201140092 六、發明說明 【發明所屬之技術領域】 本發明是有關頂板的水平機構及探針裝置，更詳細是 有關被檢查體與探針卡電性接觸而進行被檢查體的電性特 性檢查時，即使在頂板有大的接觸荷重作用，還是可防止 根據頂板的變形之探針的位移，得以進行可靠度高的檢查 之頂板的水平機構及探針裝置。 Ο 【先前技術】 探針裝置是具備： 載置台，其係載置被檢查體（例如半導體晶圓），且可 移動於X、Y、Z方向及Θ方向； 探針卡，其係配置於載置台的上方； 頂板，其係保持探針卡；及 支撐柱，其係於四個角落支撐頂板。 〇 在進行半導體晶圓的電性特性檢查時，是在進行載置 台上的半導體晶圓的複數個電極焊墊與探針卡的複數個探 針之對位後，載置台會上昇來使半導體晶圓與探針卡電性 接觸而進行半導體晶圓的電性特性檢查。 半導體晶圓的複數個電極焊墊與探針卡的複數個探針 爲了分別在均一的針壓下接觸，載置台上的半導體晶圓與 探針卡必須始終形成平行。於是，在探針裝置中設有用以 將探針卡調整成平行於載置台上的半導體晶圓之水平機 構。如此的水平機構，例如有專利文獻1〜3所記載的發 -5- 201140092 明爲人所知。 記載於專利文獻1的發明，是在支撐探針卡的嵌入環 (insert ring)與頂板之間於周方向取等間隔來設置第1、第 2支承機構。第1支承機構是可傾斜地於一處支承嵌入 環’第2支承機構是二處可個別地昇降支承嵌入環。第2 支承機構是具備馬達、滾珠螺桿、楔子及球體，可令馬達 驅動經由滾珠螺桿來使楔子進退作動而使嵌入環昇降，經 由球體來調整嵌入環的傾斜程度。並且，在專利文獻2中 記載有與專利文獻1所記載的發明同樣地以在周方向取所 定間隔的三點來支撐嵌入環，且以二處的支撐點來調整探 針卡的傾斜之發明。在專利文獻2的發明中使用供以調整 探針卡的傾斜之調整螺絲的點是與專利文獻1的發明不 同。以下將如此調整載置台上的半導體晶圓與探針卡的平 行度之機構稱爲水平機構。 在專利文獻1的發明是經由嵌入環來調整探針卡的水 平度，但如圖4、圖5所示般亦有經由保持探針卡的頂板 來調整探針卡的水平度之水平機構。一邊參照圖4、圖5 一邊槪說有關此水平機構。 如圖4所示，此水平機構具備： 頂板1，其係具有保持探針卡（未圖示）的孔1 A ; 一對的第1支撐柱2、2，其係於後端部（同圖的右側） 的左右兩側支撐頂板1 ; 一對的第2支撐柱3、3，其係於前端部（同圖的左側） 的左右兩側支撐頂板1 ; -6- 201140092 一對的昇降機構4、4，其係設於第1支撐柱2、2的 上端，且使頂板1後端部分別在左右兩側個別地昇降；及 軸機構6(參照圖5)，其係固定在被架設於一對的第2 支撐柱3、3間的支撐體5的中央部與頂板1的前端部各 個的中央部，且在支撐體5上於左右方向可搖動地支撐頂 板1前端部， 構成以軸機構6的支撐點爲基準，藉由一對的昇降機 0 構4、4來使頂板1的後端部昇降，而得以調整頂板1的 水平度。另外，在圖4中，1B是用以將軸機構6固定於 頂板1的螺紋孔。 在頂板1的下方，可移動地配置有載置台（未圖示）， 此載置台是在以第1、第2支撐柱2、3所形成的空間內 移動。頂板1的後端部是配置於第1支撐柱2、2的上端 面之一對的固定塊7、7藉由銷8、8來鉸鏈結合，可抬起 頂板1的前端部來使內部開放。並且，在一對的固定塊 ❹ 7、7間架設有輔助板（subplate)(未圖示）。 如此，頂板1是其後端部的左右二點會藉由一對的昇 降機構4、4所支撐，其前端部的中央一點會藉由軸機構 6所支撐，如圖6中粗線所示，形成以三角形的三點所支 撐的三點支撐構造。並且，在頂板1的上面配置有測試頭 (未圖示），此測試頭是以頂板1的上面的三處的支撐點S 所支撐。 圖4所示的昇降機構4，例如基本上是與依據本案申 請人所提案的專利文獻1記載的昇降機構同樣，具有馬達 201140092 4A、滾珠螺桿4B及楔子4C，馬達4A會經由滾珠螺桿 4B來使楔子4C進退作動，經由固定塊7來使頂板1昇 降。 又，例如圖5所示，軸機構6是具有： 一對的第1軸支構件6A、6A，其係於頂板1下面的 前後，取所定間隔來固定，且具有軸孔； 第2軸支構件6B，其係具有藉由一對的軸支構件 6A、6A來夾持的軸孔，且被固定於支撐體5的上面；及 軸6C，其係貫通一對的第1軸支構件6A、6A的軸 孔及第2軸支構件6B的軸孔， 以軸6 C爲中心來搖動自如地支撐頂板1。 並且，在專利文獻3中記載一探測器，其係具有在四 個角落支撐頂板的支撐機構。此探測器是具備：支撐晶圓 的晶圓吸盤、及使晶圓吸盤移動的XY移動機構及Z移動 機構、以及保持探針卡的頂平台。而且，調整頂平台的傾 斜之平台支撐機構會被設於複數處（具體而言是頂平台的 四個角落）。平台支撐機構是具備馬達、齒輪、進給螺桿 機構及導件’經由Z移動機構來使晶圓吸盤上的晶圓的電 極與探針卡的探針電性接觸時驅動，而將電極與探針的接 觸壓調整於所定範圍。因此，該探測器是使頂平台以其四 個角落的4點所支撐，由4點來對頂平台調整水平度，且 修正晶圓吸盤所造成晶圓的驅使過度（overdrive)。 [專利文獻1]特開2006-317302號公報 [專利文獻2]特開平7-231018號公報 -8- 201140092 [專利文獻3]特開2008-294292號公報 【發明內容】 (發明所欲解決的課題） 然而，隨著半導體晶圓大口徑化且高集積化，探針卡 的探針數會激增，檢查時半導體晶圓與探針卡電性接觸時 的接觸壓會達200Kg程度，在頂板產生彎曲。如圖4〜圖 0 6所示具備水平機構，當頂板1爲以三點所支撐的探針裝 置時，頂板1上的測試頭的支撐點S的三點之中，二點爲 處於連結二個昇降機構4與一個軸機構6的三角形領域的 外側，所以頂板1會因測試頭的荷重而向下彎曲，形成容 易沈下的構造。此構造在半導體晶圓與探針卡電性接觸 時，若從頂板1的中央部下面有像上述那樣大的荷重作 用，則會在好不容易調整折角平行度後的頂板產生新的彎 曲。而且，頂板1的前端部雖藉由軸機構6的軸6C所支 Q 撐，但因爲此軸6C剛性低，所以因接觸壓所造成的彎 曲，軸6 C會變形，頂板1會位移於前後方向或左右方 向，進而探針會從所對應的電極焊墊位移，恐有使檢查的 可靠度降低之虞。記載於專利文獻3的探測器也是藉由軸 所支撐，因此經不起往頂平台的前後左右方向之位移，發 生同樣的問題。 於接機 在性平 是電水 的卡的 目針板 其探頂 ， 與之 者體查 發查檢 硏檢的 而被高 題的度 課等靠 述圓可 上晶行 決體進 解導’ 了半移 爲制位 是抑的 明可板 發種頂 本 一 的 供時 提觸 -9 _ 201140092 構及探針裝置。 (用以解決課題的手段） 本發明的請求項1所記載的頂板的水平機構，係具 備： 頂板，其係保持探針卡； 一對的第1支撐柱，其係於後端部的左右兩側支撐上 述頂板； 一對的第2支撐柱，其係於前端部的左右兩側支撐上 述頂板； 一對的昇降機構，其係設於上述第1支撐柱的上端， 且使上述頂板後端部分別在左右兩側個別地昇降；及 軸機構，其係固定在被上述一對的第2支撐柱所架設 的支撐體的中央，且於左右方向可搖動地軸支上述頂板前 端部， 調整上述頂板的水平度之頂板的水平機構， 其特徵爲： 分別在上述頂板的前端部與上述一對的第2支撐柱的 上端面設置用以拘束上述頂板的水平方向的位移之位置拘 束機構。 又，本發明的請求項2所記載的頂板的水平機構，係 於請求項1所記載的發明中，上述位置拘束機構係具有： 倒圓錐狀的第1凹部，其係形成於上述第2支撐柱； 第2凹部’其係於上述頂板前端部對應於上述第1凹 -10- 201140092 部形成；及 球體，其係介於上述第1'第2凹部之間’且在上述 頂板前端部與上述一對的第2支撐柱上端面之間形成間 隙。 又，本發明的請求項3所記載的頂板的水平機構，係 於請求項1或請求項2所記載的發明中，上述第1凹部係 設在固定於上述第2支撐柱的上端面的第1承具’且上述 0 第2凹部係設在固定於上述頂板的第2承具。 又，本發明的請求項4所記載的探針裝置’係具備： 可移動的載置台，其係載置被檢查體； 頂板，其係保持被配置於上述載置台的上方之探針 卡； 一對的第1支撐柱，其係以後端部的左右兩側來支撐 上述頂板； 一對的第2支撐柱，其係以前端部的左右兩側來支撐 Q 上述頂板；及 頂板的水平機構，其係調整上述頂板的水平度， 上述水平機構係具備； 一對的昇降機構，其係設於上述第1支撐柱的上端， 且使上述頂板後端部分別在左右兩側個別地昇降；及 軸機構，其係固定於被上述一對的第2支撐柱所架設 的支撐體的中央，且在左右方向可搖動地軸支上述頂板前 端部， 其特徵爲： -11 - 201140092 分別在上述頂板的前端部與上述一對的第2支撐柱的 上端面設置用以拘束上述頂板的水平方向的位移之位置拘 束機構。 又’本發明的請求項5所記載的探針裝置，係於請求 項4所記載的發明中，上述位置拘束機構係具有： 倒圓錐狀的第1凹部’其係形成於上述第2支撐柱； 第2凹部，其係於上述頂板前端部對應於上述第1凹 部形成；及 球體’其係介於上述第1、第2凹部之間，且在上述 頂板前端部與上述一對的第2支撐柱上端面之間形成間 隙。 又’本發明的請求項6所記載的探針裝置，係於請求 項4或請求項5所記載的發明中’上述第1凹部係設在固 定於上述第2支搏柱的上端面的第1承具，且上述第2凹 部係設在固定於上述頂板的第2承具。 [發明的效果] 若根據本發明，則能提供一種可抑制半導體晶圓等的 被檢查體與探針卡電性接觸時的頂板的位移，進行可靠度 高的檢查之頂板的水平機構及探針裝置。 【實施方式】 以下’根據圖1〜圖3所示的實施形態來說明本發 明。 -12- 201140092 例如圖1所示，本實施形態的探針裝置1 〇是具備： 可移動的載置台（未圖示）’其係載置被檢查體（例如 半導體晶圓）（未圖示）； 頂板11’其係保持被配置於載置台的上方之探針卡 (未圖不）， 一對的第1支撐柱12 ’其係於後端部的左右兩側支 撐頂板1 1 ; 0 一對的第2支撐柱13 ’其係於前端部的左右兩側支 撐頂板1 1 ;及 頂板的水平機構（以下簡稱「水平機構」）2 0，其係調 整頂板U的水平度。 水平機構2 0是具備： 一對的昇降機構14，其係設在於左右兩端部支撐頂 板11的後端部之第1支撐柱12的上端，且使頂板11的 後端部分別在左右兩側個別地昇降； Q 軸機構16,其係固定於被一對的第2支撐柱13所架 設的支撐體15的中央，且於左右方向可搖動地軸支頂板 11的前端部；及 位置拘束機構1 9，其係介於頂板1 1的前端部的左右 兩側與一對的第2支撐柱1 2的上端面之間，且拘束頂板 1 1的水平方向的位移。 