201221965 六、發明說明： 【發明所屬之技術領域】 本發明是有關在使探針卡與晶圓等的被檢查體電性接 觸而進行被檢查體的電性特性檢查時，可調整探針卡與載 置台上的被檢查體的平行度之探針卡的平行調整機構及檢 '查裝置。 【先前技術】 以往的此種檢查裝置有記載於專利文獻1的探針裝置 。有關此探針裝置是一邊參照圖4、圖5 —邊槪說。此探針 裝置是具備：搬送被檢查體（例如晶圓）的裝載機室、及 與裝載機室鄰接且進行從裝載機室接受的晶圓的電性特性 檢查的探針室。 如圖4所示’探針室是具備： 載置台（晶圓夾頭）1，其係載置被檢查體（晶圓） W，且可移動於X、Y、Z方向； 具有探針2A的探針卡2，其係配置於晶圓夾頭1的上 方： 卡夾緊機構4，其係經由卡夾具3來可裝卸地保持探針 卡2 ; 嵌環（Insert Ring) 5，其係經由卡夾緊機構4來支撐 . 探針卡2 ;及 頂板6，其係支承嵌環5，201221965 6. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a probe card that can be adjusted when the probe card is electrically contacted with an object to be inspected such as a wafer to perform electrical property inspection of the object to be inspected. A parallel adjustment mechanism and a check device for the probe card parallel to the object to be inspected on the mounting table. [Prior Art] A conventional inspection apparatus of this type is disclosed in Patent Document 1. Regarding this probe device, it is referred to FIG. 4 and FIG. This probe device includes a loader chamber that transports a test object (for example, a wafer), and a probe chamber that is adjacent to the loader chamber and performs electrical property inspection of the wafer received from the loader chamber. As shown in FIG. 4, the probe chamber is provided with a mounting table (wafer chuck) 1 that mounts a test object (wafer) W and is movable in the X, Y, and Z directions; and has a probe 2A. The probe card 2 is disposed above the wafer chuck 1 : a card clamping mechanism 4 detachably holding the probe card 2 via the clip 3; an Insert Ring 5 Supported by the card clamping mechanism 4; the probe card 2; and the top plate 6, which supports the collar 5,
可使測試頭（未圖示）往頂板6側旋轉，經由連接環R -5- 201221965 來使測試頭與探針卡2電性連接。 近年來，探針卡2的開發日新月異，可同時檢查複數 的裝置。特別是使探針卡2與晶圓W的所有裝置同時一次 接觸而檢査時，形成於探針卡2的全面之多數的探針2 A是 與形成於晶圓W的全面之所有的裝置接觸，因此探針卡2 與晶圓W的平行度會成問題。一旦該等兩者間的平行度差 ，則無法使探針卡2的全探針2A與晶圓W以均一的針壓來 接觸，在接觸荷重產生過與不足，恐有損害檢査的可靠度 之虞，依情坪，恐有傷及探針卡2或晶圓W等之虞。 於是，圖4所示的檢査裝置是具備調整探針卡2與晶圓 W的平行度之平行調整機構7。如圖4、圖5所示，此平行 調整機構7是在至少三處支承嵌環5，在兩處使往上下方向 昇降，藉此調整探針卡2的平行度。如同圖所示，此平行 調整機構7是具備：在一處支承嵌環5的第1支承機構7A、 及各彼此於圓周方向離第1支承機構7 A預定間隔來配置， 而在其他的兩處支承嵌環5的2個第2支承機構7B，第1、第 2支承機構7A、7B會被配置於包圍探針卡2的嵌環5的中央 孔所形成的階部上。第1支承機構7 A是構成作爲支承嵌環 5的支撐點，其他的第2支承機構7B是構成作爲個別地使嵌 環5昇降的昇降機構。 支承嵌環5的頂板6是圖4所示四個角落會藉由支撐柱8 來水平地支撐。亦即，配置有測試頭的頂板是被分割成： 支撐探針卡2的嵌環5、及被支撐柱8所支撐的頂板6。原本 ，頂板6是作爲一體物形成，強度會較佳。但，爲了利用 -6 - 201221965 平行調整機構7來使探針卡2形成可動構造，而自頂板6分 割嵌環5。 [專利文獻1]特開2006-317302號公報 【發明內容】 (發明所欲解決的課題） 然而，在專利文獻1所記載的平行調整機構7中，嵌環 5自頂板6分割，且嵌環5是以形成於頂板6的內端面的矩形 狀的階部所支撐，因此與頂板的分割構造相輔而使得嵌環 5形成比頂板6薄，會有作爲測試頭的支承構造的剛性降低 的問題。隨支承構造的剛性降低，嵌環5會因爲來自配置 於嵌環5上的測試頭的大的荷重或檢查時的探針卡2與晶圓 W的大的接觸荷重等而彎曲，複數的探針的針端位置會在 上下方向變位。其結果，難以取得適當的過驅動量，且難 以安定地取得用以觀察檢査時的接觸狀況的探針標記。而 且，有關平行調整機構7，因爲第1、第2支承機構7A、7B 如圖5所示配置於探針卡2的附近，所以爲了在嵌環5與頂 板6之間安裝第1、第2支承機構7A、7B，而於嵌環5及頂 板6需要獨自的支撐機構等，會有無法使用具有泛用性的 頂板6的問題^ 本發明是爲了解決上述課題而硏發者，其目的是在於 提供一種可取得適當的過驅動量及安定的探針標記，可使 用具有泛用性的頂板，且可使平行度的調整充裕之探針卡 的平行調整機構及檢查裝置。 201221965 (用以解決課題的手段） 本發明的請求項1所記載的探針卡的平行調整機構， 係於四個角落支撐安裝有探針卡的頂板之四處的支撐柱之 中的至少三處使上述頂板昇降，而調整上述探針卡與配置 於其下方的載置台上的被檢査體的平行度，其特徵爲： 具備介於上述至少三處的支撐柱與上述頂板之間的昇 降機構， 上述昇降機構係具有： 具有傾斜面的移動體，其係沿著上述支撐柱的上面而 配置成可移動；及 昇降體，其係被連結至上述頂板，且沿著上述移動體 的傾斜面而配置成可昇降；及 驅動機構，其係使上述移動體沿著上述支撐柱的上面 來移動。 又，本發明的請求項2所記載的探針卡的平行調整機 構係於請求項1所記載的發明中，上述驅動機構係具有： 與上述移動體螺合的滾珠螺桿、及使上述滾珠螺桿驅動的 馬達。 又，本發明的請求項3所記載的探針卡的平行調整機 構係於請求項1或請求項2所記載的發明中，在上述支撐柱 與上述移動體的境界、及上述移動體的傾斜面與上述昇降 體的傾斜面的境界係分別介有移動引導機構。 又，本發明的請求項4所記載的探針卡的平行調整機 -8- 201221965 構係於請求項3所記載的發明中，上述移動引導機構係具 有交叉滾輪。 又，本發明的請求項5所記載的探針卡的平行調整機 構係於請求項1〜請求項4中的任一項所記載的發明中，設 置昇降引導上述昇降體的昇降引導機構。 又，本發明的請求項6所記載的探針卡的平行調整機 構係於請求項1〜請求項5中的任一項所記載的發明中，彼 此卡合的上述移動體及上述昇降體係於各個的傾斜面卡合 而成爲矩形狀的塊體。 又，本發明的請求項7所記載的檢查裝置，係具備： 載置台，其係載置被檢查體； 探針卡，其係配置於上述載置台的上方； 頂板，其係安裝有上述探針卡； 四處的支撐柱，其係於四個角落支撐上述頂板；及 探針卡的平行調整機構，其係於上述四處的支撐柱之 中的至少三處使上述頂板昇降，而調整上述探針卡與配置 於其下方的載置台上的被檢查體的平行度， 其特徵爲： 上述平行調整機構係具備介於上述至少三處的支撐柱 與上述頂板之間的昇降機構， 上述昇降機構係具有： 具有傾斜面的移動體，其係沿著上述支撐柱的上面而 配置成可移動； 昇降體，其係被連結至上述頂板，且沿著上述移動體 -9- 201221965 的傾斜面而配置成可昇降；及 驅動機構，其係使上述移動體沿著上述支撐柱的上面 來移動。 又，本發明的請求項8所記載的檢査裝置係於請求項7 所記載的發明中，上述驅動機構係具有：與上述移動體螺 合的滾珠螺桿、及使上述滾珠螺桿驅動的馬達。 又，本發明的請求項9所記載的檢査裝置係於請求項7 或請求項8所記載的發明中，在上述支撐柱與上述移動體 的境界、及上述移動體的傾斜面與上述昇降體的傾斜面的 境界係分別介有移動引導機構。 又，本發明的請求項10所記載的檢査裝置係於請求項 9所記載的發明中，上述移動引導機構係具有交叉滾輪。 又，本發明的請求項11所記載的檢查裝置係於請求項 7〜請求項1 0中的任一項所記載的發明中，設置昇降引導 上述昇降體的昇降引導機構。 又，本發明的請求項1 2所記載的檢查裝置係於請求項 7〜請求項1 1中的任一項所記載的發明中，彼此卡合的上 述移動體及上述昇降體係於各個的傾斜面卡合而成爲矩形 狀的塊體。 [發明的效果] 若根據本發明，則可提供一種探針卡的平行調整機構 及檢查裝置，其係可取得適當的過驅動量及安定的探針標 記’可使用具有泛用性的頂板，且可使平行度的調整充裕 -10- 201221965 【實施方式】 以下’根據圖1〜圖3所示的實施形態來說明本發明。 例如圖1、圖2所示，本實施形態的檢查裝置1〇是具備 可移動的載置台（晶圓夾頭）11，其係載置晶圓W; 探針卡12，其係配置於晶圓夾頭11的上方； 卡夾緊機構14，其係經由卡夾具13來固定探針卡12; 頂板15，其係卡夾緊機構14被固定於下面； 支撐柱16，其係於四個角落支撐頂板15;及 平行調整機構17，其係調整晶圓夾頭11上的晶圓W與 探針卡12的平行度， 構成探針卡12經由連接環R來連接至測試頭（未圖示） 之後，在控制裝置的控制下進行晶圓W的電性特性檢查。 並且，探針卡12是被安裝於頂板15的下面所設的卡夾 緊機構1 4。由於像以往那樣頂板1 5未被分割，所以具備頂 板15原本高的剛性。其結果，即使在頂板15的上面配置測 試頭（未圖示），且大的接觸荷重作用於探針卡12與晶圓 W之間，照樣頂板15不易往上下方向彎曲，探針卡12的複 數根探針12A的針端位置安定，可維持一定的高度，經常 可取得適當的過驅動量的同時可取得安定的探針標記’進 而能夠進行可靠度高且安定的檢査。 而且，如圖1、圖2所示，平行調整機構17是藉由分別 201221965 介於頂板15的四個角落與四處的支撐柱16之間的四處的昇 降機構17A所構成，利用四處的昇降機構17A來調整探針 卡12與晶圓夾頭11上的晶圓W的平行度。此時，探針卡12 與晶圓W的平行度是利用電容感測器或雷射測長器等的測 定機器來測定。 如圖2所示，在本實施形態中，昇降機構17A是被配 置於四處，但昇降機構17A只要配置於四處的支撐柱16的 其中至少3處即可。當昇降機構17A配置於三處時，例如 只要在剩下的一處的支撐柱16以一定的高度來可傾斜地支 撐頂板15即可。只要昇降機構17A至少配置於三處，便可 個別地控制各昇降機構1 7 A，比兩處時還可擴大頂板1 5的 傾斜角，可使探針卡12與晶圓夾頭1 1上的晶圓W的調整角 度充裕。 如圖1〜圖3所示，四處的昇降機構17A皆是全體形成 大致矩形狀的塊狀，各昇降機構17A是以各個的下面來固 定於四處的支撐柱16的上面，且以各個的上面來分別連結 於頂板15的四個角落。 如圖1〜圖3所示，昇降機構17A是具備： 基體17B，其係被固定於支撐柱16的上面； 具有傾斜面的移動體17C，其係沿著基體17B上面而 配置成可移動； 具有傾斜件的昇降體1 7E，其係藉由連結構件1 7D來 連結至頂板1 5，且沿著移動體1 7C的傾斜面而配置成可昇 降；及 -12- 201221965 驅動機構1 7F，其係使移動體1 7C沿著支撐柱1 6的上 面而移動， 驅動機構17F是在控制裝置的控制下驅動，而使移動 體17C往前後方向（在圖1〜圖3是左右方向）只移動預定 的尺寸，藉此構成昇降體17E可經由移動體17C的傾斜面 來只昇降預定的尺寸。控制裝置可根據測定機器的測定結 果來控制驅動機構17F。 如圖1、圖3所示，移動體17C及昇降體17E皆是側面 形狀形成大致梯形，各個的傾斜面是彼此卡合而成爲收於 支撐柱16上的矩形狀的塊體，各個彼此對向的前後左右的 平行面是與支撐柱16的側面實質上一致，上下的兩面是被 固定於支撐柱16的上面及頂板15。位於檢查裝置1〇的後方 (在圖1是右側）的移動體17C是上端部延伸至檢查裝置1〇 的正面側（在圖1是左側），具有屋簷狀的部分。 如圖3的（a)所示，使移動體17C移動的驅動機構17F 是具有：與形成於移動體17C的前後方向的雌螺紋螺合的 滾珠螺桿17〇、及驅動滾珠螺桿17G的馬達17H，使移動體 17C沿著基體17B的上面來往前後方向移動。在基體17B與 移動體17C之間設有第1移動引導機構171，移動體17C可經 由此移動引導機構171在基體17B上往前後方向順暢地移動 。並且，在移動體17C的傾斜面與昇降體17E的傾斜面之 間設有第2移動引導機構17J ’昇降體17E可經由此移動引 導機構17J來沿著移動體17C的傾斜面往前後方向移動而順 暢地昇降。如圖3的（b)所示，該等的移動引導機構171 -13- 201221965 、1 7J皆至少具有二列的交叉滾輪，可沿著各個的線性滑 軌來移動。由於第1、第2移動引導機構171、17J分別具有 至少二列的交叉滾輪，因此耐荷重性佳，即使在高荷重下 還是可以順暢地移動引導。 並且，基體17B是如圖3的（a)所示，從支撐柱16的 側面突出，在突出部配置有馬達17H。在此基體17B的突 出部，昇降引導昇降體17E的昇降引導機構17K是位於馬 達17H與支撐柱16的側面之間而設。此昇降引導機構17K 是具有：設於基體1 7 B上的線性滑軌1 7 L、及與線性滑軌 17L經由至少二列的交叉滾輪（參照圖3的（b))來卡合 ，按照線性滑軌17L來昇降引導昇降體17E的卡合體17M。 因此，藉移動體17C經由驅動機構17F來移動於前後，昇 降體17E可經由具有至少二列的交叉滾輪的昇降引導機構 1 7K來昇降。 其次，說明有關動作。首先，爲了進行晶圓W的檢查 ，將探針卡12安裝於卡夾緊機構14。在安裝探針卡12下， 並非探針卡1 2與晶圓夾頭1 1上的晶圓W是形成平行。於是 ，利用測定機器來測定探針卡1 2與晶圓W的平行度。亦即 ，利用此測定機器，在複數處測定探針卡1 2與晶圓W間的 距離’測定探針卡1 2對晶圓夾頭1 1上的晶圓W的傾斜度。 測定機器的測定結果是被傳送至控制裝置。 控制裝置是根據測定結果來對平行調整機構1 7的四處 驅動機構1 7F分別傳送固有的測定訊號，個別地控制驅動 機構17F。各驅動機構17F會驅動，各移動體17C會經由第 -14- 201221965 1移動引導機構171來只移動預定尺寸。隨之，一旦各昇降 體17E經由第2移動引導機構17J來分別只昇降預定尺寸， 則各昇降體17E會使頂板15的四個角落只昇降預定的尺寸 ，調整頂板15的傾斜情況，使探針卡12與晶圓夾頭1 1上的 晶圓W形成平行。 如以上說明，若根據本實施形態，則因爲將探針卡1 2 設於頂板15的同時，將構成平行調整機構17的昇降機構 17 A設於頂板15與四處的支撐柱16之間，所以頂板15的剛 性會被強化，藉此可取得適當的過驅動量及安定的探針標 記，可使用具有泛用性的頂板，且藉由在頂板15的四個角 落調整頂板15的平行度，可使頂板15與晶圓W的平行度的 調整充裕。 