JPH0735808A - Moving contact probe type double side inspecting device for circuit board - Google Patents

Abstract

PURPOSE:To provide a moving contact type double side inspecting device for a circuit board which can deal with a long life of more than 10 million passes and a pitch of 0.1mm. CONSTITUTION:A head body 47 set on an X-Y robot for horizontal movement to an inspection position on a circuit board is provided with a vertically sliding shaft 38 which is driven to be connected electrically with a pulse motor 40 to let a contact probe 34 conduct to the substrate by contact. The contact probe 34 mounted on the vertically sliding shaft 38 is formed in a shape of a plate having a pointed tip part to secure longer life and positioning accuracy. A deflection sensor 53 is provided to detect the deflection of the plate-shaped contact probe 34 and the pointed tip part of the contact probe 34 is kept in contact with the substrate by a constant deflection of a contact spring corresponding to the warping of the substrate thereby enabling adaptation to 0.1mm pitch securing the positioning accuracy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe movable circuit board inspecting apparatus for electrically inspecting a pattern of a board using contacts for open, short and resistance values.

[0002]

2. Description of the Related Art Recently, in a circuit board inspection apparatus, C
In order to support OB (chip on board), the same measurement pitch as the external connection pattern pitch of the IC (connection portion between the IC and the external substrate) is required.

A conventional contact probe moving type circuit board inspection device will be described below with reference to the drawings. FIG. 16 is a perspective view showing the configuration of a conventional contact probe movable circuit board single-sided inspection device. As shown in FIG. 16, in order to move the contact probe to the inspection position on the circuit board, a pair of XY robots 101 and 102 (one or more pairs) provided corresponding to the board surface is provided. Combination), a vertical slide mechanism 103, 104 provided on the XY robots 101, 102 for bringing the contact probe into contact with the substrate, and a conventional contact probe attached to the slide mechanism 104, 105. 105 and 106, a unit 107 for holding the substrate, a support mechanism 108 for supporting from the back surface to absorb the warp of the substrate, a camera 109 for recognizing the position of the substrate, and a resistance measuring device 11 such as an LCR meter.
0 and a measurement line 111. With the above configuration, the electrical continuity test is automatically performed based on the information on the pattern of the circuit board.

[0004]

However, such a conventional contact probe movable type circuit board single-sided inspection apparatus is an apparatus which can only inspect one side of the measurement board and cannot inspect both sides at the same time. . Also,
A conventional contact probe movable type circuit board single-sided inspection apparatus has a conventional probe tip 11 as shown in FIG.
2, holder 113, probe tip spring spring receiving portion and holder contact portion 114, coil spring 11
Since the contact probes 105 and 106 consisting of 5 are used, there are many friction portions and the friction amount is large, so the number of contacts (which varies depending on conditions such as stroke, but is the condition at the longest life) is about 500,000 times. Is the lifespan. Further, the clearance play is ± 10 μm or more, and the minimum pitch of 0.2 mm is a value that can be guaranteed. With such a life and minimum pitch, there are 20000 measurement points (1 million measurement combination patterns) and IC pad pitch is 0.1 m.
It cannot be used to inspect a double-sided multi-layered board of m.

Further, in the conventional contact probe moving type circuit board single-sided inspection device, the influence on the warp of the board is reduced by supporting one side not measuring the board to reduce the warp and to provide a supporting force against the contact pressure. Was secured. However, when performing double-sided measurement, it is not possible to support from one side, and there is a problem that it is difficult to secure the contact pressure when the substrate warps and the substrate material is thin and soft.

Further, the function of judging whether or not the tip portion of the contact probe can be inspected has been found only by a simple method of checking the resistance value. Also,
Since the board holding method inspected by sandwiching the rail-shaped parts on both end surfaces of the board, the rail-shaped space of about 2 to 3 mm from both ends of the board is an uninspectable area, and it is necessary to expand the inspectable range. Had the problem that there is.

The present invention solves such a problem and provides a contact probe movable circuit board double-sided inspection apparatus capable of simultaneously inspecting a double-sided board. In addition, the contact probe is designed to have a dramatically extended life and can be used for fine pitches.
By adding a displacement sensor (including a deflection sensor) to the contact probe of the above shape, it is possible to support a fine 0.1 mm pitch. Furthermore, by attaching a linear motor with a linear scale with a resolution of 1 μm or less to the contact probe vertical mechanism, Provided is a contact probe movable circuit board double-sided inspection device capable of handling a pitch of 0.08 mm or less, which is even smaller than a pitch of 1 mm.

Further, the floating of the substrate is prevented, and further,
Provided is a contact probe movable circuit board double-sided inspection device having a function of preventing warpage of a measurement board having a thin board thickness, softness, and not so high rigidity.

Further, an inspection station is provided, and by using this, the displacement sensor can be adjusted, the accurate position of the contact probe of each head can be known, and the fine pitch and the absolute precision can be set to ± 20 μm. In addition, the present invention provides a contact probe movable circuit board double-sided inspection device that recognizes the wear of the tip of the contact probe, checks the wear degree, and notifies the replacement time of the contact probe. Is.

[0010]

In order to achieve the above object, the first invention of the present invention is capable of being horizontally moved to an inspection position on a circuit board and provided corresponding to each of the front and back surfaces of the board. , At least one pair of XY robots, a plate-like contact probe having a pointed tip provided on each head installed in the robot, and contacting the contact probe with a substrate It is provided with a vertical slide means provided on the head for electrical connection, a recognition means for recognizing the position of the substrate, and a measurement means for measuring the current or voltage or the resistance directly from the contact probe.

According to a second aspect of the present invention, a plate-shaped contact probe has a fixed portion, a support portion and a pointed tip portion, and further, a connecting portion between the fixed portion and the support portion, a support portion and a tip end. It has a contact probe consisting of three elements of the connecting part of the parts and the structure of these connecting parts.

Further, according to a third aspect of the present invention, a plate-shaped contact probe fixing portion has a rectangular parallelepiped shape. The fourth invention of the present invention is
As the configuration of the support portion of the plate-shaped contact probe,
A plate that considers the plate thickness and plate width obtained by calculating the deflection to secure a predetermined contact pressure at the tip, heat dissipation, a large allowable current value and low resistance value, and a dimension that allows the sensor to accurately detect the deflection. The dimensions (length, width, plate thickness) are as follows.

The fifth aspect of the present invention is the configuration of the tip portion of a plate-shaped contact probe, in which the distal end portion has a pointed shape of □ 50 to 60 µm, and as the support portion extends. , Has a multi-stepped taper shape in a side view or has a square shape of □ 50 to 60 μm only at the tip part, and isosceles triangle (more precisely, an isosceles trapezoid in a plan view as it extends to the support part ).

According to a sixth aspect of the present invention, the relationship between the fixed portion and the support portion of the plate-shaped contact probe has a shape in which R (R) notches are connected to each other. Is.

According to a seventh aspect of the present invention, the relationship between the support portion and the tip portion of the plate-shaped contact probe is a plan view, and the connection portion is provided with a gentle R (R), and is supported from the boundary. Until it enters the section, it has an isosceles trapezoidal shape.

The eighth aspect of the present invention is to install a displacement sensor for detecting the deflection of the contact probe in the warp direction of the board in order to cope with the warp of the circuit board and ensure the positioning accuracy. .

A ninth invention of the present invention is such that the drive source of the vertical slide means of the contact probe with a sensor is constituted by a linear motor with a linear scale. Further, a tenth aspect of the present invention is to provide a floating / warp prevention unit for preventing the substrate from warping on the vertical slide means that moves up and down in synchronization with the contact probe.

