CN102023237A - Device for leveling head plate and probe apparatus - Google Patents
Device for leveling head plate and probe apparatus Download PDFInfo
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- CN102023237A CN102023237A CN201010285599XA CN201010285599A CN102023237A CN 102023237 A CN102023237 A CN 102023237A CN 201010285599X A CN201010285599X A CN 201010285599XA CN 201010285599 A CN201010285599 A CN 201010285599A CN 102023237 A CN102023237 A CN 102023237A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
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Abstract
The invention discloses a device for leveling head plate and a probe apparatus for restraining deviation of the position of a head plate of semiconductor wafers, among other objects to be detected, upon electric contact with a probe card and subsequently securing a valid detection. The device for leveling head plate (20) comprises a pair of elevating systems (14) which are disposed at the upper end of a first support pole (12) whereof a left and a right end support the rear end portion of the head plate (11), the left and right side of the elevating systems being capable of separately causing the rear end portion of the head plate (11) to be elevated. The device for leveling head plate (20) also comprises an axis mechanism (16) which is fixedly disposed in the center of a support body (15) which is erected by a pair of second support poles (13), the axis mechanism (16) being capable of performing left and right swing around the front end portion of an axis for supporting the head plate (11). The device for leveling head plate (20) also comprises a position restricting mechanism (19) which is respectively disposed at the front end portion of the head plate (11) and the upper end surface of a pair of second support poles (12), for restraining position deviation of the head plate (11) in horizontal direction.
Description
Technical field
Even the present invention relates to the smoothing mechanism of top board and probe unit, relate to when tested having a medical check-up and electrically contact with probe and carry out tested electrical specification of having a medical check-up and have bigger contact load can prevent that also thereby the position deviation based on the probe of roof deformation from can carry out the smoothing mechanism and the probe unit of the top board of the high inspection of reliability to the top board effect when checking in more detail.
Background technology
Probe unit comprises that mounting is tested have a medical check-up (for example semiconductor wafer) and can the mounting table that moves on X, Y, Z direction and the θ direction, be configured in mounting table above probe, keep the top board of probe and with the support column of four jiaos of roof supportings.When the electrical specification of carrying out semiconductor wafer is checked, after carrying out the contraposition between a plurality of probes of a plurality of electrode pads of the semiconductor wafer on the mounting table and probe, mounting table rises, and semiconductor wafer and probe is electrically contacted, to carry out the electrical specification inspection of semiconductor wafer.
Then, when a plurality of probes of a plurality of electrode pads of semiconductor wafer and probe during respectively with uniform pin press contacts, the semiconductor wafer on the mounting table must be always parallel with probe.Therefore, be provided with smoothing mechanism on probe unit, this smoothing mechanism is used to make probe to be adjusted into parallel with respect to the semiconductor wafer on the mounting table.As this smoothing mechanism, for example known invention that patent documentation 1 to 3 record is arranged.
In the invention of patent documentation 1 record, uniformly-spaced spaced apart in the circumferential direction and first, second supporting mechanism is provided with between the insertion ring of supporting probe card and top board.First supporting mechanism supports at a place in the mode that can tilt and inserts ring, and second supporting mechanism supports in two modes of sentencing lifting respectively and inserts ring.Second supporting mechanism has motor, ball-screw, wedge shape part and spheroid, and it makes direct motor drive, makes the action of wedge shape part advance and retreat by ball-screw, so that insert the ring lifting, inserts the inclination situation of ring by the spheroid adjustment.And, record following invention at patent documentation 2: with the invention of patent documentation 1 in the same manner, insert ring with the supported at three point that separates predetermined space in a circumferential direction, adjust the degree of tilt of probe at the strong point at two places.In the invention of patent documentation 2, be with the difference of patent documentation 1: it has used the adjustment screw of the degree of tilt that is used to adjust probe.The mechanism that will so adjust the depth of parallelism of semiconductor wafer on the mounting table and probe in the following description is called smoothing mechanism.
Be to adjust the levelness of probe in the invention of patent documentation 1 by inserting ring, but also just like Fig. 4, the smoothing mechanism that adjusts the levelness of probe by the top board that keeps probe shown in Figure 5.With reference to Fig. 4, Fig. 5 this smoothing mechanism is summarized.As shown in Figure 4, this smoothing mechanism constitutes, and comprising: top board 1, and it has the hole 1A of maintenance probe (not shown); A pair of first support column 2,2, it uses the left and right sides supporting probe card 1 of rearward end (right side of Fig. 4); A pair of second support column 3,3, it uses the left and right sides supporting probe card 1 of leading section (left side of Fig. 4); A pair of elevating mechanism 4,4, it is located at the upper end of a pair of first support column 2,2, and makes the rearward end lifting of probe 1 respectively individually in the left and right sides; With axis mechanism 6 (with reference to Fig. 5), it is fixed on the leading section central portion separately of the central portion that is erected at the supporter 5 between a pair of second support column 3,3 and top board 1, and on supporter 5 with can be along the leading section of the mode supporting probe card 1 of left and right directions swing, with the strong point based on axis mechanism 6 is benchmark, make the rearward end lifting of top board 1 by a pair of elevating mechanism 4,4, to adjust the levelness of top board 1.Wherein, in Fig. 4, label 1B is used for axis mechanism 6 is fixed on threaded hole on the top board 1.
Can dispose mounting table (not shown) movably at the following of top board 1, this mounting table moves in the space that is formed by first, second support column 2,3.The rearward end of top board 1 is by pin 8,8 and be disposed at a pair of fixed block 7,7 twistings of the upper surface of first support column 2,2, the leading section of top board 1 is lifted and can open interior.And, between a pair of fixed block 7,7, set up subplate (not shown).
So top board 1 forms following supported at three point structure: thereafter the end about 2 supported by a pair of elevating mechanism 4,4, its leading section central authorities are a bit supported by axis mechanism 6, as at Fig. 6 with supporting by leg-of-mutton 3 shown in the thick line.And, disposing measuring head at the upper surface of top board 1, this measuring head is supported by the strong point S at three places of top board 1 upper surface.
Elevating mechanism 4 shown in Figure 4 basically with the elevating mechanism of patent documentation 1 record that proposes by the applicant in the same manner, for example have motor 4A, ball-screw 4B and wedge shape part 4C, motor 4A makes the action of wedge shape part 4C advance and retreat by ball-screw 4B, to make top board 1 lifting by fixed block 7.And for example shown in Figure 5, axis mechanism 6 comprises: a pair of first shaft support part 6A, 6A, and it separates predetermined space and is fixed on the front and back of top board 1 lower surface, and has axis hole; The second shaft support part 6B, it is fixed on the upper surface of supporter 5, and has by the axis hole of a pair of shaft support part 6A, 6A clamping; With axle 6C, connect the axis hole of a pair of first shaft support part 6A, 6A and the axis hole of the second shaft support part 6B, this axis mechanism 6 is the center with axle 6C, ground roof supporting 1 can freely swing.
And, on patent documentation 3, record the probe that has at the supporting mechanism of four jiaos of roof supportings.This probe comprise supporting wafers wafer clamp, make XY travel mechanism and the Z travel mechanism that wafer clamp moves and keep the head worktable of probe.And (specifically for a worktable four jiaos) is provided with the worktable supporting mechanism of the degree of tilt of adjusting the head worktable at a plurality of positions.The worktable supporting mechanism has motor, gear, gives thread mechanism and guides, and its probe via the electrode of the wafer of Z travel mechanism on wafer clamp and probe drives when electrically contacting, and electrode is adjusted into preset range with the pressure that contacts of probe.Therefore, the correct worktable of this probe supports 4 of Qi Sijiao, adjust levelness from 4 to the head worktable, and additional wafer clamp is at the overload of wafer.
