CN115394706B - Wafer loading device and use method - Google Patents
Wafer loading device and use method Download PDFInfo
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- CN115394706B CN115394706B CN202211182180.0A CN202211182180A CN115394706B CN 115394706 B CN115394706 B CN 115394706B CN 202211182180 A CN202211182180 A CN 202211182180A CN 115394706 B CN115394706 B CN 115394706B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a wafer loading device which comprises a chassis, and a stepping motor, a motor screw rod, a screw rod nut adapter, a conversion sliding block, a conversion guide rail, a connecting piece and a bearing table component which are connected in sequence; the stepping motor is arranged on the chassis; the conversion guide rail is arranged in a non-parallel manner with the motor screw rod; the stepping motor drives the motor screw rod to rotate so that the screw rod nut in threaded connection with the motor screw rod moves along the motor screw rod, and therefore the conversion sliding block on the screw rod nut adapter piece is driven to move along the conversion guide rail, and further the bearing platform assembly is enabled to displace. The invention can realize the accurate up-and-down movement of the inner bearing table, preventing damage or breakage of wafers during loading.
Description
Technical Field
The present invention relates to a loading device and method of use, and more particularly to a wafer loading apparatus and method of use.
Background
The loading wafer is a step of placing and taking out the wafer in the semiconductor production and detection process, the existing wafer loading device adopts a straight up and down movement mode, the motor shaft directly drives the bearing table (chuck) to move, and the inner bearing table (inner chuck) adopts a three-thimble structure. Such loading devices do not have precise control over the accuracy of the movement, it is possible that the wafer or other nearby mechanical structures may be damaged due to the excessive speed. In addition, the inner carrier may move during loading of the wafer, resulting in loading failure. In addition, the carrying table may have a problem that the table top is not horizontal, so that the wafer slides easily.
Disclosure of Invention
In order to solve the problem that the motion precision cannot be precisely controlled in the vertical direction in the prior art, the invention provides a wafer loading device and a use method thereof.
In a first aspect, the invention provides a wafer loading device, which comprises a chassis, and a stepping motor, a motor screw rod, a screw rod nut adaptor, a conversion sliding block, a conversion guide rail, a connecting piece and a bearing table component which are connected in sequence; the stepping motor is arranged on the chassis; the conversion guide rail is arranged in a non-parallel manner with the motor screw rod;
the stepping motor drives the motor screw rod to rotate so that the screw rod nut in threaded connection with the motor screw rod moves along the motor screw rod, and therefore the conversion sliding block on the screw rod nut adapter piece is driven to move along the conversion guide rail, and further the bearing platform assembly is enabled to displace.
In some embodiments, the conversion slide comprises a first conversion slide and a second conversion slide; the conversion guide rail comprises a first conversion guide rail and a second conversion guide rail which are parallel to each other; the first conversion sliding block is arranged on the first conversion guide rail, and the second conversion sliding block is arranged on the second conversion guide rail; the first conversion sliding block and the second conversion sliding block are connected with the screw nut adapter; the first conversion guide rail and the second conversion guide rail are connected with the bearing table assembly through the connecting piece.
In some embodiments, further comprising a first chassis rail, a first chassis slider, a second chassis rail, and a second chassis slider; the first chassis guide rail and the second chassis guide rail are both arranged on the chassis; the first chassis guide rail and the second chassis guide rail are parallel to the motor screw rod; the first chassis sliding block is arranged on the first chassis guide rail and the lead screw nut adapter, so that the first chassis sliding block moves along the first chassis guide rail under the drive of the lead screw nut adapter; the second chassis sliding block is arranged on the second chassis guide rail and connected with the screw nut, so that the second chassis sliding block moves along the second chassis guide rail under the drive of the screw nut.
In some embodiments, the first chassis rail is disposed at a region where the transition rail and the lead screw nut adapter are perpendicularly projected to the chassis; the second chassis guide rail is arranged in the area where the motor screw rod is perpendicularly projected to the chassis. Thus, the stability of the movement of the conversion guide rail and the conversion sliding block, and the motor screw rod and the screw rod nut is ensured.