The eleventh aspect of the present invention is for sandwiching the measurement substrate from the front and back surfaces (one side may be used) in order to prevent warpage with respect to the measurement substrate having a small substrate thickness, softness, and rigidity. A substrate scissors plate made of a plate-shaped insulating coated metal base having holes formed at measurement points is provided.

A twelfth aspect of the present invention is, in order to prevent warpage of a measurement substrate having a thin substrate thickness, softness, and low rigidity, at a position where it does not interfere with the contact probe in the same head as the contact probe. Therefore, it has means for moving up and down independently of the vertical slide means that moves up and down in synchronization with the contact probe, and a substrate holding portion with a suction pad at its tip.

The thirteenth invention of the present invention has oblique illumination, a recognition camera and a surveillance camera on the upper and lower heads, and within the range in which each head can move within the apparatus,
Transparent glass having a + (cross) mark of ˜30 μm,
An inspection station equipped with a transparent glass for sensor adjustment that has a step corresponding to the sensitivity of the displacement sensor, which is provided at a position different from the cross mark above it, is provided so that an accurate contact point position can be obtained. It was done.

Further, a fourteenth aspect of the present invention is to have a high-magnification camera in a range in which each head can move, and to have hardware and software for recognizing wear of the tip portion of the contact probe by the camera. An inspection station is provided to check the degree of wear.

A fifteenth aspect of the present invention is a method for holding a substrate holding portion, which is provided with at least four upper and lower suction pads that move independently in the horizontal and vertical directions.

[0023]

According to the first aspect of the present invention, at least one pair of robots is provided on each of the front and back surfaces of the board for horizontal movement to the inspection position on the circuit board, and the robot is installed on the robot. On each of the heads, a vertical slide means with a pulse motor for bringing the contact probe into contact with the substrate is provided, and by configuring the contact probe attached to the vertical slide means in a plate shape having a pointed tip, Both sides of the board can be measured, and the life of the contact probe and the positioning accuracy can be ensured.

Further, according to the second aspect of the present invention, the plate-shaped contact probe is configured to include the fixing portion, the supporting portion, and the pointed tip portion so that the effect of each function can be exhibited and the number of contact times 1000 10,000 times longer life and 0.
It is also possible to measure conduction at a narrow pitch of 1 mm pitch.

Further, according to the third aspect of the present invention, since the plate-shaped contact probe fixing portion has a rectangular parallelepiped shape, the mechanical positioning accuracy in the horizontal and vertical directions is high. It is easy to apply, pressure is easily applied from the external metal part, clearance play is eliminated by mechanical holding, and stable electrical conduction can be obtained.

Further, according to the fourth aspect of the present invention, the plate-shaped contact probe supporting portion has a plate thickness and a plate thickness obtained by calculation of deflection to secure a predetermined contact pressure at the tip end, as a structure of the supporting part of the contact probe. The contact probe has a plate-like size (length, width, plate thickness) that takes into account the plate width and heat dissipation, the large allowable current value, the low resistance value, and the size that allows the sensor to flexure with high accuracy. An appropriate contact probe pressure can be secured at the tip portion, and the amount of wear at the tip portion of the contact probe can be reduced by the heat diffusion effect, so that the life can be extended.

Further, according to the fifth aspect of the present invention, as the configuration of the tip of the plate-shaped contact probe, the tip portion has a pointed shape of □ 50 to 60 μm (varies depending on accuracy). However, it has a multi-step taper shape in a side view as it extends to the support part, or has a square shape of □ 50 to 60 μm only at the tip part, and isosceles triangle in a plan view as it extends to the support part. Since it has the shape of an isosceles trapezoid, the rigidity of the entire tip can be secured even if the tip is small, and it is effective against breakage and wear of the tip, and the contact probe It also has the effect of preventing damage to the head when it is attached to the head.
It is also possible to measure conduction at a narrow pitch of 1 mm pitch.

According to the sixth aspect of the present invention, the relationship between the fixed portion and the support portion of the plate-shaped contact probe is
Since it has a shape in which the R (R) cutout is connected, the repeated fatigue of the material due to the spring of the support portion is reduced, and the number of contacts is 10
The life can be extended to, 000,000 times.

According to the seventh aspect of the present invention, the relationship between the support portion and the tip portion of the plate-shaped contact probe is:
In plan view, the connection part has a gentle R (R) and has an isosceles trapezoidal shape from the boundary to the support part, reducing repeated fatigue of material due to contact pressure applied to the tip part As a result, it is possible to extend the life of the contacts by 10 million times.

According to the eighth aspect of the present invention, in order to cope with the warp of the circuit board and to secure the positioning accuracy,
By installing a displacement sensor that detects the deflection of the contact probe in the warp direction of the board, if you set the sensor sensitivity when the contact support part warps a certain amount corresponding to the warp of the board, the vertical sliding means of the contact probe When approaching the substrate, when the amount of flexure of the spring of the supporting part set to the sensor sensitivity is reached, the approach of the vertical slide means to the substrate is immediately stopped, and the tip of the contact probe with respect to the substrate is stopped. The deflection amount can be made constant, and if the offset amount is set individually for each head, the positioning accuracy can be secured, the contact pressure can be made constant, and the contact height of each head is 0 in absolute value of the slide amount. When the distance is within 0.5 mm, it is possible to keep the amount of positional deviation in the horizontal direction (XY direction) relative to the substrate surface. It also enables conduction measuring a narrow pitch of the contact number 10 million times longer life and 0.1mm pitch.

Further, according to the ninth aspect of the present invention, since the drive source of the vertical sliding means of the contact probe with the sensor is constituted by the linear motor with the linear scale, it is better than the case with only the contact probe with the sensor.
The amount of slide in the vertical slide direction can be made constant for all movements, and the resolution can be 1 μm or less, and the contact height of each head is independent of the absolute value of the slide amount. Even if the warp amount of the substrate varies by about 2 mm, it is possible to make the deflection amount of the contact probe between the heads constant. Therefore, the amount of positional deviation in the horizontal direction (X-Y direction) with respect to the substrate surface can be made constant, and the life can be extended by 10 million contacts and the continuity measurement can be performed at a narrow pitch of 0.1 mm. .

According to the tenth aspect of the present invention, since the up-and-down sliding means that moves up and down in synchronization with the contact probe is provided with the anti-floating / warping unit for preventing the warping of the substrate, the floating / warping of the substrate is prevented. When not only preventing the contact height and stabilizing the substrate height to prevent the contact probe tip part from contacting the substrate and contacting other supporting and fixing parts, but also probabilistically supporting the contact part substrate. Can also happen.

According to the eleventh aspect of the present invention, the measurement substrate is sandwiched from the front and back surfaces (one side may be used) in order to prevent warpage with respect to the measurement substrate having a thin substrate thickness, softness, and rigidity. Since the board scissors made of a plate-shaped insulating coated metal base with holes for the measurement are provided, the board thickness is thin, and it is not only warp-proof against the measurement board that is not soft and rigid, but also contacts. It also serves as a support for the contact pressure at the time, and an appropriate contact pressure can be obtained.

Further, according to the twelfth aspect of the present invention, in order to prevent warpage of the measurement substrate having a thin substrate thickness, softness, and low rigidity, a position where the contact probe and the contact probe in the same head do not interfere with each other. There
Since it has means for moving up and down independently of the vertical slide means that moves up and down in synchronization with the contact probe, and a substrate holding part with a suction pad at its tip, it holds the substrate in the warping direction of the contact probe by suction pressure. An appropriate contact pressure can be obtained by making the distance to the substrate constant independently for each head.

Further, according to the thirteenth aspect of the present invention, oblique lighting is provided on the upper and lower heads, and a recognition camera and a surveillance camera are provided. Transparent glass having a + (cross) mark (changed according to the target pitch) of 30 μm, and transparent glass for sensor adjustment having a step corresponding to the sensitivity of the displacement sensor, provided at a position different from the cross mark on the glass. Since an inspection station equipped with is used, the contact probe can be accurately aligned with the + (cross) mark by the enlargement ratio of the camera and the illumination system by using this, and the + (cross) marks are independent of each other. It can be unified to the common accurate soft origin of the axis of the XY robot that moves in the same direction, and the absolute positioning accuracy of ± 20 μm or less can be maintained.
It is also possible to measure conduction at a narrow pitch of mm pitch.

The fourteenth aspect of the present invention provides an inspection station having a high-magnification camera in a range in which each head can move so that hardware and software for recognizing wear of the tip portion of the contact probe by the camera. Therefore, the wear degree can be checked and the contact probe replacement time can be notified.

The fifteenth aspect of the present invention widens the inspection range by providing at least four vertical suction pads that move independently in the horizontal and vertical directions as a method of holding the substrate holding portion. You can

[0038]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A contact probe movable type circuit board double-sided inspection apparatus according to an embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a perspective configuration diagram of a contact probe movable type circuit board double-sided inspection device in a first embodiment of the present invention, and FIG. 2 is installed on each axis of the XY robot of FIG. It is a perspective view of the head which is. As shown in FIG. 1, the contact probe movable type circuit board double-sided inspection apparatus is a pair of XY robots for moving to the inspection position on the circuit board on each of the front and back surfaces (top and bottom in the figure) of the board. 1
A pair of vertical slide mechanisms with pulse motors for providing a contact probe to a substrate on which heads 30, 31, 32, and 33 are provided respectively on the shafts of the heads 1, 12, and 13 and 14 respectively. 15, 16, 17, 18
And a plate-shaped contact probe 19, 20, 21, 2 which has a special shape and is attached to the slide mechanism to ensure a long life and high positioning accuracy.
2, a unit 23 for holding the substrate, cameras 24 and 25 (minimum necessary number) for recognizing the position of the substrate, oblique illuminations 26 and 27, and a current or voltage or direct resistance measurement signal from the contact probe. It is provided with a calculator 28 that measures through lines A, B, C, and D, and a control information processing unit 29 that controls the mechanism and measurement thereof. The XY robot is constructed under the design conditions that the absolute accuracy is ± 20 μm or less, the mechanical accuracy of the slide mechanism with the pulse motor is 0.05 mm / pulse or less, and the recognition accuracy error is 5 μm or less.

Next, the structure of the head will be described in more detail with reference to FIG. In FIG. 2, the head includes a contact probe 34 in the form of a plate, a measurement signal line A drawn from the measurement side, a metal portion 35 that applies pressure to the contact probe 34 to hold it, and a metal portion 35. An insulating portion 36 that electrically insulates 34 from other components on the head other than the sandwiched metal portion 35, a slide guide 37 that moves the vertical slide shaft, and a vertical slide shaft 38 that converts the rotation of the motor into linear motion. A transmission mechanism 39 for transmitting the rotation of the motor, a high resolution pulse motor or a high resolution servo motor (including AC and DC) 40,
It has a dog 41 for setting the upper limit, origin, and lower limit of the motor shaft, an upper limit sensor 42, an origin sensor 43, a lower limit sensor 44, a high-resolution recognition camera 45, and a camera illumination 46 that illuminates the camera coaxially. 47 is attached to the axis of the XY robot.

According to the present embodiment, after the board position recognition camera (24, 25 in FIG. 1) recognizes the board marks on the front and back surfaces of the board, the control unit follows the CAD data or the NC data of the board. (29 in FIG. 1), the head (30, 31, 32, 33 in FIG. 1) on the XY robot (11, 12, 13, 14 in FIG. 1) moves to a predetermined position,
Rotation of the motor (40 in FIG. 2) is transmitted through the transmission mechanism section (39 in FIG. 2) at that location, and the board is contacted through the vertical slide shaft (38 in FIG. 2) that converts the rotation into a slide. The contact probe (34 in FIG. 2) moves to the height thus reached, contacts the substrate, and the resistance is measured by the measuring instrument (28 in FIG. 1).
The data is organized by the control information processing unit (29 in FIG. 1). By this operation, if the thickness of the double-sided substrate is thick (1.6 mm or more) and the material is hard and strained such as glass epoxy, the conduction test of the rough pitch of 0.5 mm or more can be performed simultaneously from both the front and back sides. .

(Embodiment 2) FIG. 3A shows a second embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example of FIG. In FIG. 3A, the shape of the plate-shaped contact probe 34 is such that the probe itself is fixed and conductive to the head when the surrounding metal applies pressure to the head, and the fixing portion and the tip end are mechanical and electrical. To the support portions 49, 0.1 for connecting and conducting to and simultaneously applying pressure to the tip portion.
From the three elements of a pointed tip 50 that contacts a measuring portion of a minute circuit such as a mm pitch interval, a connecting portion 51 between a fixed portion and a support portion, a connecting portion 52 between a support portion and a tip portion, and their connecting portion configurations. Become. FIG. 3B is a plan view and a side view showing the shape of the tip of the plate-shaped contact probe.

According to this embodiment, the plate-shaped contact probe has a fixed portion (48 in FIG. 3A), a support portion (49 in FIG. 3A), and a tip portion (FIG. 3 (A)). a)
No. 50), a connecting portion between the fixed portion and the supporting portion (51 in FIG. 3A), a connecting portion between the supporting portion and the tip portion (52 in FIG. 3A).
Each of these functions is effective, and each function exerts an effect to extend the service life by 10 million times of contacts and enable conduction measurement of a narrow pitch of 0.1 mm pitch. Further, as the material, a material having a good thermal diffusivity is used, and the stainless steel material is currently used, but other spring material and contact material can also be used. Currently, this type of stainless steel has a life of 1
Has a track record of more than 10 million times.

(Embodiment 3) FIG. 3A shows a third embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example of FIG. 3C is a plan view and a side view of a plate-shaped contact probe of another contact probe movable circuit board double-sided inspection device according to the third embodiment of the present invention. In FIG. 3 (c), the fixed portion is 48 ', the support portion is 49', and the tip portion is 50 '. The connection portion between the fixed portion and the support portion is 5'.
1'is a connecting portion 52 'between the tip portion and the supporting portion.

According to the third embodiment of the present invention, a plate-shaped contact probe fixing portion (4 in FIGS. 3A and 3B) is used.
(8, 48 ') has a rectangular parallelepiped shape, which facilitates mechanical positioning accuracy in the horizontal and vertical directions, makes it easy to apply pressure from an external metal part, and mechanically holds it without clearance play. A contact probe with stable electric conduction can be obtained.

(Embodiment 4) FIG. 3A shows a fourth embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example of FIG. Further, FIG. 3C is a plan view and a side view of a plate-shaped contact probe of another contact probe movable circuit board double-sided inspection apparatus according to the fourth embodiment of the present invention.

FIG. 4 shows the calculation of the second moment of area by the calculation formula of the uniform leaf spring shape part of the support part and the calculation from the tip part to the connection part with the fixed part through the support part in the fourth embodiment of the present invention. It is a figure explaining an example.

In FIG. 4A, the deflection y of the uniform plate-shaped portion of the support portion can be calculated by the following equation. y = − (P / 6EIz) · (x ³ −3lx ² ) where P: force applied to the tip E: Young's modulus Iz: moment of inertia l: length of plate-shaped portion In addition, the width of the plate-shaped portion is b, When the plate thickness is h, the moment of inertia Iz is expressed by the following equation.

[0048]

[Equation 1]

According to the fourth embodiment of the present invention, the plate-shaped contact probe support portion (49 in FIG. 3A) is constructed so as to bend to secure a predetermined contact pressure at the tip. Of the plate thickness and width and heat dissipation obtained from the calculation of the moment of inertia and the moment of inertia, the large allowable current value and the low resistance value, and the dimension that allows the sensor to flexure with high precision. By providing plate-like dimensions (length, width, plate thickness) (for example, (c) of FIG. 3), it is possible to form a supporting portion having a second moment of area as shown in FIG. 4 (b). Therefore, an appropriate contact probe pressure can be ensured at the tip of the contact probe, and the amount of wear at the tip of the contact probe can be reduced by the thermal diffusion effect, which makes it possible to prolong the service life.

(Embodiment 5) FIG. 3A shows a fifth embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example. Further, FIG. 3B is a plan view and a side view showing the shape of a plate-shaped contact probe tip portion of the contact probe movable circuit board double-sided inspection apparatus in the fifth embodiment of the present invention.

FIG. 5 shows an example of the movement of the tip portion in the fifth embodiment of the present invention, showing the positioning accuracy of movement in the horizontal direction. According to the fifth embodiment of the present invention, the tip of the plate-shaped contact probe (5 in FIG. 3A) is used.
As shown in Fig. 3 (b), the leading edge is □
It has a pointed shape of 50 to 60 μm (depending on accuracy), and has a stepped taper shape in multiple stages in a side view as it extends to the support portion. In addition, since it has a square shape of □ 50 to 60 μm only at the tip end in plan view and has an isosceles triangle (correctly isosceles trapezoidal) shape in plan view as it extends to the supporting portion, Even if the tip is small, the rigidity of the entire tip can be secured, and the stepped taper part radiates heat due to electric current and friction, which is effective against bending and abrasion of the tip part, and the contact probe can be used as a head. It also has the effect of preventing damage by hand when mounting it, and the longevity of 10 million contacts can be realized from experimental results. Further, when the movement of the tip portion (vertical direction to the horizontal direction) is repeatedly reproduced as shown in FIG. 5, the range of the positional deviation of the tip portion in the horizontal direction (XY direction) is within ± 5 μm, and the pitch is 0.1 mm. It is a shape that can also realize conduction measurement with a narrow pitch.

Here, as a specific example obtained, when viewed from the side, the first stage from the tip is 7 to 8 ° from the vertical direction, the second stage is 10 to 11 ° from the vertical direction, and the third stage is 45 °. The fourth step is a multi-step of 65 to 70 ° from the vertical direction and the fifth step is 80 ° from the vertical direction to connect with the support portion. Also, when viewed in a plane, the tip part consists of a square of □ 50 to 60 μm, and is shaped like an isosceles trapezoid as it extends to the support part, and the boundary line between the tip part and the support part is about 1/10 of the plate width. It has a size (0.34 mm).

(Embodiment 6) FIG. 3A shows a sixth embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example of FIG. Further, FIG. 3C is a plan view and a side view of a plate-shaped contact probe of another contact probe movable circuit board double-sided inspection device according to the sixth embodiment of the present invention.

According to the sixth embodiment of the present invention, the relationship between the fixing portion and the supporting portion of the plate-shaped contact probe is shown in FIG.
As in (c), it has a shape with R (R) cutouts and is connected, so that repeated fatigue of the material due to the spring of the support portion can be reduced,
A long life with 10 million contacts can be realized.

(Embodiment 7) FIG. 3A shows a seventh embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in the example of FIG. 3C is a plan view and a side view of a plate-shaped contact probe of another contact probe movable circuit board double-sided inspection device according to the seventh embodiment of the present invention.

According to the seventh embodiment of the present invention, the relationship between the supporting portion and the tip of the plate-shaped contact probe is shown in FIG.
In plan view as shown in (c), the connecting part has a gentle R (R), and since it has an isosceles trapezoidal shape from the boundary to the supporting part, it depends on the contact pressure applied to the tip part. The repeated fatigue of the material can be reduced, and the life can be extended to 10 million contacts.

(Embodiment 8) FIG. 6 is a perspective view of a head having a contact probe with a deflection sensor of a contact probe moving type circuit board double-sided inspection apparatus according to an eighth embodiment of the present invention. In FIG. 6, the head includes a plate-shaped contact probe 34 and a contact probe 34.
The deflection sensor 53 for measuring the deflection of the contact probe, the measurement signal line A drawn from the calculation unit, the metal portion 35 for applying pressure to the contact probe 34 to hold the contact probe 34, and the metal portion 35 sandwiching the contact probe 34. An insulating portion 36 that electrically insulates from other components on the head other than
A slide guide 37 in which the vertical slide shaft moves, a vertical slide shaft 38 that converts the rotation of the motor into a linear motion,
A transmission mechanism section 39 for transmitting the rotation of the motor, a high resolution pulse motor or a high resolution servo motor (including AC and DC) 40, a dog 41 for setting the upper limit, origin and lower limit of the motor shaft, and an upper limit sensor 42, The origin sensor 43, the lower limit sensor 44, the high resolution recognition camera 45, the camera illumination 46, and the oblique illumination 54 are provided, and the head main body 47 is XY.
It is attached to the axis of the robot.

FIG. 7 is a block diagram showing the main part of a head having a contact probe with a deflection sensor of a contact probe moving type circuit board double-sided inspection device according to an eighth embodiment of the present invention. In FIG. 7, a plate-shaped contact probe 34, a deflection sensor 53 for measuring the deflection of the contact probe, and a measurement signal line A drawn from the measurement unit.
A metal portion 35 for applying pressure to the contact probe 34 to hold the contact probe 34; and an insulating portion 36 for electrically insulating the contact probe 34 from other components on the head other than the metal portion 35 by sandwiching the contact probe 34 with the metal portion 35. A slide guide 37, which moves the vertical slide shaft, and a vertical slide shaft 38, which converts the rotation of the motor into a linear motion, are shown. 5 here
Reference numeral 5 indicates a substrate.

According to the eighth embodiment of the present invention, the deflection sensor for detecting the deflection of the contact probe (53 in FIGS. 6 and 7) in order to cope with the warp of the circuit board and to secure the positioning accuracy. ) Is installed in the warp direction of the substrate to set the sensor sensitivity when the contact support portion warps by a certain amount corresponding to the warp of the substrate, the vertical sliding mechanism of the contact probe (37 in FIG. 6 and FIG. 7, Three
When (8) approaches the board, when the amount of deflection of the spring of the supporting portion set to the sensor sensitivity is reached, the approach of the vertical slide mechanism to the board is immediately stopped (the delay time of the control system is The amount of deflection of the tip portion of the contact probe with respect to the substrate can be made constant, although it is slight but constant. Therefore, if the offset amount is set individually for each head, the positioning accuracy is ensured, the contact pressure can be kept constant, and the contact height of each head is within 0.5 mm in absolute value of the slide amount. At this time, it is possible to make the amount of positional deviation in the horizontal direction (X-Y direction) constant with respect to the substrate surface, to extend the service life by 10 million contacts and to measure conduction at a narrow pitch of 0.1 mm. Become.

(Embodiment 9) FIG. 8 is a perspective view of a head having a contact probe with a linear motor of a contact probe moving type circuit board double-sided inspection apparatus according to a ninth embodiment of the present invention. In FIG. 8, the head includes a plate-shaped contact probe 34, a deflection sensor 53 that measures the deflection of the contact probe, a measurement signal line A drawn from the measurement unit, and a metal that holds the contact probe 34 by applying pressure. Part 35, an insulating part 36 for sandwiching the contact probe 34 with the metal part 35 and electrically insulating it from other components on the head other than the metal part 35, a slide guide 37 for moving a vertical slide shaft 38, and a linear part. It has a linear motor with scale 56, a high-resolution recognition camera 45, a camera illumination 46, and an oblique illumination 54, and a head body 47 is attached to the axis of an XY robot.

According to the ninth embodiment of the present invention, a linear motor with a linear scale (FIG. 8) is used as a vertical drive source for moving the contact probe with sensor of the eighth embodiment up and down.
56) is provided, the slide amount in the vertical slide direction is more constant than the contact probe with a sensor for all movement amounts, and the resolution can be 1 μm or less. is there. Therefore, regardless of the contact height of each head and the absolute value of the slide amount, it is possible to make the deflection amount of the contact probe between each head constant even if the warp amount of the substrate varies by about 2 mm. Therefore, the horizontal direction (X-
It becomes possible to make the amount of positional deviation in the Y direction) constant,
Long service life with 10 million contacts and 0.1 m
It is also possible to measure conduction at a narrow pitch of m pitches.

(Embodiment 10) FIG. 9 is a plan view of a contact probe movable type circuit board double-sided inspection apparatus according to a tenth embodiment of the present invention, in which the board is prevented from warping on a slide mechanism which moves up and down in synchronization with the contact probe. It is a block diagram which installed the floating warp prevention unit for doing.

In FIG. 9, a plate-shaped contact probe 34, a deflection sensor 53 for measuring the deflection of the contact probe, and a measurement signal line A drawn from the measuring section.
A metal portion 35 for applying pressure to the contact probe 34 to hold the contact probe 34; and an insulating portion 36 for electrically insulating the contact probe 34 from other components on the head other than the metal portion 35 by sandwiching the contact probe 34 with the metal portion 35. A slide guide 37 in which the vertical slide shaft moves, a vertical slide shaft 38 that converts the rotation of the motor into a linear motion, a transmission mechanism 39 that transmits the rotation of the motor, a high resolution pulse motor or a high resolution servo motor (AC, (Including DC) 40, XY
The head body 47 attached to the axis of the robot, the spring movable pin 57 installed in the insulating portion 36, and the substrate 5
It has a pin 58 for adjusting the height of 5, and 57 and 58 are collectively called a floating warp prevention unit.

According to the tenth embodiment of the present invention, the floating / warping prevention unit (FIG. 9) for preventing the substrate from warping is provided in the vertical slide mechanism (37 and 38 in FIG. 9) which moves up and down in synchronization with the contact probe. 57, 58), the substrate is prevented from floating and the height of the substrate is stabilized, and only the tip of the contact probe comes into contact with the substrate.
Not only can the contact with the fixed portion be prevented, but the support of the substrate of the contact portion can also be established.

(Embodiment 11) FIG. 10A is a perspective view of a substrate scissors plate of a contact probe movable circuit board double-sided inspection apparatus in an eleventh embodiment of the present invention.
In FIG. 10 (a), the substrate scissors plate is composed of a plate-shaped insulating coated metal base 60 having holes at the measurement points for inserting the measurement substrate 59 from the front and back surfaces (one side may be used).

FIG. 10 (b) is a sectional view of the substrate scissors plate of the contact probe movable type circuit board double-sided inspection apparatus in the eleventh embodiment of the present invention. In FIG. 10B, a plate-shaped metal base 6 having holes at measurement points for inserting the measurement substrate 59 from the front and back surfaces (may be one surface).
0 has insulating coatings 6 on both sides.

FIG. 10 (c) shows a contact probe movable circuit board double-sided inspection apparatus according to the eleventh embodiment of the present invention, in which the board sandwiched by the board scissors is fixed to a board holding portion constituted by rails. It is an isometric view block diagram of an example. FIG. 10C shows that the measurement substrate 59 sandwiched by the metal base 60 is fixed by the substrate holding portion constituted by the rail 62.

FIG. 10 (d) shows a contact probe movable type circuit board double-sided inspection apparatus according to the eleventh embodiment of the present invention, in which at least four front and back substrates for vacuum suction are sandwiched by the substrate scissors. FIG. 6 is a perspective configuration diagram of an example in which the suction pad and the back side of at least four suction pads for vacuum suction are fixed to a substrate holding portion. FIG. 10D shows that the substrate sandwiched is fixed with at least four suction pads 63 on the front and back sides of the substrate and with at least four suction pads 64 on the back side.

According to the eleventh embodiment of the present invention, the substrate is sandwiched from the front and back surfaces (one side may be used) in order to prevent warpage with respect to the measurement substrate that is thin, soft, and not so rigid. Insulation-coated metal base in the form of a plate with holes at the measurement points (Fig. 10 (a), Fig. 10)
Since 60) of (b) is used, it not only prevents warpage for measurements with a thin board thickness, is soft and does not have large rigidity, but also supports the contact pressure at the time of contact and obtains an appropriate contact pressure. be able to. These can be carried out by the holding method as shown in FIGS.

(Embodiment 12) FIG. 11 shows a twelfth embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a head portion of the contact probe movable circuit board double-sided inspection device in the example of FIG. In FIG. 11, the head holds the plate-shaped contact probe 34, the deflection sensor 53 that measures the deflection of the contact probe 34, the measurement signal line A drawn from the measurement unit, and the contact probe 34 by applying pressure. Metal part 35
An insulating part 36 for sandwiching the contact probe 34 with the metal part 35 and electrically insulating it from other components on the head other than the metal part 35, a slide guide 37 for moving the vertical slide shaft, and a motor rotation. The vertical slide shaft 38 for converting into linear motion, the transmission mechanism 39 for transmitting the rotation of the motor, the high resolution pulse motor or the high resolution servomotor (including AC and DC) 40, and the XY robot shaft are attached. It has a head body 47, a substrate holding portion 65 with a suction pad, a vertical movement rod 66, a linear actuator (cylinder or the like) 67, a suction source 68, a regulation height support pin 69, and a slide guide 70. .

FIG. 12 is a side view of the head portion of the contact probe movable circuit board double-sided inspection apparatus in the twelfth embodiment of the present invention. In FIG. 12, the components denoted by the same reference numerals as those in FIG. 11 have the same mechanism, and thus the description thereof will be omitted.

According to the twelfth embodiment of the present invention, in order to prevent warpage of the measurement substrate having a thin substrate thickness, softness, and low rigidity, the contact probe is placed in a position where it does not interfere with the contact probe in the same head. Therefore, a mechanism that moves up and down independently of a vertical slide mechanism that moves up and down in synchronization with the contact probe (66, 6 in FIGS. 11 and 12).
7) and a substrate holder with a suction pad at its tip (Fig. 11,
12), the substrate is held in the warp direction of the contact probe by suction pressure, and the distance between the head and the substrate is independently adjusted for each head by the height setting support pins (6 in FIGS. 11 and 12).
The contact pressure can be kept constant by 9) and an appropriate contact pressure can be obtained.

(Embodiment 13) FIG. 13A is a perspective view showing the construction of an inspection station of a contact probe movable circuit board double-sided inspection apparatus in a thirteenth embodiment of the present invention. In FIG. 13, a + (cross) mark (changed according to the target pitch) of 1 to 30 μm, which is a common and accurate soft origin of the axes of the XY robots that move independently (at least 4 heads on the front and back surfaces of the substrate) is set to 1 , A transparent glass substrate front surface (or upper) sensor having a step corresponding to the sensitivity of the deflection sensor, provided at a position different from the cross mark, and a substrate rear surface (or lower) sensor sensitivity adjustment mark 2. The sensitivity adjustment mark is 3, the base glass materials 1, 2, and 3 are 4, and the holding portion that holds the base glass material 4 and is installed at a specific position where each head of the entire apparatus can move is 5.
Of the four upper and lower heads (the number of heads may be increased), the upper heads corresponding to the heads 30 and 31 in FIG. 1 are the first and second heads, and the lower heads corresponding to the heads 32 and 33 in FIG. 1 are the third and fourth heads. The contact probe 34a of the upper first head, the recognition camera 45a, the camera illumination 46a, the oblique illumination 54a, the deflection sensor 53a, and the second upper
The contact probe of the head is 34b, the upper surveillance camera (which has a high magnification but does not require positioning accuracy and substitutes for human eyes) 71, and the contact probe of the third head below is 34c, The contact probe of the fourth head below is 34d and the recognition camera is 4
5d, camera illumination is 46d, oblique illumination is 54d, deflection sensor is 53d, and the lower surveillance camera is 72d.

FIG. 13B is a plan view and a side view for explaining the state of the contact probe of the inspection station of the contact probe movable circuit board double-sided inspection apparatus in the thirteenth embodiment of the present invention. In FIG. 13 (b), the height of the tip of the contact probe aligned with the + (cross) mark 1 with the contact probe flexed at the height when the deflection sensor actually senses and stops the mechanism. If the position is 34-A and the base glass material 4 is not present, the position 34-A at the tip of the contact probe is 34-B.

According to the thirteenth embodiment of the present invention, the upper and lower four
The head has oblique illumination, a recognition camera and a surveillance camera, and within the range where each head can move within the device,
Transparent glass with a + (cross) mark of 1 to 30 μm (changed according to the target pitch) and a transparent glass for sensor adjustment having a step corresponding to the sensitivity of the deflection sensor, which is provided at a position different from the cross mark on the transparent glass. An inspection station with glass is provided. The lower camera is used to position the upper contact, and the upper camera is used to position the lower contact.First, the transparent glass for adjusting the deflection sensor is used to optimize the contrast for each illumination of the recognition camera and the surveillance camera. After that, adjust the sensor while observing the movement of the contact probe. The sensor is adjusted when the deflection of the contact probe is, for example, 0.3 mm.
When F is 0.4 mm, the sensor is turned on. In this state, when the deflection of the tip of the contact probe reaches a certain value (0.4 mm in the example), the sensor is turned on. Then, considering the delay (constant value) of the control system, the soft origin is 1 to 30 μm + (cross). ) Touch the tip of each contact probe to the mark (changed according to the target pitch). As a result, the mechanical mechanism actually touches the + (cross) mark at the height at which it senses the sensor and stops (Fig. 13).
34-A of (b)). At that time, more accurately according to the magnification of the camera and the illumination system (camera illumination and oblique illumination)
Align the contact probe with the (cross) mark by teaching operation of the device. Like this, + (cross)
The marks unify the common and accurate soft origins of the axes of the XY robots that move independently (minimum 4 heads on the front and back surfaces of the substrate), thereby maintaining absolute positioning accuracy of ± 20 μm or less, and 0. It is also possible to measure conduction at a narrow pitch of 1 mm pitch.

(Embodiment 14) FIG. 14 shows a fourteenth embodiment of the present invention.
FIG. 3 is a perspective configuration diagram of a contact probe wear degree check system of the contact probe movable circuit board double-sided inspection device in the example of FIG. In FIG. 14, a contact probe 34, which is an object to be measured, and a semitransparent frosted glass 7
3, a holding part 74 that holds the frosted glass 73 and is installed at a specific position where each head of the entire device can move, and a resolution that can sufficiently see the pointed shape of □ 50 to 60 μm at the tip of the contact probe. Recognition camera 7 having
5, the camera illumination 76, oblique illumination 7 from the camera side
7, 78, transmitted illumination 7 from the other side of the frosted glass 73
9. Input the image from the camera, and at the time of measurement, check and judge how much it has worn from the beginning and how much it has worn to the wear determination position, and notify the operation of the device and the contact probe replacement processing control device 80,
It has a TV monitor 81 connected to it.

According to the fourteenth embodiment of the present invention, a high magnification camera (75 in FIG. 14) is provided within the range in which each head can move.
By providing an inspection station having a hard disk and a software (80 in FIG. 14) for recognizing the wear of the tip portion (34 in FIG. 14) of the contact probe by the camera, the wear degree is checked to judge the wear. When the value is reached, the fact that it should be replaced is notified through the entire control unit, and the operation of the measuring mechanism can be stopped at the time of wear that is wasteful even if the resistance is measured.

(Embodiment 15) FIG. 15 shows a fifteenth embodiment of the present invention.
FIG. 6 is a perspective configuration diagram of a suction pad substrate holding portion of the contact probe movable type circuit board double-sided inspection device in the example of FIG. In Fig. 15, a minimum of 4 each on the top and bottom (total 8
A movable substrate holding portion having a suction pad), a suction pad 82, a pad height adjusting pin 83, a Y-axis direction slide unit 84, a lifting cylinder 85, an X-axis direction slide unit 86, a moving cylinder 87. Have
The moving cylinder 87 serves as a substrate holding unit for the train station 88.
Can be moved from.

According to the fifteenth embodiment of the present invention, as a method of holding the substrate holding portion, the inspection range is widened by including at least four suction pads vertically and independently that move independently in the horizontal and vertical directions. be able to.

[0080]

As described above, according to the first aspect of the present invention, at least one pair of robots are provided on each of the front and back surfaces of the board for horizontal movement to the inspection position on the circuit board. , Each head installed in this robot is provided with a vertical sliding means with a pulse mode for bringing the contact probe into contact with the substrate, and the contact probe attached to the vertical sliding means is formed into a plate having a pointed tip. With this configuration, both sides of the substrate can be measured, and the life of the contact probe and the positioning accuracy can be ensured.

According to the second aspect of the present invention, since the plate-shaped contact probe is composed of the fixing portion, the supporting portion and the pointed tip, the effect of each function can be exerted and the contact number can be increased to 1000. 10,000 times longer life and 0.
It is also possible to measure conduction at a narrow pitch of 1 mm pitch.

Further, according to the third aspect of the present invention, the plate-shaped contact probe has a rectangular parallelepiped shape as the fixed portion of the contact probe, so that the positioning accuracy can be improved mechanically in the horizontal and vertical directions. In addition, it is easy to apply pressure from an external metal, eliminates clearance backlash by mechanical holding, and further, stable electrical conduction can be obtained.

Further, according to the fourth aspect of the present invention, as the structure of the supporting portion of the plate-shaped contact probe, the plate thickness and the plate thickness obtained by calculation of the deflection to secure a predetermined contact pressure at the tip end and The contact probe has a plate-like size (length, width, plate thickness) that takes into account the plate width and heat dissipation, the large allowable current value, the low resistance value, and the size that allows the sensor to flexure with high accuracy. An appropriate contact probe pressure can be secured at the tip portion, and the amount of wear of the tip portion of the contact probe can be reduced by the heat diffusion effect, so that the life can be extended.

Further, according to the fifth aspect of the present invention, the tip portion of the plate-shaped contact probe has a pointed shape of □ 50 to 60 μm (varies depending on accuracy) at the tip. However, it has a multi-step taper shape in a side view as it extends to the support part, or has a square shape of □ 50 to 60 μm only at the tip part, and isosceles triangle in a plan view as it extends to the support part. Since it has the shape of an isosceles trapezoid, the rigidity of the entire tip can be secured even if the tip is small, and it is effective against breakage and wear of the tip, and the contact probe It also has the effect of preventing damage to the head when it is attached to the head.
It is also possible to measure conduction at a narrow pitch of 1 mm pitch.

According to the sixth aspect of the present invention, the relationship between the fixed portion and the support portion of the plate-shaped contact probe is as follows.
Since it has a shape with R (R) notches and is connected, the repeated fatigue of the material due to the spring of the supporting portion is reduced, and the number of contacts is 1
The life can be extended to 10 million times.

According to the seventh aspect of the present invention, the relationship between the support portion and the tip portion of the plate-shaped contact probe is as follows.
In plan view, the connection part has a gentle R (R) and has an isosceles trapezoidal shape from the boundary to the support part, reducing repeated fatigue of material due to contact pressure applied to the tip part As a result, it is possible to extend the life of the contacts by 10 million times.

According to the eighth aspect of the present invention, in order to deal with the warp of the circuit board and to secure the positioning accuracy,
By installing a displacement sensor to detect the deflection of the contact probe in the warp direction of the board, the sensor sensitivity can be set when the contact support part warps by a certain amount corresponding to the warp of the board. When the means approaches the substrate, when the amount of deflection of the spring of the supporting portion set to the sensor sensitivity is reached, the vertical slide means immediately stops the approach to the substrate, thereby The deflection of the tip of the contact probe can be made constant, and positioning accuracy can be ensured by setting the offset amount for each head individually, and the contact pressure can be made constant. When the absolute value is within 0.5 mm, the amount of positional deviation in the horizontal direction (XY direction) is made constant with respect to the substrate surface. Door becomes possible, contact number 1
It is possible to extend the life to 10 million times and to measure continuity at a narrow pitch of 0.1 mm.

According to the ninth aspect of the present invention, since the drive source for the vertical sliding means of the sensor-equipped contact probe is composed of a linear motor with a linear scale, it is more difficult than the case of the sensor-equipped contact probe alone.
The amount of slide in the vertical slide direction can be made constant for all movements, and the resolution can be 1 μm or less. The contact height of each head is independent of the absolute value of the amount of slide. Even if the amount of warp varies about 2 mm, it is possible to make the amount of deflection of the contact probe between the heads constant. Therefore, it is possible to make the amount of positional deviation in the horizontal direction (X-Y direction) constant with respect to the substrate surface, to extend the service life by 10 million contacts and to measure conduction at a narrow pitch of 0.1 mm. it can.

According to the tenth aspect of the present invention, since the up-and-down slide means that moves up and down in synchronization with the contact probe is provided with the float-warp prevention unit for preventing the warp of the substrate, the float-warp of the substrate is prevented. In addition to preventing the contact probe tip from contacting the substrate and stabilizing it from contacting other supporting and fixed parts by stabilizing the substrate height, it may occur that the substrate of the contact part is stochastically supported. obtain.

Further, according to the eleventh aspect of the present invention, the measurement substrate is sandwiched from the front and back surfaces (one side may be used) in order to prevent warpage with respect to the measurement substrate having a thin substrate thickness, softness, and rigidity. Since the board scissors made of a plate-shaped insulating coated metal base with holes for the measurement are provided, the board thickness is thin, and it is not only warp-proof against the measurement board that is not soft and rigid, but also contacts. It also serves as a support for the contact pressure at the time, and an appropriate contact pressure can be obtained.

According to the twelfth aspect of the present invention, in order to prevent warpage of the measurement substrate having a thin substrate thickness, softness, and low rigidity, a position where the contact probe and the contact probe in the same head do not interfere with each other. There
Since it has means for moving up and down independently of the vertical slide means that moves up and down in synchronization with the contact probe, and a substrate holding part with a suction pad at its tip, it holds the substrate in the warping direction of the contact probe by suction pressure. An appropriate contact pressure can be obtained by keeping the distance from the substrate constant for each head.

According to the thirteenth invention of the present invention, the upper and lower heads are provided with oblique illumination, the recognition camera and the surveillance camera, and within the range in which each head can be moved within the range of 1 to 1. A transparent glass having a + (cross) mark of 30 μm (changed depending on the target pitch) and a transparent glass for adjustment having a step corresponding to the sensitivity of the displacement sensor, which is provided at a position different from the cross mark on the transparent glass. By providing the inspection station equipped with it, the contact probe can be accurately aligned with the + (cross) mark by the enlargement ratio of the camera and the illumination system by using this.
(Cross) mark can be unified to the common and accurate soft origin of the axis of the XY robot that moves independently,
0.1mm with absolute positioning accuracy of ± 20μm or less maintained
It is also possible to measure conduction at a narrow pitch.

The fourteenth invention of the present invention provides a hardware and software for recognizing wear of the tip portion of the contact probe by the camera by providing an inspection station having a high magnification camera in a range where each head can move. Therefore, the wear degree can be checked and the contact probe replacement time can be notified.

Further, a fifteenth aspect of the present invention is to widen the inspection range by providing at least four upper and lower suction pads which move independently in the horizontal and vertical directions as a method for holding the substrate holding portion. You can

[Brief description of drawings]

FIG. 1 is a perspective configuration diagram of a contact probe movable type circuit board double-sided inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective configuration diagram of a head portion of the contact probe movable type circuit board double-sided inspection apparatus according to the first embodiment.

FIG. 3A is a perspective configuration diagram of a plate-shaped contact probe of the contact probe movable circuit board double-sided inspection device in second to seventh embodiments of the present invention. FIG. 3B is the second to seventh embodiments. And side view showing the shape of the tip of the plate-shaped contact probe of the contact probe movable circuit board double-sided inspection apparatus in FIG. (C) Other contact probe movable circuit board both sides in the third to seventh embodiments Top view and side view of the contact probe of the inspection device

FIG. 4 illustrates a calculation example of a second moment of area by a calculation formula of a uniform leaf spring shape portion of a supporting portion and a calculation from a tip portion to a connecting portion with a fixing portion through a supporting portion in a fourth embodiment of the present invention. Figure

FIG. 5 is a diagram showing an example of actual measurement of the movement of the tip portion in the fifth embodiment of the present invention.

FIG. 6 is a perspective configuration view of a head having a contact probe with a deflection sensor of a contact probe moving type circuit board double-sided inspection device according to an eighth embodiment of the present invention.

FIG. 7 is a configuration diagram of a main part of a head having a contact probe with a deflection sensor of a contact probe movable type circuit board double-sided inspection device in the eighth embodiment.

FIG. 8 is a perspective configuration diagram of a head having a contact probe with a linear motor of a contact probe movable circuit board double-sided inspection device in a ninth embodiment of the present invention.

FIG. 9 is a configuration diagram of a head having a contact probe with a substrate floating / warping prevention unit of a contact probe moving type circuit board double-sided inspection apparatus in a tenth embodiment of the present invention.

FIG. 10 is a view for explaining the structure of a board scissor plate of a contact probe movable circuit board double-sided inspection device in an eleventh embodiment of the present invention.

FIG. 11 is a perspective configuration diagram of a head portion of a contact probe movable circuit board double-sided inspection device according to a twelfth embodiment of the present invention.

FIG. 12 is a side view of the head portion of the contact probe movable circuit board double-sided inspection apparatus according to the twelfth embodiment.

FIG. 13 (a) is a perspective configuration diagram of an inspection station of a contact probe movable circuit board double-sided inspection apparatus in a thirteenth embodiment of the present invention (b) shows the state of contact probes of the inspection station in the thirteenth embodiment. Plan and side view to explain

FIG. 14 is a perspective configuration view of a contact probe wear degree check system of a contact probe movable type circuit board double-sided inspection device in a fourteenth embodiment of the present invention.

FIG. 15 is a perspective configuration diagram of a suction pad substrate holding portion of a contact probe movable circuit board double-sided inspection device in a fifteenth embodiment of the present invention.

FIG. 16 is a perspective configuration diagram of a conventional contact probe movable circuit board single-sided inspection device.

FIG. 17 is a cross-sectional configuration diagram of a contact probe used in the conventional contact probe moving type circuit board single-sided inspection device.

[Explanation of symbols]

 1 + (cross) mark 2 Sensor sensitivity adjustment mark for substrate surface 3 For substrate backside 4 Base glass material 11-14 XY robot 15-18 Vertical slide mechanism with pulse motor 19-22 Contact probe 24, 25 Camera sensor sensitivity adjustment Marks 26, 27 Oblique illumination 28 Measuring device 29 Control information processing unit 30 to 33 Head 34 Contact probe 35 Metal part 36 Insulating part 37 Slide guide 38 Vertical slide shaft 39 Transmission mechanism part 40 High resolution pulse motor or servo motor 45 Recognition camera 46 Camera illumination 47 Head body 48 Fixed part 49 Support part 50 Tip part 51, 52 Connection part 53 Deflection sensor 54 Oblique light illumination 56 Linear motor with linear scale 59 Measurement board 60 Metal base 61 Insulation coating layer 62 Board support part 65 Absorption Substrate holding unit with attachment pad 71,72 Monitoring camera 75 Recognition camera 76 Camera illumination 77,78 Oblique light illumination 79 Transmitted illumination 80 Recognition processing diagnosis processing control device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Akita 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Hiroyuki Yoshida, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (15)

[Claims] 1. At least one pair of robots, each of which is horizontally movable to an inspection position on a circuit board and is provided corresponding to each of the front and back surfaces of the board, and each of the robots installed on the robot. A plate-shaped contact probe having a pointed tip provided on the head, a vertical slide means provided on the head for bringing the contact probe into contact with the substrate, and a recognition means for recognizing the position of the substrate. , A contact probe movable circuit board double-sided inspection apparatus comprising means for measuring current, voltage or resistance directly from the contact probe. 2. The shape of the plate-shaped contact probe is such that the probe itself can contact a fixing portion for fixing and conducting to the head by a metal portion arranged around the probe, and a measuring portion of a minute circuit. A pointed tip, a support that mechanically and electrically connects the fixed part and the tip for electrical connection, and at the same time applies pressure to the tip, a connecting part between the fixed part and the support part, and a support part and the tip part. The contact probe movable circuit board double-sided inspection device according to claim 1, comprising three elements with a connecting portion and a configuration of the connecting portions. 3. The plate-shaped contact probe fixing part has a rectangular parallelepiped shape which facilitates mechanical positioning accuracy in the horizontal and vertical directions and is easy to apply pressure from an external metal part. Contact probe movable circuit board double-sided inspection system. 4. The plate-shaped contact probe supporting part has a plate-thickness and plate-width and a heat-dissipating property and a large permissible current value, which are obtained by calculation of deflection to secure a predetermined contact pressure at the tip part. And the dimensions of the plate (length,
The contact probe movable circuit board double-sided inspection device according to claim 2, having a width and a plate thickness. 5. The plate-shaped contact probe has a tip end portion having a pointed shape of □ 50 to 60 μm in a tip end portion, and has a stepped taper in multiple stages in a side view as it extends to the support portion. Has a shape or only the tip is □ 50
It has a square shape of ~ 60μm and isosceles triangle in plan view as it extends to the supporting part (correctly isosceles trapezoid).
The contact probe movable circuit board double-sided inspection device according to claim 2, which has the shape of 6. The contact probe according to claim 2, wherein the fixed portion and the supporting portion of the plate-shaped contact probe are connected in a shape with a R (R) notch in order to secure springiness. Mobile circuit board double-sided inspection device. 7. The relationship between the support portion and the tip end portion of the plate-shaped contact probe is that in a plan view, the connection portion has a gentle R (R), and has an isosceles trapezoidal shape from the boundary to the support portion. The contact probe movable circuit board double-sided inspection device according to claim 2, further comprising: 8. The contact probe movable circuit board according to claim 1, further comprising a displacement sensor for detecting the deflection of the contact probe in order to secure the positioning accuracy corresponding to the warp of the circuit board. Double-sided inspection device. 9. The contact probe movable circuit board double-sided inspection apparatus according to claim 8, wherein the drive source of the vertical slide means of the contact probe is constituted by a linear motor with a linear scale in order to further improve the positional accuracy. 10. The contact probe movable circuit board both sides according to claim 1, wherein a floating warp prevention unit for preventing the warp of the board is provided on the vertical slide means that moves up and down in synchronization with the contact probe. Inspection device. 11. A plate shape having holes at measurement points for inserting the measurement board from the front and back surfaces (one side is also possible) in order to prevent warpage of the measurement board having a thin board thickness, softness, and rigidity The contact probe movable circuit board double-sided inspection apparatus according to any one of claims 1 to 9, further comprising: a substrate scissor plate made of the insulating coated metal base. 12. In order to prevent warpage of a measurement board having a thin board thickness, softness, and low rigidity, the contact probe is located at a position where it does not interfere with the contact probe in the same head as the contact probe. 10. A unit for moving up and down independently of the vertical sliding unit, and a substrate holding unit with a suction pad at its tip.
2. A contact probe movable circuit board double-sided inspection apparatus according to any one of 1. 13. A transparent glass having oblique illumination, a recognition camera and a surveillance camera on the upper and lower heads, and having a + (cross) mark of 1 to 30 μm in a range in which each head can be moved in the apparatus. 9. The contact probe movable type according to claim 8, further comprising: an inspection station provided with a transparent glass for adjusting a sensor having a step corresponding to the sensitivity of the displacement sensor, the inspection station being provided at a position different from the cross mark on the contact probe. Circuit board double-sided inspection device. 14. An inspection station that has a high-magnification camera within a range in which each head can move and that recognizes wear of the tip of the contact probe by the camera, checks the wear degree, and notifies the contact probe replacement time. The contact probe movable circuit board double-sided inspection apparatus according to claim 1, which is provided. 15. The contact probe movable circuit board double-sided inspection apparatus according to claim 1, further comprising a substrate holding unit having at least four suction pads vertically arranged so as to move independently in the horizontal and vertical directions.