CN107538138B - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

Info

Publication number
CN107538138B
CN107538138B CN201710494389.3A CN201710494389A CN107538138B CN 107538138 B CN107538138 B CN 107538138B CN 201710494389 A CN201710494389 A CN 201710494389A CN 107538138 B CN107538138 B CN 107538138B
Authority
CN
China
Prior art keywords
frame
workpiece
fixing
interval
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710494389.3A
Other languages
Chinese (zh)
Other versions
CN107538138A (en
Inventor
时田大作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Mechanics Ltd filed Critical Via Mechanics Ltd
Publication of CN107538138A publication Critical patent/CN107538138A/en
Application granted granted Critical
Publication of CN107538138B publication Critical patent/CN107538138B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a laser processing device, which can reliably fix a workpiece on a workbench without floating the workpiece even if the sizes of the workpiece are different. A laser processing device is characterized by comprising: a rectangular workpiece clamping portion, which is composed of a first frame to a fourth frame, is arranged on the workbench and is used for fixing the workpiece on the workbench; a clamping drive section for changing the width of the rectangle and the interval between the workpiece clamping section and the table; and a control unit that controls the clamp driving unit so as to expand the gap when the lateral width is expanded and to reduce the gap when the lateral width is reduced.

Description

Laser processing apparatus
Technical Field
The present invention relates to a laser processing apparatus for drilling a workpiece such as a printed circuit board fixed to a table, and relates to a technique for fixing a workpiece.
Background
Conventionally, when machining in a laser machining apparatus, it is known to suction-fix a printed circuit board as a workpiece on a table. However, since only the suction is insufficient, the end portion of the printed circuit board is fixed by the chuck mechanism and the punching process is performed (patent document 1).
Documents of the prior art
Patent document
Patent document 1 Japanese patent application laid-open No. 10-328863
Disclosure of Invention
Technical problem to be solved by the invention
In the conventional technique as described above, the length of the printed circuit board pressing member of the clamping mechanism is fixed, and therefore, it is impossible to cope with a change in the size of the printed circuit board, and the four sides of the end portion of the printed circuit board may not be pressed. Therefore, there is a disadvantage that a portion floating from the table is generated on the printed board, and the processing accuracy is deteriorated, such as an error in reading the alignment mark marked in the vicinity of the end portion of the printed board.
The present invention aims to provide a laser processing device which can reliably fix a workpiece on a workbench without floating the workpiece even if the sizes of the workpiece are different.
Means for solving the technical problem
In order to solve the above problem, a laser processing apparatus according to the present invention includes: a workpiece clamping portion provided on a table for fixing a workpiece to the table, the workpiece clamping portion including: a first frame to which a first clamper for fixing a first edge positioned on an end side of the workpiece is attached; a second frame to which a second holder for fixing a second edge located on an end side of the workpiece is attached, the second edge being at right angles to the first edge; a third frame parallel to the first frame; a fourth frame parallel to the second frame; a first member that is parallel to the first frame and is movable in a direction at right angles to the first frame, the first member being attached to a third clamp that fixes a third edge on an end side of the workpiece, the third edge being parallel to the first edge; a second member that is parallel to the second frame and is movable in a direction at right angles to the second frame, the second member being attached with a fourth gripper for fixing a fourth edge on an end side of the workpiece, the fourth edge being parallel to the second edge; a first fixing portion fixing an end portion of the first frame and an end portion of the fourth frame to each other; and a second fixing portion fixing an end portion of the second frame and an end portion of the third frame to each other; a clamp driving portion for changing a first interval between the first fixing portion and the second fixing portion and a second interval between the workpiece clamping portion and the table; and a control unit that controls the clamp driving unit so that the second interval is increased when the first interval is increased and the second interval is decreased when the first interval is decreased.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, even when the sizes of the workpieces are different, the workpieces can be reliably fixed to the table without floating the workpieces.
Drawings
Fig. 1 is a perspective view of a workpiece clamping portion in a laser processing apparatus according to the present invention.
Fig. 2 is a view showing a released state of the work clamping portion of fig. 1.
Fig. 3 is a view showing a clamped state of the work clamping portion of fig. 1.
Fig. 4 is a schematic view of a laser processing apparatus according to the present invention.
Description of the symbols
1 laser unit 2 camera 3 integral control part 4 work 5XY table 6 work piece clamping part 7 clamping rod 8 clamping rod driving part 9, 10 control signal 21-24 clamping frame 25, 26 clamping rod 27, 28 connecting part 36-39 clamper 40 window
Detailed Description
Fig. 4 is a schematic view of a laser processing apparatus according to an embodiment of the present invention.
The laser unit 1 irradiates the surface of the workpiece 4 with laser light emitted from a laser light source. The XY table 5 moves the workpiece 4 in the X direction (vertical direction to the paper surface) and the Y direction (horizontal direction to the paper surface). And a workpiece clamping part 6 for fixing the workpiece 4 on the XY table 5. The camera 2 picks up an image of an alignment mark of the workpiece 4. The clamp lever driving unit 8 moves the clamp lever 7 in the Z direction (vertical direction with respect to the paper surface) and in the P direction, which will be described later. The overall control unit 3 controls the laser unit 1, the camera 2, the XY table 5, the work clamp 6, the clamp rod driving unit 8, and the like. The clamp lever driving unit 8 is provided in the XY table 5.
Fig. 1 to 3 are views showing details of the work clamping portion 6 in fig. 4. 21. 22, 23, and 24 are clamp frames, respectively, and form four sides of the rectangular workpiece clamping portion 6. The clamp frames 21 and 24 are fixed to each other at one end in a right-angle direction at a fixing portion 29 to be L-shaped. Similarly, the clamp frames 22 and 23 are fixed to each other at one end in the right-angle direction by the fixing portion 30, and are L-shaped. Guide grooves 31 to 34 are formed in the clamp frames 21 to 24, respectively. Reference numeral 25 denotes a clamp rod which is slidably fitted in the guide groove 31 and the guide groove 33 and is movable in the Y direction on the paper surface. Reference numeral 26 denotes a clamp rod, one end of which is slidably fitted in the guide groove 32, and the other end of which is slidably fitted in a guide groove 34 formed in the clamp frame 24 so as to penetrate through a guide groove 35 provided in the clamp rod 25, and which is movable in the direction of the drawing sheet X.
Grippers 36 and 37 are attached to the lower sides of the clamp frames 21 and 22, respectively, and grippers 38 and 39 are attached to the lower sides of the clamp rods 25 and 26, respectively. The grippers 38, 39 are each provided with a plurality of lengths, and can be appropriately replaced by an operator according to the size of the workpiece 4. The fixing portions 29 of the clamp frames 21 and 24 and the fixing portions 30 of the clamp frames 22 and 23 are coupled to a clamp rod driving portion 8 provided in the XY table 5 via a clamp rod 7 attached to the lower side thereof.
The fixing portions 29 and 30 are located on the diagonal line of a rectangle surrounded by the clamp frames 21 to 24, and the clamp lever driving portion 8 drives the clamp lever 7 in the P direction, i.e., the diagonal direction, by controlling in accordance with the control signal 9 from the overall control portion 3, thereby changing the interval between the fixing portions 29 and 30. The other ends of the clamp frames 21 and 22 are connected to each other by a connecting portion 27 in which a piston and a cylinder are combined, and the other ends of the clamp frames 23 and 24 are also connected to each other by a connecting portion 28 in which a piston and a cylinder are combined in the same manner. The coupling portions 27 and 28 are controlled in accordance with the control signal 10 from the overall control portion 3, and the intervals between the coupling portions can be changed.
When the width of the rectangular window 40 surrounded by the clamp frames 21 and 22 and the clamp rods 25 and 26 is increased, the distance between the fixing portions 29 and 30 is increased, and the distance between the connecting portions 27 and 28 is also increased. Conversely, when the width of the window 40 is reduced, the distance between the fixing portions 29 and 30 is reduced, and the distance between the connecting portions 27 and 28 is also reduced.
The clamp lever driving unit 8 is controlled by a control signal 9 from the overall control unit 3, and can drive the clamp lever 7 in the Z direction (vertical direction with respect to the paper surface) from the XY table 5 side. That is, when the width of the window 40 is reduced, the clamp rod 7 is driven downward in the Z direction, and the workpiece clamp 6 is lowered to clamp the workpiece 4. Conversely, when the width of the window 40 is increased, the clamp rod 7 is driven upward in the Z direction to raise the workpiece clamp 6, thereby releasing the clamping of the workpiece 4.
When the workpiece 4 is carried onto the XY table 5, first, the XY table 5 is moved in the X direction to a position where the workpiece clamping portion 6 does not face the laser unit 1. Thereafter, the clamp rod 7 is pushed upward in the Z direction by the clamp rod driving unit 8 provided in the XY table 5 to raise the workpiece clamp 6, and the lateral width of the window 40 is enlarged. In this state, the workpiece 4 is inserted from above the workpiece clamping portion 6 through the window 40 by a not-shown dedicated workpiece conveying mechanism. This state (released state) is shown in fig. 2. The part of the figure shown by hatching is the workpiece 4. Thereafter, the width of the window 40 is reduced, and the clamp rod 7 is driven downward in the Z direction to lower the work clamp 6. Thereby, the workpiece 4 is fixed between the workpiece clamping portion 6 and the XY table 5. This state (clamped state) is shown in fig. 3. The machining of the workpiece 4 by the laser unit 1 is performed after moving the XY table 5 in the X direction to a position where the workpiece clamping portion 6 faces the laser unit 1.
When the workpiece 4 is carried out from the XY table 5, first, the XY table 5 is moved in the X direction to a position where the workpiece clamp 6 does not face the laser unit 1. Thereafter, the work 4 is taken out from the upper side through window 40 by a dedicated work conveying mechanism in the unclamped state.
When workpieces 4 having different sizes are to be processed, the clamp rods 25 and 26 are moved in the direction Y, X according to the sizes, and the grippers 38 and 39 corresponding to the sizes are attached to the clamp rods 25 and 26, respectively. This is performed in the above-described released state in which the workpiece 4 is not present, and in a state in which the lateral width of the window 40 is enlarged.
According to the above embodiment, since the four sides of the end portion of the workpiece 4 such as the printed circuit board can be reliably fixed, there is no portion of the workpiece 4 that floats from the upper surface of the XY table 5, and it is possible to prevent the lowering of the machining accuracy due to the floating of the end portion of the workpiece 4. Further, by moving the clamp rods 25 and 26 in the Y, X direction in accordance with the size of the workpiece 4 and replacing the grippers 38 and 39, workpieces 4 of various sizes can be fixed to the XY table 5.
It should be noted that, in the above embodiment, although the clamp lever driving section 8 drives both the fixing sections 29 and 30, in the case where only one of the fixing sections 20 or 30, that is, the width of the adjustable window 40 is driven, both the fixing sections 29 and 30 are not necessarily driven.
It should be noted that, in the above-described embodiment, although the coupling portions 27, 28 are controlled by the overall controller 3 to control the intervals of the coupling portions, in the case where only the fixing portions 29 and 30, i.e., the width of the adjustable window 40 is driven, the coupling portions 27, 28 may be configured such that only the ends of the frames are slidably fitted to each other without being controlled by the overall controller 3.
In the above-described embodiment, although the one workpiece 4 is fixed to the XY table 5, a plurality of laser units 1 and workpieces 4 may be provided, and the same number of workpiece clamping portions 6 as the number of workpieces 4 may be provided to simultaneously fix the plurality of workpieces 4 and perform machining.
The present invention is not limited to the above-described embodiments and various modifications are possible, and all technical matters included in the technical idea described in the claims are intended to be the object of the present invention.

Claims (2)

1. A laser processing device is characterized by comprising:
a workpiece clamping portion provided on a table for fixing a workpiece to the table, the workpiece clamping portion including: a first frame to which a first clamper for fixing a first edge positioned on an end side of the workpiece is attached; a second frame to which a second holder for fixing a second edge located on an end side of the workpiece is attached, the second edge being at right angles to the first edge; a third frame parallel to the first frame; a fourth frame parallel to the second frame; a first member that is parallel to the first frame and is movable in a direction at right angles to the first frame, the first member being attached to a third clamp that fixes a third edge on an end side of the workpiece, the third edge being parallel to the first edge; a second member that is parallel to the second frame and is movable in a direction at right angles to the second frame, the second member being attached with a fourth gripper for fixing a fourth edge on an end side of the workpiece, the fourth edge being parallel to the second edge; a first fixing portion fixing an end portion of the first frame and an end portion of the fourth frame to each other; and a second fixing portion fixing an end portion of the second frame and an end portion of the third frame to each other;
a clamp driving portion for changing a first interval between the first fixing portion and the second fixing portion and a second interval between the workpiece clamping portion and the table; and
a control unit that controls the clamp driving unit so that the second interval is increased when the first interval is increased and the second interval is decreased when the first interval is decreased,
the work clamping portion has: a first connecting portion that connects the other end portion of the first frame and the other end portion of the second frame to each other, the first connecting portion being configured such that a third interval between the connecting portions is variable; and a second connecting portion connecting the other end of the third frame and the other end of the fourth frame to each other, a fourth interval of a connecting portion of the second connecting portion being variable,
the control unit controls the first coupling unit and the second coupling unit so that the third interval and the fourth interval are enlarged when the first interval is enlarged, and the third interval and the fourth interval are reduced when the first interval is reduced.
2. Laser processing apparatus according to claim 1,
the clamp driving part is provided inside the table, and drives the first fixing part and the second fixing part via a member fixed to the first fixing part and the second fixing part.
CN201710494389.3A 2016-06-27 2017-06-26 Laser processing apparatus Active CN107538138B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016126352 2016-06-27
JP2016-126352 2016-06-27
JP2017-095154 2017-05-12
JP2017095154A JP6806625B2 (en) 2016-06-27 2017-05-12 Laser processing equipment

Publications (2)

Publication Number Publication Date
CN107538138A CN107538138A (en) 2018-01-05
CN107538138B true CN107538138B (en) 2020-09-01

Family

ID=60945512

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710494389.3A Active CN107538138B (en) 2016-06-27 2017-06-26 Laser processing apparatus

Country Status (4)

Country Link
JP (1) JP6806625B2 (en)
KR (1) KR102304688B1 (en)
CN (1) CN107538138B (en)
TW (1) TWI710420B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108705211A (en) * 2018-07-19 2018-10-26 安徽美诺福科技有限公司 A kind of laser cutting system and steel plate system of processing
CN111570958B (en) * 2019-02-15 2022-06-21 上海炫邦电子科技有限公司 Precision welding machine
CN111761288A (en) * 2020-08-07 2020-10-13 珠海格力智能装备有限公司 Welding positioning auxiliary device
RU205266U1 (en) * 2020-12-30 2021-07-06 Общество с ограниченной ответственностью "НПК Морсвязьавтоматика" TABLE FOR INSTALLATION OF WORKED PARTS

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2207691A1 (en) * 1972-02-18 1972-08-30 Peri Werk Schwoerer Kg Artur CONCRETE FORMWORK
EP0623449B1 (en) * 1993-05-04 1998-07-01 Georg Geiss Maschinenfabrik Clamping frame for deep-drawing machine
CN2569519Y (en) * 2002-09-23 2003-08-27 华为技术有限公司 Welding general tray for print circuit board
CN2580727Y (en) * 2002-11-08 2003-10-15 华硕电脑股份有限公司 Two edge adjustable type circuit board frame clamp
CN200983722Y (en) * 2006-12-15 2007-11-28 捷营精密有限公司 An adjustable PCB carrying tool
CN104148767A (en) * 2014-07-14 2014-11-19 天津中电达人电子科技有限公司 Wave soldering fixture