並且，將構成平行調整機構17的昇降機構17A設於頂 板15與四處的支撐柱16之間，因此不需要用以安裝平行調 整機構17的特別的支撐機構，可以低成本來安裝於各種的 檢査裝置。 另外，本發明並非限於上述實施形態，可因應所需適 當變更設計各構成要素。 【圖式簡單說明】 圖1是表示本發明的檢査裝置之一實施形態的要部側 面圖。 圖2是圖1所示的檢查裝置的平面圖。 圖3 (a) 、（b)是分別表示圖1所示的檢查裝置的平 -15- 201221965 行調整機構的圖，（a)是其剖面圖，（b)是表示使用於 (a)所示的平行調整機構的移動機構的一例剖面圖。 圖4是表示以往的檢查裝置的要部側面圖。 圖5是圖4所示的檢查裝置的平面圖。 【主要元件符號說明】 10 :檢查裝置 1 1 :晶圓夾頭（載置台） 1 2 :探針卡 1 2 A :探針 14 :卡夾緊機構 15 :頂板 1 6 :支撐柱 1 7 :平行調整機構 17A :昇降機構 17C :移動體 17E :昇降體 17F :驅動機構 171 :第1移動引導機構 17J :第2移動引導機構 17K :昇降引導機構 W :晶圓（被檢查體） -16-The test head (not shown) can be rotated toward the top plate 6 side, and the test head is electrically connected to the probe card 2 via the connection ring R-5-201221965. In recent years, the development of the probe card 2 has been changing with each passing day, and it is possible to simultaneously check a plurality of devices. In particular, when the probe card 2 is inspected at the same time as all the devices of the wafer W, the probe 2A formed on the probe card 2 is in contact with all of the devices formed on the wafer W. Therefore, the parallelism of the probe card 2 and the wafer W may be a problem. Once the parallelism between the two is poor, the full probe 2A of the probe card 2 cannot be brought into contact with the wafer W by a uniform needle pressure, and the contact load is excessively and insufficiently generated, which may impair the reliability of the inspection. After that, depending on the situation, there may be damage to the probe card 2 or the wafer W. Therefore, the inspection apparatus shown in Fig. 4 is provided with a parallel adjustment mechanism 7 for adjusting the parallelism of the probe card 2 and the wafer W. As shown in Figs. 4 and 5, the parallel adjustment mechanism 7 supports the collar 5 at at least three places, and moves up and down in two places, thereby adjusting the parallelism of the probe card 2. As shown in the figure, the parallel adjustment mechanism 7 is provided with a first support mechanism 7A that supports the collar 5 at one position, and each of which is disposed at a predetermined interval from the first support mechanism 7 A in the circumferential direction, and the other two The two second support mechanisms 7B that support the collar 5 are disposed on the step formed by the central hole of the ring 5 surrounding the probe card 2, and the first and second support mechanisms 7A and 7B. The first support mechanism 7A constitutes a support point as the support collar 5, and the other second support mechanism 7B constitutes an elevating mechanism that individually raises and lowers the insert ring 5. The top plate 6 of the support ring 5 is such that the four corners shown in Fig. 4 are horizontally supported by the support column 8. That is, the top plate provided with the test head is divided into: a ring 5 supporting the probe card 2, and a top plate 6 supported by the support column 8. Originally, the top plate 6 was formed as a unitary body, and the strength was better. However, in order to form the movable structure of the probe card 2 by the parallel adjustment mechanism 7 of -6 - 201221965, the collar 5 is divided from the top plate 6. [Problem to be Solved by the Invention] However, in the parallel adjustment mechanism 7 described in Patent Document 1, the ring 5 is divided from the top plate 6 and is inlaid. 