In some embodiments, further comprising an auxiliary rail and an auxiliary slider; the auxiliary guide rail is arranged on the chassis, and the auxiliary sliding block is arranged on the auxiliary guide rail; the auxiliary sliding block is connected with the connecting piece, so that the auxiliary sliding block moves along the auxiliary guide rail along with the connecting piece.
In some embodiments, the number of the auxiliary guide rail and the auxiliary slide block is m, and m is greater than 0; when m is more than 1, the auxiliary guide rail and the auxiliary sliding blocks are arranged in a one-to-one correspondence mode, namely 1 auxiliary guide rail corresponds to 1 auxiliary sliding block. In some embodiments m=3.
In some embodiments, a bracket arm is also included; the bearing table assembly comprises a bearing table (chuck) and an inner bearing table (inner chuck) arranged at a hollowed-out part of the bearing table; the first end part of the supporting arm is connected with the chassis, and the second end part of the supporting arm is connected with the bearing table; the inner bearing table is connected with the conversion guide rail through the connecting piece, and then the inner bearing table is displaced along with the position change of the conversion guide rail. In some embodiments, the number of the brackets is 2-10, preferably 3.
In some embodiments, a negative pressure assembly is also included; the negative pressure assembly comprises a negative pressure generating device and a negative pressure pipeline; the negative pressure pipeline comprises a first negative pressure pipeline and a second negative pressure pipeline; the first negative pressure pipeline is arranged on the bearing table and is connected with the negative pressure generating device through a first negative pressure source interface arranged on the bearing table; the second negative pressure pipeline is arranged on the inner bearing table and is connected with the negative pressure generating device through a second negative pressure source interface arranged on the inner bearing table; and negative pressure air ports are arranged on the first negative pressure pipeline and the second negative pressure pipeline. In some embodiments, the inner carrier is of three-pin configuration.
In some embodiments, the side of the bearing platform contacted with the wafer is provided with a concentric groove; the negative pressure air port on the first negative pressure pipeline is arranged at the concentric groove.
In some embodiments, a leveling assembly is also included; the leveling assembly comprises a bracket arm adapter, a leveling sliding block, a precision screw and a leveling sliding block bracket arm; the bracket arm adapter is connected with the second end part of the bracket arm; the first end part of the leveling slider bracket is arranged on the chassis, and the second end part of the leveling slider bracket is provided with the leveling slider and a nut groove;
the screw cap of the precise screw is arranged in the screw cap groove, and the screw rod of the precise screw is inserted into the leveling slide block; the top surface and the bottom surface of the leveling slider are not parallel and are respectively clung to the bottom surface of the bracket adapter and the second end part of the bracket of the leveling slider, so that the precise screw is rotated to drive the leveling slider in threaded connection with the leveling slider to move along the precise screw, the horizontal position of the bracket adapter is finely adjusted, and the horizontal position of the second end part of the bracket is changed to level the bearing table on the bracket.
In some embodiments, a nut portion of the precision screw is disposed within the nut recess, which exposes a portion of the nut recess for turning the precision screw.
In some embodiments, the top surface of the leveling slider is inclined, and the bottom surface of the bracket adapter is inclined, and the two inclination directions are opposite but the angle is the same.
In some embodiments, the number of leveling components is n, the number of the supporting arms is also n, and the leveling components and the supporting arms are matched one by one; n > 0, preferably 2 to 6, or 3.
In some embodiments, the bottom surface of the leveling slider is inclined, and the top surface of the second end of the leveling slider bracket is inclined, and the two inclined directions are opposite but have the same angle.
In some embodiments, the stepper motor is a closed loop stepper motor.
