JP4343391B2 - Workpiece processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing apparatus that processes a workpiece such as a printed circuit board, and more particularly to a technique for correcting a positional shift of a processing position caused by an ambient temperature.
[0002]
[Prior art]
In general, printed circuit boards used for mounting electronic components are guide holes for driving guide pins, alignment holes for exposure work by an exposure machine, pin lamination holes, and inner layers at the manufacturing stage. Work to drill holes for materials. Such a drilling operation requires extremely high accuracy.
[0003]
The drilling operation as described above is performed using various processing apparatuses. FIG. 6 is a plan view schematically showing a configuration of a guide hole drilling device for making a guide pin driving hole in the above-described processing device, and FIG. 7 is a front view thereof. As shown in the figure, the guide drilling device 101 includes a table 102 on which a printed circuit board 110 to be drilled is placed, and two moving units 103a and 103b.
[0004]
The moving units 103a and 103b are arranged on the sides of the X-ray imaging devices 104a and 104b (which may be CCD cameras) and the X-ray imaging devices 104a and 104b, and perforating devices 106a and 106b having drills 105a and 105b. It is equipped with. The X-ray imaging devices 104a and 104b include X-ray tubes 107a and 107b disposed below the table 102, and X-ray cameras 108a and 108b disposed at positions facing the X-ray tubes 107a and 107b above the table 102, respectively. , Is composed of. In the table 102, elongated grooves 113a and 113b are formed at positions to be drilled portions of the punching devices 106a and 106b.
[0005]
Furthermore, each moving unit 103a, 103b is pivotally supported by a linear scale 109 arranged along the lateral direction of the guide drilling device 101, and one-dimensionally along the linear scale 109 by servo motors 111a, 111b. It is possible to move the slide. The linear scale 109 detects the one-dimensional positions of the moving units 103a and 103b.
[0006]
The servo motors 111a and 111b, the linear scale 109, and the X-ray cameras 108a and 108b are connected to the control means 121, respectively.
[0007]
When drilling a guide hole in the printed circuit board 110 using the guide hole drilling device 101 configured as described above, first, the printed circuit board 110 is placed and fixed at a desired position on the table 102. Guide hole marks 110a formed in advance on the printed circuit board 110 (usually formed at two positions in the approximate central portion on the short side of the printed circuit board 110) in the X-ray imaging device 104a, Images are taken by 104b.
[0008]
Then, image processing is performed on the images captured by the X-ray imaging devices 104a and 104b, and the center point of the two guide hole marks 110a formed on the printed circuit board 110 (if the mark is circular, the center of this circle) The moving units 103a and 103b are moved along the linear scale 109 so that the center point comes to the reference position of the image captured by the X-ray cameras 108a and 108b.
[0009]
In this state, the distance between the two moving units 103a and 103b measured by the linear scale 109 matches the preset distance M between the two guide hole marks (for example, M = 20 cm, 25 cm, etc.). In this case, the positions of the drills 105a and 105b are moved to the position of the guide hole mark 110a, and the drills 105a and 105b are lowered while rotating to the position of the guide hole mark 110a on the printed circuit board 110. Drill a guide hole.
[0010]
If the distance between the two guide hole marks does not match the set distance M, each movement is performed so that the distance between the movement units 103a and 103b becomes M by processing such as sorting from the center. The units 103a and 103b are fixed, and at this position, the drills 105a and 105b are lowered in the same manner as described above to drill a guide hole in a desired portion of the printed circuit board 110. In this way, a guide hole for driving a guide pin can be drilled in the printed board 110.
[0011]
However, various devices and parts are mounted on the moving units 103a and 103b, and these devices and parts cause a slight positional shift due to a temperature change. For this reason, even if the distance between the two moving units 103a and 103b measured at the connecting portion with the linear scale 109 is correct, the distance between the two moving units 103a and 103b at the attachment position of the X-ray cameras 108a and 108b. Is not always accurate.
[0012]
That is, the positions of the moving units 103a and 103b that are slid by the servo motors 111a and 111b are accurately aligned on the linear scale 109, and the images actually captured by the two X-ray cameras 108a and 108b are displayed. The distance between the reference positions may be slightly shifted due to the ambient temperature. Therefore, there is a drawback that an error occurs in the drilling position of the guide hole.
[0013]
[Problems to be solved by the invention]
As described above, the conventional guide drilling device 101 is configured to set the distance between the two drills 105a and 105b based on the measurement result by the linear scale 109, and thus is caused by a temperature change. As a result, the accuracy of the distance between the drills 105a and 105b mounted on the moving units 103a and 103b may be deteriorated, causing a problem that the position of the guide hole is displaced.
[0014]
The present invention has been made to solve such a conventional problem, and the object of the present invention is a printed circuit board that can always process a printed circuit board with high accuracy regardless of changes in ambient temperature. It is in providing the processing apparatus of.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 of the present application includes a moving unit on which an imaging apparatus and a processing tool are mounted, a driving unit that slides the moving unit in a one-dimensional direction, and a movement by the driving unit. A linear scale or a rotary encoder that detects a one-dimensional position of the moving unit, and after the processing tool mounted on the moving unit is moved to a desired position on the workpiece, the processing tool is operated. In the workpiece processing apparatus configured to process a desired position of the workpiece, a sub-plate on which at least two reference position marks at a set value interval are formed is disposed along the one-dimensional direction, the reference position marks formed on the sub-plate, and image pickup device mounted on the mobile unit, the distance between the reference position mark Serial measured on a linear scale or a rotary encoder, based on the ratio of the set value for this measured distance, is characterized in that for correcting the machining position by the processing tool to be measured on a linear scale or a rotary encoder.
[0016]
According to a second aspect of the present invention, there are provided two moving units on which an imaging device and a processing tool are mounted, driving means for sliding the moving units in a one-dimensional direction, and the moving means moved by the driving means. A linear scale or a rotary encoder for detecting a one-dimensional position of each moving unit, and after moving the processing tool mounted on each moving unit to a desired position on the workpiece, operating the processing tool In the workpiece processing apparatus configured to process a desired position of the workpiece, a sub plate on which at least two reference position marks having a set value interval are formed is disposed along the one-dimensional direction, and the sub Two reference position marks formed on the plate are imaged by an imaging device mounted on the two moving units, and the distance between the two reference position marks is measured. The distance between the two processing tools measured by a linear scale or a rotary encoder is corrected based on the ratio of the set value to the measured value .
[0017]
According to a third aspect of the present invention, there are provided two moving units on which an imaging device and a processing tool are mounted, driving means for sliding the two moving units in a one-dimensional direction, and each of the moving units moved by the driving means. A linear scale or a rotary encoder for detecting a one-dimensional position of the moving unit, and after moving the processing tool mounted on each moving unit to a desired position on the work, the processing tool is operated to operate the work In the workpiece processing apparatus configured to process a desired position, a sub-plate disposed along the one-dimensional direction at an appropriate position of a table on which the workpiece is placed , and at least at a set value interval a sub-plate in which two reference position marks are formed, are mounted two reference position marks formed on the sub-plate to said each mobile unit By imaging by the imaging device, a calculating means for calculating the ratio of the set value for the distance measurement value measured the between the reference position mark in the near-scale or a rotary encoder, a numerical value obtained by the arithmetic means Accordingly, machining position setting means for correcting the machining position on the workpiece is provided.
[0018]
The sub-plate is preferably configured using a material having an extremely small expansion coefficient due to temperature change . The invention according to claim 4 is characterized in that the sub-plate is configured using a material having a temperature expansion coefficient substantially the same as that of the workpiece.
[0019]
The invention described in claim 5 is characterized in that the processing tool is any one of drill, punch, cutting, polishing, and leather. The invention described in claim 6 is characterized in that the workpiece is a printed circuit board.
[0020]
According to the present invention configured as described above, the moving unit on which the imaging device is mounted is slid in a one-dimensional direction, and the reference position mark formed on the sub-plate is imaged using this imaging device, The center position of the reference position mark is obtained by performing processing. Then, the distance between the two reference position marks is calculated. On the other hand, since the distance between the two reference position marks formed on the sub-plate is determined in advance, this distance is compared with the distance obtained by the above calculation.
[0021]
If an error occurs because the two calculation results do not match, processing for correcting the movement position of the moving unit is added according to the magnitude of the error. Thereby, the system of the processing position can be improved when processing such as punching, punching, cutting, and polishing is performed on the printed circuit board by the processing apparatus.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a configuration of an embodiment of a guide drilling device to which the present invention is applied, and FIG. 2 is a front view thereof. In this embodiment, a printed board guide drilling device will be described as an example of a workpiece processing device. However, the present invention is not limited to this, and positioning with respect to the workpiece using an imaging device. The present invention can be applied to various processing apparatuses having the function of performing the above.
[0023]
As shown in FIGS. 1 and 2, the guide drilling device 1 includes a table 2 on which a printed board 10 is placed and two moving units 3a and 3b. The moving units 3a and 3b are printed. The position of the two guide hole marks 10a formed on the printed circuit board 10 is lowered by moving the drills 5a and 5b mounted on the movement units 3a and 3b while rotating them after moving to a predetermined position on the circuit board 10. Drill a guide hole. In the present embodiment, the case where there are two guide hole marks 10a will be described. However, the present invention is not limited to this, and three or more guide hole marks 10a may be used.
[0024]
Each of the moving units 3a and 3b includes X-ray imaging devices (imaging devices) 4a and 4b, respectively, and perforators 6a and 6b are installed on the sides of the X-ray imaging devices 4a and 4b. In this embodiment, an example in which the X-ray imaging devices 4a and 4b are used as the imaging device will be described. However, other imaging devices such as a CCD camera may be used.
[0025]
The X-ray imaging devices 4a and 4b are disposed below the table 2 and radiate X-rays, and disposed above the table 2 at positions facing the X-ray tubes 7a and 7b. Line camera 8a, 8b, and images the guide hole mark 10a previously formed in the printed circuit board 10 by X-ray fluoroscopy.
[0026]
Drills 5a and 5b are mounted on the drilling devices 6a and 6b, and the guide hole mark 10a of the printed circuit board 10 placed on the table 2 is lowered by lowering the drills 5a and 5b while rotating. Drill a guide hole in the entered area.
[0027]
A linear scale 9 is installed along the horizontal direction of the table 2, and each moving unit 3a, 3b is pivotally supported by the linear scale 9 via the arms 16a, 16b, and the driving force of the servo motors 11a, 11b. Thus, it can move one-dimensionally along the linear scale 9. The linear scale 9 detects one-dimensional positions (coordinates) of the moving units 3a and 3b.
[0028]
Grooves 13a and 13b for penetrating drills 5a and 5b mounted on the punching devices 6a and 6b through the printed circuit board 10 are formed at portions on the table 2 corresponding to the moving positions of the moving units 3a and 3b. Further, sub-plates 14 are embedded in positions along the groove portions 13a and 13b inside the table 2.
[0029]
FIG. 4 is an external view of the sub-plate 14, and the sub-plate 14 has a long flat plate shape and is made of a material having an extremely small expansion coefficient with respect to a change in ambient temperature. Further, reference position marks 15a and 15b that can be seen through with X-rays are formed at two locations on the sub-plate 14 (in the case where a CCD camera is used as an imaging device, reference position marks that can be imaged with the CCD camera). Yes. Note that the reference position mark is not limited to two places.
[0030]
The distance between the two reference position marks 15a and 15b is set to a predetermined value with high accuracy. Reference numeral 17 denotes an elongated hole corresponding to the grooves 13a and 13b shown in FIG.
Further, the servo motors 11a and 11b and the linear scale 9 shown in FIG. 1 and the X-ray cameras 8a and 8b and the punching units 6a and 6b shown in FIG. It is connected to the.
[0031]
FIG. 3 is a block diagram illustrating an internal configuration of the control device 21. The control device 21 performs image processing on an image captured by the X-ray cameras 8a and 8b, and the image processing unit 22. The display unit 23 that displays the image processed in the above, the motor drive unit 24 that operates the drive of the servo motors 11a and 11b, and the drill drive that drills the drills 5a and 5b by driving the drilling devices 6a and 6b. And a drive control unit 26 that outputs a drive control signal to the motor drive unit 24 and the drill drive unit 25.
[0032]
Further, the linear scale 9 is detected when the distance between the two reference position marks 15a and 15b formed on the subscale 14 and the reference position of the X-ray image are aligned with the center point of the reference position marks 15a and 15b. An error calculation unit 27 for obtaining an error between the distance between the moving units 3a and 3b obtained from the result, and a process for correcting the drilling position by the drills 5a and 5b based on the error data obtained by the error calculation unit 27 A perforation position setting unit 28 for performing
[0033]
The table 2 is mounted with a fixing means such as a mechanical clamp or a vacuum clamp so that the printed circuit board 10 placed on the table 2 does not shift in position.
[0034]
Next, the operation of the guide drilling device 1 according to the above-described embodiment will be described. First, the printed board 10 to be drilled is placed on a desired portion on the table 2, and the printed board 10 is firmly fixed on the table 2 using a fixing means such as a mechanical clamp or a vacuum clamp.
[0035]
Next, when the X-ray imaging devices 4a and 4b are activated and X-rays are exposed from the X-ray tubes 7a and 7b, the X-ray cameras 8a and 8b capture X-ray fluoroscopic images of the printed circuit board 10, and this image The data is given to the image processing unit 22 shown in FIG. 3 for image processing and displayed on the display unit 23. Further, when a CCD camera is used as the imaging device, an image captured by the CCD camera is displayed on the display unit 23.
[0036]
When an operator turns on an operation switch (not shown) and an operation signal is input to the control device 21 shown in FIG. 3, the drive control unit 26 outputs a drive signal to the motor drive unit 24, thereby The servo motors 11 a and 11 b are rotationally driven to move the two moving units 3 a and 3 b in a one-dimensional manner along the linear scale 9. Then, the center point of the reference position marks 15a and 15b formed on the sub plate 14 is set so as to come to the reference position on the image picked up by the X-ray imaging devices 4a and 4b. In this state, the distance between the moving units 3a and 3b is obtained based on the position data of the moving units 3a and 3b detected by the linear scale 9 (this distance is L2).
[0037]
On the other hand, as described above, the distance between the two reference position marks 15a and 15b formed on the sub-plate 14 is set in advance (this distance is assumed to be L1). An error ΔL between the data L1 and L2 is calculated.
That is, the error ΔL is obtained by the following equation (1).
ΔL = L2−L1 (1)
[0038]
Further, as described above, since the sub-plate 14 is made of a material that has an extremely low expansion rate due to a change in the ambient temperature, it can be considered that the value of L1 is extremely reliable without being affected by the temperature change. . Therefore, the error ΔL obtained by the equation (1) is caused by expansion / contraction due to temperature change of various parts constituting the moving units 3a and 3b such as the arms 16a and 16b shown in FIG. It is thought that this occurred.
[0039]
In the following processing, the accuracy of the guide hole drilling position is improved by drilling the guide hole at a position where the error is corrected.
That is, when the error ΔL is obtained by X-ray imaging of the reference position marks 15 a and 15 b of the sub-plate 14, the motor driving unit 24 continues to drive the servo motors 11 a and 11 b to form in advance on the printed circuit board 10. The reference position on the image captured by the X-ray imaging devices 4a and 4b is set at the center point of the guide hole mark.
[0040]
Further, the distance between the two guide hole marks (this distance is assumed to be M) is set in advance (for example, M = 20 cm, 25 cm, etc.). In the drilling position setting unit 28 shown in FIG. A corrected distance M ′ is obtained by adding a process according to the following equation (2) to M.
M ′ = M × {1− (ΔL / L2)} (2)
[0041]
Based on the detection result of the linear scale 9, the motor drive unit 24 drives and controls the servo motors 11a and 11b so that the distance between the moving units 3a and 3b becomes M '. The drill driving unit 25 outputs a drive signal to the drilling units 6a and 6b. The drill 5a and 5b are moved to the reference position of the X-ray image by the drive signal, and are driven to rotate while descending. A guide hole is drilled at a desired guide hole drilling position. In this way, by correcting the preset distance M between the two guide holes using the error data ΔL obtained by the equation (1), the moving units 3a, 3b such as the arms 16a, 16b shown in FIG. Even when the various components constituting the lens expand and contract due to changes in ambient temperature, it is possible to compensate for the positional deviation of the guide drilling position caused by the expansion and contraction. As a result, the accuracy of the guide drilling position can be significantly improved.
[0042]
In this way, in the guide drilling device 1 according to the present embodiment, the interval between the guide drilling positions obtained from the imaging results of the X-ray imaging devices 4a and 4b and the detection result of the linear scale 9 due to changes in the ambient temperature. Even if there is a deviation between the distance between the two moving units 3a and 3b obtained by the above, this deviation can be corrected. Drilling is possible.
[0043]
In the above-described embodiment, the example in which the sub-plate 14 in which the two long holes 11 are formed as shown in FIG. 4 has been described. However, as shown in FIG. 5, the slightly shorter sub-plate 14 ′ is used. It is also possible to use this so that it is disposed inside the table 2 between the two grooves 13a and 13b shown in FIG.
[0044]
Further, although an example in which the reference position marks are formed at two locations on the sub-plate 14 has been described, it is possible to adopt a configuration in which the reference position marks are formed at one location or three or more locations.
[0045]
In the above-described embodiment, an example in which a material having an extremely small expansion coefficient due to a temperature change is used as the sub plate 14 has been described. However, the material of the sub plate 14 is the same as the material of the printed circuit board 10, or If a material having the same temperature expansion coefficient is used, an error caused by expansion and contraction due to the ambient temperature of the printed circuit board 10 itself can be corrected, and the drilling position accuracy of the guide hole can be further improved. Is possible.
[0046]
That is, when the ambient temperature changes, the printed circuit board 10 itself expands and contracts depending on the temperature. Therefore, by forming the sub plate 14 from the same material as the printed circuit board 10 or a material having the same temperature expansion coefficient, the temperature change is caused. The resulting expansion and contraction of the printed circuit board 10 can be corrected. Thereby, drilling of the guide hole with higher accuracy becomes possible.
[0047]
In the above-described embodiment, the example in which the position of the moving units 3a and 3b is detected using the linear scale 9 has been described. However, the position of the moving units 3a and 3b is detected using a rotary encoder instead of the linear scale 9. it may be, also, can be configured in combination a linear scale and a rotary encoder.
[0048]
In the above-described embodiment, the guide drilling device has been described as an example of the processing device. However, the present invention is not limited to this, and various processing devices (punch, cutting) having a function of positioning the moving unit. , Polishing, leather, etc.).
[0049]
Furthermore, in the above-described embodiment, the example having two moving units 3a and 3b has been described. However, the present invention is not limited to this, and can be applied to a processing apparatus having one moving unit. It is.
[0050]
【The invention's effect】
As described above, according to the printed circuit board processing apparatus of the present invention, the two reference position marks formed on the sub-plate are imaged by the imaging device, and the distance between the two reference position marks is determined. If an error occurs between the distance detected by the position detection means and the preset distance between the reference position marks, the workpiece is processed by the processing tool according to the magnitude of the error. It is configured to correct the position. Therefore, even when a deviation occurs in the machining position of the workpiece due to a change in ambient temperature or the like, this can be corrected, so that the machining accuracy can be remarkably improved.
[0051]
In addition, if the material constituting the sub-plate is the same material as the workpiece or a material having the same coefficient of thermal expansion, this can be corrected for expansion and contraction of the workpiece itself due to changes in ambient temperature. Thus, the machining accuracy of the workpiece can be further improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a guide drilling device according to an embodiment of the present invention.
FIG. 2 is a front view showing a configuration of a guide drilling device according to an embodiment of the present invention.
FIG. 3 is a block diagram showing a detailed configuration of a control device.
FIG. 4 is an external view showing a configuration of a sub plate.
FIG. 5 is an external view showing a configuration of a modified example of a sub-plate.
FIG. 6 is a plan view showing a configuration of a conventional guide drilling device.
FIG. 7 is a front view showing a configuration of a conventional guide drilling device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Guide drilling apparatus 2 Table 3a, 3b Moving unit 4a, 4b X-ray imaging device 5a, 5b Drill 6a, 6b Drilling apparatus 7a, 7b X-ray tube 8a, 8b X-ray camera 9 Linear scale 10 Printed circuit board 10a Guide hole mark 11a, 11b Servo motors 13a, 13b Grooves 14, 14 'Subplates 15a, 15b Reference position marks 16a, 16b Arm 17 Slot 21 Controller 22 Image processing unit 23 Display unit 24 Motor drive unit 25 Drill drive unit 26 Drive control unit 27 Error Calculation Unit 28 Drilling Position Setting Unit

Claims (6)

A moving unit on which an imaging device and a processing tool are mounted, a driving unit that slides the moving unit in a one-dimensional direction, and a linear scale or a rotary encoder that detects a one-dimensional position of the moving unit moved by the driving unit And comprising
In the workpiece processing apparatus configured to move the processing tool mounted on the moving unit to a desired position on the workpiece and then operate the processing tool to process the desired position of the workpiece.
A sub-plate on which at least two reference position marks at a set value interval are formed is disposed along the one-dimensional direction;
Two reference position marks formed on the sub-plate are imaged by an imaging device mounted on the moving unit, and the distance between the reference position marks is measured by the linear scale or the rotary encoder to obtain a measurement value. ,
An apparatus for processing a workpiece, wherein the position of the processing tool measured by a linear scale or a rotary encoder is corrected based on a ratio of the set value to the measured value . Two moving units on which an imaging device and a processing tool are mounted, a driving unit that slides each moving unit in a one-dimensional direction, and a linear that detects a one-dimensional position of each moving unit moved by the driving unit A scale or a rotary encoder ,
In the workpiece machining apparatus configured to process the desired position of the workpiece by operating the machining tool after moving the machining tool mounted on each moving unit to a desired position on the workpiece,
A sub-plate on which at least two reference position marks at a set value interval are formed is disposed along the one-dimensional direction;
Two reference position marks formed on the sub-plate are imaged with an imaging device mounted on the two moving units, and the distance between the two reference position marks is measured by a linear scale or a rotary encoder. Find the value
An apparatus for processing a workpiece, wherein an interval between the two processing tools measured by a linear scale or a rotary encoder is corrected based on a ratio of the set value to the measured value. Two moving units on which an imaging device and a processing tool are mounted, driving means for sliding the two moving units in a one-dimensional direction, and a one-dimensional position of each moving unit moved by the driving means are detected. A linear scale or a rotary encoder ,
In the workpiece machining apparatus configured to process the desired position of the workpiece by operating the machining tool after moving the machining tool mounted on each moving unit to a desired position on the workpiece,
A sub-plate arranged along the one-dimensional direction at an appropriate position of a table on which the workpiece is placed , wherein the sub-plate is formed with at least two reference position marks at a set value interval ;
The two reference position marks formed on the sub-plate are imaged by an imaging device mounted on each moving unit, and the distance between the two reference position marks is measured by the linear scale or rotary encoder. Calculating means for calculating a ratio of the set value to a measured value to be measured ;
Machining position setting means for correcting the machining position on the workpiece according to the numerical value obtained by the computing means ;
An apparatus for processing a workpiece, comprising:   The workpiece processing apparatus according to claim 1, wherein the sub-plate is configured using a material having a temperature expansion coefficient substantially the same as that of the workpiece. The said processing tool is any one of a drill, a punch, a cutting | disconnection, grinding | polishing, and a laser , The processing apparatus of the workpiece | work of any one of Claims 1-3 characterized by the above-mentioned. The work processing apparatus according to claim 1 , wherein the work is a printed circuit board.

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