WO2010119507A1

WO2010119507A1 - Apparatus and method for measuring semiconductor

Info

Publication number: WO2010119507A1
Application number: PCT/JP2009/057510
Authority: WO
Inventors: 寿治清水; 昭一藤森; 秀憲青木
Original assignee: パイオニア株式会社; 株式会社パイオニアＦａ
Priority date: 2009-04-14
Filing date: 2009-04-14
Publication date: 2010-10-21
Also published as: CN102077103B; CN102077103A; JPWO2010119507A1; JP4646271B1

Abstract

Provided is an apparatus for measuring electrical characteristics of a plurality of electronic components at the same time. A semiconductor measuring apparatus (1) is provided with a placing means (100) whereupon a plurality of electronic components (500) are placed; a first moving means (110) which can move the placing means in parallel to a surface whereupon the electronic components are placed; a first probe (200) for measuring the characteristics by being brought into contact with one electronic component; a second probe (300) which measures the characteristics by being brought into contact with other electronic component; a second moving means (320) which can move the second probe in parallel to the surface whereupon the electronic components are placed; and a third moving means (110) which can move the placing means in a direction orthogonally intersecting with the surface whereupon the electronic components are placed. The first moving means moves the placing means so that the one electronic component faces the first probe. The second moving means moves the second probe so that the second probe faces other electronic component. The third moving means moves the placing means so that the first and the second probes and the corresponding electronic components are broughtinto contact with each other.

Description

Semiconductor measuring apparatus and method

The present invention relates to a technical field of a semiconductor measuring apparatus and method for measuring electrical characteristics by bringing an inspection needle into contact with an electronic component such as a chip divided by a dicing process.

Conventionally, in order to measure each electrical characteristic of an electronic component such as a semiconductor chip formed on a semiconductor wafer, for example, a probe for measuring the electrical characteristic of the electronic component with a stylus of an inspection needle has been provided. Semiconductor measuring devices have been used. According to such measurement, it is possible to eliminate a semiconductor chip whose characteristics are determined to be defective before the assembly process, resulting in cost reduction and improvement in productivity.

Generally, a probe card having an inspection needle fixedly arranged in a probe apparatus is moved on a table on which a chip to be measured is mounted, so that the probe is provided on the chip with respect to the inspection needle. 2. Description of the Related Art A probe device that enables a stylus at a measurement site such as an electrode section is used. As a background to this, there are many cases where the measurement of an electrical characteristic by a probe is performed on a chip at the same time as an optical measurement device such as a photodetector. Such an optical measuring device needs to be arranged so that the stylus position of the inspection needle of the probe can be measured. For this reason, it is possible to fix and arrange such an optical measuring device by fixing the probe and movably configuring the table on which the chip is mounted with respect to the probe. This is advantageous in that it is possible to suitably prevent the mechanism of the probe apparatus from becoming complicated.

As described above, an improvement in productivity is required as a background for using such a probe apparatus. In order to achieve improvement in productivity, not only accuracy but also speed is required for measurement of electrical characteristics of a chip to be measured. In view of such circumstances, for example, a probe device has been devised that includes a plurality of measurement probes and is configured to measure the electrical characteristics of a plurality of chips at the same time.

For such a probe device having a plurality of probes, consider the case of a probe device having two probes for simplicity. According to the operation of such a probe device, each of two adjacent chips in one contact is brought into contact with the inspection probe of the corresponding probe. At this time, alignment is performed with reference to the position at which the inspection needle of one probe and the electrode portion of the corresponding one chip touch each other. At this time, the position of the inspection needle of the other probe is adjusted in advance by manual teaching so that the probe can be brought into contact with the electrode position of the other tip. For this reason, even if alignment is performed using one probe and one chip as a reference, each of the other probes and the corresponding chip can be stylused.

Japanese Patent Laid-Open No. 11-219988

However, there is no problem if the tip position is accurate with respect to the tip position assumed during teaching, but if there is a deviation from the reference tip position, correct stylus cannot be performed. There is a fear. At this time, when re-teaching the probe position based on the chip position information, it leads to an extension of the measurement time, which is not preferable because a quick process is preferred.

Also, in the chip arrangement, there are cases where there are contaminated chips or places where no chips exist. At this time, since the position of the table and the height adjustment of the table for the stylus of the inspection needle are adjusted based on the reference probe, the chip corresponding to the other probe is not contaminated or missing. If so, there is also a technical problem that leads to contamination of the inspection needle.