In a second aspect, the present invention also provides a method for using the wafer loading device as described above, including the following steps:
starting the stepping motor to drive the motor screw rod to rotate so that the screw rod nut in threaded connection with the motor screw rod moves along the motor screw rod, driving the conversion sliding block on the screw rod nut adapter to move obliquely downwards along the conversion guide rail, further enabling the inner bearing table to move upwards and continuously close to a wafer brought by a mechanical arm until the wafer is in contact with the inner bearing table, starting a negative pressure air port of the second negative pressure pipeline to provide negative pressure to suck the wafer, and enabling the mechanical arm to be separated from the wafer;
starting the stepping motor to drive the motor screw rod to rotate in the opposite direction so that the screw rod nut in threaded connection with the motor screw rod moves in the opposite direction, driving the conversion sliding block on the screw rod nut adapter to move obliquely upwards along the conversion guide rail, further enabling the inner bearing table to move downwards and continuously close to the bearing table until the wafer is placed on the bearing table, closing the negative pressure of the negative pressure air port of the second negative pressure pipeline, and starting the negative pressure air port of the first negative pressure pipeline to provide negative pressure to suck the wafer.
In some embodiments, the method further comprises the steps of: the precise screw is rotated to drive the leveling slide block in threaded connection with the precise screw to move along the precise screw, and the leveling slide block is respectively clung to the bottom surface of the bracket adapter and the second end part of the bracket of the leveling slide block according to the fact that the top surface and the bottom surface of the leveling slide block are not parallel, so that the horizontal position of the bracket adapter is finely adjusted, and the function of the bearing table is leveled.
The invention has the beneficial effects that:
1. the cooperation of conversion slider, conversion guide rail and other subassemblies, especially conversion guide rail and motor lead screw non-parallel arrangement for the horizontal motion of lead screw nut is converted into the vertical motion of inside plummer. According to the slope of the conversion guide rail relative to the motor screw rod, the proportion of the horizontal motion to the vertical motion can be adjusted, and the adjustment is carried out so as to meet the requirement of the wafer bearing process on accurate and controllable displacement of the internal bearing table. In addition, the closed-loop stepping motor has the characteristic of controllable speed and acceleration, so that the displacement control of the internal bearing table also has controllable speed and acceleration.
2. A first conversion slide block and a first conversion guide rail, a second conversion slide block and a second conversion guide rail, the two sets of conversion sliding block guide rail systems can strengthen the stability of converting horizontal displacement into vertical displacement. Likewise, the addition of the first chassis slide and the first chassis guide rail, and the second chassis slide and the second chassis guide rail further enhances the stability of converting horizontal displacement into vertical displacement, so that related components are more firmly combined with the chassis, and the displacement precision is improved. In addition, the stability of converting horizontal displacement into vertical displacement is further enhanced by adding the auxiliary sliding blocks and the auxiliary guide rails, so that the connecting piece is prevented from shaking in the up-and-down movement process, and the displacement precision and the stability of the wafer loading device are further improved.
3. The negative pressure assembly is beneficial to adsorbing the wafer and avoiding the wafer from moving relative to the bearing table and/or the inner bearing table. When the wafer is placed on the bearing table, the negative pressure of the bearing table is opened, and the negative pressure of the inner bearing table is closed, so that the wafer is protected, and the influence of wafer deformation on a measurement result caused by two groups of negative pressures when the inner bearing table and the bearing table are in different planes is avoided.
4. The negative pressure air port is arranged in the concentric groove, so that the wafer deformation caused by the direct contact of the wafer and the air port is avoided, and meanwhile, the concentric groove is more beneficial to the prevention of the wafer sliding relative to the smooth plane.
5. The leveling assembly facilitates adjusting the carrier to a horizontal position to better receive the wafer and avoid wafer slip. The nut groove in the leveling assembly is used for placing the nut of the precision screw, so that the nut of the precision screw cannot be separated from the nut groove when rotating, and only the leveling sliding block in threaded connection with the precision screw moves along the precision screw.
The invention can realize accurate up-and-down movement, speed control and acceleration control of the internal bearing table, prevent the wafer from being damaged or broken in the loading process, and simultaneously prevent the wafer from being displaced in the loading process.
