CN210429757U - Wafer dotting device for microscope - Google Patents
Wafer dotting device for microscope Download PDFInfo
- Publication number
- CN210429757U CN210429757U CN201921667177.1U CN201921667177U CN210429757U CN 210429757 U CN210429757 U CN 210429757U CN 201921667177 U CN201921667177 U CN 201921667177U CN 210429757 U CN210429757 U CN 210429757U
- Authority
- CN
- China
- Prior art keywords
- fine adjustment
- adjustment frame
- microscope
- sliding
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model provides a wafer dotting device for a microscope, belonging to the technical field of wafer detection, comprising a vertical plate, a first fine adjustment frame, a second fine adjustment frame, a third fine adjustment frame and a dotting device; the vertical plate is used for being vertically fixed on the side wall of the microscope; the first fine adjustment frame is connected with the vertical plate in a sliding mode and slides along the horizontal direction; the second fine adjustment frame is connected with the first fine adjustment frame in a sliding mode, slides along the horizontal direction, and the sliding direction of the second fine adjustment frame is perpendicular to that of the first fine adjustment frame; the third fine adjustment frame is connected with the second fine adjustment frame in a sliding mode and slides along the vertical direction; the dotting device is rotationally connected with the third fine adjustment frame, the rotating axial direction of the dotting device is the same as the sliding direction of the second fine adjustment frame, and the working end of the dotting device is aligned with the optical center position of the microscope for detecting the wafer. The utility model provides a device is got ready to wafer for microscope is got ready and is got ready mark convenience, detection efficiency height to the unqualified chip on the wafer.
Description
Technical Field
The utility model belongs to the technical field of the wafer detects, more specifically says, relates to a device is got ready to wafer for microscope.
Background
In the field of wafer detection, when a wafer scribed with chips is manually and visually detected whether the chips on the wafer are qualified or not, the wafer is placed on a worktable of a microscope through a tight film, the position of the wafer is moved by adjusting a knob of the worktable, and the chips which are not qualified in visual detection on the wafer need to be marked.
When an inspector finds an unqualified chip, the specific position of the chip needs to be calculated and recorded, after the whole wafer is detected, the wafer needs to be detached, the unqualified chip is marked one by using ink pens, the marking process is extremely complicated, and the efficiency is extremely low. Especially for the tiny wafers contained on the film, the calculation of the row and column positions of the unqualified chips requires a long time, so that the efficiency is low, and errors are easy to occur.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a device is got ready to wafer for microscope aims at solving the problem that wafer mark efficiency is low among the prior art.
In order to achieve the above object, the utility model adopts the following technical scheme: a wafer dotting device for a microscope is provided, which comprises a vertical plate, a first fine adjustment frame, a second fine adjustment frame, a third fine adjustment frame and a dotter; the vertical plate is used for being vertically fixed on the side wall of the microscope; the first fine adjustment frame is connected with the vertical plate in a sliding mode and slides along the horizontal direction; the second fine adjustment frame is connected with the first fine adjustment frame in a sliding mode, slides along the horizontal direction, and the sliding direction of the second fine adjustment frame is perpendicular to that of the first fine adjustment frame; the third fine adjustment frame is connected with the second fine adjustment frame in a sliding mode and slides along the vertical direction; the dotting device is rotationally connected with the third fine adjustment frame, the rotating axial direction of the dotting device is the same as the sliding direction of the second fine adjustment frame, and the working end of the dotting device is aligned with the optical center position of the microscope for detecting the wafer.
As another embodiment of the application, two vertical plates are arranged, and the two vertical plates are respectively used for being vertically fixed on two sides of the microscope; the first fine adjustment frame is connected with the two vertical plates in a sliding mode respectively.
As another embodiment of the application, a first sliding groove extending along the horizontal direction is formed in the side wall of one vertical plate, and a first sliding block is arranged on the other vertical plate; one side of the first fine adjustment frame is provided with a sliding rail which is connected with the first sliding groove in a sliding mode, the other side of the first fine adjustment frame is connected with a first screw rod, and the first screw rod penetrates through the first sliding block along the sliding direction of the first fine adjustment frame and is in threaded connection with the first sliding block.
As another embodiment of the present application, the first fine adjustment frame is further provided with a second sliding block, the second fine adjustment frame is provided with a second sliding groove slidably connected to the second sliding block, the second sliding groove is connected to a second screw rod, and the second screw rod passes through the second sliding block along the sliding direction of the second fine adjustment frame and is in threaded connection with the second sliding block.
