TWI383152B - Detection device - Google Patents

Detection device Download PDF

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Publication number
TWI383152B
TWI383152B TW098111173A TW98111173A TWI383152B TW I383152 B TWI383152 B TW I383152B TW 098111173 A TW098111173 A TW 098111173A TW 98111173 A TW98111173 A TW 98111173A TW I383152 B TWI383152 B TW I383152B
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Taiwan
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detecting device
disposed
rail
wedge block
wedge
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TW098111173A
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Chinese (zh)
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TW201037316A (en
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Tien Te Yang
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Mjc Probe Inc
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Description

探測裝置Detection device

本發明係有關於一種探測裝置,尤指一種用於半導體及發光二極體的探測裝置。The invention relates to a detecting device, in particular to a detecting device for a semiconductor and a light emitting diode.

半導體及發光二極體製造主要可分成積體電路設計(1C Design)、晶圓製程(Wafer Fabrication)、晶圓測試(Wafer Probe)及晶圓封裝(Packaging)等主要製程,而晶圓必須經過多次測試,例如電路導通狀態、老化、高溫等測試方能確保其品質。其中,探測裝置即是用以探測晶圓。Semiconductor and LED manufacturing can be divided into main processes such as 1C Design, Wafer Fabrication, Wafer Probe and Packaging. Multiple tests, such as circuit conduction, aging, high temperature, etc., can ensure their quality. The detecting device is used to detect the wafer.

請參閱第一圖所示一種習知探測裝置之結構示意圖,該晶圓探測裝置10具有一支撐架11,於該支撐架11頂部設有一探針卡12,於該探針卡12底部設有複數探針121,該晶圓探測裝置10內設有一承載台13,再於該承載台13上擺置晶圓15,該承載台13可作X、Y、Z三軸移動,以調整晶圓15位置,並驅動該晶圓15上升與探針121接觸。Referring to the structure of the conventional detecting device shown in FIG. 1 , the wafer detecting device 10 has a support frame 11 , and a probe card 12 is disposed on the top of the support frame 11 , and the probe card 12 is disposed at the bottom of the probe card 12 . A plurality of probes 121 are disposed in the wafer detecting device 10, and a loading platform 13 is disposed on the loading platform 13. The loading platform 13 can be moved in three axes of X, Y, and Z to adjust the wafer. At the 15 position, the wafer 15 is driven to rise in contact with the probe 121.

理想狀況下,當承載台13驅動晶圓15上升時,該複數探針121應可與相對應晶圓15上之接觸墊(圖中未示出)同時接觸,以對晶圓15進行測試,為調整該承載台13與探針121間之平行度,一般業者係將該承載台13設置於複數導螺桿131上,再以鑄件將承載台13及導螺桿131包設為一體,為了平穩支撐該承載台13,至少必須設置四支導螺桿131,因此體積龐大、佔空間,而該導螺桿131之調 整方式複雜、困難且耗時,此外,該導螺桿131通常藉由馬達及皮帶驅動,而皮帶存在撓性問題,當皮帶承受高荷重時,則會影響實際調整高度之準確度。再者,若導螺桿131本身的支撐強度不足,將造成導螺桿131變形,影響承載台13的平面度。最後則是導螺桿131的可靠度不佳,容易造成承載台13平面度的精度下降。Ideally, when the carrier 13 drives the wafer 15 to rise, the plurality of probes 121 should be in contact with the contact pads (not shown) on the corresponding wafer 15 to test the wafer 15 . In order to adjust the parallelism between the carrier 13 and the probe 121, the carrier 13 is generally disposed on the plurality of lead screws 131, and the carrier 13 and the lead screw 131 are integrally formed by castings for smooth support. The loading platform 13 must have at least four lead screws 131, so that it is bulky and takes up space, and the lead screw 131 is adjusted. The whole method is complicated, difficult and time consuming. In addition, the lead screw 131 is usually driven by a motor and a belt, and the belt has a problem of flexibility. When the belt is subjected to a high load, the accuracy of the actual height adjustment is affected. Further, if the support strength of the lead screw 131 itself is insufficient, the lead screw 131 is deformed to affect the flatness of the stage 13. Finally, the reliability of the lead screw 131 is not good, and the accuracy of the flatness of the stage 13 is likely to be lowered.