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550617B2 (en) 1997-06-03 2004-08-04 日立ビアメカニクス株式会社 Laser processing equipment
JP3196927B2 (en) * 1997-10-24 2001-08-06 住友重機械工業株式会社 Sheet Clamping Equipment of Sheet Forming Machine
JP4251745B2 (en) 2000-02-23 2009-04-08 日立ビアメカニクス株式会社 Laser processing machine
KR100599490B1 (en) 2004-09-02 2006-07-12 강삼태 A jig for LCD inspecting line
KR100930871B1 (en) * 2007-10-04 2009-12-10 주식회사 성우하이텍 Conduction laser welding device of aluminum blank
JP5615636B2 (en) 2010-09-13 2014-10-29 倉敷レーザー株式会社 Welding jig
KR101572640B1 (en) 2015-05-22 2015-11-27 한주훈 Jig for apparatus inspecting covered display panel

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2207691A1 (en) * 1972-02-18 1972-08-30 Peri Werk Schwoerer Kg Artur CONCRETE FORMWORK
EP0623449B1 (en) * 1993-05-04 1998-07-01 Georg Geiss Maschinenfabrik Clamping frame for deep-drawing machine
CN2569519Y (en) * 2002-09-23 2003-08-27 华为技术有限公司 Welding general tray for print circuit board
CN2580727Y (en) * 2002-11-08 2003-10-15 华硕电脑股份有限公司 Two edge adjustable type circuit board frame clamp
CN200983722Y (en) * 2006-12-15 2007-11-28 捷营精密有限公司 An adjustable PCB carrying tool
CN104148767A (en) * 2014-07-14 2014-11-19 天津中电达人电子科技有限公司 Wave soldering fixture

Also Published As

Publication number Publication date
KR20180001449A (en) 2018-01-04
JP6806625B2 (en) 2021-01-06
TWI710420B (en) 2020-11-21
JP2018001273A (en) 2018-01-11
KR102304688B1 (en) 2021-09-24
CN107538138A (en) 2018-01-05
TW201800169A (en) 2018-01-01

Similar Documents

Publication Publication Date Title
CN107538138B (en) Laser processing apparatus
US11007768B2 (en) Board work device having support member conveyance section for conveying board support member
JP6619019B2 (en) Anti-substrate working system and insertion method
US20070218737A1 (en) Printed-Board Supporting Apparatus
CN106413372B (en) Conveying device
WO2013118175A1 (en) Machining system and control method
JP2009073714A (en) Glass substrate cutting device
JP2008085275A (en) Method and device for alignment
CN105845561B (en) Alignment method
JP6946286B2 (en) Screen printing device
JP2008221438A (en) Robot hand and robot
JP2008114521A (en) Screen printing equipment and underproping exchanging work in screen printing equipment
JP2017220498A (en) Component mounting equipment and component mounting method
JP2006297521A (en) Apparatus for machining groove on plate material
JP4942188B2 (en) Substrate clamping mechanism and drawing system
TWM639285U (en) Substrate cutting device
JP5487982B2 (en) Screen printer and foreign matter detection method for screen printer
JP6857609B2 (en) Bending device and bending method
JP7283851B2 (en) Laser processing equipment
JP2011143548A (en) Screen printing machine and screen printing method
KR20120037240A (en) Cutting and chamfering circular saw
JPWO2017216948A1 (en) Screen printer
WO2019171561A1 (en) Clamp structure of manipulator and method of bending sheet material using same
KR101913279B1 (en) Board processing apparatus and board processing method
JPWO2017037949A1 (en) Working machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant