JP5129655B2 - Substrate inspection device and method for changing rail width of substrate stationary rail provided in substrate inspection device - Google Patents

Description

  The present invention relates to a substrate inspection apparatus capable of realizing a high-speed and high-precision inspection by shortening a lifting stroke of a contact probe during inspection, and a technique relating to a rail width changing method of a substrate stationary rail included in the substrate inspection apparatus. is there.

  There are two types of board inspection devices: one-sided inspection type that can only perform electrical inspection of one surface of the substrate to be inspected, and double-sided inspection type that can perform electrical inspection on both surfaces simultaneously. There is.

Among these, as a double-sided inspection type substrate inspection device, for example, there is a substrate double-sided inspection device disclosed in the following patent document.
JP-A-7-35808

  In this case, as shown in FIG. 16 of the above-mentioned Patent Document 1, the contact probe at the time of non-inspection is retracted with the place deviated from the placement surface of the substrate to be inspected this time as a fixed position. These are arranged so as to be able to move to a position above the substrate to be inspected at the time of inspection.

  This will be described in more detail with reference to the explanatory diagrams of FIGS. 5 and 6. The double-sided board inspection apparatus 1 is provided with a pair in which expansion and contraction of the width between rails, conveyance of the board B to be inspected, and fixing of its position are freely arranged. Board mounting rails 2 and 5, and inspection heads 8 and 9 disposed separately on both front and back sides of the board B to be inspected.

  The board stationary rails 2 and 5 are formed so as to have a thickness ha so that the thickness is equal to the height ha from the viewpoint of providing a required rigidity, and the rail body parts 3 and 6 extend from the rail body parts 3 and 6. The chuck portions 4 and 7 are provided to fix the position of the substrate B to be inspected.

  In addition, the inspection head 8 disposed above the substrate B to be inspected and the inspection head 9 disposed below the head main body are freely disposed along the surface direction of the substrate B to be inspected. 8a and 9a, and contact probes 8b and 9b disposed on the head main bodies 8a and 9a so as to freely move up and down in a direction orthogonal to the moving direction of the head main body.

  Moreover, in the inspection heads 8 and 9, a predetermined position (a broken line position in FIG. 6) located outside the substrate mounting rails 2 and 5 is determined as a fixed position to be retracted during non-inspection. As shown in FIG. 2, it is necessary to horizontally move to the substrate B to be inspected under the position height over the substrate stationary rails 2 and 5 where the height of the highest portion is ha.

  In the inspection, the inspection heads 8 and 9 are placed above the inspection position of the substrate B to be inspected with the contact probes 8b and 9b close to the inspection substrate B side to some extent while maintaining a certain height. To move.

  In this case, the contact probes 8b and 9b can contact and inspect the inspection position by moving the distance hb to the inspection position of the substrate B to be inspected.

  That is, when the inspection heads 8 and 9 move on the stationary substrate B to be inspected and reach the inspection position, the inspection heads 8 and 9 can perform inspection by moving the contact probes 8b and 9b by a minute distance hb. It will be possible.

  However, in the case of the conventional apparatus, when the inspection heads 8 and 9 are retracted from the fixed position and moved over the substrate stationary rails 2 and 5 to the inspection position, the contact probes 8b and 9b themselves are moved to the substrate stationary rail 2. , 5 must be moved to the farthest position that does not contact the 5 side.

  For this reason, the contact probes 8b and 9b located farthest from the inspection position of the flat inspection substrate B must be moved again during the inspection to perform the measurement inspection, and the length itself needs to be increased accordingly. In addition, the movement stroke during inspection is inevitably longer, resulting in a decrease in position accuracy and a longer time required for movement, which makes it impossible to meet the demand for high speed and high accuracy. there were.

  SUMMARY OF THE INVENTION In view of such problems seen in conventional apparatuses, the present invention provides a board inspection apparatus capable of performing a probing inspection while well responding to the demand for high speed and high accuracy, and a board stationary rail provided in the board inspection apparatus. The purpose is to provide a method for changing the rail width.