就專利而言,已知中華民國發明專利申請第91133971號「於半導體自動化晶圓測試中確保探針卡對晶圓平行之一致性裝置與方法,探針卡量測系統,及探針卡之製造」,該案揭露一種利用光學標靶偵測探針與晶圓平行度之技術手段,然而該方法與系統之成本極高。As far as patents are concerned, the Republic of China Invention Patent Application No. 91133971 is known as a device and method for ensuring the consistency of a probe card to a wafer in a semiconductor automated wafer test, a probe card measurement system, and a probe card. Manufactured, the method discloses a technique for detecting the parallelism of a probe and a wafer by using an optical target, but the method and the system are extremely expensive.

有鑑於習知技術之缺失,本發明提出一種探測裝置,可提高承載台荷重能力,避免變形,且有利於調整承載台平行度。In view of the lack of the prior art, the present invention provides a detecting device which can improve the load capacity of the loading platform, avoid deformation, and is advantageous for adjusting the parallelism of the loading platform.

為達到上述目的,本發明提出一種探測裝置,其主要係由一底座、一楔形塊、一限位結構、一承載台、一滑軌組及一驅動裝置構成,該楔形塊係設置在該底座上,該限位結構係設置於該底座的一側,該承載台具有一承載支座,該承載支座設置於該限位結構上,用以限制該承載支座的垂直位移,該滑軌組係設置於該承載支座及該楔形塊之間,該驅動裝置係用以驅動該楔形塊水平位移,並藉由該滑軌組帶動該承載支座的垂直位移。In order to achieve the above object, the present invention provides a detecting device, which is mainly composed of a base, a wedge block, a limiting structure, a carrying platform, a sliding rail group and a driving device, and the wedge block is disposed on the base. The limiting structure is disposed on one side of the base, and the loading platform has a bearing support, and the bearing support is disposed on the limiting structure to limit vertical displacement of the bearing support, the sliding rail The assembly is disposed between the bearing support and the wedge block, and the driving device is configured to drive the wedge block horizontal displacement, and the vertical displacement of the bearing support is driven by the sliding rail group.

為使 貴審查委員對於本發明之結構目的和功效有更 進一步之了解與認同,茲配合圖示詳細說明如后。In order for your review board to have more structural purpose and efficacy for the present invention Further understanding and approval, as detailed with the illustrations as follows.

以下將參照隨附之圖式來描述本發明為達成目的所使用的技術手段與功效,而以下圖式所列舉之實施例僅為輔助說明,以利 貴審查委員瞭解,但本案之技術手段並不限於所列舉圖式。The technical means and efficacy of the present invention for achieving the object will be described below with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, and are to be understood by the reviewing committee, but the technical means of the present invention are not Limited to the listed figures.

請參閱第二圖至第四圖所示,本發明所提出之探測裝置20實施例結構,其包含一底座21、一楔形塊22、一限位結構23、一承載台24以及一滑軌組25。Referring to the second to fourth embodiments, the structure of the detecting device 20 of the present invention comprises a base 21, a wedge block 22, a limiting structure 23, a carrying platform 24 and a sliding rail set. 25.

在底座21上設置楔形塊22,以供楔形塊22在底座21進行水平位移。限位結構23係設置在底座21的一側,並固定於底座21上。承載台24包含一承載座241及一承載支座242兩部分,承載座241固定設置於承載支座242之頂部,承載支座242的一側設置在限位結構23上。而滑軌組25則設置在楔形塊22及承載支座242之間。A wedge block 22 is provided on the base 21 for horizontal displacement of the wedge block 22 at the base 21. The limiting structure 23 is disposed on one side of the base 21 and is fixed to the base 21. The carrier 24 includes a carrier 241 and a carrier 242. The carrier 241 is fixedly disposed on the top of the carrier 242. One side of the carrier 242 is disposed on the limiting structure 23. The rail set 25 is disposed between the wedge block 22 and the carrier mount 242.