The conception, specific structure, and technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, features, and effects of the present invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer loading apparatus according to an embodiment of the present invention;
FIG. 2 is an exploded view of a portion of the components of a wafer loading device according to one embodiment of the present invention;
figures 3-5 are views of the motion of parts of a wafer loading apparatus according to one embodiment of the present invention;
FIG. 6 is a top view of a portion of the components of the wafer loading device of one embodiment of the present invention;
FIG. 7 is a top view of a carrier in accordance with one embodiment of the present invention;
FIG. 8 is a bottom view of a carrying platform according to an embodiment of the invention;
figure 9 is a schematic structural view of a leveling assembly according to one embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Fig. 1 to 9 show a wafer loading apparatus and a partial structure of the present embodiment. In this embodiment, the wafer loading device includes a chassis 4, a first chassis rail 18, a first chassis slider 17, a second chassis rail 20, a second chassis slider 19, an auxiliary rail 25, an auxiliary slider 24, a bracket arm 8, a negative pressure assembly, a leveling assembly, and a stepper motor 2, a motor screw 6, a screw nut 3, a screw nut adaptor 16, a conversion slider, a conversion rail, a connector, and a carrier assembly that are sequentially connected.
In this embodiment, the stepper motor 2 is a closed loop stepper motor and is disposed on the chassis 4. The conversion slide comprises a first conversion slide 15 and a second conversion slide 22. The transition rail comprises a first transition rail 14 and a second transition rail 21. The first switch rail 14 and the second switch rail 21 are parallel but not parallel to the motor lead screw 6. The motor screw rod 6 is parallel to the plane of the chassis 4. The connection members include a first connection member 23 and a second connection member 26.
The first conversion slide 15 is arranged on the first conversion guide rail 14, and the second conversion slide 22 is arranged on the second conversion guide rail 21; the first conversion slide 15 and the second conversion slide 22 are each connected to the spindle nut adapter 16.
The bearing table assembly comprises a bearing table 1 and an inner bearing table 13 arranged at the hollowed-out part 103 of the bearing table 1. The first end of the bracket arm 8 is connected to the chassis 4, and the second end of the bracket arm 8 is connected to the carrying table 1. The inner stage 13 is connected to the first link 23 via the second link 26, and is further connected to the first switch rail 14 and the second switch rail 21, and is further displaced according to the positional changes of the first switch rail 14 and the second switch rail 21. The number of the brackets 8 in the present embodiment is 3, but the number of the brackets of the present invention is not limited to the present embodiment.
The first chassis rail 18 and the second chassis rail 20 are both arranged on the chassis 4. The first chassis rail 18 and the second chassis rail 20 are both parallel to the motor lead screw 6. The first chassis slide 17 is arranged on both the first chassis rail 18 and the screw-nut adapter 16 so as to be moved along the first chassis rail 18 by the screw-nut adapter 16. The second chassis slide 19 is arranged on the second chassis guide rail 20 and is connected with the screw nut 3, so as to move along the second chassis guide rail 20 under the driving of the lead screw nut 3. The first chassis guide 18 is arranged in the region where the conversion guide and the lead screw nut adapter 16 are vertically projected to the chassis 4; the second chassis guide rail 20 is arranged in the area where the motor screw 6 is perpendicularly projected to the chassis 4.
The auxiliary guide rail 25 is arranged on the chassis 4 and provided with an auxiliary slide block 24; the auxiliary slider 24 is connected with the first link 23 such that the auxiliary slider 24 moves along the auxiliary rail 25 with the first link 23.
In the present embodiment, the number of the auxiliary guide rails 25 and the auxiliary sliders 24 is 3 and corresponds to one another, that is, 1 auxiliary guide rail 25 corresponds to 1 auxiliary slider 24. The number of the auxiliary guide rails and the auxiliary sliders of the present invention is not limited to this embodiment.