本實施形態的水平機構20除了具備位置拘束機構1 9 以外，按照以往的水平機構來構成。 如圖1所示，昇降機構1 4是與以往的昇降機構同樣 13- 201140092 構成，具有馬達14A、滾珠螺桿14B及楔子14C，馬達 14A會經由滾珠螺桿14B來使楔子14C進退作動，使頂 板11昇降。軸機構16也是與以往的軸機構6同樣構成。 本實施形態是如上述般在頂板1 1前端部的左右兩側與一 對的第2支撐柱1 3的上端面之間設有位置拘束機構1 9， 如圖2所示具有從下面支撐頂板1 1的5處之五點支撐構 造的特徵。另外，在圖1、圖2中，位置拘束機構19的 支撐點是以具有網點的圓所示。 例如圖3所示，位置拘束機構1 9是具有： 倒圓錐狀的第1凹部1 9 A，其係形成於第2支撐柱 1 3的上端面； 第2凹部1 9B，其係於頂板1 1的前端部對應於第1 凹部1 9A形成；及 球體19C，其係介於第1、第 2凹部 19A、19B之 間，且在頂板11的前端部的下面與一對的第2支撐柱13 的上端面之間形成間隙δ。 因爲形成有間隙δ，所有頂板1 1會如圖3中箭號所 示般經由球體1 9 C來傾斜於左右前後。又，由於球體1 9 C 被拘束於第1、第2凹部1 9 A、1 9Β內，因此即使頂板1 1 在檢查時有彎曲’頂板1 1還是會經由一對的球體1 9C來 拘束於第】、第2凹部19A、19B內’不會有頂板11位移 於前後左右方向的情形予以拘束，不會有在半導體晶圓的 電極焊墊與探針卡的探針間產生位移的情形，可進行可靠 度高的檢查。 -14- 201140092 又，第2凹部1 9 B是設於例如被固定於頂板1 1的孔 之第2承具19D。第2凹部19B是如圖3所示形成具有與 球體19C的外徑實質上同一直徑的圓筒狀，深處形成圓錐 狀。因此，球體19C是在第2凹部19B內線接觸。並 且，在嵌入球體19C的第2凹部19B的球體19C側固定 有環狀的卡止部19E，使球體19C不會從第2凹部19B脫 落。另外，第1凹部19A是直接形成於第1支撐柱13的 0 上端面，但亦可與第2凹部1 9B同樣形成於第1承具（未 圖示）的一面，將第2承具固定於第2支撐柱13的上端 面。 其次’說明有關水平機構2 0的動作。首先，將探針 卡安裝於頂板1 1 ’在頂板11上配置測試頭後，測定載置 台上的半導體晶圓與頂板11的平行度。在此階段，頂板 11與載置台上的半導體晶圓的平行度是未調整。於是， 載置台會移動於水平方向，藉由第2CCD攝影機，在彼此 Q 離開的複數處檢測探針卡的探針尖端的高度。該等的檢測 値是被儲存於未圖示的控制裝置的記憶部。若複數處的探 針尖端高度分別相同’則探針卡亦即頂板與載置台的上面 是形成平行’因此不調整頂板1 1的平行度，移往半導體 晶圓的檢查。 當頂板11與載置台的上面未平行時，使用水平機構 20來將該等兩者調整成平行。此情況，是藉由載置台的 第2CCD攝影機來檢測複數處的探針尖端高度，根據此算 出結果來算出相對於軸機構16之一對的第1、第2支撐 -15- 201140092 柱1 2上的2個昇降機構14的昇降量。其次，若由控制裝 置來對2個昇降機構14發送各個的控制信號，則2個昇 降機構〗4會根據各個的控制信號來驅動馬達14A，經由 滾珠螺桿MB來使楔子14C進退作動，而使頂板11的後 端部從左右兩側昇降，以軸機構1 6爲基點調整頂板1 1的 水平度。此時，在位置拘束機構19也會經由球體19C來 使頂板1 1圓滑地傾斜。藉此，調整頂板1 1與載置台的平 行度，載置台上的半導體晶圓的複數個電極焊墊與探針卡 的複數個探針會以均一的接觸壓（針壓）來電性接觸，可進 行半導體晶圓的電性特性檢查。 可是，隨著探針數的激增，一旦接觸壓達200Kg程 度，則會將頂板1 1的中央部推上去，而於頂板1 1發生彎 曲。但，本實施形態因爲在頂板11上的測試頭的三處支 撐點皆位於連結5處支撐點的五角形的領域內，所以來自 測試頭的荷重所造成頂板1 1的彎曲及沈下會被抑制，因 此作用於探針卡與載置台上的半導體晶圓之間的接觸壓所 造成頂板11的彎曲也會變少。而且，在頂板11的前端部 的左右二處藉由位置拘束機構19所拘束，因此可防止頂 板11的彎曲所造成的位移，進而可防止探針卡的複數個 探針與載置台上的半導體晶圓的複數個電極焊墊的位移， 得以進行可靠度高的檢查。 在此，將實際使測試頭著落於頂板1 1上，分別對頂 板1 1上的三處支撐點S施加200kgf的荷重，測定在各支 撐點S之X方向、Y方向及z方向的位移量的結果顯示 -16 - 201140092 於表1。根據表1所示的結果’可知藉由使位置拘束機構 1 9介於頂板1 1的前端部的左右兩側與一對的第2支撐柱 12的上端面之間的二處’在測試頭的三處支撐點s之X 方向及Y方向的位移量會顯著地被抑制，且Z方向的沈 下量會顯著地被抑制。另外，表1的平面性是表示在各指 示點S之沈下量的最大値與最小値的差。另外，在表1 中，球體是表示位置拘束機構19。 〇 [表1] 解析 項目 從測試器對各著落點施加200kgf的荷重時之頂板的位移(μιη) X方向位移 Y方向位移 Z方向位移(沈下） A B C A B C A B C Z方向位移 (沈下)— 無球體 7 1 7 -64 -43 -44 219 552 328 333 有球體 11 5 7 -7 2 -1 100 33 104 71 如以上說明，若根據本實施形態，則因爲水平機構 Ο 20具備： 一對的昇降機構14，其係設在於左右兩端部支撐頂 板1 1的後端部之第1支撐柱12的上端，且使頂板1 1的 後端部分別在左右兩側個別地昇降； 軸機構16，其係固定於被一對的第2支撐柱13所架 設的支撐體15的中央，且於左右方向可搖動地軸支頂丰反 1 1的目丨j端部，及 位置拘束機構1 9，其係分別設於頂板1 1的前端部與 一對的第2支撐柱1 2的上端面，且拘束頂板1 1的水平方 -17- 201140092 向的位移， 且，位置拘束機構1 9具有： 倒圓錐狀的第1凹部19 A，其係形成於第2支撐柱 1 3的上端面； 第2凹部19B，其係於頂板1 1的前端部對應於第1 凹部19A形成；及 球體19C ’其係介於第1、第2凹部19A、19B之 間’且在頂板1 1的前端部的下面與一對的第2支撐柱1 3 的上端面之間形成間隙δ。 因此，即使在頂板1 1有大的荷重作用，還是可抑制 頂板1 1的彎曲，且可防止頂板11的水平方向的位移，抑 制半導體晶圓與探針卡電性接觸時之頂板的位移，進而能 夠進行可靠度高的檢查。 又，若根據本實施形態，則藉由將第1凹部19 Α設 在固定於第2支撐柱13的上端面的第1承具（未圖示）， 且將第2凹部19B設在固定於頂板11的第2承具19D， 可將以往的三點支撐構造改造成五點支撐構造。 另外，本發明並非限於上述實施形態，亦可在本發明 的範圍內適當變更設計各構成要素。 [產業上的利用可能性] 本發明可適用於探針裝置。 【圖式簡單說明】 -18- 201140092 圖1是表示本發明的探針裝置之一實施形態的要部立 體圖。 圖2是用以說明使用於圖1所示的探針裝置之本發明 的頂板的水平機構之一實施形態的支撐構造的平面圖。 圖3是表示圖1所示的頂板的水平機構的要部剖面 圖。 圖4是表示使用於以往的探針裝置之頂板的水平機構 Q 之一例的立體圖。 圖5是表示使用於圖4所示的頂板的水平機構之軸機 構的立體圖。 圖6是用以說明圖4所示的頂板的水平機構之頂板的 支撐構造的平面圖。 【主要元件符號說明】 1 〇 :探針裝置 〇 11 :頂板 12 :第1支撐柱 13 :第2支撐柱 1 4 :昇降機構 15 :支撐體 16 :軸機構 1 9 :位置拘束機構 19 A :第1凹部 1 9 B :第2凹部 -19- 201140092 1 9 C :球體 1 9 D :第2承具 2 0 :水平機構 -20-201140092 VI. Description of the Invention [Technical Field] The present invention relates to a horizontal mechanism and a probe device for a top plate, and more specifically relates to an electrical property inspection of an object to be inspected when the object to be inspected is electrically contacted with the probe card. Even if the top plate has a large contact load, it is possible to prevent the displacement of the probe according to the deformation of the top plate, and to realize the horizontal mechanism and the probe device of the top plate with high reliability inspection. Ο [Prior Art] The probe device includes: a mounting table on which a test object (for example, a semiconductor wafer) is placed, and is movable in the X, Y, and Z directions and the x direction; and the probe card is disposed in the mounting Above the mounting table; a top plate that holds the probe card; and a support column that supports the top plate at four corners.