KR101008319B1 - Inspection device for semiconductor chip - Google Patents

Inspection device for semiconductor chip Download PDF

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Publication number
KR101008319B1
KR101008319B1 KR1020100064421A KR20100064421A KR101008319B1 KR 101008319 B1 KR101008319 B1 KR 101008319B1 KR 1020100064421 A KR1020100064421 A KR 1020100064421A KR 20100064421 A KR20100064421 A KR 20100064421A KR 101008319 B1 KR101008319 B1 KR 101008319B1
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KR
South Korea
Prior art keywords
semiconductor chip
inspection
base
stage
unit
Prior art date
Application number
KR1020100064421A
Other languages
Korean (ko)
Inventor
장영훈
Original Assignee
(주)앤앤아이테크
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Publication date
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Priority to KR1020100064421A priority Critical patent/KR101008319B1/en
Application granted granted Critical
Publication of KR101008319B1 publication Critical patent/KR101008319B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

PURPOSE: An apparatus for inspecting a semiconductor chip is provided to improve both the flatness and the precision of the semiconductor chip by forming fine absorbent holes on the surface of an inspecting table. CONSTITUTION: A base(100) blocks vibrations generated from the outside. An elevating unit(200) is installed at one side of the base to be elevatable. An X-Y stage(300) moves to the X-axis and the Y-axis using a linear motor. An inspecting table(400) fixes a semiconductor chip by implementing vacuum absorption. A loading-unloading unit(500) loads the semiconductor chip to the inspecting table and unloads the semiconductor chip from the inspecting table.

Description

Inspection device for semiconductor chip

The present invention relates to a semiconductor chip inspection apparatus for loading and unloading a plurality of semiconductor chips in a wafer state and an accurate inspection using an optical system while the movement of the XY stage is made stable and precise.

In general, semiconductor chips are manufactured by cutting a wafer in the form of a round disc. As described above, when dividing into a plurality of semiconductor chips 20 in the wafer state, the dicing tape 22 is attached to the back surface of the wafer as shown in FIGS. 11 and 13, and the wafer ring ( 21).

The semiconductor chip (hereinafter referred to as a semiconductor chip) divided in the state bonded to the dicing tape or bonded to the wafer ring as described above is kept in a wafer shape and stored in a cassette.

Since very fine circuits are formed on the surface of the semiconductor chip, various defects such as foreign matters, scratches, discolorations, etc., which are difficult to visually identify, and cracks generated in the process of cutting the wafer occur.

Therefore, by inspecting the semiconductor chip with a camera, not only the defect can be detected but also the cause of the defect in the manufacturing process can be found and solved.

The present invention is to solve the conventional problem that the loading / unloading of the semiconductor chip is made in stages over several sections, the reliability is lowered because the movement of the X-Y stage using the motor and the gear is not precise.

The present invention is to solve the problem that the precise inspection is difficult because it does not absorb the vibration generated from the outside during the inspection of the semiconductor chip.

The present invention is to solve the conventional problem that the precision is low because the flatness of the base for installing each configuration is low.

The present invention is to solve the conventional problem that the reliability of the inspection is lowered because it is difficult to prevent the position is shifted in the process of placing the semiconductor chip on the inspection table.

The present invention is to solve the conventional problem that is difficult to precise inspection while bending because the vacuum adsorption of the semiconductor chip is partially made in the inspection table.

The present invention is to solve the problem that the reliability is degraded due to the remaining of the defective semiconductor chip because the display of the defect is not made after the inspection of the semiconductor chip.

The semiconductor chip inspection apparatus of the present invention includes a base; A lift unit installed at one side of the base to move up and down at a predetermined height, the lift unit configured to seat a cassette containing a semiconductor chip fixed to a wafer ring in a divided state; An X-Y stage installed at the other side of the base and formed to move in X and Y axes using a linear motor; An inspection table disposed above the X-Y stage and configured to seat the semiconductor chip; A loading / unloading unit disposed between the lifting unit and the X-Y stage, the loading / unloading unit configured to load / unload the semiconductor chip stored in the cassette onto the inspection table; And an inspection unit installed on the other side of the base and inspecting the semiconductor chip seated on the inspection table to detect a defect and to photograph the detected defective portion.