在底座21上設置一滑軌組26,以供楔形塊22設置於底座21上,滑軌組26係由可相互配合且相對滑動之第一導軌26a及第二導軌26b構成,其中第一導軌26a係設置於底座21上,第二導軌26b係設置於楔形塊22底部,透過滑軌組26之設置,可使楔形塊22進行水平位移,即平行底座21方向的位移。滑軌組26之設置數量無一定限制,但以對稱為佳,例如本實施例設置有二組滑軌組26,且兩組滑軌組26係對稱設置於限位結構23之兩側(如第四圖所示)。滑軌組26之種類或型態並無限制,可採用負載能力、 精度及穩定性高之滾珠滑軌(Roller Linear Slide),或一鳩形軌與一鳩形槽搭配形成。A slide rail group 26 is disposed on the base 21 for the wedge block 22 to be disposed on the base 21. The slide rail group 26 is composed of a first rail 26a and a second rail 26b that can cooperate with each other and slide relative to each other, wherein the first rail The 26a is disposed on the base 21, and the second guide rail 26b is disposed at the bottom of the wedge block 22. Through the arrangement of the slide rail group 26, the wedge block 22 can be horizontally displaced, that is, displaced in the direction of the parallel base 21. The number of the slide rails 26 is not limited, but it is preferably a pair. For example, the two sets of slide rails 26 are disposed in the embodiment, and the two sets of the slide rails 26 are symmetrically disposed on both sides of the limit structure 23 (eg, The fourth picture shows). The type or type of the slide rail group 26 is not limited, and the load capacity, A Roller Linear Slide with high precision and stability, or a 鸠-shaped rail formed with a 鸠-shaped groove.

由於承載支座242的一側設置在限位結構23上,即限位結構23係設於承載支座242外側,可以限制承載支座242的垂直位移不致產生水平位移,所以承載台24只能進行垂直位移。限位結構23之種類或設置型態並無一定限制,限位結構23可為一固定塊,或可於限位結構23與承載支座242相對應面之間設置可相互配合之滑軌,且滑軌之移動方向係垂直於承載台24之承載座241,例如可採用負載能力、精度及穩定性高之滾珠滑軌,或一鳩形軌與一鳩形槽搭配形成。Since the side of the bearing support 242 is disposed on the limiting structure 23, that is, the limiting structure 23 is disposed outside the bearing support 242, the vertical displacement of the bearing support 242 can be restricted from causing horizontal displacement, so the carrying platform 24 can only Perform vertical displacement. The type or setting of the limiting structure 23 is not limited. The limiting structure 23 can be a fixed block, or a sliding rail can be arranged between the limiting structure 23 and the corresponding surface of the bearing support 242. Moreover, the moving direction of the sliding rail is perpendicular to the bearing base 241 of the carrying platform 24, for example, a ball bearing rail with high load capacity, high precision and stability, or a sinuous rail can be formed with a sinuous groove.

限位結構23不會隨著楔形塊22及承載台24移動,藉由限位結構23之設置,可限制承載支座242無法產生水平位移,亦即,承載台24只能做垂直向高度調整,亦即第三圖所示該方向C;必須強調說明的是,承載台24之高度調整範圍極小,不至於產生因為承載支座242水平位移距離過大而導致限位結構23變形之狀況。The limiting structure 23 does not move along with the wedge block 22 and the carrying platform 24. By the setting of the limiting structure 23, the horizontal displacement of the bearing support 242 can be restricted, that is, the carrying platform 24 can only be adjusted vertically. That is, the direction C shown in the third figure; it must be emphasized that the height adjustment range of the carrying platform 24 is extremely small, so that the deformation of the limiting structure 23 due to the excessive horizontal displacement distance of the bearing support 242 is not generated.