The present invention has been made in view of such a problem, and enables an accurate stylus in response to an unexpected change in the position of the tip, and on the other hand, the inspection stylus is soiled due to chip scumming or missing. An object of the present invention is to provide a probe device that appropriately prevents this.

In order to solve the above-described problems, a semiconductor measuring apparatus according to the present invention is a semiconductor measuring apparatus for measuring electrical characteristics of an electronic component, and includes a mounting means for mounting a plurality of the electronic components, and the electronic component. A first moving means that enables the placement means to move within a plane parallel to the surface on which the electronic component is placed; and a first measuring means that is fixed to the semiconductor measuring device and that measures electrical characteristics by contacting one electronic component. One probe, a second probe for measuring electrical characteristics by contacting another electronic component different from the one electronic component, and the second probe in a plane parallel to a surface on which the electronic component is placed And a third moving means for moving the mounting means in a direction in which the distance between the first probe and the surface on which the electronic component is placed is reduced or moved away. The first moving means is the one electric power source. The placement means can be moved so that the measurement site of the component faces the first probe, and the second movement device can move the second probe so as to face the measurement site of the other electronic component. The third moving means can move the placing means so that the first probe and the one electronic component, and the second probe and the other electronic component are in contact with each other.

In order to solve the above-described problem, the probe method of the present invention is a first method for measuring electrical characteristics of a plurality of electronic components placed on a placing means by contacting a measurement site of the electronic components. A semiconductor measurement method of a semiconductor measurement device comprising a probe and a second probe, wherein the measurement part of one electronic component is in a plane parallel to a surface on which the electronic component is placed so as to face the first probe The first moving step of moving the mounting means in the above and the first moving step in a plane parallel to the surface on which the electronic component is placed so as to face the measurement site of another electronic component different from the one electronic component. A second movement step for moving two probes; and a third movement for moving the placement means so that the first probe and the one electronic component and the second probe and the other electronic component are in contact with each other. A process.

It is the schematic which shows the structural example of the probe apparatus which concerns on embodiment of this invention. It is the schematic which shows the measurement order of a chip | tip by operation | movement of the probe apparatus which concerns on embodiment of this invention. It is a flowchart which shows the flow of basic operation | movement of the probe apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows a specific example of basic operation | movement of the probe apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows a specific example of basic operation | movement of the probe apparatus which concerns on embodiment of this invention.

An embodiment of the semiconductor measuring device according to the present invention is a semiconductor measuring device for measuring electrical characteristics of an electronic component, and a mounting means for mounting a plurality of the electronic components and a mounting of the electronic components. A first moving means capable of moving the placing means in a plane parallel to the plane; a first probe fixed to the semiconductor measuring device and measuring electrical characteristics by contacting one electronic component; A second probe that measures electrical characteristics by contacting another electronic component different from the one electronic component; and the second probe is movable in a plane parallel to a surface on which the electronic component is placed. Second moving means that moves, and third moving means that enables the placing means to move in a direction to reduce or move away the distance between the first probe and the surface on which the electronic component is placed, The moving means measures the one electronic component. The mounting means is movable so that the position faces the first probe, and the second moving means allows the second probe to move so as to face the measurement site of the other electronic component, The third moving means enables the placing means to move so that the first probe and the one electronic component, and the second probe and the other electronic component are in contact with each other.

According to the embodiment of the semiconductor measuring device of the present invention, the electronic component arranged on the mounting means is transferred to the first probe arranged in a fixed state in the device. The inspection needle of the first probe touches the electrode part of the electronic component, and the electrical characteristics of the electronic component are measured. Specifically, a surface parallel to the surface on which the electronic component is arranged so that the electrode portion of one electronic component on the mounting device is positioned at the stylus position of the first probe by the first moving unit. The upper mounting means is aligned. Here, the electronic component is typically a chip in which electrode portions are patterned on a semiconductor wafer by a photoetching process or the like, and the semiconductor wafer is divided into individual chips by a dicing process on the mounting means. Placed on.

Then, by the operation of the third moving means, the electrode portion of the one electronic component is moved to the first position by the alignment in the height direction of the placing means (that is, the direction orthogonal to the surface on which the electronic component is arranged). Touch the probe needle. Therefore, the electrical characteristics of the electronic component are measured by the semiconductor measuring device of this embodiment.

According to the present embodiment, in particular, a second probe is provided which is arranged so that the electrical characteristics of other electronic components different from the one electronic component corresponding to the first probe can be measured simultaneously. The second probe is typically positioned so as to be capable of touching an electrode portion of an electronic component adjacent to the one electronic component among the plurality of electronic components. For this reason, preferably, by aligning one electronic component to be in contact with the inspection needle of the first probe, the electrode portion of the other electronic component adjacent to the one electronic component is inspected by the second probe. Needle and stylus become possible.

