TWI503549B - Parallel adjustment mechanism of probe card and probe inspection device - Google Patents

Description

Parallel adjustment mechanism of probe card and probe inspection device

According to the present invention, when the probe card is electrically contacted with an object to be inspected such as a wafer to perform electrical property inspection of the object to be inspected, the parallelism of the probe card and the object to be inspected on the mounting table can be adjusted. The parallel adjustment mechanism and inspection device of the needle card.

A conventional probe device of this type is disclosed in Patent Document 1. This probe device will be described with reference to Figs. 4 and 5 . This probe device includes a loader chamber that transports an object to be inspected (for example, a wafer), and a probe chamber that is adjacent to the loader chamber and performs electrical property inspection of the wafer received from the loader chamber.

As shown in FIG. 4, the probe chamber includes a mounting table (wafer chuck) 1 on which a test object (wafer) W is placed, and is movable in the X, Y, and Z directions; and has a probe 2A. The probe card 2 is disposed above the wafer chuck 1 ; the card clamping mechanism 4 detachably holds the probe card 2 via the clip 3; an Insert Ring 5 The probe card 2 is supported via the card clamping mechanism 4; and the top plate 6 supports the collar 5 so that the test head (not shown) can be rotated toward the top plate 6 side via the connecting ring R is used to electrically connect the test head to the probe card 2.

In recent years, the development of the probe card 2 has been changing with each passing day, and it is possible to simultaneously check a plurality of devices. In particular, when the probe card 2 is inspected at the same time as all the devices of the wafer W, the probe 2A formed in the probe card 2 is in contact with all of the devices formed on the wafer W. Therefore, the parallelism of the probe card 2 and the wafer W can be problematic. Once the parallelism between the two is poor, the full probe 2A of the probe card 2 cannot be brought into contact with the wafer W by a uniform needle pressure, and the contact load is excessively and insufficiently generated, which may impair the reliability of the inspection. After that, depending on the situation, there may be damage to the probe card 2 or the wafer W.

Then, the inspection apparatus shown in FIG. 4 is provided with the parallel adjustment mechanism 7 which adjusts the parallelism of the probe card 2 and the wafer W. As shown in FIGS. 4 and 5, the parallel adjustment mechanism 7 supports the collar 5 at at least three places, and moves up and down in two places, thereby adjusting the parallelism of the probe card 2. As shown in the figure, the parallel adjustment mechanism 7 includes a first support mechanism 7A that supports the collar 5 at one position, and each of which is disposed at a predetermined interval from the first support mechanism 7A in the circumferential direction, and is disposed at two other places. The two second support mechanisms 7B supporting the collar 5 are disposed on the step formed by the central hole of the collar 5 surrounding the probe card 2, and the first and second support mechanisms 7A and 7B. The first support mechanism 7A constitutes a support point as the support collar 5, and the other second support mechanism 7B constitutes an elevating mechanism that individually raises and lowers the ring 5.

The top plate 6 of the support ring 5 is such that the four corners shown in Fig. 4 are horizontally supported by the support column 8. That is, the top plate provided with the test head is divided into: a ring 5 supporting the probe card 2, and a top plate supported by the support column 8. 6. Originally, the top plate 6 was formed as a unitary body, and the strength was better. However, in order to form the movable structure of the probe card 2 by the parallel adjustment mechanism 7, the collar 5 is divided from the top plate 6.

[Patent Document 1] JP-A-2006-317302

However, in the parallel adjustment mechanism 7 described in Patent Document 1, the ring 5 is divided from the top plate 6, and the ring 5 is supported by a rectangular step formed on the inner end surface of the top plate 6, and thus is divided with the top plate. The configuration is complementary such that the formation of the collar 5 is thinner than the top plate 6, and there is a problem that the rigidity of the support structure as the test head is lowered. As the rigidity of the support structure is lowered, the ring 5 is bent due to a large load from the test head disposed on the ring 5 or a large contact load of the probe card 2 and the wafer W during inspection, etc. The needle end position of the needle is displaced in the up and down direction. As a result, it is difficult to obtain an appropriate overdrive amount, and it is difficult to stably obtain a probe mark for observing the contact state at the time of inspection. Further, in the parallel adjustment mechanism 7, since the first and second support mechanisms 7A and 7B are disposed in the vicinity of the probe card 2 as shown in FIG. 5, in order to mount the first and second between the collar 5 and the top plate 6, The support mechanisms 7A and 7B require a separate support mechanism or the like for the ring 5 and the top plate 6, and there is a problem that the top plate 6 having versatility cannot be used.