5 is supported by a rectangular step formed on the inner end surface of the top plate 6, so that the split structure of the top plate is made thinner than the top plate 6, and the rigidity of the support structure as the test head is lowered. problem. As the rigidity of the support structure is lowered, the ring 5 is bent due to a large load from the test head disposed on the ring 5 or a large contact load of the probe card 2 and the wafer W during inspection, etc. The needle end position of the needle is displaced in the up and down direction. As a result, it is difficult to obtain an appropriate overdrive amount, and it is difficult to stably obtain a probe mark for observing the contact state at the time of inspection. Further, in the parallel adjustment mechanism 7, since the first and second support mechanisms 7A and 7B are disposed in the vicinity of the probe card 2 as shown in FIG. 5, in order to mount the first and second between the collar 5 and the top plate 6, In the support mechanisms 7A and 7B, the support ring 7 and the top plate 6 require a separate support mechanism or the like, and there is a problem that the top plate 6 having versatility cannot be used. The present invention has been made to solve the above problems. In order to provide a probe mark which can obtain an appropriate overdrive amount and stability, it is possible to use a top plate having a general purpose and a parallel adjustment mechanism and an inspection device for a probe card having a sufficient degree of parallelism adjustment. 201221965 (Means for Solving the Problem) The parallel adjustment mechanism of the probe card according to the first aspect of the present invention is at least three of the support columns at four corners of the top plate on which the probe card is attached. Lifting the top plate to adjust the parallelism of the probe card and the object to be inspected on the mounting table disposed therebelow, characterized in that: the lifting mechanism is provided between the support column and the top plate at least three places The lifting mechanism includes: a moving body having an inclined surface that is disposed to be movable along an upper surface of the support post; and a lifting body that is coupled to the top plate and along an inclined surface of the moving body And configured to be movable up and down; and a driving mechanism for moving the moving body along the upper surface of the support column. Further, the parallel adjustment mechanism of the probe card according to the second aspect of the invention of the invention of the present invention, wherein the drive mechanism includes: a ball screw that is screwed to the moving body; and the ball screw Driven motor. Further, the parallel adjustment mechanism of the probe card according to claim 3 of the present invention is the invention described in claim 1 or claim 2, wherein the boundary between the support column and the movable body and the inclination of the moving body The boundary between the surface and the inclined surface of the lifting body is respectively provided with a movement guiding mechanism. Further, in the invention described in claim 3, the above-described movement guiding mechanism has a cross roller. Further, in the invention described in any one of claims 1 to 4, the parallel adjustment mechanism of the probe card according to the invention of claim 5 is provided with a lifting and lowering guide for elevating and guiding the elevating body. Further, in the invention described in any one of the claims 1 to 5, the parallel adjustment mechanism of the