At this time, for example, when there is a shift in the relative positional relationship between the arranged electronic components due to some factor such as vibration during transfer, a plurality of probes and the electrons corresponding to the probes are arranged. There is a possibility that the alignment with the component is not performed properly. For example, when the relative positional relationship between one electronic component and another electronic component adjacent to the one electronic component is shifted, alignment is performed with reference to the one electronic component and the first probe. Even if it is performed, the positional relationship between the other electronic component and the second probe is displaced, so that an accurate stylus of the second probe is not implemented.

In consideration of such a situation, the second probe of the present embodiment is configured to be movable in a plane parallel to the plane on which the electronic components are arranged by the operation of the second moving means. According to such operation of the second moving means, a deviation is confirmed in the relative positional relationship between the position of the other electronic component corresponding to the second probe and the electronic component at the position corresponding to the first probe. In this case, the second probe is moved so that the inspection needle can accurately touch the electrode portion of the electronic component. That is, it is possible to correct the positional relationship to enable the stylus by moving the second probe with respect to the displacement of the electronic component position.

Here, the displacement of the position of the electronic component is intended to indicate a displacement of the relative position with respect to one electronic component corresponding to the first probe. Therefore, even when the position of the other electronic component corresponding to the second probe is equal to the position adjusted by teaching, for example, the position where the position of one electronic component corresponding to the first probe is adjusted by teaching If the first electronic component position is adjusted by the first moving means so as to correspond to the first probe, the position of the other electronic component corresponding to the second probe is displaced. Will occur. Such relative displacement of the second probe can also be corrected by aligning the second probe by the operation of the second moving means.

Although not particularly taken up in the present embodiment, a general semiconductor measurement apparatus is provided with a photodetector that performs optical characteristic measurement corresponding to the position of the probe of each probe. The measurable range of such a photodetector is typically about several centimeters. On the other hand, considering that the size of the arranged electronic components and the interval between the electronic components is about several hundred μm, the range is one. It can be seen that a plurality of adjacent electronic components can be simultaneously measured by the photodetector. For this reason, according to the embodiment of the semiconductor measuring apparatus of the present invention, a special mechanism for moving the photodetector according to the measurement position of the probe is not required even if the configuration includes such a photodetector.

In addition, the second probe in the present embodiment is intended to indicate at least one probe different from the first probe. For example, as one aspect of the embodiment of the semiconductor measurement device of the present invention, a plurality of second probes may be provided as will be described later. At this time, a plurality of second moving means each independently operating are provided corresponding to the plurality of second probes. For this reason, even when two or more probes are used, it is possible to suitably align the stylus of the electronic component corresponding to each probe.

As described above, according to the embodiment of the semiconductor measuring device of the present invention, the first probe fixed and arranged in the device, and moves in a plane parallel to the arrangement surface of the electronic components and in a direction orthogonal thereto Possible mounting means and a second probe movable in a plane parallel to the arrangement surface of the electronic components are provided. For this reason, when the mounting means for mounting the electronic component is transferred in accordance with the measurement position of the first probe, there is a deviation between the measurement position of the second probe and the corresponding electronic component. Even if it exists, the position of the second probe is adjusted by the second moving means, and the correction of the thread is performed. Therefore, even when there is a deviation in the arrangement of the electronic components, it is possible to contact the electronic components using a plurality of probes at the same time. Incidentally, since it is possible to correct a slight misalignment of the electronic components, it is possible to relax the required accuracy value of the electronic component arrangement to some extent.

One aspect of the embodiment of the semiconductor measuring device of the present invention is the fourth aspect in which the second probe can be moved in a direction in which the distance between the second probe and the surface on which the electronic component is placed is reduced. The fourth moving unit further moves the distance between the second probe and the surface on which the electronic component is placed when the other electronic component is not present.

According to this aspect, the second probe can be moved in a direction in which the distance from the electronic component is reduced or moved away by the operation of the fourth moving means. For this reason, it becomes possible to determine whether or not to perform contact with the corresponding electronic component by the inspection needle provided in the second probe by the operation of the fourth moving means.

In this aspect, in particular, the fourth moving means has an electronic component for measurement corresponding to the second probe at the time of one stylus measurement in which the placing means is brought close to each probe by the third moving means as described above. If not, the position of the second probe is moved away from the electronic component. At this time, the operation of moving the second probe away means that at least the tip part of the inspection needle is at a position where the electronic component is originally present even if a factor such as vibration is taken into account, and further on the portion on the mounting means where the electronic component is originally present. The purpose is to keep the distance away from contact.