The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a probe mark which can obtain an appropriate overdrive amount and stability, and can use a top plate having versatility and can be used for adjusting the parallelism. Needle card Parallel adjustment mechanism and inspection device.

The parallel adjustment mechanism of the probe card according to the first aspect of the present invention is configured to raise and lower the top plate by at least three of the support columns at four corners of the top plate on which the probe card is attached at four corners. a parallelism between the needle card and the object to be inspected disposed on the mounting table below, and characterized in that: a lifting mechanism is provided between the support column and the top plate at least three places, and the lifting mechanism has a tilting a moving body of the surface disposed to be movable along an upper surface of the support column; and a lifting body coupled to the top plate and configured to be movable up and down along an inclined surface of the moving body; and a driving mechanism The moving body moves along the upper surface of the support column, and there is a movement guiding mechanism between the boundary between the support column and the moving body, and the inclined surface of the moving body and the inclined surface of the lifting body. The movement guiding mechanism has a cross roller, and the parallel adjustment mechanism has a lifting guide mechanism for lifting and guiding the moving body, and the lifting mechanism has a cross roller.

Further, the parallel adjustment machine of the probe card described in claim 2 of the present invention In the invention according to claim 1, the drive mechanism includes a ball screw that is screwed to the moving body, and a motor that drives the ball screw.

Further, in the invention described in claim 1 or claim 2, the parallel adjustment mechanism of the probe card according to the third aspect of the present invention provides a lifting and lowering guide for elevating and guiding the elevating body.

Further, the parallel adjustment mechanism of the probe card according to the invention of claim 1 is the invention of the invention described in claim 1 or claim 2, wherein the moving body and the lifting system are each inclined surface card Together, it becomes a rectangular block.

Further, the inspection apparatus according to claim 5 of the present invention includes: a mounting table on which an object to be inspected is placed; a probe card disposed above the mounting table; and a top plate on which the probe is attached a needle card; four support columns attached to the top plate at four corners; and a parallel adjustment mechanism of the probe card, which is attached to at least three of the four support columns to raise and lower the top plate, and adjust the above-mentioned probe a parallelism between the needle card and the object to be inspected disposed on the mounting table below, wherein the parallel adjustment mechanism includes a lifting mechanism between the support post and the top plate at the at least three places, and the lifting mechanism The utility model has a moving body having an inclined surface, which is arranged to be movable along an upper surface of the support column; a lifting body connected to the top plate and arranged to be movable up and down along an inclined surface of the moving body; and a driving mechanism for moving the moving body along an upper surface of the support column, the support column a movement guiding mechanism is provided in a boundary between the boundary of the moving body and the inclined surface of the moving body and the inclined surface of the lifting body, wherein the moving guiding mechanism has a cross roller, and the parallel adjusting mechanism has a lifting and lowering movement The guiding machine, the lifting guide mechanism has a cross roller.

The inspection apparatus according to claim 5, wherein the drive mechanism includes a ball screw that is screwed to the moving body and a motor that drives the ball screw.

Further, the inspection apparatus according to claim 7 of the present invention is characterized in that the invention described in claim 5 or claim 6 provides a lifting and lowering guide for elevating and guiding the elevating body.

Further, in the invention according to claim 5 or the invention of claim 6, the moving body and the lifting system that are engaged with each other are engaged in each of the inclined surfaces to form a rectangular shape. Shaped block.

According to the present invention, it is possible to provide a parallel adjustment mechanism and an inspection device for a probe card, which can obtain an appropriate overdrive amount and a stable probe mark. It is noted that a top plate having versatility can be used, and the adjustment of the parallelism can be made abundant.

Hereinafter, the present invention will be described based on the embodiments shown in Figs. 1 to 3 .