As another embodiment of the present application, a third sliding block is further disposed on the second fine adjustment frame, a third sliding groove slidably connected to the third sliding block and extending in the vertical direction is disposed on the third fine adjustment frame, a third screw is connected to the third sliding groove, and the third screw passes through the third sliding block in the vertical direction and is in threaded connection with the third sliding block.
As another embodiment of the present application, an adapter plate is disposed on the third fine tuning frame, an upper end of the adapter plate is fixedly connected to a sidewall of the third fine tuning frame, and a lower end of the adapter plate extends to a position close to the wafer and is rotatably connected to the dotter.
As another embodiment of the application, the lower end of the adapter plate is rotatably connected with a mounting plate, the rotating axial direction of the mounting plate is the same as the sliding direction of the second fine adjustment frame, and the dotter is fixedly connected with the mounting plate.
As another embodiment of this application, threaded connection has the locking bolt on the keysets, and the locking bolt passes the face of keysets and with the face butt of mounting panel.
As another embodiment of the present application, the dotter includes a fixed frame rotatably connected to the third fine adjustment frame, an electromagnet connected to the fixed frame, an ink guide line connected to the electromagnet, an ink fountain connected to the fixed frame, and a needle connected to the ink fountain; wherein, the ink guide line sequentially passes through the ink fountain and the needle head and is aligned with the optical center position of the microscope; the opening and closing of the electromagnet is used for driving the ink guide line to stretch in the needle head.
As another embodiment of the present application, the electromagnet is electrically connected to a foot switch.
The utility model provides a device is got ready to wafer for microscope's beneficial effect lies in: compared with the prior art, the utility model discloses the wafer is got ready the device and is fixed at microscopical lateral wall through the riser for the microscope, the work end of getting ready the ware and microscopically be used for detecting the optical center position of wafer and adjust well, when the microscope detects unqualified chip on the wafer, directly get ready the mark to unqualified chip through getting ready the ware, need not to calculate and take notes the ranks position of unqualified chip, avoided the phenomenon of the mark mistake because of calculating the mistake and leading to on the one hand, on the other hand saved the time of calculating unqualified chip position and the time of dismouting wafer, improved marking efficiency;
the riser, first fine-tuning, all adopt sliding connection's mode between second fine-tuning and the third fine-tuning, and first fine-tuning, the slip direction of second fine-tuning is perpendicular with riser extending direction, and the slip direction of second fine-tuning and the slip direction mutually perpendicular of first fine-tuning, the third fine-tuning slides along vertical direction, consequently rotate the dotting device of connecting on the third fine-tuning and can carry out the front and back for the position of microscope, left and right sides, the position adjustment of three degree of freedom about, and it has the axis of rotation the same with the slip direction of second fine-tuning to dotting device on the third fine-tuning, realize the angle adjustment of the work end of dotting device, make the work end of dotting device align with the optical center position of camera lens all the time, thereby can general camera lens of different multiples, the dotting mark work of the wafer of different specifications, wafer detection efficiency is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer dotting device for a microscope according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating an adjustment method of a wafer dotting device for a microscope according to an embodiment of the present invention;
fig. 3 is a schematic view of a connection structure among a vertical plate, a first fine adjustment frame, a second fine adjustment frame and a third fine adjustment frame according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a dotter according to an embodiment of the present invention.
