TWM639285U - Substrate cutting device - Google Patents

Abstract

A cutting device for a substrate, comprising: a first cutter and a second cutter set to mark a cutting line parallel to the moving direction of the high beam device 4; The side surface of the table A supports the substrate as a reference; and the control unit calculates the amount of deviation between the long side direction of the high beam device and the preset reference when marking, and corrects the positions of the first tool and the second tool . This invention can solve the problem that there is no alignment mark (Alignment Mark) as a reference on the main glass substrate as formed on the liquid crystal panel, and the cutting line is not formed within the cutting processing accuracy.

Description

Substrate cutting device

The invention relates to a cutting device, which is used to draw a cutting line for cutting edges (Cutting Edges) on each edge (four edges) of a substrate (such as glass, etc.).

In order to trim the four edges of substrates such as glass as a pre-processing, it is necessary to process the dicing line.

Therefore, the size of the main glass substrate of the liquid crystal is, for example, a large size of 2200 mm on the short side x 2500 mm on the long side.

As a pre-processing of processing the large-sized substrate, a cutting line for edge trimming was drawn on each edge (four edges) of the substrate. [Patent Document]

Patent Document 1: Japanese Patent No. 3216017

Incidentally, according to the apparatus of Patent Document 1, a liquid crystal panel is supplied on a stage, alignment marks of the liquid crystal panel are read and calculated by a camera, and dicing lines are drawn on the upper surface of the substrate.

On the other hand, there is a problem that no alignment mark as a reference like that on a liquid crystal panel is formed on the main glass substrate, and that cutting lines cannot be formed within the precision of the cutting process.

Therefore, an object of the invention is to mount a reference scale on a cutting device and improve the cutting accuracy of a main glass substrate.

The device used in this creation to solve the above problems includes: a workbench, which is set to support the substrate, and the substrate is supplied and placed on the workbench; two parallel first guide devices are arranged in the left and right directions of the workbench The outer sides on both sides; the high beam device is set to be guided by the first guide device and moved in the left and right direction by the first traveling device; the first slider and the second slider are set to slide on the track Engage freely, and at the same time, move back and forth between the first guide devices by the second traveling device, wherein the track is arranged between the two ends of the high beam device; the first cutter and the second cutter, depicting and The cutting line parallel to the moving direction of the high beam device of the substrate, the first slider and the second slider are respectively arranged to be raised and lowered by the lifting device; a plurality of scales are opposite to the long side direction of the high beam device The side surface of the workbench supports the substrate as a reference; and the control unit calculates the amount of deviation between the long side direction of the high beam device and the preset reference when marking, and corrects the first tool and the second tool s position.

As described above, with the substrate cutting device of the present invention, since the deviation of the cutting line is corrected after a predetermined number of scribing, the glass substrate can be cut into a predetermined size with high precision.

In addition, since the scale is attached to the edge of the side surface of the table facing the longitudinal direction of the high beam device, the positioning of the substrate can be performed with high precision.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. A shown in FIG. 1 is a table for placing, for example, a glass substrate a on which is supplied.

As the above-mentioned substrate a, for example, a large-sized liquid crystal main substrate with a short side of 2200 mm and a long side of 2500 mm is supplied, for example, by a supply machine or the like, placed on a table A as a machine (stage), and supplied. The substrate a can be attracted and held on the table A. As the suction and holding device, as described in the prior art, numerous small holes (not shown) are provided on the upper panel of the hollow suction workbench A, and the substrate a is sucked and held on the upper panel of the workbench A. superior.

In addition, two parallel first guide devices 1 are provided on both sides of the moving direction of the worktable A. Two parallel rails are laid as the above-mentioned first guide device 1 .

Furthermore, sliders 2 at both ends are slidably engaged with the first guide device 1, and a high beam device 4 that is moved in the X direction by the first traveling device 3 is provided.

As the first running device 3 of the high beam device 4, in the case of the figure, the internal thread 7 is supported at both ends of the door-shaped high beam device 4 and does not interfere with the first guide device 1 or the workbench A. The lower end of the foot material 6 extending downwards at the position, the external thread 8 screwed on the internal thread 7 can be reversely driven by the motor 9 to move the high beam device 4, but the walking device is not limited to the illustration.

In addition, the high beam device 4 is provided with a first cutter 10 for scribing a cut line X1 along the left-right direction (X direction) of the upper surface of the substrate a on the table A and a second cutter 11 for scribing a cut line X2 .

Above-mentioned 1st cutter 10 and the 2nd cutter 11, as shown in the 2nd figure, wherein the 1st slide block 13 and the 2nd slide block 14 engage in the guide rail 12 that is located at the guide rail 12 between two ends of the high beam device 4 in a slidable manner At the same time, the linear motor supported by the first slider 13 and the second slider 14 is used as the second traveling device 15 and can move in the Y direction. This kind of running device is not limited, and other modes can also be used.

Also, the first cutter 10 and the second cutter 11 are raised and lowered by providing cylinders 16 as elevating devices supported by the first slider 13 and the second slider 14 , respectively.

Therefore, as the first traveling device 3, the first cutter 10 and the second cutter 11 are moved in the X direction by the operation of the motor 9, and a line is drawn on the upper surface of the substrate a, and the cutting line X1 and the cutting line X1 are respectively formed. Line X2.

In addition, an X stage 23, a Y stage 22, and a Z stage 21 for finely adjusting the position of the camera 24 in the X, Y, and Z directions are provided on the first slider 13 and the second slider 14, respectively. The cutting line X1 and the cutting line X2 respectively formed by the first cutter 10 and the second cutter 11 can be manually aligned with the electronic line of the camera 24 .

First, as an initial setting, the distance between the cutting line X1 and the cutting line X2 (distance between pitches) is input as data into the control unit 50, and the scale installed on the surface of the table A facing the high beam device 4 On the holder 26, a ruler 25 with a length of about 200 mm is provided.

Then, the positions of the first cutter 10 and the second cutter 11 along the Y direction are adjusted so that the cutting line X1 and the cutting line X2 are respectively located within the setting range of the scale 25 .

The scale 25 is a reference for positioning the glass substrate a in the X direction, preferably a glass scale.

In addition, the control unit 50 is provided with an image processing device 51 for processing the image captured by the camera 24 so that the respective centers of the cutting line X1 and the cutting line X2 can be recognized by the electron beam.

First, the high beam device 4 moves in the X direction and stops near the end surface of the glass substrate a. The first cutter 10 and the second cutter 11 are lowered onto the glass substrate a by the air cylinder 16, and after marking the cutting line X1 and the cutting line X2, the first cutter 10 and the second cutter 11 are raised to make the high beam device 4 Move in the direction opposite to the direction of the scribed line in the X direction to be scribed. The camera 24 stops at the position where the cutting line X1 and the cutting line X2 are captured, and then performs image processing to detect the preset reference position and the offset in the Y direction of the cutting line.

After that, the first cutter 10 and the second cutter 11 are moved in the Y direction to correct the offset detected by the control unit 50 .

Such movement of the first cutter 10 and the second cutter 11 in the Y direction may be performed every time marking is performed, or may be performed every set number of times.

In addition, in the description, although two cutting lines, the cutting line X1 and the cutting line X2, are described, it is also possible to add at least one slider to measure a plurality of cutting lines for correction.

As described above, the reference scale is provided to improve the cutting accuracy of the main glass substrate and to correct the deviation of the cutting line.

In addition, although the example of the cutting device used for unidirectional trimming has been described in this specification, after the unidirectional scribing is performed for the first time, the main glass substrate a is moved by the rotating pad 60 shown in FIG. Retreat upward, and then hold the main glass substrate a on the workbench A again after rotating it by 90°. The end surface of the main glass substrate a is detected by the alignment camera 61, and the angle correction of the stage A is performed by the stage rotation motor 62 shown in FIG. 5 . The second scribing for trimming in the other direction can be performed by moving the first cutter 10 and the second cutter 11 in the Y direction to predetermined positions for trimming in the other direction.

A: workbench a: Substrate X1, X2: cutting line 1: 1st guide device 2: slider 3: The first traveling device 4 : high beam device 6: foot material 7: Internal thread 8: external thread 9: Motor 10: 1st tool 11: 2nd tool 12: track 13: 1st slider 14: 2nd slider 15: The second traveling device 16: Cylinder 21: X machine 22: Y machine 23: X machine 24: camera 25: Ruler 26: Scale holder 50: Control Department 51: Image processing device 60:Rotating Pad 61:Calibrate the camera 62: Table rotation motor

Figure 1 is a plan view illustrating one embodiment of the present invention. Fig. 2 is the above-mentioned front view. Fig. 3 is a front view showing a state where a scale is attached to a workbench. Figure 4 is a top view illustrating another embodiment of the invention. Fig. 5 is a front view of Fig. 4 .

A: workbench

a: Substrate

X1, X2: cutting line

1: 1st guide device

2: slider

4: high beam device

10: 1st tool

11: 2nd tool

12: track

13: 1st slider

14: 2nd slider

16: Cylinder

24: camera

25: Ruler

50: Control Department

51: Image processing device

Claims (1)

A cutting device for a substrate, comprising: a workbench configured to support a substrate on which the substrate is supplied and placed; Two parallel first guiding devices are arranged on the outer sides of the workbench in the left-right direction; The high beam device is arranged to be guided by the first guiding device and moved in the left and right direction by the first traveling device; The first slide block and the second slide block are arranged to slide and engage freely on the track, and at the same time, the second traveling device moves back and forth between the first guide devices, wherein the track is set on the high beam between the ends of the device; The first cutter and the second cutter are used to draw a cutting line parallel to the moving direction of the high beam device of the substrate, and the first slider and the second slider are respectively arranged to be lifted and lowered by a lifting device; a plurality of scales, which become references when the base plate is supported on the side of the table opposite to the long-side direction of the high-beam device; and The control unit calculates the amount of deviation between the long-side direction of the high beam device and a preset reference when drawing, and corrects the positions of the first cutter and the second cutter.

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