JP4544911B2 - Processing apparatus and printed circuit board production method - Google Patents

Processing apparatus and printed circuit board production method Download PDF

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JP4544911B2
JP4544911B2 JP2004162632A JP2004162632A JP4544911B2 JP 4544911 B2 JP4544911 B2 JP 4544911B2 JP 2004162632 A JP2004162632 A JP 2004162632A JP 2004162632 A JP2004162632 A JP 2004162632A JP 4544911 B2 JP4544911 B2 JP 4544911B2
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processing
circuit board
printed circuit
processing unit
workpiece
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JP2005342813A (en
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徹 石井
卓也 原
伊藤  猛
敬一郎 笹岑
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Yamaha Fine Technologies Co Ltd
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Priority to CN 200520012467 priority patent/CN2862133Y/en
Priority to KR1020050044991A priority patent/KR100681295B1/en
Priority to CN 200510075976 priority patent/CN1704859B/en
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Description

本発明は、複数の被処理部を備えたシート状や板状のワークに穿孔等の処理を施すための処理装置およびプリント基板の生産方法に関する。   The present invention relates to a processing apparatus and a printed circuit board production method for performing processing such as perforation on a sheet-like or plate-like workpiece having a plurality of parts to be processed.

従来から、フレキシブル基板等のシート状のワークに所定形状の穴を打ち抜く場合、上面に孔部が穿設されたダイと、このダイに対して昇降可能でダイの孔部に挿入可能なパンチとからなる金型を備えた穿孔装置が用いられている。そして、このような穿孔装置で穿孔加工されるワークには、打ち抜き位置を示す被穿孔部が設けられており、この被穿孔部と孔部を一致させた状態でパンチを下降させることにより穿孔加工が行われる(例えば、特許文献1参照)。
特許第3204236号公報
Conventionally, when punching a hole of a predetermined shape in a sheet-like workpiece such as a flexible substrate, a die having a hole formed in the upper surface, and a punch that can be moved up and down relative to the die and inserted into the hole of the die A perforating apparatus having a mold made of the above is used. A workpiece to be punched by such a punching device is provided with a punched portion indicating a punching position, and the punch is lowered by lowering the punch in a state where the punched portion and the hole are aligned. (For example, refer to Patent Document 1).
Japanese Patent No. 3204236

しかしながら、前述した穿孔装置では、金型が1個だけ設けられているため、ワークに形成された被穿孔部の数が多数の場合には、穿孔加工に長時間を要するという問題がある。また、金型を複数個設けて複数の被穿孔部に同時に穿孔加工ができる穿孔装置も開発されている。しかしながら、従来のこのような穿孔装置は、複数の被穿孔部が一定間隔に配置された同一パターンが複数形成されたワークの穿孔加工を行うように構成されており、不規則に多数の被穿孔部が形成されたワークの穿孔加工はできないという問題を有している。   However, since the above-described punching device is provided with only one die, there is a problem that it takes a long time for the punching process when the number of punched portions formed on the workpiece is large. In addition, a drilling apparatus has been developed that can provide a plurality of molds and can simultaneously drill a plurality of drilled parts. However, such a conventional drilling device is configured to perform drilling of a workpiece formed with a plurality of identical patterns in which a plurality of drilled portions are arranged at regular intervals, and a large number of drilled holes irregularly. There is a problem that drilling of a workpiece formed with a portion cannot be performed.

本発明は、前述した問題に対処するためになされたもので、その目的は、複数の被処理部が形成されたワークに所定の処理を効率よく施すことのできる処理装置およびプリント基板の生産方法を提供することである。   The present invention has been made to cope with the above-described problems, and an object of the present invention is to provide a processing apparatus and a printed circuit board production method capable of efficiently performing a predetermined process on a work on which a plurality of processed parts are formed. Is to provide.

前述した目的を達成するため、本発明に係る処理装置の構成上の特徴は、基台の上面に移動可能に設置されX軸方向に貫通しY軸方向に長く延びるワーク挿通孔を有する縦枠状の一対の取付部材と、一対の取付部材のワーク挿通孔を通る複数の被処理部を備えたシート状または板状のワークを固定するための固定部と、取付部材の上部中央に設置されたパンチと、取付部材の下部中央に設置されたダイとを有する金型で構成され、取付部材の長手方向の両側で支持された複数の処理部と、複数の被処理部に関する処理情報を入力するための入力装置と、入力装置に入力された複数の処理部の各処理部がプリント基板に処理を施す際に要する時間、各処理部がプリント基板に処理を施す際の経路の長さ、または各処理部が処理を施す被処理部の数を均一化させることによって複数の処理部のそれぞれの移動経路を算出し、その算出結果に応じて、複数の処理部をそれぞれ独立して移動させながらワークの被処理部に処理を施す移動制御装置とを備えたことにある。 In order to achieve the above-described object, a structural feature of the processing apparatus according to the present invention is that a vertical frame having a workpiece insertion hole that is movably installed on the upper surface of the base and extends in the X-axis direction and extends in the Y-axis direction. A pair of mounting members, a fixing portion for fixing a sheet-like or plate-like workpiece having a plurality of processed parts passing through the workpiece insertion holes of the pair of mounting members, and an upper center of the mounting member. Processing information on a plurality of processing parts, and a plurality of processing parts supported by both sides in the longitudinal direction of the mounting member, and a die having a punch and a die installed in the lower center of the mounting member. Input device for input, the time required for each processing unit of the plurality of processing units input to the input device to process the printed circuit board, and the length of the path when each processing unit processes the printed circuit board Or of each part to be processed Calculates the respective movement path of the processing unit of the multiple by homogenizing the, according to the calculation result, independently movement control processes the portion to be processed of the workpiece while moving a plurality of processing units to With the device.

このように構成した処理装置では、ワークを固定部で固定し、そのワークに対して複数の処理部をそれぞれ独立して移動させながら各処理部でそれぞれワークの所定の被処理部に処理を施すようにしている。また、その際、ワークに設けられた複数の被処理部に関する処理情報から、各処理部が被処理部に処理を施すために移動する経路が最適になるようにしてその移動経路を算出するようにしている。したがって、ワークに対して効率のよい処理を施すことができ、高速かつ高精度な処理の実現ができる。   In the processing apparatus configured as described above, a workpiece is fixed by a fixing unit, and each processing unit performs processing on a predetermined processing target portion of the workpiece while moving a plurality of processing units independently with respect to the workpiece. I am doing so. At that time, from the processing information related to the plurality of processed parts provided in the workpiece, the moving path is calculated so that each processing part moves optimally to process the processed part. I have to. Therefore, efficient processing can be performed on the workpiece, and high-speed and high-precision processing can be realized.

また、ワークに設けられた複数の被処理部は、一定の間隔を保って規則的に並んだものに限らず、不規則に設けられた複数のものでもよい。本発明に係る処理装置においては、被処理部が不規則に並んでいても、各被処理部に関する処理情報から各処理部の最適な移動経路を算出し、その算出結果に応じて各処理部が移動するため適正な処理が行える。また、移動制御装置が算出する最適な移動経路は、種々のものを基準として求めることができる。例えば、各処理部が被処理部の処理に要する時間、各処理部が被処理部に処理を施す際の経路の長さ、および各処理部による被処理部の処理数等用いることができ、各処理部の処理が均一になる場合を最適な移動経路として求める。   Further, the plurality of processing parts provided on the workpiece are not limited to those regularly arranged with a constant interval, and may be a plurality of parts provided irregularly. In the processing apparatus according to the present invention, even when the processing target units are irregularly arranged, the optimal movement path of each processing unit is calculated from the processing information related to each processing target unit, and each processing unit is determined according to the calculation result. Can move properly. In addition, the optimum movement route calculated by the movement control device can be obtained based on various routes. For example, the time required for each processing unit to process the processing target, the length of the path when each processing unit performs processing on the processing target, the number of processing of the processing target by each processing unit, etc. can be used. A case where the processing of each processing unit is uniform is obtained as an optimal movement path.

また、本発明に係る処理装置の他の構成上の特徴は、処理部の近傍に、処理部とともに移動する位置検出装置を設けて、位置検出装置が検出した被処理部の位置に基づいて処理部が移動してワークに処理を施すようにしたことにある。この場合の位置検出装置としては、カメラやセンサ等を用いることができる。これによると、被処理部の位置を位置検出装置で正確に検出したのちに処理部による処理を行える。このため、被処理部と、処理部が実際に処理を施す部分との間に位置ずれが生じなくなり、精度のよい処理が可能になる。   Further, another structural feature of the processing apparatus according to the present invention is that a position detection device that moves together with the processing unit is provided in the vicinity of the processing unit, and processing is performed based on the position of the processing target detected by the position detection device. This is because the part has moved to process the workpiece. In this case, a camera, a sensor, or the like can be used as the position detection device. According to this, processing by the processing unit can be performed after the position of the processing target portion is accurately detected by the position detection device. For this reason, position shift does not occur between the processing target part and the part where the processing part actually performs processing, and high-precision processing becomes possible.

また、本発明に係る処理装置では、処理部を、移動方向に沿って長く形成された縦枠状の取付部材を介して基台に取り付け、かつ処理部が取付部材の中央部に設置されている。これによると、処理部が、基台に移動可能に設置された取付部材に取り付けられ、その処理部の移動方向に沿った両側に取付部材の両側部分が延びるようになる。この取付部材の両側部分が振動防止用の突部として作用するようになるため、処理部を取付部材とともに移動させてワークに対して所定の処理を行う場合に、処理部に振動が生じ難くなる。このため、ワークに対して精度のよい処理が行える。 Further, the processing equipment according to the present invention, the processing unit, attached to the base via a vertical frame-shaped attachment member is formed to extend in the moving direction, and the processing unit is placed in the center portion of the attachment member Tei Ru. According to this, the processing unit is attached to the mounting member that is movably installed on the base, and both side portions of the mounting member extend on both sides along the moving direction of the processing unit. Since both side portions of the mounting member act as projections for preventing vibration, when the processing unit is moved together with the mounting member to perform a predetermined process on the workpiece, the processing unit is less likely to vibrate. . For this reason, accurate processing can be performed on the workpiece.

また、本発明に係る処理装置のさらに他の構成上の特徴は、複数の処理部または複数の処理部がそれぞれ取り付けられて基台に対して移動する部分に、互いに接近したことを検出するための接近検出装置を設けて、接近検出装置が処理部同士が接近したことを検出すると、移動制御装置の制御により処理部同士がそれ以上接近しないようにしたことにある。これによると、処理部同士または処理部を支持する部材同士が衝突して破損したり、干渉しあって処理の精度が悪くなったりすることを防止できる。   Further, still another structural feature of the processing apparatus according to the present invention is to detect that a plurality of processing units or a plurality of processing units are attached to each other and move toward the base, respectively. When the proximity detection device detects that the processing units have approached each other, the processing units are prevented from approaching further by the control of the movement control device. According to this, it is possible to prevent the processing units or members supporting the processing unit from colliding with each other and being damaged, or interfering with each other to deteriorate the processing accuracy.

また、本発明に係る処理装置では、処理部は、パンチとダイを有する金型で構成している。これによると、孔部を備えたダイとパンチとの間にワークを固定し、ダイとパンチとを互いに接近させて孔部にパンチを挿入することにより穿孔が行える。 Further, the processing equipment according to the present invention, the processing unit is constituted by a mold having a punch and a die. According to this, a work can be fixed between a die provided with a hole and a punch, and punching can be performed by bringing the die and the punch close to each other and inserting the punch into the hole.

本発明に係るプリント基板の生産方法の構成上の特徴は、基台の上面に移動可能に設置されX軸方向に貫通しY軸方向に長く延びるワーク挿通孔を有する縦枠状の一対の取付部材と、一対の取付部材のワーク挿通孔を通る複数の被処理部を備えたシート状または板状のプリント基板を固定するための固定部と、取付部材の上部中央に設置されたパンチと、取付部材の下部中央に設置されたダイとを有する金型で構成され、取付部材の長手方向の両側で支持された複数の処理部と、所定の処理情報に基づいて複数の処理部の作動を制御する移動制御装置とを備えた処理装置を用いて、プリント基板に処理を施すためのプリント基板の生産方法であって、プリント基板を固定する固定工程と、複数の被処理部に関する処理情報を入力する入力工程と、入力工程で入力された処理情報から複数の処理部のそれぞれの移動経路を算出する移動経路算出工程と、移動経路算出工程で算出された結果に応じて、複数の処理部をそれぞれ独立して移動させながらプリント基板の被処理部に処理を施す処理工程とを備え、移動経路算出工程における移動経路の算出を、複数の処理部の各処理部がプリント基板に処理を施す際に要する時間、各処理部がプリント基板に処理を施す際の経路の長さ、または各処理部が処理を施す被処理部の数を均一化させることによって行うことにある。 A structural feature of the printed circuit board production method according to the present invention is that a pair of vertical frame-shaped attachments having a workpiece insertion hole that is movably installed on the upper surface of the base and extends in the X-axis direction and extends in the Y-axis direction. A fixing part for fixing a member, a sheet-like or plate-like printed circuit board having a plurality of processed parts passing through the workpiece insertion holes of the pair of attachment members, and a punch installed at the upper center of the attachment member, A plurality of processing units configured by a die having a die installed at the lower center of the mounting member and supported on both sides in the longitudinal direction of the mounting member, and operations of the plurality of processing units based on predetermined processing information A printed circuit board production method for performing processing on a printed circuit board using a processing apparatus including a movement control device for controlling the process, and a fixing process for fixing the printed circuit board, and processing information on a plurality of processing parts Input process to input , A movement route calculation step for calculating each movement route of the plurality of processing units from the processing information input in the input step, and a plurality of processing units independently according to the result calculated in the movement route calculation step A processing step of performing processing on the processing target portion of the printed circuit board while moving, and calculating the movement path in the movement path calculation step, the time required for each processing unit of the plurality of processing units to process the printed circuit board, This is done by equalizing the length of the path when each processing unit performs processing on the printed circuit board, or the number of processing target units that each processing unit performs processing.

これによると、プリント基板に対する処理を効率よく行える。また、この場合、処理部がプリント基板に対して施す処理を穿孔や導通検査とすることができる。さらに、移動経路算出工程における移動経路の算出を、複数の処理部の各処理部がプリント基板に処理を施す際に要する時間、各処理部がプリント基板に処理を施す際の経路の長さ、または各処理部が処理を施す被処理部の数を均一化させることによって行うことができる。これによると、処理装置が処理部を2個備えていれば、処理部が1個の場合よりも大幅に全体の処理時間、1個の処理部による処理数、1個の処理部による処理に要する移動距離を短縮または減少させることができる。さらに、処理装置が処理部を3個またはそれ以上備えていれば、さらに効率のよい処理が可能になる。   According to this, the process with respect to a printed circuit board can be performed efficiently. In this case, the processing performed by the processing unit on the printed circuit board can be perforation or continuity inspection. Further, the calculation of the movement path in the movement path calculation step is the time required for each processing unit of the plurality of processing units to process the printed circuit board, the length of the path when each processing unit processes the printed circuit board, Or it can carry out by equalizing the number of to-be-processed parts which each process part processes. According to this, if the processing apparatus has two processing units, the total processing time, the number of processes by one processing unit, and the processing by one processing unit are much larger than when one processing unit is provided. The required travel distance can be shortened or reduced. Furthermore, if the processing apparatus includes three or more processing units, more efficient processing is possible.

以下、本発明の一実施形態を図面を用いて説明する。図1ないし図3は本発明に係る処理装置としての穿孔装置Mを示している。この穿孔装置Mは、床面F上に設置される基台10と、基台10の上部に設けられた装置本体部20等を備えている。基台10の上面には、X軸方向(図1および図2の左右方向)に延びる一対のX軸レール11a,11bが間隔を保って平行に設置されている。そして、このX軸レール11a,11b上に、Y軸方向(水平面上でX軸に直交する方向)が長くなった2個の移動支持台12a,12bがそれぞれ掛け渡されて、X軸レール11a,11bに沿って移動可能になっている。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 to 3 show a perforation apparatus M as a processing apparatus according to the present invention. The perforating apparatus M includes a base 10 installed on the floor surface F, an apparatus main body 20 provided on the upper part of the base 10, and the like. On the upper surface of the base 10, a pair of X-axis rails 11 a and 11 b extending in the X-axis direction (the left-right direction in FIGS. 1 and 2) are installed in parallel with a distance therebetween. Then, on the X-axis rails 11a and 11b, two moving support bases 12a and 12b each having a longer Y-axis direction (a direction perpendicular to the X-axis on the horizontal plane) are respectively spanned, and the X-axis rail 11a , 11b.

また、X軸レール11a,11b間には、X軸レール11a,11bと平行してねじ軸13a,13bが設置されている。そして、ねじ軸13aにおける図1および図2の右側端部に、ねじ軸13aを軸回り方向に回転させるためのX軸モータ14aが連結され、ねじ軸13bにおける図1および図2の左側端部に、ねじ軸13bを軸回り方向に回転させるためのX軸モータ14bが連結されている。   In addition, screw shafts 13a and 13b are installed between the X-axis rails 11a and 11b in parallel with the X-axis rails 11a and 11b. An X-axis motor 14a for rotating the screw shaft 13a in the direction around the axis is connected to the right end portion of the screw shaft 13a in FIGS. 1 and 2, and the left end portion of the screw shaft 13b in FIGS. Further, an X-axis motor 14b for rotating the screw shaft 13b in the direction around the axis is coupled.

移動支持台12aは、X軸モータ14aの駆動によって回転するねじ軸13aに連結され、X軸モータ14aの駆動によって、図1におけるX軸レール11a,11bの左側端部から移動支持台12bの手前側部分までの間をX軸レール11a,11bに沿って移動する。また、移動支持台12bは、X軸モータ14bの駆動によって回転するねじ軸13bに連結され、図1におけるX軸レール11a,11bの右側端部から移動支持台12aの手前側部分までの間をX軸モータ14bの駆動によって、X軸レール11a,11bに沿って移動する。   The movement support base 12a is connected to a screw shaft 13a that rotates by driving of the X-axis motor 14a, and from the left end of the X-axis rails 11a and 11b in FIG. 1 before the movement support base 12b by driving of the X-axis motor 14a. It moves along the X-axis rails 11a and 11b between the side portions. The movement support base 12b is connected to a screw shaft 13b that is rotated by driving of the X-axis motor 14b, and extends from the right end of the X-axis rails 11a and 11b in FIG. 1 to the front side portion of the movement support base 12a. The X-axis motor 14b is driven to move along the X-axis rails 11a and 11b.

また、基台10の左右両側の壁部には、支持部材15を介してそれぞれ回転支持軸15a,15bが取り付けられており、回転支持軸15a,15bの上方にそれぞれ伸展ローラ16a,16bが取り付けられている。このため、回転支持軸15aに、例えば、フレキシブル基板からなるロール状のワークWを回転可能に取り付け、その先端部を伸展ローラ16a,16bの上部側を通過させたのちに回転支持軸15bに巻き取らせるようにすることができる。この場合、ワークWは、回転支持軸15a,15bを回転させることにより、順次回転支持軸15aから送り出され、回転支持軸15bに巻き取られる。その際、伸展ローラ16a,16bは、ワークWに適度な張力が加わるようにしてワークWを支持するとともに、ワークWを、X軸レール11a,11bの上方に位置決めする。   In addition, rotation support shafts 15a and 15b are attached to the left and right wall portions of the base 10 via support members 15, respectively, and extension rollers 16a and 16b are attached above the rotation support shafts 15a and 15b, respectively. It has been. For this reason, for example, a roll-shaped workpiece W made of a flexible substrate is rotatably attached to the rotation support shaft 15a, and its tip is passed through the upper side of the extension rollers 16a and 16b, and then wound around the rotation support shaft 15b. You can make it take. In this case, the workpiece W is sequentially sent out from the rotation support shaft 15a and wound around the rotation support shaft 15b by rotating the rotation support shafts 15a and 15b. At that time, the extension rollers 16a and 16b support the work W so that an appropriate tension is applied to the work W, and position the work W above the X-axis rails 11a and 11b.

また、移動支持台12a,12bの上面には、それぞれY軸方向に延びるY軸レール17a,17bが設置されており、このY軸レール17a,17b上に、装置本体部20の一部を構成する取付部材21a,21bが、それぞれ対応するY軸レール17a,17bに沿ってY軸方向に移動可能な状態で取り付けられている。すなわち、Y軸レール17a,17bには、Y軸レール17a,17bの長手方向に沿って、ねじ軸18a,18bが設置され、ねじ軸18a,18bの後端部に、それぞれねじ軸18a,18bを軸回り方向に回転させるためのY軸モータ19a,19bが連結されている。   Further, Y-axis rails 17a and 17b extending in the Y-axis direction are respectively installed on the upper surfaces of the movable support bases 12a and 12b, and a part of the apparatus main body 20 is configured on the Y-axis rails 17a and 17b. The attaching members 21a and 21b to be attached are attached so as to be movable in the Y-axis direction along the corresponding Y-axis rails 17a and 17b. That is, the Y-axis rails 17a and 17b are provided with screw shafts 18a and 18b along the longitudinal direction of the Y-axis rails 17a and 17b, and screw shafts 18a and 18b are respectively provided at the rear ends of the screw shafts 18a and 18b. Y-axis motors 19a and 19b for rotating the motor in the direction around the axis are coupled.

そして、取付部材21aは、Y軸モータ19aの駆動によって回転するねじ軸18aに連結され、Y軸モータ19aの駆動によって、Y軸レール17aに沿って移動する。また、取付部材21bは、Y軸モータ19bの駆動によって回転するねじ軸18bに連結され、Y軸モータ19bの駆動によって、Y軸レール17bに沿って移動する。取付部材21a,21bには、それぞれ対応する処理部22a,22bが取り付けられており、装置本体部20は、取付部材21a,21b、処理部22a,22bおよび後述する固定部等で構成される。   The attachment member 21a is connected to a screw shaft 18a that rotates by driving of the Y-axis motor 19a, and moves along the Y-axis rail 17a by driving of the Y-axis motor 19a. The attachment member 21b is connected to a screw shaft 18b that rotates by driving of the Y-axis motor 19b, and moves along the Y-axis rail 17b by driving of the Y-axis motor 19b. Corresponding processing parts 22a and 22b are attached to the attachment members 21a and 21b, respectively, and the apparatus main body part 20 is composed of attachment members 21a and 21b, processing parts 22a and 22b, a fixing part to be described later, and the like.

また、取付部材21a,21bおよび処理部22a,22bはそれぞれ同一構造からなる一対のもので構成されているため、以下、取付部材21aおよび処理部22aについて説明し、取付部材21bおよび処理部22bについての説明は省略する。取付部材21aは、図3および図4に示したように、Y軸方向に長く前後対称になった略楕円形の枠体で構成されており、取付部材21a,21bは、処理部22a,22bから見て、紙面上、左右の二つの方向から支持するようにしている。これによって、片側のみで支持しているときと比較して、急加速、急停止時でも、パンチ27a,28aとダイ24,25の間で位置ずれを生じ難いものとしている。そして、取付部材21aの内部は、X軸方向に貫通しY軸方向に長く延びるスリット状のワーク挿通孔23に形成されており、ワークWを穿孔する場合には、このワーク挿通孔23にワークWを通す。   In addition, since the attachment members 21a and 21b and the processing portions 22a and 22b are composed of a pair having the same structure, the attachment member 21a and the processing portion 22a will be described below, and the attachment member 21b and the processing portion 22b will be described. Description of is omitted. As shown in FIGS. 3 and 4, the attachment member 21 a is configured by a substantially elliptical frame that is long and symmetrical in the Y-axis direction, and the attachment members 21 a and 21 b include the processing units 22 a and 22 b. As seen from above, it is supported from the left and right directions on the paper. As a result, compared with the case where only one side is supported, even during sudden acceleration and sudden stop, it is difficult to cause a positional deviation between the punches 27a and 28a and the dies 24 and 25. The inside of the mounting member 21a is formed in a slit-like workpiece insertion hole 23 that extends in the X-axis direction and extends in the Y-axis direction. When the workpiece W is to be drilled, Pass W.

また、取付部材21aの下部中央におけるワーク挿通孔23に面した部分には、一対のダイ24,25が間隔を保って取り付けられており、ダイ24には,孔部24aが開口を上方に向けて形成され、ダイ25には、孔部25aが開口を上方に向けて形成されている。そして、取付部材21aの下部中央におけるダイ24,25間に、位置合わせ用の穴部26が設けられている。   In addition, a pair of dies 24 and 25 are attached to a portion facing the work insertion hole 23 at the lower center of the attachment member 21a, and the hole 24a faces the opening upward in the die 24. A hole 25a is formed in the die 25 with the opening facing upward. An alignment hole 26 is provided between the dies 24 and 25 at the lower center of the mounting member 21a.

また、取付部材21aの上部中央におけるダイ24,25に対応する部分には、それぞれ孔部24a,25aに挿入可能な棒状のパンチ27a,28aが昇降機構27,28を介して昇降可能な状態で取り付けられている。パンチ27a,28aは、昇降機構27,28の作動により下降してそれぞれ対応する孔部24a,25a内に入り、その際のせん断力によってワークWを穿孔する。これらのダイ24,25と、パンチ27a,28aとで金型からなる処理部22aが構成されている。   In addition, rod-like punches 27a and 28a that can be inserted into the holes 24a and 25a can be lifted and lowered via the lifting mechanisms 27 and 28 at the portions corresponding to the dies 24 and 25 in the upper center of the mounting member 21a. It is attached. The punches 27a and 28a are lowered by the operation of the elevating mechanisms 27 and 28 to enter the corresponding holes 24a and 25a, respectively, and the workpiece W is punched by the shearing force at that time. The dies 24 and 25 and the punches 27a and 28a constitute a processing unit 22a made of a mold.

また、孔部24a,25aと、それに対応するパンチ27a,28aとは、それぞれ嵌合した際に、ワークWをせん断できる大きさに設定されている。孔部24aと孔部25aとの直径は同一に設定してもよいし異なる大きさに設定してもよい。同様に、パンチ27aとパンチ28aとの直径も、同一にしてもよいし異なる大きさにしてもよい。これらを異なる大きさに設定することにより、一つの処理部22aで2種類の大きさの孔を開けることができる。したがって、処理部22a,22bで大きさの異なる孔を最大4種類開けることが可能になる。   Further, the holes 24a and 25a and the punches 27a and 28a corresponding to the holes 24a and 25a are set to a size capable of shearing the workpiece W when fitted. The diameters of the hole 24a and the hole 25a may be set to the same or different sizes. Similarly, the diameters of the punch 27a and the punch 28a may be the same or different. By setting these to different sizes, two types of holes can be opened by one processing unit 22a. Therefore, it is possible to open up to four types of holes having different sizes in the processing units 22a and 22b.

また、取付部材21aの下部中央における孔部24a,25aの下方部分には、穿孔されたワークWの破片を収容するための収容部29が形成されており、穿孔の際に生じた破片は、一旦収容部29内に収容されたのちに、吸引装置(図示せず)の吸引によって外部に排出される。そして、取付部材21aの上部中央におけるパンチ27a,28a間に、本発明の位置検出装置としてのCCDカメラ30が位置決め用の穴部26に向けて取り付けられている。   In addition, in the lower part of the holes 24a and 25a in the lower center of the mounting member 21a, an accommodating portion 29 for accommodating debris of the drilled work W is formed, and the debris generated during drilling is After being accommodated in the accommodating portion 29, it is discharged to the outside by suction of a suction device (not shown). A CCD camera 30 as a position detection device of the present invention is attached to the positioning hole 26 between the punches 27a and 28a at the upper center of the attachment member 21a.

また、図5に示したように移動支持台12aにおける移動支持台12bに対向する部分には移動支持台12bに向って開口した凹部を備えたマイクロフォトセンサ31が取り付けられ、移動支持台12bにおけるマイクロフォトセンサ31の凹部に対向する部分には、マイクロフォトセンサ31の凹部に入ることのできる棒状のドック32が取り付けられている。マイクロフォトセンサ31は、凹部を通過する光線Lを発光する発光部と、その光線Lを受光する受光部とを備えており、ドッグ32が凹部内に入るとその光線Lが遮断されて、移動支持台12aと移動支持台12bとが接近したことを検出できる。このマイクロフォトセンサ31とドッグ32とで本発明に係る接近検出装置が構成される。   Further, as shown in FIG. 5, a microphotosensor 31 having a recess opened toward the moving support table 12b is attached to a portion of the moving support table 12a facing the moving support table 12b. A rod-shaped dock 32 that can enter the concave portion of the micro photosensor 31 is attached to a portion facing the concave portion of the microphotosensor 31. The micro photo sensor 31 includes a light emitting unit that emits a light beam L that passes through the recess and a light receiving unit that receives the light beam L. When the dog 32 enters the recess, the light beam L is blocked and moved. It can be detected that the support table 12a and the moving support table 12b are close to each other. The micro photo sensor 31 and the dog 32 constitute an approach detection device according to the present invention.

また、固定部は、基台10の上面におけるX軸レール11a,11bの端部近傍にそれぞれ設置された4個の挟持爪部35a,35b,35c,35dで構成されている。これらの挟持爪部35a,35b,35c,35dは、それぞれワークWの縁部を着脱可能に固定する把持部と移動機構(図示せず)とで構成されており、移動機構の作動によって、それぞれ独立して、X軸方向およびY軸方向に移動する。この移動機構としては、モータを用いて移動させる機構を用いてもよく、手動で移動させる機構を用いてもよい。手動による移動機構を用いる場合には、各挟持爪部35a,35b,35c,35dをねじによって所定の位置に固定できるようにする。また、把持部は、取付部材21aのワーク挿通孔23と同じ高さに設置されてワーク挿通孔23内を通るワークWの縁部を側縁部の外部側から固定する。   Further, the fixed portion is composed of four clamping claws 35 a, 35 b, 35 c, and 35 d installed near the ends of the X-axis rails 11 a and 11 b on the upper surface of the base 10. These clamping claws 35a, 35b, 35c, and 35d are each composed of a gripping part for removably fixing the edge of the workpiece W and a moving mechanism (not shown). Independently move in the X-axis direction and the Y-axis direction. As this moving mechanism, a mechanism that moves using a motor may be used, or a mechanism that moves manually may be used. When a manual moving mechanism is used, each of the holding claws 35a, 35b, 35c, and 35d can be fixed at a predetermined position with a screw. Further, the gripping portion is installed at the same height as the workpiece insertion hole 23 of the attachment member 21a, and fixes the edge portion of the workpiece W passing through the workpiece insertion hole 23 from the outside of the side edge portion.

これによると、挟持爪部35a等のうちの所定の挟持爪部を移動させることによりサイズの異なる種々のワークの固定が可能になる。例えば、4個の挟持爪部35a等のうちの挟持爪部35aを基準点として固定し、挟持爪部35dをX軸方向に沿って移動可能にし、挟持爪部35bをY軸方向に沿って移動可能にする。そして、挟持爪部35cをX軸方向およびY軸方向に移動可能にする。これによって、4個の挟持爪部35a等が移動可能な範囲内で、どのようなサイズのワークWでも固定が可能になる。また、挟持爪部35a等が移動可能になっているため、ワークWが薄く撓み易いシートで構成されていても、適度な張力で真っ直ぐに引っ張った状態で固定することができる。これによって、処理の精度が向上する。   According to this, it becomes possible to fix various workpieces of different sizes by moving a predetermined clamping claw portion of the clamping claw portion 35a and the like. For example, the clamping claw portion 35a of the four clamping claw portions 35a is fixed as a reference point, the clamping claw portion 35d is movable along the X-axis direction, and the clamping claw portion 35b is moved along the Y-axis direction. Make it movable. The clamping claw portion 35c is movable in the X-axis direction and the Y-axis direction. Accordingly, the workpiece W of any size can be fixed within a range in which the four clamping claws 35a and the like can be moved. In addition, since the clamping claw portion 35a and the like are movable, even if the workpiece W is formed of a thin and flexible sheet, it can be fixed in a state of being pulled straight with an appropriate tension. This improves the processing accuracy.

また、本実施形態に係る穿孔装置Mは、前述した各装置の外に、図6に示した、入力装置36や、CPU37、ROM38、RAM39等を含む移動制御装置40を備えている。入力装置36は操作パネルで構成されており、操作者の操作によって、ワークWに形成された各被穿孔部(図示せず)に関する位置(座標)や大きさ(直径)等の穿孔情報およびCCDカメラ30,30aとパンチ27a,28aの位置とのオフセットを示すオフセット情報を移動制御装置40に送信する。   In addition to the above-described devices, the punching device M according to the present embodiment includes the movement control device 40 including the input device 36, the CPU 37, the ROM 38, the RAM 39, and the like shown in FIG. The input device 36 is constituted by an operation panel, and perforation information such as position (coordinates) and size (diameter) relating to each perforated part (not shown) formed on the work W and CCD according to the operation of the operator. Offset information indicating the offset between the cameras 30 and 30a and the positions of the punches 27a and 28a is transmitted to the movement control device 40.

また、移動制御装置40のROM38には、図7に示したプログラムが記憶されており、CPU37は、入力装置36から入力される穿孔情報に基づいてそのプログラムを実行する。すなわち、移動制御装置40は、入力装置36から入力される穿孔情報に基づいて、各処理部22a,22bの移動経路を算出する。そして、その算出結果と、CCDカメラ30および取付部材21bに取り付けられたCCDカメラ30aとの検出結果に基づいて、X軸モータ14a,14b、Y軸モータ19a,19b、昇降機構27,28および取付部材21bに取り付けられた昇降機構41,42等の作動を制御する。   Further, the program shown in FIG. 7 is stored in the ROM 38 of the movement control device 40, and the CPU 37 executes the program based on the punching information input from the input device 36. That is, the movement control device 40 calculates the movement path of each processing unit 22a, 22b based on the punching information input from the input device 36. Then, based on the calculation result and the detection result of the CCD camera 30 and the CCD camera 30a attached to the attachment member 21b, the X-axis motors 14a and 14b, the Y-axis motors 19a and 19b, the lifting mechanisms 27 and 28, and the attachment The operation of the elevating mechanisms 41 and 42 attached to the member 21b is controlled.

以上の構成において、ワークWに穿孔加工を行う際には、まず、ワークWを穿孔装置Mに取り付けて所定位置に固定するとともに、穿孔装置Mに電源を入れて作動可能な状態にする。そして、ワークWに設けられた複数の被穿孔部の穿孔情報を入力装置36を操作することにより入力する。この穿孔情報としては、各被穿孔部の座標軸上の位置、例えばX座標、Y座標がともに「0」となる基準点を設定し、その基準点に対する各被穿孔部のX座標およびY座標の値や、各被穿孔部の直径の大きさを用いる。入力装置36から入力された穿孔情報は、移動制御装置40のRAM39に記憶される。   In the above configuration, when drilling a workpiece W, the workpiece W is first attached to the punching device M and fixed at a predetermined position, and the punching device M is turned on to be in an operable state. Then, drilling information of a plurality of drilled portions provided on the workpiece W is input by operating the input device 36. As the drilling information, a reference point where the position of each drilled part on the coordinate axis, for example, the X coordinate and the Y coordinate are both “0”, is set, and the X coordinate and Y coordinate of each drilled part with respect to the reference point are set. The value and the size of the diameter of each drilled part are used. The punching information input from the input device 36 is stored in the RAM 39 of the movement control device 40.

穿孔情報の入力が終了すると、スタートスイッチ(図示せず)をオン操作する。これによって、図7に示したプログラムの実行がCPU37によって開始される。プログラムは、ステップ100においてスタートし、ステップ102においてRAM39に記憶されている穿孔情報の読込みが行われる。つぎに、プログラムはステップ104に進み、ステップ104において、処理部22a,22bが、それぞれ穿孔加工する加工領域を分割する処理が行われる。   When the input of drilling information is completed, a start switch (not shown) is turned on. As a result, the execution of the program shown in FIG. The program starts in step 100, and in step 102, the punching information stored in the RAM 39 is read. Next, the program proceeds to step 104. In step 104, the processing units 22a and 22b each perform a process of dividing a machining area to be drilled.

ここでは、所定のルールに基づいて、加工領域を分割する。所定のルールとしては、例えば、処理部22a,22bの処理回数を均等配分したり、移動経路の近似値を略均等化したりする等がある。そして、この二つのルールをもとに分割された加工領域内で、それぞれの処理部22a,22bが穿孔加工する被穿孔部の座標間を結ぶように移動経路の近似値を求め、この近似値をRAM39に記憶させる。なお、処理部22a,22bが実際に移動する際の移動経路については、スムージングなどの処理が行われるため、常に被穿孔部間を直線で移動するとは限らない。このため、単純な処理位置の距離の加算は近似値で示す。   Here, the machining area is divided based on a predetermined rule. As the predetermined rule, for example, the processing times of the processing units 22a and 22b are evenly distributed, the approximate value of the movement route is substantially equalized, and the like. Then, within the machining area divided based on these two rules, the approximate values of the movement paths are obtained so as to connect the coordinates of the drilled parts to be drilled by the respective processing units 22a and 22b. Is stored in the RAM 39. In addition, about the movement path | route at the time of process part 22a, 22b actually moving, since processes, such as smoothing, are performed, it does not necessarily move in a straight line between to-be-punched parts. For this reason, the addition of simple processing position distances is indicated by an approximate value.

ステップ104での処理が終了すると、プログラムはステップ106に進み、処理部22a,22bのそれぞれの移動経路を求め、その移動経路を最適化するための処理が行われる。各移動経路は、それぞれ加工領域内の被穿孔部を結び合わせることによって求められ、その移動経路の最適化は、抑振動作、最短動作、最適速度および処理部22a,22bの相互干渉の有無の判断等に基づいて経路を変更することによって行われる。すなわち、抑振動作は、処理部22a,22bの移動が、互いの移動により発生する振動を打ち消しあうように作用するものであり、処理部22a,22bが左右対称または前後対称に移動したり、一方向に長く移動せずに、短距離で進行方向を適宜変更しながら移動したりすることにより達成される。   When the process in step 104 is completed, the program proceeds to step 106, where the respective movement paths of the processing units 22a and 22b are obtained, and a process for optimizing the movement path is performed. Each movement path is obtained by combining the drilled parts in the machining area, and the optimization of the movement path is based on the suppression operation, the shortest operation, the optimum speed, and the presence or absence of mutual interference between the processing units 22a and 22b. This is done by changing the route based on judgment or the like. That is, in the vibration suppression operation, the movement of the processing units 22a and 22b acts so as to cancel vibrations generated by the movement of each other, and the processing units 22a and 22b move symmetrically or longitudinally symmetrically. This can be achieved by moving in a short distance while changing the traveling direction as appropriate without moving long in one direction.

また、最短動作は、処理部22a,22bの移動距離が最短になるように移動経路を設定するものであり、最適速度は、加工精度を規定の範囲内に収めた状態で、できるだけ高速処理が行える速度に設定するものである。また、相互干渉の有無の判断は、処理部22a,22bが、それぞれ穿孔すべき所定の被穿孔部に向って移動する際に、接触しないようにして、移動経路を設定するものである。   The shortest operation is to set the movement path so that the movement distances of the processing units 22a and 22b are the shortest. The optimum speed is as high-speed processing as possible with the machining accuracy within the specified range. It is set to a speed that can be performed. Further, the determination of the presence or absence of mutual interference is to set the movement path so that the processing units 22a and 22b do not come into contact with each other when moving toward a predetermined portion to be drilled.

つぎに、処理部22a,22bの各移動経路が求められると、プログラムはステップ108に進み、得られた移動経路に沿って移動しながら、処理部22a,22bがそれぞれ対応する被穿孔部を穿孔する場合に要する時間の差が、所定値以下か否かの判定を行う。なお、この所定値は、予め設定してRAM39に記憶されているものである。ここで、時間差が所定値よりも大きく、ステップ108において「NO」と判定すると、プログラムはステップ104に進み、前述した処理を再度行う。この場合、前回の処理で求めた加工領域とは、異なる加工領域を設定して、別のルールに基づく移動経路を求め、求められた移動経路が適切なものになるまでこの処理を繰り返す。   Next, when the moving paths of the processing units 22a and 22b are obtained, the program proceeds to step 108, and the processing units 22a and 22b drill the corresponding drilled parts while moving along the obtained moving paths. It is determined whether or not the difference in time required for the determination is equal to or less than a predetermined value. The predetermined value is set in advance and stored in the RAM 39. Here, if the time difference is larger than the predetermined value and it is determined as “NO” in Step 108, the program proceeds to Step 104 and performs the above-described processing again. In this case, a machining area different from the machining area obtained in the previous process is set, a movement route based on another rule is obtained, and this process is repeated until the obtained movement route becomes appropriate.

ついで、ステップ106において、ステップ104の処理で設定された加工領域における処理部22a,22bのそれぞれの移動経路を求める処理と、その移動経路を最適化するための処理が行われる。そして、再度、ステップ108において、得られた移動経路に基づいた処理部22a,22bの加工時間の差が所定値以下か否かの判定が行われる。処理部22a,22bの加工時間の差が所定値以下になって、ステップ108で「YES」と判定するまで、CPU37は、ステップ104,106の処理を繰り返す。そして、処理部22a,22bの加工時間の差が所定値以下になって、ステップ108で「YES」と判定すると、プログラムはステップ110に進む。   Next, in step 106, a process for obtaining the respective movement paths of the processing units 22a and 22b in the machining area set in the process of step 104 and a process for optimizing the movement path are performed. Then, in step 108, it is determined whether or not the difference between the processing times of the processing units 22a and 22b based on the obtained movement path is equal to or less than a predetermined value. The CPU 37 repeats the processes of steps 104 and 106 until the difference between the processing times of the processing units 22a and 22b becomes equal to or smaller than the predetermined value and it is determined “YES” at step 108. If the difference between the processing times of the processing units 22a and 22b becomes equal to or smaller than a predetermined value and it is determined “YES” in step 108, the program proceeds to step 110.

ステップ110では、ステップ108で「YES」と判定されたときの移動経路を、処理部22a,22bのそれぞれの最適な移動経路として決定する処理が行われる。この移動経路のデータはRAM39に記憶される。そして、ステップ112において、この移動経路にしたがって処理部22a,22bが移動しながら、穿孔する径に応じてCCDカメラ30,30aとパンチ27a,28aとのオフセット量を利用して穿孔位置にパンチ27a,28aとダイ24,25を移動させ、穿孔加工を実行するための処理が行われる。   In step 110, a process of determining the movement route when it is determined “YES” in step 108 as the optimum movement route of each of the processing units 22a and 22b is performed. The data of the movement route is stored in the RAM 39. In step 112, the processing units 22a and 22b move along the moving path, and the punch 27a is moved to the punching position using the offset amount between the CCD cameras 30 and 30a and the punches 27a and 28a according to the diameter of the punching. , 28a and the dies 24, 25 are moved to perform a drilling process.

この穿孔加工は、つぎのようにして行われる。まず、X軸モータ14a,14bおよびY軸モータ19a,19bを作動させて、処理部22a,22bを、それぞれの移動経路の出発点となる被穿孔部に位置させる。ついで、CCDカメラ30,30aによってその対応する被穿孔部を撮影する。この画像データはCPU37に送られて画像処理され位置データとしてRAM39に記憶される。そして、この被穿孔部の位置データと孔部24a,25a等の位置データとの差に基づいて、X軸モータ14a等が作動して、例えば、孔部24aとそれに対応する被穿孔部との位置を一致させる。   This drilling process is performed as follows. First, the X-axis motors 14a and 14b and the Y-axis motors 19a and 19b are operated to place the processing units 22a and 22b in the drilled portions that are the starting points of the respective movement paths. Then, the corresponding perforated part is photographed by the CCD cameras 30 and 30a. This image data is sent to the CPU 37, subjected to image processing, and stored in the RAM 39 as position data. Then, based on the difference between the position data of the drilled part and the position data of the holes 24a, 25a, etc., the X-axis motor 14a is operated, for example, between the hole 24a and the corresponding drilled part. Match the positions.

そして、昇降機構27の作動によりパンチ27aが下降して、被穿孔部を穿孔する。同様に、処理部22bも対応する被穿孔部を穿孔する。最初の穿孔加工が終了すると、処理部22a,22bは、それぞれ次の被穿孔部の位置に移動して、CCDカメラ30,30aでその被穿孔部の位置を確認したのちにその被穿孔部を穿孔する。そして、処理部22a,22bは、CCDカメラ30,30aによる被穿孔部の位置の確認にしたがって順次移動経路に沿って移動しながら被穿孔部の穿孔を繰り返す。   Then, the punch 27a is lowered by the operation of the elevating mechanism 27 to perforate the portion to be perforated. Similarly, the processing unit 22b also punches the corresponding drilled part. When the first drilling process is completed, the processing units 22a and 22b move to the positions of the next drilled parts, respectively, and after confirming the positions of the drilled parts with the CCD cameras 30 and 30a, Perforate. Then, the processing units 22a and 22b repeat the drilling of the drilled part while sequentially moving along the movement path according to the confirmation of the position of the drilled part by the CCD cameras 30 and 30a.

その間に、処理部22a,22bが接近して干渉しそうになった場合には、マイクロフォトセンサ31とドッグ32とからなる接近検出装置の検出により、移動制御装置40は、処理部22a,22bがそれ以上接近することを禁止する制御を行う。そして、すべての被穿孔部の穿孔が終了すると、プログラムはステップ114に進んで終了する。   In the meantime, if the processing units 22a and 22b approach and interfere with each other, the movement control device 40 detects that the processing units 22a and 22b are detected by the detection of the approach detection device including the microphotosensor 31 and the dog 32. Control to prohibit further approach is performed. When all the drilled portions have been punched, the program proceeds to step 114 and ends.

このように、この穿孔装置Mでは、ワークWを固定し、そのワークWに対して処理部22a,22bをそれぞれ独立して移動させながら被処理部を穿孔するため、効率のよい処理ができる。また、その際、ワークWの被処理部に関する処理情報から、処理部22a,22bの最適な移動経路を算出するため、不規則に形成された被穿孔部であっても、効率のよい穿孔加工ができ、高速かつ高精度な処理の実現ができる。また、本実施形態に係る穿孔装置Mは、CCDカメラ30,30aを備えているため、被処理部と、孔部24a等との間に位置ずれが生じなくなり、精度のよい処理が可能になる。   In this way, in this punching device M, the workpiece W is fixed, and the processing portion 22a, 22b is punched in the processing portion while moving the processing portions 22a and 22b independently of each other, so that efficient processing can be performed. At that time, since the optimum movement path of the processing units 22a and 22b is calculated from the processing information related to the processing target portion of the workpiece W, even an irregularly formed drilling portion can be efficiently drilled. And high-speed and high-precision processing can be realized. Further, since the perforation apparatus M according to the present embodiment includes the CCD cameras 30 and 30a, a positional shift does not occur between the processing target part and the hole part 24a and the like, and accurate processing is possible. .

さらに、本実施形態に係る穿孔装置Mが備える4個の挟持爪部35a等は、移動可能になっているため、サイズの異なる種々のワークの固定が可能になる。また、ワークWのように撓み易いフレキシブル基板からなるシートであっても、適度な張力で真っ直ぐに引っ張った状態で固定することができる。これによって、処理の精度が向上する。さらに、取付部材部21a,21bの両側部分は、移動方向に沿って突出して形成されているため、処理部22a,22bが移動する際に振動が生じ難くなる。このため、ワークWに対して精度のよい処理が行える。   Furthermore, since the four clamping claws 35a and the like included in the punching device M according to the present embodiment are movable, it is possible to fix various workpieces having different sizes. Further, even a sheet made of a flexible substrate that is easily bent, such as the workpiece W, can be fixed in a state of being pulled straight with an appropriate tension. This improves the processing accuracy. Furthermore, since both side portions of the attachment member portions 21a and 21b are formed so as to protrude along the moving direction, vibrations are less likely to occur when the processing portions 22a and 22b move. For this reason, accurate processing can be performed on the workpiece W.

また、本発明に係る処理装置は、前述した実施形態に限定するものでなく、適宜変更して実施することができる。例えば、前述した穿孔装置Mは、2個の処理部22a,22bを備えているが、この処理装置および処理装置を移動させるための移動機構は、3個以上にすることもできる。また、各処理部22a,22bの近傍に、CCDカメラ30,30aの外、被穿孔部を斜めから撮影できるCCDカメラを設けることもできる。これによると、被穿孔部の位置検出がさらに高精度になる。   In addition, the processing apparatus according to the present invention is not limited to the above-described embodiment, and can be implemented with appropriate modifications. For example, although the punching device M described above includes two processing units 22a and 22b, the number of moving mechanisms for moving the processing device and the processing device may be three or more. Further, in the vicinity of each processing unit 22a, 22b, a CCD camera capable of photographing the perforated part from an angle in addition to the CCD cameras 30, 30a can be provided. According to this, the position detection of the to-be-pierced part becomes more accurate.

さらに、前述した実施形態では、ワークWをロール状に巻かれたフレキシブル基板としたが、これを正方形や長方形に形成された長さの短いシート状のもので構成してもよいし、厚みの厚い板状のもので構成してもよい。また、穿孔に代えて、例えば、フレキシブル基板の接点部分を研磨するための処理や切抜きを行うこともできる。研磨の場合は、処理部22a,22bに代えて研磨用治具を取り付け、切り抜きの場合には、処理部22a,22bに代えて固定切断刃または回転切断刃を取り付ける。また、本実施形態においては、経路の生成時の最適化の処理と、実際の動作時のマイクロフォトセンサ31とドック32による検出の双方のチェックを行うようにしたが、どちらか一方の手法で干渉を防ぐようにしてもよい。さらに、前述した実施形態では、処理装置を穿孔装置Mとしたが、この処理装置をワークWの導通検査を行うための挿通検査装置とすることもできる。穿孔用の処理部22a,22bに代えて、導通検査用の処理部を用いる。   Furthermore, in the above-described embodiment, the workpiece W is a flexible substrate wound in a roll shape. However, the workpiece W may be formed of a sheet having a short length formed in a square shape or a rectangular shape. You may comprise with a thick plate-shaped thing. Moreover, it can replace with perforation and can also perform the process and cut-out for grind | polishing the contact part of a flexible substrate, for example. In the case of polishing, a polishing jig is attached in place of the processing units 22a and 22b, and in the case of clipping, a fixed cutting blade or a rotary cutting blade is attached in place of the processing units 22a and 22b. In this embodiment, both the optimization process at the time of path generation and the detection by the micro photosensor 31 and the dock 32 at the time of actual operation are checked. Interference may be prevented. Furthermore, in the above-described embodiment, the processing device is the punching device M, but this processing device may be an insertion inspection device for performing a continuity inspection of the workpiece W. Instead of the processing units 22a and 22b for drilling, a processing unit for continuity inspection is used.

本発明の一実施形態に係る穿孔装置を示す平面図である。It is a top view which shows the perforation apparatus which concerns on one Embodiment of this invention. 図1に示した穿孔装置の正面図である。It is a front view of the perforation apparatus shown in FIG. 図1に示した穿孔装置の側面図である。It is a side view of the perforation apparatus shown in FIG. 図3に示した穿孔装置の要部を拡大した側面図である。It is the side view to which the principal part of the punching apparatus shown in FIG. 3 was expanded. 接近検出装置を示した平面図である。It is the top view which showed the approach detection apparatus. 穿孔装置が備える各装置およびその作動を制御する移動制御装置を示すブロック図である。It is a block diagram which shows the movement control apparatus which controls each apparatus with which a piercing | piercing apparatus is provided, and its operation | movement. 移動制御装置が備えるCPUが実行するプログラムを示すフローチャートである。It is a flowchart which shows the program which CPU which a movement control apparatus provides is executed.

符号の説明Explanation of symbols

10…基台、11a,11b…X軸レール、13a,13b,18a,18b…ねじ軸、14a,14b…X軸モータ、17a,17b…Y軸レール、19a,19b…Y軸モータ、21a,21b…取付部材、22a,22b…処理部、23…ワーク挿通孔、24,25…ダイ、24a,25a…孔部、27,28,41,42…昇降機構、27a,28a…パンチ、30,30a…CCDカメラ、31…マイクロフォトセンサ、32…ドック、35a,35b,35c,35d…挟持爪部、36…入力装置、40…移動制御装置、M…穿孔装置、W…ワーク。
DESCRIPTION OF SYMBOLS 10 ... Base, 11a, 11b ... X-axis rail, 13a, 13b, 18a, 18b ... Screw shaft, 14a, 14b ... X-axis motor, 17a, 17b ... Y-axis rail, 19a, 19b ... Y-axis motor, 21a, 21b ... Mounting member, 22a, 22b ... Processing part, 23 ... Work insertion hole, 24, 25 ... Die, 24a, 25a ... Hole, 27, 28, 41, 42 ... Lifting mechanism, 27a, 28a ... Punch, 30, 30 ... CCD camera, 31 ... micro photo sensor, 32 ... dock, 35a, 35b, 35c, 35d ... clamping nail part, 36 ... input device, 40 ... movement control device, M ... punching device, W ... work.

Claims (4)

基台の上面に移動可能に設置されX軸方向に貫通しY軸方向に長く延びるワーク挿通孔を有する縦枠状の一対の取付部材と、
前記一対の取付部材のワーク挿通孔を通る複数の被処理部を備えたシート状または板状のワークを固定するための固定部と、
前記取付部材の上部中央に設置されたパンチと、前記取付部材の下部中央に設置されたダイとを有する金型で構成され、前記取付部材の長手方向の両側で支持された複数の処理部と、
前記複数の被処理部に関する処理情報を入力するための入力装置と、
前記入力装置に入力された複数の処理部の各処理部が前記プリント基板に処理を施す際に要する時間、前記各処理部が前記プリント基板に処理を施す際の経路の長さ、または前記各処理部が処理を施す被処理部の数を均一化させることによって前記複数の処理部のそれぞれの移動経路を算出し、その算出結果に応じて、前記複数の処理部をそれぞれ独立して移動させながら前記ワークの被処理部に処理を施す移動制御装置と
を備えたことを特徴とする処理装置。
A pair of vertical frame-shaped mounting members that are movably installed on the upper surface of the base and have work insertion holes that extend in the X-axis direction and extend in the Y-axis direction;
A fixing portion for fixing a sheet-like or plate-like workpiece having a plurality of processed portions passing through the workpiece insertion holes of the pair of attachment members;
A plurality of processing units configured by a mold having a punch installed at the upper center of the mounting member and a die installed at the lower center of the mounting member and supported on both sides in the longitudinal direction of the mounting member When,
An input device for inputting processing information related to the plurality of processed parts;
The time required for each processing unit of the plurality of processing units input to the input device to perform processing on the printed circuit board, the length of the path when each processing unit performs processing on the printed circuit board, or each of the above processing unit performs processing to calculate the respective movement path of the previous SL plurality of processing units by equalizing the number of the processing unit, in accordance with the calculation results, moving said plurality of processing units each independently And a movement control device for performing processing on the processing target portion of the workpiece.
前記処理部の近傍に、前記処理部とともに移動する位置検出装置を設けて、前記位置検出装置が検出した前記被処理部の位置に基づいて前記処理部が移動して前記ワークに処理を施すようにした請求項1に記載の処理装置。   A position detection device that moves together with the processing unit is provided in the vicinity of the processing unit so that the processing unit moves and processes the workpiece based on the position of the processing target detected by the position detection device. The processing apparatus according to claim 1. 前記複数の処理部または前記複数の処理部がそれぞれ取り付けられて前記基台に対して移動する部分に、互いに接近したことを検出するための接近検出装置を設けて、前記接近検出装置が前記処理部同士が接近したことを検出すると、前記移動制御装置の制御により前記処理部同士がそれ以上接近しないようにした請求項1または2に記載の処理装置。   An approach detection device for detecting that the plurality of processing units or the plurality of processing units are respectively attached and moved relative to the base is provided, and the approach detection device is configured to perform the processing. The processing apparatus according to claim 1 or 2, wherein when the parts are detected to approach each other, the processing parts are prevented from approaching further by the control of the movement control device. 基台の上面に移動可能に設置されX軸方向に貫通しY軸方向に長く延びるワーク挿通孔を有する縦枠状の一対の取付部材と、一対の取付部材のワーク挿通孔を通る複数の被処理部を備えたシート状または板状のプリント基板を固定するための固定部と、前記取付部材の上部中央に設置されたパンチと、前記取付部材の下部中央に設置されたダイとを有する金型で構成され、前記取付部材の長手方向の両側で支持された複数の処理部と、所定の処理情報に基づいて前記複数の処理部の作動を制御する移動制御装置とを備えた処理装置を用いて、前記プリント基板に処理を施すためのプリント基板の生産方法であって、
前記プリント基板を固定する固定工程と、
前記複数の被処理部に関する処理情報を入力する入力工程と、
前記入力工程で入力された処理情報から前記複数の処理部のそれぞれの移動経路を算出する移動経路算出工程と、
前記移動経路算出工程で算出された結果に応じて、前記複数の処理部をそれぞれ独立して移動させながら前記プリント基板の被処理部に処理を施す処理工程と
を備え、
前記移動経路算出工程における移動経路の算出を、前記複数の処理部の各処理部が前記プリント基板に処理を施す際に要する時間、前記各処理部が前記プリント基板に処理を施す際の経路の長さ、または前記各処理部が処理を施す被処理部の数を均一化させることによって行うことを特徴とするプリント基板の生産方法。
A pair of vertical frame-shaped mounting members that are movably installed on the upper surface of the base and have workpiece insertion holes that extend in the X-axis direction and extend in the Y-axis direction, and a plurality of covers that pass through the workpiece insertion holes of the pair of mounting members A gold having a fixing part for fixing a sheet-like or plate-like printed circuit board provided with a processing part, a punch installed at the upper center of the mounting member, and a die installed at the lower center of the mounting member A processing apparatus comprising a plurality of processing units that are configured by a mold and supported on both sides in the longitudinal direction of the mounting member, and a movement control device that controls operations of the plurality of processing units based on predetermined processing information. Using a printed circuit board production method for processing the printed circuit board,
A fixing step of fixing the printed circuit board;
An input step for inputting processing information related to the plurality of processed parts;
A movement route calculation step of calculating a movement route of each of the plurality of processing units from the processing information input in the input step;
In accordance with the result calculated in the movement path calculation step, a processing step of performing processing on the target portion of the printed circuit board while independently moving the plurality of processing portions,
The calculation of the movement path in the movement path calculation step is the time required for each processing unit of the plurality of processing units to process the printed circuit board, and the path when each processing unit processes the printed circuit board. A method for producing a printed circuit board, characterized in that the length or the number of processing parts to be processed by each processing unit is made uniform.
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CN 200520012467 CN2862133Y (en) 2004-05-31 2005-05-27 Treating equipment
KR1020050044991A KR100681295B1 (en) 2004-05-31 2005-05-27 Processing apparatus, method for producing printed circuit board, and computer readable recording medium having processing program recorded therein
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CN102198670B (en) * 2010-03-22 2013-10-02 宏恒胜电子科技(淮安)有限公司 Board cutting system
JP5282137B2 (en) * 2011-12-06 2013-09-04 ヤマハ発動機株式会社 Board work equipment
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