probe card according to the present invention, wherein the moving body and the lifting system are engaged with each other Each inclined surface is engaged to form a rectangular block. Further, the inspection apparatus according to claim 7 of the present invention includes: a mounting table on which an object to be inspected is placed; a probe card disposed above the mounting table; and a top plate to which the probe is attached a needle card; four support columns that support the top plate at four corners; and a parallel adjustment mechanism of the probe card that is attached to the top plate at at least three of the four support columns to adjust the above-mentioned top plate a parallelism between the needle card and the object to be inspected disposed on the mounting table below, wherein the parallel adjustment mechanism includes an elevating mechanism between the support post and the top plate of the at least three places, and the elevating mechanism The utility model has: a moving body having an inclined surface, which is arranged to be movable along an upper surface of the support column; and a lifting body coupled to the top plate and along an inclined surface of the moving body -9-201221965 Configuring to be movable up and down; and a driving mechanism for moving the moving body along the upper surface of the support column. In the invention according to claim 7 of the invention, the drive mechanism includes: a ball screw that is screwed to the moving body; and a motor that drives the ball screw. In the invention according to claim 7 or claim 8, the boundary between the support column and the moving body, and the inclined surface of the moving body and the lifting body are provided in the invention. The boundary of the inclined surface is respectively associated with a moving guiding mechanism. Further, the inspection apparatus according to claim 10 of the present invention is the invention of claim 9, wherein the movement guide mechanism has a cross roller. In the invention according to any one of the claims 7 to 10, the inspection apparatus according to any one of the claims 7 to 10 of the present invention provides a lifting and lowering guide for elevating and guiding the elevating body. In the invention described in claim 1 to claim 1, the moving body and the lifting system are engaged in each of the tilting systems. The surface is engaged to form a rectangular block. [Effect of the Invention] According to the present invention, it is possible to provide a parallel adjustment mechanism and an inspection device for a probe card, which are capable of obtaining an appropriate overdrive amount and a stable probe mark 'a top plate having versatility can be used. Further, the adjustment of the parallelism can be made ample. -10- 201221965 [Embodiment] Hereinafter, the present invention will be described based on the embodiments shown in Figs. 1 to 3 . For example, as shown in FIG. 1 and FIG. 2, the inspection apparatus 1A of the present embodiment includes a movable mounting table (wafer chuck) 11 on which a wafer W is placed, and a probe card 12 disposed in the crystal. Above the round collet 11; a card clamping mechanism 14 that fixes the probe card 12 via a clip 13; a top plate 15 with a tether clamping mechanism 14 secured thereto; a support post 16 that is tied to four a corner supporting top plate 15; and a parallel adjusting mechanism 17 for adjusting the parallelism between the wafer W on the wafer chuck 