进行 When performing electrical property inspection of a semiconductor wafer, after the plurality of electrode pads of the semiconductor wafer on the mounting table are aligned with the plurality of probes of the probe card, the mounting table is raised to make the semiconductor The wafer is electrically contacted with the probe card to perform electrical property inspection of the semiconductor wafer. The plurality of electrode pads of the semiconductor wafer and the plurality of probes of the probe card are respectively in contact with each other under a uniform pin pressure, and the semiconductor wafer and the probe card on the mounting table must always be parallel. Thus, a horizontal mechanism for adjusting the probe card to be parallel to the semiconductor wafer on the mounting table is provided in the probe device. Such a horizontal mechanism is known, for example, from Japanese Patent Application Laid-Open No. Hei No. Hei. According to the invention of Patent Document 1, the first and second support mechanisms are provided at equal intervals in the circumferential direction between the insert ring supporting the probe card and the top plate. The first support mechanism supports the insertion ring at an inclined position. The second support mechanism is two places, and the insertion ring can be individually lifted and lowered. The second support mechanism is provided with a motor, a ball screw, a wedge, and a ball. The motor is driven to move the wedge forward and backward via the ball screw to raise and lower the insertion ring, and the inclination of the insertion ring is adjusted by the ball. In the same manner as the invention described in Patent Document 1, the invention discloses that the insertion ring is supported by three points at predetermined intervals in the circumferential direction, and the inclination of the probe card is adjusted by the support points at two places. . The point of using the adjusting screw for adjusting the inclination of the probe card in the invention of Patent Document 2 is different from the invention of Patent Document 1. Hereinafter, the mechanism for adjusting the degree of parallelism between the semiconductor wafer and the probe card on the mounting table is referred to as a horizontal mechanism. In the invention of Patent Document 1, the level of the probe card is adjusted via the insertion ring. However, as shown in Figs. 4 and 5, there is also a horizontal mechanism for adjusting the level of the probe card via the top plate holding the probe card. Referring to Figures 4 and 5, we will talk about this level mechanism. As shown in FIG. 4, the horizontal mechanism includes: a top plate 1 having a hole 1 A for holding a probe card (not shown); and a pair of first support columns 2 and 2 attached to the rear end portion (the same The top left side of the figure supports the top plate 1; the pair of second support columns 3, 3 are supported on the left and right sides of the front end portion (the left side of the same figure) to support the top plate 1; -6- 201140092 The mechanisms 4 and 4 are disposed at the upper ends of the first support columns 2 and 2, and the rear end portions of the top plate 1 are individually raised and lowered on the left and right sides, respectively; and the shaft mechanism 6 (see FIG. 5) is fixed to the The center portion of the support body 5 between the pair of second support columns 3 and 3 and the front end portion of the top plate 1 are supported, and the front end portion of the top plate 1 is supported by the support body 5 in the left-right direction. Based on the support points of the shaft mechanism 6, the rear end portions of the top plate 1 are lifted and lowered by a pair of elevator structures 4, 4, and the level of the top plate 1 is adjusted. Further, in Fig. 4, 1B is a screw hole for fixing the shaft mechanism 6 to the top plate 1. Below the top plate 1, a mounting table (not shown) is movably disposed, and the mounting table moves in a space formed by the first and second support columns 2, 3. The rear end portion of the top plate 1 is a pair of fixing blocks 7 and 7 disposed on one of the upper end faces of the first support columns 2, 2, and is hinge-joined by the pins 8, 8 to lift the front end portion of the top plate 1 to open the inside. . Further, a subplate (not shown) is placed between the pair of fixed blocks 、 7, 7. Thus, the top plate 1 is supported by the pair of lifting mechanisms 4, 4 at the left and right ends of the rear end portion thereof, and the center of the front end portion is supported by the shaft mechanism 6, as shown by the