JPH0313769U - - Google Patents
Info
- Publication number
- JPH0313769U JPH0313769U JP7502489U JP7502489U JPH0313769U JP H0313769 U JPH0313769 U JP H0313769U JP 7502489 U JP7502489 U JP 7502489U JP 7502489 U JP7502489 U JP 7502489U JP H0313769 U JPH0313769 U JP H0313769U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- mounting seat
- suction nozzle
- vacuum suction
- pin mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第３図は本考案のはんだ付け装置
のプリント板矯正装置の実施例を示す図で、第１
図は本考案の矯正装置を使用したはんだ付け装置
の全体を示す断面図、第２図は第１図の一点鎖線
の円Ａの部分を拡大して示し後記する第３図をＣ
−Ｃ切断線から見た断面図、第３図は第２図を矢
印Ｂから見た下面図、第４図はプリント板の反り
状態を示す断面図である。
２……プリント板、８……光ビーム、１０……
加熱手段、１２……電子部品、１４……真空吸着
ノズル、１６……ピン取付座、２０……付勢機構
、２２……押しピン、２６……ロータリーベース
、３０……駆動部、３６……マスク板、３８……
バツクアツプピン、４０……プリント板ガイド。
1 to 3 are views showing an embodiment of the printed board straightening device of the soldering device of the present invention, and FIG.
The figure is a cross-sectional view showing the entire soldering device using the straightening device of the present invention, and Figure 2 is an enlarged view of the part indicated by the dashed line circle A in Figure 1, and Figure 3 is C, which will be described later.
3 is a bottom view of FIG. 2 as viewed from arrow B, and FIG. 4 is a sectional view showing a warped state of the printed board. 2... Printed board, 8... Light beam, 10...
heating means, 12... electronic component, 14... vacuum suction nozzle, 16... pin mounting seat, 20... biasing mechanism, 22... push pin, 26... rotary base, 30... drive unit, 36... ...Mask board, 38...
Backup pin, 40...Printed board guide.
Claims (1)
はんだ付け個所に加熱手段により加熱されて搭載
された電子部品がはんだ付けされるはんだ付け装
置のプリント板上反り矯正装置において、前記電
子部品が吸着されて搬送される真空吸着ノズルの
前記プリント板に対向する一端部に前記プリント
板と平行に取付けられた円板状のピン取付座と、
このピン取付座の前記プリント板と対向する面側
に付勢機構を介して取付けられた複数個の押しピ
ンとを備えることを特徴とするはんだ付け装置の
プリント板上反り矯正装置。 In a printed board warp straightening device of a soldering machine, the electronic component is soldered to the soldering location of the printed board with solder adhered to a desired portion by being heated by a heating means. a disk-shaped pin mounting seat attached parallel to the printed board at one end opposite to the printed board of the vacuum suction nozzle that is conveyed by the vacuum suction nozzle;
A printed board warping correction device for a soldering machine, comprising a plurality of push pins attached via a biasing mechanism to a surface of the pin mounting seat facing the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502489U JPH0313769U (en) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502489U JPH0313769U (en) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313769U true JPH0313769U (en) | 1991-02-12 |
Family
ID=31615237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7502489U Pending JPH0313769U (en) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313769U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218409A (en) * | 2008-03-11 | 2009-09-24 | Yamaha Fine Technologies Co Ltd | Processing apparatus for processing object |
-
1989
- 1989-06-27 JP JP7502489U patent/JPH0313769U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218409A (en) * | 2008-03-11 | 2009-09-24 | Yamaha Fine Technologies Co Ltd | Processing apparatus for processing object |
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