For example, as shown in FIG. 1 and FIG. 2, the inspection apparatus 10 of the present embodiment includes a movable mounting table (wafer chuck) 11 on which a wafer W is placed, and a probe card 12 disposed on the crystal. Above the round collet 11; a card clamping mechanism 14, which fixes the top plate 15 of the probe card 12 via a clip 13, the tether clamping mechanism 14 is fixed to the underside; the support post 16 is attached to the four corners The support top plate 15 and the parallel adjustment mechanism 17 adjust the parallelism between the wafer W on the wafer chuck 11 and the probe card 12, and the probe card 12 is connected to the test head via the connection ring R (not shown). After that, the electrical property inspection of the wafer W is performed under the control of the control device.

Further, the probe card 12 is a card clamping mechanism 14 that is attached to the lower surface of the top plate 15. Since the top plate 15 is not divided as in the related art, the top plate 15 is originally provided with high rigidity. As a result, even if a test head (not shown) is placed on the top surface of the top plate 15, and a large contact load acts between the probe card 12 and the wafer W, the top plate 15 is not easily bent in the up and down direction. The needle end position of the plurality of probes 12A of the needle card 12 is stable, and a certain height can be maintained. A proper overdrive amount can be obtained and a stable probe mark can be obtained, and a highly reliable and stable inspection can be performed.

Further, as shown in FIGS. 1 and 2, the parallel adjustment mechanism 17 is constituted by four elevating mechanisms 17A interposed between the four corners of the top plate 15 and the support columns 16 at four places, and the elevating mechanism 17A at four places is utilized. The parallelism of the probe card 12 to the wafer W on the wafer chuck 11 is adjusted. At this time, the parallelism between the probe card 12 and the wafer W is measured by a measuring device such as a capacitive sensor or a laser length measuring device.

As shown in Fig. 2, in the present embodiment, the elevating mechanism 17A is disposed at four locations, but the elevating mechanism 17A may be disposed at at least three of the support columns 16 at four locations. When the elevating mechanism 17A is disposed at three places, for example, the top plate 15 may be tiltably supported at a certain height as long as the support column 16 at the remaining portion is provided. As long as the elevating mechanism 17A is disposed at at least three places, the elevating mechanisms 17A can be individually controlled, and the tilt angle of the top plate 15 can be enlarged compared with the two places, so that the probe card 12 and the wafer W on the wafer chuck 11 can be obtained. The adjustment angle is sufficient.

As shown in FIG. 1 to FIG. 3, the four lifting mechanisms 17A are formed in a substantially rectangular block shape, and each of the lifting mechanisms 17A is fixed to the upper surface of the support columns 16 at the respective lower portions, and each of the upper surfaces is provided. They are respectively connected to the four corners of the top plate 15.

As shown in FIGS. 1 to 3, the elevating mechanism 17A includes a base body 17B that is fixed to the upper surface of the support column 16, and a moving body 17C having an inclined surface that is placed along the base body 17B. The movable body 17E having the inclined member is coupled to the top plate 15 by the connecting member 17D, and is arranged to be movable up and down along the inclined surface of the moving body 17C; and the driving mechanism 17F is moved The body 17C moves along the upper surface of the support column 16, and the drive mechanism 17F is driven under the control of the control device, and the moving body 17C is moved only in the front-rear direction (the left and right directions in FIGS. 1 to 3) by a predetermined size. This configuration elevating body 17E can be lifted and lowered only by a predetermined size via the inclined surface of the moving body 17C. The control device can control the drive mechanism 17F based on the measurement result of the measurement machine.

As shown in Fig. 1 and Fig. 3, both the movable body 17C and the elevating body 17E are formed in a substantially trapezoidal shape on the side surface, and each of the inclined surfaces is engaged with each other to form a rectangular block that is received on the support post 16, and each of the pair is opposed to each other. The front, rear, left, and right parallel faces are substantially identical to the side faces of the support post 16, and the upper and lower faces are fixed to the upper surface of the support post 16 and the top plate 15. The moving body 17C located at the rear of the inspection apparatus 10 (on the right side in FIG. 1) has an upper end portion extending to the front side (on the left side in FIG. 1) of the inspection apparatus 10, and has an eaves-like portion.