In the figure: 1. a microscope; 10. a wafer; 11. a lens; 12. moving the working table; 2. a vertical plate; 21. a first slider; 22. a first chute; 3. a first fine adjustment frame; 31. a first screw; 32. a first knob; 33. a slide rail; 34. a second slider; 4. a second fine tuning frame; 40. a second chute; 41. a second screw; 42. a second knob; 43. a third slider; 5. a third fine adjustment frame; 50. a third chute; 51. a third screw; 52. a third knob; 53. an adapter plate; 54. mounting a plate; 55. locking the bolt; 6. a dotting device; 61. a fixed mount; 62. an electromagnet; 63. an ink fountain; 64. a needle head; 65. and (4) ink guide lines.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and 2, a wafer dotting apparatus for a microscope according to the present invention will now be described. The wafer dotting device for the microscope comprises a vertical plate 2, a first fine adjustment frame 3, a second fine adjustment frame 4, a third fine adjustment frame 5 and a dotter 6; the vertical plate 2 is used for being vertically fixed on the side wall of the microscope 1; the first fine adjustment frame 3 is connected with the vertical plate 2 in a sliding mode, and the first fine adjustment frame 3 slides along the horizontal direction; the second fine adjustment frame 4 is connected with the first fine adjustment frame 3 in a sliding mode, the second fine adjustment frame 4 slides along the horizontal direction, and the sliding direction of the second fine adjustment frame 4 is perpendicular to the sliding direction of the first fine adjustment frame 3; the third fine adjustment frame 5 is connected with the second fine adjustment frame 4 in a sliding mode, and the third fine adjustment frame 5 slides in the vertical direction; the dotting device 6 is rotatably connected with the third fine adjustment frame 5, the rotating axial direction of the dotting device 6 is the same as the sliding direction of the second fine adjustment frame 4, and the working end of the dotting device 6 is aligned with the optical center position of the microscope 1 for detecting the wafer 10.
It should be noted that, as the prior art, the microscope 10 has a movable table 12 for placing the wafer 10, and the movable table 12 can drive the wafer 10 to move by adjusting the position, so that the chips on the wafer 10 are moved to the position right below the lens 11 of the microscope 1 one by one, and the chips to be detected are located at the optical center position of the microscope 1 one by one for detection. The utility model provides a device is got ready to wafer for microscope's working method does: the vertical plate 2 is fixed on the side wall of the microscope 1, the working end of the dotting device 6 is aligned with the optical center position of the microscope 1, and when unqualified chips on the wafer 10 are detected, the unqualified chips are directly dotted and marked by the dotting device 6;
the vertical plate 2, the first fine adjustment frame 3, the second fine adjustment frame 4 and the third fine adjustment frame 5 are all connected in a sliding way, referring to fig. 2, the sliding direction of the first fine adjustment frame 3 and the second fine adjustment frame 4 is vertical to the extending direction of the vertical plate 2, the sliding direction (Y axis) of the second fine adjustment frame 4 is vertical to the sliding direction (X axis) of the first fine adjustment frame 3, the third fine adjustment frame 5 slides along the vertical direction (Z axis), therefore, the position of the dotter 6 rotatably connected to the third fine adjustment frame 5 relative to the microscope 1 can be adjusted in three directions of front-back (X-axis), left-right (Y-axis) and up-down (Z-axis), and the dotting device 6 is provided with a rotating axis (Y axis) on the third fine adjustment frame 5, which is the same as the sliding direction of the second fine adjustment frame 4, so that the angle adjustment of the working end of the dotting device 6 is realized, and the working end of the dotting device 6 is always aligned with the optical center position of the microscope 1.
Compared with the prior art, the wafer dotting device for the microscope has the advantages that the row and column positions of unqualified chips are not required to be calculated and recorded in the detection process, the detected unqualified chips can be directly marked by dotting, the phenomenon of marking error caused by calculation error is avoided on one hand, the time for calculating the positions of the unqualified chips and the time for taking and placing the wafer 10 are saved on the other hand, and the marking efficiency is improved;
by adjusting the position and the angle of the dotting device 6, the dotting marking work of the lens 11 with different multiples and the wafers 10 with different specifications can be commonly used, and the detection efficiency of the wafers 10 is high.
As a specific embodiment of the wafer dotting device for the microscope of the present invention, please refer to fig. 1 to 3, two vertical plates 2 are provided, and the two vertical plates 2 are respectively used for being vertically fixed on two sides of the microscope 1; the first fine adjustment frame 3 is respectively connected with the two vertical plates 2 in a sliding manner. Fixed through two risers 2 and microscope 1's outer wall, make and beat that ware 6 is fixed firm stable, avoid detecting the precision that the mark was got ready because of the influence of rocking of ware 6 is got ready to the detection mark process.
In this embodiment, to 1 appearance of microscope of difference, utilize hole, the ladder face or the plane that exists to fix a position on its outer wall, through the clamp force of two riser 2 to 1 outer wall of microscope, fix riser 2 and microscope 1, perhaps with riser 2 and microscope 1 be connected the face on the non-setting adhesive makes riser 2 and microscope 1's lateral wall (be applicable to the lateral wall and be planar structure microscope 1) bonding fixed to guarantee that riser 2's is fixed reliably.