Generally, the electronic component after the dicing process is often placed on an adhesive sheet developed on the placing means so that the position does not move due to vibration of the placing means. At this time, if the inspection needle of the probe touches the portion where the electronic component does not exist, the adhesive adheres to the inspection needle, and the subsequent characteristic measurement by the stylus on the electronic component cannot be performed accurately. There is a fear. Furthermore, there is a possibility that the adhesive that has adhered to the inspection needle may adhere to the electronic component, which may lead to a decrease in quality due to the contamination of the electronic component. In addition, the thickness of the electronic component is very thin, such as several hundred μm. When the inspection needle and the mounting means are brought close to each other for the purpose of palpating the electronic component, if there is no electronic component there, it is easily caused by a slight vibration. The tip of the inspection needle touches the mounting means.

Note that the measurement electronic components are typically arranged in a circular shape because they are typically cut out from a circular wafer. For this reason, when the mounting means on which the electronic component is arranged in accordance with the first probe is aligned, for example, the electronic component corresponding to the second probe is often absent at the periphery of the circle.

According to the embodiment of the semiconductor measuring apparatus including the fourth moving unit, when the electronic component is aligned with the first probe, there is no measurement electronic component corresponding to the second probe. The second probe is moved away from the mounting means, and the probe is retracted. For this reason, it becomes possible to avoid suitably that the inspection needle of the second probe is damaged or broken.

It should be noted that the confirmation as to whether or not there is an electronic component corresponding to the second probe in this aspect may be performed based on information relating to the arrangement of the electronic components obtained by some sensor, and will be described later. It may be confirmed as appropriate based on the position information of the electronic component stored in the means.

In another aspect of the embodiment of the semiconductor measuring device of the present invention, the semiconductor measuring apparatus further includes a determining unit that determines whether the other electronic component is a measurement target electronic component, and the fourth moving unit includes the other electronic component. When it is determined that the electronic component is not the measurement target electronic component, the distance between the second probe and the surface on which the electronic component is placed is increased.

According to this aspect, it is determined whether or not the electronic component corresponding to the second probe is a measurement target. Then, when it is determined that the corresponding measurement electronic component is an electronic component that is not a measurement target, the fourth moving unit performs the retreat operation of the second probe as described above. Here, electronic components that are not to be measured include, for example, electronic components that are damaged or defective in the manufacturing process, TEG (Test Element Group) electronic components that are formed for the purpose of measuring characteristics such as materials and manufacturing processes, and the like. The purpose is to indicate an electronic component that does not require measurement with a probe. Measuring these electronic parts with the stylus of the inspection needle is not preferable in terms of the process, although it is difficult to cause a loss in tact time. Further, when the inspection needle is brought into contact with the contaminated electronic component, the inspection needle may be stained or damaged.

Note that the discrimination means in this aspect is typically configured to include an imaging means such as a camera, and is the measurement target obtained by acquiring image information of each electronic component and analyzing the image information? Determine whether or not. Further, the determination may be made by some other means, for example, based on information related to the electronic component included in advance in the position information of the electronic component stored in the recording means described later.

With such a configuration, such a problem can be suitably avoided by retracting the second probe for an electronic component that does not require measurement with the stylus as described above. Note that the electronic component information for identifying such a fouled electronic component is typically optically acquired image information of the arrangement of electronic components, but the electronic component can be identified by some other method. Any information may be used as long as it is information.

In another aspect of the embodiment of the semiconductor measuring apparatus of the present invention, the second probe is a plurality of probes, and the second moving unit corresponds to each of the plurality of probes, and And a plurality of moving means for moving each of the different electronic components so as to face each other.

The second probe in this aspect is intended to indicate a plurality of probes, and each probe is configured such that the moving operation by the second moving means can be performed individually. That is, the embodiment of the semiconductor measurement device of this aspect includes the first probe and a plurality of probes that should be referred to as the second probe group, and the first probe that is fixedly arranged with respect to the device is Each probe of the second probe group is configured to be movable in a plane parallel to the arrangement surface of the electronic components.

For this reason, it is possible to simultaneously measure a plurality of electronic components at the timing of a single stylus. In addition, the second probe group other than the reference first probe can be individually moved to correct the deviation, so that a highly accurate measurement result can be obtained. In addition, there is an effect that the required value of the arrangement accuracy of the electronic components can be relaxed suitably.