As shown in FIG. 3(a), the drive mechanism 17F that moves the movable body 17C has a ball screw 17G that is screwed with a female screw formed in the front-rear direction of the movable body 17C, and a motor 17H that drives the ball screw 17G. The moving body 17C is moved in the front-rear direction along the upper surface of the base 17B. A first movement guiding mechanism 17I is provided between the base 17B and the moving body 17C. The movable body 17C can smoothly move in the front-rear direction on the base 17B via the first movement guiding mechanism 17I. Further, a second movement guide mechanism 17J is provided between the inclined surface of the moving body 17C and the inclined surface of the elevating body 17E, and the elevating body 17E can be moved forward and backward along the inclined surface of the moving body 17C via the second movement guiding mechanism 17J. The direction moves and smoothly moves up and down. As shown in FIG. 3(b), the first and second movement guiding mechanisms 17I and 17J have at least two rows of intersecting rollers which are movable along the respective linear slides. Since the first and second movement guiding mechanisms 17I and 17J each have at least two rows of intersecting rollers, the load resistance is excellent, and the guidance can be smoothly moved even under a high load.

Further, as shown in FIG. 3(a), the base 17B protrudes from the side surface of the support column 16, and the motor 17H is disposed in the protruding portion. In the protruding portion of the base body 17B, the elevation guide mechanism 17K of the elevation guide lifting and lowering body 17E is provided between the motor 17H and the side surface of the support column 16. The lifting guide mechanism 17K has a linear slide rail 17L provided on the base body 17B and a cross roller (refer to FIG. 3(b)) that is connected to the linear slide rail 17L via at least two rows, according to the linear slide rail 17L. The engaging body 17M of the lifter 17E is lifted and lowered. Therefore, the lifter 17E can be moved up and down via the lift guide mechanism 17K having at least two rows of cross rollers by the moving body 17C moving forward and backward via the drive mechanism 17F.

Second, explain the relevant actions. First, in order to inspect the wafer W, the probe card 12 is attached to the card clamping mechanism 14. Under the mounting of the probe card 12, the probe card 12 is not formed in parallel with the wafer W on the wafer chuck 11. Therefore, the measurement device is used to measure the level of the probe card 12 and the wafer W. Degree of action. That is, with this measuring device, the distance between the probe card 12 and the wafer W is measured at a plurality of points, and the inclination of the probe card 12 to the wafer W on the wafer chuck 11 is measured. The measurement result of the measuring machine is transmitted to the control device.

The control device transmits a unique measurement signal to each of the four drive mechanisms 17F of the parallel adjustment mechanism 17 based on the measurement result, and individually controls the drive mechanism 17F. Each of the drive mechanisms 17F is driven, and each of the movable bodies 17C moves only by a predetermined size via the first movement guide mechanism 17I. Accordingly, when each of the elevating bodies 17E is lifted and lowered by a predetermined size via the second movement guide mechanism 17J, each of the elevating bodies 17E raises and lowers the four corners of the top plate 15 by a predetermined size, and adjusts the inclination of the top plate 15 to detect the inclination of the top plate 15. The needle card 12 is formed in parallel with the wafer W on the wafer chuck 11.

As described above, according to the present embodiment, since the probe card 12 is provided on the top plate 15, the elevating mechanism 17A constituting the parallel adjustment mechanism 17 is provided between the top plate 15 and the support columns 16 at four places, so that the top plate 15 is provided. The rigidity is enhanced, whereby an appropriate overdrive amount and a stable probe mark can be obtained, a top plate having versatility can be used, and by adjusting the parallelism of the top plate 15 at four corners of the top plate 15, The adjustment of the parallelism between the top plate 15 and the wafer W is sufficient.

Further, since the elevating mechanism 17A constituting the parallel adjustment mechanism 17 is provided between the top plate 15 and the support columns 16 at four places, a special support mechanism for mounting the parallel adjustment mechanism 17 is not required, and it can be mounted at various low-cost inspections. Device.

In addition, the present invention is not limited to the above embodiment, and can be adapted to the needs. When changing the design components.

10‧‧‧Inspection device

11‧‧‧ wafer chuck (mounting table)

12‧‧‧ Probe Card

12A‧‧‧Probe

14‧‧‧Card clamping mechanism

15‧‧‧ top board

16‧‧‧Support column

17‧‧‧Parallel adjustment mechanism

17A‧‧‧ Lifting mechanism

17C‧‧‧Mobile

17E‧‧‧ Lifting body

17F‧‧‧ drive mechanism

17I‧‧‧1st mobile guiding mechanism

17J‧‧‧2nd mobile guiding mechanism

17K‧‧‧ Lifting guide mechanism

W‧‧‧ Wafer (inspected body)

Fig. 1 is a side elevational view showing an essential part of an embodiment of an inspection apparatus according to the present invention.