The negative pressure assembly comprises a negative pressure generating device and a negative pressure pipeline. The negative pressure lines include a first negative pressure line 104 (fig. 8) and a second negative pressure line. The first negative pressure pipeline 104 is arranged on the bearing table 1 and is connected with a negative pressure generating device through a first negative pressure source interface 105 arranged on the bearing table 1. The second negative pressure pipeline is arranged on the inner bearing table 13 and is connected with a negative pressure generating device through a second negative pressure source interface arranged on the inner bearing table 13. The first negative pressure pipeline 104 and the second negative pressure pipeline are provided with a negative pressure air port 102 (fig. 7). The inner bearing table 13 has a three-pin structure. The side of the carrier 1 in contact with the wafer is provided with concentric grooves 101. A negative pressure port 102 on a first negative pressure line 104 is provided at the concentric groove 101.
The leveling assembly (fig. 9) includes a bracket adapter 12, a leveling slider 9, a precision screw 11, and a leveling slider bracket 7. The bracket adapter 12 is connected to a second end of the bracket 8. The first end 5 of the leveling slider bracket is arranged on the chassis 4, and the second end 10 of the leveling slider bracket is provided with a leveling slider 9 and a nut groove.
The screw cap of the precision screw 11 is arranged in the screw cap groove, and the screw rod of the precision screw 11 is inserted into the leveling slider 9. The top surface and the bottom surface of the leveling slider 9 are not parallel and respectively clung to the bottom surface of the bracket arm adapter 12 and the second end part 10 of the leveling slider bracket arm, so that the leveling slider 9 in threaded connection with the leveling slider is driven by the rotating precision screw 11 to move along the precision screw 11, the horizontal position of the bracket arm adapter 12 is finely adjusted, and then the horizontal position of the second end part 10 of the bracket arm is changed, thereby leveling the bearing table 1 on the second end part 10 of the bracket arm.
The nut portion of the precision screw 11 is disposed in the nut groove, and the portion thereof exposed to the nut groove is used to rotate the precision screw 11. The top surface of the leveling slide block 9 is inclined, the bottom surface of the bracket arm adapter 12 is inclined, and the inclination directions of the bracket arm adapter 12 and the bracket arm adapter are opposite but have the same angle. In this embodiment, the number of leveling assemblies is 3, and the number of supporting arms is also 3, and the two are matched one by one. The number of leveling assemblies and brackets of the present invention is not limited to this embodiment.
The stepping motor 2 drives the motor screw rod 6 to rotate so that the screw nut 3 in threaded connection with the motor screw rod 6 moves along the motor screw rod 6, thereby driving the first conversion sliding block 15 on the screw nut adapter 16 to move along the first conversion guide rail 14 and the second conversion sliding block 22 to move along the second conversion guide rail 21, and further pushing the first connecting piece 23 and the second connecting piece 26 to vertically move, so that the inner bearing table 13 in the bearing table assembly vertically moves (fig. 2). Also moving along the auxiliary rail 25 is an auxiliary slide 24, the first chassis slide 17 moving along the first chassis rail 18 and the second chassis slide 19 moving along the second chassis rail 20.
Example 2
In this embodiment, the bottom surface of the leveling slider is inclined, the top surface of the second end portion of the leveling slider bracket is inclined, and the two inclined directions are opposite but the angle is the same, otherwise the same as in embodiment 1.
Example 3
The present embodiment provides a method for using the wafer loading device described in embodiment 1 or 2, including the following steps:
starting a stepping motor to drive a motor screw rod to rotate so that a screw nut in threaded connection with the motor screw rod moves along the motor screw rod, driving a conversion sliding block on a screw nut adapter to move obliquely downwards along a conversion guide rail, further enabling an inner bearing table to move upwards to be continuously close to a wafer brought by a mechanical arm until the wafer is contacted with the inner bearing table, starting a negative pressure air port of a second negative pressure pipeline to provide negative pressure to suck the wafer, and enabling the mechanical arm to be separated from the wafer;
the step motor is started to drive the motor screw rod to rotate in the opposite direction, so that a screw nut in threaded connection with the motor screw rod moves in the opposite direction, the conversion sliding block on the screw nut adapter is driven to move obliquely upwards along the conversion guide rail, the inner bearing table is further enabled to move downwards to be continuously close to the bearing table until a wafer is placed on the bearing table, the negative pressure of the negative pressure air port of the second negative pressure pipeline is closed, and the negative pressure air port of the first negative pressure pipeline is started to provide negative pressure to suck the wafer.