In this aspect, a plurality of fourth moving means may be provided corresponding to each of the second probes, and each of the second probes may be configured to perform the retreat operation as described above. Is possible.

According to another aspect of the embodiment of the semiconductor measuring device of the present invention, the semiconductor measuring apparatus further includes storage means for storing position information of the plurality of electronic components placed on the placing means, and the first moving means includes: The placing means is moved based on the position information, and the second moving means moves the second probe based on the position information.

According to this aspect, the operations of the first moving unit, the second moving unit, the fourth moving unit, and the like are performed by referring to the position information indicating the position of each electronic component in the electronic component array acquired in advance. The With this configuration, it is possible to relatively easily align the first probe and the electronic component, or align the second probe and the electronic component.

Such position information is typically acquired by acquiring image information by an imaging unit such as a camera and analyzing the image information when the electronic component is mounted on the mounting unit. However, there is no problem even if it is appropriately acquired by some means.

Embodiments according to the semiconductor measurement method of the present invention include a first probe that measures electrical characteristics of a plurality of electronic components placed on a placement means by contacting a measurement site of the electronic components, and A semiconductor measurement method of a semiconductor measurement device including a second probe, wherein the measurement part of one electronic component faces the first probe in a plane parallel to a surface on which the electronic component is placed. A first moving step for moving the mounting means, and the second probe in a plane parallel to a surface on which the electronic component is placed so as to face a measurement site of another electronic component different from the one electronic component. A second moving step for moving, and a third moving step for moving the placing means so that the first probe and the one electronic component, and the second probe and the other electronic component are in contact with each other. Prepare.

According to the embodiment of the semiconductor measurement method of the present invention, it is possible to receive the same effects as the various effects that can be enjoyed by the above-described embodiment of the semiconductor measurement apparatus of the present invention. Incidentally, in response to the various aspects of the embodiment of the semiconductor measurement apparatus of the present invention described above, the embodiment of the semiconductor measurement method of the present invention can also adopt various aspects.

As described above, according to the semiconductor measuring apparatus of the present invention, the mounting means, the first probe, the second probe, the first moving means, the second moving means, and the third moving means are provided. Prepare. According to the semiconductor measurement device of the present invention, the semiconductor measurement apparatus includes a first movement process, a second movement process, and a third movement process. Accordingly, when the electronic component is misaligned on the arrangement of the electronic component and the electronic component is aligned with the first probe, the position of the electronic component corresponding to the second probe is misaligned. It is possible to carry out highly accurate measurement after suitably correcting the deviation.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

(1) Basic Configuration Example First, a basic configuration example of a probe device, which is a specific example of an embodiment of a semiconductor measurement device of the present invention, will be described with reference to FIG. FIG. 1 is a schematic diagram illustrating a basic configuration example of the probe device according to the present embodiment.

As shown in FIG. 1, the basic configuration example of the probe apparatus 1 includes a table 100, a table position adjustment unit 110, a first probe 200, a second probe 300, a control unit 400, and a photodetector 410. Yes. According to such a probe device 1, the electrical characteristics of the chip 500, which is a specific example of the electronic component in the present embodiment, are measured.

The table 100 is a specific example of the placing means according to the present embodiment. The table position adjustment unit 110 is a moving unit including an actuator that is attached to or integrated with the table 100, and is a specific example of the first moving unit and the third moving unit in the present embodiment. The table position adjustment unit 110 is connected to the control unit 400 and is controlled to move based on the positional information of the arrangement of the chips 500, so that the table 100 is placed in a plane parallel to the arrangement plane of the chips 500 and the arrangement plane of the chips 500. Move in an orthogonal direction. An adhesive sheet 510 is developed on the table 100, and a plurality of chips 500 are placed thereon.

The first probe 100 is a probe card arranged and fixed in the probe apparatus 1 by the first probe base 220, and includes a plurality of inspection needles 210. When the inspection needle 210 touches the electrode portion of the chip 500, the electrical characteristics of the chip 500 are measured.

Specifically, assuming that the direction orthogonal to the chip array is the Z axis, the X axis and the Y axis orthogonal to the Z axis and orthogonal to each other, and the rotation on the XY plane, are mounted on the table 100. The chip 500 to be placed is aligned with the inspection needle 210 of the first probe 200. Thereafter, the table 100 is moved in the Z-axis direction so that the tip 500 comes into contact with the inspection needle 210, thereby measuring the electrical characteristics of the tip 500 with the stylus of the inspection needle 210.

