TWI279303B - Processing apparatus, method for producing printed circuit board, and processing program - Google Patents

Processing apparatus, method for producing printed circuit board, and processing program Download PDF

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Publication number
TWI279303B
TWI279303B TW094117276A TW94117276A TWI279303B TW I279303 B TWI279303 B TW I279303B TW 094117276 A TW094117276 A TW 094117276A TW 94117276 A TW94117276 A TW 94117276A TW I279303 B TWI279303 B TW I279303B
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TW
Taiwan
Prior art keywords
processing
processed
processing units
processing unit
circuit board
Prior art date
Application number
TW094117276A
Other languages
Chinese (zh)
Other versions
TW200607626A (en
Inventor
Toru Ishii
Takuya Hara
Takeshi Ito
Keiichiro Sasamine
Original Assignee
Yamaha Fine Tech Co Ltd
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Priority claimed from JP2004162633A external-priority patent/JP4514519B2/en
Priority claimed from JP2004162632A external-priority patent/JP4544911B2/en
Application filed by Yamaha Fine Tech Co Ltd filed Critical Yamaha Fine Tech Co Ltd
Publication of TW200607626A publication Critical patent/TW200607626A/en
Application granted granted Critical
Publication of TWI279303B publication Critical patent/TWI279303B/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005Punching of holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B26F1/04Perforating by punching, e.g. with relatively-reciprocating punch and bed with selectively-operable punches

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  • Engineering & Computer Science (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)

Abstract

To provide a processing apparatus and processing method for effectively processing predetermined treatments to a work which has a plurality of portions to be processed. Perforation apparatus M includes: a base 10 which is provided with holding pawls 35a for fixing a work which has a plurality of sections to be perforated; processing sections 22a and 22b which are movably provided on the base; an input section 36 for inputting information indicating process to be performed to the processed portion; a movement control section 40. The movement control section 40 determines an optimum movement path for each processing sections 22a in accordance with the information inputted to the input section 36 and carries out the perforation with driving to move the processing sections 22a in response to the determination. The processing sections 22a include a die 24 having a hole section 24a and a punch 27a. Further, CCD cameras 30, 30a are provided for detecting positions of the sections to be perforated.

Description

1279303 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種用以對設置有複數個被處理部之薄片 狀或板狀之工件實施穿孔、剪切等處理的處理裝置、印刷 基板之生產方法以及處理程式。 本申請基於2謝年5月31日提出中請之特襲G4]62632 號以及於同日提出申請之特願2004 權,且於此引用其内容。 【先前技術】 •162633號而主張優先1279303 IX. EMBODIMENT OF THE INVENTION The present invention relates to a processing apparatus and a printed circuit board for performing a process of punching, shearing, etc. on a sheet-like or plate-shaped workpiece provided with a plurality of processed portions. Production methods and processing programs. This application is based on the right of the special attack on G31]62632, which was filed on May 31, and the right to apply for the application on the same day. [Prior Art] • No. 162633 and advocates priority

進行升降且可插入模具之孔部的衝頭。並且’於藉由上述 穿孔裝置而穿孔之工件,形成有表示打穿位置之被穿孔 部,以使該被穿孔部與孔部相一致之狀態,使衝頭向孔部 先前,於對可擾性基板等薄片狀工件打穿特定形狀之孔 之情形時,使用-種設置有金屬模具之穿孔裝置,該金屬 模具含有於上面穿設有孔部之模具’以及可相對於該模具 方向下降’藉此對X件實行穿孔。如上所述之穿孔裝置於 例如日本專利特許第3204236號公報中有所揭示。 、 然而,於上述先前之穿孔裝置中,因僅設置有一個金屬 杈具,故而於形成有多個被穿孔部於工件之情形時,存在 穿孔需較長時間之問題。又,亦開發有一種穿孔裝置,其 設置有複數個金屬模具部,可對複數個被穿孔部同時實ς 穿孔。然而,先前之此種穿孔裝置,其構成為對以固定間 隔配置有複數個被穿孔部且排列形成有同一圖案之工件實 行穿孔,故而存有無法對不規則地排列複數個被穿孔部而 99717-950331.doc 1279303 形成之工件實行穿孔的問題。 【發明内容】 本發明係鑒於上述問題而開發者,其目的在於提供一種 可對形成有複數個被處理部之工件高效地實施特定之處理 的處理裝置、印刷基板之生產方法以及處理程式。 為達成上述目的,本發明之處理裝置於構造上之特徵在 =,其含有··基台,其設置有用以固定具有複數個被處理 部之薄片狀或板狀之工件的固定部;複數個處理部,其以 可移動之方式而設置於基台;輸入裝置,其用以輸入複數 個被處理部之相關處理資訊;以及移動控制裝置,其根據 輸入至輸入裝置之複數個被處理部之相關處理資訊,算出 後數個處理部各自 <最適之移動路徑,並且對應於上述算 出結果Μ吏複數個處理部各M蜀立移動並且對工件之被處 理部實施處理。 於以上述方式而構成之處理裝置中,藉由固定部固定工 件,使複數個處理部相對於該卫件各自獨立地移動,並且 藉由各處理部分別對工件之特定被處理部實施處理。又, 此:夺’根據於工件所設置之複數個被處理部之相關處理資 #出八私動路徑,以使各處理部對被處理部實施處理而 移動之路徑為最佳。藉此’可對工件實施高效之處理,實 現鬲速且高精度之處理。 作為此情形之處理’較好的是,相對於固定狀態之工件 而言’使處理部移動並且對工件實施若干處理,例如,可 對可擾性基板實行穿孔、導通檢查以及其他加工等處理。 99717-950331.doc 1279303 於實行穿孔處理之情形時 M &有衝頭與模具之金屬模且 :成叫於實施導通檢查之處理之情形時,以二檢 一用之檢查治具構成處理部。 二於工件所設置之複數個被處理部,並非限定 1 寺固疋間隔之方式規則地排列者,亦可不規則地設置有複 數個。於本發明之處理裝置中 刻介 τ即使被處理部不規則地排 幻,亦可根據各被處理部之相關處 , ^ ^ ^ ^ ^ 貝讯,异出各處理部 移動路徑’可對應於其計算結果,實行適當處理 :使各處理部移動。又’移動控制裝置所算出之最適之移 動路徑可以各種條件為基準而求得。例如可使用各處理部 =被,理部實行處理所需要之時間’各處理部對被處理部 Ρ處理時之路徑長度,以及藉由各處理部之被處理部之 處理數等’以各處理部之處理為均—之情形作為最適 動路徑而求得。 又,本發明之處理裝置之其他構造上的特徵在於,於處 理部之附近設置與處理部一同移動之位置檢測裝置,依據 位置檢測裝置所檢測之被處理部之位置,處理部進行移動 繼而對工件實施處理。作為此情形之位置檢測裝置,可使 用攝影機或感測器等。藉此’於藉由位置檢測裝置正確地 檢測被處理部之位置之後,可實行藉由處理部之處理。因 此’於被處理部與處理部實際實施處理之部分之間不會產 生位置偏移,從而可實現高精度之處理。丨 " 又’本發明之處理裝置之$而其他於構造上的特徵在 於’介於沿移動方向延伸而形成之縱框狀安裝構件,將處 99717-950331.doc 1279303 , 理邛安凌於基台,並且處理部設置於安裝構件之中央部。 ·#此’處理部安裝於以可移動之方式設置於基台的安装構 m構件之兩側部分會沿上述處理部之移動方向的兩 側延伸。因該安裝構件之兩侧部分會作為振動防止用之突 起部而發揮作用,故而於使處理部與安裝構件一同移動對 • I件實施特定處理之情形時,於處理部不易產生振動。因 此,可對工件實行高精度之處理。 . 又,本發明之處理裝置之進而其他構造上的特徵在於, 籲力複數個處理部或分別安裝有複數個處理部而相對於基台 移動之部分’設置用以檢測是否相互接近之接近檢測裝 置,倘若接近檢測裝置檢測出處理部之間相互接近,則藉 由移動控制裝置之控制而阻止處理部之間進一步接近。^ 此,可防止處理部之間或支持處理部之構件之間產生衝突 - 而引起破損,或相互幹涉而降低處理之精度。 - 又,本發明之處理裝置之進而其他構造上的特徵在於, 冑理部以含有衝頭與模具之金屬模具而構成,支持金屬模 攀*之支,構件以金屬模具為中心自不同之複數個方向進行 支持。藉此,固定工件於具有孔部之模具與衝頭之間,使 模具與衝頭相互接近,將衝頭插入孔部,藉此可實行穿 孔。 又,本發明之處理裝置之進而其他構造上的特徵在於, $係一種將具有複數個被處理部之薄片狀或板狀之工件固 定於基台’且藉由移動控制裝置之控制而對工件實施處理 之處理裝置,上述移動控制裝置使以可移動之方式設置於 99717-950331.doc -9- 1279303 基台之複數個處理部,依據複數個被處理部之處理資訊而 動作’且移動控制裝置含有以下機構:處理區域分割機 構丄其根據所輸人之處理資訊,將複數個處理部分別對工 件貫行處理之區域加以分割;移動路徑算出機構,其算出 各處理部於被處理區域分割機構分割之各個處理區域:移 :路徑’肖定機構,其用以判斷藉由移動路徑算出機構所 算出之各移動路徑是否滿足預先所設定之特定條件;以及 處理機構,其根據藉由判定機構而判定為滿足特定條件之A punch that moves up and down and can be inserted into the hole of the mold. And 'the workpiece pierced by the perforating device is formed with a perforated portion indicating the puncture position so that the perforated portion and the hole portion are in a state of being aligned, so that the punch is previously disturbed toward the hole portion When a sheet-like workpiece such as a substrate is pierced through a hole of a specific shape, a perforating device provided with a metal mold containing a mold 'on which a hole portion is bored and falling in a direction relative to the mold' is used. Thereby, the X piece is perforated. The perforating device as described above is disclosed in, for example, Japanese Patent No. 3204236. However, in the above-mentioned prior art perforating apparatus, since only one metal cookware is provided, when a plurality of perforated portions are formed in the workpiece, there is a problem that the perforation takes a long time. Further, a perforating device has been developed which is provided with a plurality of metal mold portions for simultaneously punching a plurality of perforated portions. However, the prior art perforating apparatus is configured to perforate a workpiece in which a plurality of perforated portions are arranged at regular intervals and are arranged in the same pattern, so that a plurality of perforated portions cannot be irregularly arranged and 99717 -950331.doc 1279303 The problem of perforating is performed on the formed workpiece. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the invention is to provide a processing apparatus, a method of producing a printed circuit board, and a processing program which can efficiently perform a specific processing on a workpiece in which a plurality of processed portions are formed. In order to achieve the above object, the processing apparatus of the present invention is characterized in that it includes a base for providing a fixing portion for fixing a workpiece having a plurality of sheet-like or plate-like portions of the processed portion; a processing unit that is movably disposed on the base station; an input device that inputs relevant processing information of the plurality of processed portions; and a movement control device that is based on the plurality of processed portions that are input to the input device The processing information is calculated, and each of the subsequent processing units calculates an optimum moving path, and corresponding to the calculation result, the plurality of processing units move in the respective positions and perform processing on the processed portion of the workpiece. In the processing apparatus configured as described above, the plurality of processing units are independently moved with respect to the guard by the fixing unit fixing means, and each of the processing units performs processing on the specific processed portion of the workpiece. Further, this is based on the fact that the processing unit of the plurality of processed parts provided by the workpiece is out of the eight-private path, so that the path that each processing unit performs processing on the processed portion and moves is optimal. This enables efficient processing of the workpiece for idle and high precision processing. As a process in this case, it is preferable to move the processing portion with respect to the workpiece in a fixed state and perform a number of processes on the workpiece. For example, the disturbing substrate can be subjected to a process such as punching, conduction inspection, and other processing. 99717-950331.doc 1279303 In the case of perforation treatment, M & has a metal mold of the punch and the mold and: when it is called a treatment for conducting the conduction inspection, the inspection unit is configured by the second inspection and the treatment unit. . The plurality of processed parts to be set in the workpiece are not regularly limited to the one in which the temples are arranged in a regular manner, and a plurality of irregularities may be arranged irregularly. In the processing device of the present invention, even if the processed portion is irregularly imaginary, according to the correlation of each processed portion, ^^^^^, the processing path of each processing portion can correspond to As a result of the calculation, appropriate processing is performed: each processing unit is moved. Further, the optimum moving path calculated by the motion control device can be obtained based on various conditions. For example, it is possible to use each processing unit = the time required for the processing by the processing unit, the path length when each processing unit processes the processing unit, and the number of processing by the processing unit of each processing unit. The case where the processing is uniform is obtained as the most suitable path. Further, another configuration of the processing apparatus according to the present invention is characterized in that a position detecting device that moves together with the processing unit is provided in the vicinity of the processing unit, and the processing unit moves according to the position of the processed portion detected by the position detecting device. Workpiece implementation processing. As the position detecting device in this case, a camera, a sensor, or the like can be used. Thereby, the processing by the processing unit can be performed after the position of the processed portion is correctly detected by the position detecting device. Therefore, no positional shift occurs between the portion to be processed and the portion where the processing unit actually performs processing, so that high-precision processing can be realized.丨"also' the processing device of the present invention and other structural features are 'longitudinal frame-like mounting members formed extending in the direction of movement, will be at 99917-950331.doc 1279303, The base is provided, and the processing portion is provided at a central portion of the mounting member. The #this processing unit is attached to both sides of the mounting member that is movably mounted on the base, and extends along both sides in the moving direction of the processing unit. Since both side portions of the mounting member function as a protruding portion for preventing vibration, when the processing portion and the mounting member are moved together to perform specific processing on the member, vibration is less likely to occur in the processing portion. Therefore, the workpiece can be processed with high precision. Furthermore, another structural feature of the processing apparatus of the present invention is that a plurality of processing sections or portions in which a plurality of processing sections are respectively mounted and moved relative to the base station are provided to detect proximity detection for mutual proximity. The device prevents the processing units from approaching further by the control of the movement control device if the proximity detecting device detects that the processing units are close to each other. ^ This prevents collisions between the processing units or between the components supporting the processing unit - causing breakage or interference with each other to reduce the accuracy of processing. Further, in still another structural feature of the processing apparatus of the present invention, the processing portion is configured by a metal mold including a punch and a mold, and supports a metal mold to support the member, and the member is different from the metal mold. Support in one direction. Thereby, the workpiece is fixed between the die having the hole portion and the punch, the die and the punch are brought close to each other, and the punch is inserted into the hole portion, whereby the punching can be performed. Further, another structural feature of the processing apparatus of the present invention is that the workpiece is fixed to the base by a sheet-like or plate-like workpiece having a plurality of processed portions and is controlled by the movement control device. a processing device for performing processing, wherein the mobile control device is movably provided in a plurality of processing units of a base station of 99917-950331.doc -9- 1279303, and operates according to processing information of a plurality of processed portions and moves control The apparatus includes a processing area dividing unit that divides a plurality of processing units into regions for processing the workpiece according to processing information of the input person, and a movement path calculating unit that calculates each processing unit to be divided in the processed area Each processing area of the mechanism division: a shift: a path determining mechanism for determining whether each moving path calculated by the moving path calculating means satisfies a specific condition set in advance; and a processing mechanism according to the determining means And judged to meet certain conditions

各移動路徑,使各個處理部獨立移動並且對工件之被處理 部實施處理。 本發明之印刷基板之製造方法於構造上之特徵在於,其 係一種使用具有基台、複數個處理部以及移動控制裝置之 處理裝置,對印刷基板實施處理之印刷基板之製造方法, 上述基台設置有用以固定具有複數個被處理部之薄片狀或 板狀之印刷基板的固定部,上述複數個處理部以可移動之 方式設置於基台,上述移動控制裝置根據特定之處理資訊 而控制複數個處理部之動作;該製造方法含有:固定步 驟’其將印刷基板固定於基台上;輸入步驟,其輸入複數 個被處理部之相關處理資訊;移動路徑算出步驟,其根據 藉由輸入步驟所輸入之處理資訊,算出複數個處理部之各 自最適之移動路徑;以及處理步驟,其對應於藉由移動路 徑算出步驟所算出之結果,使複數個處理部各自獨立移動 並且對印刷基板之被處理部實施處理。 藉此’可高效地實行對印刷基板之處理。又,於此情形 99717-950331.doc • 10 - 1279303 時,可將處理部對印刷基板所實施之處理設定為穿孔或導 通檢查。進而,根據複數個處理部之各處理部對印刷基板 實施處理時所需之時間、各處理部對印刷基板實施處理時 之路徑長度、或各處理部實施處理之被處理部之數量均一 化’可算出於移動路徑算出步驟之移動路徑。藉此,倘若 處理裝置設置有兩個處理部,則與處理部為一個之情形相 比,可大幅地縮短或減少整體之處理時間、使用一個處理 部之處理數、以及使用一個處理部實行處理所需要的移動 距離。進而,倘若處理裝置具有三個或三個以上之處理 部,則可實現更為高效之處理。 、本發明之印刷基板之生產方法之其他構造上的特徵在 於,其係一種將具有複數個被處理部之薄片狀或板狀之印 刷基板固疋於基台,且藉由移動控制裝置之控制而對印刷 土板κ化處理之印刷基板之生產方法,上述移動控制裝置 使以可移動之方式設置於基台之複數個處理部,依據複數 個被處理部之處理資訊而動作;移動控制裝置所實行之控 制步驟含有以下步驟··處理區域分割步驟,其根據所輸: 之處理資訊,將複數個處理部分別對印刷基板實行處理之 區域加以分割;移動路徑算出步驟,其算出各處理部於藉 、由:理區域分割步驟所分割之各個處理區域的移動路徑; 判定步驟,其用以判斷藉由移動路徑算出步驟所算出之各 移動路徑是否滿足預先所設定之特定條件;以及處理步 驟,其根據判定步驟中判定為滿足特定條件之各移動路 b使各個處理部獨立移動並且對印刷基板之被處理部實 99717-950331.doc 1279303 施處理。 於具有上述構造之印刷基板之生產方法中,將印刷基板 固定於基台,相對於該印刷基板使複數個處理部各自獨立 夕動並且藉由各處理部對各個印刷基板之特定被處理部 貫施處理。又,此時,根據於印刷基板所設置之複數個被 處理部之相關處理資訊,劃分各處理部實施處理之被處理 邛之處理區域而加以分割,並且,於各處理區域中,使各 處理部用以實施處理之移動路徑設定為最佳。從而,可對 印刷基板實施高效之處理,可實現高速且高精度之處理。 作為此情形時之複數個處理部所實行之處理,較好的是 相對於固定狀態下之印刷基板,使處理部移動並且實行若 干處理,例如,可對可擾性基板實行穿孔、導通檢查以及 其他加工等處理。又,於印刷基板所設置之複數個被處理 部,並非限定於以保持固定間隔之方式規則地配置者,亦 可為不規則地配置者。於本發明之處理方法中,即使不規 則地,置被處理部,亦可根據各被處理部之相關處理資 訊,算出各處理部之最佳移動路徑,可對應於其計算結果 貫行適當處理以使各處理部依次移動。 又本毛明t印刷基板之生產方法於進而其他構造上的 特徵在於,依據使複數個處理部之各處理部對印刷基板實 施處理時所需之時間、各處理部對印刷基板實施處理時之 路從長度、或各處理部實施處理之被處理部之數量均一 化,可實行於處理區域分割步驟中之處理區域之":夢 此’可使各處理部所實行之處理均—化,從而可防止所^ 99717-950331.doc -12- 1279303 行之偏向於特定之處理部。因此,可使各處理部之消 耗狀悲變為相同,從而實現壽命之均一化。 又’本發明之印刷基板之生產方法於進而其他構造上的 特徵在於,依據複數個處理部之抑振動作、最短動作、或 最適速度,算出於移動路徑算出步驟中之移動路徑。該情 形日守之抑振動作,係以相互抵消因相互之移動所產生之振 動的方式而使各處理部移動者,例如,倘若含有兩個處理 部,則使各處理部以左右對稱或前後對稱之方式移動。 使各處理部不向-方向較長地移動,而以短距離適當 凋正仃進方向並且使其移動,藉此亦可提昇抑振效果。 又’最短動作係以各處理部之移動距離為最短之方式設 定移動路徑者。例如,自位於較近之被處理部依次實行處 理,藉此避免於處理部產生無用之移動,以此方式求得各 移動路彳m最適速度係於未使處理之精度產生降低 之範圍内’設定為可實行高速處理之速度者。藉此, 現更為高效之處理。 又,本發明之印刷基板之生產方法於進而其他構造上的 特徵在於,複數個處理部所實行之處理為穿孔。於此产开,Each of the movement paths causes each of the processing units to move independently and performs processing on the processed portion of the workpiece. The method for producing a printed circuit board according to the present invention is characterized in that it is a method of manufacturing a printed circuit board that processes a printed circuit board using a processing device having a base, a plurality of processing units, and a movement control device, and the base plate A fixing portion for fixing a printed circuit board having a plurality of processed portions in a sheet shape or a plate shape is provided, wherein the plurality of processing portions are movably provided on the base, and the movement control device controls the plural according to the specific processing information. The processing method includes: a fixing step of fixing the printed substrate to the base; an input step of inputting related processing information of the plurality of processed portions; and a moving path calculating step according to the input step The input processing information is used to calculate an optimum moving path of each of the plurality of processing units, and a processing step corresponding to the result calculated by the moving path calculating step, so that the plurality of processing units are independently moved and the printed substrate is The processing unit performs processing. Thereby, the processing of the printed substrate can be performed efficiently. Further, in this case, 99717-950331.doc • 10 - 1279303, the processing performed by the processing unit on the printed circuit board can be set to a perforation or conduction check. Further, the time required for the processing of the printed circuit board by each of the processing units of the plurality of processing units, the path length when the processing unit performs processing on the printed circuit board, or the number of processed portions that are processed by each processing unit are uniformized' The movement path of the movement path calculation step can be calculated. Therefore, if the processing device is provided with two processing units, the overall processing time, the number of processing using one processing unit, and the processing using one processing unit can be greatly shortened or reduced as compared with the case where the processing unit is one. The required moving distance. Further, if the processing device has three or more processing units, more efficient processing can be realized. Another structural feature of the method for producing a printed circuit board according to the present invention is that a printed substrate having a plurality of processed portions in a sheet shape or a plate shape is fixed to a base and controlled by a movement control device. In the method for producing a printed circuit board for printing a printed circuit board, the movement control device is movably provided in a plurality of processing units of the base, and operates according to processing information of the plurality of processed portions; the mobile control device The control step to be executed includes the following steps: a processing area dividing step of dividing a region in which a plurality of processing units perform processing on the printed circuit board based on the processed information: a moving path calculating step of calculating each processing unit And a determination step of determining whether each of the movement paths calculated by the movement path calculation step satisfies a specific condition set in advance; and a processing step And each processing is performed according to each of the movement paths b determined to satisfy the specific condition in the determination step And the independent movement of the printed circuit board processing unit of the solid 99717-950331.doc 1279303 application process. In the method of producing a printed circuit board having the above structure, the printed circuit board is fixed to the base, and the plurality of processing units are independently moved with respect to the printed circuit board, and the respective processed portions of the respective printed circuit boards are processed by the respective processing units. Processing. In addition, in this case, the processing area of the processed processing performed by each processing unit is divided and divided according to the processing information of the plurality of processed parts provided on the printed circuit board, and each processing is performed in each processing area. The movement path used to perform the processing is set to be optimal. Thereby, efficient processing can be performed on the printed substrate, and high-speed and high-precision processing can be realized. As a process performed by a plurality of processing units in this case, it is preferable to move the processing unit with respect to the printed substrate in a fixed state and perform a number of processes. For example, the perturbation and conduction check can be performed on the disturbing substrate. Other processing and other processing. Further, the plurality of processed portions provided on the printed circuit board are not limited to being regularly arranged to maintain a fixed interval, and may be irregularly arranged. In the processing method of the present invention, even if the processing unit is irregularly placed, the optimal processing path of each processing unit can be calculated based on the processing information of each processing unit, and the calculation result can be appropriately processed in accordance with the calculation result. The processing units are sequentially moved. Further, in the other method of producing the printed substrate of the present invention, the time required for each processing unit of the plurality of processing units to perform processing on the printed circuit board and the processing of each of the processing units on the printed circuit board are performed. The length of the road or the number of processed parts to be processed by each processing unit is uniform, and the processing of the processing area in the processing area dividing step can be performed, and the processing performed by each processing unit can be made uniform. Therefore, it is possible to prevent the 99717-950331.doc -12-1279303 from being biased toward a specific processing portion. Therefore, the consumption of each processing unit can be made the same, thereby achieving uniformity of life. Further, the method for producing a printed circuit board according to the present invention is characterized in that the moving path in the moving path calculating step is calculated based on the vibration suppression, the shortest operation, or the optimum speed of the plurality of processing units. In this case, the vibration suppression is performed by moving the respective processing units so as to cancel each other by the vibration generated by the mutual movement. For example, if the two processing units are included, the processing units are bilaterally symmetric or symmetrical. The way to move. The respective treatment portions are not moved long in the - direction, but are appropriately moved in a short direction and moved, thereby enhancing the vibration suppression effect. Further, the shortest operation is to set the movement path such that the movement distance of each processing unit is the shortest. For example, processing is sequentially performed from a portion to be processed that is located closer to each other, thereby avoiding useless movement in the processing portion, and in this way, the optimum speed of each moving path 求m is determined within a range in which the accuracy of processing is not lowered. Set to the speed at which high speed processing can be performed. In this way, it is now more efficient. Further, the method for producing a printed circuit board according to the present invention is characterized in that the processing performed by the plurality of processing units is a perforation. Produced here,

時’可藉由例如金屬模具而構成處理部’該金屬模且:有 模具以及可插入孔部之衝頭,該模具具有設置為可自印刷 基板之兩面側相對地實行進退移動之孔部。藉此,可對E 刷基板之被處理部依次實行穿孔。 、P 又,本發明之處理程式於構造上之特徵在於,其係 將具有複數個被處理部之薄片狀或板狀之工件固定於基 99717-950331.doc -13 - 1279303 * 台’且藉由移動控制裝置之控制而對工件實施處理之處理 程式’上述移動控制裝置使以可移動之方式設置於基台之 複數個處理部,依據複數個被處理部之處理資訊而動作; 且該處理程式含有以下步驟:處理資訊讀入步驟,其讀入 複數個被處理區域之相關處理資訊;處理區域分割步驟, 其根據藉由處理資訊讀入步驟所讀入之處理資訊,將複數 個處理部分別對工件實行處理之區域加以分割;移動路徑 异出步驟,其算出各處理部於藉由處理區域分割步驟所分 藝剎之各個處理區域的移動路徑;判定步驟,其用以判斷藉 由移動路徑算出步驟所算出之各移動路徑,是否為最適之 移動路徑;以及處理步驟,其根據於判定步驟中被判定為 最佳移動路徑之各移動路徑,使各個處理部獨立移動並且 - 對工件之被處理部實施處理。 - 藉此’藉由依據上述處理方法之移動控制裝置之控制, 於對工件實行特定之處理時,可實施有效之處理,實現高 速且高精度之處理。 •【實施方式】 以下,使用圖式就本發明之一實施形態加以說明。圖i 至圖3係本發明之處理裝置之一例,表示用以實施本發明 之處理方法之穿孔裝置Μ。 該穿孔裝置Μ含有設置於地面F上之基台丨〇以及設置於 基σ10之上cr[V之t置本體部2〇等。於基台丨〇之上面,保持 間隔而平行地設置有一對向x軸方向(圖i以及圖2之左右 方向)延伸之X軸軌道lla、llb。並且,於該χ軸軌道 99717-950331.doc -14- 1279303 於水平面上與 12b,其可沿χ ⑴、Ub上’分別架設有兩個向¥轴方向 X軸正交之方向)延伸之移動支持台i2a 軸執道11a、lib於X軸方向移動。 又,於X軸執道lla、llb之間,與χ轴轨道⑴、爪 地設置有螺桿轴13a、13b。並且,於螺桿軸…之圖i以及 圖2之右側端部’連接有用以使螺桿轴⑴圍繞軸方向旋轉 之X軸馬達14a,⑨螺桿轴13a之圖i以及圖2之左侧端部, 連接有用以使螺桿軸13b圍繞軸方向旋轉之χ軸馬達丨外。The mold can be formed by, for example, a metal mold, and has a mold and a punch insertable into the hole portion, and the mold has a hole portion which is provided to be movable forward and backward from the both sides of the printed substrate. Thereby, the processed portion of the E-brush substrate can be sequentially punched. Further, the processing program of the present invention is characterized in that it is characterized in that a sheet-like or plate-like workpiece having a plurality of processed portions is fixed to a base 99917-950331.doc -13 - 1279303 * a processing program for processing a workpiece by the movement control device. The movement control device moves a plurality of processing units movably disposed on the base, and operates according to processing information of the plurality of processed portions; and the processing The program includes the following steps: processing a information reading step, which reads related processing information of a plurality of processed regions; and processing a region dividing step, which performs a plurality of processing portions according to processing information read by processing the information reading step The area where the processing of the workpiece is processed is divided; the moving path is different, and the moving path of each processing area of each processing unit by the processing area dividing step is calculated; and the determining step is for determining by moving Whether each of the movement paths calculated by the path calculation step is an optimal movement path; and a processing step based on the determination step It is determined for the best movement path of the moving path, independent movement of the respective processing unit, and - the processing of the embodiment of the treating portion of work. - By the control of the movement control device according to the above-described processing method, when a specific process is performed on the workpiece, effective processing can be performed to realize high-speed and high-precision processing. [Embodiment] Hereinafter, an embodiment of the present invention will be described using the drawings. Figs. 1 to 3 are diagrams showing an example of a processing apparatus of the present invention, showing a punching apparatus for carrying out the processing method of the present invention. The perforating device Μ includes a base 设置 disposed on the floor F and a base unit 〇2 disposed on the base σ10. On the upper surface of the base, a pair of X-axis rails 11a and 11b extending in the x-axis direction (the left and right directions of Figs. i and 2) are provided in parallel with each other at intervals. Further, the yoke axis 99917-950331.doc -14-1279303 is on the horizontal plane and 12b, and the movement can be extended along the χ (1) and Ub, respectively, in the direction in which the two axes are orthogonal to the X axis of the ¥ axis. The support table i2a is in the X-axis direction. Further, between the X-axis lanes 11a and 11b, the screw shafts 13a and 13b are provided on the y-axis rail (1) and the claws. Further, the figure i of the screw shaft and the right end portion of FIG. 2 are connected to the X-axis motor 14a, 9 which rotates the screw shaft (1) about the axial direction, and the left end of the screw shaft 13a and the left end of FIG. A yoke motor that is used to rotate the screw shaft 13b about the axial direction is attached.

移動支持台12a連接於藉由x軸馬達14a之驅動而旋轉之 螺桿軸13a,藉由X軸馬達14a之驅動,於圖丨之又軸軌道 Ua、lib之左侧端部與移動支持台12b的面前側(於自移 動支持台12a側看之X軸方向之面前側)部分之間,沿χ軸 軌道11a、lib移動。又,移動支持台12b連接於藉由χ軸馬 達14b之驅動而旋轉之螺桿軸131?,藉由χ軸馬達14b之驅 動,於圖1之X軸軌道11a、lib之右側端部與移動支持台 12a的面前側(於自移動支持台i2b側看之χ軸方向之面前 側)部分之間,沿X軸執道11a、lib移動。 又’於基台10之左右兩側之壁部,經由支持構件1 5分別 安裝有旋轉支持軸15a、15b,並且於旋轉支持軸i5a之上 方安裝有伸展滾筒16a,於旋轉支持軸15b之上方安裝有伸 展滾筒16b。因此,可旋轉地安裝例如含有可撓性基板之 滾筒狀之工件W於旋轉支持軸1 5 a,且使其前端部通過伸 展滾筒1 6a、1 6b之上部側後,可使其捲繞於旋轉支持軸 15b。於此情形時,工件W使旋轉支持軸15a、15b旋轉, 99717-950331.doc -15- 1279303 , 藉此依-人自旋轉支持軸15a被送出,捲繞於旋轉支持軸 15b此日守’伸展滾筒16a、16b為對工件w施加適當之張 力而支持工件W,並且於X軸執道11a、lib之上方將工件 W定位。 又’於移動支持台12a之上面設置有向γ軸方向延伸之γ 軸軌道17a,於移動支持台12b之上面設置有向γ軸方向延 伸之Y軸軌道17b。再者,以可沿對應之γ軸軌道17&、工几 於Y轴方向移動之狀態,於Y轴執道17a上安裝有安裝構件 ® 2 la,於Y軸執道17b上安裝有安裝構件21b。即於Y軸軌道 17a上軸執道17a之長度方向設置有螺桿軸iga,於γ 軸軌道17b上,沿γ軸執道nb之長度方向設置有螺桿軸 18b。並且,於螺桿軸18&之後端部,連接有用以使螺桿軸 — 18a圍繞軸方向旋轉之Y軸馬達19a,於螺桿轴18b之後端 . 部’連接有用以使螺桿軸18b圍繞軸方向旋轉之γ軸馬達 19b 〇 並且’女裝構件21a連接於藉由Y軸馬達19a之駆動而旋 •轉之螺桿軸18a,藉由Y軸馬達19a之驅動而沿γ軸執道i7a 移動。又,安裝構件21b連接於藉由Y軸馬達i9b之驅動而 旋轉之螺桿軸18b,藉由Y軸馬達19b之驅動而沿γ轴執道 17b移動。並且,於安裝構件21 a安裝有處理部22a,於安 裝構件21b安裝有處理部22b。又,裝置本體部20含有安装 構件21a、21b、處理部22a、22b以及後述之固定部等。 又,因安裝構件21a、21b以及處理部22a、22b分別藉由 含有相同構造之一對物質而構成,故而,以下就安裝構件 99717-950331.doc -16- 1279303 2U以及處理部22a加以說明,省略安裝構件m以及處理 部221?之§兄明。安裝構件2U如圖3以及圖4所示,藉由向γ 軸方向延伸之前後對稱的大致橢圓形框體而構成/安裝構 件2U、⑽自處理部22a、22b來看,於紙面上自左右:個 方向進行支持。 藉此’與僅藉由單側進行支持之情形相比較,即使於急 加速、急停止時,亦難以於衝頭27a、28a與模具24、25之 間產生位置偏移。該兩端側部分形成為用以防止振動之突The moving support table 12a is connected to the screw shaft 13a that is rotated by the driving of the x-axis motor 14a, and is driven by the X-axis motor 14a to the left end of the shaft rails Ua, lib and the moving support table 12b. The front side (the front side in the X-axis direction seen from the side of the moving support table 12a) moves along the x-axis rails 11a, lib. Further, the movement support table 12b is connected to the screw shaft 131 that is rotated by the drive of the spindle motor 14b, and is driven by the spindle motor 14b, and is supported by the right end of the X-axis rails 11a and 11b of FIG. The front side of the table 12a (on the front side in the direction of the x-axis viewed from the side of the moving support table i2b) moves along the X-axis lanes 11a, 11b. Further, on the left and right side walls of the base 10, the rotation support shafts 15a and 15b are respectively attached via the support members 15, and the extension roller 16a is attached above the rotation support shaft i5a above the rotation support shaft 15b. A stretching roller 16b is mounted. Therefore, a roller-shaped workpiece W including a flexible substrate is rotatably attached to the rotation support shaft 15a, and the front end portion thereof is passed over the upper side of the extension rollers 16a, 16b, and can be wound around The support shaft 15b is rotated. In this case, the workpiece W rotates the rotation support shafts 15a, 15b, 99717-950331.doc -15 - 1279303, whereby the self-rotating support shaft 15a is fed out, and is wound around the rotation support shaft 15b. The stretching drums 16a, 16b support the workpiece W by applying an appropriate tension to the workpiece w, and position the workpiece W above the X-axis lanes 11a, lib. Further, a γ-axis rail 17a extending in the γ-axis direction is provided on the upper surface of the movement support table 12a, and a Y-axis rail 17b extending in the γ-axis direction is provided on the upper surface of the movement support table 12b. Further, the mounting member ® 2 la is mounted on the Y-axis road 17a in a state in which the corresponding γ-axis rail 17 & and the workpiece is moved in the Y-axis direction, and the mounting member is mounted on the Y-axis road 17b. 21b. That is, the screw shaft iga is provided in the longitudinal direction of the shaft path 17a on the Y-axis rail 17a, and the screw shaft 18b is provided on the γ-axis rail 17b in the longitudinal direction of the γ-axis road nb. Further, at the end of the screw shaft 18 & the Y-axis motor 19a for rotating the screw shaft 18a about the axial direction is connected to the rear end of the screw shaft 18b. The connection is made to rotate the screw shaft 18b about the axial direction. The γ-axis motor 19b and the 'women's member 21a' are connected to the screw shaft 18a that is rotated by the Y-axis motor 19a, and are moved along the γ-axis command i7a by the Y-axis motor 19a. Further, the attachment member 21b is connected to the screw shaft 18b which is rotated by the driving of the Y-axis motor i9b, and is moved along the γ-axis road 17b by the driving of the Y-axis motor 19b. Further, the treatment portion 22a is attached to the attachment member 21a, and the treatment portion 22b is attached to the attachment member 21b. Further, the apparatus main body portion 20 includes attachment members 21a and 21b, processing portions 22a and 22b, and a fixing portion to be described later. Further, since the attachment members 21a and 21b and the treatment portions 22a and 22b are each constituted by a pair of substances having the same structure, the attachment members 99117-950331.doc-16-1279303 2U and the treatment unit 22a will be described below. The mounting member m and the processing unit 221 are omitted. As shown in FIG. 3 and FIG. 4, the mounting member 2U is configured by the substantially elliptical frame that is symmetrical before and after the γ-axis direction, and the mounting members 2U and (10) are viewed from the processing portions 22a and 22b. : Support in one direction. Therefore, it is difficult to cause a positional shift between the punches 27a and 28a and the dies 24 and 25 even when the vehicle is supported by one side alone, even in the case of sudden acceleration or sudden stop. The both end side portions are formed to prevent vibration from protruding

起邛亚且,安裝構件21a之内部,形成為於χ轴方向貫通 且向Υ軸方向延伸之狹縫狀之工件插通孔23,於對工件w 實行穿孔之情形時HW通過於該工件插通孔23。 ;面向位於文衮構件21 a之下部中央之工件插通孔 23的部分,以於γ軸方向保持一定間隔之方式安裝有一對 模具24、25,於模具24形成有開口向上方之孔部,於 模具25形成有開口向上方之孔部25a。並且,於位於安裝 構件21a之下部中央的模具24、25之間,設置有用以對準 之孔部26。 又’於對向位於安裝構件21a之上部中央之模具24、25 的部分,以可介於升降機構27、28進行升降之狀態,安裝 有棒狀之衝頭27a、28a,該衝頭27a、28a可分別插入所對 向之孔部24a、25a。衝頭27a、28a藉由升降機構27、28之 動作而下IV ’插入各自對向之孔部24a、25a内,藉由此時 之剪斷力對工件W實行穿孔。藉由含有該等模具24、25以 及衝頭27a、28a之金屬模具,構成處理部22a。 99717-950331.doc -17- 1279303 ^ 又,孔部24a、25a以及與其相對應之衝頭27a、28a,於 各自實行嵌合時,設定為可剪斷工件W之大小。於此情形 ^ ’孔部24a與孔部25a之直徑之大小既可設定為相同亦可 設定為不同。同樣地,衝頭27a與衝頭28a之直徑大小亦可 设定為相同或不同。藉由將該等設定為相異之大小,可藉 由個處理部22a開兩種大小之孔。從而,藉由處理部 22a、22b可開最多四種大小不同之孔。 又’於位於安裝構件21a之下部中央的孔部24a、25a之 • 下方部分,形成有收容部29用以收容被穿孔之工件w之破 片’於牙孔時所產生之破片,暫時被收容至收容部2 9内之 後藉由吸引1置(未圖示)之吸引而被排除至外部。並 且,於位於安裝構件21 a之上部中央之衝頭27a、28a間, — 以對向於用以定位之孔部26之方式,安裝有作為本發明之 位置檢測裝置之CCD攝影機30。 - 又,如圖5所示,於位於移動支持台12a之對向於移動支 持台12b之部分,安裝有具有面向移動支持台12b開口之凹 • 部的顯微感測器3 1,於對向於位於移動支持台12b之顯微 感測器31之凹部的部分,安裝有棒狀之擋塊32,其可進入 顯微感測器31之凹部。顯微感測器31含有使通過凹部之光 線L發光之發光部,以及接受該光線1之受光部,倘若擋塊 32進入凹部内,則該光線L被遮斷,可檢測出移動支=台 12a與移動支持台12b接近。本發明之接近檢測裝置含有該 顯微感測器3 1以及播塊3 2。 又,固定部含有四個挾持爪部35a、35b、3化以及3以, 99717-950331.doc -18- 1279303 力別设置於位於基台1()上面之χ軸軌道ua、爪之端部附 近。该等挾持爪部35a、35b、35c以及叫各自含有把持部 :移動機構(未圖示)’藉由移動機構之動作,上述挾持爪 部各自獨立地於X軸方向以及γ轴方向移動,上述把持部 以可拆卸之方式固定工件评之邊緣部。作為該移動機構, 既可使用藉由馬達使其移動之機構,亦可使用藉由手動使 其移動之機構。於使用藉由手動之移動機構之情形時,可 猎由螺桿將各挾持爪部35a、35b、35e以及⑽固定於特定 位置。又,把持部將設定為與安裝構件2U之工件插通孔 23為相同同度’自側邊緣部之外部側對穿通工件插通孔^ 内的工件w之邊緣部固定。 藉可藉由使挾持爪部…等中之特定挾持爪部移 動、現尺寸相異之各種工件之固定。例如將四個挾持爪 叩a等中之挾持爪部35a作為基準點加以固定,使挟 部35d可沿_方向移動’使挾持爪部说可沿γ軸方向移 且’使挾持爪部35c^x軸方向以及W方向移 ^。㈣’可於四個挾持爪部35a等可移動之範圍内,固 定任意尺寸之工件W〇又,士〆^ 干 又因挾持爪部35a等可移動, :: = w藉由較薄且易彎曲之薄片而構成,亦可藉* 適虽之張力以拉伸為整亩夕壯At ^ 處理之精度。 %而加以固定。藉此’提昇 又,於^實施形態中所使用之穿孔裝舰,除上述各褒 以外,通具有如圖6所示之輸入裝置36或含有cpu37、 議38以及RAM39等移動控制襄置如。輸入震置%含有 99717-950331.doc -19- 1279303 • 刼作面板,其藉由操作者之操作,將關於於工件貨所形成 之各被穿孔部(參照圖8) n丨〜n 2 0之位置(座標值)或大小^穿 孔之孔直徑)等穿孔資訊,以及表示CCD攝影機3〇、與 衝頭27a、28a之位置之偏移的偏移資訊傳送至移動控制裝 置 40。 、 又,於移動控制裝置40之R〇M38中,儲存有如圖7所示 之處理程式,CPU37依據自輸入裝置36所輸入之穿孔資 汛,貫行尋求加工時之移動路徑之處理程式。即移動控制 馨裝置40依據自輸入裝置36所輸入之穿孔資訊,算出各處理 部22a、22b之各自之移動路徑。並且,依據其計算結果, 與CCD攝影機30以及安裝於安裝構件21b之CCD攝影機3〇a 之檢測結果,控制X軸馬達14a、14b、Y軸馬達19a、 - 19b、升降機構27、28以及安裝於安裝構伴21b之升降機構 41、42等之動作。 - 於以上之構造中,當對工件W實行穿孔加工時,首先將 - 工件…安裝於穿孔裝置Μ且固定於特定位置,並且對穿孔 _ 裝置“輸入電源設定為可動作之狀態。並且,藉由操作輸 入裝置36,輸入設置於工件w之複數個被穿孔部的穿孔資 訊。至於該穿孔資訊,設定各被穿孔部之座標軸上之位 置,例如設定X座標、Υ座標均為”〇”之點為基準點,使用 相對於該基準點之各被穿孔部之X座標以及γ座標之值, 或各被穿孔部之直徑之大小而表示。自輸入裝置36所輸入 之穿孔資訊,儲存於移動控制裝置40之RAM39中。 關於該穿孔裝置Μ之處理,就如圖8所示將設置有被穿 99717-950331.doc -20· 1279303 孔部nl〜n20之工件w實行穿孔之情形為例加以說 情形時,首先將卫件w安裝於穿孔裝㈣且固定w线 置,亚且對穿孔裝置Μ輸入電源設定為可動作之狀能 而’藉由操作輸入裝置36,輸入設置於 nl〜η20之穿孔資訊。 明 於此 位 繼 工件W之被穿孔部 件W之表面設定X座 用相對於該基準點〇 標 至於該穿孔資訊,如圖8所示,於工 、丫座標均為"0"之點為基準點〇,使Further, the inside of the mounting member 21a is formed as a slit-shaped workpiece insertion hole 23 that penetrates in the z-axis direction and extends in the z-axis direction, and the HW passes through the workpiece when the workpiece w is perforated. Through hole 23. a portion facing the workpiece insertion hole 23 located at the center of the lower portion of the document member 21a, and a pair of dies 24 and 25 are attached so as to maintain a constant interval in the γ-axis direction, and a hole having an opening upward is formed in the mold 24, A hole portion 25a whose opening is upward is formed in the mold 25. Further, a hole portion 26 for alignment is provided between the molds 24, 25 located at the center of the lower portion of the mounting member 21a. Further, in a portion opposite to the molds 24 and 25 located at the center of the upper portion of the mounting member 21a, rod-shaped punches 27a and 28a are attached in a state where the lifting mechanisms 27 and 28 can be moved up and down, and the punch 27a, The holes 28a can be inserted into the opposite hole portions 24a, 25a, respectively. The punches 27a and 28a are inserted into the respective opposing hole portions 24a and 25a by the movement of the elevating mechanisms 27 and 28, and the workpiece W is perforated by the shearing force at this time. The treatment portion 22a is constituted by a metal mold including the molds 24, 25 and the punches 27a, 28a. 99717-950331.doc -17- 1279303 ^ Further, the holes 24a and 25a and the punches 27a and 28a corresponding thereto are set to have a size at which the workpiece W can be cut. In this case, the diameters of the hole portion 24a and the hole portion 25a may be set to be the same or different. Similarly, the diameters of the punch 27a and the punch 28a may be set to be the same or different. By setting the levels to different sizes, the holes of the two sizes can be opened by the processing unit 22a. Thus, up to four holes of different sizes can be opened by the processing sections 22a, 22b. Further, a lower portion of the hole portions 24a and 25a located at the center of the lower portion of the mounting member 21a is formed with a receiving portion 29 for accommodating the fragment generated when the fragment of the workpiece w that is perforated is inserted into the tooth hole, and is temporarily accommodated to the inside. The inside of the accommodating portion 29 is excluded from the outside by suction by suction 1 (not shown). Further, a CCD camera 30 as a position detecting device of the present invention is attached between the punches 27a, 28a located at the center of the upper portion of the mounting member 21a, and the hole portion 26 for positioning. - Further, as shown in Fig. 5, a microscopic sensor 3 1 having a concave portion facing the opening of the movable support table 12b is attached to a portion of the moving support table 12a opposite to the moving support table 12b. To the portion of the recess of the micro-sensor 31 of the mobile support table 12b, a bar-shaped stopper 32 is provided which can enter the recess of the micro-sensor 31. The microscopic sensor 31 includes a light-emitting portion that emits light L passing through the concave portion, and a light-receiving portion that receives the light beam 1. If the stopper 32 enters the concave portion, the light beam L is blocked, and the moving branch can be detected. 12a is close to the mobile support station 12b. The proximity detecting device of the present invention contains the microscopic sensor 31 and the broadcast block 32. Further, the fixing portion includes four holding claw portions 35a, 35b, 3, and 3, and 99717-950331.doc -18-1279303 is disposed on the end of the yoke track ua and the claw on the base 1 (). nearby. Each of the gripping claw portions 35a, 35b, 35c and each of the gripping portions: a moving mechanism (not shown) is moved by the movement mechanism, and the gripping claw portions are independently moved in the X-axis direction and the γ-axis direction. The grip portion fixes the edge portion of the workpiece in a detachable manner. As the moving mechanism, a mechanism that moves by a motor or a mechanism that moves it manually can be used. In the case where a manual moving mechanism is used, it is possible to fix each of the gripping claw portions 35a, 35b, 35e, and (10) to a specific position by a screw. Further, the grip portion is set to be the same degree as the workpiece insertion hole 23 of the attachment member 2U. The outer side of the side edge portion is fixed to the edge portion of the workpiece w penetrating through the workpiece insertion hole. The fixing of various workpieces having different sizes can be achieved by moving the specific gripping claws in the gripping claws and the like. For example, the gripping claw portions 35a of the four gripping jaws a and the like are fixed as reference points, so that the crotch portion 35d can be moved in the _ direction so that the gripping claw portion can be moved in the γ-axis direction and the gripping claw portion 35c^ The x-axis direction and the W-direction shift ^. (4) 'The workpieces of any size can be fixed within the movable range of the four gripping claws 35a, etc., and the stems can be moved by the gripping claws 35a, etc. ::= w is thin and easy It is composed of curved sheets, and it can also be used to stretch the tension to the precision of the whole acre. % is fixed. In addition to the above, the perforated ship used in the embodiment has an input device 36 as shown in Fig. 6 or a mobile control device such as cpu37, bar 38, and RAM 39. The input vibration % contains 99917-950331.doc -19- 1279303. The panel is operated by the operator, and each of the perforated portions formed by the workpiece is formed (refer to FIG. 8) n丨~n 2 0 The perforation information such as the position (coordinate value) or the size of the perforated hole diameter, and the offset information indicating the offset of the position of the CCD camera 3 and the punches 27a, 28a are transmitted to the movement control device 40. Further, in the R〇M38 of the mobile control device 40, a processing program as shown in Fig. 7 is stored, and the CPU 37 searches for a processing procedure of the movement path at the time of processing based on the punching amount input from the input device 36. That is, the movement control device 40 calculates the movement path of each of the processing units 22a and 22b based on the perforation information input from the input unit 36. Further, based on the calculation results, the X-axis motors 14a and 14b, the Y-axis motors 19a and 19b, the elevating mechanisms 27 and 28, and the mounting are controlled together with the detection results of the CCD camera 30 and the CCD camera 3A attached to the mounting member 21b. The operation of the elevating mechanisms 41, 42 and the like of the mounting 21b is mounted. - In the above configuration, when the workpiece W is subjected to the punching process, the - workpiece is first mounted on the punching device and fixed at a specific position, and the input power is set to the operable state for the punching_device. The operation input device 36 inputs the perforation information of the plurality of perforated portions of the workpiece w. As for the perforation information, the position on the coordinate axis of each of the perforated portions is set, for example, the X coordinate and the coordinate are set to "〇". The point is a reference point, and the value of the X coordinate and the γ coordinate of each of the perforated portions with respect to the reference point or the diameter of each of the perforated portions is used. The perforation information input from the input device 36 is stored in the movement. In the RAM 39 of the control device 40, as for the processing of the punching device, as shown in FIG. 8, a case where the workpiece w provided with the hole portions n1 to n20 of the 99917-950331.doc -20·1279303 is punched is taken as an example. In the case of the situation, the guard w is first mounted on the punching device (4) and the fixed w wire is placed, and the input power of the punching device is set to be operable and can be input by operating the input device 36. The perforation information is placed in nl~η20. The surface of the perforated part W of the workpiece W is set to be used to mark the perforation information with respect to the reference point, as shown in FIG. The point of ""0" is the benchmark point, so that

之被穿孔部nl〜η20的X座標以及γ座標之值,或被穿孔部 nl〜η20之直徑之大小而表示。於下述表表示有該穿孔 資訊之一例。於此情形時,於被穿孔部nl〜n2〇所穿孔之孔 之直徑設定為具有dl、d2兩種者,並且設定為於處理部 22a、22b分別設置有具有相異大小之孔部之模具24、25等 以及衝頭27a、28a等。自輸入裝置36所輸入之穿孔資訊, 儲存於移動控制裝置40之RAM39中。 [表1] 被穿孔部 X座標值 Υ座標值 孔徑 nl xl yi dl n2 χ2 y2 d2 η3 χ3 y3 dl η4 χ4 y4 d2 η20 χ20 y20 dl 穿孔資訊之輸入結束後,實行接通起動開關(未圖示)之 操作。藉此,藉由CPU37開始實行如圖7所示之處理程 式。該程式於步驟100實行開始,於步驟102實行讀入儲存 99717-950331.doc -21 - 1279303 於RAM39之穿孔資訊。繼而程式前進至步驟l〇4,於步驟 104中,處理部22a、22b分別實行分割穿孔之加工區域的 處理。 於此,依據特定之規則分割加工區域。作為特定之規 則,包括例如平均分配處理部22a、22b之處理次數,以及 使移動路徑之近似值大致均等化等。並且,於依據上述兩 項規則所分割之加工區域内,以連接各個處理部22a、22b 實行穿孔加工之被穿孔部之座標間的方式,獲得移動路徑 之近似值,使該近似值儲存於RAM39中。再者,關於處理 部22a、22b實際產生移動時之移動路徑,因實行平滑化等 處理,故而通常並非限定於以直線方式而於被穿孔部間移 動。因此,藉由近似值表示純粹之處理位置的距離之相 加0 例如、如圖8所示將工件W以沿X軸方向為等面積之方式 分割為兩等份,將處理部22a實行穿孔之被穿孔部,設定The values of the X coordinate and the γ coordinate of the perforated portions n1 to η20 or the diameters of the perforated portions n1 to η20 are shown. An example of such perforation information is shown in the following table. In this case, the diameter of the hole perforated by the perforated portions n1 to n2 is set to have both dl and d2, and is set to have molds having different sizes of the holes in the processing portions 22a and 22b. 24, 25, etc. and punches 27a, 28a, and the like. The punching information input from the input device 36 is stored in the RAM 39 of the mobile control device 40. [Table 1] Perforated portion X Coordinate value Υ Coordinate value aperture nl xl yi dl n2 χ2 y2 d2 η3 χ3 y3 dl η4 χ4 y4 d2 η20 χ20 y20 dl After the input of the perforation information is completed, the start switch is turned on (not shown) ) operation. Thereby, the processing procedure shown in Fig. 7 is started by the CPU 37. The program begins at step 100, and in step 102, the puncturing information stored in the RAM 39 is read and stored in 99917-950331.doc -21 - 1279303. Then, the program proceeds to step 104. In step 104, the processing units 22a and 22b respectively perform processing for dividing the punched processing area. Here, the processing area is divided according to a specific rule. Specific rules include, for example, the number of processing times of the average distribution processing units 22a and 22b, and the approximate value of the movement path are substantially equalized. Further, in the processing region divided by the above two rules, an approximate value of the movement path is obtained so that the respective processing portions 22a and 22b connect the coordinates of the perforated portion of the perforated portion, and the approximate value is stored in the RAM 39. In addition, the movement path when the processing units 22a and 22b actually move is subjected to processing such as smoothing, and therefore, it is not normally limited to linearly moving between the perforated portions. Therefore, the addition value of the distance of the pure processing position is represented by the approximate value. For example, as shown in Fig. 8, the workpiece W is divided into two equal parts so as to be equal in the X-axis direction, and the processing portion 22a is perforated. Perforation, setting

為被穿孔部nl〜n8以及被穿孔部nl2之九個,將處理部2沘 實行穿孔之被穿孔部,設定為被穿孔部n9〜nl丨以及被穿孔 部η 13〜n2 0之·{ 個。 藉由步驟1〇4之處理結束後,程式前進至步驟ι〇6,實行 尋求處理部22a、22b之各自之移動路徑,且使其移動路徑 取適化之處理。各移動路徑藉由使各個加工區域内之被穿 孔部相互連接而求得,並且依據抑振動作、最短動作、最 適速度以及處理部22a、22b有無相互幹涉之判斷等而變更 路徑’藉此實行上述移動路徑之最適化。即抑振動作係以 99717-950331.doc -22- 1279303 處理部22a、22b之移動抵消因相互之移動而產生的振動之 方式而作用者,其藉由處理部22a、22b以左右對稱或前後 對%之方式移動,或不向一方向較長地移動,而一面以短 距離適當變更行進方向一面移動而得以實現。 又,最短動作係以處理部22a、22b之移動距離為最短之 方式而設定移動路徑者,最適速度係以可將加工精度控制 於規定範圍内之狀態’設定為可實行盡可能快之高速處理 之速度者。又,有無相互幹涉之判斷,係當處理部Ua、The perforated portions that are perforated by the processing unit 2 are nine of the perforated portions n1 to n8 and the perforated portion nl2, and are set to be perforated portions n9 to nl and perforated portions η 13 to n2 0 . When the processing of the step 1〇4 is completed, the program proceeds to the step 〇6, and the processing for seeking the respective movement paths of the processing units 22a and 22b and the movement path thereof is performed. Each of the movement paths is obtained by connecting the perforated portions in the respective processing regions to each other, and the path is changed according to the vibration suppression, the shortest motion, the optimum speed, and whether or not the processing units 22a and 22b interfere with each other. The above-mentioned moving path is optimized. That is, the vibration suppression system acts as a means for canceling the vibration generated by the movement of the processing portions 22a, 22b by the movement of the processing portions 22a, 22b, which is symmetrically symmetrical by the processing portions 22a, 22b It is realized by moving in a manner of % or not moving in one direction, and moving while appropriately changing the traveling direction with a short distance. Further, in the shortest operation, the movement path is set such that the movement distance of the processing units 22a and 22b is the shortest, and the optimum speed is set to a state in which the machining accuracy can be controlled within a predetermined range. Speed. Moreover, whether or not there is mutual interference is judged as the processing unit Ua,

22b向各自欲穿孔之特定被穿孔部移動時,不產生接觸地 設定移動路徑者。 例如,當處理部22a以被穿孔部nl為出發點,以被穿孔 •2、n3、n4、n7..fW_M^Blq22b 以被穿孔部n20為出發點,以被穿孔部η19、ηΐ8、Μ?、 之順序移動並且穿孔,以此方式求得處理部❿、 22b之各自之移動路徑。又,最短動作係以處理部22&、 22b之移動距離為最短之方式設定移動路徑者,例如,藉 由自位於較近之被穿孔部開始依次實行穿孔,可以減心 理部22a、22b之無用之移動的方式求得各移 而’最適速度係於不降低工精度之範_,設 高速處理之速度者。 繼而,求得處理部22a、22b之各移動路捏後,程式前進 至步驟_,該步驟對於沿所求得之移動路徑移 且When the 22b moves to the specific perforated portion to be perforated, the movement path is set without causing contact. For example, when the processing portion 22a takes the perforated portion n1 as a starting point, the perforated portion 2, n3, n4, n7..fW_M^Blq22b is used as the starting point by the perforated portion n20, and the perforated portions η19, nΐ8, Μ? The movement paths of the processing units ❿, 22b are determined in this manner by sequentially moving and perforating. Further, in the shortest operation, the movement path is set such that the movement distances of the processing units 22 & 22b are the shortest. For example, by performing the perforation sequentially from the near-perforated perforated portion, the use of the psychological portions 22a and 22b can be reduced. The way of moving is to find each shift and the 'optimal speed is based on the standard of not reducing the accuracy of the work, and setting the speed of high-speed processing. Then, after the movement paths of the processing units 22a and 22b are pinched, the program proceeds to step _, which is for moving along the determined movement path.

處理部22a、22b對各自所對用之被f孔部ni〜n2Q 的情形時所需要之時間差是否為特定值以下加以: 99717-950331.doc -23- 1279303 者,該特定值預先設定且儲存於RAM39中。於此,倘若處 理之時間差大於特定值,於步驟1〇8判定為”N〇",則程式 前,至步驟1〇4,再次實行上述處理。於此情形時:設^ 與藉由前次處理而求得之加工區域為相異之加卫區域,依 據其他規則尋求移㈣徑,重複該處理直輯求得之移動 路徑變為適合者。 例如,於以面冑平均&割加工區域時未㉟求得適合之移 動路徑之情形時,將分割規則變為以被穿孔部之個數為均 等之方式進仃分割’將處理部22a實行穿孔之被穿孔部, 設$為被穿孔部nl〜nl0之十個,將處理部22b實行穿孔之 被穿孔部’設定為被穿孔部nll〜n2〇之十個。繼而,於步 驟106貫打尋求於藉由步驟1〇4之處理所設定之加工區域 中,處理部22a、22b之各自最適之移動路徑的處理。於此 情形時,以使處理部22a對被穿孔部心㈣^于穿孔時所 需之時間,與處理部22b對被穿孔部nll〜n2〇實行穿孔時所 需要之時間接近之方式,尋求處理部22a、2沘之各自之移 動路徑。 亚且,再度於步驟108中,依據所求得之移動路徑,判 斷處理部22a、22b於實行穿孔時所需要之加工時間之差是 否為特定值以下。咖37反覆步驟1()4、1()6之處理,直至 處理部22a、22b之加工時間之差變為特定值以下,於步驟 1〇8中判定為"YES’,。在此期間,於步驟ΠΜ中,一面變更 被穿孔部nll~n20之組合一面實行加工區域之分割處理, 於步驟H)6中,算出對應於步驟1〇4中獲得之加工區域之移 997I7-95033I.doc -24- 1279303 動路徑。 、屬而,處理部22a、22b之處理所需要的加工時間之差變 為特定值以下,於步驟1〇8中判定為.,,YES,,時,程式前進至 步驟110。 於步驟110中,實行決定藉由步驟108判定為”YES”時之 移動路徑作為處理部22a、22b之各自最適的移動路徑之處 理。該移動路徑之數據儲存於RAM39中。繼而,於步驟 u2中,處理部22a、22b根據該移動路徑進行移動,並且 對應於穿孔之直徑,利用CCD攝影機3〇、3〇a與衝頭27&、 28a之偏移量,使衝頭27&、28a與模具以、乃移動至穿孔 位置’進行用於實行穿孔加工之處理。 該穿孔藉由以下方式而實行。首先,使χ軸馬達i4a、 14b以及Y軸馬達19a、19b動作,使處理部22&、2汕位於作 為各自之移動路徑之出發點的被穿孔部,例如被穿孔部d 以及被穿孔部n20。繼而,藉由CCD攝影機3〇、3〇a拍攝其 對應之被穿孔部nl、n2〇。該圖像數據被傳送至cpu37實 行圖像處理,且作為位置數據儲存於RAM39。繼而,依據 該被穿孔部nl、n2〇之位置數據與孔部24a、25a等之位置 數據之差(利用偏移資訊而求得),χ軸馬達14a等動作,例 如使孔部24a與其所對應之被穿孔部n丨之位置相一致。 並且’藉由升降機構27之動作衝頭27a下降,對被穿孔 部nl實行穿孔。藉此,於被穿孔部nl之位置穿有孔徑為dl 之孔。同樣地,處理部22b亦對其對應之被穿孔部n20實行 穿孔’於此形成孔徑為d 1之孔。最初之穿孔結束後,處理 99717-950331.doc -25- 1279303 , 部22a、22b各自移動至下一個被穿孔部,例如移動至被穿 孔部n2與被穿孔部ni9之位置,藉由CCD攝影機30、30a確 認上述被穿孔部n2、nl9之位置後,對該被穿孔部n2、ni9 實行穿孔。並且,處理部22a、22b依據藉由CCD攝影機 30、30a所確認之被穿孔部nl〜n2〇之位置,依次沿移動路 徑移動並且反覆實行對被穿孔部nl〜n2〇之穿孔操作。 其間,於處理部22a、22b欲接近產生幹涉之情形時,藉 • 由含有顯微感測器3 1與擋塊32之近接檢測裝置之檢測,移 鲁動控制裝置40實行禁止處理部22a、22b進一步接近之控 制。其後’變為可避免幹涉之狀態後,再開始穿孔動作。 繼而’所有被穿孔部nl〜n2〇之穿孔結束後,程式前進至步 驟114結束。 一 如此,於該穿孔裝置Μ中,因固定工件w,且一面使處 - 理部22a、22b相對於該工件w各自獨立移動一面對被處理 " 部nl〜n20實行穿孔,故而可實行高效之處理。又,因此時 - 依據工件w之被處理部nl〜n20之相關穿孔資訊,算出處理 參 部22a、22b之最適之移動路徑,故而即使形成於工件貿之 被穿孔部η 1〜n2 0為不規則地配置,亦可實行高效之穿孔, 實現高速且高精度之處理。又,因穿孔裝置Μ設置有CCD 攝影機30、30a,故而可避免於被處理部nl〜n2〇與孔部2粍 等之間產生位置偏移,從而可實現高精度之處理。 進而,因牙孔I置Μ所具有之四個挾持爪部3 5 &等可移 動,故而可固定各種尺寸相異之工件。又,即使為含有如 工件W般容易彎曲之可擾性基板之薄片,亦可藉由適當之 99717-950331.doc -26 - 1279303 張力以拉伸為筆直之狀態而加以固定。藉此,可提昇處理 之精度。進而,安裝構件部2ia、21b之兩側部分,沿移動 方向突出地形成,故而於處理部22a、221)移動時難以產生 振動。因此,可對工件W實行高精度之處理。The processing units 22a and 22b set the time difference required for each of the f-hole portions ni to n2Q to be used for a specific value or less: 99717-950331.doc -23- 1279303, the specific value is preset and stored. In RAM39. Here, if the time difference of the processing is greater than the specific value, it is determined as "N〇" in step 1〇8, and the above processing is executed again before the program to step 1〇4. In this case: set and before The processing area obtained by the secondary processing is a different reinforcing area, and the moving (four) path is sought according to other rules, and the moving path obtained by repeating the processing is turned into a suitable one. For example, in the face 胄 average & In the case where the region is not 35 to obtain a suitable movement path, the division rule is changed so that the number of the perforated portions is equalized, and the perforated portion is formed by perforating the treatment portion 22a, and $ is perforated. Ten of the parts n1 to nl0 are set to be the perforated portions n11 to n2 of the perforated portions of the processing unit 22b. Then, in step 106, the processing is performed by the processing of the step 1〇4. In the set processing area, the processing of each of the processing units 22a and 22b is optimal. In this case, the time required for the processing unit 22a to punch the to-be-punched portion (four) is matched with the processing unit 22b. When the perforated portion nll~n2〇 is punched In the manner in which the time is close, the respective moving paths of the processing units 22a and 2 are sought. In addition, in step 108, based on the obtained moving path, it is determined that the processing units 22a and 22b are required to perform the punching. Whether the difference in processing time is equal to or less than a specific value. The coffee 37 repeats the processing of steps 1 () 4 and 1 () 6 until the processing time difference between the processing units 22a and 22b becomes a specific value or less, and is determined in step 1〇8. In the meantime, in the step ΠΜ, the division processing of the processing region is performed while changing the combination of the punched portions n11 to n20, and in step H)6, the calculation is obtained corresponding to the step 1〇4. The processing area shifts 997I7-95033I.doc -24-1279303 moving path. The difference between the processing time required for the processing of the processing units 22a and 22b becomes a specific value or less, and is determined in step 1〇8. In the case of YES, the program proceeds to step 110. In step 110, the process of determining the movement path when the determination is "YES" in step 108 is performed as the optimum movement path of each of the processing units 22a, 22b. Path data is stored in RAM3 9. In step u2, the processing units 22a, 22b are moved according to the movement path, and the offsets of the CCD cameras 3〇, 3〇a and the punches 27 & 28a are used corresponding to the diameter of the perforations. The punch 27&, 28a and the mold are moved to the punching position 'to perform the punching process. The punching is performed by the following method. First, the spindle motors i4a, 14b and the Y-axis motor 19a, In the operation of 19b, the processing units 22 & 2 are placed in the perforated portions as the starting points of the respective movement paths, for example, the perforated portion d and the perforated portion n20. Then, the corresponding perforated portions n1, n2 拍摄 are taken by the CCD cameras 3A, 3〇a. The image data is transferred to cpu37 for image processing and stored as location data in RAM 39. Then, based on the difference between the position data of the perforated portions n1 and n2 and the position data of the holes 24a and 25a (determined by the offset information), the spindle motor 14a or the like operates, for example, the hole portion 24a and the hole portion 24a thereof The positions of the corresponding perforated portions n丨 are identical. Further, the punch 27a is lowered by the action of the elevating mechanism 27, and the perforated portion n1 is perforated. Thereby, a hole having a hole diameter dl is bored at the position of the perforated portion n1. Similarly, the processing portion 22b also perforates the corresponding perforated portion n20, thereby forming a hole having a diameter d1. After the initial perforation is completed, the processing is 99917-950331.doc -25-1279303, and the portions 22a, 22b are each moved to the next perforated portion, for example, moved to the position of the perforated portion n2 and the perforated portion ni9 by the CCD camera 30. After confirming the positions of the to-be-punched portions n2 and nl9, 30a, the perforated portions n2 and ni9 are perforated. Further, the processing units 22a and 22b sequentially move along the movement path in accordance with the positions of the perforated portions n1 to n2, which are confirmed by the CCD cameras 30 and 30a, and repeatedly perform the punching operation for the to-be perforated portions n1 to n2. In the meantime, when the processing units 22a and 22b are to be close to the interference, the movement control device 40 executes the prohibition processing unit 22a by the detection of the proximity detecting device including the microscopic sensor 31 and the stopper 32. 22b is closer to the control. After that, it becomes a state in which interference can be avoided, and the punching operation is started again. Then, after the perforation of all the punched portions n1 to n2 is completed, the program proceeds to the end of step 114. In this way, in the perforating device, since the workpiece w is fixed and the processing portions 22a, 22b are independently moved with respect to the workpiece w, the perforation is performed on the processed portions nl to n20, so that it can be implemented. Efficient processing. Further, in this case, the optimum movement path of the processing reference portions 22a and 22b is calculated based on the related perforation information of the processed portions n1 to n20 of the workpiece w, so that the perforated portions η 1 to n2 0 formed in the workpiece trade are not Regularly configured, high-efficiency perforation can also be implemented to achieve high-speed and high-precision processing. Further, since the CCD cameras 30 and 30a are provided in the punching device, it is possible to avoid a positional shift between the processed portions n1 to n2 and the hole portion 2, and the like, thereby achieving high-precision processing. Further, since the four gripping claw portions 3 5 & or the like which are provided by the dental perforation I can be moved, workpieces having different sizes can be fixed. Further, even a sheet containing a disturbing substrate which is easily bent like the workpiece W can be fixed by stretching in a straight state by a suitable tension of 99717-950331.doc -26 - 1279303. This improves the accuracy of the process. Further, since the both side portions of the attachment member portions 2ia and 21b are formed to protrude in the movement direction, it is difficult to generate vibration when the treatment portions 22a and 221) move. Therefore, the workpiece W can be processed with high precision.

又,本發明之處理裝置以及處理方法,並非限定於上述 實施形態者,可實施適當之變更。例如,上述穿孔裝置m 設置有兩個處理部22a、22b,但該處理部以及用以使處理 部移動之移動機構亦可設定為三個以上。又,於各處理部 22a、22b之附近,除CCD攝影機3〇、3〇a之外,亦可設置 可自斜向拍攝被穿孔部nl〜n20之CCD攝影機。藉此,可進 一步提南被穿孔部nl〜n20之位置檢測之精度。 進而,於上述實施形態中,將工件臂設定為捲繞為滾筒 狀之可擾性基板,但既可設定其為藉由正方形或長方形之 長度較短之薄片狀而構成者,亦可設定其為藉由厚度較厚 之板狀物而構成者。又,代替穿&,亦可實行例如用以研 磨可擾性基板之接點部分之處理或剪切。於研磨之情形 時,安裝研磨用治具以代替處理部22a、22b,於剪切二情 形時,安裝固定切斷刀或旋轉切斷刀以代替處理部 22b。又,於本實施形態中實行有兩種檢查,即於生成&路 徑時之最優化之處理,以及實際之動作時藉由顯微感測器 3 1與擔塊3 2之檢測,但亦可藉由任一去 百 < 予法防止幹涉。 再者,於本實施形態中,係以加工結束之時間 斷之條件,但並非限定於此者。例如, # .、,θ 既可猎由移動路徑 長之呈疋否於特定範圍内而加以判斷, 丌了精由抑振動之 99717-950331.doc -27- 1279303 觀點而判斷,即作為各處理部22a、22b之移動方向以及時 序與特定次數以上不一致者,或最小者而判斷。又,於上 述實施形態中,作為處理裝置,就實行穿孔之穿孔裝置M 加以說明,但亦可將該處理裝置作為實行工件貿之導通檢 查之導通檢查裝置。於此情形時,使用導通檢查用之處理 部,代替穿孔裝置Μ之處理部22a、22b。又,本發明之處 理程式亦可於本發明之技術的範圍内進行適當之變更。 【圖式簡單說明】 圖1係表示本發明之一實施形態之穿孔裝置的平面圖。 圖2係於圖1所示之本發明之一實施形態的穿孔裝置之正 面圖。 圖3係於圖1所示之本發明之一實施形態的穿孔裝置之側 面圖。 圖4係擴大表示於圖3所示之本發明之一實施形態的穿孔 裝置之主要部分之側面圖。 圖5係表示使用於本發明之一實施形態之穿孔裝置的接 近檢測裝置之平面圖。 圖6係表示本發明之一實施形態之穿孔裝置所設置的各 個叙置以及控制其動作之移動控制裝置的方塊圖。 圖7係表示上述移動控制裝置所具有之cpu實行之程式 的流程圖。 圖8係表示形成有藉由本發明之一實施形態之穿孔裝置 所加工的被穿孔部之工件之平面圖。 【主要元件符號說明】 99717-950331.doc -28· 1279303Further, the processing apparatus and the processing method of the present invention are not limited to the above-described embodiments, and can be appropriately modified. For example, the perforating device m is provided with two processing units 22a and 22b, but the processing unit and the moving mechanism for moving the processing unit may be set to three or more. Further, in the vicinity of each of the processing units 22a and 22b, in addition to the CCD cameras 3A and 3〇a, a CCD camera capable of obliquely photographing the to-be-punched portions n1 to n20 may be provided. Thereby, the accuracy of the position detection of the south punched portions n1 to n20 can be further raised. Further, in the above-described embodiment, the workpiece arm is set to be a disturbing substrate wound in a roll shape, but it may be configured such that it is formed by a sheet having a short length of a square or a rectangle, and may be set. It is composed of a thicker plate. Further, instead of wearing &, processing or shearing, for example, for grinding the contact portion of the disturbing substrate may be carried out. In the case of polishing, the polishing jig is attached instead of the processing portions 22a and 22b, and in the case of shearing, the fixed cutting blade or the rotary cutting blade is attached instead of the processing portion 22b. Further, in the present embodiment, there are two types of inspections, that is, the process of optimizing the generation of the & path, and the detection of the micro-sensor 31 and the load block 3 in the actual operation, but also You can prevent interference by either going to the hundred. Further, in the present embodiment, the condition is such that the processing is completed, but the present invention is not limited thereto. For example, # ., θ can be judged by whether the moving path is long or not within a certain range, and is judged by the viewpoint of 9917-950331.doc -27-1279303 The movement direction and timing of the portions 22a and 22b do not match the specific number of times or more, or the smallest one is determined. Further, in the above-described embodiment, the perforating device M for perforating is described as the processing device. However, the processing device may be used as a conduction inspection device for performing the continuity inspection of the workpiece. In this case, the processing unit for conduction inspection is used instead of the processing units 22a and 22b of the punching device. Further, the present invention can be appropriately modified within the scope of the technology of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a perforating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing a perforating apparatus according to an embodiment of the present invention shown in Fig. 1. Figure 3 is a side elevational view of the perforating apparatus of one embodiment of the present invention shown in Figure 1. Fig. 4 is a side elevational view showing the main part of the perforating apparatus showing an embodiment of the present invention shown in Fig. 3; Fig. 5 is a plan view showing the proximity detecting device of the perforating device used in an embodiment of the present invention. Fig. 6 is a block diagram showing the arrangement of the perforating device according to the embodiment of the present invention and the movement control device for controlling the operation thereof. Fig. 7 is a flow chart showing a routine executed by the CPU of the above mobile control device. Fig. 8 is a plan view showing a workpiece formed by a perforated portion processed by a perforating device according to an embodiment of the present invention. [Main component symbol description] 99717-950331.doc -28· 1279303

99717-950331.doc ίο 15 20 23 24, 25 26 27, 28, 41,42 29 31 32 36 37 38 39 40 11a,lib 12a,12b 13a,13b 14a,14b 15a, 15b 16a,16b 17a,17b 18a,18b 19a,19b 基台 支持構件 本體部 工件插通孔 模具 孔部 升降機構 收容部 顯微感測器 擔塊99717-950331.doc ίο 15 20 23 24, 25 26 27, 28, 41, 42 29 31 32 36 37 38 39 40 11a, lib 12a, 12b 13a, 13b 14a, 14b 15a, 15b 16a, 16b 17a, 17b 18a , 18b 19a, 19b abutment support member body portion workpiece insertion hole die hole portion lifting mechanism housing portion microsensor load block

輸入裝置 CPU ROM RAM 移動控制裝置 X軸軌道 移動支持台 螺桿軸 X軸馬達 旋轉支持軸 伸展滾筒 Y軸執道 螺桿軸 γ轴馬達 -29- 1279303 21a,21b 22a,22b 2 4 a,2 5 a 27a,28a 30, 30a 35a, 35b, 35c, 35dInput device CPU ROM RAM Movement control device X-axis orbital movement support table screw shaft X-axis motor rotation support shaft extension roller Y-axis road screw shaft γ-axis motor -29- 1279303 21a, 21b 22a, 22b 2 4 a, 2 5 a 27a, 28a 30, 30a 35a, 35b, 35c, 35d

FF

MM

安裝構件 處理部 孔部 衝頭 CCD攝影機 挾持爪部 地面 穿孔裝置 工件 -30- 99717-950331.docMounting member Treatment section Hole punch Punch CCD camera Holder claw Ground Perforation device Workpiece -30- 99717-950331.doc

Claims (1)

1279303 十、申請專利範圍: : L 一種處理裝置,其特徵在於含有: ^ °又置有用以固定具有複數個被處理部之薄片 狀或板狀之工件的固定部; 複數個處理部,其可移動地設置於上述基台; 輸入衣置其用以輸入關於上述複數個被處理部之處 理資訊;及 移動控制裝置,其由輸入至上述輸入裝置之關於複數 • 個被處理部之處理資訊算出上述複數個處理部之各自最 適合之移動㈣,按照其計算結果,—面使上述複數個 處理部各自獨立移動—面對上述工件之被處理部實施處 理。 月求員1之處理裝置,其中於上述處理部附近設置與 - 上述處理部一同移動之位置檢測裝置,依據上述位置檢 ㈣置檢測出t上述被處理部的位S,上述處理部移動 - 而對上述工件實施處理。 • 3.如請求項!或2之處理裝置,其中經由沿移動方向較長形 成之縱框狀安裝構件,將上述處理部安裝於上述基台, 並且上述處理部設置於上述安裝構件之中央部。 4·如請求項1或2之處理裝置,其中於上述複數個處理部或 分別安裝有上述複數個處理部而相對於上述基台移動之 部为,设置用以檢測相互接近之接近檢測裝置,上述接 近檢測裝置檢測出上述處理部彼此接近,則藉由上述移 動控制裝置之控制,防止上述處理部彼此再接近。 99717-950331.doc 1279303 5.如=項3之處理裝置,其中於上述複數個處理部或分 八〗安衣有上述複數個處理部而相對於上述基台移動之部 刀叹置用以檢測相互接近之接近檢測裝置,上述接近 檢測裝置檢測出上述處理部彼此接近,則藉由上述移動 控制裝置之控制,防止上述處理部彼此再接近。 6. 如請:項1或2之處理裝置,其中上述處理部以含有衝頭 :及拉具之金屬模具構成,支持上述金屬模具之支持構 以上述金屬模具為中心,自不同之複數個方向進行支 持。 7. 如請求項3之處理裝置,其中上述處理部以含有衝頭以 及挺具之金屬模具構成,支持上述金屬模具之支持構件 以上述金屬模具為中心,自不同之複數個方向進行支 持。 8. ::求項4之處理裝置,其中上述處理部以含有衝頭以 及权具之金屬模具構成,支持上述金屬模具之支 以上述金屬模具為中心,自不同之複數個方向進行支 持。 9. 種處理裝置’其特徵在於:其係將具有複數個被處理 部之溥片狀或板狀之工件固定於基台,藉由移動控制裝 置之控制而對上述工件實施處理者,上述移動控制裝置 係使可移動地設置於上述其二 置於上这基口的稷數個處理部依據上述 稷數個被處理部之處理資訊而動作;且 上述移動控制裝置含有: 處理區域分割機構,其根據所輸入之處理資訊,分割 99717-950331.doc 1279303 . 1述複數個處理部分別對上述卫件實行處理之區域; :㈣路徑算出機構’其算出由上述處理區域分割機構 所分割之於各處理區域之各處理部的移動路徑; 判定機構’其判定由上述移動路徑算出機構所算出之 各移動路徑是否為滿足所預先設定之特定條件者·及 、、處理機構’其根據由上述判定機構所被判定為滿足上 述特&條件之各移動路徑,—面使各個處理部獨立移動 一面對上述工件之被處理部實施處理。 籲10· -種印刷基板之製造方法,其特徵在於:其係使用具有 基台、可移動地設置於上述基台之複數個處理部及根據 特定之處理資訊而控制上述複數個處理部之動作的移動 控制裝置之處理裝置,對上述印刷基板實施處理者,上 • 述基台設置有用以固定具有複數個被處理部之薄片狀或 板狀之印刷基板的固定部;且含有: 口疋’其於上述基台上固定上述印刷基板; 輸入步驟,其輸入關於上述複數個被處理部之處理資 ⑩訊; 移動路徑异出步驟,其根據藉由上述輸入步驟所輸入 之處理資訊算出上述複數個處理部之各自最適合之移動 路徑;及 處理步驟’其按照藉由上述移動路徑算出步驟所算出 之結果,一面使上述複數個處理部各自獨立移動一面對 上述印刷基板之被處理部實施處理。 11·如請求項10之印刷基板之製造方法,其中藉由使上述複 99717-950331.doc 1279303 個處理部之各處理部對上述印刷基板實施處理時所需 要之時間’上述各處理部對上述印刷基板實施處理時之 路彼長度或上述各處理部實施處理之被處理部之數量均 勻化,實行於上述移動赵^ 秒勁路徑异出步驟之移動路徑之算1279303 X. Patent application scope: L A processing device characterized by comprising: ^ ° and a fixing portion for fixing a workpiece having a plurality of sheet-like or plate-like portions of a processed portion; a plurality of processing portions, Movably disposed on the base station; the input device is configured to input processing information about the plurality of processed portions; and the movement control device is calculated by processing information about the plurality of processed portions input to the input device The most suitable movement (4) of each of the plurality of processing units is such that the plurality of processing units are independently moved in accordance with the calculation result, and the processed portion facing the workpiece performs processing. The processing device of the monthly requester 1 is provided with a position detecting device that moves together with the processing unit in the vicinity of the processing unit, and detects the bit S of the processed portion based on the position detection (four), and the processing unit moves - The above workpiece is processed. 3. The processing apparatus of claim 2 or 2, wherein the processing unit is attached to the base via a vertical frame-shaped mounting member formed long in the moving direction, and the processing unit is disposed at a central portion of the mounting member . 4. The processing device according to claim 1 or 2, wherein the plurality of processing units or the plurality of processing units respectively mounted on the plurality of processing units and moving relative to the base station are provided with proximity detecting means for detecting mutual proximity When the proximity detecting means detects that the processing units are close to each other, the processing unit prevents the processing units from approaching each other again under the control of the movement control device. The processing device of claim 3, wherein the plurality of processing units or the plurality of processing units are disposed in the plurality of processing units or the plurality of processing units are slid with respect to the moving portion of the base station for detecting The proximity detecting means that is close to each other, and the proximity detecting means detects that the processing sections are close to each other, and the control means prevents the processing sections from coming back to each other by the control of the movement control means. 6. The processing device of item 1 or 2, wherein the processing unit is formed by a metal mold including a punch and a puller, and the support structure supporting the metal mold is centered on the metal mold, and is different from a plurality of directions. Support. 7. The processing apparatus according to claim 3, wherein the processing unit is formed of a metal mold including a punch and a ejector, and the supporting member for supporting the metal mold is supported from a plurality of directions in a plurality of directions centering on the metal mold. 8. The processing apparatus of claim 4, wherein the processing unit is formed of a metal mold including a punch and a holder, and supports the metal mold to support the metal mold as a center and supports the plurality of directions. 9. A processing apparatus characterized in that: a workpiece having a plurality of processed portions in a meandering shape or a plate shape is fixed to a base, and the workpiece is processed by a movement control device, the movement The control device is configured to operate the plurality of processing units movably disposed on the base port and to operate according to the processing information of the plurality of processed portions; and the movement control device includes: a processing region dividing mechanism; According to the input processing information, the segmentation 99917-950331.doc 1279303. 1 describes a region in which the processing unit performs processing on the widget; (4) the path calculation mechanism 'calculates the segmentation by the processing region segmentation mechanism a movement path of each processing unit in each processing area; a determination unit that determines whether each of the movement paths calculated by the movement path calculation means is a predetermined condition that satisfies a predetermined condition, and a processing means' The movement path determined by the mechanism to satisfy the above-mentioned special conditions, the surface is caused to move independently by each processing unit. Embodiment processing unit to be processed of said workpiece. A method of manufacturing a printed circuit board, comprising: using a plurality of processing units having a base and movably provided on the base; and controlling the plurality of processing units based on specific processing information The processing device for the movement control device is configured to perform processing on the printed circuit board, and the base is provided with a fixing portion for fixing a printed circuit board having a plurality of processed portions in a sheet shape or a plate shape; and includes: And fixing the printed circuit board on the base; the inputting step of inputting the processing information about the plurality of processed parts; and the moving path releasing step, calculating the plural according to the processing information input by the inputting step a processing path that is optimal for each of the processing units; and a processing step of causing the plurality of processing units to independently move one of the processing units facing the printed circuit board according to the result calculated by the moving path calculation step deal with. The method of manufacturing a printed circuit board according to claim 10, wherein the processing unit is configured to process the printed circuit board by the processing unit of the processing unit of the 99717-950331.doc The length of the printed circuit board during processing or the number of processed portions to be processed by each of the processing units is equalized, and the calculation is performed on the moving path of the moving step. 12.12. 種印刷基板之生產方法,其特徵在於:其係將具有複 數個被處理部之薄片狀或板狀之印刷基板固定於基台, 藉由移動控制裝置之;丨&慰L 直炙栓制而對上述印刷基板實施處理 者,上述移動控制裝置係使可移動地設置於上述基台之 複數個處理部依據上述複數個被處理部之處理資訊而動 作;且 上述移動控制裝置實行之控制步驟含有·· 處理區域分割步驟,其根據所輸入之處理資訊,分割 上述複數個處理部分別對上料刷基板實行處理之區 域; 移動路徑算出步驟,其算出於上述處理區域分割步驟 所刀割之於各個處理區域之各處理部的移動路徑; 判定步驟,其判定於上述移動路徑算出步驟所算出之 各移動路徑是否滿足所預先設定之特定條件;及 處理步驟,其根據於上述判定步驟被判定為滿足上述 特疋條件之各移動路徑,一面使各個處理部獨立移動一 面對上述印刷基板之被處理部實施處理。 13.如請求項12之印刷基板之生產方法,其中依據使上述複 數個處理部之各處理部對上述印刷基板實施處理時所需 99717-950331.doc 1279303 要之時間,上述各處理部對上述印刷基板實施處理時之 路徑長度或上述各處理部實施處理之被處理冑之數量均 勻化,實行於上述處理區域分割步驟之處理區域之分 割。 14·如請求項12或13之印刷基板之生產方法,其中依據上述 複數個處理部之抑振動作、最短動作或最適合速度,實 行於上述移動路徑算出步驟之移動路徑之算出。 15. 如請求項12或13之印刷基板之生產方法,其中上述複數 個處理部實行之處理為穿孔。 16. 如請求項14之印刷基板之生產方法,其中上述複數個處 理部實行之處理為穿孔。 17· —種記錄處理程式之記錄媒體,該處理程式之特徵在 於:其係將具有複數個被處理部之薄片狀或板狀之工件 固定於基台,藉由移動控制裝置之控制而對上述工件實 施處理者,上述移動控制裝置係使可移動地設置於上述 基台之複數個處理部依據上述複數個被處理部之處理資 訊而動作; 且含有: 處理資訊讀入步驟,其讀入關於上述複數個被處理部 之處理資訊; 處理區域分割步驟,其根據於上述處理資訊讀入步驟 所項入之處理資訊,分割上述複數個處理部分別對上述 工件實行處理之區域; 移動路徑算出步驟,其算出於上述處理區域分割步驟 99717-950331.doc 1279303 所分割之於各個處理區域之各處理部的移動路徑·, 判定步驟,其判定於上述移動路徑算出步驟所算出之 各移動路徑是否為最適合移動路徑;及 處理步驟’其根據於上述判定步驟被判定為最適合移 路&之各移動路控,一面使各個處理部獨立移動一面 對上述工件之被處理部實施處理。A method for producing a printed circuit board, which is characterized in that a printed circuit board having a plurality of processed portions in a sheet shape or a plate shape is fixed to a base by a movement control device; 丨 & Further, in the case of processing the printed circuit board, the movement control device operates a plurality of processing units movably provided on the base station in accordance with processing information of the plurality of processed portions; and the control step executed by the mobile control device a processing area dividing step of dividing a region in which the plurality of processing units respectively perform processing on the upper brush substrate based on the input processing information; and a moving path calculating step of calculating a cutting step in the processing area dividing step a moving path of each processing unit in each processing area; a determining step of determining whether each of the moving paths calculated by the moving path calculating step satisfies a predetermined specific condition; and a processing step of determining according to the determining step Each processing unit is made to satisfy each of the above-described special conditions Mobile stand facing a portion to be processed of the printed wiring board processing embodiment. The method of producing a printed circuit board according to claim 12, wherein each of the processing units is configured according to a time required for each processing unit of the plurality of processing units to perform processing on the printed circuit board: 99917-950331.doc 1279303 The path length at the time of performing the processing on the printed circuit board or the number of processed ridges to be processed by each of the processing units is equalized, and is performed in the processing region of the processing region dividing step. The method of producing a printed circuit board according to claim 12 or 13, wherein the calculation of the movement path of the moving path calculation step is performed based on the vibration suppression, the shortest operation, or the optimum speed of the plurality of processing units. 15. The method of producing a printed circuit board according to claim 12, wherein the processing performed by the plurality of processing units is a punch. 16. The method of producing a printed substrate according to claim 14, wherein the processing performed by the plurality of processing units is a perforation. 17. A recording medium for recording a processing program, wherein the processing program is characterized in that a sheet-like or plate-shaped workpiece having a plurality of processed portions is fixed to a base, and the above is controlled by a movement control device. In the workpiece execution processor, the movement control device operates a plurality of processing units movably provided on the base station in accordance with processing information of the plurality of processed portions; and includes: a processing information reading step in which the reading is performed Processing information of the plurality of processed parts; a processing area dividing step of dividing the processing area for processing the workpiece by the plurality of processing units based on the processing information of the processing information reading step; And calculating a movement path of each processing unit divided into the respective processing areas in the processing area dividing step 99917-950331.doc 1279303, and determining a path for determining whether each moving path calculated by the moving path calculating step is Most suitable for moving paths; and processing steps 'which are based on the above decision steps It is determined that it is most suitable for each of the movements of the path & the processing unit of the workpiece is processed while the respective processing units are independently moved. 99717-950331.doc 1279303 七、指定代表圖: (一) 本案指定代表圖為:第(1 )圖。 (二) 本代表圖之元件符號簡單說明:99717-950331.doc 1279303 VII. Designated representative map: (1) The representative representative of the case is: (1). (2) A brief description of the symbol of the representative figure: 10 基台 15 支持構件 20 本體部 11a, lib X軸執道 12a, 12b 移動支持台 13a, 13b 螺桿軸 14a, 14b X軸馬達 15a, 15b 旋轉支持軸 19a, 19b Y軸馬達 21a, 21b 安裝構件 22a, 22b 處理部 30, 30a CCD攝影機 35a, 35b,35c,35d 挾持爪部 M 穿孔裝置 W 工件 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無) 99717-950331.doc10 base 15 support member 20 body portion 11a, lib X-axis way 12a, 12b moving support table 13a, 13b screw shaft 14a, 14b X-axis motor 15a, 15b rotation support shaft 19a, 19b Y-axis motor 21a, 21b mounting member 22a, 22b Processing unit 30, 30a CCD camera 35a, 35b, 35c, 35d Holding claw part M Perforating device W Workpiece 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (none) 99717-950331. Doc
TW094117276A 2004-05-31 2005-05-26 Processing apparatus, method for producing printed circuit board, and processing program TWI279303B (en)

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JP2004162633A JP4514519B2 (en) 2004-05-31 2004-05-31 Printed circuit board production method, processing apparatus, and processing program
JP2004162632A JP4544911B2 (en) 2004-05-31 2004-05-31 Processing apparatus and printed circuit board production method

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