11 and the probe card 12, and the probe card 12 is connected to the test head via the connecting ring R (not shown) After that, the electrical characteristic inspection of the wafer W is performed under the control of the control device. Further, the probe card 12 is a chucking mechanism 14 which is attached to the lower surface of the top plate 15. Since the top plate 15 is not divided as in the related art, the top plate 15 is originally provided with high rigidity. As a result, even if a test head (not shown) is placed on the top surface of the top plate 15, and a large contact load acts between the probe card 12 and the wafer W, the top plate 15 is not easily bent in the up and down direction, and the probe card 12 is The needle end position of the plurality of probes 12A is stable, and a certain height can be maintained, and an appropriate overdrive amount can be obtained at the same time, and a stable probe mark can be obtained, thereby enabling highly reliable and stable inspection. Further, as shown in FIG. 1 and FIG. 2, the parallel adjustment mechanism 17 is constituted by four elevating mechanisms 17A between the four corners of the top plate 15 and the four support columns 16 at 201221965, respectively, and utilizes four lifting mechanisms. 17A adjusts the parallelism of the probe card 12 and the wafer W on the wafer chuck 11. At this time, the parallelism between the probe card 12 and the wafer W is measured by a measuring device such as a capacitive sensor or a laser length measuring device. As shown in Fig. 2, in the present embodiment, the elevating mechanism 17A is disposed at four locations, but the elevating mechanism 17A may be disposed at at least three of the support columns 16 at four locations. When the elevating mechanism 17A is disposed at three places, for example, the top plate 15 can be supported obliquely at a certain height as long as the support column 16 at the remaining one is supported. As long as the lifting mechanism 17A is disposed at least at three places, each of the lifting mechanisms 1 7 A can be individually controlled, and the inclination angle of the top plate 15 can be enlarged compared with the two places, so that the probe card 12 and the wafer chuck 1 1 can be The wafer W has a sufficient angle of adjustment. As shown in FIG. 1 to FIG. 3, each of the four elevating mechanisms 17A is formed in a substantially rectangular block shape, and each elevating mechanism 17A is fixed to the upper surface of the support post 16 at each of the four lower portions, and each of the upper surfaces is provided. They are respectively connected to the four corners of the top plate 15. As shown in FIG. 1 to FIG. 3, the elevating mechanism 17A includes: a base body 17B that is fixed to the upper surface of the support column 16; and a movable body 17C having an inclined surface that is disposed to be movable along the upper surface of the base body 17B; a lifting body 17E having a tilting member connected to the top plate 15 by a connecting member 17D, and configured to be movable up and down along an inclined surface of the moving body 17C; and -12-201221965 driving mechanism 1 7F, This moves the moving body 1 7C along the upper surface of the support column 16 , and the drive mechanism 17F is driven under the control of the control device, and the moving body 17C is moved forward and backward (in the left and right directions in FIGS. 1 to 3 ). The predetermined size is moved, whereby