JP2009218409A - Processing apparatus for processing object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a punching apparatus capable of surely bringing a printed board close to a die side member, capable of recognizing an accurate position of the printed substrate with respect to the die side member and being miniaturized by reducing the number of components. <P>SOLUTION: A printed board 17 is placed on the die side member 15. A punch side member 13 moves in a direction approaching or separated to/from the die side member 15 to move in an approaching direction and punch the printed board 17. A position of the printed board 17 with respect to the die side member 15 is recognized by an image photographing device 21. On the basis of the position of the printed board 17 recognized by the image photographing device 21, the printed board 17 is moved to a prescribed position of the die side member 15. When recognizing the position of the printed board 17 by the image photographing device 21, the printed board 17 is directly pressed by a pressing unit 45 and brought close to the die side member 15. The pressing unit 45 is attached to the punch side member 13 so as to freely move forward and backward. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  INDUSTRIAL APPLICABILITY The present invention is suitable for recognizing an accurate position of a processing object with respect to the mounting table in a processing object processing apparatus that performs a predetermined process by mounting a flexible thin plate-shaped processing object on the mounting table. The present invention relates to a processing object processing apparatus.

  In the conventional object processing apparatus shown in Patent Document 1, a substrate as a object to be processed is mounted on a mounting table, and the substrate is fixed on the mounting table by vacuum suction means, and then a punching tool. Thus, a guide hole is formed at a predetermined position of the substrate. In such a conventional workpiece processing apparatus, before the guide hole is drilled, the substrate is aligned with the drilling tool based on the position of a reference mark or the like attached to the substrate. At that time, a reference mark affixed to the substrate by the CCD camera in a state where the compressed air is ejected from the compressed air ejection portion toward the substrate placed on the placement table and the substrate is securely brought into close contact with the placement table. Etc. are measured.

Based on the measurement result, the mounting table is moved and controlled to align the substrate. The compressed air is ejected by supplying air from a compressed air source to the compressed air ejection section via a pipe. The compressed air is ejected by bringing the substrate into close contact with the mounting table by the ejection, and measuring the reference marks on the substrate with a CCD camera in a state without warping or wrinkles. This is because the measurement becomes accurate, and the guide hole can be drilled at an accurate position of the substrate by the drilling tool.
Japanese Utility Model Publication No. 7-27726

  However, in the conventional workpiece processing apparatus, the compressed air is ejected from the compressed air ejecting section so that the substrate is brought into close contact with the mounting table. Depending on the relationship between the degree of rigidity, warpage, and wrinkles, the substrate could not be brought into close contact with the mounting table. For this reason, the exact position of the substrate with respect to the mounting table could not be measured. Further, since air is supplied from the compressed air source to the compressed air ejecting portion via the pipe and the compressed air is ejected from the compressed air ejecting portion, the number of parts is increased, and from the compressed air source, There is also a problem in that a space for arranging the compressed air source to the pipe is required, and the object processing apparatus is increased in size.

  The present invention has been made to solve such a problem, and it is possible to reliably bring a flexible thin plate-like object to be placed into close contact with the mounting table, and to accurately measure the object to be mounted on the mounting table. It is an object of the present invention to provide a workpiece processing apparatus that can recognize a position and can be reduced in size by reducing the number of parts.

  In order to achieve this object, a processing object processing apparatus according to the present invention includes a mounting table for mounting a flexible thin plate-shaped processing object, and a direction close to or away from the mounting table. A processing unit that is relatively movable and relatively moves in the direction in which it approaches, and performs a predetermined process on an object to be processed that is mounted on the mounting table, and a substrate that is mounted on the mounting table An image capturing apparatus for recognizing a position of a predetermined part of the processing object with respect to the mounting table, and a predetermined object on the mounting table based on the position of the predetermined part of the processing object with respect to the mounting table recognized by the image capturing apparatus. An object processing apparatus including a moving device that moves the object to the position of the object, and when the position of the predetermined part of the object to be processed is recognized by the image capturing device, the predetermined part of the object to be processed is pressed. The pusher that brings the workpiece into close contact with the mounting table is moved forward and backward with respect to the mounting table. But on the processor to.

  In the present invention, a predetermined portion of the object to be recognized that is to be recognized by the image photographing apparatus is pressed by the pressing element so that the object to be processed is brought into close contact with the mounting table. For this reason, the image photographing apparatus can recognize an accurate position of the workpiece with respect to the mounting table, and accordingly, the processing section can appropriately process the workpiece. That is, with the object to be processed being in close contact with the mounting table, the position of the object to be processed is recognized by the image capturing device, and the moving object is moved based on the position recognition to move the object to be processed. By adjusting the front / rear, left / right or rotational position of the processed object, the processed object can be positioned at an appropriate position. As a result, proper processing can be performed when the processing object is processed by the processing unit.

  In this case, after the object to be processed is moved by the operation of the moving device, the position of the object to be processed is recognized again by the image photographing device, and the processing by the processing unit is performed when the position of the object to be processed becomes appropriate. In addition, the processing unit is relatively movable in a direction in which the processing unit approaches or separates from the mounting table, and the processing unit moves in a direction in which the processing unit moves relatively to the processing table and is placed on a processing object placed on the mounting table. Since the processing unit is provided with a presser, the processing unit is placed closer to or away from the mounting table to be processed on the mounting table. The pressing element can be close or separated. For this reason, a dedicated moving device for moving the pressing element is not required, the number of parts can be reduced correspondingly, and the workpiece processing apparatus can be downsized.

  Furthermore, the pressing element is provided in the processing unit so as to be movable forward and backward in a direction approaching or separating from the mounting table. For this reason, when the processing unit is relatively moved in the approaching direction to perform a predetermined process on the object to be processed, the pressing member is obstructed by retreating the pressing member in a direction away from the mounting table. Thus, a predetermined process can be performed on the workpiece without any trouble. Note that only one or a plurality of pressing members may be provided. Moreover, it is preferable that the predetermined site | part of the to-be-processed object which a presser presses is the vicinity of the part to which the process in a to-be-processed object is performed.

  A workpiece processing apparatus according to a second aspect of the present invention is the workpiece processing apparatus according to the first aspect, wherein the processing section is numerically controlled in a direction approaching or separating from the mounting table. It is characterized by the fact that it moves. According to the second aspect of the present invention, the processing unit is numerically controlled and relatively moved, so that the amount of movement is controlled with high accuracy. For this reason, the pressing force applied to the object to be processed by the pressing element can be finely adjusted in accordance with the characteristics of the object to be processed and appropriately pressed, and a weak pressing force can be applied by the pressing element to the mounting table. It is also possible to move the object to be processed in close contact and align it with a predetermined position on the mounting table. As a result, the alignment accuracy can be further improved.

  A workpiece processing apparatus according to a third aspect of the present invention is the workpiece processing apparatus according to the first or second aspect, wherein the pressing element is applied by the biasing means so as to advance toward the mounting table. The object to be processed is pressed by the pressing element by the urging force of the urging means and brought into close contact with the mounting table. According to the invention described in claim 3, since the object to be processed is pressed with the pressing element by the urging force of the urging means and brought into close contact with the mounting table, the object to be processed is securely brought into close contact with the mounting table. The pusher can be moved backward in a direction away from the mounting table with a simple and inexpensive structure.

  A workpiece processing apparatus according to a fourth aspect of the present invention is the workpiece processing apparatus according to any one of the first to third aspects, wherein the workpiece is placed on a mounting table. When the processing unit moves relatively in a direction close to the processing unit, the pressing unit is positioned with respect to the processing unit so that the processing unit presses the processing unit with the pressing unit before contacting the processing unit. It is a feature.

  According to the fourth aspect of the present invention, the object to be processed is pressed by the pressing element before the processing unit comes into contact with the object to be processed. For this reason, since a to-be-processed object can be given to a to-be-processed object by a process part, after pressing a to-be-processed object with a presser and making it closely contact with a mounting base beforehand, a predetermined process can be performed appropriately. In addition, since the processing object is pressed by a pressing member protruding from the processing unit before the processing unit comes into contact with the processing object, the processing object is pressed by the pressing element so as to be in close contact with the mounting table. In this state, a gap can be formed between the processing unit and the object to be processed, and a predetermined part of the object to be processed can be imaged by positioning the imaging unit of the image capturing apparatus in the gap.

  A workpiece processing apparatus according to a fifth aspect of the present invention is the workpiece processing apparatus according to any one of the first to fourth aspects, wherein the workpiece processing apparatus is mounted on a mounting table. It comprises a punching device for drilling a predetermined hole in the placed workpiece, the processing part comprises a punch side member of the punching device, and the mounting table comprises a die side member of the punching device. .

  According to the fifth aspect of the present invention, the predetermined part of the workpiece to be recognized by the image photographing apparatus can be reliably brought into close contact with the die side member, and the accurate position of the workpiece with respect to the die side member can be determined. Can be recognized. In addition, since the accurate position of the object to be processed can be recognized, the installation position of the object to be processed can be adjusted to an appropriate position, thereby enabling accurate processing. In addition, the presser can be moved closer to or away from the workpiece placed on the die side member by moving the punch side member closer to or away from the die side member. For this reason, a dedicated moving device for moving the pressing element is not required, the number of parts can be reduced correspondingly, and the punching device can be miniaturized.

  In this case, the punch side member is constituted by a punch provided with a predetermined hole in the workpiece placed on the die side member, and the presser is arranged in the vicinity of the punch in the punch side member. When the punch side member relatively moves in a direction close to the workpiece placed on the die side member, the workpiece is processed by the presser before the punch side member contacts the workpiece. It is preferable to position the pressing element with respect to the punch side member so as to press the.

  According to this, in the state where the vicinity of the part where the predetermined hole is drilled is pressed by the pressing element and the object to be processed is brought into close contact with the die side member, the hole on the object to be processed is punched by the punch of the punch side member. Therefore, the hole can be drilled with high accuracy. In addition, since the workpiece is pressed by the presser before the punch side member comes into contact with the workpiece, the punch is pressed in a state where the workpiece is pressed by the presser and brought into close contact with the die side member. A gap can be formed between the side member and the object to be processed, and a predetermined part of the object to be processed can be photographed by positioning the photographing unit of the image photographing device in the gap.

  A processing object processing apparatus according to a sixth aspect of the present invention is the processing object processing apparatus according to any one of the first to fourth aspects, wherein the processing object comprises a printed circuit board. The material processing apparatus comprises a substrate inspection device that inspects the electrical continuity of the printed circuit board by bringing a plurality of inspection probes into contact with the plurality of electrical contacts of the printed circuit board placed on the mounting table. Is composed of an inspection probe side member provided with a plurality of inspection probes.

  According to the sixth aspect of the present invention, the printed circuit board can be reliably brought into close contact with the mounting table, and the accurate position of the printed circuit board with respect to the mounting table can be recognized. In addition, since the accurate position of the printed circuit board can be recognized, the installation position of the printed circuit board can be adjusted to an appropriate position, thereby enabling accurate inspection. In addition, the presser can be moved closer to or away from the printed circuit board placed on the mounting table by relatively moving the inspection probe side member closer to or away from the mounting table. For this reason, a dedicated moving device for moving the pressing element is not required, and accordingly, the number of parts can be reduced, and the board inspection apparatus can be downsized.

  In this case, the presser is disposed in the vicinity of the plurality of inspection probes on the inspection probe side member, and when the inspection probe side member relatively moves in the direction approaching the printed circuit board placed on the mounting table, It is preferable that the presser is positioned with respect to the inspection probe side member so that the printed circuit board is pressed by the presser before the plurality of inspection probes contact the printed circuit board. According to this, the plurality of inspection probes are brought into contact with each other while the printed circuit board is brought into close contact with the mounting table by pressing the vicinity of the portion where the plurality of inspection probes are in contact with the pressing element. It is possible to check the state of proper continuity.

  For this reason, the inspection can be performed with high accuracy. In addition, since the printed circuit board is pressed by the presser before the plurality of inspection probes come into contact with the printed circuit board, the plurality of inspection probes are in close contact with the mounting table by pressing the printed circuit board with the presser. A gap can be formed between the printed circuit board and the printed board, and a photographing part of the image photographing apparatus can be positioned in the gap to photograph a predetermined part of the printed board.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 shows a schematic configuration of a perforation apparatus 11 (which constitutes a “processing object processing apparatus” in the present invention) according to the embodiment. In FIG. 1, the arrow F points to the front. This punching device 11 is disposed so as to face the punch side member 13 below the punch side member 13 constituting the “processing section for performing a predetermined process” according to the present invention. A die-side member 15 (which constitutes a “mounting table” according to the present invention) and a flexible thin plate-like printed circuit board 17 (the “object to be processed” according to the present invention) placed on the die-side member 15. And a moving device 19 that moves the printed circuit board 17 to a predetermined position on the die side member 15 and a die at a predetermined portion of the printed circuit board 17 placed on the die side member 15. The image capturing device 21 recognizes the position with respect to the side member 15.

  A presser 45, which will be described later, is provided on the punch side member 13 so as to be able to advance and retract in a direction approaching or separating from the die side member 15. The predetermined part of the printed circuit board 17 refers to a reference mark attached to the printed circuit board 17 or a specific part of the wiring pattern of the printed circuit board 17 and is hereinafter referred to as “reference mark or the like”. One or a plurality of the reference marks and the like are provided at predetermined positions on the printed circuit board 17, and the reference marks and the like are photographed by the image photographing device 21 and the position with respect to the die side member 15 is recognized. Although not shown, the punching device 11 includes a mechanism for controlling each mechanism provided in the punching device 11 and an operation of each device, an operation panel for operating each mechanism and each device, and the like. ing.

  The moving device 19 includes a pair of a first gripping mechanism 23 and a second gripping mechanism 25, a gripping mechanism support member 27 that supports the first gripping mechanism 23 and the second gripping mechanism 25, and the gripping mechanism support member. And a support member moving mechanism 28 that freely moves 27. The support member moving mechanism 28 includes a gripping mechanism support member 27 together with the first gripping mechanism 23 and the second gripping mechanism 25 in the X-axis direction (direction along the longitudinal direction of the die-side member 15) and the Y-axis direction shown in FIG. (In a direction perpendicular to the X-axis direction on the horizontal plane) and rotated in a direction around the axis along the Z-axis direction (the direction perpendicular to the X-axis direction and the Y-axis direction and the vertical direction). It is configured to move freely. The support member moving mechanism 28 is a well-known mechanism and includes a moving mechanism including an electric motor, a rail, a ball screw, and the like, and a rotating mechanism including an electric motor and a rotating shaft.

  The first gripping mechanism 23 and the second gripping mechanism 25 have a gripping portion 23a and a gripping portion 25a for gripping an edge portion on one end side of the printed circuit board 17 or releasing the gripping at the distal end portions. The supporting member moving mechanism 28 is operated in a state where the edge portion of the printed circuit board 17 is gripped by the gripping portions 23a and 25a, and the gripping mechanism supporting member 27 is appropriately moved to move the printed circuit board relative to the die side member 15. 17 is aligned with a predetermined position.

  Further, the gripping mechanism support member 27 can move the first gripping mechanism 23 and the second gripping mechanism 25 in the direction of widening or narrowing each other, and the width dimension of the printed circuit board 17 (X in FIG. 1). The distance between the first gripping mechanism 23 and the second gripping mechanism 25 can be appropriately adjusted according to the dimension in the axial direction. For this reason, the printed circuit board 17 is appropriately moved so as to widen the distance between the first gripping mechanism 23 and the second gripping mechanism 25 in the state where the vicinity of the corners of both ends of the printed circuit board 17 is gripped by the gripping portions 23a and 25a. It is possible to prevent undulation between the 17 gripped portions.

  The image photographing device 21 is configured to be movable in the X axis direction and the Y axis direction shown in FIG. 1 by a photographing device moving mechanism (not shown), and extends to one end of the image photographing device 21. A CCD camera (not shown) is attached to the tip of the arm portion 21a. The photographing apparatus moving mechanism is a well-known mechanism and includes a moving mechanism including an electric motor, a rail, a ball screw, and the like, and an electric motor.

  The punching device 11 is provided with an image processing device, a memory for storing various data, and a microcomputer in addition to the devices described above. The microcomputer is a CCD camera of the image photographing device 21. The position of the reference mark or the like of the printed board 17 with respect to the die side member 15 is obtained by calculation by processing the image to be photographed. Then, based on the obtained position of the reference mark or the like, the moving device 19 operates the support member moving mechanism 28 to move the gripping mechanism support member 27 in the X-axis direction or the Y-axis direction, or in the Z-axis direction. The printed board 17 is aligned with a predetermined position of the die-side member 15 by rotating in the direction around the axis along the axis.

  At the time of this alignment, the gripping portion 23a of the first gripping mechanism 23 and the gripping portion 25a of the second gripping mechanism 25 grip and move only one end side of the printed circuit board 17. For this reason, in the moving device 19, both the gripping portions 23a and 25a are directed from the die side member 15 to the rear or obliquely rearward along the Y-axis direction shown in FIG. 1 so that the printed circuit board 17 does not wave when moved. The printed circuit board 17 is moved so as to always move backward.

  The punch side member 13 is configured to be movable by being numerically controlled in the Z-axis direction shown in FIG. 1 by a punch side member moving mechanism (not shown). 2 to 5, the punch-side member 13 is bonded and fixed to the base frame 29, the punch base plate 31 bonded and fixed to the lower surface of the base frame 29, and the lower surface of the punch base plate 31. A punch plate 33, a cylindrical punch 35 penetrating the punch plate 33 and having an upper end joined and fixed to the lower surface of the punch base plate 31, and a stripper 37 are provided. The punch 35 is for making a predetermined hole in the printed circuit board 17 placed on the die side member 15, and the stripper 37 is used for punching the printed circuit board 17 with the punch 35. This is for pressing the upper surface.

  The punch 35 is inserted into a through-hole 37a formed in the central portion of the stripper 37, and is slidable through the through-hole 37a. The punch base plate 31, the punch plate 33, and the stripper 37 are all formed in a rectangular plate shape. The punch plate 33 and the stripper 37 are substantially the same rectangular shape smaller than the punch base plate 31. The plate thickness of the punch plate 33 is slightly thinner, and the plate thickness of the punch plate 33 is approximately half of the plate thickness of the punch base plate 31.

  At the four corners of the punch base plate 31, the upper ends of the columnar guide struts 39 are firmly fixed through the punch base plate 31, respectively, and intermediate the guide struts 39 projecting downward from the punch base plate 31. The portions are inserted through through-holes 37 b formed in the four corners of the stripper 37. A mechanism (not shown) for restricting the movement of the stripper 37 so as not to be separated from the punch plate 33 by the gap S (see FIGS. 2 and 3) is provided between the punch base plate 31 or the punch plate 33 and the stripper 37. It is provided in between.

  Note that the stripper 37 is guided by the guide column 39 and is movable in the direction along the axis of the guide column 39 (Z-axis direction shown in FIG. 1) above each through hole 37b of the stripper 37, and Guide bushes 40 for reducing sliding frictional resistance when moving are provided. The inner diameter of the through hole 37 b of the stripper 37 below the guide bush 40 is slightly larger than the outer diameter of the guide column 39, and the inner diameter of the guide bush 40 is substantially the same as the outer diameter of the guide column 39. Further, around the punch 35, four compression springs 41 are arranged in the vicinity of the punch 35 at equal angular intervals of 90 degrees so as to surround the punch 35.

  The compression spring 41 passes through the punch plate 33 and is interposed between the lower surface of the punch base plate 31 and the upper surface of the stripper 37 in a compressed state. The stripper 37 is always urged away from the punch plate 33 by the compression spring 41. Further, the stepper 37 is provided with four stepped through holes 43 (see FIG. 6) at equal angular intervals of 90 degrees so as to further surround the portion where the four compression springs 41 are interposed. The through hole 43 is formed such that the upper part facing the punch plate 33 has a large diameter, and the lower part on the opposite side is formed with a small diameter so that the through hole 43 is closer to the lower part of the middle part of the through hole 43 in the longitudinal direction. A step portion 43a is formed.

  A columnar pressing element 45 having a flange 45a (see FIG. 6) formed on the upper side of the middle part in the longitudinal direction is inserted into the through hole 43, and the pressing element 45 is connected to the punch 35 in the punch side member 13. It is arranged in the vicinity. In FIG. 2 to FIG. 6, for the convenience of drawing, a portion between the left and right guide columns 39 and the presser 45 and the like is broken and omitted as shown by a two-dot chain line. The upper end surface of the flange 45 a of the pressing element 45 is pressed by the lower end surface of the compression spring 47, and the lower end surface of the flange 45 a is brought into contact with the step 43 a of the through hole 43.

  For this reason, the pressing element 45 is urged by the compression spring 47 so as to advance toward the die side member 15, and the pressing element 45 can move forward and backward in a direction approaching or separating from the die side member 15. Projected to Then, before the punch-side member 13 is lowered and the lower surface of the stripper 37 contacts the printed circuit board 17, the pressing member 45 contacts the printed circuit board 17 first so that the printed circuit board 17 is pressed against the punch-side member 13. A pressing element 45 is positioned. The compression spring 47 has a spring constant or the like so that a relatively small compressive load is generated even in the most compressed state in the range of expansion and contraction. In addition, it replaces with the compression spring 47, the presser 45 is urged | biased by the air spring using compressed air, or the compression spring 47 is abbreviate | omitted, and sets the weight of the presser 45 itself suitably, and presses the weight of the presser 45 itself. Thus, the pressing element 45 may be urged downward.

  The large diameter portion on the upper side of the through hole 43 is formed to have a size slightly larger than the outer diameter of the flange 45a of the pressing element 45 and the compression spring 47, and the inner diameter of the small diameter portion on the lower side of the through hole 43 is the pressing element 45. Are formed in dimensions slightly larger than the outer diameter of the portion below the flange 45a. In addition, the upper side of the compression spring 47 is inserted into the punch plate 33 and the punch base plate 31 through through holes respectively formed at positions coaxial with the through holes 43. The compression spring 47 is compressed between the lower end surface of the fixing screw 49 screwed into the screw hole formed in the upper portion of the through hole of the punch base plate 31 and the upper end surface of the flange 45a of the pressing element 45. It is intervened in.

  As described above, since the compression springs 47 are accommodated in the through holes of the punch base plate 31 and the punch plate 33 and the through holes 43 of the stripper 37, a dedicated container or the like for accommodating the compression springs 47 becomes unnecessary. . Depending on the thickness of the punch base plate 31, the punch plate 33 and the stripper 37, the spring constant of the compression spring 47, etc., the punch plate 33 and the stripper 37 are drilled only in both through holes or the stripper 37. The compression spring 47 may be accommodated in the formed through hole 43 and the fixing screw 49 may be attached to the punch plate 33 or the stripper 37.

  On the other hand, the die side member 15 is disposed below the stripper 37. The die side member 15 includes a base 51, a die base plate 53 bonded and fixed to the upper surface of the base 51, and a die 55 bonded and fixed to the upper surface of the die base plate 53. The die 55 is for mounting the printed circuit board 17 on the upper surface thereof. The die base plate 53 and the die 55 are each formed in a rectangular plate shape, and the die base plate 53 is larger than the die 55 and thicker.

  A circular punch hole 55a into which the lower end portion of the punch 35 is inserted is formed through the central portion of the die 55 where the printed circuit board 17 is placed. By inserting the punch 35 into the punch hole 55a, the printed circuit board 17 placed on the upper surface of the die 55 is punched. The inner diameter of the punch hole 55 a is slightly larger than the outer diameter of the punch 35. A through hole 53a larger than the punch hole 55a is formed at a central portion of the die base plate 53 and facing the punch hole 55a of the die 55 at a position coaxial with the punch hole 55a. In addition, through holes 53 b through which the lower end portions of the guide support columns 39 are respectively inserted are formed at four corners of the die base plate 53.

  In addition, guide bushes 59 through which the lower end portions of the guide columns 39 are inserted are fitted in stepped through holes 57 (see FIG. 6) respectively drilled at the four corners of the die 55. The through hole 57 is formed at a position that is coaxial with the through hole 53 b of the die base plate 53. The inner diameter of the guide bush 59 is smaller than the inner diameter of the through hole 53 b and slightly larger than the outer diameter of the guide column 39, and a flange portion 59 a is formed at the lower end portion of the guide bush 59. The through hole 57 is formed with a stepped portion 57 a because the lower end portion is formed to have a large diameter, and the flange portion 59 a of the guide bush 59 is sandwiched between the stepped portion 57 a and the upper surface of the die base plate 53. Yes. The lower ends of the four guide columns 39 are guided by the guide bushes 59 and lowered, whereby the punch 35 is accurately moved with respect to the punch hole 55a of the die 55 in the Z-axis direction shown in FIG.

When punching at a predetermined position of the printed circuit board 17 using the punching device 11 configured as described above, for example, the punching operation is performed in the order of the following steps (1) to (10).
(1) First, the distance between the gripping part 23a of the first gripping mechanism 23 and the gripping part 25a of the second gripping mechanism 25 is made substantially the same as the distance between both ends of the printed circuit board 17, so that the gripping parts 23a, After gripping the vicinity of the corners at both ends of the printed circuit board 17 with 25a, the gap between the first gripping mechanism 23 and the second gripping mechanism 25 is widened in the gripped state so that the printed circuit board 17 is not undulated. Like that.

(2) Next, in a state where the printed circuit board 17 is gripped by the gripping portions 23 a and 25 a, the support member moving mechanism 28 is operated to move the first gripping mechanism 23 and the second gripping mechanism 25. The printed circuit board 17 is aligned with the die-side member 15 so that the reference mark or the like of the printed circuit board 17 is positioned below the punch 35.
(3) Next, the punch-side member 13 is moved down in the Z-axis direction shown in FIG. 1 by the punch-side member moving mechanism, and the vicinity of the reference mark or the like on the printed circuit board 17 is directly pressed by the lower ends of the four pressing elements 45. Then, the warp, wrinkles, etc. existing on the printed circuit board 17 as indicated by the symbol W in FIG. 2 are extended, and the portion of the printed circuit board 17 to which the reference mark or the like is attached is the die 55 of the die side member 15 as shown in FIG. Make sure it is completely in close contact with the top surface. At this time, the printed circuit board 17 is pressed by the pressing element 45 by the urging force of the compression spring 47 and brought into close contact with the die 55.

(4) Next, in a state where the printed circuit board 17 is brought into close contact with the die side member 15 by being pressed by the pressing element 45, the arm portion 21a of the image capturing device 21 is moved by the moving mechanism for the image capturing device. The 21 CCD cameras are positioned immediately above the reference marks on the printed circuit board 17.
(5) Next, the reference mark or the like of the printed circuit board 17 is photographed by the CCD camera, and the photographed image is subjected to image processing to obtain the position of the reference mark or the like of the printed circuit board 17 with respect to the die side member 15 by calculation.
(6) Based on the position of the reference mark or the like obtained in the step (5), the moving device 19 operates the support member moving mechanism 28 to hold the printed circuit board 17 and the second holding mechanism 23. The gripping portions 23a and 25a with the gripping mechanism 25 are appropriately moved rearward or obliquely rearward along the Y-axis direction shown in FIG. 1 to place the printed circuit board 17 at a predetermined position on the upper surface of the die 55 of the die side member 15.

  At this time, if one reference mark or the like is provided at the center position of the hole formed by the punch 35 in the printed circuit board 17, the printed circuit board 17 is arranged so that the reference mark or the like coincides with the axial center of the punch 35. Align. Further, when a plurality of reference marks or the like are attached to the printed circuit board 17, the positions of the plurality of reference marks or the like with respect to the die side member 15 are obtained by calculation, and from the obtained positions of the plurality of reference marks or the like. The center position of a hole scheduled to be drilled in the printed board 17 by the punch 35 is obtained by calculation, and the printed board 17 is aligned so that the obtained center position of the hole coincides with the axial center of the punch 35. The relationship between the positions of the plurality of reference marks and the center position of the hole formed by the punch 35 is stored in advance in the memory.

  In order to increase the accuracy of the alignment of the printed circuit board 17 with respect to the die side member 15, the gripping portions 23 a and 25 a that grip the printed circuit board 17 are moved to temporarily change the predetermined position on the upper surface of the die 55 of the die side member 15. After the printed circuit board 17 is positioned, the CCD camera of the image photographing device 21 captures the reference mark on the printed circuit board 17 again to obtain the position of the reference mark and the like, and the printed circuit board is placed at a predetermined position on the upper surface of the die 55. When 17 is not yet positioned, the gripping portions 23a and 25a that grip the printed circuit board 17 may be moved again so as to be positioned at a predetermined position. Such a movement of the gripping portions 23a and 25a may be performed a plurality of times to further improve the alignment accuracy of the printed circuit board 17 with respect to the die side member 15.

(7) Next, the arm portion 21a of the image photographing device 21 is moved outward from below the punch side member 13 so as not to obstruct the punching work by the punch 35.
(8) Next, the punch side member 13 is further lowered in the Z-axis direction shown in FIG. 1 by the punch side member moving mechanism, and the lower surface of the stripper 37 is brought into contact with the upper surface of the printed circuit board 17 as shown in FIG. Make contact. As a result, the printed circuit board 17 is not only pressed against the upper surface of the die side member 15 by the four pressing elements 45 whose compression load by the compression springs 47 is further increased, but also the stripper 37 is used to attach the printed circuit board 17 to the die side member 15. Pressed against the top surface.

(9) Next, the punch-side member 13 is further lowered in the Z-axis direction shown in FIG. 1 by the punch-side member moving mechanism, and a predetermined hole is punched in the printed circuit board 17 by the punch 35 as shown in FIG. Set up. Thus, the punched piece of the printed circuit board 17 passes through the punch hole 55a and the through hole 53a and falls onto the base 51.
At this time, the stripper 37 does not move downward in contact with the printed circuit board 17, but compresses the compression spring 41 to approach the punch plate 33. Also, the four pressing elements 45 do not descend in contact with the printed circuit board 17, and the compression spring 47 is further compressed, so that the flange 45 a of the pressing element 45 is inserted into the through hole of the punch plate 33.
(10) Next, the punch side member 13 is raised to the initial position (position shown in FIG. 1) in the Z-axis direction shown in FIG. 1 by the punch side member moving mechanism.
This completes the drilling operation of the printed circuit board 17.

  In addition, the order and content of the drilling operation steps (1) to (10) described above can be appropriately changed as necessary without departing from the gist or concept of the present invention. For example, in the above-described step, the step (3) is performed in which the punch-side member 13 is lowered and the printed circuit board 17 is pressed by the pressing element 45 to bring the printed circuit board 17 into close contact with the upper surface of the die 55 of the die-side member 15. After that, the step (4) in which the arm unit 21a of the image capturing device 21 is moved by the moving mechanism for the image capturing device to position the CCD camera of the image capturing device 21 above the printed circuit board 17 is performed. Instead of this, the step (3) may be performed after the step (4) is performed first.

  In the steps (3), (8), (9) and (10), the punch side member 13 is lowered or raised. Instead, the punch side member 13 is not lowered or raised. Alternatively, the punch side member 13 may be lowered or raised, and the die side member 15 may be raised or lowered by the die side member moving mechanism. In short, the punch-side member 13 is relatively movable in the direction in which the punch-side member 13 approaches or separates from the die 55 of the die-side member 15, and moves relative to the adjacent direction and is placed on the die 55. It is sufficient that the printed circuit board 17 can be perforated.

  In this case, before the die side member 15 is raised or lowered, the holding of the printed circuit board 17 by the holding portions 23a and 25a of the first holding mechanism 23 and the second holding mechanism 25 performed in the step (1) is released. Keep it. By the way, when another hole is to be drilled in the printed circuit board 17 based on the position of the reference mark or the like of the printed circuit board 17 obtained in the step (5), the above described (6), (8), (9). The process similar to the process of (10) is repeated.

  As described above, in the punching device 11 according to the present embodiment, the vicinity of the reference mark or the like of the printed circuit board 17 to be recognized by the image capturing device 21 is directly pressed by the pressing element 45 to press the printed circuit board 17 to the die side member 15. The die 55 is brought into close contact with the upper surface of the die 55. For this reason, the part provided with the reference mark or the like of the printed circuit board 17 to be recognized by the image capturing device 21 can be reliably brought into close contact with the upper surface of the die 55. As a result, the reference mark or the like of the printed circuit board 17 can be photographed by the CCD camera of the image photographing device 21 in a state close to the state where the upper surface of the printed circuit board 17 is pressed by the stripper 37 during the punching operation. An accurate position equivalent to that at the time of drilling work for 55 can be recognized.

  In addition, the die side member 15 is relatively movable in the direction approaching or separating from the die 55, and is moved relatively in the approaching direction to be placed on the printed circuit board 17 placed on the upper surface of the die 55. Since the pressing element 45 is provided on the punch side member 13 that forms a predetermined hole, the printed board placed on the upper surface of the die 55 by moving the punch side member 13 relatively close to or away from the die 55. The pressing element 45 can be moved closer to or away from the 17. For this reason, a dedicated moving device for moving the pressing element 45 becomes unnecessary, and accordingly, the number of parts can be reduced and the punching device 11 can be downsized.

  Further, since the punch side member 13 is moved under numerical control by the punch side member moving mechanism, the movement amount is controlled with high accuracy. For this reason, the pressing force applied to the printed circuit board 17 by the pressing element 45 can be finely adjusted according to the characteristics of the printed circuit board 17 and the degree of warpage, wrinkles, etc., and pressed moderately. With the pressure applied to the printed circuit board 17 and in close contact with the upper surface of the die 55, the gripping portions 23 a and 25 a that grip the printed circuit board 17 are moved to position the printed circuit board 17 at a predetermined position on the upper surface of the die 55. It can also be combined. As a result, the alignment accuracy can be further improved.

  For improving the alignment accuracy, a method in which the die side member 15 is independently numerically controlled by the die side member moving mechanism and moves upward along the Z-axis direction, or the die side member 15 and the punch side member 13 are The same can be said for the case where the printed circuit board 17 is pressed by the pressing element 45 by a method of moving together under numerical control. Further, since the pressing member 45 is provided on the punch side member 13 so as to be able to move forward and backward in the direction approaching or separating from the upper surface of the die 55, the punch side member 13 is relatively moved in the approaching direction to the printed circuit board 17. When the predetermined hole is drilled, the pressing element 45 is prevented from getting in the way by retreating the pressing element 45 in a direction away from the die 55, and the hole is formed in the printed circuit board 17 by the punching device 11 without any trouble. Can be drilled.

  Further, in the punching device 11 according to this embodiment, the printed circuit board 17 is pressed by the pressing element 45 by the urging force of the compression spring 47 so as to be brought into close contact with the upper surface of the die 55. It is possible to achieve close contact with the upper surface and to retract the pressing element 45 in a direction away from the die 55 with a simple and inexpensive structure. Further, in the punching device 11 according to this embodiment, when the punch side member 13 moves in a direction relatively close to the printed board 17 placed on the upper surface of the die 55, the punch side member 13 moves to the printed board 17. Before the contact, the printed circuit board 17 is pressed by the pressing element 45.

  For this reason, after the printed circuit board 17 is pressed by the pressing element 45 and brought into close contact with the upper surface of the die 55 in advance, a predetermined hole can be formed in the printed circuit board 17 by the punch side member 13. Drilling can be performed appropriately. In addition, before the stripper 37 of the punch side member 13 comes into contact with the printed board 17, the printed board 17 is pressed by the pressing element 45 protruding from the punch side member 13. Therefore, a gap can be formed between the stripper 37 of the punch-side member 13 and the printed board 17 in a state where the printed board 17 is in close contact with the upper surface of the die 55, and the CCD of the image photographing device 21 is formed in the gap. The camera can be positioned and a reference mark or the like on the printed circuit board 17 can be photographed.

  Further, in the punching device 11 according to this embodiment, a pressing element 45 is disposed in the vicinity of the punch 35 in the punch side member 13. For this reason, the printed board 17 is punched by the punch 35 of the punch-side member 13 in a state where the vicinity of the portion where the predetermined hole is drilled is pressed by the pressing element 45 and the printed board 17 is brought into close contact with the upper surface of the die 55. Therefore, the hole can be drilled with high accuracy.

(Second Embodiment)
Next, a second embodiment of the present invention will be described in detail with reference to FIGS. FIG. 7 shows a schematic configuration of a substrate inspection apparatus 61 (which constitutes a “processing object processing apparatus” in the present invention) according to the embodiment. The same or equivalent members as those described in the first embodiment are denoted by the same reference numerals in the following description and FIGS. Also, some of the members that are the same as or equivalent to those described in the first embodiment are not shown in FIGS. In this board inspection apparatus 61, the conductive state of a wiring pattern (not shown) provided on a flexible thin plate-like printed board 63 (which constitutes the “object to be processed” in the present invention) is appropriate. This is an inspection apparatus for inspecting whether the printed circuit board 63 is in electrical continuity by contacting a plurality of inspection probes with the plurality of electrical contacts of the printed circuit board 63.

  The board inspection device 61 holds a printed board 63 on which the printed board 63 is placed, and a printed board 63 placed on the upper surface of the placed board 64 to hold the printed board 63 on the upper surface of the placed table 64. A moving device 19 to be moved to a position and an inspection probe member moving device (not shown) are attached to the inspection probe member moving device, and simultaneously or individually in a direction (vertical direction) perpendicular to the upper surface of the mounting table 64 by driving the inspection probe member moving device. A movable upper inspection probe member 65 (which constitutes a “processing section for performing a predetermined process” and an “inspection probe member” in the present invention), a lower inspection probe member 66, and each device included in the substrate inspection apparatus 61 An inspection apparatus main body 67 having a control section for controlling the inspection and a determination section 67a to be described later, and an upper contact for connecting the inspection apparatus main body 67 and the upper inspection probe member 65. The structure 69, the lower connection structure 71 that connects the inspection apparatus main body 67 and the lower inspection probe member 66, and the position of a predetermined portion of the printed circuit board 63 placed on the upper surface of the placement table 64 with respect to the placement table 64. It comprises an image capturing device 21 to be recognized.

  The upper inspection probe member 65 and the lower inspection probe member 66 are configured to be movable in the vertical direction by being numerically controlled by the inspection probe member moving device. The predetermined part of the printed circuit board 63 refers to a reference mark attached to the printed circuit board 63 or a specific part of the wiring pattern of the printed circuit board 63, and is hereinafter referred to as “reference mark or the like”. One or a plurality of the reference marks and the like are provided at predetermined positions on the printed circuit board 63, and the reference marks and the like are photographed by the image photographing device 21 and the position with respect to the mounting table 64 is recognized. Although not shown, the board inspection device 61 includes a mechanism for controlling each mechanism and operation of each device provided in the board inspection device 61, an operation panel for operating each mechanism and each device, and the like. It has. The control device includes a CPU, a ROM, and a RAM, and various programs such as a program for operating each moving device are stored in the ROM.

  In addition to these devices, the substrate inspection device 61 is provided with an image processing device, a memory for storing various data, and a microcomputer. The microcomputer is a CCD camera of the image photographing device 21. The position of the reference mark or the like of the printed circuit board 63 with respect to the mounting table 64 is obtained by image processing on the image to be photographed, and the moving device 19 operates the support member moving mechanism 28 based on the obtained position of the reference mark or the like. The gripping mechanism support member 27 is moved in the left-right direction in FIG. 7 or in a direction perpendicular to the paper surface in FIG. 7 or rotated in the direction around the axis along the vertical direction to place the printed circuit board 63 on the mounting table. Align to a predetermined position on the upper surface of 64.

  At the time of this alignment, the gripping part 23a of the first gripping mechanism 23 and the gripping part 25a of the second gripping mechanism 25 grip and move only one end side of the printed circuit board 63. Then, the printed circuit board 63 is moved so that both the gripping portions 23a and 25a are always retracted from the mounting table 64 in the direction intersecting the paper surface of FIG. The board inspection apparatus 61 includes a measuring unit including a circuit for measuring detection signals sent from the upper inspection probe 73 of the upper inspection probe member 65 and the lower inspection probe 74 of the lower inspection probe member 66. .

  The measuring section outputs inspection signals to the upper inspection probe 73 and the lower inspection probe 74 via the upper connection structure 69 and its upper connection wiring 69a, and the lower connection structure 71 and the lower connection wiring 71a, respectively. At the same time, a detection signal that returns after passing through the electrical contacts of the printed circuit board 63 is input via the upper inspection probe 73 and the lower inspection probe 74. In addition, various data necessary for conducting a continuity test, such as the detection signal, are stored in a rewritable manner in the RAM of the control device provided in the board inspection device 61. The CPU of the control device determines the state of electrical continuity from the measurement results measured by the measurement unit based on various programs and data stored in the ROM and RAM of the device. The CPU and the measurement unit constitute a determination unit 67a of the inspection apparatus main body 67.

  The upper inspection probe member 65, the lower inspection probe member 66, and the mounting table 64 are exchanged according to the specifications of the printed circuit board 63 to be inspected. The upper inspection probe member 65 includes three rectangular plates of an upper base plate 75a, an upper first plate 76a, and an upper second plate 77a arranged in parallel, and a plurality of upper inspection probes 73. Then, a plurality of through holes 81 and 83 (see FIG. 11) are formed in positions where the upper first plate 76a and the upper second plate 77a face each other, and the plurality of through holes 81 and 83 are respectively Both end portions of the plurality of upper inspection probes 73 are inserted.

  The arrangement of the plurality of through-holes 81 and the plurality of through-holes 83 is the same as the arrangement of the electrical contacts formed on the upper surface side of the printed circuit board 63. Therefore, the arrangement of the plurality of upper inspection probes 73 is also the same. The arrangement of the electrical contacts is the same. Further, the lower ends of the upper wire cables 85a made of flexible nichrome wires are electrically connected to the upper ends of the plurality of upper inspection probes 73, and the upper ends of the upper wire cables 85a are connected to the upper connection structure 69. The upper connection wiring 69 a of the upper connection structure 69 is electrically connected to the inspection apparatus main body 67.

  Further, four through holes 78 (see FIG. 11) are formed near the center of the upper first plate 76a so as to surround a part of the upper inspection probe 73 disposed at the center of the upper first plate 76a. The upper part of the cylindrical spring accommodating body 87 whose upper end is closed and whose lower end is opened is fitted and fixed in the through hole 78. The lower ends of the four spring storage bodies 87 are joined to the upper surface of the upper second plate 77a, and the four spring storage bodies 87 are bridged between the upper first plate 76a and the upper second plate 77a. Has been fixed. A through hole 89 (see FIG. 11) having an inner diameter smaller than the inner diameter of the spring housing body 87 is coaxial with the axial center of the spring housing body 87 at the portion of the upper second plate 77 a to which the lower end of the spring housing body 87 is joined. It is drilled at the position.

  A cylindrical pressing element 45 having a flange 45a (see FIG. 11) formed in the middle of the upper end in the longitudinal direction is inserted into the through-hole 89, and the upper end surface of the flange 45a is a spring housing. The lower end surface of the flange 45 a is pressed against the upper opening of the through hole 89 by being pressed by the lower end surface of the compression spring 47 accommodated in the 87. Further, the through hole 89 is formed to have a size slightly larger than the outer diameter of the portion of the pressing element 45 below the flange 45a. As a result, the compression spring 47 is interposed between the upper end in the spring housing 87 and the upper end surface of the flange 45a of the pressing element 45 in a compressed state.

  As a result, the pressing element 45 is urged by the compression spring 47 so as to advance toward the mounting table 64, and the pressing element 45 moves forward and backward in a direction approaching or separating from the mounting table 64. Projected. Then, before the compression spring 47 is compressed by the upper inspection probe member 65 being lowered and the pressing element 45 pressing the printed circuit board 63, the pressing element 45 protrudes downward from the upper inspection probe 73. Thus, before the upper inspection probe member 65 is lowered and the lower end of the upper inspection probe 73 is brought into contact with the printed circuit board 63, the presser 45 is first contacted to press the printed circuit board 63. The pressing element 45 is positioned with respect to the inspection probe member 65. The pressing element 45 is disposed in the vicinity of the plurality of upper inspection probes 73 and between the plurality of upper inspection probes 73.

  The upper base plate 75a is formed in a frame shape having a substantially rectangular through hole 91 formed in the center thereof, and the upper first plate 76a is formed in a plate that is thinner and smaller than the upper base plate 75a. The four corners of the upper first plate 76a are fixed to the lower surface of the upper base plate 75a via the four upper first struts 93a. The upper second plate 77a is formed in a plate that is substantially the same thickness as the upper first plate 76a and is smaller than the upper first plate 76a, and has four corners on the lower surface of the upper first plate 76a via four upper second columns 95a. Is fixed.

  The four upper first struts 93a have male screw portions (not shown) formed at the upper ends thereof screwed into female screw portions (not shown) formed on the upper base plate 75a, respectively. The upper first plate 76a is screwed to a female screw portion (not shown) formed at the lower ends of the four upper first struts 93a with bolts (not shown). The four upper second struts 95a have male screw portions (not shown) formed at their upper ends screwed into female screw portions (not shown) formed on the upper first plate 76a, respectively. The upper second plate 77a is screwed to a female screw portion (not shown) formed at the lower ends of the four upper second support columns 95a by bolts (not shown).

  As shown in FIG. 11, the plurality of upper inspection probes 73 are composed of a probe portion 73a made of a thin round bar-like tungsten material and an insulating tube 73b that covers and protects the longitudinal center portion of the probe portion 73a. Yes. And the upper end part of the probe part 73a penetrates the through-hole of the upper side first plate 76a, protrudes toward the upper side base plate 75a from the upper side first plate 76a, and the lower end part of the probe part 73a is the upper side second plate 77a. It penetrates the through hole and protrudes downward from the upper second plate 77a. For this reason, the insulating tube 73b is disposed so as to be sandwiched between the upper first plate 76a and the upper second plate 77a.

  Further, the protruding length of the upper end portion of the probe portion 73a protruding upward from the upper surface of the upper first plate 76a is longer than the lower end portion of the probe portion 73a protruding downward from the lower surface of the upper second plate 77a. It is considerably longer than the length. The protruding end of the lower end portion of the probe portion 73a comes into contact with the electrical contact on the upper surface side of the printed circuit board 63 due to the downward movement of the upper inspection probe member 65 in the vertical direction. The lower end portion of the upper wire cable 85a is bound to the upper end portion of the probe portion 73a protruding from the upper surface of the upper first plate 76a.

  The number of the upper inspection probe 73, the upper wire cable 85a, and the upper connection wiring 69a of the upper connection structure 69 is essentially the same as the number of electrical contacts on the upper surface side of the printed circuit board 63 to be inspected. In FIG. 7 to FIG. 10, for the convenience of drawing, it is drawn with a considerably smaller number. When the upper inspection probe 73 comes into contact with the electrical contact on the upper surface side of the printed circuit board 63, current is passed between the upper inspection probes 73, and whether or not the printed circuit board 63 is properly conducted depending on the magnitude of the electrical resistance value. Is determined. In this case, the detection signal is transmitted from the upper inspection probe 73 through the upper connection structure 69 to the determination unit 67a in the inspection apparatus main body 67, and the determination unit 67a determines the state of electrical continuity of the printed circuit board 63. The

  Specifically, an inspection determination threshold value is set in advance based on the electrical resistance value of the non-defective printed circuit board 63, and the conduction state of the inspected printed circuit board 63 is determined by the ratio of the detected electrical resistance value to the inspection determination threshold value. A pass / fail decision is made. That is, when the inspection is an inspection of whether or not continuity is good, if the detected electric resistance value is less than a predetermined ratio with respect to the inspection determination threshold value, it is determined as a non-defective product, and if it is equal to or higher than the predetermined ratio, Judge as good. Further, when the inspection is an inspection of whether or not the insulation is properly conducted without conducting, if the detected electric resistance value is equal to or greater than a predetermined ratio with respect to the inspection determination threshold value, it is determined as a non-defective product. If it is less than the ratio, it is determined as a defective product. Such a determination method is similarly performed for a continuity test by the lower test probe member 66 described later. In addition, various electrical measurements, for example, an insulation test and a capacitance test are also possible.

  The lower inspection probe member 66 is basically similar in structure to the above-described upper inspection probe member 65 in which the spring housing 87, the pressing element 45, and the compression spring 47 are removed and the vertical direction is reversed. It has become. That is, the upper base plate 75a, the upper first plate 76a, the upper second plate 77a, the upper first column 93a, the upper second column 95a, the upper inspection probe 73, and the upper wire cable 85a of the upper inspection probe member 65 are subjected to the lower inspection. The lower base plate 75b, the lower first plate 76b, the lower second plate 77b, the lower first support post 93b, the lower second support post 95b, the lower inspection probe 74, and the lower wire cable 85b of the probe member 66, respectively. Correspond.

  The lower inspection probe 74 is electrically connected to the inspection apparatus main body 67 via the lower wire cable 85 b and the lower connection structure 71. The number of the lower inspection probe 74, the lower wire cable 85b, and the lower connection wiring 71a of the lower connection structure 71 is essentially the same as the number of electrical contacts on the lower surface side of the printed circuit board 63 to be inspected. However, in FIG. 7 to FIG. 10, for the convenience of drawing, it is drawn with a considerably smaller number.

  Further, the mounting table 64 is provided with through holes 64a (see FIG. 11) at positions corresponding to positions where the lower inspection probes 74 of the lower inspection probe member 66 are disposed. When the upper end of the lower inspection probe 74 is inserted through the hole 64a and the upper end of each lower inspection probe 74 comes into contact with the electrical contact on the lower surface side of the printed circuit board 63, the lower inspection probes 74 are energized. Whether or not the printed circuit board 63 is properly conducted is determined based on the magnitude of the electrical resistance value. Note that the number of electrical contacts on the lower surface side of the printed circuit board 63 and the number of electrical contacts on the upper surface side of the printed circuit board 63 may be the same or different.

In such a configuration, when the electrical continuity state of the printed circuit board 63 is inspected using the substrate inspection apparatus 61, the continuity inspection work is performed in the order of the following steps (1) to (10). .
(1) First, the distance between the gripping part 23a of the first gripping mechanism 23 and the gripping part 25a of the second gripping mechanism 25 is made substantially the same as the distance between both ends of the printed circuit board 63. After gripping the vicinity of the corners at both ends of the printed circuit board 63 with 25a, the gap between the first gripping mechanism 23 and the second gripping mechanism 25 is widened in the gripped state so that the printed circuit board 63 is not waved while being gripped. Like that.

(2) Next, in a state where the printed circuit board 63 is gripped by the gripping portions 23a, 25a, the support member moving mechanism 28 is operated to move the first gripping mechanism 23 and the second gripping mechanism 25, and the upper inspection probe member 65 is moved. The printed circuit board 63 is aligned with respect to the mounting table 64 so that the reference marks and the like of the printed circuit board 63 are positioned below the plurality of upper inspection probes 73.
(3) Next, the upper inspection probe member 65 is moved downward in the vertical direction by the inspection probe member moving device, and the vicinity of the reference mark or the like on the printed circuit board 63 is directly pressed by the lower ends of the four pressing elements 45. FIG. Further, the warp, wrinkles, etc. existing on the printed circuit board 63 as indicated by W ′ in FIG. Close.

At this time, the printed circuit board 63 is pressed by the pressing element 45 by the urging force of the compression spring 47 and brought into close contact with the mounting table 64.
(4) Next, with the photographing device moving mechanism equivalent to the photographing device moving mechanism of the first embodiment described above in a state where the printed board 63 is brought into close contact with the upper surface of the mounting table 64 by being pressed by the pressing element 45. The arm portion 21 a of the image capturing device 21 is moved, and the CCD camera of the image capturing device 21 is positioned directly above the reference mark or the like on the printed board 63.
(5) Next, the reference mark or the like of the printed circuit board 63 is photographed by the CCD camera, and the photographed image is subjected to image processing to obtain the position of the reference mark or the like of the printed circuit board 63 with respect to the mounting table 64 by calculation.

(6) Based on the position of the reference mark or the like obtained in the step (5), the moving device 19 operates the support member moving mechanism 28 and the second holding mechanism 23 holding the printed circuit board 63 and the second holding mechanism 23. The gripping portions 23 a and 25 a with the gripping mechanism 25 are appropriately retracted in the direction intersecting the paper surface of FIG. 7, and the printed circuit board 63 is positioned at a predetermined position on the upper surface of the mounting table 64.
At this time, the printed circuit board 63 is provided with at least two reference marks and the like, the positions of these reference marks and the like with respect to the mounting table 64 are obtained by calculation, and based on the obtained positions of the reference marks and the like, With respect to a normal position (predetermined position) where the printed circuit board 63 is originally positioned with respect to the mounting table 64, an angle of inclination and an amount of deviation are obtained by calculation, and from these calculated values obtained. The printed circuit board 63 is aligned with a predetermined position with respect to the mounting table 64.

  In order to increase the accuracy of positioning the printed circuit board 63 with respect to the mounting table 64, the gripping portions 23 a and 25 a that grip the printed circuit board 63 are moved to temporarily position the printed circuit board 63 at a predetermined position on the mounting table 64. After that, again, the CCD camera of the image capturing device 21 captures the reference mark on the printed circuit board 63 to obtain the position of the reference mark and the like, and the printed circuit board 63 is not yet positioned at a predetermined position on the mounting table 64. In this case, the grip portions 23a and 25a that grip the printed circuit board 63 may be moved again so as to be positioned at a predetermined position. Such a movement of the gripping portions 23a and 25a may be performed a plurality of times to further improve the accuracy of alignment of the printed circuit board 63 with respect to the mounting table 64.

(7) Next, the arm portion 21a of the image photographing device 21 is moved outward from above the printed circuit board 63 placed on the placement table 64 so as not to obstruct the continuity inspection work by the upper inspection probe 73. .
(8) Next, the upper inspection probe member 65 is further lowered in the vertical direction by the inspection probe member moving device, and the lower ends of the plurality of upper inspection probes 73 are placed on the upper surface side of the printed circuit board 63 as shown in FIG. Abut on electrical contact. In this state, the conductive state of the printed circuit board 63 is inspected.

At this time, the four pressing elements 45 do not descend in contact with the printed circuit board 63, and the compression spring 47 is further compressed so that the upper end of the pressing element 45 approaches the upper surface in the spring housing 87. Then, the printed circuit board 63 is pressed against the upper surface of the mounting table 64 by the pressing element 45 to which the compression load of the compression spring 47 is applied.
(9) Next, the lower inspection probe member 66 is raised in the vertical direction by the inspection probe member moving device, and the upper ends of the plurality of lower inspection probes 74 of the lower inspection probe member 66 are passed through the through holes 64a of the mounting table 64. Is inserted into contact with the electrical contact on the lower surface of the printed circuit board 63 (see FIG. 10). In this state, the conductive state of the printed circuit board 63 is inspected.

At this time, the upper inspection probe 73 and the lower inspection probe 74 are brought into contact with each electrical contact between the upper surface side and the lower surface side of the printed circuit board 63, so that the plurality of upper inspection probes 73 and the plurality of upper inspection probes are contacted. The same number of lower inspection probes 74 corresponding to the probes 73 are electrically connected to each other through the printed circuit board 63, and the inspection of the conductive state is also performed.
(10) Next, the inspection probe member moving device raises the upper inspection probe member 65 in the vertical direction and lowers the lower inspection probe member 66 in the vertical direction to the initial position (position shown in FIG. 7).
The continuity inspection work for the printed circuit board 63 is thus completed.

  The order and contents of the continuity inspection work steps (1) to (10) described above can be appropriately changed as necessary without departing from the gist or concept of the present invention. For example, in the process described above, the process of lowering the upper inspection probe member 65 and pressing the printed circuit board 63 with the pressing element 45 to bring the printed circuit board 63 into close contact with the upper surface of the mounting table 64 (the process (3)). After the execution, the step of moving the arm portion 21a of the image photographing device 21 by the photographing device moving mechanism to position the CCD camera of the image photographing device 21 above the printed circuit board 63 (the step (4)) is performed. However, instead of this, the step (3) may be performed after the step (4) is performed first.

  In the above-described process, the upper inspection probe member 65 is lowered and the upper inspection probe 73 is brought into contact with the electrical contact on the upper surface side of the printed circuit board 63 to inspect the conduction state of the printed circuit board 63 ((( After performing step 8), the lower inspection probe member 66 is raised and the lower inspection probe 74 is brought into contact with the electrical contact on the lower surface side of the printed circuit board 63 to inspect the conductive state of the printed circuit board 63. Although the step to be performed (the step (9)) is performed, the following may be performed instead.

  That is, the lower inspection probe member 66 is raised to bring the lower inspection probe 74 into contact with the electrical contact on the lower surface side of the printed circuit board 63, and then the upper inspection probe member 65 is moved down to move the upper surface side of the printed circuit board 63. The upper inspection probe 73 and the lower inspection probe 74 are moved by bringing the upper inspection probe 73 into contact with the electrical contact of the upper inspection probe 73 or lowering the upper inspection probe member 65 and raising the lower inspection probe member 66 simultaneously. You may make it contact | abut to the electrical contact of the upper surface side of the printed circuit board 63, and a lower surface side, respectively, and you may make it test | inspect the continuity state of the printed circuit board 63. FIG.

  In the case where the conduction state of other electrical contacts on the printed circuit board 63 is inspected based on the position of the reference mark or the like of the printed circuit board 63 obtained in the step (5), the above-described (6) (8) (9) By repeating the same process as the process of (10), the next inspection position on the printed circuit board 63 is moved to a predetermined position on the upper surface of the mounting table 64, and the conduction state of the other electrical contacts is inspected. I do.

  As described above, in the board inspection apparatus 61 according to the present embodiment, the vicinity of the reference mark or the like of the printed board 63 to be recognized by the image capturing apparatus 21 is directly pressed by the pressing element 45 to place the printed board 63 on the mounting table 64. To be in close contact with. For this reason, the part provided with the reference mark or the like of the printed circuit board 63 to be recognized by the image capturing device 21 can be reliably brought into close contact with the upper surface of the mounting table 64. As a result, the reference mark or the like of the printed circuit board 63 is photographed by the CCD camera of the image photographing device 21 in a state close to the state where the upper surface of the printed circuit board 63 is pressed by the upper inspection probe 73 of the upper inspection probe member 65 during the continuity inspection work. Therefore, it is possible to recognize an accurate position equivalent to that in the continuity inspection with respect to the mounting table 64 of the printed circuit board 63.

  Further, the continuity test of the electrical contact on the upper surface side of the printed circuit board 63 which is movable in the direction approaching or separating from the mounting table 64 and is moved in the approaching direction and placed on the upper surface of the mounting table 64. Since the presser 45 is provided on the upper inspection probe member 65 that performs the above operation, the upper inspection probe member 65 is moved closer to or away from the mounting table 64, so that the printed circuit board 63 mounted on the upper surface of the mounting table 64 is attached. The pressing element 45 can be moved close to or away from the pressing element 45. For this reason, a dedicated moving device for moving the pressing element 45 becomes unnecessary, and accordingly, the number of parts can be reduced, and the board inspection device 61 can be downsized.

  Further, since the upper inspection probe member 65 is moved under numerical control by the inspection probe member moving device, the amount of movement thereof is controlled with high accuracy. For this reason, the pressing force applied to the printed circuit board 63 by the pressing element 45 can be finely adjusted according to the characteristics of the printed circuit board 63, the degree of warpage, wrinkles, etc., and pressed appropriately. In a state where pressure is applied to the printed circuit board 63 and in close contact with the upper surface of the mounting table 64, the grip portions 23 a and 25 a that grip the printed circuit board 63 are moved to move the printed circuit board 63 to a predetermined position on the upper surface of the mounting table 64. Can also be aligned. As a result, the alignment accuracy can be further improved.

  Further, since the presser 45 is provided on the upper inspection probe member 65 so as to be able to move forward and backward in the direction approaching or separating from the upper surface of the mounting table 64, the upper inspection probe member 65 is lowered and the electrical contact of the printed circuit board 63. When conducting the continuity test, the pusher 45 is retracted in a direction away from the mounting table 64 to prevent the pusher 45 from getting in the way, and the continuity test of the electrical contacts of the printed circuit board 63 can be performed without hindrance. It can be carried out. Further, in the board inspection apparatus 61 according to this embodiment, the printed circuit board 63 is pressed by the pressing element 45 by the urging force of the compression spring 47 so as to be brought into close contact with the upper surface of the mounting table 64, so that the printed circuit board 63 is securely mounted. It is possible to achieve close contact with the upper surface of the mounting table 64 and to retract the pressing element 45 in a direction away from the mounting table 64 with a simple and inexpensive structure.

  Further, in the substrate inspection apparatus 61 according to this embodiment, when the upper inspection probe member 65 moves in the direction approaching the printed circuit board 63 placed on the upper surface of the mounting table 64, a plurality of upper sides of the upper inspection probe member 65 are moved. Before the inspection probe 73 comes into contact with the printed circuit board 63, the printed circuit board 63 is pressed by the pressing element 45. For this reason, after the printed circuit board 63 is pressed by the pressing element 45 and brought into close contact with the upper surface of the mounting table 64 in advance, the continuity inspection of the electrical contacts on the upper surface side of the printed circuit board 63 can be performed by the plurality of upper inspection probes 73. Therefore, the continuity test can be appropriately performed.

  In addition, the printed circuit board 63 is pressed by the pressing element 45 protruding from the upper inspection probe member 65 before the plurality of upper inspection probes 73 contact the printed circuit board 63. A gap can be formed between the lower ends of the plurality of upper inspection probes 73 and the printed circuit board 63 in a state where it is pressed and brought into close contact with the upper surface of the mounting table 64, and the CCD camera of the image capturing device 21 is formed in the gap. The fiducial mark or the like on the printed circuit board 63 can be photographed.

  Further, in the substrate inspection apparatus 61 according to this embodiment, the pressing element 45 is disposed on the upper inspection probe member 65, and is pressed in the vicinity of the plurality of upper inspection probes 73 and between the plurality of upper inspection probes 73. A child 45 is provided. For this reason, a plurality of upper inspection probes 73 are arranged in a state where the vicinity of the portion where the upper inspection probe 73 comes into contact and the continuity inspection is performed is pressed by the pressing element 45 so that the printed circuit board 63 is brought into close contact with the upper surface of the mounting table 64. Since the printed circuit board 63 can be brought into contact with the printed circuit board 63, the electrical contact on the upper surface side of the printed circuit board 63 can be accurately inspected.

  In addition, 1st Embodiment and 2nd Embodiment which were mentioned above are examples for demonstrating this invention, and this invention is not limited to the said embodiment. The present invention can be changed as appropriate without departing from the spirit or concept of the invention which can be read from the entirety of the claims and specification, and the perforation apparatus and the substrate inspection apparatus after such a change are also included in the present invention. It is included in the technical scope. For example, in each of the embodiments described above, an example in which four pressing elements are provided has been described. However, the present invention is not limited to such a configuration, and one to three or five or more pressing elements may be provided. Good.

  If only a small number of four or less pressing elements are provided, the parts that are likely to be warped or wrinkled tend to be the same when the printed circuit board specifications are the same. The presser is disposed on the punch-side member of the perforation apparatus or the inspection probe member of the substrate inspection apparatus so that it can be positioned at the site. On the other hand, when a large number of pressing elements are provided, the pressing elements are arranged on the punch side member or the inspection probe member so that the large number of pressing elements are arranged in a lattice pattern at a predetermined interval. Disperse over a wide area of the printed circuit board so as to make uniform contact.

  In each of the above-described embodiments, an example of a printed circuit board is shown as an object to be processed. Instead, the object to be processed may be made of a flexible thin plate-like resin sheet or paper. In each of the above-described embodiments, examples of the perforation apparatus and the substrate inspection apparatus are shown as the processing object processing apparatus. Instead, the processing object processing apparatus is a predetermined part on the surface of the processing object. It may be composed of a printing device for printing characters and designs. In the punching device 11 according to the first embodiment described above, the four compression springs 41 are arranged at equal angular intervals of 90 degrees so as to surround the punch 35, and the compression springs 47 are further surrounded by these compression springs 41. However, instead of this, the presser 45 and the compression spring 47 may be provided between the compression springs 41, respectively.

  Then, the presser 45 and the compression spring 47 and the compression spring 41 surround the punch 35 so that the presser 45 and the compression spring 47 are closer to the punch 35. Accordingly, the printed board 17 can be brought into close contact with the upper surface of the die 55 by pressing the vicinity of the portion where the hole is formed by the punch 35 with the pressing element 45, and in this state, the punch 35 of the punch-side member 13. Since the printed circuit board 17 can be drilled, the holes can be drilled with higher accuracy.

  Moreover, in the board | substrate inspection apparatus 61 by 2nd Embodiment mentioned above, when arrange | positioning the presser 45 to the upper test | inspection probe member 65, it is in the vicinity of several upper test | inspection probes 73, and between several upper test | inspection probes 73. However, instead of this, the presser 45 is arranged not in the vicinity of the plurality of upper inspection probes 73 but in the vicinity of the side of the inspection probe group composed of the plurality of upper inspection probes 73. You may make it install. Even in this case, a plurality of upper inspection probes 73 are brought into contact with the upper surface of the mounting table 64 by pressing the vicinity of the portion where the upper inspection probe 73 comes into contact and the continuity inspection is performed by the pressing element 45. Can be brought into contact with the printed circuit board 63, so that the continuity test of the electrical contacts on the upper surface side of the printed circuit board 63 can be performed with high accuracy.

  Further, in the substrate inspection apparatus 61 according to the second embodiment described above, the upper inspection probe member 65 is moved in the vertical direction by numerical control by the inspection probe member moving device. 65 may be moved without moving, or the upper inspection probe member 65 may be moved and the mounting table 64 may be numerically controlled by the inspection probe member moving device to move in the vertical direction. The point is that the upper inspection probe member 65 is relatively movable in the direction in which the upper inspection probe member 65 approaches or separates from the mounting table 64, and the print placed on the mounting table 64 by moving relatively in the approaching direction. An electrical continuity test of the substrate 63 may be performed. In this case, the height position in the vertical direction of the image capturing device 21 is appropriately set in consideration of the movement range of the mounting table 64 and the upper inspection probe member 65.

It is a schematic block diagram which shows the state which looked at the punching apparatus which concerns on 1st Embodiment of this invention from diagonally forward. It is sectional drawing which shows the state which looked at the punching apparatus with which the printed circuit board was mounted from the front. It is sectional drawing which shows the state which looked at the punching device when pressing the printed circuit board with a presser from the front. It is sectional drawing which shows the state which looked at the punching apparatus when pressing the printed circuit board with a stripper from the front. It is sectional drawing which shows the state which looked at the punching apparatus when punching a printed circuit board with the punch from the front. It is sectional drawing which expands and shows a part of left side in FIG. It is sectional drawing which shows schematic structure of the state which looked at the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention from the front. It is sectional drawing which shows the state which looked at the principal part of the board | substrate inspection apparatus when pressing the printed circuit board with a presser from the front. It is sectional drawing which shows the state which looked at the principal part of the board | substrate inspection apparatus when an upper side inspection probe was made to contact | abut to a printed circuit board from the front. It is sectional drawing which shows the state which looked at the principal part of the board | substrate inspection apparatus when a lower inspection probe was made to contact | abut to a printed circuit board from the front. It is sectional drawing which expands and shows a part of the upper left side in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Perforation apparatus (processed object processing apparatus), 13 ... Punch side member (processing part), 15 ... Die side member (mounting table), 17 ... Printed circuit board (processed object), 19 ... Moving apparatus, 21 ... Image Imaging device, 35 ... punch, 45 ... pressor, 47 ... compression spring (biasing means), 61 ... substrate inspection device (processing object processing device), 63 ... printed circuit board (processing object), 64 ... mounting table, 65: Upper inspection probe side member (processing unit, inspection probe side member), 73: Upper inspection probe (inspection probe).

Claims (6)

A mounting table for mounting a flexible thin plate-shaped workpiece;
It is relatively movable in the direction approaching or separating from the mounting table, and is moved relatively in the approaching direction, and performs a predetermined process on the workpiece placed on the mounting table. A processing unit;
An image capturing device for recognizing the position of the predetermined part of the workpiece placed on the mounting table with respect to the mounting table;
An object to be processed comprising: a moving device configured to move the object to be processed to a predetermined position on the mounting table based on a position of the predetermined part of the object to be processed recognized by the image capturing device with respect to the mounting table; A processing device comprising:
When recognizing the position of a predetermined part of the object to be processed by the image photographing device, a pressing element that presses the predetermined part of the object to be processed and causes the object to be in close contact with the mounting table is A workpiece processing apparatus provided in the processing section so as to be movable forward and backward with respect to the mounting table.   The workpiece processing apparatus according to claim 1, wherein the processing unit is moved by being controlled numerically in a direction of approaching or separating from the mounting table.   The pressing element is urged by the urging means so as to advance toward the mounting table, and the workpiece is pressed by the pressing element by the urging force of the urging means so as to be in close contact with the mounting table. The processed object processing apparatus according to claim 1 or claim 2.   When the processing unit relatively moves in a direction approaching the workpiece to be placed on the mounting table, the workpiece is moved by the pressing element before the processing portion comes into contact with the workpiece. The processing object processing apparatus according to any one of claims 1 to 3, wherein the pressing element is positioned with respect to the processing unit so as to press the button.   The processing object processing apparatus includes a punching device that punches a predetermined hole in the processing object placed on the mounting table, the processing unit includes a punch side member of the punching device, and the mounting table includes The workpiece processing apparatus according to claim 1, comprising a die side member of the punching apparatus.   The object to be processed is a printed circuit board, and the object processing apparatus has a plurality of inspection probes brought into contact with a plurality of electrical contacts of the printed circuit board placed on the mounting table. 5. The object to be processed according to claim 1, comprising: a substrate inspection apparatus that inspects a state of electrical continuity, wherein the processing unit includes an inspection probe side member including the plurality of inspection probes. Processing equipment.

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