Fig. 2 is a plan view of the inspection apparatus shown in Fig. 1.

3(a) and 3(b) are views each showing a parallel adjustment mechanism of the inspection apparatus shown in Fig. 1, (a) is a cross-sectional view thereof, and (b) is a parallel adjustment mechanism shown in (a). A cross-sectional view of a moving mechanism.

4 is a side view showing a main part of a conventional inspection device.

Figure 5 is a plan view of the inspection apparatus shown in Figure 4 .

10‧‧‧Inspection device

11‧‧‧ wafer chuck (mounting table)

12‧‧‧ Probe Card

12A‧‧‧Probe

13‧‧‧Card fixture

14‧‧‧Card clamping mechanism

15‧‧‧ top board

16‧‧‧Support column

17‧‧‧Parallel adjustment mechanism

17A‧‧‧ Lifting mechanism

17B‧‧‧ substrate

17C‧‧‧Mobile

17E‧‧‧ Lifting body

17F‧‧‧ drive mechanism

17I‧‧‧1st mobile guiding mechanism

17J‧‧‧2nd mobile guiding mechanism

17K‧‧‧ Lifting guide mechanism

W‧‧‧ Wafer (inspected body)

R‧‧‧ connection ring

Claims (8)

A parallel adjustment mechanism of a probe card is configured to lift and lower the top plate at at least three of the support columns at four corners of the top plate on which the probe card is mounted, and adjust the probe card and the lower portion thereof The parallelism of the object to be inspected on the mounting table is characterized by comprising: a lifting mechanism between the support column and the top plate at least three places, the lifting mechanism having a moving body having an inclined surface And a lifting body coupled to the top plate and configured to be movable up and down along an inclined surface of the moving body; and a driving mechanism for moving the moving body along the upper surface of the supporting column Moving on the upper surface of the support column, a movement guiding mechanism exists in a boundary between the support column and the moving body, and an inclined surface of the moving body and an inclined surface of the lifting body, and the moving guiding mechanism has an intersection The roller and the parallel adjustment mechanism have a lifting guide mechanism for lifting and guiding the moving body, and the lifting mechanism has a cross roller. The parallel adjustment mechanism of the probe card according to the first aspect of the invention, wherein the drive mechanism includes a ball screw that is screwed to the moving body and a motor that drives the ball screw. Parallel adjustment of the probe card as described in claim 1 or 2 of the patent application The whole mechanism, wherein the lifting guide mechanism for guiding the lifting body is provided. The parallel adjustment mechanism of the probe card according to the first or second aspect of the invention, wherein the moving body and the lifting system that are engaged with each other are engaged with each inclined surface to form a rectangular block. A probe inspection device includes: a mounting table on which an object to be inspected is placed; a probe card disposed above the mounting table; and a top plate to which the probe card is attached; and four support columns; The top plate is supported at four corners; and the parallel adjustment mechanism of the probe card is configured to lift and lower the top plate at at least three of the four support columns, and adjust the probe card and the lower portion thereof The parallelism of the object to be inspected on the mounting table is characterized in that the parallel adjustment mechanism includes an elevating mechanism interposed between the support post and the top plate of the at least three places, and the elevating mechanism has a movement having an inclined surface a body that is disposed to be movable along an upper surface of the support column; a lifting body coupled to the top plate and configured to be movable up and down along an inclined surface of the moving body; and a driving mechanism The moving body moves along the upper surface of the support column, at a boundary between the support column and the moving body, and the moving body Each of the inclined surface and the inclined surface of the elevating body has a movement guiding mechanism, the movement guiding mechanism has a cross roller, and the parallel adjustment mechanism has an elevating guide that elevates and guides the moving body, and the elevating guiding mechanism has a cross roller. The probe inspection device according to claim 5, wherein the drive mechanism includes a ball screw that is screwed to the moving body and a motor that drives the ball screw. The probe inspection device according to claim 5, wherein the elevation guide mechanism for guiding the elevation body is provided. The probe inspection device according to the invention of claim 5, wherein the moving body and the lifting system that are engaged with each other are engaged with each inclined surface to form a rectangular block.