the elevating body 17E can be moved up and down only by a predetermined size via the inclined surface of the moving body 17C. The control device can control the drive mechanism 17F based on the measurement result of the measuring machine. As shown in Fig. 1 and Fig. 3, both the movable body 17C and the elevating body 17E are formed in a substantially trapezoidal shape on the side surface, and each of the inclined surfaces is engaged with each other to form a rectangular block that is received on the support post 16, and each of the pair is opposed to each other. The front, rear, left, and right parallel faces are substantially identical to the side faces of the support post 16, and the upper and lower faces are fixed to the upper surface of the support post 16 and the top plate 15. The moving body 17C located at the rear of the inspection device 1A (on the right side in Fig. 1) has a portion in which the upper end portion extends to the front side (the left side in Fig. 1) of the inspection device 1A, and has an eaves shape. As shown in Fig. 3 (a), the drive mechanism 17F for moving the movable body 17C has a ball screw 17A that is screwed with a female screw formed in the front-rear direction of the movable body 17C, and a motor 17H that drives the ball screw 17G. The moving body 17C is moved in the front-rear direction along the upper surface of the base 17B. A first movement guide mechanism 171 is provided between the base body 17B and the movable body 17C, and the movable body 17C can smoothly move in the front-rear direction on the base body 17B via the movement guide mechanism 171. Further, a second movement guide mechanism 17J' is provided between the inclined surface of the moving body 17C and the inclined surface of the elevating body 17E. The elevating body 17E can be moved in the front-rear direction along the inclined surface of the moving body 17C via the movement guiding mechanism 17J. And smoothly rise and fall. As shown in Fig. 3(b), the movement guiding mechanisms 171 - 13 - 20122 1965 and 1 7J each have at least two rows of intersecting rollers which are movable along the respective linear slides. Since the first and second movement guiding mechanisms 171 and 17J each have at least two rows of intersecting rollers, the load resistance is excellent, and the guidance can be smoothly moved even under a high load. Further, as shown in Fig. 3(a), the base 17B protrudes from the side surface of the support post 16, and the motor 17H is disposed in the protruding portion. In the protruding portion of the base body 17B, the elevation guide mechanism 17K of the elevation guide lifting and lowering body 17E is provided between the motor 17H and the side surface of the support column 16. The lifting guide mechanism 17K has a linear slide rail 17 7 L provided on the base body 1 7 B and a cross roller (refer to FIG. 3 (b)) of the linear slide rail 17L via at least two rows, according to The linear slide rail 17L lifts and lowers the engaging body 17M of the guide lifter 17E. Therefore, the moving body 17C is moved forward and backward via the driving mechanism 17F, and the lifting body 17E can be raised and lowered via the lifting guide mechanism 17K having at least two rows of intersecting rollers. Second, explain the relevant actions. First, in order to inspect the wafer W, the probe card 12 is attached to the card clamping mechanism 14. Under the mounting of the probe card 12, not the probe card 12 is formed in parallel with the wafer W on the wafer chuck 11. Then, the parallelism of the probe card 12 and the wafer W is measured by a measuring machine. That is, the distance between the probe card 12 and the wafer W is measured at a plurality of points by the measuring device. The inclination of the probe card 12 to the wafer W on the wafer chuck 1 is measured. The measurement result of the measuring machine is transmitted to the control device. The control device transmits a unique measurement signal to each of the four drive mechanisms 17F of the parallel adjustment mechanism 17 based on the measurement result, and individually controls the drive mechanism 17F. Each of the driving mechanisms 17F is driven, and each of the moving bodies 17C moves only by a predetermined size via the movement guidance mechanism 171 of the -14-201221965. Accordingly, when each of the elevating bodies 17E is lifted and lowered by a predetermined size via the second movement guide mechanism 17J, each of the elevating bodies 17E raises and lowers the four corners of the top plate 15 by a predetermined size, and adjusts the inclination of the top plate 15 to detect The needle card 12 is formed in parallel with the wafer W on the wafer chuck 11. As described above, according to the present embodiment, since the probe card 12 is provided on the top plate 15, the elevating mechanism 17A constituting the parallel adjustment mechanism 17 is provided between the top plate 15 and the support columns 16 at four places. The rigidity of the top plate 15 is reinforced, whereby an appropriate overdrive amount and a stable probe mark can be obtained, a versatile top plate can be used, and the parallelism of the top plate 15 can be adjusted by the four corners of the top plate 15, The adjustment of the parallelism of the top plate 15 and the wafer W can be made sufficient. Further, since the elevating mechanism 17A constituting the parallel adjustment mechanism 17 is provided between the top plate 15 and the support columns 16 at four places, a special support mechanism for mounting the parallel adjustment mechanism 17 is not required, and it can be mounted at various low-cost inspections. Device. Further, the present invention is not limited to the above embodiment, and various components can be designed and modified as appropriate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view showing an essential part of an embodiment of an inspection apparatus according to the present invention. Fig. 2 is a plan view of the inspection apparatus shown in Fig. 1. 3(a) and 3(b) are diagrams showing the adjustment mechanism of the flat -15-201221965 line of the inspection apparatus shown in Fig. 1, (a) is a cross-sectional view thereof, and (b) is a view showing the use of (a). An example cross-sectional view of the moving mechanism of the parallel adjustment mechanism shown. 4 is a side view showing a main part of a conventional inspection device. Figure 5 is a plan view of the inspection apparatus shown in Figure 4 . [Description of main component symbols] 10 : Inspection device 1 1 : Wafer chuck (mounting table) 1 2 : Probe card 1 2 A : Probe 14 : Card clamping mechanism 15 : Top plate 1 6 : Support column 1 7 : Parallel adjustment mechanism 17A: Elevating mechanism 17C: Moving body 17E: Elevating body 17F: Driving mechanism 171: First moving guiding mechanism 17J: Second moving guiding mechanism 17K: Elevating guiding mechanism W: Wafer (inspected body) -16-