承載台24的承載座241係用以承載欲探測物件,當承載台24應用於晶圓探測時,晶圓放置於承載座241上,而承載支座242進行垂直方向的位移,以與探測裝置20頂部設置的探針卡(圖中未示出)接觸進行晶圓探測。本發明適用於各種高荷重且水平度要求嚴格之探測裝置承載台,並不限於晶圓探測裝置。The carrier 241 of the carrier 24 is used to carry the object to be detected. When the carrier 24 is applied to the wafer, the wafer is placed on the carrier 241, and the carrier 242 is vertically displaced to the detecting device. A probe card (not shown) disposed at the top of the 20 contacts the wafer for probing. The invention is applicable to various probe device carriers with high load and strict horizontality, and is not limited to the wafer detecting device.

承載支座242呈現上寬下窄之楔形,楔形塊22呈現上窄下寬之楔形,承載支座242具有一第一斜面281,楔形 塊22具有一第二斜面282,第一斜面281大致抵接於第二斜面282,即第一斜面281係與第二斜面282相互抵靠。楔形塊22連接一驅動裝置27,藉由滑軌組26的設置,驅動裝置27可驅動楔形塊22往復移動,驅動裝置27可採用馬達、導螺桿或皮帶、鏈條等裝置,但不限於此。The bearing support 242 has a wedge shape with an upper width and a lower width, and the wedge block 22 has a wedge shape with a narrow upper and a lower width. The bearing support 242 has a first inclined surface 281 and a wedge shape. The block 22 has a second inclined surface 282. The first inclined surface 281 abuts against the second inclined surface 282, that is, the first inclined surface 281 and the second inclined surface 282 abut each other. The wedge block 22 is connected to a driving device 27. The driving device 27 can drive the wedge block 22 to reciprocate by the arrangement of the slide rail group 26. The driving device 27 can be a motor, a lead screw or a belt, a chain or the like, but is not limited thereto.

滑軌組25係由可相互配合且相對滑動之第一導軌25a及第二導軌25b構成,滑軌組25係設置於承載支座242及楔形塊22之間,其中第一導軌25a係設置於承載支座242底部,第二導軌25b係設置於楔形塊22頂部,透過滑軌組25之設置,可使承載支座242與楔形塊22進行相對運動,且該運動方向係大致平行於第一斜面281或第二斜面282之斜度(亦即如第三圖所示的方向B);滑軌組25之設置數量無一定限制,但以對稱為佳,例如本實施例設置有二組滑軌組25,且兩組滑軌組25係對稱設置於限位結構23之兩側(如第四圖所示)。如第三圖所示,當驅動裝置27驅動楔形塊22沿方向A移動時,可同歩帶動承載支座242沿方向B移動,方向B具有一斜度,因此會使得承載支座242於移動過程中同時產生水平及垂直位移,由於限位結構23與承載支座242相對應面之間設置,使承載支座242於移動過程中帶動承載座241沿方向C移動,滑軌組25之種類或型態並無限制,可採用負載能力、精度及穩定性高之滾珠滑軌,或一鳩形軌與一鳩形槽搭配形成。The rail group 25 is composed of a first rail 25a and a second rail 25b which are slidably coupled to each other. The rail group 25 is disposed between the bearing bracket 242 and the wedge block 22, wherein the first rail 25a is disposed on the rail The second rail 25b is disposed on the bottom of the support block 242, and the second rail 25b is disposed on the top of the wedge block 22. Through the arrangement of the slide rail group 25, the bearing support 242 and the wedge block 22 can be moved relative to each other, and the movement direction is substantially parallel to the first The slope of the slope 281 or the second slope 282 (that is, the direction B as shown in the third figure); the number of the slide rails 25 is not limited, but is preferably referred to as a pair, for example, two sets of slips are provided in this embodiment. The rail set 25, and the two sets of the slide rails 25 are symmetrically disposed on both sides of the limiting structure 23 (as shown in the fourth figure). As shown in the third figure, when the driving device 27 drives the wedge block 22 to move in the direction A, the carrier holder 242 can be driven to move in the direction B, and the direction B has a slope, thereby causing the carrier holder 242 to move. The horizontal and vertical displacements are simultaneously generated in the process. Since the limiting structure 23 is disposed between the corresponding surface of the bearing support 242, the bearing support 242 moves the bearing base 241 in the direction C during the moving process, and the types of the sliding rail group 25 are moved. There is no limitation on the type or the shape, the ball slide rail with high load capacity, precision and stability, or a 鸠-shaped rail can be formed with a 鸠-shaped groove.