  The present invention has been made to achieve the above object, and the first invention (apparatus) of the present invention is arranged to enable expansion / contraction of the width between rails, transportation of a substrate to be inspected, and fixing of its position. A pair of substrate mounting rails and two or more inspection heads disposed on at least one surface of the substrate to be inspected, the inspection heads being parallel to the surface direction of the substrate to be inspected. A head main body arranged to be movable, and a contact probe arranged on the head main body to be movable in a direction crossing the moving direction of the head main body, the inspection head comprising a probing inspection In order to shorten the movement stroke of the contact probe at the time, a fixed position to be retracted at the time of non-inspection and each inspection position at the time of inspection are set in the same plane as the stationary surface of the substrate to be inspected for this time The most important feature that was. In this case, the inspection head can be arranged on both the front and back sides of the substrate to be inspected.

  Further, the second invention (method) is a process for inputting the surface size information of the board to be inspected for the current inspection, a process for reading the current width between the rails of the board mounting rail, and a process for reading the current position of each inspection head. And a rising process for moving the height position of the contact probe included in each inspection head to the highest position, and the current position of each inspection head in the direction orthogonal to the transport direction is inside the lateral width size of the substrate to be inspected And when the current position of each inspection head is determined to be inside the width size of the substrate to be inspected through the determination processing, the distance between the rails of the substrate stationary rails is determined. The main feature is that it includes at least rail width changing processing for changing the width from the current width to the horizontal width size of the board to be inspected, which is the current inspection, and setting the board to be inspected. This

  According to the present invention, the inspection head is always placed on the stationary surface of the substrate to be inspected for the current inspection, which is fixed to the substrate stationary rail, regardless of whether it is non-inspected or inspected. Therefore, not only can the contact probe itself be shortened, but also the probing inspection can be performed while well meeting the demand for high speed and high accuracy by reducing the distance of the contact probe movement.

  FIG. 1 is a schematic configuration diagram in the front view direction of an example of the first invention (apparatus) of the present invention, and FIG. 2 is a schematic configuration diagram in the plan view direction of the example shown in FIG. Show. In addition, the arrow X in FIG. 2 shows the length direction of a board | substrate stationary rail, and the arrow Y shows the rail width direction of a board | substrate stationary rail, respectively. Further, an arrow Z in FIG. 1 indicates a direction orthogonal to the plate surface of the substrate to be inspected.

  According to these drawings, the substrate inspection apparatus 11 includes a pair of substrate stationary rails 12 and 16 that are freely arranged to expand and contract the width between the rails, transport the substrate B to be inspected, and fix its position, and the substrate B to be inspected. The inspection heads 22 and 26 are disposed on the front surface side, and the inspection heads 32 and 36 are disposed on the back surface side.

  Among these, the substrate stationary rails 12 and 16 are rail main body portions 13 and 17 formed so as to have a thickness ha as shown in FIG. 1 from the viewpoint of providing required rigidity, and these rails. Chuck portions 14 and 18 extending from the main body portions 13 and 17 and fixing the position of the inspected substrate B are formed.

  In addition, the substrate stationary rails 12 and 16 are arranged such that either one of them can be moved toward and away from the other side in the direction of the arrow Y as shown in FIG. The width W (y) can be matched with the lateral width Bsize (y) of the substrate B to be inspected this time.

  Further, the inspection heads 22 and 26 disposed above the substrate B to be inspected and the inspection heads 32 and 36 disposed below are in the plane direction of the substrate B to be inspected (directions of arrows X and Y in FIG. 2). Head bodies 23, 27, 33, 34 arranged to be movable along the head, and movement in a direction crossing the moving direction of the head bodies 23, 27, 33, 34, in this example The contact probes 24, 28, 34, and 38 are attached to an appropriate lifting mechanism that can be lifted and lowered (in the direction of arrow Z in FIG. 1).

  In addition, the inspection heads 22, 26, 32, and 36 are used to reduce the lifting stroke of the contact probes 24, 28, 34, and 38 during the probing inspection. 14 and 18 and a fixed position to be retracted at the time of non-inspection and each inspection at the time of inspection in the same surface as the surface formed by the substrate B to be inspected fixed through these chuck portions 14 and 18 The position is set and arranged.