In this embodiment, please refer to fig. 2 and fig. 3 together as a specific implementation manner, wherein a first sliding groove 22 extending along a horizontal direction is disposed on a side wall of one vertical plate 2, and a first sliding block 21 is disposed on the other vertical plate 2; one side of the first fine adjustment frame 3 is provided with a slide rail 33 which is connected with the first slide groove 22 in a sliding manner, the other side of the first fine adjustment frame is connected with a first screw 31 in a rotating manner, the first screw 31 penetrates through the first slide block 21 and is connected with the first slide block 21 in a threaded manner, and the extending direction of the first screw 31 is the same as the sliding direction of the first fine adjustment frame 3. Riser 2 is immovable, through rotating first screw rod 31, drives first slider 21 and moves (along the X axial) on first screw rod 31, and first spout 22 slides (along the X axial) on first slide rail 33, and the adjustment of first fine-tuning frame 3 is convenient, the removal is steady.
In this embodiment, referring to fig. 2 and fig. 3 together, as a specific implementation manner, the first fine adjustment frame 3 is further provided with a second sliding block 34, the second fine adjustment frame 4 is provided with a second sliding slot 40 slidably connected with the second sliding block 34, the second sliding slot 40 is connected with a second screw 41, and the second screw 41 passes through the second sliding block 34 along the sliding direction of the second fine adjustment frame 4 and is in threaded connection with the second sliding block 34.
By rotating the second screw 41, the second fine adjustment frame 4 slides on the first fine adjustment frame 3 in the extending direction (Y-axis direction) of the second screw 41 under the screw drive of the second screw 41 and the second slider 34.
In this embodiment, referring to fig. 2 and fig. 3 together, as a specific implementation manner, the second fine adjustment frame 4 is further provided with a third sliding block 43, the third fine adjustment frame 5 is provided with a third sliding slot 50 slidably connected with the third sliding block 43 and extending in the vertical direction, the third sliding slot 50 is connected with a third screw 51, and the third screw 51 passes through the third sliding block 43 in the vertical direction and is in threaded connection with the third sliding block 43.
By rotating the third screw 51, the third fine adjustment frame 5 slides on the second fine adjustment frame 4 in the vertical direction (Z-axis direction) under the screw drive of the third screw 51 and the third slider 43.
In this embodiment, as a specific implementation manner, please refer to fig. 2 or fig. 3, one end of the first screw 31 extends out of the end surface of the first fine tuning frame 3 and is provided with a first knob 32; one end of the second screw rod 41 extends out of the end face of the second fine adjustment frame 4 and is provided with a second knob 42; one end of the third screw 51 extends upward from the end surface of the third fine adjustment frame 5 and is provided with a third knob 52. By rotating the first knob 32, the second knob 42 and the third knob 52, the position of the dotter 6 in the front-back, left-right and up-down directions of the spatial position relative to the microscope 1 is adjusted, and the position of the dotter 6 is conveniently adjusted manually.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1, an adapter plate 53 is disposed on the third fine tuning frame 5, the upper end of the adapter plate 53 is fixedly connected to the sidewall of the third fine tuning frame 5, and the lower end extends to a position close to the wafer 10 and is rotatably connected to the dotter 6. The mounting position of the dotter 6 is close to the position of the wafer 10 by connecting the adapter plate 53, so that the working end of the dotter 6 is conveniently aligned with the optical center position of the microscope 1, and the marking position is ensured to be accurate.
In this embodiment, referring to fig. 1 and fig. 2 together, as a specific implementation manner, the lower end of the adapter plate 53 is rotatably connected with a mounting plate 54, the rotating axial direction of the mounting plate 54 is the same as the sliding direction of the second fine adjustment frame 4, and the dotter 6 is fixedly connected with the mounting plate 54. Through rotating connection mounting panel 54 on keysets 53, carry out fixed connection by mounting panel 54 and dotting device 6 again, compare in dotting device 6 and keysets 53 and directly carry out the mode of rotating connection, make dotting device 6's installation fixed simpler, convenient, stable.
