定装置
JP2006098296A (ja) * 2004-09-30 2006-04-13 Optrex Corp 表示パネルの点灯検査装置
JP4102884B2 (ja) * 2005-05-13 2008-06-18 東京エレクトロン株式会社 プローブカードの調整機構及びプローブ装置
JP4685559B2 (ja) * 2005-09-09 2011-05-18 東京エレクトロン株式会社 プローブカードと載置台との平行度調整方法及び検査用プログラム記憶媒体並びに検査装置
JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
JP2007183194A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP2008294292A (ja) * 2007-05-25 2008-12-04 Tokyo Seimitsu Co Ltd プローバ、プローブ接触方法及びプログラム
KR101093646B1 (ko) * 2009-05-01 2011-12-15 가부시키가이샤 니혼 마이크로닉스 평판형상 피검사체의 시험장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231018A (ja) * 1993-08-25 1995-08-29 Tokyo Electron Ltd プローブ装置
JPH08320389A (ja) * 1995-05-26 1996-12-03 Dainippon Screen Mfg Co Ltd 測定ステージ
JP2004071909A (ja) * 2002-08-07 2004-03-04 Tokyo Electron Ltd 載置台の駆動装置及びプローブ装置
TWI302010B (enrdf_load_stackoverflow) * 2002-08-07 2008-10-11 Tokyo Electron Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616664B (zh) * 2016-03-23 2018-03-01 創意電子股份有限公司 使用探針卡之方法、系統及其探針卡裝置

Also Published As

Publication number Publication date
KR101256306B1 (ko) 2013-04-18
CN102298079A (zh) 2011-12-28
TW201221965A (en) 2012-06-01
JP5826466B2 (ja) 2015-12-02
JP2012008051A (ja) 2012-01-12
KR20120000503A (ko) 2012-01-02

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