  For this reason, the contact probes 24, 28, 34, 38 are moved away from the inspection position of the substrate B to be inspected so that the positions of the substrate stationary rails 12, 16 that do not contact the chuck portions 14, 18 are farthest from the inspection position. Sometimes, a measurement inspection can be performed by moving away from the inspection position by a distance and moving the distance hb during the inspection. 1 and 2, the inspection heads 22, 26, 32, and 38 indicated by imaginary lines are in a fixed position to be retracted during non-inspection, and the inspection heads 22, 26, 32, and 38 indicated by solid lines are inspections. Each inspection position at the time is shown.

  FIG. 3 is a flowchart showing an example of a processing procedure of the rail width changing method (second invention) of the substrate stationary rails 12 and 16 provided in the substrate inspection apparatus 11 having the above-described configuration, and one inspection head located above. The details will be described below.

  First, the user inputs the surface size (outer shape) information of the substrate B to be inspected as Bsize (x, y) to the arithmetic control unit provided in the substrate inspection apparatus 11.

  When there is an input from the user, the arithmetic control unit instructs to change the width between the rails of the board stationary rails 12 and 16, and reads this as the current width W (y).

  Next, the current positions of the inspection heads 22 and 26 are read as HL (x, y) and HR (x, y).

  After the current positions of the inspection heads 22 and 26 are read, the contact probes 24 and 28 of the inspection heads 22 and 26 are raised to the highest position according to a command from the arithmetic control unit, and then the transport direction It is determined whether or not the current positions HL (y) and HR (y) of the inspection heads 22 orthogonal to the inner side of the lateral width Bsize (y) of the substrate B to be inspected.

  If the current positions HL (y) and HR (y) of the inspection heads 22 and 26 are inside the lateral width Bsize (y) of the substrate B to be inspected, the substrate stationary rails 12 and 16 are moved to the rails. After changing the gap width from the current width W (y) to the horizontal width Bsize (y) of the board B to be inspected this time, the board B to be inspected is set on the substrate stationary rails 12 and 16.

  If the current positions HL (y) and HR (y) of the inspection heads 22 and 26 are outside the lateral size Bsize (y) of the substrate B to be inspected, the inspection heads 22 and 26 are covered by the current inspection. After moving to a position inside the lateral width size Bsize (y) of the inspection substrate B, the substrate stationary rails 12 and 16 are moved to change the width between the rails from the current width W (y) to the inspection substrate B to be inspected this time. After changing to the horizontal width size Bsize (y), the substrate B to be inspected is set on the substrate stationary rails 12 and 16, and the processing is completed.

  FIG. 4 is a flowchart showing an example of a processing procedure of an automatic inspection process performed on the inspected substrate B after setting the inspected substrate B on the substrate mounting rails 12 and 16 through the processing of FIG. The relationship between the inspection heads 22 and 26 positioned above will be described below.

  First, the user inputs the surface size (outer shape) information of the substrate to be inspected B as Bsize (x, y) to the arithmetic control unit provided in the substrate inspection apparatus.

  The user designates arbitrary inspection position coordinates on the substrate B to be inspected, registers and holds them as inspection data in the arithmetic control unit, and then instructs execution of automatic inspection on the substrate B to be inspected.

  The arithmetic control unit calculates the movement coordinates of the next inspection position from the registered inspection data, and the current rail width W (y) of the substrate mounting rails 12 and 16 is Bsize (y). Is read.

  Next, HL (x, y) and HR (x, y), which are the coordinates of the movement destination of each inspection head 22, 26, are checked to determine whether or not the position is inside Bsize (y). If it is determined that the inspection heads 22 and 26 are outside, the inspection process is terminated as a prohibition error.

  However, if it is determined that the inspection heads 22 and 26 are located inside, HL (x, y) and HR (x, After moving to y), the contact probes 24 and 28 are lowered and a measurement inspection is performed.