The precise screw is rotated to drive the leveling slide block in threaded connection with the precise screw to move along the precise screw, and according to the fact that the top surface and the bottom surface of the leveling slide block are not parallel and respectively clung to the bottom surface of the bracket adapter and the second end part of the bracket of the leveling slide block, the horizontal position of the micro-adjusting bracket adapter is achieved, so that the function of leveling the bearing table is achieved.
The foregoing is merely exemplary of the invention, the scope of the invention is not limited in this respect. Those skilled in the art can make changes or substitutions within the technical scope of the present disclosure, and such changes or substitutions should be included in the scope of the present disclosure.
Claims (7)
1. The wafer loading device is characterized by comprising a chassis, and a stepping motor, a motor screw rod, a screw rod nut adapter, a conversion sliding block, a conversion guide rail, a connecting piece and a bearing table component which are connected in sequence; the step motor is arranged on the chassis; the conversion guide rail is arranged in a non-parallel manner with the motor screw rod;
the stepping motor drives the motor screw rod to rotate so that the screw rod nut in threaded connection with the motor screw rod moves along the motor screw rod, and therefore the conversion sliding block on the screw rod nut adapter piece is driven to move along the conversion guide rail, and the bearing table assembly is further enabled to displace;
the conversion sliding block comprises a first conversion sliding block and a second conversion sliding block; the transition rail comprises a first transition rail and a second transition rail parallel to each other in a plane perpendicular to the chassis; the first conversion sliding block is arranged on the first conversion guide rail, and the second conversion sliding block is arranged on the second conversion guide rail; the first conversion sliding block and the second conversion sliding block are connected with the screw nut adapter; the first conversion guide rail and the second conversion guide rail are connected with the bearing table assembly through the connecting piece; the device also comprises a first chassis guide rail, a first chassis sliding block, a second chassis guide rail and a second chassis sliding block; the first chassis guide rail and the second chassis guide rail are both arranged on the chassis; the first chassis guide rail and the second chassis guide rail are parallel to the motor screw rod; the first chassis sliding block is arranged on the first chassis guide rail and the lead screw nut adapter, so that the first chassis sliding block moves along the first chassis guide rail under the drive of the lead screw nut adapter; the second chassis sliding block is arranged on the second chassis guide rail and is connected with the screw nut so as to move along the second chassis guide rail under the drive of the screw nut; the device also comprises an auxiliary guide rail and an auxiliary sliding block; the auxiliary guide rail is arranged on the chassis, and the auxiliary sliding block is arranged on the auxiliary guide rail; the auxiliary sliding block is connected with the connecting piece, so that the auxiliary sliding block moves along the auxiliary guide rail along with the connecting piece; the load table assembly includes an inner load table; the inner bearing table is connected with the conversion guide rail through the connecting piece and then moves along with the position change of the conversion guide rail; the stepping motor, the motor screw rod and the screw rod nut are arranged on one side of the screw rod nut adapter, and the stepping motor, the motor screw rod and the screw rod nut are not overlapped with the inner bearing table in the top view condition.
2. The wafer loading apparatus of claim 1, further comprising a bracket arm; the bearing table assembly also comprises a bearing table; the inner bearing table is arranged at the hollowed-out part of the bearing table; the first end of the supporting arm is connected with the chassis, and the second end of the supporting arm is connected with the bearing table.
3. The wafer loading apparatus of claim 2, further comprising a negative pressure assembly; the negative pressure assembly comprises a negative pressure generating device and a negative pressure pipeline; the negative pressure pipeline comprises a first negative pressure pipeline and a second negative pressure pipeline; the first negative pressure pipeline is arranged on the bearing table and is connected with the negative pressure generating device through a first negative pressure source interface arranged on the bearing table; the second negative pressure pipeline is arranged on the inner bearing table and is connected with the negative pressure generating device through a second negative pressure source interface arranged on the inner bearing table; and negative pressure air ports are arranged on the first negative pressure pipeline and the second negative pressure pipeline.
4. The wafer loading apparatus according to claim 3, wherein a concentric groove is provided on a side of the susceptor that contacts the wafer; the negative pressure air port on the first negative pressure pipeline is arranged at the concentric groove.
5. The wafer loading apparatus of claim 3, further comprising a leveling assembly; the leveling assembly comprises a bracket arm adapter, a leveling sliding block, a precision screw and a leveling sliding block bracket arm; the bracket arm adapter is connected with the second end part of the bracket arm; the first end part of the leveling slider bracket is arranged on the chassis, and the second end part of the leveling slider bracket is provided with the leveling slider and a nut groove;
the screw cap of the precise screw is arranged in the screw cap groove, and the screw rod of the precise screw is inserted into the leveling slide block; the top surface and the bottom surface of the leveling slider are not parallel and are respectively clung to the bottom surface of the bracket adapter and the second end part of the bracket of the leveling slider, so that the precise screw is rotated to drive the leveling slider in threaded connection with the leveling slider to move along the precise screw, the horizontal position of the bracket adapter is finely adjusted, and the horizontal position of the second end part of the bracket is changed to level the bearing table on the bracket.
6. The wafer loading device of claim 5, wherein the top surface of the leveling slider is inclined and the bottom surface of the bracket adapter is inclined in opposite directions but at the same angle.
7. A method of using the wafer loading apparatus of claim 3, comprising the steps of:
starting the stepping motor to drive the motor screw rod to rotate so that the screw rod nut in threaded connection with the motor screw rod moves along the motor screw rod, driving the conversion sliding block on the screw rod nut adapter to move obliquely downwards along the conversion guide rail, further enabling the inner bearing table to move upwards and continuously close to a wafer brought by a mechanical arm until the wafer is in contact with the inner bearing table, starting a negative pressure air port of the second negative pressure pipeline to provide negative pressure to suck the wafer, and enabling the mechanical arm to be separated from the wafer;
starting the stepping motor to drive the motor screw rod to rotate in the opposite direction so that the screw rod nut in threaded connection with the motor screw rod moves in the opposite direction, driving the conversion sliding block on the screw rod nut adapter to move obliquely upwards along the conversion guide rail, further enabling the inner bearing table to move downwards and continuously close to the bearing table until the wafer is placed on the bearing table, closing the negative pressure of the negative pressure air port of the second negative pressure pipeline, and starting the negative pressure air port of the first negative pressure pipeline to provide negative pressure to suck the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211182180.0A CN115394706B (en) | 2022-09-27 | 2022-09-27 | Wafer loading device and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211182180.0A CN115394706B (en) | 2022-09-27 | 2022-09-27 | Wafer loading device and use method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115394706A CN115394706A (en) | 2022-11-25 |
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| CN103474384A (en) * | 2013-09-06 | 2013-12-25 | 苏州凯欧机械科技有限公司 | Wedge-structure precision positioning lifting platform on semiconductor processing equipment |
| CN111732020B (en) * | 2019-04-28 | 2022-01-28 | 北京京东乾石科技有限公司 | Lifting mechanism, lifting rotating mechanism and automatic guided vehicle |
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| CN112053990A (en) * | 2020-09-17 | 2020-12-08 | 河北博特半导体设备科技有限公司 | Wafer bearing table for automatically transmitting and testing wafers in semiconductor chip production process |
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