Is installed in the lower portion of the base, the vibration blocking device for blocking the vibration transmitted from the floor; is configured to include.

The base is formed of a stone tablet.

The elevating means of the elevating unit includes a lift table for placing the cassette; A guide configured to vertically penetrate the base in a state coupled to a lower portion of the lift table and to guide the lift; A screw coupled to a lower portion of the platform and installed to vertically penetrate the base; A rotating body coupled to the base and rotating in a state where the screw penetrates and is engaged; And a first electric motor coupled to the base and configured to forward and reverse rotate the rotating body.

And a second electric motor installed under the inspection table and configured to rotate the inspection table 360 degrees forward and backward.

And a porous chuck installed at an upper portion of the inspection table and having a plurality of fine pores for adsorbing and fixing the semiconductor chip.

The gripper is installed on the X-Y stage, the gripper for picking up and going out of the semiconductor chip housed in the cassette while being lifted by the first cylinder formed on one side; A rail which is formed to support both ends of the semiconductor chip for entering and exiting by the gripper, and which is formed to be spread to the left and right by second cylinders installed at both sides; And a picker installed at an upper portion of the rail, the picker being configured to vacuum-suck the semiconductor chip by a third cylinder to be transferred to the rail or an inspection table.

The inspection unit includes an alignment camera for reading the alignment and position of the wafer ring; And a line scan camera for inspecting a circuit formed in each sector of the wafer ring to detect a bad sector.

The alignment camera is configured to move the X-Y stage, rotate the inspection table to correct alignment of the semiconductor chip, and to enlarge and photograph the semiconductor chip to be transferred to the screen.

And a marking head for marking a defective portion of the semiconductor chip detected by the line scan camera.

According to the semiconductor chip inspection device of the present invention, the loading / unloading of the semiconductor chip is performed in one section, and the movement of the semiconductor chip is precisely performed by using an XY stage using a linear motor, thereby greatly improving stability and precision. It is effective.

According to the semiconductor chip inspection device of the present invention by installing a vibration blocking device in the lower base to block the vibration transmitted from the outside, there is an effect that a more precise inspection is performed.

According to the semiconductor chip inspection device of the present invention, by forming the base into a stone plate, there is an effect of improving the flatness and precision for installing each configuration.

According to the semiconductor chip inspection apparatus of the present invention, the accuracy of the inspection is improved by determining an accurate inspection area by using an alignment camera and forming the inspection table to rotate 360 degrees.

According to the semiconductor chip inspection apparatus of the present invention, by forming fine adsorption pores on the surface of the inspection table, it is possible to precisely inspect the semiconductor chip while maintaining the flatness of the semiconductor chip.

According to the semiconductor chip inspection apparatus of the present invention, the marking head is formed so as to display the defects, so that the defects can be easily removed without missing the defects.

1 and 2 are a perspective view showing a semiconductor chip inspection device to which the present invention is applied.
Figure 3 is a front view showing a semiconductor chip inspection device to which the present invention is applied.
Figure 4 is a plan view showing a semiconductor chip inspection device to which the present invention is applied.
5 is a partial front cross-sectional view showing a semiconductor chip inspection device to which the present invention is applied.
Figure 6 is a perspective view of the XY stage and the inspection unit to which the present invention is applied.
7 is a plan view showing the operation of the XY stage to which the present invention is applied.
8 is a cross-sectional view showing an examination table to which the present invention is applied.
Figure 9 is a perspective view showing the operation of the gripper to which the present invention is applied.
Figure 10 is a side cross-sectional view showing the operation of the rail to which the present invention is applied.
Figure 11 is a perspective view showing the operation of the rail to which the present invention is applied.
Figure 12 is a side cross-sectional view showing the operation of the picker to which the present invention is applied.
Figure 13 is a plan view showing the alignment of the inspection unit and the semiconductor chip to which the present invention is applied.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 to 13, the semiconductor chip inspecting apparatus of the present invention has a base 100, an elevating unit 200 for elevating a cassette containing the semiconductor chip, and an XY stage 300 driven by a linear motor. ), An inspection table 400 for adsorption-fixing the semiconductor chip, a loading / unloading unit 500 for loading / unloading the semiconductor chip between the lift unit and the inspection table, and the semiconductor chip fixed to the inspection table. It consists of an inspection unit 600 for inspecting.

Here, the semiconductor chip 20 is fixed to the wafer ring in a divided state.

The base 100 is to install the lifting unit 200, the XY stage 300, the loading / unloading unit 500 and the inspection unit 600, to increase the flatness for precise inspection, generated from the outside It is formed to block the vibration.

The base 100 is a vibration blocking device 110 is installed at the bottom as shown in Figures 1 to 3 to block the vibration generated from the outside through the floor. The vibration blocking device 110 blocks the vibration transmitted through the floor using air to the respective bases 100, so that each device on the base 100 operates stably and precisely.

The base 100 is formed of a stone plate. The stone slab is a plate using a stone such as marble or granite (a thick plate for assembly and inspection of mechanical parts), and because it uses a stone such as marble or granite, it is deformed by an external temperature compared to a metal plate. This small, excellent vibration absorption.

The lifting unit 200 is installed on one side of the base 100, and is formed to ascend and raise a predetermined height on one side in a state in which the cassette 10 containing the semiconductor chip 20 is seated.

The lifting unit 200 is configured to allow loading / unloading of the semiconductor chip 20 fixed to the wafer ring in one section, and directly adjusts the height of the cassette 10 to the semiconductor chip at the same height. Allow entry and exit of (20).

As a specific embodiment of the lifting unit 200 as shown in Figures 2 to 5 composed of a lifting platform 210, a guide 220, a screw 230, a rotating body 240 and the first electric motor 250 do.

The lifting platform 210 is for mounting the cassette 10, jig for fixing the cassette 10 is not moved in front, rear, left and right is installed.

The guide 220 is for guiding the lift while preventing the platform 210 from moving back, forth, left, and right, and is installed to vertically penetrate the base 100 in a state coupled to the platform 210. At this time, the base 100 may be coupled to the guide pipe to stably lift the guide 220 in the fitted state.

The screw 230 is for elevating the platform 210, is coupled to the platform 210, and installed in a state that vertically penetrates the base 100.

The rotating body 240 is coupled to the base 100 and is formed to rotate in a state where the screw 230 penetrates.

The first electric motor 250 is coupled to the base 100 to reversely rotate the rotating body 240, and the first electric motor 250 and the rotating body 240 are shown in FIG. 5. They can be connected together by belts or through teeth.

Meanwhile, a sensor is installed at one side of the lifting unit 200 to check whether the semiconductor chip 20 is absent when the cassette 10 is raised or lowered on the lifting table 210.

The X-Y stage 300 is installed on the other side of the base 100 and is formed to move in the X-axis and the Y-axis using a linear motor. That is, the XY stage 300 is formed to move back and forth and left and right as shown in FIGS. 6 and 7, and replaces the existing XY stage using an electric motor and a screw. 300). The linear motor is a motor having a structure that generates a thrust force between a linearly facing mover and a stator, and is used in various precision measuring devices and test devices.

The XY stage 300 moves to a position for loading / unloading the semiconductor chip 20 on the inspection table 400 as shown in FIGS. 6 and 7, or moves the semiconductor chip 20 to the inspection unit. In the state moved to 600 to move in a zigzag to make the inspection.

The inspection table 400 is for seating the semiconductor chip 20 in a state where it is installed on the X-Y stage 300, and fixes the semiconductor chip 20 so as not to move through vacuum adsorption.

The lower portion of the inspection table 400 is provided with a second electric motor 410 formed to be capable of 360 degrees forward and reverse rotation. Since the inspection table 400 rotates freely by the second electric motor 410, when the alignment state of the semiconductor chip 20 is not correct, the inspection table 400 may be properly aligned by driving the second electric motor 410. Precise and stable inspection is possible.

A porous chuck 420 having a plurality of fine pores for adsorptive fixing the semiconductor chip 20 is formed on the inspection table 400. That is, as shown in FIG. 8, a porous chuck 420 formed of fine pores is formed on the upper portion to increase flatness when the semiconductor chip is adsorbed to the inspection table 400, thereby allowing more precise inspection. will be.

The loading / unloading unit 500 is installed between the lifting unit 200 and the XY stage 300, and includes a semiconductor chip 20 fixed to a wafer ring to be accommodated in the cassette 10. And to load / unload 400). That is, since the loading / unloading unit 500 adjusts the position of the cassette 10 by the lifting unit 200, the semiconductor chip 20 enters and exits at the same position, and the inspection table 400 is used. The XY stage 300 is formed to move to the correct position to be loaded / unloaded.

The loading / unloading unit 500 may include, for example, a gripper 510, a rail 520, and a picker 530.

The gripper 510 is installed on the X-Y stage 300 to move the semiconductor chip 20 forward or backward to the cassette 10. That is, the gripper 510 moves along the X-Y stage 300 and then moves the X-Y stage 300 to the right position when loading / unloading the semiconductor chip 20. At this time, the gripper 510 is formed to move up and down relative to the rail 520 by forming a first cylinder 511 on one side as shown in Figs. That is, when the gripper 510 moves along the XY stage 300, the gripper 510 is lowered by the first cylinder 511 so as not to contact the rail 520, and when the semiconductor chip 20 is loaded / unloaded. One cylinder 511 is raised above the rail 520.

The rail 520 is formed so as to support both ends of the semiconductor chip 20 for entering and exiting by the gripper 510, but is formed so as to be opened to the left and right by installing a second cylinder 521 on both sides thereof. . That is, when the semiconductor chip 20 accommodated in the cassette 10 is loaded into the examination table 400, for example, as illustrated in FIGS. 10 and 11, the gripper 510 includes the cassette 10. When the semiconductor chip 20 is removed from the rail 520, the rail 520 is narrowed by the second cylinder 521 so that both ends of the semiconductor chip 20 can be mounted on the rail 520. In the state in which the semiconductor chip 20 mounted on the rail 520 is raised and lowered, the rail 520 is spread from side to side by the second cylinder 521 and the semiconductor chip together with the picker 530. 20 is to be lowered to be placed on the examination table (400). The unloading of the semiconductor chip 20 acts in the reverse order.

The picker 530 is installed on the rail 520, and ascends and lifts the semiconductor chip 20 by the third cylinder 531 to move to the rail 520 or the inspection table 400. Is formed. That is, when the semiconductor chip 20 mounted on the rail 520 is loaded into the inspection table 400, for example, as shown in FIG. 12, the picker 530 may include the third cylinder 531. The first step is lowered by the first to absorb and lift the semiconductor chip 20 mounted on the rail 520, and when the rail 520 is opened, it is lowered second by the third cylinder 531 to the test table ( 400) on the top. As shown in FIG. 12, the third cylinder 531 has two steps of descending at a distance D1 and a distance D2. The unloading of the semiconductor chip 20 acts in the reverse order.

Therefore, according to the loading / unloading unit 500 configured as described above, a series of operations regarding loading and unloading are performed at the position where the gripper 510 removes the semiconductor chip 20 from the cassette 10.

The inspection unit 600 is installed on the other side of the base 100 to inspect the semiconductor chip 20 seated on the inspection table 400. The inspection unit 600 detects defects and photographs the detected defects to screen the screen. It is formed to output through.

As an example of the inspection unit 600, as illustrated in FIG. 6, the inspection unit 600 includes an alignment camera 610 and a line scan camera 620.

The alignment camera 610 is to read the alignment and the position of the semiconductor chip 20, and to correct the inspection position when inspecting the semiconductor chip 20 by checking that the semiconductor chip 20 is distorted for precise inspection. Correction of the inspection position by the alignment camera 610, for example, as shown in FIG. 13 moves the XY stage 300 and rotates the inspection table 400 to align the semiconductor chip 20. The state can be corrected. In addition, the alignment camera 610 enlarges the semiconductor chip 20 and transmits the image to the screen, thereby outputting the state of the semiconductor chip 20 through the screen.

The line scan camera 620 detects a defect by inspecting a circuit formed in each sector of the semiconductor chip 20 so that it can be removed later.

Meanwhile, the present invention includes a marking head 700 for displaying a defect on the semiconductor chip 20 detected by the line scan camera 620 together with the inspection unit 600. The marking head 700 may mark the defective portion with ink, so that the defective sector may be removed using a pickup tool if necessary.

Looking at a series of processes for inspecting the semiconductor chip 20 through the configuration of the present invention as follows.

When the operator places the cassette 10 containing the semiconductor chip 20 on the lifting unit 200, the lifting unit 200 moves inside the cassette 10 while moving from the top to the bottom or from the bottom to the top. The absence of the semiconductor chip 20 is checked.

When the cassette 10 is raised on the lifting unit 200, a loading is performed to place the semiconductor chip 20 on the test table 400 using the loading / unloading unit 500. Move the XY stage 300 so that the gripper 510 of the loading / unloading unit 500 is positioned in front of the cassette 10. When the gripper 510 is raised, the XY stage 300 moves forward. And while reversing, the gripper 510 picks up the semiconductor chip 20, pulls it out of the cassette, and places it on the rail 520. In the state where the semiconductor chip 20 is placed on the rail 520, the gripper 510 is lowered and the XY stage 300 is advanced so that the test table 400 is positioned at the lower portion of the semiconductor chip 20. Do it. When the picker 530 descends to absorb and raise the semiconductor chip 20 mounted on the rail 520, the rail 520 opens to the left and right, and the picker 530 descends to the semiconductor chip 20. The 20 is placed on the examination table 400 and then climbs.

When the loading process is completed, the inspection of the defect through the inspection unit 600 is performed. After the XY stage 300 is driven to move the inspection table 400 to the alignment camera 610 of the inspection unit 600, the alignment and mounting ranges of the semiconductor chip 20 are read, and the twisted angle and distance The inspection table 400 is rotated as much or the XY stage 300 is moved to correct the position. When the correction is completed, the XY stage 300 is driven to move the examination table 400 to the line scan camera 620, and the XY stage 300 moves in a zigzag and through the license scan camera 620. The semiconductor chip 20 is inspected.

When the inspection is completed, the X-Y stage 300 is driven so that the detected defect is positioned on the marking head 700 and then displayed using ink.

When the display of the bad sector is completed, unloading is performed to push the completed semiconductor chip 20 into the cassette 10. The XY stage 300 is driven so that the examination table 400 is positioned under the picker 530 of the loading / unloading unit 500. When the picker 530 is lowered to lift the semiconductor chip 20 mounted on the inspection table 400, the widths of the rails 520 on both sides are narrowed, and the picker 530 is the rails 520. The semiconductor chip 20 is placed on it. The XY stage 300 retreats, the gripper 510 is raised to pick up the semiconductor chip 20 mounted on the rail 520, and the XY stage 300 moves forward to store the wafer ring in the cassette. .

According to the present invention having the above configuration, the loading / unloading of the semiconductor chip 20 is performed in one section, and the movement of the semiconductor chip 20 is precisely performed by using the XY stage 300 using a linear motor. As a result, stability and precision are greatly improved.

In addition, according to the present invention by installing the vibration blocking device 110 in the lower portion of the base 100 to block the vibration transmitted from the outside, a more precise inspection is made, by forming the base 100 as a stone plate, The flatness and precision for installing each component can be improved.

In addition, according to the present invention by using the alignment camera 610 to determine the correct inspection area and to form the inspection table 400 to rotate 360 degrees, the accuracy of the inspection is improved, the surface fine adsorption of the inspection table 400 By forming pores, the semiconductor chip 20 can be inspected precisely while maintaining the flatness of the semiconductor chip 20.

In addition, according to the present invention, by marking the marking head 700 to display the defect, it can be easily removed without missing the defect.

10: cassette 20: semiconductor chip
100: base 110: vibration blocking device
200: elevator 210: platform
220: guide 230: screw
240: rotating body 250: first electric motor
260: sensor
300: XY stage
400: inspection table 410: second electric motor
420: Fors Chuck
500: loading / unloading unit 510: gripper
511: first cylinder 520: rail
521: second cylinder 530: picker
531: third cylinder
600: inspection unit 610: alignment camera
620: line scan camera
700: marking head

Claims (10)

Base;
A lift unit installed at one side of the base to move up and down at a predetermined height, the lift unit configured to seat a cassette containing a semiconductor chip fixed to a wafer ring in a divided state;
An XY stage installed at the other side of the base and formed to move in X and Y axes using a linear motor;
An inspection table disposed above the XY stage and configured to seat the semiconductor chip;
A loading / unloading unit provided between the lifting unit and the XY stage, the loading / unloading unit configured to load / unload the semiconductor chip stored in the cassette onto the inspection table; And
And an inspection unit installed on the other side of the base and detecting the defect by inspecting the semiconductor chip seated on the inspection table, and photographing the detected defective portion.
Lifting means of the lifting unit,
Platform for placing the cassette;
A guide configured to vertically penetrate the base in a state coupled to a lower portion of the lift table and to guide the lift;
A screw coupled to a lower portion of the platform and installed to vertically penetrate the base;
A rotating body coupled to the base and rotating in a state where the screw penetrates and is engaged; And
And a first electric motor coupled to the base and configured to forward and reverse rotate the rotating body.
The semiconductor chip inspection apparatus according to claim 1, further comprising: a vibration blocking device installed at a lower portion of the base to block vibration transmitted from the floor.
The semiconductor chip inspection apparatus according to claim 1 or 2, wherein the base is formed of a stone plate.
delete The semiconductor chip inspection apparatus according to claim 1, further comprising: a second electric motor provided below the inspection table and configured to rotate the inspection table 360 degrees forward and backward.
The semiconductor chip inspection apparatus according to claim 1 or 5, further comprising: a porous chuck installed on an upper portion of the inspection table and having a plurality of minute pores for adsorbing and fixing the semiconductor chip.
The method of claim 1, wherein the loading / unloading unit,
A gripper provided on the XY stage and configured to move the semiconductor chip housed in the cassette while being lifted by a first cylinder formed on one side thereof;
A rail which is formed to support both ends of the semiconductor chip for entering and exiting by the gripper, and which is formed to be spread to the left and right by second cylinders installed at both sides; And
And a picker disposed above the rail and configured to vacuum-suck the semiconductor chip by a third cylinder to move the semiconductor chip to the rail or an inspection table.
The method according to claim 1, wherein the inspection unit,
An alignment camera for reading the alignment and position of the semiconductor chip; And
And a line scan camera for detecting a bad sector by inspecting a circuit formed in each sector of the semiconductor chip.
The method of claim 8, wherein the alignment camera is formed to move the XY stage, rotate the inspection table to correct the alignment of the semiconductor chip,
And an enlarged photograph of the semiconductor chip and transmitted to the screen.
The semiconductor chip inspection apparatus according to claim 8, further comprising a marking head for marking a defective portion of the semiconductor chip detected by the line scan camera.
KR1020100064421A 2010-07-05 2010-07-05 Inspection device for semiconductor chip KR101008319B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101082781B1 (en) * 2011-04-27 2011-11-14 (주)큐엠씨 Semiconductor chip test apparatus
KR101350012B1 (en) 2011-07-20 2014-01-14 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser scribe device
EP4102547A4 (en) * 2020-02-18 2024-03-20 Hamamatsu Photonics Kk Semiconductor failure analysis device and semiconductor failure analysis method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250558A (en) * 1995-03-10 1996-09-27 Tokyo Seimitsu Co Ltd Wafer prober
JPH09199451A (en) * 1996-01-12 1997-07-31 Disco Abrasive Syst Ltd Method and device for dicing
JP2000021955A (en) * 1998-06-27 2000-01-21 Yaskawa Electric Corp Visual inspection apparatus for semiconductor wafer
JP2004152916A (en) * 2002-10-29 2004-05-27 Nec Corp Inspecting device and inspecting method of semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250558A (en) * 1995-03-10 1996-09-27 Tokyo Seimitsu Co Ltd Wafer prober
JPH09199451A (en) * 1996-01-12 1997-07-31 Disco Abrasive Syst Ltd Method and device for dicing
JP2000021955A (en) * 1998-06-27 2000-01-21 Yaskawa Electric Corp Visual inspection apparatus for semiconductor wafer
JP2004152916A (en) * 2002-10-29 2004-05-27 Nec Corp Inspecting device and inspecting method of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101082781B1 (en) * 2011-04-27 2011-11-14 (주)큐엠씨 Semiconductor chip test apparatus
KR101350012B1 (en) 2011-07-20 2014-01-14 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser scribe device
EP4102547A4 (en) * 2020-02-18 2024-03-20 Hamamatsu Photonics Kk Semiconductor failure analysis device and semiconductor failure analysis method

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