Since the chip 500 is generally cut out from a circular semiconductor wafer, the chip 500 often has a circular arrangement as shown in FIG. For this reason, the table position adjustment unit 110 moves the table 100 and aligns each chip with the inspection needle 210 so that the chip 500 is measured in the measurement order shown in FIG.

Note that the inspection needle 210 in the first probe 200 is movable with respect to the first probe 200. For this reason, before the measurement of the chip 500, the inspection needle 210 can be aligned so as to appropriately touch the electrode portion of the chip 500 by, for example, a manual teaching operation.

The second probe 300 is a probe card that includes a plurality of inspection needles 310 and is arranged in the probe apparatus 1 by the second probe base 330, similar to the first probe 200. The second probe 300 of the present embodiment is basically disposed at a position where a stylus can be touched with respect to the tip adjacent to the tip touched by the first probe 200.

The second probe 300 further includes a second probe position adjusting unit 320, and the movement of the second probe position adjusting unit 320 and the rotational movement in the XY plane are performed by the operation of the second probe position adjusting unit 320, similarly to the table 100 described above. Configured to be possible. The second probe position adjustment unit 320 is connected to the control unit 400 and moves the second probe 300 under the control of the control unit 400.

The control unit 400 is a processing device such as a known CPU (Central Processing Unit), for example, and includes a memory as a specific example of the storage means in the present embodiment, and is connected to each unit of the probe device 1. Control the operation and obtain measurement results.

For example, the control unit 400 is connected to each of the table position adjustment unit 110 and the second probe position adjustment unit 320, and controls the execution of the movement operation and the movement amount. At this time, the control unit 400 controls the movement operation (ie, alignment) of the position adjustment unit based on the position information of the chip 500 stored in the memory.

Also, the control unit 400 is connected to the first probe 200 and the second probe 300, and controls the operation of the inspection needles 210 and 310 during teaching, acquires the measurement result of the chip 500 with each probe, and the like. Further, the measurement result of the chip 500 is obtained from the photodetector 410.

The photodetector 410 is arranged so that the optical characteristics of the chip 500 can be measured with respect to the stylus portion of the

inspection probe

210 and 310 of each of the first probe 200 and the second probe 300 with the chip 500. In the present embodiment, the photodetector 410 is arranged in a state where the vicinity of the stylus position of the inspection needle 210 is aligned so as to be measurable. For this reason, it is possible to suitably measure the optical characteristics of the chip 500 that is aligned with the inspection needle 210 so that it can be touched.

(2) Basic Operation Example Next, with reference to FIG. 3, an example of a basic operation in the probe apparatus 1 of the present embodiment will be described. FIG. 3 is an example of a flowchart showing a basic operation flow of the probe apparatus 1.

First, as shown in the flowchart, chip position information is acquired (step S101). At this time, for example, the position information of the chip may be acquired by an imaging device such as a camera, or may be acquired by reading the position information of the chip acquired in advance.

Subsequently, under the control of the control unit 400, the table 100 is moved by the operation of the table position adjustment unit 110, and among the mounted chips 500, the measurement start chip is the touch of the inspection needle 210 of the first probe 200. Positioning is performed so as to come to the needle position (step S102). In general, for example, the chip at the peripheral edge is selected as the measurement start chip, such as the chip at the upper left in the chip arrangement of FIG.

At this time, a tip different from the measurement start tip is aligned with the stylus position of the inspection needle 310 of the second probe 300.

Then, each inspection needle is aligned (so-called teaching) so that the inspection needle 210 of the first probe 200 and the electrode portion of the measurement start tip, and the inspection needle 310 of the second probe 300 and the electrode portion of the corresponding tip are in contact with each other. Implemented (step S103).

Thereafter, the height of the table 100 is adjusted by the operation of the table position adjustment unit 110, and the electrical characteristics of each chip are measured by contacting the corresponding inspection needles with the electrode portions of the chips (step S104). ).

Subsequently, the next measurement chip is aligned with the first probe 200 (step S105). Here, the next measurement chip is a chip that follows the inspection sequence, and indicates an unmeasured chip other than a chip that is determined not to be a measurement target chip due to contamination, breakage, or some other reason. For this reason, the chip that has been measured by the second probe 300 is excluded and the subsequent chip is selected.

After the alignment, basically, the tip is also transferred to the measurement position of the inspection needle 310 of the second probe 300. At this time, for example, based on chip manufacturing information included in the position information, it is determined whether or not the chip has a defect (step S106). Here, the defect that occurs in the chip is a chip that has been excluded from the measurement object due to something such as fouling or breakage, a chip that has already been measured, or a chip on the chip arrangement (that is, This means that there is no chip to be arranged). In addition, the case where the position is simply shifted from the inspection needle 310 is not included in the problem mentioned here.

When such a defect occurs in the chip transferred to the position of the second probe 300, the second probe 300 is moved away from the table 100 by the second probe position adjustment unit 320 under the control of the control unit 400. (Step S107). With reference to FIG. 4, the operation of each unit at this time will be described. FIG. 4 is a schematic diagram illustrating an example of the retreat operation of the second probe 300 when a chip having such a defect is confirmed.

As shown in FIG. 4A, normally, the tip of the inspection needle 310 of the second probe 300 can touch the electrode portion of the corresponding chip simultaneously with the inspection needle 210 of the first probe 200. The height is adjusted to the same level as the inspection needle 210. For this reason, measurement with each probe is possible in one stylus operation.

On the other hand, as shown in FIG. 4 (b) or FIG. 4 (c), when the corresponding chip is absent, or when the corresponding chip is damaged, the second The probe position adjusting unit 320 retracts the second probe 300 away from the table 100 so that the circular end portion of the inspection needle 310 does not touch the table 100, the adhesive sheet 510, or the dirty tip. At this time, even if the height of the table 100 for measurement is adjusted, the second probe position adjusting unit 320 makes the tip of the inspection needle 310 contact the table 100, the adhesive sheet 510, or the dirty tip. In order not to do it, keep it away to a distance that is sufficient even if vibration is added. Moreover, it is preferable that such a retracting operation of the second probe is performed in parallel with the alignment in step S105.

When the tip 500 to be measured is transferred after the second probe 300 is retracted, the position of the second probe 300 is returned to the initial state after teaching, and the stylus can be made again.

If the chip 500 transferred to the position of the second probe 300 does not have the above-described defects, it is subsequently determined whether or not the position of the chip is displaced (step S108). At this time, the displacement of the position of the tip typically means a displacement of the position of the inspection needle 310 of the second probe 300 and the position of the electrode portion of the tip 500. When such a positional shift is detected, the second probe position adjusting unit 320 is aligned under the control of the control unit 400, and the tip of the inspection needle 310 is accurately positioned on the electrode portion of the tip 500. (Step S109). With reference to FIG. 5, the operation of each unit at this time will be described. FIG. 5 is a schematic diagram illustrating an example of the alignment operation of the second probe 300 when the chip 500 in which such a positional deviation has occurred is confirmed.

According to the probe device 1 of the present embodiment, the inspection needle 210 of the first probe 200 can be brought into contact with the electrode portion of the chip 500 to be measured by the first probe 200 by teaching work so that the probe 500 can touch the electrode portion of the chip 500. It is aligned in a plane parallel to the array plane. At the same time, the tip of the inspection needle 310 of the second probe 300 is aligned within a plane parallel to the array surface of the chip 500 so that the probe can be brought into contact with the electrode portion of the chip 500 to be measured by the second probe. ing. For this reason, in the above-described chip measurement operation, by adjusting the height of the table 100, as shown in FIG. 5A, each probe suitably measures the two chips 500 of the contact 1. Can be implemented.

On the other hand, the tip of the contact 2 is adjusted by teaching shown in FIG. 4A because there is a positional shift between the tip corresponding to the first probe 200 and the tip corresponding to the second probe 300. With the second probe 300 that has been made, an appropriate stylus cannot be implemented. Note that such a positional shift can be confirmed by, for example, the chip position information acquired in step S101.

When such a positional deviation is confirmed, the control unit 400 operates the second probe position adjustment unit 320 to finely adjust the position of the second probe 300 so that an appropriate stylus is implemented.

For example, in the contact 2 shown in FIG. 5 (b), the corresponding tip of the second probe 300 is shifted downward in the drawing compared to the corresponding tip of the first probe 200. Make fine adjustments.

Further, in the contact 3 shown in FIG. 5B and FIG. 5C, the two chip positions are close compared to the chips of the other contacts, and the traveling direction of the table 100 (that is, the chip transfer direction). The positions of the chips are shifted in the direction orthogonal to (). In the alignment step of step S105, the corresponding tip of the first probe 200 is adjusted so as to come to the measurement position of the first probe 200. Therefore, in such a contact, the second probe 300 is moved downward and left in the drawing. Tweaked.

Thus, since the position of the second probe 300 is finely adjusted with respect to the relative displacement between the first probe 200 and the corresponding chip, the displacement in the chip arrangement can be suitably corrected. Further, such position adjustment of the second probe is preferably performed in parallel with the alignment in step S105.

Then, like step S104, the height of the table 100 is adjusted, and the electrical characteristics of the corresponding chip are measured by each probe (step S110).

Such a series of alignment and measurement operations are basically performed until there is no unmeasured chip on the table 100 or until it is stopped.

As described above, according to the embodiment of the probe device according to the present invention, even when a plurality of probes are provided, the tip is displaced relative to the corresponding tip of the reference first probe. On the other hand, it can be corrected by finely adjusting the second probe position. For this reason, even with the chip arrangement in which such a shift occurs, high-precision measurement can be simultaneously performed on a plurality of chips.

Further, when a defect occurs in the chip corresponding to the second probe or when the chip does not exist, the inspection probe of the second probe moves to the dirty chip or the adhesive sheet by the retraction operation of moving the second probe away from the table. Thus, it is possible to favorably avoid fouling or breakage due to the occurrence of the damage.

In addition, it is preferable that the position adjustment and the retreating operation of the second probe are performed in parallel with the transfer of the measurement tip (in other words, the alignment). It is possible to suppress an increase in tact time due to the position adjustment and retraction operation.

The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the scope or spirit of the invention that can be read from the claims and the entire specification. The method is also included in the technical scope of the present invention.

For example, in the basic configuration example and the basic operation example described above, the probe apparatus including two probes has been described, but a probe apparatus including three or more probes is also included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Probe apparatus 100 ... Table 110 ... Table position adjustment part 200 ... 1st probe 210 ... 1st test needle 220 ... 1st probe base part 300 ... 2nd probe 310 ... 2nd test needle 320 ... 2nd probe position adjustment part 330 ... second probe base 400 ... control unit 500 ... chip 510 ... adhesive sheet

Claims

A semiconductor measuring device for measuring electrical characteristics of electronic components,
A placing means for placing a plurality of the electronic components; a first moving means for allowing the placing means to move within a plane parallel to a surface for placing the electronic components;
A first probe fixed to the semiconductor measuring device and measuring an electrical characteristic by contacting one electronic component;
A second probe that measures electrical characteristics by contacting another electronic component different from the one electronic component;
Second moving means for allowing the second probe to move in a plane parallel to the surface on which the electronic component is placed;
Third moving means for moving the placing means in a direction in which the distance between the first probe and the surface on which the electronic component is placed is reduced or moved away;
With
The first moving means enables the placing means to move so that the measurement site of the one electronic component faces the first probe,
The second moving means enables the second probe to move so as to face the measurement site of the other electronic component,
The third moving means is characterized in that the placing means can be moved so that the first probe and the one electronic component, and the second probe and the other electronic component are in contact with each other. Semiconductor measuring device.
A fourth moving means for allowing the second probe to move in a direction in which the distance between the second probe and the surface on which the electronic component is placed is reduced or moved away;
2. The semiconductor according to claim 1, wherein the fourth moving unit increases a distance between the second probe and a surface on which the electronic component is placed when the other electronic component does not exist. measuring device.
A discriminating means for discriminating whether or not the other electronic component is an electronic component to be measured;
The fourth moving means increases the distance between the second probe and a surface on which the electronic component is placed when it is determined that the other electronic component is not a measurement target electronic component. The semiconductor measurement apparatus according to item 2.
The second probe is a plurality of probes, and the second moving unit corresponds to each of the plurality of probes, and each of the corresponding probes is opposed to a measurement position of the different electronic component. The semiconductor measuring apparatus according to any one of claims 1 to 3, wherein the semiconductor measuring apparatus is a plurality of moving means for moving in such a manner.
And further comprising storage means for storing position information of the plurality of electronic components placed on the placing means.
The first moving means moves the placing means based on the position information,
5. The semiconductor measurement apparatus according to claim 1, wherein the second moving unit moves the second probe based on the position information. 6.
Semiconductor measurement of a semiconductor measuring device comprising a first probe and a second probe that measure electrical characteristics of a plurality of electronic components placed on the placing means by contacting a measurement site of the electronic components. A method,
A first moving step of moving the placing means in a plane parallel to a surface on which the electronic component is placed so that a measurement site of one electronic component faces the first probe;
A second moving step of moving the second probe in a plane parallel to a surface on which the electronic component is placed so as to face a measurement site of another electronic component different from the one electronic component;
A semiconductor measuring method comprising: a third moving step of moving the placing means so that the first probe and the one electronic component, and the second probe and the other electronic component are in contact with each other.