其次,綜上所述,本發明提供之探測裝置,由於承載支座及楔形塊的設計並搭配滑軌組,確實可提高承載台荷重能力,避免變形,且有利於調整承載台平行度。Secondly, in summary, the detecting device provided by the present invention can improve the load capacity of the loading platform, avoid deformation, and facilitate the adjustment of the parallelism of the loading platform due to the design of the bearing support and the wedge block and the combination of the sliding rail group.

惟以上所述者,僅為本發明之實施例而已,當不能以之限定本發明所實施之範圍。即大凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬於本發明專利涵蓋之範圍內,謹請 貴審查委員明鑑,並祈惠准,是所至禱。However, the above description is only for the embodiments of the present invention, and the scope of the invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. I would like to ask your review committee to give a clear explanation and pray for it.

10‧‧‧晶圓探測裝置10‧‧‧Wafer detector

11‧‧‧支撐架11‧‧‧Support frame

12‧‧‧探針卡12‧‧‧ Probe Card

121‧‧‧探針121‧‧‧Probe

13‧‧‧承載台13‧‧‧Loading station

131‧‧‧導螺桿131‧‧‧ lead screw

15‧‧‧晶圓15‧‧‧ wafer

20‧‧‧探測裝置20‧‧‧Detector

21‧‧‧底座21‧‧‧Base

22‧‧‧楔形塊22‧‧‧ wedge block

23‧‧‧限位結構23‧‧‧Limited structure

24‧‧‧承載台24‧‧‧Loading station

241‧‧‧承載座241‧‧‧ bearing seat

242‧‧‧承載支座242‧‧‧ bearing bearing

25‧‧‧滑軌組25‧‧‧Slide group

25a‧‧‧第一導執25a‧‧‧First Steering

25b‧‧‧第二導軌25b‧‧‧Second rail

26‧‧‧滑軌組26‧‧‧Slide group

26a‧‧‧第一導軌26a‧‧‧First rail

26b‧‧‧第二導軌26b‧‧‧Second rail

27‧‧‧驅動裝置27‧‧‧ drive

281‧‧‧第一斜面281‧‧‧ first slope

282‧‧‧第二斜面282‧‧‧second bevel

A、B、C‧‧‧方向A, B, C‧‧‧ directions

第一圖係習知探測裝置之結構示意圖。The first figure is a schematic structural view of a conventional detecting device.

第二圖係本發明實施例之立體結構圖。The second drawing is a perspective structural view of an embodiment of the present invention.

第三圖係第二圖之前視圖。The third figure is the front view of the second figure.

第四圖係第二圖之右側視圖。The fourth figure is the right side view of the second figure.

20‧‧‧探測裝置20‧‧‧Detector

21‧‧‧底座21‧‧‧Base

22‧‧‧楔形塊22‧‧‧ wedge block

23‧‧‧限位結構23‧‧‧Limited structure

24‧‧‧承載台24‧‧‧Loading station

241‧‧‧承載座241‧‧‧ bearing seat

242‧‧‧承載支座242‧‧‧ bearing bearing

25‧‧‧滑軌組25‧‧‧Slide group

25a‧‧‧第一導軌25a‧‧‧First rail

25b‧‧‧第二導軌25b‧‧‧Second rail

26‧‧‧滑軌組26‧‧‧Slide group

26a‧‧‧第一導軌26a‧‧‧First rail

26b‧‧‧第二導軌26b‧‧‧Second rail

27‧‧‧驅動裝置27‧‧‧ drive

281‧‧‧第一斜面281‧‧‧ first slope

282‧‧‧第二斜面282‧‧‧second bevel

Claims (10)