  Such measurement inspections by the contact probes 24 and 28 are repeatedly performed as many times as necessary, that is, all the registered inspection positions, and after all measurement inspections are completed, the measurement inspections are performed via a display unit such as an LCD. The result is output and displayed to the user to finish the process.

  The substrate inspection apparatus 11 can perform the measurement inspection with the inspection heads 22, 26, 33, and 36 always positioned within the stationary surface of the substrate B to be inspected by following such a procedure. The main bodies 23, 27, 33 and 37 can be arranged without getting over the rail main bodies 13 and 17 of the board stationary rails 12 and 16.

  Moreover, the head main bodies 23, 27, 33, and 37 can be horizontally moved between the inspection positions along the surface direction in which the head main body 23, 27, 33, and 37 always approaches the inspection substrate B within the stationary surface of the inspection substrate B. Therefore, the contact probes 24, 28, 34, and 38 can be brought into contact with the inspection position of the substrate B to be inspected by moving the distance hb that is a short descending stroke.

  Therefore, according to the present invention, the up / down stroke of each contact probe 24, 28, 34, 38 can be shortened, so that the positional accuracy can be further increased, and the time required for movement can be shortened accordingly and high speed can be achieved.・ It will fully meet the demand for higher precision.

  The above is the description of the present invention based on the illustrated examples, and various modifications can be made to the specific contents without departing from the gist of the present invention. For example, although the case where the inspected substrate is placed in the horizontal direction has been described as an example, it can be placed in the vertical direction if necessary. Further, three or more inspection heads may be arranged on both sides of the substrate to be inspected. Further, the contact probe may be lifted or lowered in an oblique direction in addition to being lifted or lowered in a direction orthogonal to the surface direction of the substrate to be inspected.

The outline block diagram in the front view direction about an example of 1st invention (apparatus) among this invention. The schematic block diagram in the planar view direction of the example shown in FIG. The flowchart figure which shows the example of a process sequence of 2nd invention (method) among this invention. The flowchart figure which shows the example of a procedure of the automatic test | inspection process performed with respect to a to-be-inspected board | substrate after setting a to-be-inspected board | substrate to a board | substrate stationary rail by 2nd invention. The schematic block diagram in the front view direction of a prior art example. The schematic block diagram in the planar view direction of the prior art example shown in FIG. Explanatory drawing which shows the positional relationship of the board | substrate stationary rail and inspection head in the prior art example shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Board inspection apparatus 12, 16 Board stationary rail 13, 17 Rail main body 14, 18 Chuck part 22, 26, 32, 36 Inspection head 23, 27, 33, 37 Head main body 24, 28, 34, 38 Contact probe

Claims (3)

A pair of substrate stationary rails arranged to enable expansion / contraction of the width between the rails, conveyance of the substrate to be inspected, and fixing the position thereof, and two or more inspection heads disposed on at least one side surface of the substrate to be inspected And consists of
The inspection head includes a head main body arranged to be capable of parallel movement along the surface direction of the substrate to be inspected, and the head main body capable of moving in a direction crossing the movement direction of the head main body. A contact probe disposed in the
In order to shorten the movement stroke of the contact probe at the time of probing inspection, the inspection head is retracted during non-inspection within the same surface as the stationary surface of the substrate to be inspected this time and each inspection position during inspection A board inspection apparatus characterized by being arranged and arranged. The substrate inspection apparatus according to claim 1, wherein the inspection head is disposed on both surface sides of the substrate to be inspected. The process of inputting the surface size information of the board to be inspected this time, the process of reading the current width between the rails of the board mounting rail, the process of reading the current position of each inspection head, and the height of the contact probe provided in each inspection head A rising process for moving the vertical position to the highest position, a determination process for determining whether or not the current position of each inspection head in the direction orthogonal to the transport direction is inside the lateral width size of the substrate to be inspected, Only when it is determined that the current position of each inspection head is inside the lateral width size of the substrate to be inspected through the discrimination process, the width between the rails of the substrate mounting rail is the current inspection amount from the current width. A rail for a substrate stationary rail provided in the substrate inspection apparatus, comprising at least a rail width changing process for changing the width of the substrate to be inspected to enable setting of the substrate to be inspected How to change.

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