Patent documentation 1: TOHKEMY 2006-317302 communique
Patent documentation 2: Japanese kokai publication hei 7-231018 communique
Patent documentation 3: TOHKEMY 2008-294292 communique
But along with become heavy caliberization and because of highly integrated of semiconductor wafer, the number of probes of probe is increased sharply, and when checking, the contact pressure when semiconductor wafer electrically contacts with probe reaches about 200Kg, produces deflection on top board.Extremely shown in Figure 6 as Fig. 4, has smoothing mechanism, top board 1 is by under the situation of the probe unit of supported at three point, because 2 outsides that are positioned at the delta-shaped region that connects two elevating mechanisms 4 and an axis mechanism 6 in 3 of the measuring head strong point S on the top board 1, thereby because of the load of measuring head, top board 1 deflection downwards becomes the structure of easy sinking.In this structure, when semiconductor wafer and probe electrically contact, as from the central portion lower surface effect of top board 1 load of size as mentioned above, the then new deflection of generation on the top board of having adjusted the depth of parallelism as far as possible.And, though the leading section of top board 1 is supported by the axle 6C of axis mechanism 6, because the rigidity of this 6C is lower, thereby presses the deflection that causes because of contact, axle 6C distortion and make and have top board 1 position deviation on fore-and-aft direction, left and right directions and reduce the reliability problems of checking.The probe of patent documentation 3 record is also supported by axle, thereby the head worktable dies down at direction position deviation all around, produces same problem.
Summary of the invention
The present invention makes in order to address the above problem, its purpose is to provide a kind of smoothing mechanism and probe unit of top board, so that can suppress the position deviation of the tested top board when electrically contacting of having a medical check-up such as semiconductor wafer, can carry out the high inspection of fiduciary level with probe.
The smoothing mechanism of the top board of technical solution of the present invention 1 record,, it is characterized in that, be used to adjust the levelness of above-mentioned top board, and comprise: the top board that keeps probe; Support a pair of first support column of above-mentioned top board with the left and right sides of rearward end; Support a pair of second support column of above-mentioned top board with the left and right sides of leading section; A pair of elevating mechanism is located at the upper end of above-mentioned first support column, and makes the lifting of above-mentioned top board rearward end respectively individually in the left and right sides; And axis mechanism, it is fixed in the central authorities of the supporter that is set up by above-mentioned a pair of second support column, and can swing the leading section that the earth's axis supports above-mentioned top board along left and right directions, be provided with the position restriction mechanism of the position deviation on the horizontal direction of the above-mentioned top board of restriction in the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column respectively.
And, the smoothing mechanism of the top board of technical scheme 2 records of the present invention, the invention according to technical scheme 1 record is characterized in that above-mentioned position restriction mechanism comprises: first recess of inverted cone-shaped, it is formed on above-mentioned second support column; Second recess, itself and above-mentioned first recess are formed on above-mentioned top board leading section accordingly; And spheroid, between above-mentioned first, second recess, be provided with, and make between above-mentioned top board leading section and the above-mentioned a pair of second support column upper surface and form the gap.
And, the smoothing mechanism of the top board of technical solution of the present invention 3 records, invention according to technical scheme 1 or technical scheme record, it is characterized in that, above-mentioned first recess is located on first bearing piece of the upper surface of being fixed in above-mentioned second support column, and above-mentioned second recess is located on second bearing piece that is fixed in above-mentioned top board.
And the probe unit of technical solution of the present invention 4 records is characterized in that, comprising: the tested mobile mounting table of having a medical check-up of mounting; Keep being disposed at the top board of probe of the top of above-mentioned mounting table; Support a pair of first support column of above-mentioned top board with the left and right sides of rearward end; Support a pair of second support column of above-mentioned top board with the left and right sides of leading section; With the smoothing mechanism of the top board of the levelness of adjusting above-mentioned top board, above-mentioned smoothing mechanism comprises: a pair of elevating mechanism, and it is located at the upper end of above-mentioned first support column, and makes the lifting of above-mentioned top board rearward end respectively individually in the left and right sides; And axis mechanism, it is fixed in the central authorities of the supporter that is set up by above-mentioned a pair of second support column, and can swing the earth's axis along left and right directions and support above-mentioned top board leading section, be respectively arranged with the position restriction mechanism of the position deviation on the horizontal direction of the above-mentioned top board of restriction in the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column.
And, the probe unit of technical solution of the present invention 5 records, the invention according to technical scheme 4 records is characterized in that above-mentioned position restriction mechanism comprises: first recess of inverted cone-shaped, it is formed on above-mentioned second support column; Second recess, itself and above-mentioned first recess are formed on above-mentioned top board leading section accordingly; And spheroid, between above-mentioned first, second recess, be provided with, and make between the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column and form the gap.
And, the probe unit of technical solution of the present invention 6 records, invention according to technical scheme 4 or technical scheme 5 records, it is characterized in that, above-mentioned first recess is located on first bearing piece of the upper surface of being fixed in above-mentioned second support column, and above-mentioned second recess is located on second bearing piece that is fixed in above-mentioned top board.
According to the present invention, can provide inhibition to work as the position deviation of the tested top board when electrically contacting of having a medical check-up such as semiconductor wafer and can carry out the smoothing mechanism and the probe unit of the top board of the high inspection of reliability with probe.
Description of drawings
Fig. 1 is the stereographic map of major part of an embodiment of expression probe unit of the present invention.
Fig. 2 is the vertical view that is used for illustrating at the support structure of an embodiment of the smoothing mechanism of the employed top board of the present invention of probe unit shown in Figure 1.
Fig. 3 is the cut-open view of major part of the smoothing mechanism of expression top board shown in Figure 1.
Fig. 4 is the stereographic map that is illustrated in smoothing mechanism one example of employed top board in the existing probe unit.
Fig. 5 is the stereographic map that is illustrated in employed axis mechanism in the smoothing mechanism shown in Figure 4.
Fig. 6 is the vertical view of top plate supporting structure that is used for illustrating the smoothing mechanism of top board shown in Figure 4.
The explanation of label
10 probe units
11 top boards
12 first support columns
13 second support columns
14 elevating mechanisms
15 supporters
16 axis mechanisms
19 position restriction mechanism
19A first recess
19B second recess
The 19C spheroid
19D second bearing piece
20 smoothing mechanisms
Embodiment
Below, the present invention will be described to embodiment shown in Figure 3 according to Fig. 1.
For example shown in Figure 1, the probe unit 10 of present embodiment has that mounting is tested have a medical check-up (for example semiconductor wafer) (not shown) mobile mounting table (not shown), keep being configured in the top board 11 of the probe (not shown) of mounting table top, with a pair of first support column 12 of the left and right sides roof supporting 11 of rearward end, with the smoothing mechanism of the top board of the levelness of a pair of second support column 13 of the left and right sides roof supporting 11 of leading section and adjustment top board 11 (below abbreviate " smoothing mechanism " as) 20.
As shown in Figure 1, elevating mechanism 14 constitutes in the same manner with existing elevating mechanism, has motor 14A, ball-screw 14B and wedge shape part 14C, and motor 14A makes the action of wedge shape part 14C advance and retreat by ball-screw 14B, so that top board 11 liftings.Axis mechanism 16 also constitutes in the same manner with existing axis mechanism 6.In the present embodiment, it is characterized in that, as mentioned above, between the left and right sides of top board 11 leading sections and a pair of second support column 13 upper surfaces, be provided with position restriction mechanism 19, as shown in Figure 2, from 5 support structures of five of lower surface roof supporting 11.Wherein, in Fig. 1, Fig. 2, represent the strong point of position restriction mechanism 19 with the circle mark that the site is arranged.
For example as shown in Figure 3, position restriction mechanism 19 comprise the inverted cone-shaped of the upper surface that is formed on second support column 13 the first recess 19A, and the first recess 19A be formed on accordingly top board 11 leading section the second recess 19B and between the spheroid 19C that is provided with and makes formation gap delta between the upper surface of lower surface and a pair of second support column 13 of leading section of top board 11 between first, second recess 19A, the 19B.Owing to be formed with gap delta, thereby top board 11 tilts forward and back to the left and right by spheroid 19C shown in arrow among Fig. 3.And, because spheroid 19C is limited in first, second recess 19A, the 19B, even thereby top board 11 is being checked deflection sometimes, also be limited in first, second recess 19A, the 19B by a pair of spheroid 19C, top board 11 does not have position deviation to limit top board 11 all around on the direction, thereby between the probe of the electrode pad of semiconductor wafer and probe, can not produce position deviation, can carry out the high inspection of reliability.
And the second recess 19B for example is arranged at the second bearing piece 19D in the hole that is fixed on top board 11.The second recess 19B forms as illustrated in fig. 2 has the cylindric of in fact identical with the external diameter of spheroid 19C diameter, and the inboard forms coniform.Therefore, spheroid 19C carries out the line contact in the second recess 19B.And, have the spheroid 19C side of the second recess 19B of spheroid 19C to be fixed with the holding section 19E of ring-type in embedding, thereby spheroid 19C can not come off from the second recess 19B.In addition,, also can similarly be formed at the single face of first bearing piece (not shown), and second bearing piece is fixed on the upper surface of second support column 13 with the second recess 19B though the first recess 19A directly is formed on the upper surface of first support column 13.
Then, the action to smoothing mechanism 19 describes.At first, probe is installed to top board 11, behind configuration testing head on the top board 11, the semiconductor wafer on the mensuration mounting table and the depth of parallelism of top board 11.In this stage, do not adjust the depth of parallelism between the semiconductor wafer on top board 11 and the mounting table.Therefore, the mounting table along continuous straight runs moves, by the height of the 2nd CCD camera in the probe front of a plurality of location detection probe that are separated from each other.These detected values are stored in the storage part of not shown control device.Probe front height as a plurality of positions is identical respectively, and then owing to probe, promptly top board is parallel with the upper surface of mounting table, so do not adjust the depth of parallelism of top board 11, just carries out the transition to the inspection of semiconductor wafer.
Under the top board 11 and the upper surface of mounting table are not parallel situation, use smoothing mechanism 20 to adjust so that above-mentioned both become parallel.In this case, detect the probe front height at a plurality of positions, calculate two elevating mechanisms 14 on a pair of first, second support column 12 with respect to the lifting amount of axis mechanism 16 according to this result of calculation by the 2nd CCD camera of mounting table.Then, when from control device when elevating mechanism 14 sends separately control signal, two elevating mechanism 14 basis control signal driving motor 14A separately, via ball-screw 14B wedge shape part 14C advance and retreat are moved, make the rearward end lifting of top board 11 from the left and right sides, with axis mechanism 16 is basic point, adjusts the levelness of top board 11.At this moment, in position restriction mechanism 19, also top board 11 is tilted smoothly by spheroid 19C.Adjust the depth of parallelism of top board 11 and mounting table thus, a plurality of electrode pads of the semiconductor wafer on the mounting table and a plurality of probes of probe electrically contact with uniform contact pressure (pin pressure), carry out the electrical specification inspection of semiconductor wafer.
Yet, if the surge of number of probes makes contact pressure reach about 200Kg, the central portion of top board 11 is up pushed away, produce deflections at top board 11.But, in the present embodiment, because the strong point at three places of the measuring head on the top board 11 is all in the pentagonal regions of the strong point that connects 5 places, thereby suppressed the deflection of the top board 11 that causes because of load and recessed, the deflection of the top board 11 that causes because of the contact pressure that acts between the semiconductor wafer on probe and the mounting table can also have been reduced respective amount thus from measuring head.In addition, because two places are limited by position restriction mechanism 19 about the leading section of top board 11, thereby can prevent the position deviation that the deflection because of top board 11 causes, and then can prevent position deviation, thereby carry out the high inspection of reliability because of a plurality of electrode pads of a plurality of probes of probe and the semiconductor wafer on the mounting table.
, measuring head is dropped on the top board 11 here, the strong point S at three places on top board 11 applies the load of 200kgf respectively, and the result of displacement who has measured directions X, Y direction and the Z direction of each strong point S is illustrated in table 1.According to the result shown in the table 1, as can be known by two places of position restriction mechanism 19 between the upper surface of the left and right sides of top board 11 leading sections and a pair of second support column 12 are provided with, thereby the directions X of the strong point S at 3 places of measuring head and the displacement on the Y direction are significantly suppressed, and the recessed amount of Z direction is significantly suppressed.Wherein, the planarity in the table 1 is represented the poor of the maximal value of recessed amount of each indication point S and minimum value.Wherein, in table 1, spheroid is represented position restriction mechanism 19.
(table 1)
As described above, according to present embodiment, because smoothing mechanism 20 comprises: a pair of elevating mechanism 14, it is located at the upper end with first support column 12 of the rearward end of both ends, left and right sides roof supporting 11, and makes top board 11 rearward end liftings respectively individually in the left and right sides; Axis mechanism 16, it is fixed in the central authorities of the supporter 15 that is set up by a pair of second support column 13, and can swing earth's axis roof supporting 11 leading sections along left and right directions; With position restriction mechanism 19, it is located at the upper surface of the leading section and a pair of second support column 12 of top board 11 respectively, and the position deviation on the horizontal direction of restriction top board 11, and position restriction mechanism 19 comprises: the first recess 19A of inverted cone-shaped, and it is formed on the upper surface of second support column 13; The second recess 19B, itself and the first recess 19A are formed on top board 11 leading sections accordingly; With spheroid 19C, it is provided with between above-mentioned first, second recess 19A, 19B, and make between the lower surface of top board 11 leading sections and a pair of second support column 13 upper surfaces and form gap delta, even thereby be applied with bigger load to top board 11, also can suppress the deflection of top board 11, and can prevent top board 11 position deviation in the horizontal direction, can suppress the position deviation of the tested top board when electrically contacting of having a medical check-up such as semiconductor wafer, can carry out the high inspection of reliability with probe.
And, according to present embodiment, on the first bearing piece 19D that the first recess 19A is located at the upper surface of being fixed in second support column 13, and the second recess 19B is located on second bearing piece (not shown) that is fixed in top board 11, present supported at three point tectonic reworking can be become 5 support structures.
In addition, the invention is not restricted to above-mentioned any embodiment, within the scope of the invention suitable each textural element of design alteration.
The present invention is preferred for probe unit.
Claims (6)
1. the smoothing mechanism of a top board is characterized in that, is used to adjust the levelness of above-mentioned top board, and the smoothing mechanism of above-mentioned top board comprises: the top board that keeps probe; Support a pair of first support column of above-mentioned top board with the left and right sides of rearward end; Support a pair of second support column of above-mentioned top board with the left and right sides of leading section; A pair of elevating mechanism, it is located at the upper end of above-mentioned first support column, and makes the rearward end lifting of above-mentioned top board respectively individually in the left and right sides; And axis mechanism, it is fixed in the central authorities of the supporter that is set up by above-mentioned a pair of second support column, and can swing the leading section that the earth's axis supports above-mentioned top board along left and right directions,
Be respectively arranged with the position restriction mechanism of the position deviation on the horizontal direction of the above-mentioned top board of restriction in the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column.
2. the smoothing mechanism of top board as claimed in claim 1 is characterized in that, above-mentioned position restriction mechanism comprises: first recess of inverted cone-shaped, and it is formed on above-mentioned second support column; Second recess, itself and above-mentioned first recess are formed on the leading section of above-mentioned top board accordingly; And spheroid, between above-mentioned first, second recess, be provided with, and make between the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column and form the gap.
3. the smoothing mechanism of top board as claimed in claim 1 or 2 is characterized in that, above-mentioned first recess is located on first bearing piece of the upper surface of being fixed in above-mentioned second support column, and above-mentioned second recess is located on second bearing piece that is fixed in above-mentioned top board.
4. a probe unit is characterized in that, comprising: the tested mobile mounting table of having a medical check-up of mounting; Maintenance is disposed at the top board of the probe of above-mentioned mounting table top; Support a pair of first support column of above-mentioned top board with the left and right sides of rearward end; Support a pair of second support column of above-mentioned top board with the left and right sides of leading section; With the smoothing mechanism of the top board of the levelness of adjusting above-mentioned top board, above-mentioned smoothing mechanism comprises: a pair of elevating mechanism, and it is located at the upper end of above-mentioned first support column, and makes the rearward end lifting of above-mentioned top board respectively individually in the left and right sides; And axis mechanism, it is fixed in the central authorities of the supporter that is set up by above-mentioned a pair of second support column, and can swing the earth's axis along left and right directions and support above-mentioned top board leading section,
Be provided with the position restriction mechanism of the position deviation on the horizontal direction of the above-mentioned top board of restriction respectively in the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column.
5. probe unit as claimed in claim 4 is characterized in that, above-mentioned position restriction mechanism comprises: first recess of inverted cone-shaped, and it is formed on above-mentioned second support column; Second recess, itself and above-mentioned first recess are formed on the leading section of above-mentioned top board accordingly; And spheroid, it is provided with between above-mentioned first, second recess, and makes between the upper surface of the leading section of above-mentioned top board and above-mentioned a pair of second support column and form the gap.
6. as claim 4 or 5 described probe units, it is characterized in that above-mentioned first recess is located on first bearing piece of the upper surface of being fixed in above-mentioned second support column, and above-mentioned second recess is located on second bearing piece that is fixed in above-mentioned top board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-212766 | 2009-09-15 | ||
| JP2009212766A JP2011064467A (en) | 2009-09-15 | 2009-09-15 | Leveling mechanism for head plate and probe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102023237A true CN102023237A (en) | 2011-04-20 |
Family
ID=43864778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010285599XA Pending CN102023237A (en) | 2009-09-15 | 2010-09-15 | Device for leveling head plate and probe apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2011064467A (en) |
| KR (1) | KR101103430B1 (en) |
| CN (1) | CN102023237A (en) |
| TW (1) | TW201140092A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739762A (en) * | 2021-09-17 | 2021-12-03 | 无锡迪渊特科技有限公司 | Mounting position detecting device for semiconductor equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013024684A (en) * | 2011-07-20 | 2013-02-04 | Mitsubishi Electric Corp | Inspection tool and inspection device |
| JP6262547B2 (en) * | 2014-01-22 | 2018-01-17 | 東京エレクトロン株式会社 | Probe tip polishing device for prober and probe card |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4123408B2 (en) * | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | Probe card changer |
| JP2004205487A (en) * | 2002-11-01 | 2004-07-22 | Tokyo Electron Ltd | Probe card fixing mechanism |
| JP4102884B2 (en) * | 2005-05-13 | 2008-06-18 | 東京エレクトロン株式会社 | Probe card adjustment mechanism and probe device |
-
2009
- 2009-09-15 JP JP2009212766A patent/JP2011064467A/en active Pending
-
2010
- 2010-09-01 KR KR1020100085459A patent/KR101103430B1/en not_active IP Right Cessation
- 2010-09-14 TW TW099131033A patent/TW201140092A/en unknown
- 2010-09-15 CN CN201010285599XA patent/CN102023237A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739762A (en) * | 2021-09-17 | 2021-12-03 | 无锡迪渊特科技有限公司 | Mounting position detecting device for semiconductor equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011064467A (en) | 2011-03-31 |
| KR101103430B1 (en) | 2012-01-09 |
| TW201140092A (en) | 2011-11-16 |
| KR20110030313A (en) | 2011-03-23 |
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Application publication date: 20110420 |