一種探測裝置,包含:一底座;一楔形塊,設置在該底座上;一限位結構,設置於該底座的一側;一承載台,具有一承載支座,該承載支座設置於該限位結構上,用以限制該承載支座的垂直位移,該承載支座具有一第一斜面,該楔形塊具有一第二斜面,該第一斜面係與該第二斜面相互抵靠;一滑軌組,設置於該承載支座及該楔形塊之間;一驅動裝置,用以驅動該楔形塊水平位移,並藉由該滑軌組帶動該承載支座的垂直位移。 A detecting device comprises: a base; a wedge block disposed on the base; a limiting structure disposed on one side of the base; a carrying platform having a bearing support, the bearing support being disposed at the limit The positioning structure is configured to limit the vertical displacement of the bearing support, the bearing support has a first inclined surface, the wedge shaped block has a second inclined surface, and the first inclined surface and the second inclined surface abut each other; a rail assembly is disposed between the bearing bracket and the wedge block; a driving device is configured to drive the wedge block horizontal displacement, and the vertical displacement of the bearing bracket is driven by the rail group. 如申請專利範圍第1項所述之探測裝置,其中該承載支座係為楔形支座。 The detecting device of claim 1, wherein the bearing support is a wedge-shaped support. 如申請專利範圍第1項所述之探測裝置,其中該滑軌組為一滾珠滑軌。 The detecting device of claim 1, wherein the sliding rail group is a ball bearing rail. 如申請專利範圍第1項所述之探測裝置,其中該滑軌組為一鳩形軌與一鳩形槽搭配形成。 The detecting device of claim 1, wherein the sliding rail group is formed by a 鸠-shaped rail and a 鸠-shaped groove. 如申請專利範圍第1項所述之探測裝置,其中該底座具有一第二滑軌組,以供該楔形塊設置在該第二滑軌組上。 The detecting device of claim 1, wherein the base has a second set of slides for the wedge block to be disposed on the second set of slides. 如申請專利範圍第5項所述之探測裝置,其中該第二滑軌組為一滾珠滑軌。 The detecting device of claim 5, wherein the second sliding rail group is a ball bearing rail. 如申請專利範圍第5項所述之探測裝置,其中該第二滑軌組為一鳩形軌與一鳩形槽搭配形成。 The detecting device of claim 5, wherein the second sliding rail group is formed by a 鸠-shaped rail and a 鸠-shaped groove. 如申請專利範圍第1項所述之探測裝置,其中該限位結 構係設於該承載支座外側。 The detecting device according to claim 1, wherein the limiting knot The structure is disposed outside the bearing support. 如申請專利範圍第2項所述之探測裝置,其中該楔形支座呈現上寬下窄之楔形,該楔形塊呈現上窄下寬之楔形。 The detecting device of claim 2, wherein the wedge-shaped support has a wedge shape with an upper width and a lower width, and the wedge block has a wedge shape with a narrow upper and a lower width. 如申請專利範圍第1項所述之探測裝置,其中該限位結構為滑軌。 The detecting device of claim 1, wherein the limiting structure is a sliding rail.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW330917B (en) * 1996-05-31 1998-05-01 Memc Electronic Materials Spa Automated wafer lapping system
TW200618059A (en) * 2004-06-29 2006-06-01 Nippon Kogaku Kk Management method, management system, and program
TW200625026A (en) * 2004-12-06 2006-07-16 Nikon Corp Substrate processing method, method of exposure, exposure device and device manufacturing method
TWM317631U (en) * 2007-02-15 2007-08-21 Ching Gu Electronics Co Ltd Water-proof fire detector and base
TW200832084A (en) * 2006-08-31 2008-08-01 Nikon Corp Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW330917B (en) * 1996-05-31 1998-05-01 Memc Electronic Materials Spa Automated wafer lapping system
TW200618059A (en) * 2004-06-29 2006-06-01 Nippon Kogaku Kk Management method, management system, and program
TW200625026A (en) * 2004-12-06 2006-07-16 Nikon Corp Substrate processing method, method of exposure, exposure device and device manufacturing method
TW200832084A (en) * 2006-08-31 2008-08-01 Nikon Corp Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
TWM317631U (en) * 2007-02-15 2007-08-21 Ching Gu Electronics Co Ltd Water-proof fire detector and base

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