JP2006344628A - Semiconductor wafer probe device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe device in which a method of fixing a probe card has been changed to solve the problems occurring by a reinforcing member, or the like required following an increase in the diameter of the probe card. <P>SOLUTION: The probe device 1 having the probe card with a probe pin for measuring the electrical characteristics of a semiconductor wafer comprises an inspection stand 5 provided nearly vertically for fixing a semiconductor wafer 6; a probe card fixing means 4 for installing the probe card 2 nearly vertically opposite to the inspection stand 5; and a moving means 7 for horizontally moving the inspection stand 5 for bringing the surface of the inspection stand 5 closer to that of the probe card 2 relatively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe apparatus including a probe card for measuring electrical characteristics of a semiconductor wafer, and more particularly to a probe apparatus in which a semiconductor wafer and a probe card are fixed vertically.

  A probe card is used to measure the electrical characteristics of the semiconductor wafer. In the conventional probe apparatus 20, as shown in FIG. 3, the semiconductor wafer 22 is positioned and fixed on an inspection table 21 movable up and down. The probe card 23 is horizontally fixed at the upper surface position opposite to the surface of the semiconductor wafer 22, the inspection table 21 is raised, and the probe 24 provided on the probe card 23 and the electrode on the wafer 22 are brought into contact with each other. Electric conduction is performed.

  As an example of such a conventional probe apparatus, there is a semiconductor device inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 2004-152916. In the semiconductor device inspection apparatus, the wafer stage on which the semiconductor device is placed is moved horizontally in the X direction and the Y direction by the X stage and the Y stage, and then positioned on the wafer stage by the elevating device. The probe card approaches the set probe card, is pressed against the probe needle of the probe card, and is measured.

  Although the measurement of the semiconductor wafer was performed using the apparatus as described above, with the increase in the diameter of the semiconductor wafer, the increase in the diameter of the probe card has progressed, in particular, facing the entire surface of the semiconductor wafer, In the case of a probe card in which substantially the entire area is inspected at a time, it is necessary to configure the probe card with a size larger than the diameter of the semiconductor wafer, so that a probe card with a larger diameter is required.

  As the diameter of the probe card increases, the probe card is deformed and the planar state of the surface of the probe card changes in order to measure a wafer using the large-diameter probe card with the apparatus as described above. There was a problem that it became easier. This is because the probe card has a fixed peripheral portion, and in the case of a large-diameter probe card, the center portion of the probe card hangs due to bending and the planar state changes.

In order to solve the above problem, in the case of a large-diameter probe card, conventionally, measures such as attaching a reinforcing member to the back surface of the probe card have been taken to prevent bending of the center portion of the probe card.
JP 2004-152916 A

  Although a structure made of stainless steel has been used as the reinforcing member, there is a problem that the reinforcing member increases the weight of the probe card and makes it difficult to carry and attach.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a probe device that fixes a probe card vertically in order to solve the problems caused by an increase in the diameter of the probe card.

  A probe device of the present invention is a probe device including a probe card having probe pins for measuring electrical characteristics of a semiconductor wafer, and an inspection table provided substantially vertically for fixing the semiconductor wafer; A probe card fixing means for placing the probe card substantially vertically opposite the inspection table, and moving the inspection table horizontally so that the surface of the inspection table and the surface of the probe card are relatively close to each other And a movable means for making it move.

  Moreover, it is preferable that the said inspection table is equipped with the vacuum suction apparatus for adsorb | sucking a semiconductor wafer to the surface of the said inspection table, and fixing it substantially perpendicularly.

  Furthermore, it is preferable that a convex portion corresponding to an orientation flat provided on the semiconductor wafer is formed on the surface of the inspection table for positioning when the semiconductor wafer is fixed to the inspection table.

  And it is preferable to provide a wafer position control device for moving the inspection table horizontally and controlling the distance between the inspection table and the probe card fixing means.

  A probe apparatus of the present invention is a probe apparatus including a probe card having probe pins for measuring electrical characteristics of a semiconductor wafer, and an inspection table provided substantially vertically for fixing the semiconductor wafer; A probe card fixing means for installing the probe card substantially perpendicularly to the inspection table, and the inspection table is moved horizontally so that the surface of the inspection table and the surface of the probe card are relatively close to each other. Provided with a movable means to prevent the probe card from being lowered without using a reinforcing member or the like, and the probe card can be made thinner, and the resistance can be reduced. This minimizes the value and enables high-frequency compatible large probe cards.

  In addition, since the inspection table includes a vacuum suction device for adsorbing the semiconductor wafer to the surface of the inspection table and fixing it substantially vertically, the semiconductor wafer falls even if the surface of the inspection table is substantially vertical. It can be securely fixed without any problems.

  Furthermore, for the positioning when fixing the semiconductor wafer to the inspection table, a convex portion corresponding to the orientation flat provided on the semiconductor wafer is formed on the surface of the inspection table, whereby the semiconductor wafer is inspected. When fixed to the table, the semiconductor wafer can be easily positioned in a predetermined direction.

  The contact pressure between the electrode of the wafer and the probe of the probe card is adjusted by providing a wafer position control device that moves the inspection table horizontally and controls the distance between the inspection table and the probe card fixing means. It becomes possible.

    Below, the probe apparatus 1 of this invention is demonstrated using figures.

  As shown in FIG. 1, a probe device 1 of the present invention includes a probe card 2 having probe pins 3, probe card fixing means 4 for fixing the probe card 2 vertically, and a semiconductor wafer 6 for fixing. The inspection table 5 and movable means 7 for moving the inspection table 5 horizontally in order to bring the surface of the inspection table 5 and the surface of the probe card 2 relatively close to each other.

  The probe card fixing means 4 is installed on the base 8 and fixes the probe card 2 in a vertical state. The inspection table 5 facing the probe card fixing means 4 is fixed to a movable means 7 provided on a base 8 so as to be horizontally movable.

  The inspection table 5 and the probe card 2 fixed vertically by the probe card fixing means 4 are vertically arranged so as to face each other, and the inspection table 5 is moved horizontally by the movable means 7 to fix the probe card. It approaches the means 4.

  The inspection table 5 is provided with a vacuum suction device 13 so that the semiconductor wafer 6 can be adsorbed to the surface of the inspection table 5 and fixed vertically. Further, a convex portion 11 corresponding to an orientation flat (orientation flat) 12 which is a notch provided in the semiconductor wafer 6 is formed on the surface of the inspection table 5. As a result, the semiconductor wafer 6 is positioned at a predetermined position on the inspection table 5 in a predetermined direction.

  Since the semiconductor wafer 6 is sucked by the vacuum suction device 13, positioned by the convex portion 11, and vertically fixed to the surface of the inspection table 5, the inspection table 5 approaches the probe card fixing means 4 as described above. As a result, the semiconductor wafer 6 approaches the probe card 2, and the electrodes of the semiconductor wafer 6 are pressed and contacted by the probe pins 3 provided on the probe card 2.

  When the inspection table 5 is moved by the movable means 7, the movement amount of the inspection table 5 is controlled by a wafer position control means 15 provided separately. The wafer position control means 15 controls the distance between the inspection table 5 and the probe card 2, and as a result, the contact pressure when the probe 3 is pressed against the electrode of the semiconductor wafer 6 is adjusted, and an appropriate contact pressure is maintained. It is.

  The wafer position control means 15 can control the contact pressure more accurately by combining a camera and a sensor.

  The movable means 7 has means for moving the inspection table 5 in parallel with the probe card fixing means 4 as well as moving the inspection table 5 in a direction opposite to the probe card fixing means 4. This is performed by the upper stage 9 of the movable means 7 shown in FIG. 2, and the position of the semiconductor wafer 6 can be adjusted.

  The inspection table 5 can be moved in the opposite direction of the probe card fixing means 4 by the lower stage 10 of the movable means 7 and can be moved in a parallel direction by the upper stage 9, so that it can move horizontally on the base 8 in all directions. It becomes. Thereby, the positional relationship between the semiconductor wafer 6 and the probe card 2 can be brought into an appropriate state at the time of measurement.

  The movable means 7 is configured to be driven by a driving means 14 such as a motor, and can move the inspection table 5. The driving means 14 is connected to the wafer position control device 15, and the driving means 14 is controlled by the wafer position control device 15.

  The probe card 2 and the probe pin 3 can be the same as the conventional probe device. However, in the probe device 1 according to the present invention, since the probe card 2 is installed vertically, it is not necessary to greatly reinforce the probe card 2 even if the semiconductor wafer 6 has a large diameter. However, a thin configuration is possible.

  The probe device 1 according to the present invention is compatible with a large-diameter semiconductor wafer 6 having a diameter of 300 mm. By arranging the probe card 2 vertically, the probe card 2 is not bent and the conventional reinforcement is unnecessary. As a result, a high-frequency compatible large probe card 2 is possible.

Sectional drawing of the probe apparatus of this invention. The perspective view of the state which removed the probe card fixing means etc. from the probe apparatus of this invention. Sectional drawing of the conventional probe apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe apparatus 2 Probe card 3 Probe 4 Probe card fixing means 5 Inspection stand 6 Semiconductor wafer 7 Movable means 8 Base 9 Upper stage 10 Lower stage 11 Convex part 12 Orientation flat 13 Vacuum suction apparatus 14 Driving means 15 Wafer position control means 20 Probe apparatus 21 Inspection Base 22 Semiconductor wafer 23 Probe card 24 Probe

Claims (4)

  A probe apparatus comprising a probe card having probe pins for measuring electrical characteristics of a semiconductor wafer, and an inspection table provided substantially vertically for fixing the semiconductor wafer, and facing the inspection table Probe card fixing means for installing the probe card substantially vertically, and movable means for moving the inspection table horizontally so that the surface of the inspection table and the surface of the probe card are relatively close to each other. The probe apparatus characterized by the above-mentioned.   The probe apparatus according to claim 1, wherein the inspection table includes a vacuum adsorption device for adsorbing a semiconductor wafer to a surface of the inspection table and fixing the wafer substantially vertically.   3. A convex portion corresponding to an orientation flat provided on the semiconductor wafer is formed on the surface of the inspection table for positioning when the semiconductor wafer is fixed to the inspection table. The probe device according to 1. 4. The probe apparatus according to claim 1, further comprising a wafer position control device that moves the inspection table horizontally and controls a distance between the inspection table and the probe card fixing unit. 5. .

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