thick line in FIG. A three-point support structure supported by three points of a triangle is formed. Further, a test head (not shown) is disposed on the top surface of the top plate 1, and the test head is supported by the support points S at three positions on the upper surface of the top plate 1. The elevating mechanism 4 shown in FIG. 4 basically has a motor 201140092 4A, a ball screw 4B, and a wedge 4C, similarly to the elevating mechanism described in Patent Document 1 proposed by the applicant, and the motor 4A is via the ball screw 4B. The wedge 4C is moved forward and backward, and the top plate 1 is lifted and lowered via the fixing block 7. Further, for example, as shown in Fig. 5, the shaft mechanism 6 has a pair of first shaft supporting members 6A and 6A which are fixed to the front and rear of the top plate 1 at a predetermined interval and have a shaft hole; the second shaft branch The member 6B has a shaft hole that is sandwiched by the pair of shaft support members 6A, 6A, and is fixed to the upper surface of the support body 5; and a shaft 6C that penetrates the pair of first shaft support members 6A The shaft hole of the 6A and the shaft hole of the second shaft support member 6B swingably support the top plate 1 around the shaft 6 C. Further, Patent Document 3 describes a probe having a support mechanism for supporting a top plate at four corners. The detector is provided with a wafer chuck for supporting the wafer, an XY moving mechanism for moving the wafer chuck, a Z moving mechanism, and a top platform for holding the probe card. Moreover, the platform support mechanism for adjusting the tilting of the top platform will be located at a plurality of locations (specifically, the four corners of the top platform). The platform support mechanism is provided with a motor, a gear, a feed screw mechanism and a guide member. When the electrode of the wafer on the wafer chuck is electrically contacted with the probe of the probe card via the Z moving mechanism, the electrode and the probe are driven. The contact pressure of the needle is adjusted to the specified range. Therefore, the detector is such that the top platform is supported by four points in four corners thereof, the level is adjusted to the top platform by four points, and the overdrive of the wafer caused by the wafer chuck is corrected. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2008-294292. Problem) However, as semiconductor wafers are larger in diameter and higher in integration, the number of probes in the probe card will increase sharply. The contact pressure between the semiconductor wafer and the probe card during electrical inspection will reach 200Kg, on the top plate. Produces a bend. As shown in FIG. 4 to FIG. 0.6, a horizontal mechanism is provided. When the top plate 1 is a probe device supported by three points, among the three points of the support point S of the test head on the top plate 1, two points are in the connection two. The lifting mechanism 4 and the outer side of the triangular region of one of the shaft mechanisms 6 are so that the top plate 1 is bent downward due to the load of the test head, forming a structure that is easy to sink. In this configuration, when the semiconductor wafer is electrically contacted with the probe card, if a large load acts as described above from the lower surface of the center portion of the top plate 1, the new top bend is easily formed after the folding angle parallelism is easily adjusted. Further, although the front end portion of the top plate 1 is supported by the shaft 6C of the shaft mechanism 6, since the rigidity of the shaft 6C is low, the shaft 6 C is deformed due to the bending caused by the contact pressure, and the top plate 1 is displaced before and after. In the direction or the left and right direction, the probe will be displaced from the corresponding electrode pad, which may reduce the reliability of the inspection. The probe described in Patent Document 3 is also supported by the shaft, so that the displacement of the front, rear, left, and right directions of the top platform cannot be withstood, and the same problem occurs. In the pick-up machine, the head of the card that is the electric water is the top of the card, and the person who is inspected and checked by the physical examination is subject to a high-level lesson, etc. The half-shifting to the position is the stipulation of the singularity of the