In this embodiment, as a specific implementation manner, referring to fig. 1, a locking bolt 55 is connected to the adapter plate 53 through a thread, and the locking bolt 55 passes through the plate surface of the adapter plate 53 and abuts against the plate surface of the mounting plate 54. When the dotter 6 fixed on the mounting plate 54 rotates to the position where the working end of the dotter is aligned with the optical center of the microscope 1, one end of the locking bolt 55 is abutted to the plate surface of the mounting plate 54 by screwing the locking bolt 55, so that the rotational freedom of the mounting plate 54 along the rotational axial direction thereof is limited, the mounting plate 54 is kept in a fixed state, and the connection stability of the dotter 6 is ensured.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 4, the dotting device 6 includes a fixing frame 61 rotatably connected to the third fine adjustment frame 5, an electromagnet 62 connected to the fixing frame 61, an ink guide line 65 connected to the electromagnet 62, an ink fountain 63 connected to the fixing frame 61, and a needle 64 connected to the ink fountain 63; wherein, the ink guide line 65 passes through the ink fountain 63 and the needle 64 in sequence and is aligned with the optical center position of the microscope 1; the electromagnet 62 is turned on and off to drive the ink guide line 65 to extend and retract in the needle 64. When the electromagnet 62 is powered on, the iron core moves downwards due to the absorption force, so that the ink guide line 65 is pushed to extend out of the needle head 64 downwards, ink in the ink duct 63 carried by the ink guide line 65 marks the wafer 10 at the optical center position of the microscope 1, and when the electromagnet 62 is powered off, the iron core rebounds upwards through the internal spring, so that the ink guide line 65 is pulled back.
In the present embodiment, the electromagnet 62 is electrically connected to a foot switch. When detecting the unqualified chip on the wafer 10, the worker steps on the foot switch to electrify the electromagnet 62, marks the unqualified chip, releases the foot switch after the marking is finished, and then adjusts the position of the movable workbench 12 to detect other chips on the wafer 10. The staff can be through foot control dotter 6 mark work of dotting, and the process of dotting does not influence hand adjustment mobile workbench 12, convenient operation, efficient.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A wafer dotting device for a microscope is characterized by comprising:
the vertical plate is used for being vertically fixed on the side wall of the microscope;
the first fine adjustment frame is connected with the vertical plate in a sliding mode and slides along the horizontal direction;
the second fine adjustment frame is connected with the first fine adjustment frame in a sliding mode, slides along the horizontal direction, and the sliding direction of the second fine adjustment frame is perpendicular to that of the first fine adjustment frame;
the third fine adjustment frame is connected with the second fine adjustment frame in a sliding mode and slides along the vertical direction;
and the dotting device is rotationally connected with the third fine adjustment frame, the rotating axial direction of the dotting device is the same as the sliding direction of the second fine adjustment frame, and the working end of the dotting device is aligned with the optical center position of the microscope for detecting the wafer.
2. The microscope wafer dotting device according to claim 1, wherein: the two vertical plates are respectively used for being vertically fixed on two sides of the microscope; the first fine adjustment frame is connected with the two vertical plates in a sliding mode respectively.
3. The microscope wafer dotting device according to claim 2, wherein: the side wall of one of the vertical plates is provided with a first sliding groove extending along the horizontal direction, and the other vertical plate is provided with a first sliding block; one side of the first fine adjustment frame is provided with a sliding rail which is in sliding connection with the first sliding groove, the other side of the first fine adjustment frame is connected with a first screw rod, and the first screw rod penetrates through the first sliding block along the sliding direction of the first fine adjustment frame and is in threaded connection with the first sliding block.
4. The microscope wafer dotting device according to claim 3, wherein: the first fine adjustment frame is further provided with a second sliding block, the second fine adjustment frame is provided with a second sliding groove in sliding connection with the second sliding block, a second screw rod is connected to the second sliding groove, and the second screw rod penetrates through the second sliding block and is in threaded connection with the second sliding block along the sliding direction of the second fine adjustment frame.
5. The microscope wafer dotting device according to claim 4, wherein: the second fine adjustment frame is further provided with a third sliding block, the third fine adjustment frame is provided with a third sliding groove which is connected with the third sliding block in a sliding mode and extends in the vertical direction, a third screw rod is connected onto the third sliding groove, and the third screw rod penetrates through the third sliding block in the vertical direction and is in threaded connection with the third sliding block.
6. The wafer dotting apparatus for a microscope according to any one of claims 1 to 5, wherein: and the third fine adjustment frame is provided with an adapter plate, the upper end of the adapter plate is fixedly connected with the side wall of the third fine adjustment frame, and the lower end of the adapter plate extends to a position close to the wafer and is rotatably connected with the dotting device.
