JP6341693B2 - Substrate holding device and substrate inspection device - Google Patents

Description

  The present invention relates to a substrate holding device configured to hold a substrate by bringing a contact portion into contact with a contacted portion of the substrate, and a substrate inspection apparatus including the substrate holding device.

  As this type of substrate support apparatus, a substrate fixing mechanism disclosed by the applicant in Patent Document 1 below is known. The substrate fixing mechanism includes two chucks and a clamp piece so that a rectangular substrate can be fixed. One of the two chucks (hereinafter also referred to as “first chuck”) is formed with a right-angled V-shaped opening so that the end surface of the opening abuts each end surface of two adjacent sides of the substrate. It is configured. Further, the first chuck is formed with a support claw for supporting the edges of the two sides. On the other of the two chucks (hereinafter also referred to as “second chuck”), a mounting claw for supporting the edges of the other two sides excluding the two sides is formed. The clamp piece is disposed on the second chuck so as to be movable back and forth, and is moved in a direction of contacting and separating from the first chuck by the driving means. In addition, a right-angled V-shaped opening is formed in the clamp piece, and the end face of this opening comes into contact with the other two end faces except the above-described two end faces of the substrate. When the substrate is fixed using this substrate fixing mechanism, the interval between the two chucks is first adjusted to a required interval, and then the substrate is transported between the chucks. Subsequently, the substrate is pressed with the clamp piece by operating the driving means to move the clamp piece toward the substrate. At this time, the end surfaces of the right-angled V-shaped opening in the first chuck abut against two adjacent end surfaces of the substrate, and the end surfaces of the right-angled V-shaped opening in the clamp piece are in contact with the other two end surfaces of the substrate. In contact with each other, the substrate is sandwiched between the end faces of the openings. Thereby, the substrate is fixed by the substrate fixing mechanism.

JP 2010-32405 A (page 4-6, FIG. 1-2)

  However, the conventional substrate fixing mechanism has the following problems to be improved. That is, in the conventional substrate fixing mechanism, the end face of the opening in one chuck (first chuck) is brought into contact with two end faces of the substrate, and the end face of the opening in the clamp piece is brought into contact with the other two end faces of the substrate. The substrate is held in contact with the substrate, thereby fixing the substrate. That is, in this substrate fixing mechanism, the end surfaces of the chuck and the clamp piece and the end surface of the substrate are in surface contact. In this case, in order to stably hold the substrate, it is necessary to define the contact area between the end faces as large as possible. Therefore, probing the outer peripheral portion of the substrate becomes difficult because the chuck or the clamp piece becomes an obstacle. There is a fear. Further, in this substrate fixing mechanism, since the outer peripheral portion of the substrate is supported by the support claws of the first chuck and the mounting claws of the clamp pieces, probing the lower surface of the outer peripheral portion of the substrate may be more difficult.

  On the other hand, in this substrate fixing mechanism, after the suction unit of the substrate suction device sucks the substrate and conveys the substrate to the position where the first chuck and the clamp piece are disposed, and then sandwiches the substrate by the first chuck and the clamp piece. The suction is released by releasing the vacuum pressure to the atmosphere (vacuum break), and then the suction part is moved upward. However, with this substrate fixing mechanism, it is possible to prevent the substrate from moving downward by supporting the outer periphery of the substrate, but it is difficult to prevent the substrate from moving upward. If the suction part is raised before the process ends, the substrate may be detached from the first chuck and the clamp piece. For this reason, in this board | substrate fixing mechanism, it is necessary to wait until a vacuum break is complete | finished, and there exists a subject that work time becomes long (tact time loss generate | occur | produces).

  The present invention has been made in view of such a problem to be improved, and provides a substrate support device and a substrate inspection device that can shorten the work time for holding a substrate while enabling probing with respect to the outer peripheral portion of the substrate. The main purpose.

In order to achieve the above object, a substrate holding apparatus according to claim 1, wherein a contact portion capable of contacting the contacted portion of the substrate, and the contacted portion is contacted with the contacted portion. a pressing mechanism for pressing process for pressing the contact portion, there is provided a substrate holding apparatus that is configured to be able to hold the substrate, comprising a distal end member having an opening formed at the distal end is formed in a pillar shape Two or more contact portions configured to be able to contact the tip of the tip member with the corner in a state in which the corner of the substrate as the contacted portion is inserted into the opening. The pressing mechanism performs the pressing process on two or more corners of the substrate .

  According to a second aspect of the present invention, in the substrate holding device according to the first aspect, the opening is formed in a circular shape in plan view.

  The substrate holding device according to claim 3 is the substrate holding device according to claim 1 or 2, wherein a tapered surface is formed at an edge of the opening.

  The substrate holding device according to claim 4 is the substrate holding device according to any one of claims 1 to 3, wherein the contact portion includes N pieces (N is an integer of 3 or more), and the pressing mechanism is The pressing process is performed on N corners of the substrate.

  A substrate holding device according to claim 5 is the substrate holding device according to any one of claims 1 to 4, wherein a moving mechanism that moves the substrate, a control unit that controls the moving mechanism and the pressing mechanism, The control unit controls the moving mechanism to perform a moving process for moving the substrate to a predetermined holding position, and controls the pressing mechanism to position the substrate at the holding position. The pressing process is executed on

  The substrate holding device according to claim 6 is the substrate holding device according to claim 5, further comprising a measurement unit capable of measuring the position of the substrate, wherein the control unit is configured to perform the measurement based on a measurement result of the measurement unit. Perform the move process.

  According to a seventh aspect of the present invention, there is provided a substrate inspection apparatus according to any one of the first to sixth aspects, a probing apparatus for probing a probe with respect to the substrate held by the substrate holding apparatus, An inspection unit that inspects the substrate based on an electric signal input and output through the probe probed on the substrate.

  According to the substrate holding device according to claim 1 and the substrate inspection device according to claim 7, the tip is provided with a tip member having an opening formed at the tip, and the corner of the substrate is inserted into the opening. By configuring the abutting portion so that the tip of the member can come into contact with the corner, movement of the corner in the vertical direction and the left-right direction can be restricted by the tip member. Therefore, according to the substrate holding device and the substrate inspection device, when the substrate adsorbed by the adsorption unit is moved to the holding position and the substrate is held by the substrate holding device, adsorption (vacuum breakage) by the adsorption unit is caused. Even if the suction part is raised before it is completely finished, it is possible to reliably avoid the removal of the substrate from the substrate holding device, so that it is necessary to wait until the vacuum break is completely finished and In comparison, the tact time loss can be sufficiently reduced, and as a result, the work time of the work of holding the substrate can be sufficiently shortened. Further, according to the substrate holding device and the substrate inspection device, the occupied area for holding the substrate can be kept small, so that unlike the conventional configuration in which a large area is occupied to hold the substrate, the substrate The obstacle at the time of probing with respect to the outer peripheral portion can be suppressed. Further, according to the substrate holding device and the substrate inspection device, it is not necessary to provide a claw or the like for supporting the outer peripheral portion of the substrate, so that the probing can be reliably performed on the lower surface of the outer peripheral portion of the substrate.

  According to the substrate holding device according to claim 2 and the substrate inspection device according to claim 7, since the opening is formed in a circular shape in plan view, the shape of the opening in plan view is changed to another shape (for example, rectangular). Compared to the configuration formed in the above, the corners can be pressed in a state where the four corners in the corners are securely in contact with the inner surface of the opening or the edge of the opening. As a result of preventing the movement in the vertical and horizontal directions more reliably, the substrate can be stably held.

  According to the substrate holding device according to claim 3 and the substrate inspection device according to claim 7, since the tapered surface is formed at the edge of the opening, the corner of the substrate is guided to the opening by the tapered surface. Therefore, the corner can be smoothly inserted into the opening.

  Further, according to the substrate holding device according to claim 4 and the substrate inspection device according to claim 7, the substrate holding device includes three or more N abutting portions, and performs a pressing process on N corners of the substrate. As a result, the substrate can be held more stably as compared with the configuration in which the pressing process is performed on the two corners by the two contact portions.

  According to the substrate holding device according to claim 5 and the substrate inspection device according to claim 7, the processing unit performs a moving process of moving the substrate to the holding position by controlling the moving mechanism, and the pressing mechanism is By performing the pressing process on the substrate positioned at the holding position by control, the operation of holding the substrate can be automated, so that the work time of the operation of holding the substrate can be further shortened. .

  According to the substrate holding device according to claim 6 and the substrate inspection device according to claim 7, the substrate holding device includes a measuring unit capable of measuring the position of the substrate, and the processing unit performs the moving process based on the measurement result of the measuring unit. Since the substrate can be reliably positioned at the holding position, the substrate can be reliably held by the substrate holding device.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 3 is a plan view showing a configuration of a substrate holding device 2. FIG. 3 is a perspective view showing a configuration of an abutting portion 12. FIG. 3 is a perspective view of a slider 21. FIG. It is the perspective view which looked at the front-end | tip member 22 from the front-end | tip 22a side. 3 is a cross-sectional view of a tip member 22. FIG. It is the perspective view which looked at the front-end | tip member 22 from the base end 22b side. FIG. 5 is a first explanatory view explaining the operation of the substrate inspection apparatus 1. It is the 2nd explanatory view explaining operation of substrate inspection device 1. 5 is a perspective view showing a state in which a tip member 22 is in contact with a corner portion 105 of a substrate 100. FIG. FIG. 11 is a cross-sectional view (vertical cross-sectional view) in the X plane in FIG. 10. FIG. 11 is a Y-plane cross-sectional view (transverse cross-sectional view) in FIG. 10. FIG. 13 is a cross-sectional view of the tip member 22 and the substrate 100 as viewed by cutting the state in which the tip member 22 is in contact with the corner portion 105 of the substrate 100 along the line ZZ in FIG. 12. 4 is a cross-sectional view of a tip member 122. FIG.

  Hereinafter, embodiments of a substrate holding device and a substrate inspection device will be described with reference to the accompanying drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the substrate inspection apparatus will be described. A substrate inspection apparatus 1 shown in FIG. 1 includes a substrate holding device 2, probing devices 3a and 3b (hereinafter also referred to as “probing device 3” when not distinguished), and a processing unit 4, and a substrate 100 (see FIG. 9). It is configured to be inspectable. In this case, as an example, the substrate 100 is a bare board on which no electronic component is mounted, and is formed in a rectangular thin plate shape.

  As shown in FIG. 2, the substrate holding device 2 includes four main body parts 11, four (an example of N) contact parts 12 a to 12 d (hereinafter also referred to as “contact part 12” when not distinguished). Pressing mechanisms 13a to 13d (hereinafter also referred to as “pressing mechanism 13” when not distinguished), a moving mechanism 14 (see FIG. 1), and a measurement unit 15 (see the same figure) are configured to hold the substrate 100. ing.

  As shown in FIG. 2, the main body 11 is formed in a rectangular plate shape as an example. A rectangular opening 11 b is formed at the center of the main body 11.

  As shown in FIG. 3, the contact portions 12 a to 12 d are configured to include a slider 21 and a tip member 22, respectively. The slider 21 is disposed on a rail 31 (see FIG. 2) of the pressing mechanism 13 and is configured to be movable (slidable) along the rail 31. As shown in FIG. 4, a screw hole 21 b for fixing the tip member 22 is formed in the tip surface 21 a of the slider 21.

  As shown in FIG. 5, the distal end member 22 is formed in a columnar shape (an example of a columnar shape) having a small diameter on the distal end 22a side and a large diameter on the proximal end 22b side. As shown in FIGS. 5 and 6, an opening 23 having a circular shape in plan view is formed at the tip 22 a of the tip member 22. The opening 23 may be a concave portion (bottomed hole) having a circular shape in a plan view or a through hole having a circular shape in a plan view. In this substrate holding device 2, when holding the substrate 100, four corners 105a to 105d (an example of N locations) corresponding to the contacted portion of the substrate 100 (see FIG. 8: hereinafter, when not distinguished) A corner 105 ”(also referred to as a corner 105) is inserted into the opening 23 (see FIGS. 10 to 12). In this state, the tip 22a of the tip member 22 (the edge of the opening 23) comes into contact with the corner 105. It is configured.

  As shown in FIGS. 5 and 6, a tapered surface 24 is formed at the edge of the opening 23. By forming the tapered surface 24, the corner 105 can be smoothly inserted into the opening 23.

  Further, as shown in FIG. 7, a screw portion 25 that can be screwed into a screw hole 21 b (see FIG. 4) of the slider 21 is provided at the base end 22 b of the tip member 22. With this configuration, in the substrate holding device 2, the tip member 22 can be easily attached to and detached from the slider 21. For this reason, in this substrate holding device 2, the tip member 22 selected according to the type of the substrate 100 (the thickness of the substrate 100 or the shape of the corner 105) is replaced from among a plurality of types of tip members 22 having different shapes. And can be attached.

  Each of the pressing mechanisms 13a to 13d includes a rail 31 (see FIG. 2) and a drive unit (not shown), and presses the tip member 22 of the contact portion 12 against the corner portion 105 of the substrate 100 to press it. The process is configured to be executable.

  As shown in FIG. 2, the rail 31 is disposed on the upper surface 11 a of the main body 11 along a straight line L connecting the corner 11 d of the main body 11 and the center 11 c of the opening 11 b of the main body 11. . Moreover, the rail 31 supports the slider 21 of the contact part 12 so that a movement (sliding) is possible. As an example, the drive unit includes a ball screw and a motor (not shown) that rotates the ball screw, and moves the slider 21 disposed on the rail 31 along the rail 31.

  The moving mechanism 14 is configured to include a suction unit 14a (see FIG. 8) and a drive unit (not shown), and in accordance with the control of the processing unit 4, a predetermined holding position for the substrate 100 sucked by the suction unit 14a. Move to P1 (refer to the figure) and perform a movement process to release the suction at the holding position P1. In this case, as shown in the figure, the holding position P1 is such that the central portion 101 of the substrate 100 is positioned on the central portion 11c of the opening 11b in the main body 11, and each corner 105 of the substrate 100 is the main body described above. As shown in FIG. 11, the central axis of the opening 23 formed on the tip 22 a of the tip member 22 in each contact portion 12 and the center of the substrate 100 in the thickness direction are located on the straight line L of the portion 11. Are defined at the same height.

  The measurement unit 15 is disposed, for example, below the opening 11 b in the main body unit 11, measures the position of the substrate 100 (height of the substrate 100), and outputs an electrical signal indicating the value to the processing unit 4. To do. In this case, the measurement part 15 is comprised with a laser displacement meter as an example, and measures the position of the board | substrate 100 non-contactingly.

  The probing device 3a performs a probing process for probing the probe unit 41a (see FIG. 1) on the lower surface 103 (see FIG. 11) of the substrate 100 supported by the substrate holding device 2 according to the control of the processing unit 4. In this case, the probe unit 41a includes a plurality of probes 42 arranged in the same arrangement pattern as the arrangement pattern of the plurality of contacted parts formed on the lower surface 103 of the substrate 100, and is configured in a jig shape.

  The probing device 3b performs a probing process for probing the probe unit 41b (see FIG. 1) on the upper surface 104 (see FIGS. 9 and 11) of the substrate 100 supported by the substrate holding device 2 according to the control of the processing unit 4. In this case, the probe unit 41b includes a plurality of probes 42 arranged in the same arrangement pattern as the arrangement pattern of the plurality of contacted parts formed on the upper surface 104 of the substrate 100, and is configured in a jig shape.

  The processing unit 4 functions as a control unit. Specifically, the processing unit 4 controls each pressing mechanism 13 to execute the pressing process. In addition, the processing unit 4 controls the moving mechanism 14 to perform a moving process for moving the substrate 100 to the holding position P1 described above. In this case, in the movement process, the processing unit 4 controls the amount of movement of the substrate 100 by the movement mechanism 14 while specifying the position of the substrate 100 based on the electrical signal (measurement result) output from the measurement unit 15. Thus, the substrate 100 is positioned at the holding position P1. Further, the processing unit 4 controls each pressing mechanism 13 to execute a pressing process on the substrate 100 positioned at the holding position P1. Further, the processing unit 4 controls each probing device 3 to execute a probing process.

  Further, the processing unit 4 functions as an inspection unit, and inspects the substrate 100 based on an electric signal input / output via the probe 42 of the probe unit 41 probed on the substrate 100.

  Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the accompanying drawings. In the initial state, as shown in FIG. 2, each contact portion 12 in the substrate holding device 2 is positioned closer to the corner 11 d of the main body 11 than the opening 11 b of the main body 11 (the main body in the plan view state). 11 is a position where the opening 11b is not blocked and is also referred to as an “initial position” hereinafter.

  In the substrate inspection apparatus 1, when the operation unit (not shown) is operated to instruct the start of inspection, the processing unit 4 starts each process. Specifically, the processing unit 4 first performs a movement process. In this moving process, the processing unit 4 controls the moving mechanism 14 of the substrate holding device 2 to suck the substrate 100 supplied to the supply position by the suction unit 14a.

  In this case, the processing unit 4 controls the moving mechanism 14 to move the suction unit 14 a above the central portion 101 of the substrate 100, and then lowers the suction portion 14 a toward the central portion 101. Subsequently, the processing unit 4 sucks the central portion 101 of the substrate 100 with the suction portion 14a, and then raises the suction portion 14a. Subsequently, as shown in FIG. 8, the processing unit 4 is arranged above the opening 11b of the main body 11 of the substrate holding device 2, specifically, the central portion 101 of the substrate 100 is located at the central portion 11c of the opening 11b. The suction part 14a is moved so as to be positioned above.

  Next, the processing unit 4 controls the measurement unit 15 to start the measurement process. In this measurement process, the measurement unit 15 measures the distance from the measurement unit 15 to the substrate 100 and outputs an electrical signal indicating the value to the processing unit 4.

  Subsequently, the processing unit 4 controls the moving mechanism 14 to lower the suction unit 14a. At this time, the processing unit 4 specifies the position of the substrate 100 based on the electrical signal output from the measurement unit 15 and controls the movement amount of the suction unit 14a by the movement mechanism 14 as shown in FIG. As described above, the substrate 100 is positioned at the holding position P1 where the center axis of the opening 23 formed at the tip 22a of the tip member 22 in each contact portion 12 and the center of the substrate 100 in the thickness direction are the same height. .

  Next, the processing unit 4 controls each pressing mechanism 13 to execute the pressing process. In the pressing process, the drive unit of the pressing mechanism 13 moves the slider 21 of the contact portion 12 on the rail 31 toward the center portion 11c of the opening portion 11b in the main body portion 11 as shown in FIG.

  At this time, as shown in FIGS. 10 to 12, the corners 105 a to 105 d of the substrate 100 are inserted into the openings 23 formed at the tips 22 a of the tip members 22 in the contact portions 12 a to 12 d. . In this case, as shown in FIGS. 11 and 12, since the tapered surface 24 is formed at the edge of the opening 23, the corner 105 is guided to the opening 23 by the tapered surface 24, and the opening 23 is in contact with the opening 23. The corner 105 is inserted smoothly.

  Subsequently, when the slider 21 is further moved toward the center portion 11c of the opening portion 11b, the corner portion 105 of the substrate 100 becomes the edge portion of the opening portion 23 in the tip member 22 (see FIG. 12 and FIG. 13). Alternatively, it contacts the tapered surface 24). In this case, as shown in FIG. 13, two corners constituted by both side surfaces 102 and the lower surface 103 in the corner 105, and two sides constituted by both side surfaces 102 and the upper surface 104 in the corner 105. The corners (four corners in total) abut against the edge of the opening 23. For this reason, the movement of the corner 105 in the vertical direction and the horizontal direction is restricted. In this manner, the movement of the corners 105a to 105d in the substrate 100 is restricted by the contact portions 12a to 12d, whereby the substrate 100 is held.

  Next, the processing unit 4 controls the moving mechanism 14 to release the adsorption by the adsorption unit 14a, and then raises the adsorption unit 14a. In this case, in the substrate holding device 2, the movement of the corner 105 in the vertical direction and the horizontal direction is restricted by the tip member 22 as described above. Therefore, even if the suction unit 14a is raised before the suction (vacuum break) by the suction unit 14a is completely completed, the substrate 100 is detached from the substrate holding device 2 (the holding of the substrate 100 by the substrate holding device 2). Release) is avoided. For this reason, in this substrate holding device 2, the tact time loss is reduced as compared with the conventional configuration in which it is necessary to wait until the vacuum break is completely completed. As a result, the work time of the work for holding the substrate 100 is shortened. It is possible to do.

  Next, the processing unit 4 controls the probing devices 3a and 3b to execute the probing process. In this probing process, the probing apparatus 3a moves (raises) the probe unit 41a upward, and causes each probe 42 of the probe unit 41a to probe each contacted portion formed on the lower surface 103 of the substrate 100. Further, the probing device 3b moves (lowers) the probe unit 41b downward to probe each probe 42 of the probe unit 41b to each contacted portion formed on the upper surface 104 of the substrate 100.

  Here, in the substrate holding device 2, the tip 22 a of the tip member 22 is inserted into the corner 105 while the corner 105 of the substrate 100 is inserted into the opening 23 formed in the tip member 22 of the contact portion 12. The substrate 100 is held by pressing the corner 105 in contact with the substrate. For this reason, as shown in FIG. 9, the occupation area for holding the substrate 100 can be kept small. For this reason, a large area is occupied to hold the substrate 100 by bringing the end surface of the substrate and the end surface of the holding member (chuck or clamp piece in the conventional substrate support apparatus) and the end surface of the substrate into surface contact. Unlike the conventional configuration, it is possible to reduce the obstacles when probing the outer peripheral portion of the substrate. Further, in the substrate holding device 2, it is not necessary to provide a claw or the like to support the outer peripheral portion of the substrate, and thus it is possible to reliably perform probing on the lower surface 103 of the outer peripheral portion of the substrate 100.

  Subsequently, the processing unit 4 performs an inspection process. In this inspection process, the processing unit 4 performs an electrical inspection on the substrate 100 based on an electric signal input / output via each probe 42 of each probe unit 41 (for example, an inspection of a conductive state of a conductor pattern, a conductor pattern, or the like). Insulation state between them).

  Next, when the inspection process ends, the processing unit 4 performs an end process. In this end process, the processing unit 4 controls the moving mechanism 14 to bring the suction unit 14a into contact with the upper surface 104 of the substrate 100, and subsequently sucks and holds the substrate 100 on the suction unit 14a.

  Next, the processing unit 4 controls each pressing mechanism 13 to move the tip member 22 of each contact portion 12 to the initial position. At this time, the pressing of the tip member 22 of the contact portion 12 against the corner portion 105 of the substrate 100 and the contact between the corner portion 105 and the tip member 22 are released, and the holding of the substrate 100 by the contact portion 12 is released. The

  Subsequently, the processing unit 4 controls the moving mechanism 14 to move the adsorption unit 14a in a state where the substrate 100 is adsorbed to the storage position, and then releases the adsorption and places the substrate 100 on the storage position. . Thus, the inspection of the substrate 100 is completed.

  Thus, according to this board | substrate holding | maintenance apparatus 2 and the board | substrate inspection apparatus 1, the front-end | tip member 22 in which the opening part 23 was formed in the front-end | tip 22a was provided, and the corner part 105 of the board | substrate 100 was inserted in the opening part 23 By configuring the contact portion 12 so that the tip 22a of the tip member 22 can contact the corner 105, the tip member 22 can restrict the movement of the corner 105 in the vertical direction and the left-right direction. Therefore, according to the substrate holding device 2 and the substrate inspection device 1, when holding the substrate 100 sucked by the suction portion 14a, the suction portion before the suction (vacuum break) by the suction portion 14a is completely completed. Even if 14a is raised, it is possible to surely avoid the removal of the substrate 100 from the substrate holding device 2, so that the tact is compared with the conventional configuration in which it is necessary to wait until the vacuum break is completely completed. As a result of the time loss being sufficiently reduced, the work time for the work of holding the substrate 100 can be sufficiently shortened. Further, according to the substrate holding device 2 and the substrate inspection device 1, since the occupied area for holding the substrate 100 can be kept small, a conventional configuration in which a large area is occupied to hold the substrate 100 is obtained. In contrast, it is possible to reduce the obstacles in probing the outer peripheral portion of the substrate 100. Further, according to the substrate holding device 2 and the substrate inspection device 1, since it is not necessary to provide a claw or the like for supporting the outer peripheral portion of the substrate 100, it is possible to reliably perform probing on the lower surface 103 of the outer peripheral portion of the substrate 100. it can.

  Moreover, according to this board | substrate holding | maintenance apparatus 2 and the board | substrate inspection apparatus 1, compared with the structure which formed the planar view shape of the opening part in the other shape (for example, rectangle) by forming the opening part 23 in planar view circle shape. The corner 105 can be pressed in a state where the four corners of the corner 105 are securely in contact with the inner surface of the opening 23 and the edge of the opening 23. As a result of more reliably preventing the movement in the direction, the substrate 100 can be stably held.

  Further, according to the substrate holding device 2 and the substrate inspection device 1, since the tapered surface 24 is formed at the edge of the opening 23, the corner 105 can be guided to the opening 23 by the tapered surface 24. The corner 105 can be smoothly inserted into the opening 23.

  Further, according to the substrate holding device 2 and the substrate inspection device 1, four (three or more) contact portions 12 are provided, and pressing processing is performed on four (three or more) corners 105 on the substrate 100. By performing the above, the substrate 100 can be held more stably as compared with the configuration in which the pressing process is performed on the two corners 105 by the two contact portions 12.

  Further, according to the substrate holding device 2 and the substrate inspection device 1, the processing unit 4 controls the moving mechanism 14 to perform the moving process of moving the substrate 100 to the holding position P1, and also controls the pressing mechanism 13. Since the operation of holding the substrate 100 can be automated by executing the pressing process on the substrate 100 located at the holding position P1, the work time of the operation of holding the substrate 100 can be further reduced. it can.

  Moreover, according to this board | substrate holding | maintenance apparatus 2 and the board | substrate inspection apparatus 1, the measurement part 15 which can measure the position of the board | substrate 100 is provided, and the process part 4 performs a movement process based on the measurement result of the measurement part 15. Since the substrate 100 can be reliably positioned at the holding position P1, the substrate 100 can be reliably held by the substrate holding device 2.

  The substrate holding device and the substrate inspection device are not limited to the above configuration. For example, the example in which the tapered surface 24 formed at the edge of the opening 23 is configured as a plane has been described above. However, as shown in FIG. 14, a tip member 122 in which the tapered surface 124 is configured as a curved surface may be employed. In addition, a configuration in which a tapered surface is not formed at the edge of the opening 23 can be employed.

Further, the example in which the four abutting portions 12 are provided and the pressing process is performed on the four corner portions 105 has been described above. However, the two or three abutting portions 12 are used for two or three corner portions. A configuration in which a pressing process is performed on 105 can also be employed. Further, other than a rectangle (e.g., pentagonal or polygonal) when holding the substrate, relative to the five or more corners by using five or more abutment 12 according to the number of corners A pressing process can also be performed.

  In addition, although the example in which the opening 23 is formed in a circular shape in plan view has been described above, the opening can be formed in an elliptical shape in plan view or a polygon in plan view. In addition, although the example in which the distal end member 22 formed in a columnar shape having a small diameter on the distal end 22a side and a large diameter on the proximal end 22b side has been described above, the shape of the distal end member 22 is not limited thereto. For example, a tip member formed in a columnar shape with the same thickness from the tip 22a to the base end 22b can be employed. Further, a tip member formed in a columnar shape with an elliptical cross section or a tip member formed in a columnar shape with a polygonal cross section may be employed.

  Moreover, although the example using the measurement unit 15 that measures the position of the substrate 100 in a non-contact manner has been described above, a configuration using a mechanical measurement unit that measures the position of the substrate 100 by contacting the contact with the substrate 100 is employed. You can also.

  In addition, the example in which the position of the substrate 100 (the height of the substrate 100) is measured by one measuring unit 15 has been described above. However, using the plurality of measuring units 15, the horizontal position displacement of the substrate 100 and the central portion 101 are detected. The positional deviation in the rotation direction around the center, the inclination of the substrate 100 with respect to the horizontal plane (posture of the substrate 100), and the like are measured, and the processing unit 4 controls the moving mechanism 14 based on the measurement result, thereby controlling the substrate 100. It is also possible to employ a configuration in which the correct position is set at the holding position P1.

  Further, the example in which the substrate holding device 2 is used in the substrate inspection apparatus 1 that performs inspection with the jig-type probe unit 41 has been described above. However, the probe is moved along the lower surface 103 and the upper surface 104 of the substrate 100, and the lower surface 103 or The substrate holding device 2 can also be used in a substrate inspection apparatus that performs probing at an arbitrary position on the upper surface 104, and even in this case, the above-described effects can be realized.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Board | substrate holding | maintenance apparatus 3a, 3b Probing apparatus 4 Processing part 12a-12d Contact part 13a-13d Pressing mechanism 14 Movement mechanism 15 Measurement part 22 Tip member 122 Tip member 22a Tip 23 Opening part 24 Tapered surface 124 Tapered surface 41a, 41b Probe unit 42 Probe 100 Substrate 105a-105d Corner

Claims (7)

A contact portion capable of contacting the contacted portion of the substrate, and a pressing mechanism for performing a pressing process of pressing the contacted portion by bringing the contacted portion into contact with the contacted portion, A substrate holding device configured to hold the substrate,
Includes a tip member having an opening formed at the distal end is formed in a pillar shape, the said the tip of the distal end member in a state in which the corner portion of the substrate as the contacted portion was inserted into the opening Comprising two or more of the abutting parts configured to abut on the corners ;
The pressing mechanism is a substrate holding device that performs the pressing process on two or more corners of the substrate.   The substrate holding apparatus according to claim 1, wherein the opening is formed in a circular shape in plan view.   The substrate holding device according to claim 1, wherein a tapered surface is formed at an edge of the opening. N contact portions (N is an integer of 3 or more),
The substrate pressing apparatus according to claim 1, wherein the pressing mechanism performs the pressing process on N corners of the substrate. A moving mechanism that moves the substrate; and a control unit that controls the moving mechanism and the pressing mechanism.
The control unit performs a moving process of moving the substrate to a predetermined holding position by controlling the moving mechanism, and controls the pressing mechanism with respect to the substrate positioned at the holding position. The substrate holding apparatus according to claim 1, wherein the pressing process is executed. A measurement unit capable of measuring the position of the substrate;
The substrate holding apparatus according to claim 5, wherein the control unit performs the movement process based on a measurement result of the measurement unit.   The substrate holding device according to any one of claims 1 to 6, a probing device for probing a probe with respect to the substrate held by the substrate holding device, and the probe probed on the substrate. A substrate inspection apparatus comprising: an inspection unit that inspects the substrate based on an electrical signal to be output.

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