singularity of the singularity of the singularity of the -9 _ 201140092 structure and probe device. (Means for Solving the Problem) The horizontal mechanism of the top plate according to claim 1 of the present invention includes: a top plate that holds the probe card; and a pair of first support columns that are attached to the left and right ends Supporting the top plate on both sides; a pair of second support columns supporting the top plate on the left and right sides of the front end portion; and a pair of lifting mechanisms attached to the upper end of the first support post, and the top plate is reared The end portions are individually raised and lowered on the left and right sides, and the shaft mechanism is fixed to the center of the support body that is stretched by the pair of second support columns, and the front end portion of the top plate is pivotally supported in the left-right direction. The horizontal mechanism of the top plate of the top plate is characterized in that a position restraining mechanism for restraining the horizontal displacement of the top plate is provided at a front end portion of the top plate and an upper end surface of the pair of second support columns. The horizontal mechanism of the top plate according to the invention of claim 2, wherein the position restraining mechanism has a first concave portion having an inverted conical shape and is formed on the second support a second recessed portion is formed in a front end portion of the top plate corresponding to the first recess -10-201140092; and a spherical body is interposed between the first 'second recessed portion' and at the front end portion of the top plate A gap is formed between the upper end faces of the pair of second support columns. In the invention according to claim 1 or claim 2, the first recessed portion is attached to the upper end surface of the second support post. 1 bearing 'and the 0 second recess is attached to the second carrier fixed to the top plate. Further, the probe device according to claim 4 of the present invention includes: a movable mounting table on which the object to be inspected is placed; and a top plate that holds the probe card disposed above the mounting table; a pair of first support columns supporting the top plate on the left and right sides of the rear end portion; a pair of second support columns supporting the top plate by the left and right sides of the front end portion; and the horizontal mechanism of the top plate And adjusting the level of the top plate, wherein the horizontal mechanism is provided; and a pair of lifting mechanisms are disposed on the upper end of the first support column, and the rear end portions of the top plate are individually raised and lowered on the left and right sides; And a shaft mechanism fixed to a center of the support body that is stretched by the pair of second support columns, and pivotably supporting the top end portion of the top plate in a horizontal direction, wherein: -11 - 201140092 are respectively on the top plate The front end portion and the upper end surface of the pair of second support columns are provided with a position restraining mechanism for restraining the horizontal displacement of the top plate. The probe device according to the invention of claim 4, wherein the position restraining mechanism has a first recessed portion having an inverted cone shape formed on the second support post a second recessed portion formed in the top end portion of the top plate corresponding to the first recessed portion; and a spherical body 'between the first and second recessed portions, and the second end portion of the top plate and the second pair of the top plate A gap is formed between the upper end faces of the support columns. The probe device according to the invention of claim 4, wherein the first recess is attached to the upper end surface of the second branch column. A socket, wherein the second recess is attached to a second fixture fixed to the top plate. [Effects of the Invention] According to the present invention, it is possible to provide a horizontal mechanism and a probe for suppressing displacement of a top plate when a test object such as a semiconductor wafer and a probe are electrically contacted, and performing high-reliability inspection. Needle device. [Embodiment] Hereinafter, the present invention will be described based on the embodiments shown in Figs. 1 to 3 . -12- 201140092 As shown in Fig. 1, the probe device 1 of the present embodiment includes a movable mounting table (not shown) for mounting a test object (for example, a semiconductor wafer) (not shown). The top plate 11' holds the probe card (not shown) disposed above the mounting table, and the pair of first support columns 12' support the top plate 1 1 on the left and right sides of the rear end portion; The pair of second support columns 13' support the top plate 1 1 on the left and right sides of the front end portion; and the horizontal mechanism (hereinafter referred to as "horizontal mechanism") 20 of the top plate adjusts the level of the top plate U. The horizontal mechanism 20 includes a pair of elevating mechanisms 14 that are provided at the upper ends of the first support columns 12 that support the rear end portions of the top plate 11 at the left and right end portions, and the rear end portions of the top plate 11 are respectively on the left and right sides. The Q-axis mechanism 16 is fixed to the center of the support body 15 which is erected by the pair of second support columns 13 and is pivotally supported in the left-right direction to support the front end portion of the top plate 11; and the position restraining mechanism Between the left and right sides of the front end portion of the top plate 11 and the upper end surface of the pair of second support columns 12, the displacement of the top plate 11 in the horizontal direction is restricted. The horizontal mechanism 20 of the present embodiment is configured in accordance with a conventional horizontal mechanism in addition to the position restraint mechanism 19. As shown in Fig. 1, the elevating mechanism 14 is constituted by the same 13-201140092 as the conventional elevating mechanism, and has a motor 14A, a ball screw 14B, and a wedge 14C. The motor 14A moves the wedge 14C forward and backward via the ball screw 14B, so that the top plate 11 is moved. Lifting. The shaft mechanism 16 is also configured in the same manner as the conventional shaft mechanism 6. In the present embodiment, as described above, a position restraining mechanism 1 is provided between the left and right sides of the front end portion of the top plate 1 and the upper end faces of the pair of second support columns 1 3, and the top plate is supported from below as shown in FIG. The characteristics of the five-point support structure at five points of 1 1. Further, in Figs. 1 and 2, the support point of the position restraining mechanism 19 is indicated by a circle having a halftone dot. For example, as shown in FIG. 3, the position restraining mechanism 19 has a first concave portion 1 9 A having an inverted cone shape formed on the upper end surface of the second support column 13; and a second concave portion 1 9B attached to the top plate 1 The front end portion of 1 is formed corresponding to the first concave portion 19A, and the spherical body 19C is interposed between the first and second concave portions 19A and 19B, and is formed on the lower surface of the front end portion of the top plate 11 and the pair of second support columns. A gap δ is formed between the upper end faces of 13. Since the gap δ is formed, all the top plates 11 are inclined to the left and right by the spheres 1 9 C as indicated by the arrows in Fig. 3 . Further, since the spherical body 1 9 C is restrained in the first and second recesses 1 9 A and 19 9 , even if the top plate 1 1 is bent at the time of inspection, the top plate 1 1 is restrained by the pair of balls 1 9C. In the second recesses 19A and 19B, the case where the top plate 11 is not displaced in the front-rear and left-right directions is restrained, and there is no possibility that displacement occurs between the electrode pads of the semiconductor wafer and the probes of the probe card. A highly reliable inspection is possible. Further, the second recessed portion 1 9 B is a second contractor 19D provided in, for example, a hole fixed to the top plate 1 1 . The second recessed portion 19B is formed in a cylindrical shape having substantially the same diameter as the outer diameter of the spherical body 19C as shown in Fig. 3, and has a conical shape at a deep portion. Therefore, the ball 19C is in line contact in the second recess 19B. Further, an annular locking portion 19E is fixed to the side of the spherical body 19C of the second concave portion 19B of the fitted spherical body 19C so that the spherical body 19C does not fall off from the second concave portion 19B. Further, the first recessed portion 19A is formed directly on the upper end surface of the first support post 13 , but may be formed on the first contractor (not shown) similarly to the second recessed portion 1 9B, and the second fixture may be fixed. On the upper end surface of the second support column 13. Next, the action of the horizontal mechanism 20 will be described. First, the probe card is attached to the top plate 1 1 '. After the test head is placed on the top plate 11, the parallelism between the semiconductor wafer on the mounting table and the top plate 11 is measured. At this stage, the parallelism of the top plate 11 and the semiconductor wafer on the mounting table is unadjusted. Then, the stage moves in the horizontal direction, and the height of the probe tip of the probe card is detected by the second CCD camera at a plurality of points apart from each other. These detections are stored in a memory unit of a control device (not shown). If the heights of the probe tips at the plurality of points are the same respectively, the probe card, i.e., the top plate and the upper surface of the mounting table, are formed in parallel. Therefore, the parallelism of the top plate 11 is not adjusted, and the inspection of the semiconductor wafer is performed. When the top plate 11 and the upper surface of the mounting table are not parallel, the horizontal mechanism 20 is used to adjust the two to be parallel. In this case, the probe tip height at the plurality of positions is detected by the second CCD camera of the mounting table, and the first and second supports -15 - 201140092 column 1 2 with respect to one pair of the axis mechanisms 16 are calculated based on the calculation result. The amount of lifting and lowering of the two lifting mechanisms 14 above. Next, when the control device transmits the respective control signals to the two elevating mechanisms 14, the two elevating mechanisms 4 drive the motor 14A based on the respective control signals, and the wedges 14C are moved forward and backward via the ball screw MB. The rear end portion of the top plate 11 is lifted and lowered from the left and right sides, and the horizontal degree of the top plate 11 is adjusted based on the shaft mechanism 16 as a base point. At this time, the position restraint mechanism 19 also smoothly inclines the top plate 1 1 via the spherical body 19C. Thereby, the parallelism between the top plate 1 1 and the mounting table is adjusted, and the plurality of electrode pads of the semiconductor wafer on the mounting table and the plurality of probes of the probe card are in contact with each other with a uniform contact pressure (needle pressure). Electrical characteristics inspection of the semiconductor wafer can be performed. However, as the number of probes increases, once the contact pressure reaches 200 Kg, the center portion of the top plate 1 1 is pushed up, and the top plate 11 is bent. However, in this embodiment, since the three support points of the test head on the top plate 11 are all located in the field of the pentagon connecting the support points of the five points, the load from the test head causes the bending and sinking of the top plate 11 to be suppressed. Therefore, the contact pressure between the probe card and the semiconductor wafer on the mounting table causes the curvature of the top plate 11 to decrease. Further, since the left and right ends of the top end portion of the top plate 11 are restrained by the position restraining mechanism 19, the displacement caused by the bending of the top plate 11 can be prevented, and the plurality of probes of the probe card and the semiconductor on the mounting table can be prevented. The displacement of the plurality of electrode pads of the wafer enables a highly reliable inspection. Here, the test head is actually placed on the top plate 1 1 , and a load of 200 kgf is applied to the three support points S on the top plate 1 1 , and the displacements in the X direction, the Y direction, and the z direction of each support point S are measured. The results of the display -16 - 201140092 are shown in Table 1. According to the results shown in Table 1, it can be seen that the position restraint mechanism 19 is placed between the left and right sides of the front end portion of the top plate 1 1 and the upper end faces of the pair of second support columns 12 at the test head. The displacement of the three support points s in the X direction and the Y direction is remarkably suppressed, and the amount of sinking in the Z direction is remarkably suppressed. Further, the planarity of Table 1 is the difference between the maximum 値 and the minimum 表示 of the amount of sinking at each of the indication points S. In addition, in Table 1, the sphere is the position restraint mechanism 19. 〇[Table 1] Analytical item displacement from the top plate when the tester applies a load of 200kgf to each landing point (μιη) X-direction displacement Y-direction displacement Z-direction displacement (sinking) ABCABCABCZ direction displacement (sinking) - no sphere 7 1 7 -64 -43 -44 219 552 328 333 Sphere 11 5 7 -7 2 -1 100 33 104 71 As described above, according to the present embodiment, the horizontal mechanism Ο 20 includes: a pair of lifting mechanisms 14 The upper end of the first support column 12 supporting the rear end portion of the top plate 1 1 at the left and right end portions is provided, and the rear end portions of the top plate 1 1 are individually raised and lowered on the left and right sides; the shaft mechanism 16 is fixed to the shaft mechanism 16 The center of the support body 15 which is erected by the pair of second support columns 13 is pivotally movable in the left-right direction, and the end of the target end of the abundance of the top, and the position restraining mechanism 19 are respectively provided in The front end portion of the top plate 1 1 and the upper end surface of the pair of second support columns 1 2 are restrained from the displacement of the horizontal side -17-201140092 of the top plate 1 1 , and the position restraint mechanism 19 has: an inverted cone shape a recess 19 A formed on an upper end surface of the second support column 13; The second concave portion 19B is formed in the front end portion of the top plate 1 1 corresponding to the first concave portion 19A; and the spherical body 19C ' is interposed between the first and second concave portions 19A and 19B' and at the front end portion of the top plate 1 1 A gap δ is formed between the lower surface and the upper end surface of the pair of second support columns 1 3 . Therefore, even if the top plate 11 has a large load, the bending of the top plate 11 can be suppressed, and the horizontal displacement of the top plate 11 can be prevented, and the displacement of the top plate when the semiconductor wafer and the probe card are electrically contacted can be suppressed. Further, it is possible to perform inspection with high reliability. Further, according to the present embodiment, the first recessed portion 19 is provided on the first fixture (not shown) fixed to the upper end surface of the second support post 13, and the second recessed portion 19B is fixed to the second recessed portion 19B. The second support 19D of the top plate 11 can transform the conventional three-point support structure into a five-point support structure. Further, the present invention is not limited to the above embodiment, and various components of the design may be appropriately changed within the scope of the present invention. [Industrial Applicability] The present invention is applicable to a probe device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an essential part showing an embodiment of a probe device according to the present invention. Fig. 2 is a plan view showing a support structure of an embodiment of a horizontal mechanism of a top plate of the present invention used in the probe device shown in Fig. 1. Fig. 3 is a cross-sectional view of an essential part showing a horizontal mechanism of the top plate shown in Fig. 1; Fig. 4 is a perspective view showing an example of a horizontal mechanism Q used in a top plate of a conventional probe device. Fig. 5 is a perspective view showing a shaft mechanism of a horizontal mechanism used in the top plate shown in Fig. 4; Fig. 6 is a plan view showing the supporting structure of the top plate of the horizontal mechanism of the top plate shown in Fig. 4. [Description of main component symbols] 1 〇: Probe device 〇11: Top plate 12: First support column 13: Second support column 1 4: Lifting mechanism 15: Support body 16: Shaft mechanism 1 9: Position restraint mechanism 19 A : First recess 1 9 B : 2nd recess -19- 201140092 1 9 C : Sphere 1 9 D : 2nd bearing 2 0 : Horizontal mechanism -20-