7. The microscope wafer dotting device according to claim 6, wherein: the lower extreme of keysets rotates and is connected with the mounting panel, the rotation axial of mounting panel with the slip direction of second fine setting frame is the same, get ware with mounting panel fixed connection.
8. The microscope wafer dotting device according to claim 7, wherein: the adapter plate is connected with a locking bolt in a threaded mode, and the locking bolt penetrates through the plate surface of the adapter plate and is abutted to the plate surface of the mounting plate.
9. A microscope wafer dotting device according to any one of claims 1 to 5 and 7 to 8, wherein: the dotting device comprises a fixed frame rotationally connected with the third fine adjustment frame, an electromagnet connected with the fixed frame, an ink guide line connected with the electromagnet, an ink fountain connected with the fixed frame, and a needle head connected with the ink fountain;
the ink guide line sequentially penetrates through the ink fountain and the needle head and is aligned with the optical center of the microscope; the opening and closing of the electromagnet is used for driving the ink guide line to stretch in the needle head.
10. The microscope wafer dotting device according to claim 9, wherein: the electromagnet is electrically connected with a foot switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667177.1U CN210429757U (en) | 2019-09-30 | 2019-09-30 | Wafer dotting device for microscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667177.1U CN210429757U (en) | 2019-09-30 | 2019-09-30 | Wafer dotting device for microscope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210429757U true CN210429757U (en) | 2020-04-28 |
Family
ID=70368630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921667177.1U Active CN210429757U (en) | 2019-09-30 | 2019-09-30 | Wafer dotting device for microscope |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210429757U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111920543A (en) * | 2020-08-14 | 2020-11-13 | 中国人民解放军陆军特色医学中心 | Shock tube experimental device for simulating animal chest impact injury |
| CN113418763A (en) * | 2021-06-17 | 2021-09-21 | 儒众智能科技（苏州）有限公司 | Semiconductor probe desk type dotting machine |
-
2019
- 2019-09-30 CN CN201921667177.1U patent/CN210429757U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111920543A (en) * | 2020-08-14 | 2020-11-13 | 中国人民解放军陆军特色医学中心 | Shock tube experimental device for simulating animal chest impact injury |
| CN113418763A (en) * | 2021-06-17 | 2021-09-21 | 儒众智能科技（苏州）有限公司 | Semiconductor probe desk type dotting machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210429757U (en) | Wafer dotting device for microscope | |
| CN109507779B (en) | Lens clamp mechanism for automatic coupling packaging of butterfly-shaped semiconductor laser | |
| CN103692199A (en) | Screw locking mechanism | |
| CN201439145U (en) | Horizontal position adjusting platform for electro processing | |
| CN203649884U (en) | Locking screw mechanism | |
| CN208537136U (en) | A kind of 6 DOF LED light source alignment device | |
| CN203156406U (en) | Flexible jig for large-size thin-wall components | |
| CN109708606B (en) | Composite cam machining precision detection device and method based on motion parameter representation | |
| CN111457879A (en) | Coating roughness measuring head | |
| CN206369833U (en) | Optical fiber production is equipped | |
| CN114916136A (en) | Double-shaft beveling machine for PCB | |
| CN211414266U (en) | Horizontal precision adjusting equipment of level bar | |
| CN209706742U (en) | A kind of 3D measuring table based on five axis | |
| CN210850550U (en) | Adjusting device for optical centering instrument | |
| CN208171209U (en) | A kind of dot laser flatness checking device | |
| CN219275374U (en) | Visual device adjusting structure for deburring mechanism | |
| CN108857965B (en) | Three-coordinate rotating clamp | |
| CN221271320U (en) | Accurate punching mechanism of PCB printed circuit board | |
| CN209902704U (en) | Inclined plane hole machining device and measuring device | |
| CN219934865U (en) | External alignment device of processing machine | |
| CN217560949U (en) | Herringbone tooth centering error detection device | |
| CN220660696U (en) | Positioning and guiding device for probe seat machining | |
| CN216694814U (en) | End mill parameter measuring device | |
| CN219337431U (en) | Multi-functional nondestructive test locating rack that adaptability is good | |
| CN220473747U (en) | Triaxial displacement platform zoom lens horizontal correction structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |